JPH0936581A - Shielding case and electronic equipment - Google Patents
Shielding case and electronic equipmentInfo
- Publication number
- JPH0936581A JPH0936581A JP7187600A JP18760095A JPH0936581A JP H0936581 A JPH0936581 A JP H0936581A JP 7187600 A JP7187600 A JP 7187600A JP 18760095 A JP18760095 A JP 18760095A JP H0936581 A JPH0936581 A JP H0936581A
- Authority
- JP
- Japan
- Prior art keywords
- case
- shield case
- conductive layer
- shield
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3833—Hand-held transceivers
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、携帯電話やコードレス
電話等の携帯用無線機、携帯用受信機等の電子機器に好
適なシールドケース及びこのシールドケースを有する電
子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield case suitable for electronic equipment such as portable radios such as mobile phones and cordless telephones, portable receivers and the like, and electronic equipment having the shield case.
【０００２】[0002]
【従来の技術】従来の携帯電話の概略の構成は、図１５
に示すように、プラスチックで形成された上，下のケー
ス１０，２０で機器の筐体が構成され、この上，下のケ
ース１０，２０内に回路基板３０が収納された構成とな
っている。また、この種の電子機器では、回路基板３０
に搭載された電子部品３１と筐体外部とを電磁的に遮蔽
する必要があり、図１６乃至図１８に示すようなシール
ド構造が用いられていた。2. Description of the Related Art A general structure of a conventional mobile phone is shown in FIG.
As shown in FIG. 5, the upper and lower cases 10 and 20 formed of plastics form a device casing, and the circuit board 30 is housed in the upper and lower cases 10 and 20. . In addition, in this type of electronic device, the circuit board 30
It is necessary to electromagnetically shield the electronic component 31 mounted on the housing from the outside of the housing, and the shield structure as shown in FIGS. 16 to 18 has been used.
【０００３】下ケース２０の内壁面には、導電塗装、メ
ッキ、蒸着等の導電処理により導電層２１が形成され、
回路基板３０のアースパターン３２に、下ケース２０の
周縁部に形成された導電層２１が接触させられ、或い
は、各電気回路部毎の小部屋に下ケース２０の内部を仕
切るリブ２２に形成された導電層２１が接触させられて
いる。また、場合によっては、図１８に示すように、リ
ブ２２の端部にバネ性を有する金属片２３を取り付け、
導電層２１とアースパターン３２とが電気的に確実に接
続される構成としている。一方、回路基板３０の裏面側
にもアースパターン３３が設けられ、或いは、回路基板
３０の内層にメッシュ状のアースパターンが設けられ
る。従って、電子部品３１は下ケース２０に設けられた
導電層２１及び回路基板３０に設けられたアースパター
ンで覆われた状態となるので、内外の電磁遮蔽を行え
る。A conductive layer 21 is formed on the inner wall surface of the lower case 20 by conductive treatment such as conductive coating, plating and vapor deposition.
The conductive pattern 21 formed on the peripheral portion of the lower case 20 is brought into contact with the ground pattern 32 of the circuit board 30, or the rib 22 that partitions the inside of the lower case 20 into a small chamber for each electric circuit portion is formed. The conductive layer 21 is in contact. Further, in some cases, as shown in FIG. 18, a metal piece 23 having a spring property is attached to the end of the rib 22,
The conductive layer 21 and the ground pattern 32 are electrically connected to each other reliably. On the other hand, the ground pattern 33 is also provided on the back surface side of the circuit board 30, or a mesh-shaped ground pattern is provided on the inner layer of the circuit board 30. Therefore, the electronic component 31 is covered with the conductive layer 21 provided on the lower case 20 and the ground pattern provided on the circuit board 30, so that electromagnetic shielding can be performed inside and outside.
【０００４】しかしながら、上記のように下ケース２０
に導電処理を施すシールド構造では次のような問題を有
していた。第１に、下ケース２０の成形後に導電処理を
行う必要があり、従って、機器の外観となる下ケース２
０が損傷しないように注意して導電処理工程に下ケース
２０を輸送する必要があり、また、導電処理により下ケ
ース２０を汚さないように複雑なマスキングを行う必要
があったので、下ケース２０の最終的な完成までに多く
の製造工数がかかり、また、導電処理にかかる費用も高
額なものとなっていた。また、当然のことながら、導電
処理工程があることにより下ケース２０の不良率も高く
なっていた。However, as described above, the lower case 20
The shield structure in which the conductive treatment is performed has the following problems. First, it is necessary to carry out a conductive treatment after the lower case 20 is molded, and therefore, the lower case 2 becomes the appearance of the device.
It is necessary to transport the lower case 20 to the conductive treatment step so as not to damage the lower case 20, and it is necessary to perform complicated masking so as to prevent the lower case 20 from being soiled by the conductive treatment. It took a lot of manufacturing man-hours until the final completion of, and the cost for conductive treatment was also high. In addition, as a matter of course, the defective rate of the lower case 20 was also increased due to the conductive treatment step.
【０００５】第２に、近年においてはプラスチック製品
のリサイクルも重要な課題となっているが、導電処理が
施されている下ケース２０についてはリサイクルが困難
であるという問題がある。Secondly, although recycling of plastic products has become an important issue in recent years, there is a problem in that it is difficult to recycle the lower case 20 which has been subjected to a conductive treatment.
【０００６】一方、下ケース２０に導電処理を施す必要
のないシールド構造としては、図１９及び図２０に示す
ように、金属ケース３４で電子部品３１を覆い、金属ケ
ース３４を半田３５にて回路基板３０のアースパターン
３２に接合するものもあるが、この構造にあっては、電
子部品の修理等の際に金属ケース３４を外す作業が大変
困難となる、金属ケース３４は重量があるので軽量化が
要求される電話機等の携帯形機器には合わない、金属ケ
ース３４と下ケース２０との間にデッドスペースが生じ
るので機器の小形化に逆行するという問題がある。On the other hand, as a shield structure which does not require the lower case 20 to be subjected to a conductive treatment, as shown in FIGS. 19 and 20, a metal case 34 covers the electronic component 31, and the metal case 34 is soldered to form a circuit. Some of them are joined to the ground pattern 32 of the substrate 30, but with this structure, it is very difficult to remove the metal case 34 when repairing the electronic parts. The metal case 34 is heavy and therefore lightweight. There is a problem that it is not suitable for a portable device such as a telephone, which is required to be downsized, and a dead space is generated between the metal case 34 and the lower case 20, which is against the downsizing of the device.
【０００７】[0007]
【発明が解決しようとする課題】上記のように、プラス
チック製の筐体に導電処理を施して構成されるシールド
構造では、筐体の最終的完成までに多くの製造工数がか
かる、導電処理費用も高額になる、導電処理工程がある
ことによって筐体の不良率が高くなる、プラスチックの
リサイクルを行えないという問題点があった。また、金
属ケースを用いたシールド構造では、金属ケースの着脱
作業が困難である、金属ケースの使用は電子機器の小形
化にそぐわないという問題点があった。As described above, in the shield structure formed by conducting the conductive treatment on the plastic casing, it takes a lot of manufacturing man-hours to finally complete the casing. However, there are problems that the cost is high, the defective rate of the housing increases due to the conductive treatment process, and the plastic cannot be recycled. Further, in the shield structure using the metal case, there is a problem that it is difficult to attach and detach the metal case, and use of the metal case is not suitable for downsizing of electronic devices.
【０００８】本発明はこのような従来の欠点を解決する
べくなされたものであり、金属ケースを用いないで電子
部品をシールドすることができ、従って、機器の小形
化、軽量化を図ることができ、また、プラスチック製の
筐体自体には導電処理を施す必要もない電子機器のシー
ルド構造を提供することを目的とする。The present invention has been made to solve the above-mentioned conventional drawbacks, and it is possible to shield electronic parts without using a metal case. Therefore, the size and weight of the device can be reduced. It is another object of the present invention to provide a shield structure for electronic equipment that does not require a conductive treatment on the plastic housing itself.
【０００９】[0009]
【課題を解決するための手段】請求項１に係る発明は、
電子部品を収納する凹部を有するプラスチック製の筐体
に設けられ前記電子部品をシールドするためのシールド
ケースにおいて、前記筐体の肉厚よりも十分薄い肉厚の
プラスチックシートを成形し、かつ、この成形されたプ
ラスチックシートに導電処理を施すことによりシールド
用の導電層が形成されてなり、前記筐体の凹部に嵌め込
まれて前記筐体の内壁面に密着させられる構成となって
いる。The invention according to claim 1 is
In a shield case provided in a plastic casing having a recess for accommodating an electronic component and for shielding the electronic component, a plastic sheet having a thickness sufficiently smaller than the thickness of the casing is formed, and A conductive layer for shielding is formed by subjecting a molded plastic sheet to a conductive treatment, and the conductive layer is fitted into the recess of the housing and brought into close contact with the inner wall surface of the housing.
【００１０】請求項２に係る電子機器は、電子部品を収
納する凹部を有するプラスチック製の筐体と、この筐体
の肉厚よりも十分薄い肉厚のプラスチックシートを成形
し、かつ、この成形されたプラスチックシートに導電処
理を施すことによりシールド用の導電層及びこの導電層
と絶縁されたパターン用の導電層が形成されてなり、前
記筐体の凹部に嵌め込まれて前記筐体の内壁面に密着さ
せられるシールドケースと、電子部品を搭載し、前記パ
ターン用の導電層と接続されるパターン部を有し、前記
シールドケースにより前記電子部品が覆われ、かつ、前
記パターン用導電層に前記パターン部が密着する状態で
前記筐体に取り付けられる回路基板とを具備する構成と
なっている。According to a second aspect of the present invention, there is provided an electronic apparatus, wherein a plastic casing having a recess for accommodating an electronic component and a plastic sheet having a thickness sufficiently smaller than that of the casing are molded, and the molding is performed. A conductive layer for shielding and a conductive layer for a pattern insulated from the conductive layer are formed by subjecting the formed plastic sheet to a conductive treatment, and the conductive layer is fitted into the concave portion of the housing to form an inner wall surface of the housing. A shield case that is brought into close contact with the electronic component, and has a pattern portion that is connected to the conductive layer for the pattern, the electronic component is covered by the shield case, and the conductive layer for the pattern has the above-mentioned structure. The circuit board is attached to the casing in a state where the pattern portions are in close contact with each other.
【００１１】[0011]
【作用】請求項１に係るシールドケースでは、シールド
ケースは成形された肉厚の薄いプラスチックシートに導
電処理を施すことにより形成され、このシールドケース
が筐体の凹部に嵌め込まれる構成となっているので、機
器の小形化、軽量化を図ることができ、また、プラスチ
ックの筐体自体には導電処理を施す必要がなくなる。ま
た、シールドケースは薄いプラスチックシートを真空成
形、ホットプレス等の成形手段で成形する構成となって
いるので、筐体の内側の形状に沿った複雑な形状も容易
に造り出せる。In the shield case according to the first aspect, the shield case is formed by subjecting a molded thin plastic sheet to a conductive treatment, and the shield case is fitted in the recess of the housing. Therefore, it is possible to reduce the size and weight of the device, and it is not necessary to subject the plastic housing itself to conductive treatment. Further, since the shield case has a structure in which a thin plastic sheet is formed by a forming means such as vacuum forming or hot pressing, it is possible to easily create a complicated shape along the inner shape of the housing.
【００１２】請求項２に係る電子機器では、シールドケ
ースは、成形されたプラスチックシートに導電処理を施
すことによって、シールド用導電層の他にパターン用導
電層が形成されているので、請求項１に係る発明の作用
に加え、このシールドケースが設けられる回路基板に設
ける必要がある回路パターンが減少するという作用を有
する。In the electronic device according to a second aspect of the present invention, the shield case has the pattern conductive layer in addition to the shield conductive layer formed by subjecting the molded plastic sheet to a conductive treatment. In addition to the effect of the invention according to (1), it has the effect of reducing the circuit pattern that needs to be provided on the circuit board on which the shield case is provided.
【００１３】[0013]
【実施例】以下、本発明の実施例を図１乃至図１４を参
照して詳述する。図１乃至図８は第１の実施例を示す図
であり、図１は携帯電話の概略構成図、図２は図１の携
帯電話の断面図、図３は図２の円部Ａ拡大図、図４は図
１の携帯電話に用いられているシールドケースの斜視
図、図５は図４のシールドケースの断面図、図６は両面
に導電処理を施したシールドケースの斜視図、図７は図
６のシールドケースの断面図、図８は各種プラスチック
シートの性質を比較した図である。Embodiments of the present invention will be described below in detail with reference to FIGS. 1 to 8 are views showing a first embodiment, FIG. 1 is a schematic configuration diagram of a mobile phone, FIG. 2 is a sectional view of the mobile phone of FIG. 1, and FIG. 3 is an enlarged view of a circle portion A of FIG. 4, FIG. 4 is a perspective view of a shield case used in the mobile phone of FIG. 1, FIG. 5 is a cross-sectional view of the shield case of FIG. 4, FIG. 6 is a perspective view of a shield case having conductive treatment on both sides, and FIG. Is a cross-sectional view of the shield case of FIG. 6, and FIG. 8 is a diagram comparing the properties of various plastic sheets.
【００１４】本例の携帯電話の概略構成は、図１に示す
ように、プラスチックで形成された上，下のケース（筐
体）１１０，１２０、この上，下のケース１１０，１２
０に収納される回路基板１３０、この回路基板１３０に
搭載された電子部品１３１を覆うべく、下ケース１１０
の凹部１２１に嵌め込まれるシールドケース１４０より
構成されている。As shown in FIG. 1, the schematic configuration of the mobile phone of this example is such that upper and lower cases (housings) 110 and 120 made of plastic and upper and lower cases 110 and 12 are formed.
The lower case 110 to cover the circuit board 130 housed in 0 and the electronic components 131 mounted on the circuit board 130.
The shield case 140 is fitted in the recess 121 of the.
【００１５】このシールドケース１４０は、図２及び図
４に示すように、リブ１２２により複数の小部屋に仕切
られ複雑な形状とされた下ケース１２０の凹部１２１に
嵌め込み得る形状に、薄いプラスチックシート１４１を
成形し、図５に示すように、例えば成形後のプラスチッ
クシート１４１の内壁面に導電処理を施すことによりシ
ールド用の導電層１４２を設けることにより構成されて
いる。As shown in FIGS. 2 and 4, the shield case 140 is formed into a thin plastic sheet into a shape that can be fitted into the recess 121 of the lower case 120 that is divided into a plurality of small chambers by the ribs 122 and has a complicated shape. 141 is formed, and as shown in FIG. 5, a conductive layer 142 for shielding is provided by, for example, subjecting the inner wall surface of the molded plastic sheet 141 to a conductive treatment.
【００１６】この場合に、本例においては、プラスチッ
クシート１４１の肉厚は０．１５mm〜０．２５mmとさ
れ、その重量も０．６ｇ程度となっており、ポリカーボ
ネイト（ＰＣ）で形成された下ケース１２０の肉厚（１
mm〜２．５mm）及び重量（約１５ｇ）よりも格段と肉
薄、軽量となっている。従って、真空成形、ホットプレ
ス、場合によっては真空引の射出成形等の成形手段によ
り、複雑なケース形状を容易に得ることができる。In this case, in this example, the plastic sheet 141 has a wall thickness of 0.15 mm to 0.25 mm and a weight of about 0.6 g, and is made of polycarbonate (PC). Case 120 wall thickness (1
mm to 2.5 mm) and weight (about 15 g), which is significantly thinner and lighter. Therefore, a complicated case shape can be easily obtained by a molding means such as vacuum molding, hot pressing, and in some cases vacuum suction injection molding.
【００１７】また、プラスチックシート１４１の材料と
しては、図８に示すように、ポリエステル（ＰＥＴ）、
ＰＣ、ポリ塩化ビニル（ＰＶＣ）、アクリロニトリルブ
タヂエンスチレン（ＡＢＳ）等が使用可能であるが、耐
熱性や経年変化（特に硬化）の観点からすると、ＰＣ或
いはＡＢＳが良好であると考えられ、特にＰＣは食品容
器等で使用されており安価に製造できることから、本例
ではＰＣを用いている。As a material of the plastic sheet 141, as shown in FIG. 8, polyester (PET),
Although PC, polyvinyl chloride (PVC), acrylonitrile butadiene diene styrene (ABS), etc. can be used, PC or ABS is considered to be good from the viewpoint of heat resistance and aging (particularly curing), In particular, PC is used in this example because it is used in food containers and can be manufactured at low cost.
【００１８】また、プラスチックシート１４１に対する
導電処理としては、ＮｉやＣｕのフィラーを混入した導
電塗装、Ｎｉ、Ｃｕ、Ａｕ、Ａｇ等の無電解メッキ或い
は電解メッキ、スパッタリングやイオンプレーティング
等の手法を用いたＮｉ、Ｃｕ、Ａｕ、Ａｇ等の金属の蒸
着を用いることができる。尚、プラスチックシート１４
１に設けられる導電層１４２の厚さは１μｍ〜３μｍ程
度である。As the conductive treatment for the plastic sheet 141, conductive coating containing a filler of Ni or Cu, electroless plating or electrolytic plating of Ni, Cu, Au, Ag, etc., sputtering, ion plating or the like is used. Vapor deposition of the used metal such as Ni, Cu, Au, Ag can be used. The plastic sheet 14
The thickness of the conductive layer 142 provided in No. 1 is about 1 μm to 3 μm.
【００１９】また、シールドケース１４０としては、図
６及び図７に示すように、プラスチックシート１４１の
内壁面及び外壁面の両面に導電層１４２を設けても良
く、この場合には、プラスチックシート１４１に多数の
***１４３を設けることにより、この穴１４３を通じて
シールドケース１４０の内壁面、外壁面に設けられた導
電層１４２を電気的に接続する。このように、プラスチ
ックシート１４１の両面に導電層１４２を設けたシール
ドケース１４０においては、電磁波のシールド効果とし
ては、シールドケース１４０の板厚と同じ板厚の金属板
でシールドケースを形成した場合と同じシールド効果を
期待できる。Further, as the shield case 140, as shown in FIGS. 6 and 7, conductive layers 142 may be provided on both the inner wall surface and the outer wall surface of the plastic sheet 141. In this case, the plastic sheet 141 is provided. By providing a large number of small holes 143 in the inner wall of the shield case 140, the conductive layers 142 provided on the inner wall surface and the outer wall surface of the shield case 140 are electrically connected to each other. As described above, in the shield case 140 in which the conductive layers 142 are provided on both surfaces of the plastic sheet 141, the electromagnetic wave shielding effect is the same as when the shield case is formed of a metal plate having the same plate thickness as the shield case 140. You can expect the same shield effect.
【００２０】上記のシールドケース１４０は、下ケース
１２０の凹部１２１に嵌め込まれ、回路基板１３０が下
ケース１２０に取り付けられることにより、図２及び図
３に示すように、電子部品１３１を覆う状態で回路基板
１３０に取り付けられる。この場合に、シールドケース
１４０の周縁部分には舌片部１４５が設けられており、
この舌片部１４５は薄いプラスチックシートで形成され
ているので、充分な弾力性を有している。従って、この
舌片部１４５が弾力性を有した状態で回路基板１３０の
アースパターン１３２に密着するので、シールドケース
１４０の導電層１４２とアースパターン１３２とは電気
的に確実に接続される。また、シールドケース１４０の
うちの下ケース１２０のリブ１２２が挿入される凹部１
４６の壁面１４７もアースパターン１３２に接触するの
で、シールドケース１４０は各部屋ごとにアースパター
ン１３２に電気的に接続される。一方、回路基板１３０
の裏面側にもアースパターン１３３が設けられている。
従って、電子部品１３１は、シールドケース１４０の導
電層１４２及び回路基板１３０のアースパターン１３３
で覆われた状態となり、シールドケース１４０に形成の
各部屋ごとに内外の電磁遮蔽を行える。The shield case 140 is fitted into the recess 121 of the lower case 120, and the circuit board 130 is attached to the lower case 120 so that the electronic component 131 is covered as shown in FIGS. 2 and 3. It is attached to the circuit board 130. In this case, the tongue piece 145 is provided on the peripheral portion of the shield case 140,
Since the tongue piece 145 is formed of a thin plastic sheet, it has sufficient elasticity. Therefore, since the tongue piece 145 is brought into close contact with the ground pattern 132 of the circuit board 130 in an elastic state, the conductive layer 142 of the shield case 140 and the ground pattern 132 are electrically connected reliably. Further, the recess 1 into which the rib 122 of the lower case 120 of the shield case 140 is inserted
Since the wall surface 147 of 46 also contacts the ground pattern 132, the shield case 140 is electrically connected to the ground pattern 132 for each room. On the other hand, the circuit board 130
A ground pattern 133 is also provided on the back side of the.
Therefore, the electronic component 131 includes the conductive layer 142 of the shield case 140 and the ground pattern 133 of the circuit board 130.
The interior and exterior are shielded for each room formed in the shield case 140.
【００２１】図９及び図１０は第２の実施例を示す図で
あり、図９はシールドケースの斜視図、図１０はシール
ドケースの舌片部を回路基板に接触させたときの変化を
示す図である。9 and 10 are views showing a second embodiment, FIG. 9 is a perspective view of a shield case, and FIG. 10 shows a change when a tongue piece of the shield case is brought into contact with a circuit board. It is a figure.
【００２２】本例のシールドケース１４０Ａでは、舌片
部１４５Ａの形状が湾曲した形状とされ、かつ、所定間
隔で切欠き１４６が形成されている点を除いて、シール
ドケース１４０と同様の構成となっている。本例では、
回路基板１３０のアースパターン１３２に舌片部１４５
Ａを押し付けると、舌片部１４５Ａは図１０（ａ）に示
す状態から図１０（ｂ）に示すようなつぶれた状態に変
形してアースパターン１３２に密着するので、舌片部１
４５Ａとアースパターン１３２との電気的接続を多数の
箇所で確実に確保できる。尚、舌片部１４５Ａは弾力性
を有するので、加圧を解除すれば元の状態にもどる。The shield case 140A of this example has the same structure as the shield case 140 except that the tongue piece 145A has a curved shape and the notches 146 are formed at predetermined intervals. Has become. In this example,
The tongue piece 145 is formed on the ground pattern 132 of the circuit board 130.
When A is pressed, the tongue piece portion 145A is deformed from the state shown in FIG. 10 (a) to the crushed state as shown in FIG. 10 (b) and comes into close contact with the ground pattern 132.
Electrical connection between the 45A and the ground pattern 132 can be reliably ensured at a number of places. Since the tongue piece portion 145A has elasticity, it returns to the original state when the pressure is released.
【００２３】図１１及び図１２は第３の実施例を示す図
であり、図１１はシールドケースの斜視図、図１２はシ
ールドケースの舌片部を回路基板に接触させたときの変
化を示す図である。11 and 12 are views showing a third embodiment, FIG. 11 is a perspective view of the shield case, and FIG. 12 shows a change when the tongue piece of the shield case is brought into contact with the circuit board. It is a figure.
【００２４】本例のシールドケース１４０Ｂでは、舌片
部１４５Ｂに球状の突部１４７が所定間隔で形成されて
いる点を除いて、シールドケース１４０と同様な構成と
なっている。本例では、回路基板１３０のアースパター
ン１３２に舌片部１４５Ｂの突部１４７を押し付ける
と、突部１４７は図１２（ａ）に示す状態から図１２
（ｂ）に示すようなつぶれた形状に変化してアースパタ
ーン１３２に密着するので、舌片部１４５Ｂとアースパ
ターン１３２との電気的接続を多数の箇所で確実に確保
できる。尚、舌片部１４５Ｂの突部１４７は弾力性を有
しているので、加圧を解除すれば元の状態にもどる。The shield case 140B of this example has the same construction as the shield case 140 except that spherical projections 147 are formed on the tongue piece 145B at predetermined intervals. In this example, when the protrusion 147 of the tongue piece 145B is pressed against the ground pattern 132 of the circuit board 130, the protrusion 147 changes from the state shown in FIG.
Since it changes into a crushed shape as shown in (b) and comes into close contact with the ground pattern 132, the electrical connection between the tongue piece 145B and the ground pattern 132 can be reliably ensured at a number of locations. Since the protrusion 147 of the tongue piece 145B has elasticity, it returns to the original state when the pressure is released.
【００２５】図１３及び図１４は第４の実施例を示す図
であり、図１３はシールドケースの斜視図、図１４はシ
ールドケースを回路基板に取り付けた状態の断面図であ
る。本例のシールドケース１４０Ｃは薄いプラスチック
シート１４１でケース状に成形されている点はシールド
ケース１４０と共通するが、導電処理の際にはマスキン
グを施すことにより、シールド用の導電層１４２及びこ
の導電層１４２と絶縁されたパータン用の導電層１４８
が形成されている点で異なっている。本例では、回路基
板１３０の電子部品１３１をシールドケース１４０Ｃで
覆うと、パターン用導電層１４８を回路基板１３０のホ
ットライン１３５の接続用パターン部１３６に接続する
ことが可能となり、このシールドケース１４０Ｃによっ
て電子部品のシールドを行えると共に、リード線やジャ
ンパー線の役割を兼ねることができる。FIGS. 13 and 14 are views showing a fourth embodiment, FIG. 13 is a perspective view of a shield case, and FIG. 14 is a sectional view showing a state in which the shield case is attached to a circuit board. The shield case 140C of this example is similar to the shield case 140 in that it is formed of a thin plastic sheet 141 into a case shape. However, by masking during the conductive treatment, the shield conductive layer 142 and the conductive layer 142 for shield are formed. Conductive layer 148 for pattern insulated from layer 142
Are different in that they are formed. In this example, when the electronic component 131 of the circuit board 130 is covered with the shield case 140C, the pattern conductive layer 148 can be connected to the connection pattern portion 136 of the hot line 135 of the circuit board 130. This makes it possible to shield electronic components and also serve as lead wires and jumper wires.
【００２６】[0026]
【発明の効果】以上説明したように請求項１に係るシー
ルドケースでは、シールドケースは、プラスチック製の
筐体よりも十分薄いプラスチックシートからなる成形品
に導電処理を施すことにより形成され、このシールドケ
ースが筐体の凹部に嵌め込まれる構成となっているの
で、機器の小形化、軽量化を図ることができる。また、
肉厚の薄いプラスチックシートの成形は短時間で行え、
また、外観不良を心配する必要もないのでプラスチック
シートの成形品の導電処理も容易に行えるという利点を
有する。また、シールドケースを筐体から取り外すこと
によりプラスチック製の筐体のリサイクルが可能になる
という利点もある。As described above, in the shield case according to the first aspect, the shield case is formed by subjecting a molded product made of a plastic sheet that is sufficiently thinner than the plastic housing to a conductive treatment, and the shield is formed. Since the case is configured to be fitted in the concave portion of the housing, it is possible to reduce the size and weight of the device. Also,
Molding thin plastic sheets in a short time,
In addition, there is no need to worry about a defective appearance, so that there is an advantage that the conductive treatment of the plastic sheet molded product can be easily performed. There is also an advantage that the plastic case can be recycled by removing the shield case from the case.
【００２７】また、請求項２に係る電子機器では、シー
ルドケースに形成されているパターン用導電層をリード
線やジャンパー線として用いることができるので、請求
項１の効果に加え、電子機器の部品点数を削減できると
いう効果を有する。In addition, in the electronic device according to the second aspect, since the pattern conductive layer formed in the shield case can be used as the lead wire or the jumper wire, in addition to the effect of the first aspect, parts of the electronic device can be obtained. This has the effect of reducing the number of points.
【図１】本発明の第１の実施例に係る携帯電話の概略構
成を示す分解斜視図。FIG. 1 is an exploded perspective view showing a schematic configuration of a mobile phone according to a first embodiment of the present invention.
【図２】図１に係る携帯電話の断面図。2 is a cross-sectional view of the mobile phone according to FIG.
【図３】図２の円部Ａ拡大図。FIG. 3 is an enlarged view of circle A in FIG.
【図４】図１に係る携帯電話に使用されるシールドケー
ス（片面導電処理）の斜視図。FIG. 4 is a perspective view of a shield case (single-sided conductive treatment) used in the mobile phone according to FIG.
【図５】図４のシールドケースの部分断面図。5 is a partial cross-sectional view of the shield case of FIG.
【図６】図１に係る携帯電話に使用されるシールドケー
ス（両面導電処理）の斜視図。6 is a perspective view of a shield case (double-sided conductive treatment) used in the mobile phone according to FIG.
【図７】図６のシールドケースの部分断面図。7 is a partial cross-sectional view of the shield case of FIG.
【図８】シールドケースの成形に使用し得る各種プラス
チックシートの性質を比較した図。FIG. 8 is a diagram comparing the properties of various plastic sheets that can be used for forming a shield case.
【図９】本発明の第２の実施例に係るシールドケースの
斜視図。FIG. 9 is a perspective view of a shield case according to a second embodiment of the present invention.
【図１０】図９のシールドケースの舌片部を回路基板に
当接させたときの作用を示す図。FIG. 10 is a diagram showing an operation when the tongue piece portion of the shield case of FIG. 9 is brought into contact with a circuit board.
【図１１】本発明の第３の実施例に係るシールドケース
の斜視図。FIG. 11 is a perspective view of a shield case according to a third embodiment of the present invention.
【図１２】図１１のシールドケースの舌片部を回路基板
に当接させたときの作用を示す図。FIG. 12 is a view showing an operation when the tongue piece portion of the shield case of FIG. 11 is brought into contact with a circuit board.
【図１３】本発明の第４の実施例に係るシールドケース
の斜視図。FIG. 13 is a perspective view of a shield case according to a fourth embodiment of the present invention.
【図１４】図１３のシールドケースを回路基板に取り付
けた状態の断面図。14 is a cross-sectional view of the shield case of FIG. 13 attached to a circuit board.
【図１５】従来の携帯電話の構成を示す分解斜視図。FIG. 15 is an exploded perspective view showing the configuration of a conventional mobile phone.
【図１６】図１５に係る携帯電話の断面図。16 is a cross-sectional view of the mobile phone according to FIG.
【図１７】図１６の円部Ｂ拡大図。FIG. 17 is an enlarged view of circle B in FIG.
【図１８】図１５に係る携帯電話の下ケースのリブに金
属片を設けた例を示す断面図。18 is a cross-sectional view showing an example in which a metal piece is provided on the rib of the lower case of the mobile phone according to FIG.
【図１９】別の従来の携帯電話の構成を示す断面図。FIG. 19 is a cross-sectional view showing the configuration of another conventional mobile phone.
【図２０】図１９の円部Ｃ拡大図。20 is an enlarged view of a circle C in FIG.
１２０ プラスチック筐体（下ケース） １２１ 凹
部 １３０ 回路基板 １３１ 電
子部品 １４０，１４０Ａ，１４０Ｂ，１４０Ｃ シールドケー
ス １４１ プラスチックシート １４２ シ
ールド用導電層 １４８ パターン用導電層120 Plastic Enclosure (Lower Case) 121 Recess 130 Circuit Board 131 Electronic Components 140, 140A, 140B, 140C Shield Case 141 Plastic Sheet 142 Shield Conductive Layer 148 Pattern Conductive Layer
Claims (2)
チック製の筐体に設けられ前記電子部品をシールドする
ためのシールドケースにおいて、 前記筐体の肉厚よりも十分薄い肉厚のプラスチックシー
トを成形し、かつ、この成形されたプラスチックシート
に導電処理を施すことによりシールド用の導電層が形成
されてなり、前記筐体の凹部に嵌め込まれて前記筐体の
内壁面に密着させられるシールドケース。1. A shield case for shielding an electronic component, which is provided in a plastic casing having a recess for accommodating an electronic component, wherein a plastic sheet having a thickness sufficiently smaller than that of the casing is molded. Further, the shield case is formed by conducting a conductive treatment on the molded plastic sheet, and is fitted into the recess of the casing to be in close contact with the inner wall surface of the casing.
チック製の筐体と、 この筐体の肉厚よりも十分薄い肉厚のプラスチックシー
トを成形し、かつ、この成形されたプラスチックシート
に導電処理を施すことによりシールド用の導電層及びこ
の導電層と絶縁されたパターン用の導電層が形成されて
なり、前記筐体の凹部に嵌め込まれて前記筐体の内壁面
に密着させられるシールドケースと、 電子部品を搭載し、前記パターン用の導電層と接続され
るパターン部を有し、前記シールドケースにより前記電
子部品が覆われ、かつ、前記パターン用導電層に前記パ
ターン部が密着する状態で前記筐体に取り付けられる回
路基板とを具備することを特徴とする電子機器。2. A plastic housing having a recess for accommodating an electronic component, a plastic sheet having a thickness sufficiently smaller than the thickness of the housing, and a conductive treatment applied to the molded plastic sheet. A conductive layer for shielding and a conductive layer for a pattern which is insulated from the conductive layer are formed by applying the shield case, and the shield case is fitted into the recess of the casing and brought into close contact with the inner wall surface of the casing. In a state in which the electronic part is mounted, the electronic part has a pattern part connected to the conductive layer for the pattern, the electronic part is covered by the shield case, and the pattern part is in close contact with the conductive layer for the pattern. An electronic device comprising: a circuit board attached to the housing.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18760095A JP3283161B2 (en) | 1995-07-25 | 1995-07-25 | Shield case and electronic equipment |
| EP95308494A EP0727932B1 (en) | 1994-11-28 | 1995-11-27 | Electromagnetic shielded casing |
| DE69508911T DE69508911T2 (en) | 1994-11-28 | 1995-11-27 | Housing with electromagnetic shielding |
| US08/563,591 US6031732A (en) | 1994-11-28 | 1995-11-28 | Electronic apparatus with a shield structure and a shield case used in the shield structure and a manufacturing method of the shield case |
| CN95121751A CN1055605C (en) | 1994-11-28 | 1995-11-28 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18760095A JP3283161B2 (en) | 1995-07-25 | 1995-07-25 | Shield case and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0936581A true JPH0936581A (en) | 1997-02-07 |
| JP3283161B2 JP3283161B2 (en) | 2002-05-20 |
Family
ID=16208955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18760095A Expired - Fee Related JP3283161B2 (en) | 1994-11-28 | 1995-07-25 | Shield case and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3283161B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005019582A (en) * | 2003-06-25 | 2005-01-20 | Sony Corp | High-speed signal circuit board and method of improving signal transmission property thereof |
| JP2006074149A (en) * | 2004-08-31 | 2006-03-16 | Audio Technica Corp | Condenser microphone unit |
| JP2008213885A (en) * | 2007-03-05 | 2008-09-18 | Casio Comput Co Ltd | Heat insulation package, reactor, and manufacturing processes for them |
| JP2014027218A (en) * | 2012-07-30 | 2014-02-06 | Fujitsu Ltd | Electronic apparatus |
| JP2018515897A (en) * | 2015-05-26 | 2018-06-14 | ヴァレオ システム テルミク | Heating module and electric heating apparatus provided with the heating module |
| WO2020122029A1 (en) * | 2018-12-10 | 2020-06-18 | 株式会社デンソー | Electronic control device |
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| JP2005019582A (en) * | 2003-06-25 | 2005-01-20 | Sony Corp | High-speed signal circuit board and method of improving signal transmission property thereof |
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| JP2006074149A (en) * | 2004-08-31 | 2006-03-16 | Audio Technica Corp | Condenser microphone unit |
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| JP2014027218A (en) * | 2012-07-30 | 2014-02-06 | Fujitsu Ltd | Electronic apparatus |
| JP2018515897A (en) * | 2015-05-26 | 2018-06-14 | ヴァレオ システム テルミク | Heating module and electric heating apparatus provided with the heating module |
| WO2020122029A1 (en) * | 2018-12-10 | 2020-06-18 | 株式会社デンソー | Electronic control device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3283161B2 (en) | 2002-05-20 |
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