JPH0936596A - Electronic part mounter - Google Patents
Electronic part mounterInfo
- Publication number
- JPH0936596A JPH0936596A JP7209129A JP20912995A JPH0936596A JP H0936596 A JPH0936596 A JP H0936596A JP 7209129 A JP7209129 A JP 7209129A JP 20912995 A JP20912995 A JP 20912995A JP H0936596 A JPH0936596 A JP H0936596A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- holding means
- holding member
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発光ダイオード等
の電子部品をプリント基板に自動的に高密度で実装する
実装装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting apparatus for automatically mounting electronic components such as light emitting diodes on a printed circuit board at high density.
【０００２】[0002]
【従来の技術】例えばディスプレイ装置として、発光ダ
イオード（ＬＥＤ）等の発光素子を多数マトリックス状
に高密度で配置し、該発光素子を選択的に点滅して数字
や文字を表示するものが知られている。該ディスプレイ
装置を製造する場合には、ＤＩＰ型発光素子を使用し、
該発光素子は実装装置によりプリント基板に自動的に実
装している。2. Description of the Related Art For example, a display device is known in which a large number of light emitting elements such as light emitting diodes (LEDs) are arranged in a matrix at a high density, and the light emitting elements are selectively blinked to display numbers or characters. ing. When the display device is manufactured, a DIP type light emitting device is used,
The light emitting element is automatically mounted on a printed circuit board by a mounting device.
【０００３】上記実装装置の従来例を、図４で示す。Ｄ
ＩＰ型発光素子１は、発光ダイオードの光を効率良く外
に放射する為、屈折率の高い樹脂でドーム形に形成した
キャップ２を有し、このキャップ２の下にリード３が突
出して構成されている。該発光素子１の実装は、前記リ
ード３をプリント基板４のスルーホール５に挿入して行
われる。A conventional example of the above mounting apparatus is shown in FIG. D
The IP type light emitting device 1 has a dome-shaped cap 2 made of a resin having a high refractive index in order to efficiently radiate the light emitted from the light emitting diode to the outside, and the leads 3 project below the cap 2. ing. The mounting of the light emitting element 1 is performed by inserting the lead 3 into the through hole 5 of the printed board 4.
【０００４】前記実装装置１０は、移動可能なアーム１
４に装着される保持手段２０が、く字形に形成されて発
光素子１のドーム形キャップ２を上方から掴むことが可
能な複数個の押え部材３０を有し、該押え部材３０がア
ーム１４の下部に放射状に配置され揺動可能に設けられ
ている。そして実装時には、保持手段２０の押え部材３
０を内側に揺動してキャップ２の上部を掴むことで、発
光素子１がキャップ２を上にして垂直に保持される。こ
の状態でアーム１４により発光素子１がプリント基板４
の実装箇所に搬送され、且下部のリード３をスルーホー
ル５に挿入して自動的に実装される。The mounting apparatus 10 comprises a movable arm 1
The holding means 20 attached to the reference numeral 4 has a plurality of holding members 30 formed in a V shape and capable of holding the dome-shaped cap 2 of the light emitting element 1 from above, and the holding members 30 of the arm 14 are provided. The lower part is arranged radially and is swingably provided. Then, at the time of mounting, the holding member 3 of the holding means 20.
By swinging 0 inward and grasping the upper portion of the cap 2, the light emitting element 1 is held vertically with the cap 2 facing upward. In this state, the light emitting element 1 is moved to the printed circuit board 4 by the arm 14.
Is transferred to the mounting position, and the lower lead 3 is inserted into the through hole 5 to be automatically mounted.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上記従来技
術のものにあっては、保持手段２０がく字形の複数個の
押え部材３０を備えた構成である為、高密度実装する場
合に以下の様な不具合がある。即ち、発光素子１をプリ
ント基板４に実装する場合は、押え部材３０が内側に揺
動して縮径する為、既に実装されている既実装素子１’
との隙間が少ない高密度実装の場合にも実装はできる
が、挿入後に押え部材３０が発光素子１を解放する際
に、押え部材３０が図４の一点鎖線の様に外側に揺動し
て拡径する。この為拡径した押え部材３０が既実装素子
１’に衝突して、該既実装素子１’のリード３を曲げて
しまうことがある。この為次の発光素子１が実装できな
くなったり、全部の発光素子１の実装後に曲がったリー
ド３を修正しなければならず、この修正に多大な工数を
要して作業性が悪いという問題があった。By the way, in the above-mentioned prior art, since the holding means 20 is provided with a plurality of holding members 30 having a dogleg shape, the following is required for high-density mounting. There is a problem. That is, when the light emitting element 1 is mounted on the printed circuit board 4, since the holding member 30 swings inward to reduce the diameter, the already mounted element 1 ′ already mounted.
Although it can be mounted even in the case of high-density mounting with a small gap between the holding member 30 and the holding member 30, when the holding member 30 releases the light emitting element 1 after insertion, the holding member 30 swings outward as shown by the one-dot chain line in FIG. Expand the diameter. For this reason, the expanded pressing member 30 may collide with the mounted element 1'and bend the lead 3 of the mounted element 1 '. Therefore, the next light emitting element 1 cannot be mounted, or the bent leads 3 must be corrected after mounting all the light emitting elements 1, and this correction requires a large number of man-hours and the workability is poor. there were.
【０００６】又、保持手段２０の構造が複雑で、該保持
手段２０を装備する電子部品の実装装置はコスト高にな
り、キャップ２の形状や大きさが少し異なっても保持で
きないことがある。更に、押え部材３０が揺動方式であ
るから、保持手段２０で複数個の発光素子１を同時に実
装できない。Further, since the structure of the holding means 20 is complicated, the cost of the electronic component mounting apparatus equipped with the holding means 20 becomes high, and it may not be possible to hold the cap 2 even if the shape or size of the cap 2 is slightly different. Further, since the holding member 30 is of a swing type, the holding means 20 cannot mount a plurality of light emitting elements 1 at the same time.
【０００７】本発明は、斯かる実情に鑑み、高密度実装
する際に既に実装されている他の電子部品の損傷を防
ぎ、更に種々の形状の電子部品を効率良く実装すること
ができる電子部品の実装装置を提供することを目的とす
る。In view of the above situation, the present invention can prevent damage to other electronic components already mounted at the time of high-density mounting, and can efficiently mount electronic components of various shapes. It is an object of the present invention to provide a mounting device for.
【０００８】[0008]
【課題を解決するための手段】本発明は、移動可能なア
ームにＤＩＰ型電子部品を保持する保持手段を有する電
子部品の実装装置に於いて、保持手段が板状の挟持部材
を備え、この挟持部材に電子部品のリードを出し入れす
る差込み部を設けたことを特徴とする。SUMMARY OF THE INVENTION The present invention is an electronic component mounting apparatus having a holding means for holding a DIP type electronic component on a movable arm, wherein the holding means includes a plate-shaped holding member. The holding member is provided with an insertion portion for inserting and removing the lead of the electronic component.
【０００９】保持手段に於ける挟持部材の差込み部にＤ
ＩＰ型電子部品のリードを差込むことにより、電子部品
が垂直状態で保持される。前記挟持部材により電子部品
をプリント基板に搬送し、既に実装されている既実装部
品に隣接するスペースに挟持部材を移動すると、リード
がスルーホールに挿入して実装される。D is inserted in the inserting portion of the holding member in the holding means.
By inserting the lead of the IP type electronic component, the electronic component is held in a vertical state. When the electronic component is carried to the printed board by the holding member and the holding member is moved to the space adjacent to the already mounted component already mounted, the lead is inserted into the through hole and mounted.
【００１０】又実装後はリードがスルーホールにより水
平方向に拘束される為、挟持部材の差込み部を空きスペ
ースで後方に移動することにより電子部品から挟持部材
が容易に外れる。この場合に挟持部材は空きスペースの
みで移動して既実装部品に全く接触しない為、既実装部
品の損傷が確実に防止される。Further, since the lead is horizontally restrained by the through hole after mounting, the holding member is easily detached from the electronic component by moving the inserting portion of the holding member rearward in the empty space. In this case, since the holding member moves only in the empty space and does not contact the already mounted component at all, damage to the already mounted component is reliably prevented.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１２】図１は実装装置の実施例の斜視図、図２は
実装時の作動状態の側面図である。FIG. 1 is a perspective view of an embodiment of a mounting apparatus, and FIG. 2 is a side view of an operating state during mounting.
【００１３】実装装置１０は、作動機構として例えば装
置本体１１にロッド１２が垂直方向に伸縮可能に取付け
られ、このロッド１２の先端のシリンダ１３にアーム１
４が水平方向に伸縮可能に取付けられ、これらロッド１
２とアーム１４の作動でアーム１４が垂直や水平の方向
に移動することが可能に構成される。そしてアーム１４
に保持手段２０が装着される。The mounting apparatus 10 has an operating mechanism, for example, a rod 12 which is attached to an apparatus main body 11 so that the rod 12 can extend and contract in the vertical direction, and the arm 1 is attached to a cylinder 13 at the tip of the rod 12.
4 are attached so that they can extend and contract in the horizontal direction, and these rods 1
The arm 14 can be moved vertically or horizontally by the operation of the arm 2 and the arm 14. And arm 14
The holding means 20 is attached to the.
【００１４】発光素子１は、上端部がドーム形をしてい
るキャップ２の下方にリード３を突出した形状である
が、キャップ２の部分は軽く、リード３が重りとなり、
該リード３を自由に動き得る状態で保持することで、発
光素子１をキャップ２が上の起立状態に保持できる。The light emitting element 1 has a shape in which the lead 3 is projected below the cap 2 having an upper end portion having a dome shape. However, the portion of the cap 2 is light and the lead 3 becomes a weight,
By holding the lead 3 in a freely movable state, the light emitting element 1 can be held in the upright state of the cap 2.
【００１５】前記保持手段２０は、板材をＬ字形に折曲
げることにより垂直部材２１と該垂直部材２１に水平な
挟持部材２２が形成され、前記垂直部材２１が前記アー
ム１４に取付けられる。前記挟持部材２２は、中心部に
長手方向に延びる先広がり状の差込み部２３が穿設さ
れ、該差込み部２３には発光素子１のリード３の出入れ
が可能であり、該差込み部２３の左右に一対の挟持片２
４が形成される。In the holding means 20, a vertical member 21 and a horizontal holding member 22 are formed by bending a plate material into an L shape, and the vertical member 21 is attached to the arm 14. The sandwiching member 22 has a divergent insertion portion 23 extending in the longitudinal direction at the center thereof, and the lead 3 of the light emitting element 1 can be inserted into and removed from the insertion portion 23. Left and right pair of clamping pieces 2
4 is formed.
【００１６】実装時には前記ロッド１２、アーム１４が
該アーム１４に取付けられた保持手段２０の挟持部材２
２を常に水平状態に維持して、垂直又は水平方向に移動
する。そこで図２（ａ）の様な素子補給部１６に於い
て、発光素子１がリード３を素子保持体１７に突刺した
状態で、キャップ２が上の垂直状態にセットされる場合
に、前記挟持部材２２を水平移動して前記差込み部２３
を、発光素子１のリード３の上方露出部に差込む。At the time of mounting, the rod 12 and the arm 14 are sandwiched by the holding member 20 of the holding means 20 attached to the arm 14.
2 is always kept horizontal and moved vertically or horizontally. Therefore, in the element replenishing part 16 as shown in FIG. 2A, when the cap 2 is set in the upper vertical state with the light emitting element 1 piercing the lead 3 into the element holding body 17, the clamping is performed. The member 22 is horizontally moved to move the member 23
Is inserted into the upper exposed portion of the lead 3 of the light emitting element 1.
【００１７】前記発光素子１のリード３は水平方向に拘
束されている為、該リード３が差込み部２３の奥に侵入
する。その後挟持部材２２を上方移動することで、発光
素子１が素子保持体１７から抜けると共にリードの重り
作用で発光素子１が起立状態となり、該起立状態を維持
して搬送することが可能になる。Since the lead 3 of the light emitting element 1 is constrained in the horizontal direction, the lead 3 penetrates deep into the insertion portion 23. After that, by moving the holding member 22 upward, the light emitting element 1 is removed from the element holding body 17 and the weight of the lead causes the light emitting element 1 to be in an upright state, and the light emitting element 1 can be conveyed while maintaining the upright state.
【００１８】前記発光素子１は、挟持部材２２により保
持されプリント基板４の実装箇所に搬送される。プリン
ト基板４に於いて発光素子１が、例えば図２（ｂ）の様
に縦列に実装される場合は、既に実装されている既実装
素子１’の後ろ側が空いている為、既実装素子１’の後
ろの空きスペースＡで挟持部材２２を前方に水平移動す
ると、高密度で素子相互の隙間が少ない場合でも挟持部
材２２により保持された発光素子１を既実装素子１’と
非接触でその後ろに近付けることができ、前記リード３
が前記スルーホール５に一致位置される。その後図２
（ｃ）の様に挟持部材２２を下げると、発光素子１もそ
のまま下降してリード３がスルーホール５に挿入し、発
光素子１は既実装素子１’と非接触で自動的に実装され
る。The light emitting element 1 is held by the holding member 22 and conveyed to the mounting position of the printed circuit board 4. In the case where the light emitting elements 1 are mounted on the printed circuit board 4 in a column as shown in FIG. 2B, for example, since the rear side of the already mounted already mounted elements 1'is vacant, the already mounted elements 1 When the holding member 22 is horizontally moved forward in the empty space A behind the ', the light emitting element 1 held by the holding member 22 is brought into contact with the already mounted element 1'in a high density and a small gap between the elements. It can be brought to the back, and the lead 3
Are aligned with the through holes 5. Then Figure 2
When the holding member 22 is lowered as shown in (c), the light emitting element 1 also descends as it is, the lead 3 is inserted into the through hole 5, and the light emitting element 1 is automatically mounted without contacting the already mounted element 1 '. .
【００１９】又実装後は、発光素子１のリード３が今度
はスルーホール５により水平方向に拘束される。そこで
挟持部材２２を、上述と同様に既実装素子１’の後ろの
空きスペースで後方に水平移動すると、図２（ｄ）の様
に固定したリード３から一対の挟持片２４が容易に抜け
る。而して挟持部材２２から発光素子１が自動的に離脱
して、次回の実装作業を行うことができる。この場合に
挟持部材２２は既実装素子１’の後ろの空きスペースＡ
で前後に水平移動するだけである為挟持部材２２自体も
既実装素子１’とは全く接触せず、既実装素子１’のリ
ード３の曲げ等の損傷が防止される。After mounting, the leads 3 of the light emitting element 1 are now horizontally constrained by the through holes 5. Therefore, when the holding member 22 is horizontally moved rearward in the empty space behind the mounted element 1 ′ as described above, the pair of holding pieces 24 are easily removed from the lead 3 fixed as shown in FIG. 2D. Thus, the light emitting element 1 is automatically separated from the holding member 22, and the next mounting work can be performed. In this case, the sandwiching member 22 is provided with an empty space A behind the mounted element 1 '.
Since it only horizontally moves back and forth, the holding member 22 itself does not contact the mounted element 1'at all and damage such as bending of the lead 3 of the mounted element 1'is prevented.
【００２０】尚、発光素子の実装順序を、プリント基板
の端から順次実装して既実装素子の後ろ側に常に挟持部
材の移動スペースを確保することにより、縦、横、斜め
の実装のいずれの場合も同様に作用する。By mounting the light emitting elements in order from the end of the printed circuit board and always ensuring the movement space of the sandwiching member on the rear side of the already mounted elements, any of vertical, horizontal or diagonal mounting can be achieved. The same applies in the case.
【００２１】本発明は、保持手段２０がリード差込み方
式であるから、複数個の発光素子１を同時に保持して実
装することができる。図３により保持手段の他の実施の
形態を示す。保持手段２０は、水平な挟持部材２６が横
幅が広く形成され、該挟持部材２６に例えば５本の差込
み部２３がプリント基板４のスルーホール５と同じ間隔
で平行に設けられる。In the present invention, since the holding means 20 is of the lead insertion type, a plurality of light emitting elements 1 can be held and mounted at the same time. FIG. 3 shows another embodiment of the holding means. In the holding means 20, a horizontal holding member 26 is formed with a wide width, and for example, five inserting portions 23 are provided in the holding member 26 in parallel with the through holes 5 of the printed board 4 at the same intervals.
【００２２】従って、該他の実施の形態に於いて、実装
時には挟持部材２６の５本の差込み部２３に５個の発光
素子１のリード３を差込んで同時に保持し、前記挟持部
材２６により５個の発光素子１をプリント基板４に搬送
し、該プリント基板４の空きスペースＡに挟持部材２６
を配置し、５本のリード３とスルーホール５をそれぞれ
一致位置して挟持部材２６を下降することにより、５個
の発光素子それぞれのリード３が各スルーホール５に挿
入される。Therefore, in the other embodiment, at the time of mounting, the leads 3 of the five light emitting elements 1 are inserted into the five insertion portions 23 of the holding member 26 and held at the same time. The five light emitting elements 1 are conveyed to the printed board 4, and the holding member 26 is placed in the empty space A of the printed board 4.
Are arranged and the sandwiching member 26 is lowered with the five leads 3 and the through holes 5 aligned with each other, so that the leads 3 of the five light emitting elements are inserted into the through holes 5.
【００２３】その後上記空きスペースＡで挟持部材２６
を後方に水平移動すると、挟持部材２６から５個の発光
素子１が離脱して、一度に５個の発光素子１が自動的に
実装される。而して、複数個の発光素子１を同時に実装
することができ、実装効率が大幅に向上する。Thereafter, the holding member 26 is held in the empty space A.
When 5 is horizontally moved backward, the five light emitting elements 1 are separated from the holding member 26, and the five light emitting elements 1 are automatically mounted at one time. Thus, a plurality of light emitting elements 1 can be mounted at the same time, and the mounting efficiency is significantly improved.
【００２４】尚、本発明は上述した実施の形態に限定さ
れるものではなく、例えば保持手段の挟持片は、挟持部
材と別部材で構成してもよい。又アームの作動機構は実
施の形態以外でもよい。更に、本発明はＤＩＰ型であれ
ば、発光素子以外の種々の電子部品にも適応できること
は勿論である。更に又、差込部の溝巾を充分広くとれ
ば、先広がりとする必要はない。The present invention is not limited to the above-mentioned embodiment, and for example, the holding piece of the holding means may be a member different from the holding member. Further, the arm operating mechanism may be other than the embodiment. Further, it goes without saying that the present invention can be applied to various electronic parts other than the light emitting element as long as it is a DIP type. Furthermore, if the groove width of the insertion portion is made sufficiently wide, it is not necessary to make it wider.
【００２５】[0025]
【発明の効果】以上述べた如く本発明によれば、電子部
品を保持する保持手段が板状の挟持部材を備え、該挟持
部材に電子部品のリードを出し入れする差込み部を有す
る簡単な構成であり、一方の側にスペースが有れば実装
が可能であり、高密度実装する際に既に実装されている
電子部品のリードの曲げ等の損傷を防ぐことができる。
従って、リード曲げを修正する工数が低減する。又保持
手段はリード差込み式であるから、発光素子の場合にキ
ャップの形状や大きさが異なる場合も保持できる。更に
又複数個の電子部品を保持して実装することもでき、実
装効率が向上する。As described above, according to the present invention, the holding means for holding the electronic component is provided with the plate-shaped holding member, and the holding member has the simple structure having the insertion portion for inserting / removing the lead of the electronic component. If there is a space on one side, it is possible to mount, and it is possible to prevent damage such as bending of leads of electronic components that have already been mounted at the time of high-density mounting.
Therefore, the number of steps for correcting the lead bending is reduced. Further, since the holding means is a lead insertion type, it can hold even when the shape or size of the cap is different in the case of a light emitting element. Furthermore, a plurality of electronic components can be held and mounted, and the mounting efficiency is improved.
【図１】本発明に係る電子部品の実装装置の実施の形態
を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of an electronic component mounting apparatus according to the present invention.
【図２】該実施の形態に於ける実装時の作動状態を示す
説明図である。FIG. 2 is an explanatory diagram showing an operating state at the time of mounting in the embodiment.
【図３】保持手段の他の実施の形態を示す斜視図であ
る。FIG. 3 is a perspective view showing another embodiment of holding means.
【図４】従来の保持手段の側面図である。FIG. 4 is a side view of conventional holding means.
１ ＤＩＰ型発光素子（ＤＩＰ型電子部品） ３ リード ４ プリント基板 ５ スルーホール １４ アーム ２０ 保持手段 ２２ 挟持部材 ２３ 差込み部 ２４ 挟持片 DESCRIPTION OF SYMBOLS 1 DIP type light emitting element (DIP type electronic component) 3 Lead 4 Printed circuit board 5 Through hole 14 Arm 20 Holding means 22 Clamping member 23 Insert part 24 Clamping piece
Claims (1)
保持する保持手段を有する電子部品の実装装置に於い
て、保持手段が板状の挟持部材を備え、該挟持部材に電
子部品のリードを出入れする差込み部を設けたことを特
徴とする電子部品の実装装置。1. An electronic component mounting apparatus having a holding means for holding a DIP type electronic component on a movable arm, wherein the holding means includes a plate-like holding member, and the holding member has a lead of the electronic component. A mounting device for an electronic component, which is provided with an insertion / removal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7209129A JPH0936596A (en) | 1995-07-25 | 1995-07-25 | Electronic part mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7209129A JPH0936596A (en) | 1995-07-25 | 1995-07-25 | Electronic part mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0936596A true JPH0936596A (en) | 1997-02-07 |
Family
ID=16567773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7209129A Pending JPH0936596A (en) | 1995-07-25 | 1995-07-25 | Electronic part mounter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0936596A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017085810A1 (en) * | 2015-11-18 | 2017-05-26 | 富士機械製造株式会社 | Substrate work machine and insertion method |
-
1995
- 1995-07-25 JP JP7209129A patent/JPH0936596A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017085810A1 (en) * | 2015-11-18 | 2017-05-26 | 富士機械製造株式会社 | Substrate work machine and insertion method |
| JPWO2017085810A1 (en) * | 2015-11-18 | 2018-09-06 | 株式会社Ｆｕｊｉ | Anti-substrate working machine and insertion method |
| US10813259B2 (en) | 2015-11-18 | 2020-10-20 | Fuji Corporation | Board work machine and insertion method |
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