JPH09320363A - Transparent conductive circuit forming device - Google Patents
Transparent conductive circuit forming deviceInfo
- Publication number
- JPH09320363A JPH09320363A JP14047696A JP14047696A JPH09320363A JP H09320363 A JPH09320363 A JP H09320363A JP 14047696 A JP14047696 A JP 14047696A JP 14047696 A JP14047696 A JP 14047696A JP H09320363 A JPH09320363 A JP H09320363A
- Authority
- JP
- Japan
- Prior art keywords
- transparent conductive
- conductive circuit
- ink
- substrate
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板上に透明導電
回路を形成する透明導電回路形成装置に関し、特に透明
導電回路の形成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent conductive circuit forming apparatus for forming a transparent conductive circuit on a substrate, and more particularly to a transparent conductive circuit forming method.
【０００２】[0002]
【従来の技術】一般に液晶表示装置、プラズマ表示装
置、太陽電池等においては、各種動作を行うために透明
導電回路を有している。ここで、このような透明導電回
路の形成方法としては、例えば焼結体を用いてスパッタ
リングや蒸着により透明導電膜層を形成した後、フォト
リソグラフィーを用いて基板上にパターニングを行う方
法が知られている。しかし、このようなフォトリソグラ
フィーによるパターニングは、レジスト塗布、露光、現
像、エッチング、レジスト剥離、洗浄等多数の工程が必
要となるため、透明導電回路の製造費は高くなる。2. Description of the Related Art Generally, a liquid crystal display device, a plasma display device, a solar cell and the like have a transparent conductive circuit for performing various operations. Here, as a method of forming such a transparent conductive circuit, for example, a method of forming a transparent conductive film layer by sputtering or vapor deposition using a sintered body and then performing patterning on the substrate using photolithography is known. ing. However, such patterning by photolithography requires a large number of steps such as resist coating, exposure, development, etching, resist stripping, and cleaning, which increases the manufacturing cost of the transparent conductive circuit.
【０００３】一方、近年、透明導電回路を形成する方法
として、超微粉末を溶剤に分散させてなる透明導電イン
クを基板上に塗布して焼成し、透明導電膜を形成する方
法が開発されつつある。また、塗布した後、透明導電膜
層上にレジスト液を印刷し乾燥することによりレジスト
液を硬化させ、これを洗浄した後焼成することにより、
透明導電回路を得ようとする方法が、例えば特開平５−
２９１７２６等により提案されている。On the other hand, in recent years, as a method of forming a transparent conductive circuit, a method of forming a transparent conductive film by coating a transparent conductive ink prepared by dispersing ultrafine powder in a solvent on a substrate and baking the same has been developed. is there. Further, after coating, the resist solution is printed on the transparent conductive film layer and dried to cure the resist solution, which is washed and then baked,
A method for obtaining a transparent conductive circuit is disclosed in, for example, Japanese Unexamined Patent Publication No.
It is proposed by 291726 and the like.
【０００４】[0004]
【発明が解決しようとする課題】ところで、このような
透明導電インクを用いて透明導電回路を形成する従来の
透明導電回路形成装置においては、レジスト樹脂を酸化
分解するために３００℃以上の焼成工程が必要となる。
しかし、例えば液晶表示装置のディスプレイに用いられ
る染料タイプのカラーフィルター上に透明導電回路を形
成する場合、カラーフィルターの耐熱温度が焼成温度以
下であるため、この焼成工程においてフィルターが脱色
してしまうという問題が生じる。By the way, in a conventional transparent conductive circuit forming apparatus for forming a transparent conductive circuit using such a transparent conductive ink, a baking step at 300 ° C. or higher for oxidizing and decomposing the resist resin. Is required.
However, for example, when a transparent conductive circuit is formed on a dye type color filter used for a display of a liquid crystal display device, the heat resistance temperature of the color filter is equal to or lower than the firing temperature, so that the filter is decolorized in the firing process. The problem arises.
【０００５】また、透明導電材料として、現在最もよく
使用されているＩＴＯ（Ｉｎ2 Ｏ3＋ＳｎＯ2 ）を用い
た場合、３００℃以上ではＩＴＯ膜の酸化が促進され、
抵抗率が上昇するという問題を生じる。さらに、ポスト
ベークを行った上にスクリーン印刷を行うため、ＩＴＯ
インク層にまでアクリル樹脂が浸透し、低抵抗化を行う
ことが困難であるという問題もある。When ITO (In 2 O 3 + SnO 2 ) which is most widely used at present is used as the transparent conductive material, the oxidation of the ITO film is promoted at 300 ° C. or higher,
The problem arises that the resistivity increases. In addition, ITO is used for screen printing after post-baking.
There is also a problem that it is difficult to lower the resistance because the acrylic resin penetrates into the ink layer.
【０００６】なお、真空中に置かれたクヌードソンセル
内にＩｎとＳｎの混合物を装填し、加熱して、セルのス
リットから断熱膨張させ、ＩｎとＳｎのクラスタを精製
し、これをノズルから高圧で噴出させ、酸素雰囲気中に
置かれた基板上に透明導電膜を形成する提案が成されて
いる（特開昭６２−２４５０５，２４５０６）。しか
し、この方法では、成膜室とクラスタ精製室の２室が必
要となり、装置が大型化するだけでなく、成膜速度を大
きくすることができないため回路形成に長時間掛かって
しまうという欠点がある。[0006] A mixture of In and Sn was loaded into a Knudson cell placed in a vacuum, heated and adiabatically expanded from the slit of the cell to purify In and Sn clusters. Has been proposed to form a transparent conductive film on a substrate placed in an oxygen atmosphere by ejecting it at a high pressure (JP-A-62-24505, 24506). However, this method requires two chambers, a film-forming chamber and a cluster refining chamber, which not only increases the size of the apparatus but also makes it difficult to increase the film-forming speed, resulting in a long circuit formation time. is there.
【０００７】本発明は、このような従来技術の問題を解
決するものであり、多くの工程を必要とせず、かつ比較
的低温で低抵抗の透明導電回路を形成することのできる
透明導電回路形成装置を提供することを目的とするもの
である。The present invention solves the problems of the prior art as described above, and does not require many steps and can form a transparent conductive circuit having a low resistance at a relatively low temperature. The purpose is to provide a device.
【０００８】[0008]
【課題を解決するための手段】本発明は、基板上に透明
導電回路を形成する透明導電回路形成装置において、透
明導電性材料にて形成された超微粒子を溶剤に分散させ
てなる透明導電インクと、前記透明導電インクを吐出し
て前記基板上に前記透明導電回路をパターン形成するイ
ンク吐出手段とを備えたことを特徴とするものである。The present invention provides a transparent conductive circuit forming apparatus for forming a transparent conductive circuit on a substrate, wherein transparent conductive ink formed by dispersing ultrafine particles formed of a transparent conductive material in a solvent. And an ink ejecting unit that ejects the transparent conductive ink to form a pattern of the transparent conductive circuit on the substrate.
【０００９】また本発明は、基板上に透明導電回路を形
成する透明導電回路形成装置において、酸化物系透明導
電性材料にて形成された超微粒子を溶剤に分散させてな
る透明導電インクと、前記透明導電インクを吐出して前
記基板上に前記透明導電回路をパターン形成するインク
吐出手段とを備え、前記インク吐出手段により前記透明
導電回路が形成された後、前記基板を加熱して該透明導
電回路を熱処理することを特徴とするものである。The present invention also provides a transparent conductive circuit forming apparatus for forming a transparent conductive circuit on a substrate, wherein a transparent conductive ink formed by dispersing ultrafine particles formed of an oxide-based transparent conductive material in a solvent, An ink ejecting unit that ejects the transparent conductive ink to form a pattern of the transparent conductive circuit on the substrate, wherein after the transparent conductive circuit is formed by the ink ejecting unit, the substrate is heated to be transparent. It is characterized in that the conductive circuit is heat-treated.
【００１０】また本発明は、基板上に透明導電回路を形
成する透明導電回路形成装置において、酸化物系透明導
電性材料にて形成された超微粒子を溶剤に分散させてな
る透明導電インクと、前記透明導電インクを吐出して前
記基板上に前記透明導電回路をパターン形成するインク
吐出手段とを備え、前記基板を加熱すると共に前記透明
導電インクを該加熱された基板上に吐出することによ
り、前記透明導電回路を形成すると共に該透明導電回路
を熱処理することを特徴とするものである。Further, the present invention is a transparent conductive circuit forming apparatus for forming a transparent conductive circuit on a substrate, wherein a transparent conductive ink formed by dispersing ultrafine particles formed of an oxide transparent conductive material in a solvent, An ink ejecting unit that ejects the transparent conductive ink to form a pattern of the transparent conductive circuit on the substrate, and heats the substrate and ejects the transparent conductive ink onto the heated substrate, The transparent conductive circuit is formed and the transparent conductive circuit is heat-treated.
【００１１】また本発明は、前記超微粒子は粒径０．１
μｍ以下に形成された粒子であることを特徴とするもの
である。In the present invention, the ultrafine particles have a particle size of 0.1.
It is characterized in that the particles are formed to have a size of less than or equal to μm.
【００１２】また本発明は、前記透明導電回路の膜厚
は、前記吐出手段の吐出口の口径、吐出回数及び前記透
明導電インクの超微粒子の含有量に応じて変更すること
ができることを特徴とするものである。Further, the present invention is characterized in that the film thickness of the transparent conductive circuit can be changed according to the diameter of the discharge port of the discharge means, the number of discharges and the content of the ultrafine particles of the transparent conductive ink. To do.
【００１３】また本発明は、前記熱処理は、前記透明導
電回路の酸化が抑えられる所定温度以下で行うことを特
徴とするものである。The present invention is also characterized in that the heat treatment is carried out at a temperature not higher than a predetermined temperature at which oxidation of the transparent conductive circuit is suppressed.
【００１４】また本発明は、前記熱処理は、３００℃以
下の温度で行うことを特徴とするものである。Further, the present invention is characterized in that the heat treatment is performed at a temperature of 300 ° C. or lower.
【００１５】また、本発明のように、透明導電性材料に
て形成された超微粒子を溶剤に分散させてなる透明導電
インクをインク吐出手段にて吐出するように構成するこ
とにより、基板上に透明導電回路をパターン形成する。Further, as in the present invention, the transparent conductive ink formed by dispersing the ultrafine particles formed of the transparent conductive material in the solvent is ejected by the ink ejecting means, so that it is formed on the substrate. Pattern the transparent conductive circuit.
【００１６】また、酸化物系透明導電性材料にて形成さ
れた超微粒子を溶剤に分散させてなる透明導電インクを
インク吐出手段により吐出することにより、基板上に透
明導電回路をパターン形成すると共に、透明導電回路が
形成された後、基板を加熱することにより透明導電回路
を熱処理して低抵抗の透明導電回路を形成する。Further, the transparent conductive ink formed by dispersing ultrafine particles formed of an oxide-based transparent conductive material in a solvent is discharged by an ink discharging means to form a pattern of a transparent conductive circuit on the substrate. After the transparent conductive circuit is formed, the transparent conductive circuit is heat-treated by heating the substrate to form a low conductive transparent conductive circuit.
【００１７】また、基板を加熱すると共に酸化物系透明
導電性材料にて形成された超微粒子を溶剤に分散させて
なる透明導電インクをインク吐出手段により吐出するこ
とにより、透明導電回路を熱処理して基板上に低抵抗の
透明導電回路のパターンを形成する。In addition, the transparent conductive circuit is heat-treated by heating the substrate and discharging the transparent conductive ink formed by dispersing the ultrafine particles formed of the oxide type transparent conductive material in the solvent by the ink discharging means. A low resistance transparent conductive circuit pattern is formed on the substrate.
【００１８】また、パターン形成された透明導電回路の
膜厚を、吐出手段の吐出口の口径、吐出回数及び透明導
電インクの超微粒子の含有量に応じて変更するようにす
る。さらに、所定温度以下で熱処理を行うことにより、
透明導電回路の酸化を抑えるようにする。Further, the film thickness of the patterned transparent conductive circuit is changed according to the diameter of the discharge port of the discharge means, the number of discharges, and the content of the ultrafine particles of the transparent conductive ink. Furthermore, by performing heat treatment below a predetermined temperature,
Try to suppress the oxidation of transparent conductive circuits.
【００１９】[0019]
【発明の実施の形態】以下、本発明の実施の形態を図面
を用いて説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【００２０】図１は、本発明の実施の形態に係る透明導
電回路形成装置の構成を示す図であり、同図において、
１は透明導電インクを吐出するインク吐出手段であるイ
ンクジェット、２はインクジェット１のインク吐出口に
臨むように配された基板、３はこの基板２をＸ−Ｙ方向
に移動させるＸ−Ｙステージである。FIG. 1 is a diagram showing the structure of a transparent conductive circuit forming device according to an embodiment of the present invention. In FIG.
Reference numeral 1 is an ink jet which is an ink ejecting means for ejecting a transparent conductive ink, 2 is a substrate arranged so as to face an ink ejection port of the ink jet 1, and 3 is an XY stage which moves the substrate 2 in the XY directions. is there.
【００２１】ここで、インクジェット１は、図２に示す
ように透明導電インク（以下インクという）４を加熱し
て泡Ｂを発生させ、その泡Ｂの圧力を利用してインク４
を基板２に吐出させることにより基板２上に透明導電回
路を形成するものである。Here, the ink jet 1 heats a transparent conductive ink (hereinafter referred to as ink) 4 to generate bubbles B as shown in FIG. 2, and the pressure of the bubbles B is used to make the ink 4
Is discharged onto the substrate 2 to form a transparent conductive circuit on the substrate 2.
【００２２】なお、このインクジェット１は、同図に示
すようにインク４が充填されるインク収納部１ａと、イ
ンク４を加熱するシートヒータ１ｂと、このシートヒー
タ１ｂに電源を供給する電源部１ｃと、この電源部１ｃ
のスイッチＳＷをオンオフして吐出回数（吐出周波数）
を制御する吐出制御手段１ｄとを有している。As shown in FIG. 1, the ink jet 1 includes an ink containing portion 1a filled with ink 4, a sheet heater 1b for heating the ink 4, and a power source portion 1c for supplying power to the sheet heater 1b. And this power supply unit 1c
Number of discharges (discharge frequency) by turning on / off the switch SW of
And a discharge control means 1d for controlling the above.
【００２３】ところで、このインクジェット１にて形成
される透明導電回路の膜厚は、インクジェット１のイン
ク吐出口径ｄの大小、インク４の吐出周波数、インク４
の超微粒子粉末の含有量によって決定される。例えば、
低粘度のインク４を小口径の吐出口１ｅから１回吐出し
た場合には、０．１μｍ程度の膜厚にすることができる
ようになっている。なお、必要により膜厚を厚くする場
合は、例えば吐出制御手段１ｄにより吐出回数を増やす
ようにして膜厚を厚くするようにする。By the way, the film thickness of the transparent conductive circuit formed by the ink jet 1 depends on the size of the ink ejection port diameter d of the ink jet 1, the ejection frequency of the ink 4, and the ink 4.
It is determined by the content of ultrafine powder of. For example,
When the low-viscosity ink 4 is ejected once from the small-diameter ejection port 1e, the film thickness can be about 0.1 μm. When the film thickness is made thicker as necessary, the film thickness is made thicker by, for example, increasing the number of times of ejection by the ejection control means 1d.
【００２４】一方、この透明導電インク４は、粒径が
０．１μｍ以下の透明導電材料にて形成された超微粒子
粉末を親和性溶剤又は水に分散させたものであり、粘度
は５０〜１００ｃｐｓ程度である。なお、このような超
微粒子粉末としては、ＺｎＯ、ＣｄＯ、ＺｎＳ、Ｃｄ
Ｓ、ＳｎＯ2 、ＩｎＯ2 、Ｃｄ2 ＳｎＯ4 、ＩＴＯ（Ｉ
ｎ2 Ｏ3 −ＳｎＯ2 ）等の酸化物が使用される。特に、
可視光透過率と表面抵抗の点でＩＴＯが望ましい。On the other hand, the transparent conductive ink 4 is obtained by dispersing ultrafine particle powder made of a transparent conductive material having a particle size of 0.1 μm or less in an affinity solvent or water and having a viscosity of 50 to 100 cps. It is a degree. In addition, as such ultrafine particle powder, ZnO, CdO, ZnS, Cd
S, SnO 2 , InO 2 , Cd 2 SnO 4 , ITO (I
An oxide such as n 2 O 3 —SnO 2 ) is used. Especially,
ITO is preferable in terms of visible light transmittance and surface resistance.
【００２５】また、透明導電性インク４に用いられる溶
剤は、超微粒子粉末材との親和性を考慮して選定され
る。或いは、水にコロイドミル、ボールミル、サンドミ
ル、ホモミキサー等の市販の粉砕器や超音波分散器等に
より強制的に分散させることも可能である。さらに、基
板２は３００℃以下の耐熱性を有するものであれば良
く、ガラス、セラミック或いはアクリル、ポリイミドフ
ィルム等を使用することができる。The solvent used for the transparent conductive ink 4 is selected in consideration of the affinity with the ultrafine particle powder material. Alternatively, it is possible to forcibly disperse in water with a commercially available pulverizer such as a colloid mill, a ball mill, a sand mill, a homomixer, or an ultrasonic disperser. Further, the substrate 2 may be any one as long as it has a heat resistance of 300 ° C. or less, and glass, ceramic, acrylic, polyimide film or the like can be used.
【００２６】そして、このようにインクジェット１を用
いて基板２にパターニングを行った後、透明導電インク
パターンを乾操させると、均一な透明導電回路が形成さ
れ、簡単に剥がれない程度の強さで基板２と密着するよ
うになる。After patterning the substrate 2 by using the ink jet 1 in this way, the transparent conductive ink pattern is dried to form a uniform transparent conductive circuit, and the strength is such that it is not easily peeled off. It comes into close contact with the substrate 2.
【００２７】ところで、この透明導電インク４に含有さ
れる超微粒子粉末が酸化物系の場合、必要に応じて３０
０℃以下で熱処理を行うようにしており、この熱処理に
より回路の残留溶剤がより完全に揮発すると共に回路の
構造が結晶化されるため、より低抵抗の透明導電回路が
形成されるようになる。By the way, when the ultrafine particle powder contained in the transparent conductive ink 4 is an oxide-based powder, it may be 30 if necessary.
The heat treatment is carried out at 0 ° C. or less, and the residual solvent in the circuit is more completely volatilized and the structure of the circuit is crystallized by this heat treatment, so that a transparent conductive circuit having a lower resistance is formed. .
【００２８】ここで、この熱処理は、透明導電回路の酸
化が抑えられる所定温度である３００℃以下の温度、好
ましくは２５０℃以下で数分から１２０分程度行えばよ
い。なお、本装置においては、レジスト液を使用するこ
とはないので、このように比較的低温で低抵抗の透明導
電回路を形成することができる。Here, this heat treatment may be performed at a temperature of 300 ° C. or lower, which is a predetermined temperature at which the oxidation of the transparent conductive circuit is suppressed, preferably 250 ° C. or lower, for several minutes to 120 minutes. Since the resist solution is not used in this apparatus, a transparent conductive circuit having a low resistance can be formed at a relatively low temperature.
【００２９】そして、このような熱処理により形成され
た透明導電インクパターンは、均一な透明のものとな
り、熱処理のないものに比べて、更に強固に基板２と密
着するようになる。なお、この熱処理を３００℃以上の
温度で行った場合、インク４の酸化が促進され、材料の
構造がストイキオメトリーに近づくため、キャリア濃度
が減少し、抵抗率は大きく上昇するようになる。このた
め、熱処理は３００℃以下で行うようにする必要があ
る。Then, the transparent conductive ink pattern formed by such heat treatment becomes uniform and transparent, and more firmly adheres to the substrate 2 as compared with the one without heat treatment. When this heat treatment is performed at a temperature of 300 ° C. or higher, the oxidation of the ink 4 is promoted and the structure of the material approaches stoichiometry, so that the carrier concentration is reduced and the resistivity is greatly increased. Therefore, it is necessary to perform the heat treatment at 300 ° C. or lower.
【００３０】次に、本実施の形態における実施例につい
て説明する。Next, examples of the present embodiment will be described.
【００３１】第１の実施例として、粒径２５ｎｍのＩＴ
Ｏ超微粒子粉末固形成分５重量％を、水６０重量％、ｎ
−メチルピロリドン２０重量％、エチレングリコール１
５重量％の割合でサンドミルで４時間撹拌分散させたイ
ンク４を、インクジェット１で厚さ１ｍｍのアクリル基
板２上に吐出してパターンを形成した。As a first embodiment, IT having a particle size of 25 nm is used.
O Ultrafine particle powder solid component 5% by weight, water 60% by weight, n
-Methylpyrrolidone 20% by weight, ethylene glycol 1
Ink 4 stirred and dispersed in a sand mill for 4 hours at a ratio of 5% by weight was ejected by an inkjet 1 onto an acrylic substrate 2 having a thickness of 1 mm to form a pattern.
【００３２】なお、インクジェット１のヘッドとして
は、図３に示すように吐出口１ｅの口径２０μｍ、ピッ
チ２５μｍ、吐出口１ｅが１００点直線上に並んだマル
チヘッド１Ａを用い、吐出周波数１０００Ｈｚで吐出さ
せた。また、パターン形状は、図４に示すように線幅５
ｍｍ、線間隔５ｍｍのラインを平行に５本印字した。こ
れを大気中で２４時間乾操して透明導電回路５のパター
ンを得た。As the head of the ink jet 1, as shown in FIG. 3, a multi-head 1A in which the diameter of the discharge ports 1e is 20 μm, the pitch is 25 μm, and the discharge ports 1e are arranged on a 100-point straight line is used, and the discharge frequency is 1000 Hz. Let Further, the pattern shape has a line width of 5 as shown in FIG.
mm, the line having a line interval of 5 mm was printed in parallel. This was dried in the atmosphere for 24 hours to obtain a pattern of the transparent conductive circuit 5.
【００３３】第２の実施例として、実施例１と同様の構
成で、図５に示すようにパターン形状が線幅５０μｍ、
線間隔１００μｍのラインを平行に２０本印字し、透明
導電回路５のパターンを得た。As a second embodiment, with the same configuration as the first embodiment, the pattern shape has a line width of 50 μm, as shown in FIG.
Twenty parallel lines having a line spacing of 100 μm were printed to obtain a pattern of the transparent conductive circuit 5.
【００３４】第３の実施例として、粒径２０ｎｍのＩＴ
Ｏ超微粒子粉末固形成分重量５％を、水を溶媒として超
音波分散器で２時間撹伴分散させたインク４を、インク
ジェット１にてコーニング社製無アルカリガラス（＃７
０５９）基板２上に吐出してパターンを形成した。な
お、インクジェット１のヘッドは実施例１と同様のもの
を用い、パターン形状は線幅５ｍｍ、線間隔５ｍｍのラ
インを平行に５本印字した（図４参照）。これを９５℃
で３０分乾操硬化の後、２００℃の温度で１時間加熱し
て、透明導電回路のパターンを得た。As a third embodiment, IT having a particle size of 20 nm is used.
Ink 4, which was obtained by dispersing 5% by weight of the solid component of ultrafine O powder as a solvent in an ultrasonic disperser for 2 hours, was used as an ink jet 1 to produce a non-alkali glass (# 7 manufactured by Corning Co.).
059) A pattern was formed by discharging on the substrate 2. In addition, the same head as that of Example 1 was used as the head of the inkjet 1, and the pattern shape was printed in parallel with five lines having a line width of 5 mm and a line interval of 5 mm (see FIG. 4). This is 95 ℃
After 30 minutes of dry curing, it was heated at a temperature of 200 ° C. for 1 hour to obtain a transparent conductive circuit pattern.
【００３５】第４の実施例として、粒径２０ｎｍのＩＴ
Ｏ超微粒子粉末固形成分重量５％を、水を溶媒として超
音波分散器で２時間撹拌分散させたインク４を、インク
ジェット１にてコーニング社製無アルカリガラス（＃７
０５９）基板２上に吐出してパターンを形成した。As a fourth embodiment, IT having a particle size of 20 nm is used.
Ink 4 was prepared by stirring and dispersing 5% by weight of the solid component of ultrafine O powder powder with water as an solvent in an ultrasonic disperser for 2 hours.
059) A pattern was formed by discharging on the substrate 2.
【００３６】ここで、本実施例においては、インクジェ
ット１でパターン形成中は基板２をホットプレート上に
置き、２５０℃に加熱した。なお、インクジェットのヘ
ッドは、実施例１と同様のものを用い、パターン形状は
線幅５ｍｍ、線間隔５ｍｍのラインを平行に５本印字し
（図４参照）、透明導電回路のパターンを得た。Here, in this example, the substrate 2 was placed on a hot plate and heated to 250 ° C. during pattern formation by the inkjet 1. The inkjet head used was the same as in Example 1, and the pattern shape was printed with 5 lines having a line width of 5 mm and a line interval of 5 mm in parallel (see FIG. 4) to obtain a transparent conductive circuit pattern. .
【００３７】第５の実施例として、粒径１００ｎｍのＩ
ＴＯ超微粒子粉末固形成分５重量％を、水６０重量％、
ｎ−メチルピロリドン２０重量％、エチレングリコール
１５重量％の割合でサンドミルで４時間撹拌分散させた
インクを、インクジェット１にてコーニング社製無アル
カリガラス（＃７０５９）基板３上に吐出してパターン
を形成した。As a fifth embodiment, I having a particle size of 100 nm is used.
TO ultrafine powder solid component 5% by weight, water 60% by weight,
The ink was stirred and dispersed in a sand mill at a ratio of 20% by weight of n-methylpyrrolidone and 15% by weight of ethylene glycol for 4 hours, and the ink was ejected onto a non-alkali glass (# 7059) substrate 3 manufactured by Corning Inc. to form a pattern. Formed.
【００３８】なお、インクジエット１のヘッドは、吐出
口径５０μｍ、ピッチ５０μｍ、吐出周波数２０００Ｈ
ｚ、吐出口が１００点、直線上に並んだマルチヘッドを
用いた。パターン形状は、線幅５ｍｍ、線間隔５ｍｍの
ラインを平行に２０本印字した。ここで、本実施例とし
ては、これを９５℃で３０分乾燥硬化の後、２００℃の
温度で１時間加熱して、透明導電回路のパターンを得
た。The head of the ink jet 1 has a discharge port diameter of 50 μm, a pitch of 50 μm, and a discharge frequency of 2000H.
A multi-head in which z, 100 discharge ports and lined up in a straight line was used. As the pattern shape, 20 lines having a line width of 5 mm and a line interval of 5 mm were printed in parallel. Here, in this example, this was dried and cured at 95 ° C. for 30 minutes and then heated at a temperature of 200 ° C. for 1 hour to obtain a transparent conductive circuit pattern.
【００３９】一方、第１の比較例として、粒径３０ｎｍ
のＩＴＯ超微粒子粉末を有機溶剤に分散させてなる透明
導電インク（東北化工（株）製ＤＸ−１０１）を、ガラ
ス基板（旭硝子（株）製ソーダライムガラスＡＳ、厚さ
１．１ｍｍ）上に、線径０．０５ｍｍのワイヤーバーで
塗布した後、遠赤外線を用い約８０℃で乾燥させて、Ｉ
ＴＯ膜を成膜した。On the other hand, as a first comparative example, the particle size is 30 nm.
A transparent conductive ink (DX-101 manufactured by Tohoku Kako Co., Ltd.) obtained by dispersing the ITO ultrafine particle powder in an organic solvent on a glass substrate (Soda lime glass AS manufactured by Asahi Glass Co., Ltd., thickness 1.1 mm). After coating with a wire bar with a wire diameter of 0.05 mm, it is dried at about 80 ° C. using far infrared rays.
A TO film was formed.
【００４０】次に、その上に２５０メッシュの版を用い
スクリーン印刷法によりレジスト液を５×５０ｍｍ角の
大きさに印刷し、約１００℃でこれを乾燥硬化させた。
乾燥後のレジスト層の厚さは約６μｍであった。レジス
ト液は、アクリル樹脂をイソホロンに溶解した液を用
い、アクリル樹脂３３重量％のものを用いた。Next, a resist solution was printed on the plate in a size of 5 × 50 mm square by a screen printing method using a 250-mesh plate, and this was dried and cured at about 100 ° C.
The thickness of the resist layer after drying was about 6 μm. The resist solution used was a solution in which an acrylic resin was dissolved in isophorone, and an acrylic resin of 33% by weight was used.
【００４１】その後、純水で洗浄した。この洗浄によ
り、レジスト液が印刷されていない部分のＩＴＯは簡単
に洗い流され、レジスト液が印刷された部分だけがガラ
ス基板上に残った。これを大気中５５０℃で３０分加熱
してレジスト樹脂を酸化分解させた後、窒素雰囲気下５
５０℃で１５分間加熱し、これを冷却して透明導電膜の
回路パターンを得た。Then, it was washed with pure water. By this cleaning, the ITO on the part where the resist solution was not printed was easily washed off, and only the part where the resist solution was printed remained on the glass substrate. This is heated in the atmosphere at 550 ° C. for 30 minutes to oxidatively decompose the resist resin, and then under a nitrogen atmosphere 5
It was heated at 50 ° C. for 15 minutes and cooled to obtain a circuit pattern of a transparent conductive film.
【００４２】図６は既述した各実施例および比較例で得
られたＩＴＯ膜の特性を示す表である。なお、ＩＴＯの
特性の測定において、透過率は日立製作所（株）製Ｕ−
３４００型自記記録分光光度計にて波長４００ｎｍから
７００ｎｍの測定を行い、１ｎｍ毎の透過率の値を平均
化した値である。また、表面抵抗および抵抗率の値は、
三菱油化（株）製ローレスタＭＣΡ−Ｔ４００により、
また、膜厚は、ＴＥＮＣＯＲ社製ＡＬＰＨＡ−ＳＴＥＰ
にて測定した。なお、実施例２では、線幅が細いため、
透過率の測定は不可能であった。FIG. 6 is a table showing the characteristics of the ITO films obtained in the above-mentioned examples and comparative examples. In the measurement of the characteristics of ITO, the transmittance is U-manufactured by Hitachi Ltd.
It is a value obtained by measuring the wavelength of 400 nm to 700 nm with a 3400 type self-recording spectrophotometer and averaging the transmittance values for each 1 nm. Also, the values of surface resistance and resistivity are
With Mitsubishi Oil Chemical Co., Ltd. Loresta M C-T400,
In addition, the film thickness is ALPHA-STEP manufactured by TENCOR.
Was measured. In Example 2, since the line width is thin,
It was impossible to measure the transmittance.
【００４３】そして、この表からも明らかなように、透
明導電インクをインクジェットにて吐出することによ
り、従来のスクリーン印刷法にて形成された透明導電回
路に比べて膜厚、表面抵抗及び抵抗率の優れた透明導電
回路を形成することができる。As is clear from this table, by ejecting the transparent conductive ink by an ink jet, the film thickness, surface resistance and resistivity are higher than those of the transparent conductive circuit formed by the conventional screen printing method. It is possible to form an excellent transparent conductive circuit.
【００４４】[0044]
【発明の効果】以上のように本発明によれば、基板上に
インク吐出手段にて透明導電インクを吐出することによ
り、比較的低温で低抵抗の透明導電回路を作成すること
ができる。また、透明導電インクをダイレクトに基板に
吐出して透明導電回路を形成することにより、フォトリ
ソグラフィー技術やスクリーン印刷に比べて工数を少な
くすることができる。As described above, according to the present invention, a transparent conductive circuit having a relatively low temperature and a low resistance can be formed by discharging the transparent conductive ink onto the substrate by the ink discharging means. Further, by directly ejecting the transparent conductive ink onto the substrate to form the transparent conductive circuit, the number of steps can be reduced as compared with the photolithography technique and the screen printing.
【図１】本発明の実施の形態に係る透明導電回路形成装
置の構成を示す図。FIG. 1 is a diagram showing a configuration of a transparent conductive circuit forming device according to an embodiment of the present invention.
【図２】上記透明導電回路形成装置のインクジェットの
構造を説明する図。FIG. 2 is a diagram illustrating a structure of an inkjet of the transparent conductive circuit forming device.
【図３】上記インクジェットのヘッドの一例を示す図。FIG. 3 is a diagram showing an example of the inkjet head.
【図４】上記インクジェットにて形成される透明導電回
路パターンの一例を示す図。FIG. 4 is a diagram showing an example of a transparent conductive circuit pattern formed by the inkjet.
【図５】上記透明導電回路パターンの他の一例を示す
図。FIG. 5 is a diagram showing another example of the transparent conductive circuit pattern.
【図６】各実施例及び比較例で得られたＩＴＯ膜の特性
を示す図表。FIG. 6 is a chart showing the characteristics of the ITO film obtained in each example and comparative example.
１ インクジェット １ｅ 吐出口 ２ 基板 ４ 透明導電インク ５ 透明導電回路 ｄ インクジェットのインク吐出口径 1 Inkjet 1e Discharge port 2 Substrate 4 Transparent conductive ink 5 Transparent conductive circuit d Ink discharge diameter of inkjet
Claims (7)
電回路形成装置において、 透明導電性材料にて形成された超微粒子を溶剤に分散さ
せてなる透明導電インクと、 前記透明導電インクを吐出して前記基板上に前記透明導
電回路をパターン形成するインク吐出手段とを備えたこ
とを特徴とする透明導電回路形成装置。1. A transparent conductive circuit forming apparatus for forming a transparent conductive circuit on a substrate, comprising: transparent conductive ink formed by dispersing ultrafine particles formed of a transparent conductive material in a solvent; and discharging the transparent conductive ink. And an ink ejecting unit for patterning the transparent conductive circuit on the substrate.
電回路形成装置において、 酸化物系透明導電性材料にて形成された超微粒子を溶剤
に分散させてなる透明導電インクと、 前記透明導電インクを吐出して前記基板上に前記透明導
電回路をパターン形成するインク吐出手段とを備え、 前記インク吐出手段により前記透明導電回路が形成され
た後、前記基板を加熱して該透明導電回路を熱処理する
ことを特徴とする透明導電回路形成装置。2. A transparent conductive circuit forming apparatus for forming a transparent conductive circuit on a substrate, comprising: a transparent conductive ink comprising ultrafine particles formed of an oxide-based transparent conductive material dispersed in a solvent; An ink ejecting unit that ejects ink to form a pattern of the transparent conductive circuit on the substrate, and after the transparent conductive circuit is formed by the ink ejecting unit, the substrate is heated to form the transparent conductive circuit. A transparent conductive circuit forming device characterized by heat treatment.
電回路形成装置において、 酸化物系透明導電性材料にて形成された超微粒子を溶剤
に分散させてなる透明導電インクと、 前記透明導電インクを吐出して前記基板上に前記透明導
電回路をパターン形成するインク吐出手段とを備え、 前記基板を加熱すると共に前記透明導電インクを該加熱
された基板上に吐出することにより、前記透明導電回路
を形成すると共に該透明導電回路を熱処理することを特
徴とする透明導電回路形成装置。3. A transparent conductive circuit forming apparatus for forming a transparent conductive circuit on a substrate, wherein a transparent conductive ink comprising ultrafine particles formed of an oxide-based transparent conductive material dispersed in a solvent; An ink ejecting unit that ejects ink to form a pattern of the transparent conductive circuit on the substrate, and heats the substrate and ejects the transparent conductive ink onto the heated substrate, thereby forming the transparent conductive film. A transparent conductive circuit forming apparatus, characterized in that a circuit is formed and the transparent conductive circuit is heat-treated.
成された粒子であることを特徴とする請求項１乃至３記
載の透明導電回路形成装置。4. The transparent conductive circuit forming apparatus according to claim 1, wherein the ultrafine particles are particles having a particle size of 0.1 μm or less.
段の吐出口の口径、吐出回数及び前記透明導電インクの
超微粒子の含有量に応じて変更することができることを
特徴とする請求項１乃至３記載の透明導電回路形成装
置。5. The film thickness of the transparent conductive circuit can be changed according to the diameter of the discharge port of the discharge means, the number of discharges, and the content of ultrafine particles of the transparent conductive ink. The transparent conductive circuit forming device according to any one of 1 to 3.
が抑えられる所定温度以下で行うことを特徴とする請求
項２又は３記載の透明導電回路形成装置。6. The transparent conductive circuit forming apparatus according to claim 2, wherein the heat treatment is performed at a temperature equal to or lower than a predetermined temperature at which oxidation of the transparent conductive circuit is suppressed.
うことを特徴とする請求項２又は３記載の透明導電回路
形成装置。7. The transparent conductive circuit forming apparatus according to claim 2, wherein the heat treatment is performed at a temperature of 300 ° C. or lower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14047696A JPH09320363A (en) | 1996-06-03 | 1996-06-03 | Transparent conductive circuit forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14047696A JPH09320363A (en) | 1996-06-03 | 1996-06-03 | Transparent conductive circuit forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09320363A true JPH09320363A (en) | 1997-12-12 |
Family
ID=15269500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14047696A Pending JPH09320363A (en) | 1996-06-03 | 1996-06-03 | Transparent conductive circuit forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09320363A (en) |
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| US7625493B2 (en) | 2003-02-06 | 2009-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
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| WO2004070822A1 (en) * | 2003-02-06 | 2004-08-19 | Semiconductor Energy Laboratory Co., Ltd. | Methods for manufacturing semiconductor device and display |
| US7922819B2 (en) | 2003-02-06 | 2011-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor manufacturing device |
| US7399704B2 (en) | 2003-10-02 | 2008-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Fabrication method of a semiconductor device using liquid repellent film |
| US7446054B2 (en) | 2003-10-28 | 2008-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
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| US7510905B2 (en) | 2004-01-29 | 2009-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Forming method of contact hole, and manufacturing method of semiconductor device, liquid crystal display device and EL display device |
| US7655499B2 (en) | 2004-01-29 | 2010-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Forming method of contact hole and manufacturing method of semiconductor device, liquid crystal display device and EL display device |
| US7416977B2 (en) | 2004-04-28 | 2008-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device, liquid crystal television, and EL television |
| JP2009123765A (en) * | 2007-11-12 | 2009-06-04 | Seiko Epson Corp | Method of manufacturing multilayer wiring board |
| JP2009182184A (en) * | 2008-01-31 | 2009-08-13 | Seiko Epson Corp | Method of manufacturing ceramic multilayer substrate |
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