JPH0951158A - Terminal processing method for electronic component and connecting terminal - Google Patents
Terminal processing method for electronic component and connecting terminalInfo
- Publication number
- JPH0951158A JPH0951158A JP20061795A JP20061795A JPH0951158A JP H0951158 A JPH0951158 A JP H0951158A JP 20061795 A JP20061795 A JP 20061795A JP 20061795 A JP20061795 A JP 20061795A JP H0951158 A JPH0951158 A JP H0951158A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- preliminary
- terminal
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、大規模集積回路素
子および電子部品等を、無鉛はんだにより回路基板に表
面実装する際に、予め共晶はんだ等にて予備はんだされ
た接続端子(例えばリード部等)のはんだ被覆材を無鉛
はんだに置換する電子部品の端子処理方法と、その端子
処理方法により処理された接続端子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to connection terminals (for example, leads) preliminarily soldered with eutectic solder or the like when surface-mounting large-scale integrated circuit elements and electronic components on a circuit board with lead-free solder. Part) and the like, the present invention relates to a method of treating a terminal of an electronic component in which a solder coating material is replaced with a lead-free solder, and a connection terminal treated by the method.
【0002】[0002]
【従来の技術】大規模集積回路素子や電子部品等を、は
んだにより回路基板に表面実装する際に重要な役割を果
たす接続端子等に対するはんだ被覆材の表面被覆処理方
法は、はんだ付け性の悪いはんだ被覆材の母材に対し
て、よりはんだ付け性のよい材料を被覆することによっ
て、はんだ付け性を改善しようとするものである。2. Description of the Related Art A surface coating method of a solder coating material for connecting terminals, which plays an important role in surface mounting a large scale integrated circuit element or electronic component on a circuit board by soldering, has a poor solderability. It is intended to improve the solderability by coating the base material of the solder coating material with a material having a better solderability.
【0003】実装時に使用するはんだ合金を接続端子に
被覆すると、いわゆる予備はんだとなる。はんだ付け性
を良好にすることは、接合部の機械的強度を十分なもの
として、製品の信頼性を確保するために必要である。When the connection terminals are coated with a solder alloy used for mounting, so-called preliminary solder is formed. Good solderability is necessary to ensure the reliability of the product by making the mechanical strength of the joint sufficient.
【0004】予備はんだは、電気めっき法,溶融めっき
法によって形成されている。現在電子業界で一般に利用
されているはんだの大部分は、錫Snと鉛Pbの合金で63重
量%Snと37重量%Pbなる組成記号で表示され、実際の錫
と鉛の共晶はんだ(61.9重量%Snと約39.1重量%Pb,融
点183 ℃)に略等しいものであり、「ロクヨンはんだ」
の呼称を有し、以下その組成記号を正規の錫鉛の共晶は
んだの組成も含めてSn-37Pb のように略記する。The preliminary solder is formed by electroplating or hot dipping. Most of the solders commonly used in the electronics industry today are alloys of tin Sn and lead Pb and are represented by the composition symbol 63 wt% Sn and 37 wt% Pb. Wt% Sn and approximately 39.1 wt% Pb, melting point 183 ℃), and is "ROKUYON solder"
The composition symbol will be abbreviated as Sn-37Pb including the composition of the regular tin-lead eutectic solder.
【0005】最近、環境汚染という観点からエレクトロ
ニクス用はんだに含まれる鉛を規制しようという動きが
欧米諸国で活発化している。この動きに対応して、鉛を
含まないはんだ、いわゆる無鉛はんだの開発が盛んであ
る。Recently, in Europe and the United States, movements to regulate lead contained in solder for electronics have become active from the viewpoint of environmental pollution. In response to this movement, lead-free solders, so-called lead-free solders, are being actively developed.
【0006】現在開発が進められている無鉛はんだ合金
は、以下の2つに大別される。 (イ)Sn-37Pb よりも低い融点(183℃以下)を持つはん
だ合金であって、In−48Sn (融点117 ℃),Bi-43Sn(融点
139 ℃)をベースとするもの。 (ロ)Sn-37Pb よりも高い融点(183℃以上)を持つはん
だ合金であって、Sn-3.5Ag( 融点221 ℃),Sn-9Zn( 融点
199 ℃)をベースとするもの。Lead-free solder alloys currently being developed are roughly classified into the following two types. (B) A solder alloy with a melting point (183 ° C or less) lower than that of Sn-37Pb, including In-48Sn (melting point 117 ° C), Bi-43Sn (melting point
139 ℃) based. (B) A solder alloy with a higher melting point (183 ° C or higher) than Sn-37Pb, Sn-3.5Ag (melting point 221 ° C), Sn-9Zn (melting point
199 ℃) based.
【0007】無鉛はんだを実用化するためには、はんだ
付け温度を現状(215℃〜230 ℃)に維持する。即ち、は
んだ合金の融点をSn-Pb 共晶はんだの融点(183℃)と同
等あるいはそれ以下にすることが非常に重要になると考
えられる。In order to put the lead-free solder into practical use, the soldering temperature is maintained at the current level (215 ° C to 230 ° C). That is, it is considered very important to make the melting point of the solder alloy equal to or lower than the melting point (183 ° C) of the Sn-Pb eutectic solder.
【0008】これは、はんだ付け時の熱ストレスが信頼
性に与える影響を評価する際に、ほとんど全てSn-Pb 共
晶はんだの使用を前提として行っているため、また電子
機器に使用される部品が、小型,軽量かつ安価なものに
なる傾向にあり、これに伴って部品の耐熱性の問題が大
きくクローズアップされるようになってきているためで
ある。This is because almost all of the premise is to use Sn-Pb eutectic solder when evaluating the influence of thermal stress during soldering on reliability, and also for components used in electronic equipment. However, it tends to be small, lightweight, and inexpensive, and the heat resistance problem of parts has come to be greatly highlighted with this trend.
【0009】In-Sn 系,Bi-Sn 系の低融点無鉛はんだ
は、融点に関しては問題がない。これらの合金では、は
んだ付け温度を従来よりも低くすることができるから、
はんだの無鉛化以外にも、ベーキング処理および後付処
理の削除、低耐熱性部品の使用といったことによるコス
トダウンが図れるといったメリットがある。In—Sn and Bi—Sn based low melting point lead-free solders have no problem in terms of melting point. With these alloys, the soldering temperature can be lower than before,
In addition to lead-free solder, there are advantages such as elimination of baking treatment and post-treatment, and use of low heat-resistant parts to reduce costs.
【0010】一方、高融点の無鉛はんだでは、低融点金
属を添加して融点を低温化しようという試みがなされて
いる。低融点金属としては、In,Bi,Hg,Cs,Ga,Rb,
K,Na,Li,Tl,Cdなどが考えられるが、In,Bi以外は
強い毒性を有する、アルカリ金属であるといった点か
ら、電子機器への適用は困難である。In,Biを添加して
Sn-Ag 系,Sn-Zn 系の融点をSn-Pb 共晶はんだと同じ 1
83℃程度とするためには、InまたはBiを10%以上添加す
る必要がある。On the other hand, in high melting point lead-free solder, an attempt has been made to lower the melting point by adding a low melting point metal. Low melting point metals include In, Bi, Hg, Cs, Ga, Rb,
Although K, Na, Li, Tl, Cd, etc. are considered, they are difficult to apply to electronic devices because they are highly toxic except In and Bi and are alkali metals. Add In, Bi
The melting points of Sn-Ag series and Sn-Zn series are the same as those of Sn-Pb eutectic solder 1
In order to reach about 83 ° C., it is necessary to add 10% or more of In or Bi.
【0011】[0011]
【発明が解決しようとする課題】ところが、ここで重大
な問題が生じる。現在世界中に普及しているSn-Pb 共晶
合金が予備はんだされた接続端子を、BiまたはInを含む
無鉛はんだによりプリント配線板等の所要場所にはんだ
付けした場合に、無鉛はんだが予備はんだ中に拡散する
ことにより接続端子側へ移動し、はんだ付け部のはんだ
量が減少して、接合強度が大きく低下してしまう。ま
た、Sn-Pb-In,Sn-Pb-Biの3元合金が部分的に発生する
が、この3元合金は融点(固相線温度)が低いため、−
65℃乃至+125 ℃の熱衝撃試験では溶融と凝固を繰り返
して、ついにははんだ表面から剥離してしまうといった
現象を引起し、熱衝撃試験後の接合強度の低下を招くと
いった問題がある。However, a serious problem arises here. Lead-free solder is pre-soldered when connecting terminals, which are pre-soldered with Sn-Pb eutectic alloy, which is popular all over the world, to lead-free solder containing Bi or In at required places such as printed wiring boards. By diffusing inside, it moves to the connection terminal side, the amount of solder in the soldered portion is reduced, and the joint strength is greatly reduced. Moreover, a ternary alloy of Sn-Pb-In and Sn-Pb-Bi is partially generated, but this ternary alloy has a low melting point (solidus temperature).
In the thermal shock test at 65 ° C to + 125 ° C, melting and solidification are repeated, and finally, the phenomenon of peeling from the solder surface is caused, which causes a problem that the joint strength after the thermal shock test is reduced.
【0012】従来から知られている技術に特開平4-2879
57号で開示された「LSIパッケージのリード金めっき
層除去治具および除去方法」の発明がある。この内容
は、リード先端の金めっき層は錫を含むはんだを用いて
はんだ付けすると硬くて脆い二元金属化合物AuSnx がリ
ード表面の金とはんだに含まれる錫との間に発生し、接
合強度を著しく低下させるため、金めっき層を一定時間
溶融はんだに浸漬して金めっきを除去する方法が示され
ている。しかしながら、金めっき以外の錫鉛共晶はんだ
で被覆されたリード線を、鉛を含まないはんだではんだ
付けを行う場合に発生する拡散や3元合金による原因の
異なる接合強度の低下問題の解決策については何ら示さ
れていない。[0012] Japanese Patent Application Laid-Open No. 4-2879
There is an invention of "a jig and a method for removing a lead gold plating layer of an LSI package" disclosed in No. 57. This content is because the gold plating layer at the tip of the lead is hard and brittle when soldered with a solder containing tin, a binary metal compound AuSn x is generated between the gold on the lead surface and tin contained in the solder, and In order to significantly reduce the temperature, a method of removing the gold plating by dipping the gold plating layer in the molten solder for a certain time is disclosed. However, a solution to the problem of reduction in joint strength caused by diffusion and ternary alloys that occur when soldering lead wires coated with tin-lead eutectic solder other than gold plating with solder that does not contain lead Is not shown.
【0013】本来、予備はんだは使用するはんだと同組
成であることが好ましく、無鉛はんだの実用化において
は、開発した無鉛はんだ合金で予備はんだを施した部品
の使用を前提として考えるべきである。しかし、部品の
供給メーカ,生産国は現在非常に多岐多様に渡ってお
り、これらすべてのメーカ,生産国が鉛規制に対応する
までには相当の時間的遅れが予想され、また規制を実施
しない,または非常に緩やかに移行する生産国がでてく
る可能性もある。Originally, it is preferable that the pre-solder has the same composition as that of the solder to be used, and in practical use of the lead-free solder, it should be considered on the premise of using the parts pre-soldered with the developed lead-free solder alloy. However, the suppliers and producers of parts are very diverse and diverse at present, and it is expected that there will be a considerable time lag before all of these manufacturers and producers comply with the lead regulations, and the regulations will not be implemented. Or, there is a possibility that some producing countries will move very slowly.
【0014】このような観点から考察した結果、無鉛は
んだを使用する場合に、実装する部品にSn-Pb 共晶合金
が予備はんだされているという状況が当然起こり得ると
いえる。その結果、前述のような拡散や3元合金の発生
による接合強度の低下という問題は極めて深刻な問題と
なる。As a result of consideration from this point of view, when lead-free solder is used, it can be said that a situation in which the Sn-Pb eutectic alloy is pre-soldered on the component to be mounted can naturally occur. As a result, the above-mentioned problem of reduction in bonding strength due to diffusion and generation of ternary alloy becomes a serious problem.
【0015】本発明の主な目的は、共晶はんだ等にて表
面被覆処理された接続端子等の予備はんだを、はんだ付
けの際に拡散や3元合金が発生しない低融点の無鉛のは
んだ合金に置換する方法の提供と、その置換方法によっ
て処理されたはんだ接続端子の提供を目的とする。The main object of the present invention is a low melting point, lead-free solder alloy that does not cause diffusion or ternary alloy during soldering of pre-solder such as connection terminals whose surface is coated with eutectic solder or the like. It is an object of the present invention to provide a method of substituting the same with a solder connecting terminal treated by the substituting method.
【0016】[0016]
【課題を解決するための手段】上記の問題は、はんだ付
けを行う前に、電子部品の接続端子に表面被覆処理され
た予備はんだを除去後に、低い融点の鉛を含まない合金
組成のはんだに置換することによって解決できる。以
下、電子部品の接続端子に表面被覆処理された予備はん
だの置換方法とその置換方法により処理された接続端子
の説明を行う。[Means for Solving the Problems] The above-mentioned problems are caused by a solder having an alloy composition containing no lead having a low melting point after the removal of the surface-treated preliminary solder on the connection terminals of the electronic component before soldering. It can be solved by replacing. Hereinafter, a method of replacing the pre-solder surface-coated on the connection terminal of the electronic component and the connection terminal processed by the replacement method will be described.
【0017】本発明の請求項1の電子部品の端子処理方
法は、予備はんだにより表面被覆されてなる電子部品の
接続端子を、該予備はんだの融点温度より低く、且つ鉛
を含まない合金組成のはんだ浴に浸漬し、前記予備はん
だした接続端子のはんだを熱拡散させて前記はんだ浴中
のはんだに置換することを特徴とするものである。According to a first aspect of the present invention, there is provided a method of treating a terminal of an electronic component, wherein the connecting terminal of the electronic component whose surface is coated with the preliminary solder has an alloy composition lower than the melting point temperature of the preliminary solder and containing no lead. It is characterized in that it is immersed in a solder bath and the solder of the pre-soldered connection terminal is thermally diffused and replaced with the solder in the solder bath.
【0018】接続端子に表面被覆された予備はんだに対
して、実装時に使用する鉛を含まない合金組成のはんだ
付けを直接行うと、拡散反応および3元合金の発生によ
るはんだ付け強度の低下を招くが、鉛を含まない合金組
成を溶融させたはんだ浴に、予備はんだが表面被覆され
ている接続端子を浸漬させることにより、その予備はん
だの液相線温度よりはんだ浴の溶融温度が低い場合に予
備はんだは、はんだ浴中において溶融ではなく熱拡散に
より接続端子から除去され、予備はんだに代わってはん
だ浴中の鉛を含まないはんだ合金により表面被覆され
る。If the lead-free alloy composition used at the time of mounting is directly soldered to the preliminary solder coated on the surface of the connection terminal, the diffusion strength and the generation of the ternary alloy cause a decrease in the soldering strength. However, by immersing the connection terminals whose surface is coated with pre-solder in a solder bath in which an alloy composition not containing lead is melted, when the melting temperature of the solder bath is lower than the liquidus temperature of the pre-solder. The presolder is removed from the connection terminals by thermal diffusion rather than melting in the solder bath and is surface coated with the lead-free solder alloy in the solder bath instead of the presolder.
【0019】発明の請求項2の電子部品の端子処理方法
は、請求項1の電子部品の端子処理方法において、予備
はんだは錫と鉛の共晶はんだ相当の組成であり、該予備
はんだをSn,Bi,Ag,Zn,In,Cu,またはSbの少なくと
も一つを主成分とする無鉛はんだに置換することを特徴
とするものである。According to a second aspect of the present invention, there is provided a terminal treatment method for an electronic component according to the first aspect, wherein the preliminary solder has a composition corresponding to a eutectic solder of tin and lead, and the preliminary solder is Sn. , Bi, Ag, Zn, In, Cu, or Sb is replaced with a lead-free solder whose main component is.
【0020】請求項1の電子部品の端子処理方法におい
て、接続端子に表面被覆された予備はんだ材料が、現在
最もよく普及している錫と鉛の共晶はんだ相当品である
場合に、請求項2に記載の方法でこの予備はんだを前記
各金属の少なくとも一つを主成分とする毒性のない無鉛
はんだに置換することにより有鉛はんだの除去と他の無
鉛はんだへの置換が同時に実行できる効果がある。According to the first aspect of the present invention, there is provided a method of treating a terminal of an electronic component, wherein the pre-solder material coated on the surface of the connection terminal is a eutectic solder equivalent of tin and lead which is most popular nowadays. By replacing the pre-solder with a non-toxic lead-free solder containing at least one of the metals as a main component by the method described in 2, the removal of the lead-containing solder and the replacement with another lead-free solder can be performed simultaneously. There is.
【0021】本発明の請求項3の電子部品の端子処理方
法は、予備はんだにより表面被覆されてなる電子部品の
接続端子を、前記予備はんだが浸食される液体で処理す
ることにより、前記表面被覆された予備はんだを除去後
に、前記鉛を含まない合金組成のはんだに置換すること
を特徴とするものである。According to a third aspect of the present invention, there is provided a method of treating a terminal of an electronic component, wherein the connection terminal of the electronic component, which is surface-coated with preliminary solder, is treated with a liquid that corrodes the preliminary solder. After removing the prepared preliminary solder, it is replaced with the solder having the alloy composition containing no lead.
【0022】本発明の請求項1または2以外の予備はん
だ除去方法として、予備はんだが施された接続端子を、
その予備はんだを浸食する液体で処理することにより除
去した後に鉛を含まない合金組成のはんだ浴に浸漬して
2段階の工程で置換する方法でも、はんだ付け時に拡散
や3元合金の発生を防止できる。As a pre-soldering method other than the first or second aspect of the present invention, a connection terminal to which pre-soldering is applied,
Even with the method of removing the preliminary solder by treating it with a liquid that corrodes and then immersing it in a solder bath of an alloy composition containing no lead and replacing it in a two-step process, diffusion and generation of a ternary alloy are prevented during soldering. it can.
【0023】本発明の請求項4の接続端子は、請求項
1、2または3記載の電子部品の端子処理方法によって
処理されたことを特徴とするものである。請求項1、2
または3に記載の電子部品の端子処理方法により処理さ
れた接続端子は、無毒性の無鉛はんだ被覆を実現し、ベ
ーキング処理および後付処理の削除、低耐熱性部品が使
用可能といったことによるコストダウンの効果がある。The connection terminal according to claim 4 of the present invention is characterized by being processed by the terminal processing method for an electronic component according to claim 1, 2 or 3. Claims 1 and 2
Or, the connection terminals treated by the method for treating terminals of electronic components described in 3 realizes non-toxic lead-free solder coating, eliminates baking treatment and post-treatment, and can reduce cost by using low heat resistant components. Has the effect of.
【0024】[0024]
【発明の実施の形態】以下、本発明の実施例を具体的に
説明する。予備はんだにより表面被覆されている大規模
集積回路素子や電子部品等の接続端子を、鉛を含まない
低融点温度の合金組成からなるはんだを溶融させた浴槽
に浸漬させ、予備はんだをはんだ浴中に熱拡散させるこ
とにより接続端子の予備はんだを、無鉛はんだに置換す
る方法は、はんだ温度、浸漬時間、浸漬速度、引上げ速
度等のパラメータの制御によって、置換後の予備はんだ
の被覆を均一にできる。Embodiments of the present invention will be specifically described below. The connection terminals of large-scale integrated circuit elements and electronic components that are surface-coated with preliminary solder are dipped in a bath of molten solder that has a low melting point alloy that does not contain lead, and the preliminary solder is placed in the solder bath. The method of replacing the pre-solder of the connection terminal with the lead-free solder by heat-diffusing to the lead-free solder is to control the parameters such as solder temperature, dipping time, dipping speed, pulling speed, etc. .
【0025】また、接続端子が多数のピンで構成されて
いる場合のリード間のブリッジの発生も防止できる。接
続端子の表面形状も置換後の予備はんだの被覆に影響す
るパラメータとなるが、表面形状に応じて他のパラメー
タを調整することで、予備はんだの被覆の表面形状の種
類によるばらつきを防止できる。It is also possible to prevent a bridge between leads when the connecting terminal is composed of a large number of pins. The surface shape of the connection terminal is also a parameter that affects the coating of the pre-solder after replacement, but by adjusting other parameters according to the surface shape, it is possible to prevent variations in the coating of the pre-solder depending on the type of the surface shape.
【0026】予備はんだ表面の腐食とか酸化の変質の程
度に応じて、フローソルダリング用等のフラックスを塗
布後に鉛を含まないはんだ合金組成のはんだ浴に浸漬処
理することで、予備はんだの被覆の置換効率を向上させ
ることが好ましい。Depending on the degree of corrosion or oxidation of the surface of the preliminary solder, the flux for flow soldering or the like is applied and then dipped in a solder bath having a lead-free solder alloy composition to coat the preliminary solder. It is preferable to improve the substitution efficiency.
【0027】本発明では、鉛を含まない合金組成からな
るはんだ浴の温度は、そのはんだ浴中のはんだ合金の溶
融温度+30℃程度とすることが好ましい。これにより、
十分な熱拡散による除去ならびに置換が同時に可能であ
る。従って、接続端子ならびにその近辺の部品が受ける
熱ストレスは、はんだ付け時の温度と同等かそれ以下に
調節することができる。In the present invention, the temperature of the solder bath having an alloy composition not containing lead is preferably about 30 ° C. + the melting temperature of the solder alloy in the solder bath. This allows
Removal and replacement by sufficient thermal diffusion are possible at the same time. Therefore, the thermal stress applied to the connection terminal and the components in the vicinity thereof can be adjusted to be equal to or lower than the temperature during soldering.
【0028】置換すべき無鉛の合金組成を溶融したはん
だ浴内に拡散した予備はんだの組成による汚染は、予備
はんだを被覆した接続端子のはんだ浴に対する浸漬量に
応じて、浴槽を大きくしてはんだ浴中のはんだ量を増や
す方法、或いは、はんだ浴槽の数を多くして1浴槽当た
りの接続端子の浸漬個数を規制する方法、又は両者を併
用する方法等により拡散率を所要値以下に抑制すること
ができ、これにより拡散反応および3元合金の発生を規
制し、接合強度の低下を防止することが好ましい。Contamination due to the composition of the preliminary solder diffused in the solder bath in which the lead-free alloy composition to be replaced is melted is caused by increasing the size of the bath according to the amount of immersion of the connection terminal coated with the preliminary solder in the solder bath. Suppress the diffusivity below the required value by increasing the amount of solder in the bath, by increasing the number of solder baths to regulate the number of connecting terminals immersed in one bath, or by using both together. Therefore, it is preferable to control the diffusion reaction and the generation of the ternary alloy, thereby preventing the reduction of the bonding strength.
【0029】接続端子に被覆された予備はんだ材料が、
現在最もよく使用されている錫と鉛の共晶はんだ相当品
である場合に、上記の浸漬方法でこの予備はんだを無鉛
はんだに置換することにより有鉛はんだの除去から他の
無鉛はんだへの置換が同時に実行できる接続端子の処理
方法が実現する。The preliminary solder material coated on the connection terminals is
Substitution of lead-free solder with other lead-free solder by replacing this preliminary solder with lead-free solder by the above dipping method when it is equivalent to the most commonly used eutectic solder of tin and lead at present A method of processing connection terminals that can be executed simultaneously is realized.
【0030】この場合、置換したい無鉛はんだの成分を
58Bi−42Sn(融点温度139 ℃)、予備はんだの成分を錫
と鉛の共晶はんだ63Sn−37Pb(共晶温度183 ℃)とすれ
ば、予備はんだはその共晶温度より低い無鉛はんだのは
んだ浴(約170 ℃)に浸漬されることになるが、予備は
んだは浸漬による溶融ではなく熱拡散により充分に無鉛
はんだに置換される。In this case, the lead-free solder component to be replaced is
If 58Bi-42Sn (melting point temperature 139 ° C) and eutectic solder of tin and lead 63Sn-37Pb (eutectic temperature 183 ° C) are used as the components of the pre-solder, the pre-solder is a lead-free solder bath lower than the eutectic temperature. The preliminary solder is sufficiently replaced with lead-free solder by thermal diffusion rather than melting by immersion.
【0031】また、他の予備はんだ除去方法として、予
備はんだが施された接続端子を、その予備はんだを浸食
する液体で処理することにより除去する方法がある。予
備はんだを浸食する液体としては、酸またはアルカリの
広範囲にわたり挙げることができる。強酸,強アルカリ
の場合は接続端子の母材やパッケージ樹脂分を浸食しな
いように液組成、組成温度、処理時間等の条件を最適化
する必要がある。酢酸,しゅう酸,プロピオン酸等の有
機酸は予備はんだとして接続端子に被覆されている合金
を選択的に浸食し、これを除去することができる。As another method of removing the preliminary solder, there is a method of removing the connection terminal to which the preliminary solder is applied by treating it with a liquid that corrodes the preliminary solder. Liquids that attack the presolder can include acids or alkalis over a wide range. In the case of strong acid or strong alkali, it is necessary to optimize the conditions such as liquid composition, composition temperature, treatment time, etc. so as not to erode the base material of the connecting terminal and the package resin. Organic acids such as acetic acid, oxalic acid, and propionic acid can selectively erode the alloy coated on the connection terminals as a pre-solder to remove it.
【0032】有機酸を主成分とする予備はんだ除去剤の
場合、溶媒の組成を調整することにより、容易に除去し
たいはんだ合金に対する浸触性,浸触指向性をより強く
できる。これにより接続端子の母材やパッケージ樹脂を
浸食することなく、予備はんだのみを選択的に浸触し、
除去することができる。In the case of the pre-soldering agent containing an organic acid as a main component, by adjusting the composition of the solvent, it is possible to further enhance the contact property and the contact directivity with respect to the solder alloy to be easily removed. As a result, only the preliminary solder is selectively infiltrated without eroding the base material of the connection terminal or the package resin,
Can be removed.
【0033】予備はんだを除去した接続端子の母材表面
は、清浄化されており除去後短時間の間であれば、表面
被覆処理を施さなくてもかなりのはんだ付性が期待でき
る。除去処理後からはんだ付けするまでの時間を長くし
たい場合や、十分なはんだ付性を確保したい場合には除
去処理後に再度無鉛の合金組成で予備はんだすることに
より接続端子の予備はんだの置換が2段階の工程で可能
となる。The surface of the base material of the connection terminal from which the preliminary solder has been removed is cleaned, and if it is for a short time after the removal, a considerable solderability can be expected without surface coating. If you want to increase the time from the removal process to soldering, or if you want to ensure sufficient solderability, pre-solder the lead-free alloy composition again after the removal process to replace the pre-solder of the connection terminal. It becomes possible in a stepwise process.
【0034】次に本発明の接続端子の予備はんだ置換効
果を実験結果により証明する。58Bi-42Sn のはんだ浴
(はんだ量200g)を3個用意し、これに63Sn-37Pb が予
備はんだされているSOP(small outline package;ガ
ル・ウイング・リード・タイプの略称で以下、SOP14
ピン等のように略記する。)のリード部を、夫々の浴槽
に1分間浸漬させた。電子分光法分析及び蛍光X線分析
によりリード部の合金組成を測定して63Sn-37Pb から58
Bi−42Snに置換できていることを確認した。Next, the preliminary solder replacement effect of the connection terminal of the present invention will be proved by experimental results. Three 58Bi-42Sn solder baths (soldering amount 200g) are prepared, and 63Sn-37Pb is pre-soldered in this SOP (small outline package; abbreviated name of gull wing lead type).
Abbreviated as pins and the like. The lead part of 1) was immersed in each bath for 1 minute. The alloy composition of the lead was measured by electron spectroscopy analysis and X-ray fluorescence analysis, and the composition of 63Sn-37Pb
It was confirmed that it could be replaced with Bi-42Sn.
【0035】このSOPを58Bi-42Sn はんだペーストで
ガラス・エポキシ基板上のCuパッドにはんだ付けし、熱
衝撃試験(−50〜125 ℃,200 サイクル)を行った。接
合強度を引っ張り試験により測定したところ、熱衝撃試
験の前後において接合強度に変化はなく、予備はんだの
置換による効果が下表のように確認できた。This SOP was soldered to a Cu pad on a glass / epoxy substrate with 58Bi-42Sn solder paste, and a thermal shock test (-50 to 125 ° C., 200 cycles) was conducted. When the joint strength was measured by a tensile test, the joint strength did not change before and after the thermal shock test, and the effect of replacement of the preliminary solder was confirmed as shown in the table below.
【0036】[0036]
【表1】 比較例として、Sn-37Pb 予備はんだを置換していないS
OPで同様の試験を行ったところ、表1に示すように、
熱衝撃試験前の接合強度は置換したものよりも低く、ま
た熱衝撃試験後において接合強度が大きく低下している
ことが確認された。[Table 1] As a comparative example, Sn-37Pb S without replacing the preliminary solder
When a similar test was conducted in OP, as shown in Table 1,
It was confirmed that the joint strength before the thermal shock test was lower than that of the substituted one, and that the joint strength was greatly reduced after the thermal shock test.
【0037】また酢酸10%,キシレン70%,イソプロピ
ルアルコール20%の成分を持つ除去剤に、63Sn-37Pb が
予備はんだされているSOP14ピンのリードを50℃,24
時間浸漬させた。この結果を電子分光法分析及び蛍光X
線分析によりリード部の合金組成を測定して63Sn-37Pb
が除去できていることを確認した。その後、58Bi−42Sn
のはんだ浴にリード部を1分間浸漬させて、リード部に
58Bi-42Sn を被覆した。このSOP14ピンを用いて上記
の熱衝撃試験を行ったところ、上記浸漬置換方法と同様
の置換効果が得られた。The lead of SOP14 pin preliminarily soldered with 63Sn-37Pb was added to a remover containing 10% of acetic acid, 70% of xylene and 20% of isopropyl alcohol at 50 ° C. for 24 hours.
Let it soak for an hour. The results are analyzed by electron spectroscopy and fluorescence X
63Sn-37Pb by measuring the alloy composition of the lead by line analysis
Was confirmed to have been removed. After that, 58Bi-42Sn
Immerse the lead part in the solder bath of
58Bi-42Sn was coated. When the above thermal shock test was conducted using this SOP14 pin, the same substitution effect as the above immersion substitution method was obtained.
【0038】[0038]
【発明の効果】本発明の予備はんだ置換方法を用いるこ
とにより、電子部品等の接続端子の予備はんだと実装時
に使用するはんだペーストのはんだ合金の組成が異なる
場合に生じる接合強度の低下問題を解決することができ
る。EFFECT OF THE INVENTION By using the pre-soldering method of the present invention, the problem of reduction in joint strength that occurs when the composition of the solder alloy of the solder paste used at the time of mounting and the pre-soldering of the connection terminal of an electronic component is different is solved. can do.
【0039】また本方法は、簡易且つ安価な装置での自
動化が可能であるため、工程の増加によるコストアップ
を低く抑えることができる。Since this method can be automated with a simple and inexpensive apparatus, the cost increase due to the increase in the number of steps can be suppressed to a low level.
Claims (4)
子部品の接続端子を、該予備はんだの融点温度より低
く、且つ鉛を含まない合金組成のはんだ浴に浸漬し、前
記予備はんだした接続端子のはんだを熱拡散させて前記
はんだ浴中のはんだに置換することを特徴とする電子部
品の端子処理方法。1. A connection terminal of an electronic component, which is surface-coated with preliminary solder, is dipped in a solder bath having an alloy composition lower than the melting point temperature of the preliminary solder and containing no lead, and the pre-soldered connection terminal is A method of treating a terminal of an electronic component, characterized in that the solder is thermally diffused and replaced with the solder in the solder bath.
当の組成であり、該予備はんだをSn,Bi,Ag,Zn,In,
Cu,またはSbの少なくとも一つを主成分とする無鉛はん
だに置換することを特徴とする請求項1記載の電子部品
の端子処理方法。2. The pre-solder has a composition corresponding to a eutectic solder of tin and lead, and the pre-solder comprises Sn, Bi, Ag, Zn, In,
2. The terminal processing method for an electronic component according to claim 1, wherein the lead-free solder containing at least one of Cu and Sb as a main component is substituted.
子部品の接続端子を、前記予備はんだが浸食される液体
で処理することにより、前記表面被覆された予備はんだ
を除去後に、前記鉛を含まない合金組成のはんだに置換
することを特徴とする電子部品の端子処理方法。3. The lead-free solder is obtained by removing the surface-coated preliminary solder by treating a connecting terminal of an electronic component surface-coated with the preliminary solder with a liquid that corrodes the preliminary solder. A terminal treatment method for an electronic component, characterized in that the solder is replaced with a solder having an alloy composition.
端子処理方法によって処理されたことを特徴とする接続
端子。4. A connection terminal processed by the method of processing a terminal of an electronic component according to claim 1.
Priority Applications (1)
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JP20061795A JP3365158B2 (en) | 1995-08-07 | 1995-08-07 | Terminal treatment method for electronic components and connection terminals |
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JP20061795A JP3365158B2 (en) | 1995-08-07 | 1995-08-07 | Terminal treatment method for electronic components and connection terminals |
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Cited By (1)
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---|---|---|---|---|
WO2007081605A3 (en) * | 2005-11-15 | 2008-10-30 | New Way Technologies & Licensi | Method for converting electrical components |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2007081605A3 (en) * | 2005-11-15 | 2008-10-30 | New Way Technologies & Licensi | Method for converting electrical components |
US7867404B2 (en) | 2005-11-15 | 2011-01-11 | Joel Allen Deutsch | Method for converting electrical components |
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