JPH09324157A - Adhesive tape or sheet - Google Patents

Adhesive tape or sheet

Info

Publication number
JPH09324157A
JPH09324157A JP14431596A JP14431596A JPH09324157A JP H09324157 A JPH09324157 A JP H09324157A JP 14431596 A JP14431596 A JP 14431596A JP 14431596 A JP14431596 A JP 14431596A JP H09324157 A JPH09324157 A JP H09324157A
Authority
JP
Japan
Prior art keywords
molecular weight
weight
adhesive
average molecular
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14431596A
Other languages
Japanese (ja)
Inventor
Kotaro Funabiki
耕太郎 船引
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP14431596A priority Critical patent/JPH09324157A/en
Publication of JPH09324157A publication Critical patent/JPH09324157A/en
Pending legal-status Critical Current

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape or sheet which keeps good adhesive properties, even when it is produced under the conditions over 80 deg.C. SOLUTION: This adhesive tape or sheet is produced by forming an adhesive layer on the release-treated surface of a release paper which is prepared by laminating a polyethylene layer on at least one surface of the substrate material and then sticking an adhesive tape base material to the adhesive layer. In this case, the polyethylene laminated on the release paper has a ratio of weight- average molecular weight(Mw)/number-average molecular weight(Mn) of <=3.5 and 8wt.% content of the polymer having <=10,000 weight-average molecular weight.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、工業用、包装用、
医療用等に使用される粘着テープもしくはシートに関す
るものであり、特に、製造時の熱により離型紙のポリエ
チレン層から低分子量物が粘着剤へ移行することによる
粘着力の低下が抑制された粘着テープもしくはシートに
関する。
TECHNICAL FIELD The present invention relates to industrial, packaging,
The present invention relates to a pressure-sensitive adhesive tape or sheet used for medical purposes, etc., and in particular, a pressure-sensitive adhesive tape in which a decrease in pressure-sensitive adhesive force due to transfer of low molecular weight substances from the polyethylene layer of release paper to pressure-sensitive adhesive due to heat during manufacturing Or about the seat.

【0002】[0002]

【従来の技術】従来、基材の表面に粘着剤層を設けた粘
着テープを製造する方法として、離型紙の離型処理面に
粘着剤の有機溶媒溶液を塗布し、これを乾燥して粘着剤
層を形成した後、該粘着剤層を粘着テープ基材に転写す
ることが行われている。このような離型紙は紙等の基材
にポリエチレンやポリプロピレン樹脂が積層され、更に
該積層面にシリコーン系離型剤等による離型処理の施さ
れたものが多く使われている。
2. Description of the Related Art Conventionally, as a method for producing an adhesive tape having an adhesive layer on the surface of a substrate, an organic solvent solution of an adhesive is applied to the release-treated surface of a release paper, and the adhesive is dried and applied. After forming the adhesive layer, the adhesive layer is transferred to an adhesive tape substrate. Such release paper is often used in which polyethylene or polypropylene resin is laminated on a substrate such as paper, and the laminated surface is subjected to a release treatment with a silicone release agent or the like.

【0003】このような例として、例えば、特開平5−
117603号公報には、プロピレン系共重合体と低密
度ポリエチレンとからなるポリプロピレン系樹脂組成物
が紙の両面又は片面にラミネートされた離型紙用基材が
記載され、又、特開平4−185430号公報には、紙
の片面又は両面にポリプロピレン樹脂層が最外層となる
ように積層され、該ポリプロピレン樹脂層に離型処理層
が形成された離型紙が記載されている。
As such an example, for example, Japanese Unexamined Patent Publication No.
Japanese Patent No. 117603 describes a release paper substrate in which a polypropylene resin composition composed of a propylene copolymer and low density polyethylene is laminated on both sides or one side of paper, and JP-A-4-185430. The official gazette describes a release paper in which a polypropylene resin layer is laminated on one side or both sides of the paper so as to be the outermost layer, and a release treatment layer is formed on the polypropylene resin layer.

【0004】[0004]

【発明が解決しようとする課題】従来から紙基材に積層
する樹脂としては、低密度ポリエチレンが溶融温度が低
くてラミネート加工が容易であり、柔軟性に富み、安価
であるという特徴があることから非常に多く用いられて
いる。しかし、粘着剤の有機溶媒溶液を離型処理面に塗
布し80℃以上の乾燥温度で加熱乾燥すると、この熱に
より離型紙のポリエチレン中の低分子量物が粘着剤に移
行し、粘着剤層の粘着力を低下させるという問題があ
る。特にゴム系粘着剤の場合にこの傾向が大きく現れ
る。
Conventionally, as a resin to be laminated on a paper base material, low-density polyethylene has a feature that it has a low melting temperature, is easy to laminate, is highly flexible, and is inexpensive. Used very much from. However, when an organic solvent solution of a pressure-sensitive adhesive is applied to the release-treated surface and dried by heating at a drying temperature of 80 ° C. or higher, the low-molecular weight substance in polyethylene of the release paper is transferred to the pressure-sensitive adhesive and the pressure-sensitive adhesive layer There is a problem of reducing the adhesive strength. This tendency is particularly pronounced in the case of rubber-based pressure-sensitive adhesives.

【0005】上記特開平5−117603号公報に記載
のポリプロピレン系樹脂組成物がラミネートされた離型
紙用基材では、吸湿によるカールやピンホールなどの発
生は防止できるものの、低密度ポリエチレンに含有され
ている低分子量物が粘着剤層に移行することによる粘着
力の低下を避けることは困難である。
In the release paper substrate laminated with the polypropylene resin composition described in JP-A-5-117603, curling and pinholes due to moisture absorption can be prevented, but they are contained in low density polyethylene. It is difficult to avoid the decrease in the adhesive strength due to the migration of the low-molecular-weight substances present in the adhesive layer.

【0006】また、上記特開平4−185430号公報
に記載の離型紙は、その表面にポリプロピレン樹脂層を
配置することで耐熱性、光沢度、平滑性に優れ、加熱時
のカールの発生の抑えられたものとなっているが、低分
子量物が粘着剤層への移行による粘着力低下は十分に抑
制されてはいなかった。
Further, the release paper described in the above-mentioned JP-A-4-185430 has excellent heat resistance, glossiness and smoothness by disposing a polypropylene resin layer on the surface thereof, and curling during heating is suppressed. However, the decrease in the adhesive strength due to the transfer of the low molecular weight substance to the pressure-sensitive adhesive layer was not sufficiently suppressed.

【0007】本発明は上記従来の問題点を解消し、80
℃以上で製造しても粘着剤の粘着特性の良好な粘着テー
プもしくはシートを提供することを目的とする。
The present invention solves the above-mentioned conventional problems, and
It is an object of the present invention to provide a pressure-sensitive adhesive tape or sheet having a good pressure-sensitive adhesive property even when manufactured at a temperature of not less than ° C.

【0008】[0008]

【課題を解決するための手段】本発明の粘着テープもし
くはシートは、基材の少なくとも片面にポリエチレンが
積層され、該ポリエチレン表面が離型処理されてなる離
型紙の離型処理面に粘着剤層が形成され、該粘着剤層に
粘着テープ基材が貼り合わされてなる粘着テープもしく
はシートにおいて、離型紙に積層されたポリエチレンの
重量平均分子量(Mw)/数平均分子量(Mn)の比が
3.5以下であり、且つ、10000以下の重量平均分
子量を有するポリマーの含有量が8重量%以下であるこ
とを特徴とするものである。
The pressure-sensitive adhesive tape or sheet of the present invention comprises a base material on which polyethylene is laminated on at least one side, and the surface of the polyethylene is subjected to a release treatment. And the weight average molecular weight (Mw) / number average molecular weight (Mn) of polyethylene laminated on the release paper is 3. The content of the polymer having a weight average molecular weight of 5 or less and 10,000 or less is 8% by weight or less.

【0009】本発明で用いられる基材とは、上質紙、中
質紙、クラフト紙、グラシン紙、パーチメント紙等の、
通常の離型紙基材として使用可能な紙が全て挙げられ
る。
The substrate used in the present invention includes high quality paper, medium quality paper, kraft paper, glassine paper, parchment paper, and the like.
All the papers that can be used as an ordinary release paper substrate are mentioned.

【0010】また、離型処理は上記基材上に積層された
ポリエチレン層の上にシリコーン系離型剤、非シリコー
ン系離型剤のいずれかを積層して行われる。上記シリコ
ーン系離型剤にはソルベント型とエマルジョン型の2種
類があり、いずれもジメチルポリシロキサンを基本とし
ているが、ジメチルポリシロキサンの架橋度が低下する
と離型性能は向上するが粘着剤への未架橋シリコーンの
移行により物性低下を引き起こしやすくなるので、架橋
度は95%以上が好ましく、より好ましくは98%以上
である。
The mold release treatment is carried out by laminating either a silicone type mold release agent or a non-silicone type mold release agent on the polyethylene layer laminated on the above-mentioned substrate. There are two types of the above silicone type release agents, solvent type and emulsion type, both of which are based on dimethylpolysiloxane. When the degree of crosslinking of dimethylpolysiloxane is reduced, the release performance is improved, but it is not suitable for adhesives. The degree of crosslinking is preferably 95% or more, more preferably 98% or more, because the physical properties are likely to be lowered due to migration of the uncrosslinked silicone.

【0011】上記粘着剤層に使用される粘着剤として
は、例えば、アクリル系、ゴム系、シリコーン系等の粘
着剤が挙げられる。又、粘着テープ基材としては、織
布、不織布、クラフト紙、塩化ビニル樹脂フィルム、ポ
リエチレンテレフタレート樹脂フィルム等、粘着テープ
の基材として一般に用いられているものが全て挙げられ
る。
Examples of the pressure-sensitive adhesive used in the pressure-sensitive adhesive layer include acrylic-based, rubber-based, and silicone-based pressure-sensitive adhesives. Examples of the adhesive tape base material include woven cloth, non-woven cloth, kraft paper, vinyl chloride resin film, polyethylene terephthalate resin film and the like, which are generally used as the adhesive tape base material.

【0012】本発明で離型紙に積層されるポリエチレン
は、重量平均分子量(Mw)/数平均分子量(Mn)で
規定される分子量の比が3.5以下であり、且つ、10
000以下の重量平均分子量を有するポリマーの含有量
が8重量%以下である。
The polyethylene laminated on the release paper according to the present invention has a ratio of molecular weights defined by weight average molecular weight (Mw) / number average molecular weight (Mn) of 3.5 or less, and 10
The content of the polymer having a weight average molecular weight of 000 or less is 8% by weight or less.

【0013】上記ポリエチレンの重量平均分子量(M
w)及び数平均分子量(Mn)は、ゲルパーミエーショ
ンクロマトグラフ(GPC)法により、溶離剤としてテ
トラヒドロフラン(THF)を用い、定法に従ってポリ
スチレン換算分子量として求められる。また、1000
0以下の重量平均分子量を有するポリマーの含有量は、
上記GPCにより得られた溶出曲線の面積比から容易に
求められる。
The weight average molecular weight (M
The w) and the number average molecular weight (Mn) can be determined by a gel permeation chromatograph (GPC) method using tetrahydrofuran (THF) as an eluent and a polystyrene-equivalent molecular weight according to a standard method. Also, 1000
The content of the polymer having a weight average molecular weight of 0 or less is
It can be easily obtained from the area ratio of the elution curve obtained by the above GPC.

【0014】上記ポリエチレンのMw/Mnが3.5を
超えると低分子量物の比率が増えて粘着力が低下する原
因となるので、Mw/Mnを3.5以下とする。好まし
くは3.0以下である。重量平均分子量が10000以
下であるポリマーの含有量が8重量%を超えると、この
面に塗布した粘着剤を80℃以上に加熱したとき多量の
低分子量物である上記ポリマーが粘着剤に移行し、粘着
物性が低下する。上記含有量が8重量%以下であれば粘
着剤に移行しても粘着物性に与える実用上の影響は無視
できる。上記含有量は好ましくは5重量%以下である。
If the Mw / Mn of the above-mentioned polyethylene exceeds 3.5, the ratio of low molecular weight substances increases, which may cause the adhesive strength to decrease, so Mw / Mn is set to 3.5 or less. It is preferably 3.0 or less. When the content of the polymer having a weight average molecular weight of 10,000 or less exceeds 8% by weight, when the pressure-sensitive adhesive applied to this surface is heated to 80 ° C. or higher, a large amount of the above-mentioned polymer which is a low molecular weight substance is transferred to the pressure-sensitive adhesive. , The adhesive property is deteriorated. When the content is 8% by weight or less, the practical influence on the adhesive physical properties is negligible even when the adhesive is transferred. The content is preferably 5% by weight or less.

【0015】本発明で用いられるポリエチレンは上記物
性を満足するものであり、具体的には、低密度ポリエチ
レン、中密度ポリエチレン、高密度ポリエチレン、線状
低密度ポリエチレン、メタロセン重合触媒を使用して得
られるポリエチレン等が挙げられる。上記メタロセン重
合触媒を使用して得られるポリエチレンは、用いられる
メタロセン重合触媒の活性点の性質がほぼ均一であると
いう理由から、得られるポリエチレンの分子量、分子量
分布、組成、組成分布がほぼ同じであるという特徴を有
しており好適である。
The polyethylene used in the present invention satisfies the above-mentioned physical properties. Specifically, it is obtained by using low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, and metallocene polymerization catalyst. And the like. The polyethylene obtained using the metallocene polymerization catalyst has almost the same molecular weight, molecular weight distribution, composition and composition distribution because the properties of the active sites of the metallocene polymerization catalyst used are almost uniform. It is preferable because it has the characteristics.

【0016】[0016]

【発明の実施の形態】次に本発明の実施例を説明する。 (1)離型紙離型紙A クラフト紙(厚み80μm)の両面に、メタロセン重合
触媒を用いて製造したポリエチレン(Mw/Mn=2.
3,Mw<10000であるポリマーの比率2.5%)
が厚み15μmで積層され、該ポリエチレン積層面にシ
リコーン系離型剤(信越化学社製、商品名「KS−83
5」)を積層したものを離型紙Aとした。
Next, embodiments of the present invention will be described. (1) Release paper Release paper A Polyethylene produced using a metallocene polymerization catalyst on both sides of a Kraft paper (thickness 80 μm) (Mw / Mn = 2.
3, ratio of polymer with Mw <10000 2.5%)
With a thickness of 15 μm, and a silicone-based release agent (trade name “KS-83” manufactured by Shin-Etsu Chemical Co., Ltd.
5 ”) was laminated to form release paper A.

【0017】離型紙B クラフト紙(厚み80μm)の両面に、線状低密度ポリ
エチレン(Mw/Mn=3.1,Mw<10000であ
るポリマーの比率9.7%)が厚み15μmで積層さ
れ、該低密度ポリエチレン積層面にシリコーン系離型剤
(信越化学社製、商品名「KS−835」)を塗布した
ものを離型紙Bとした。
Release paper B Kraft paper (thickness: 80 μm), both sides of which a linear low-density polyethylene (polymer ratio of Mw / Mn = 3.1, Mw <10000: 9.7%) was laminated with a thickness of 15 μm. A release paper B was obtained by applying a silicone release agent (Shin-Etsu Chemical Co., Ltd., trade name "KS-835") to the low density polyethylene laminated surface.

【0018】離型紙C クラフト紙(厚み80μm)の両面に、低密度ポリエチ
レン(Mw/Mn=4.1,Mw<10000であるポ
リマーの比率12.7%)が厚み15μmで積層され、
該低密度ポリエチレン積層面にシリコーン系離型剤(信
越化学社製、商品名「KS−835」)を塗布したもの
を離型紙Cとした。
Low density polyethylene (ratio of polymer having Mw / Mn = 4.1, Mw <10000 12.7%) is laminated on both sides of release paper C kraft paper (thickness 80 μm) with a thickness of 15 μm,
A release paper C was obtained by coating a silicone-based release agent (Shin-Etsu Chemical Co., Ltd., trade name "KS-835") on the low-density polyethylene laminated surface.

【0019】(2)粘着剤ゴム系粘着剤 天然ゴム20重量部、粘着付与樹脂(ヤスハラケミカル
社製,商品名「YSレジン700」)20重量部、トル
エン60重量部からなる組成物をゴム系粘着剤とした
(固形分40重量%)。
(2) Adhesive Rubber Adhesive Adhesive rubber composition with 20 parts by weight of natural rubber, 20 parts by weight of tackifying resin (trade name "YS resin 700" manufactured by Yasuhara Chemical Co., Ltd.), and 60 parts by weight of toluene. (Solid content 40% by weight).

【0020】アクリル系粘着剤 2−エチルヘキシルアクリレート55重量部、n−ブチ
ルアクリレート38重量部、エチルアクリレート4重量
部、アクリル酸2.5重量部及びアクリルアミド0.5
重量部からなるモノマー混合物を酢酸エチル溶液で溶液
重合することにより、重量平均分子量40万の粘着剤溶
液を得、これをアクリル系粘着剤とした(固形分40重
量%)。
Acrylic adhesive 2-ethylhexyl acrylate 55 parts by weight, n-butyl acrylate 38 parts by weight, ethyl acrylate 4 parts by weight, acrylic acid 2.5 parts by weight and acrylamide 0.5.
A monomer mixture consisting of parts by weight was solution-polymerized with an ethyl acetate solution to obtain an adhesive solution having a weight average molecular weight of 400,000, which was used as an acrylic adhesive (solid content 40% by weight).

【0021】(実施例1〜6、比較例1〜12)表1〜
3に従って離型紙の離型処理面上に上記粘着剤を塗布
し、乾燥条件に従って乾燥した後、厚み38μmのポリ
エチレンテレフタレート(PET)フィルムとラミネー
トすることによりPETフィルム基材の粘着テープを得
た。それぞれの粘着テープについてJIS Z 023
7に準拠してSP粘着力を測定した。その結果を表1〜
3に示した。
(Examples 1 to 6, Comparative Examples 1 to 12) Tables 1 to 1
The pressure-sensitive adhesive was coated on the release-treated surface of the release paper according to No. 3, dried under the drying conditions, and then laminated with a polyethylene terephthalate (PET) film having a thickness of 38 μm to obtain a PET film-based pressure-sensitive adhesive tape. JIS Z 023 for each adhesive tape
The SP adhesive strength was measured according to 7. Table 1 shows the results.
3 is shown.

【0022】[0022]

【表1】 [Table 1]

【0023】[0023]

【表2】 [Table 2]

【0024】[0024]

【表3】 [Table 3]

【0025】表2における比較例1〜3と4〜6、及び
表3における比較例7〜9と10〜12では、乾燥温度
を80℃→100℃→120℃と上昇させた場合、SP
粘着力の低下の激しいものとなっている。これに対し、
表1に記載の実施例1〜3と4〜6では、乾燥温度を8
0℃→100℃→120℃と上昇させても粘着力低下は
ほとんどないものとなっている。
In Comparative Examples 1 to 3 and 4 to 6 in Table 2 and Comparative Examples 7 to 9 and 10 to 12 in Table 3, SP was increased when the drying temperature was increased from 80 ° C to 100 ° C to 120 ° C.
The adhesive strength is severely reduced. In contrast,
In Examples 1 to 3 and 4 to 6 shown in Table 1, the drying temperature was 8
Even if the temperature was increased from 0 ° C to 100 ° C to 120 ° C, there was almost no decrease in adhesive strength.

【0026】[0026]

【発明の効果】本発明は上記の構成を有するものであ
り、本発明の粘着テープもしくはシートは、離型紙に積
層されるポリエチレンの重量平均分子量(Mw)/数平
均分子量(Mn)で規定される分子量の比が3.5以下
であり、且つ、10000以下の重量平均分子量を有す
るポリマーの含有量が8重量%以下であるため、低分子
量物が少なく、粘着剤の乾燥温度を80℃以上にして
も、低分子量物が粘着剤に移行することによる粘着物性
の低下が殆どないものとなっている。
The present invention has the above-mentioned constitution, and the pressure-sensitive adhesive tape or sheet of the present invention is defined by the weight average molecular weight (Mw) / number average molecular weight (Mn) of polyethylene laminated on the release paper. The ratio of the molecular weight of the polymer is 3.5 or less, and the content of the polymer having the weight average molecular weight of 10,000 or less is 8% by weight or less, the amount of low molecular weight substances is small, and the drying temperature of the adhesive is 80 ° C or more. However, there is almost no deterioration in the adhesive physical properties due to the transfer of the low molecular weight substance to the adhesive.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 基材の少なくとも片面にポリエチレンが
積層され、該ポリエチレン表面が離型処理されてなる離
型紙の離型処理面に粘着剤層が形成され、該粘着剤層に
粘着テープ基材が貼り合わされてなる粘着テープもしく
はシートにおいて、離型紙に積層されたポリエチレンの
重量平均分子量(Mw)/数平均分子量(Mn)の比が
3.5以下であり、且つ、10000以下の重量平均分
子量を有するポリマーの含有量が8重量%以下であるこ
とを特徴とする粘着テープもしくはシート。
1. A polyethylene film is laminated on at least one surface of a substrate, and a pressure-sensitive adhesive layer is formed on a release-treated surface of a release paper obtained by subjecting the polyethylene surface to a release treatment, and the pressure-sensitive adhesive layer is formed on the pressure-sensitive adhesive layer. In the pressure-sensitive adhesive tape or sheet obtained by laminating, the weight average molecular weight (Mw) / number average molecular weight (Mn) of polyethylene laminated on the release paper is 3.5 or less, and 10,000 or less. An adhesive tape or sheet having a content of 8% by weight or less.
JP14431596A 1996-06-06 1996-06-06 Adhesive tape or sheet Pending JPH09324157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14431596A JPH09324157A (en) 1996-06-06 1996-06-06 Adhesive tape or sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14431596A JPH09324157A (en) 1996-06-06 1996-06-06 Adhesive tape or sheet

Publications (1)

Publication Number Publication Date
JPH09324157A true JPH09324157A (en) 1997-12-16

Family

ID=15359239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14431596A Pending JPH09324157A (en) 1996-06-06 1996-06-06 Adhesive tape or sheet

Country Status (1)

Country Link
JP (1) JPH09324157A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001064806A1 (en) * 2000-03-03 2001-09-07 Lintec Corporation Pressure-sensitive adhesive sheet and covered structure
JP2002038111A (en) * 2000-04-28 2002-02-06 Lintec Corp Adhesive sheet and adhesive body
JP2003003132A (en) * 2001-06-19 2003-01-08 Lintec Corp Adhesive sheet and pasting material
JP2003013014A (en) * 2001-06-27 2003-01-15 Lintec Corp Pressure-sensitive adhesive sheet and adhesive body
JP2012209363A (en) * 2011-03-29 2012-10-25 Sumitomo Bakelite Co Ltd Dicing film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001064806A1 (en) * 2000-03-03 2001-09-07 Lintec Corporation Pressure-sensitive adhesive sheet and covered structure
JP5276244B2 (en) * 2000-03-03 2013-08-28 リンテック株式会社 Sticking body
JP2002038111A (en) * 2000-04-28 2002-02-06 Lintec Corp Adhesive sheet and adhesive body
JP2003003132A (en) * 2001-06-19 2003-01-08 Lintec Corp Adhesive sheet and pasting material
JP2003013014A (en) * 2001-06-27 2003-01-15 Lintec Corp Pressure-sensitive adhesive sheet and adhesive body
JP2012209363A (en) * 2011-03-29 2012-10-25 Sumitomo Bakelite Co Ltd Dicing film

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