JPH09307253A - Dropper type stabilized power source - Google Patents

Dropper type stabilized power source

Info

Publication number
JPH09307253A
JPH09307253A JP12015196A JP12015196A JPH09307253A JP H09307253 A JPH09307253 A JP H09307253A JP 12015196 A JP12015196 A JP 12015196A JP 12015196 A JP12015196 A JP 12015196A JP H09307253 A JPH09307253 A JP H09307253A
Authority
JP
Japan
Prior art keywords
power supply
board
pattern
power source
collector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12015196A
Other languages
Japanese (ja)
Inventor
Takashi Yamaguchi
隆 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Platforms Ltd
Original Assignee
NEC AccessTechnica Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC AccessTechnica Ltd filed Critical NEC AccessTechnica Ltd
Priority to JP12015196A priority Critical patent/JPH09307253A/en
Publication of JPH09307253A publication Critical patent/JPH09307253A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Continuous-Control Power Sources That Use Transistors (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce the size and cost of a board by connecting the collector of a control transistor being heating to a power source pattern having a wide area enough to radiate the heat while feeding the power to a load. SOLUTION: A control transistor 11 mounted on the surface of a multilayer printed board 5 has a collector, emitter and base which are mounted the surface of the board and soldered to patterns 11c, 11e and 11b, respectively. The heat generated in the transistor 11 is guided from the collector to a power source inner layer pattern 4 through the pattern 11c and through-holes 6. The power source layer pattern 4 is laid over the entire surface of the multilayer board to thereby disperse the heat from the transistor 11 in the entire board 5. Thus it is possible to eliminates any radiating pattern or radiator and reduce the size and cost of the board.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、ドロッパー型安定
化電源装置に関し、特に表面実装構造のプリント基板に
搭載する小型なドロッパー型安定化電源装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dropper type stabilized power supply device, and more particularly to a small dropper type stabilized power supply device mounted on a printed circuit board having a surface mounting structure.

【０００２】[0002]

【従来の技術】従来、この種のドロッパー型安定化電源
装置は、基板上に実装された電圧制御トランジスタの発
熱を基板上のラジエターなどにより放熱している。例え
ば特開平６−２６８３４１号公報においては発熱部品の
放熱を図２に示す構造で実現している。2. Description of the Related Art Conventionally, this type of dropper type stabilized power supply device radiates heat generated by a voltage control transistor mounted on a substrate by a radiator on the substrate. For example, in Japanese Unexamined Patent Publication No. 6-268341, heat dissipation of heat-generating components is realized by the structure shown in FIG.

【０００３】図２は従来例における発熱部品を実装した
プリント基板の断面図である。発熱部品２１の下に部品
取付用導体パターン２２を設け、その直下のプリント配
線基板２３に設けたスルーホール電極２４を介して裏面
導体パターン２３と接続し、裏面導体パターン２５上に
放熱器２６を取り付けた構造である。これにより、放熱
器２６と発熱部品２１間の熱抵抗が下がり放熱性が良く
なる。FIG. 2 is a sectional view of a printed circuit board on which a heat-generating component according to a conventional example is mounted. A component mounting conductor pattern 22 is provided below the heat-generating component 21, and is connected to the back surface conductor pattern 23 via a through-hole electrode 24 provided on a printed wiring board 23 immediately below it, and a radiator 26 is provided on the back surface conductor pattern 25. It is the attached structure. As a result, the thermal resistance between the radiator 26 and the heat-generating component 21 is reduced, and the heat dissipation is improved.

【０００４】[0004]

【発明が解決しようとする課題】このように従来例にお
いては、放熱のために放熱器を設ける必要があり、その
スペースが装置の小型化および低価格化の妨げとなって
いる問題がある。As described above, in the conventional example, it is necessary to provide a radiator for heat dissipation, and there is a problem that the space hinders downsizing and cost reduction of the device.

【０００５】[0005]

【課題を解決するための手段】本発明のドロッパー型安
定化電源装置は、表面実装型の面付け構造の電圧制御用
トランジスタと、電源配線専用の内層を有する多層プリ
ント基板と、前記電圧制御用トランジスタを前記多層プ
リント基板の表面に実装し前記電圧制御用トランジスタ
のコレクタをスルーホールを介し前記電源配線専用の内
層のパターンに接続する構造とを備えている。SUMMARY OF THE INVENTION A dropper type stabilized power supply device of the present invention includes a voltage control transistor having a surface mounting type imposition structure, a multilayer printed board having an inner layer dedicated to power supply wiring, and the voltage control transistor. And a structure in which a transistor is mounted on the surface of the multilayer printed circuit board and the collector of the voltage control transistor is connected to an inner layer pattern dedicated to the power supply wiring via a through hole.

【０００６】また、前記スルーホールは複数用いる構造
としても良い。Further, the through hole may have a structure in which a plurality of through holes are used.

【０００７】[0007]

【発明の実施の形態】次に本発明の実施の形態について
図面を参照して説明する。Embodiments of the present invention will now be described with reference to the drawings.

【０００８】図１は本発明の実施の形態例を示す（ａ）
回路図、および（ｂ）横断面図である。FIG. 1 shows an embodiment of the present invention (a).
It is a circuit diagram and (b) cross-sectional view.

【０００９】図１（ａ）において、本ドロッパー型定電
圧電源装置１は制御用トランジスタ１１と、出力電圧を
入力しこの電圧変動を検出して制御用トランジスタ１１
のベース電流を制御し、出力電圧を安定化するための制
御回路１２とから構成されている。入力電源２からの入
力電圧を直列に挿入された制御用トランジスタ１１のエ
ミッタ、コレクタ間ドロッパー電圧を制御することによ
りコレクタ側から負荷３に供給される出力電圧を安定化
している。In FIG. 1 (a), the present dropper type constant voltage power supply device 1 receives a control transistor 11 and an output voltage, detects this voltage fluctuation and detects the control transistor 11.
And a control circuit 12 for controlling the base current and stabilizing the output voltage. The output voltage supplied from the collector side to the load 3 is stabilized by controlling the emitter-collector dropper voltage of the control transistor 11 in which the input voltage from the input power supply 2 is inserted in series.

【００１０】また、制御用トランジスタ１１は表面実装
型の面付け構造のパワートランジスタで、コレクタ端子
面はエミッタあるいはベース端子面に比べて広く、内部
発熱の熱はコレクタ端子面に集中するようになってい
る。Further, the control transistor 11 is a power transistor having a surface mounting type imposition structure, the collector terminal surface is wider than the emitter or base terminal surface, and the heat generated internally is concentrated on the collector terminal surface. ing.

【００１１】図１（ｂ）において、多層プリント基板５
の表面に搭載された制御用トランジスタ１１のコレクタ
はパターン１１ｃ、エミッタ、ベースもパターン１１
ｅ，１１ｂにそれぞれ表面実装でハンダ付けされてい
る。パターン１１ｃと内層の電源層パターン４とは３つ
のスリーホール６で接続される。電源層パターン４には
基板５の表面に実装された各負荷がスルーホールを介し
接続される（図示せず）。制御用トランジスタ１１内部
で発生した熱は、コレクタからパターン１１ｃおよびス
ルーホール６を通して内層の電源層パターン４に導かれ
る。In FIG. 1B, the multilayer printed circuit board 5
The collector of the control transistor 11 mounted on the surface of the pattern is the pattern 11c, and the emitter and the base are also the pattern 11c.
e and 11b are each soldered by surface mounting. The pattern 11c and the inner power source layer pattern 4 are connected by three three holes 6. Each load mounted on the surface of the substrate 5 is connected to the power supply layer pattern 4 through a through hole (not shown). The heat generated inside the control transistor 11 is guided from the collector to the power supply layer pattern 4 of the inner layer through the pattern 11c and the through hole 6.

【００１２】電源層パターン４は多層基板の全面に広が
るように配線されているので、トランジスタ１１からの
発熱は多層プリント基板５の全体に拡散する。Since the power supply layer pattern 4 is wired so as to spread over the entire surface of the multilayer substrate, the heat generated from the transistor 11 diffuses over the entire multilayer printed circuit board 5.

【００１３】[0013]

【発明の効果】以上説明したように本発明のドロッパー
型安定化電源装置は、発熱する制御トランジスタのコレ
クタ出力をパターン面積の広い電源層パターンに接続
し、負荷への給電と同時に熱放散を行っているので、放
熱用パターンや放熱器が不要となり基板の小型化および
低価格化が可能となる効果がある。As described above, in the stabilized power supply device of the dropper type according to the present invention, the collector output of the heat-generating control transistor is connected to the power supply layer pattern having a wide pattern area to dissipate heat at the same time as power supply to the load. Therefore, there is an effect that a heat radiation pattern and a heat radiator are not necessary, and the size and cost of the substrate can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施の形態例を示す（ａ）回路図およ
び（ｂ）横断面図である。FIG. 1A is a circuit diagram and FIG. 1B is a cross-sectional view showing an embodiment of the present invention.

【図２】従来の横断面図である。FIG. 2 is a conventional cross-sectional view.

【符号の説明】[Explanation of symbols]

１ ドロッパー型安定化電源装置 ２ 入力電源 ３ 負荷 ４ 電源層パターン ５ 多層プリント基板 ６ スルーホール １１ 制御用トランジスタ １２ 制御回路 1 Dropper type stabilized power supply device 2 Input power supply 3 Load 4 Power supply layer pattern 5 Multilayer printed circuit board 6 Through hole 11 Control transistor 12 Control circuit

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 表面実装型面付け構造の電圧制御用トラ
ンジスタと、電源配線専用の内層を有する多層プリント
基板と、前記電圧制御用トランジスタを前記多層プリン
ト基板の表面に実装し前記電圧制御用のトランジスタの
コレクタをスルーホールを介し前記電源配線専用の内層
のパターンに接続する構造とを備えることを特徴とする
ドロッパー型安定化電源装置。1. A voltage control transistor having a surface mounting type imposition structure, a multilayer printed circuit board having an inner layer dedicated to power supply wiring, and the voltage control transistor mounted on the surface of the multilayer printed circuit board for voltage control. A dropper-type stabilized power supply device, comprising: a structure in which a collector of a transistor is connected to an inner layer pattern dedicated to the power supply line through a through hole. 【請求項２】 前記スルーホールは複数用いる構造を特
徴とする請求項１記載のドロッパー型安定化電源装置。2. The stabilized power supply device of dropper type according to claim 1, wherein a plurality of the through holes are used.
JP12015196A 1996-05-15 1996-05-15 Dropper type stabilized power source Pending JPH09307253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12015196A JPH09307253A (en) 1996-05-15 1996-05-15 Dropper type stabilized power source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12015196A JPH09307253A (en) 1996-05-15 1996-05-15 Dropper type stabilized power source

Publications (1)

Publication Number Publication Date
JPH09307253A true JPH09307253A (en) 1997-11-28

Family

ID=14779231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12015196A Pending JPH09307253A (en) 1996-05-15 1996-05-15 Dropper type stabilized power source

Country Status (1)

Country Link
JP (1) JPH09307253A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007483A (en) * 2010-06-22 2012-01-12 Honda Motor Co Ltd Ecu-integrated throttle device
JP2015164779A (en) * 2014-03-03 2015-09-17 セイコーエプソン株式会社 Liquid discharge device, head unit, and liquid discharge device control method
JP2015207962A (en) * 2014-04-23 2015-11-19 日本特殊陶業株式会社 control device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314861A (en) * 1993-04-28 1994-11-08 Ibiden Co Ltd Substrate for mounting electronic component
JP4099873B2 (en) * 1998-09-01 2008-06-11 ブラザー工業株式会社 Telephone communication system with mail transmission / reception function

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314861A (en) * 1993-04-28 1994-11-08 Ibiden Co Ltd Substrate for mounting electronic component
JP4099873B2 (en) * 1998-09-01 2008-06-11 ブラザー工業株式会社 Telephone communication system with mail transmission / reception function

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007483A (en) * 2010-06-22 2012-01-12 Honda Motor Co Ltd Ecu-integrated throttle device
JP2015164779A (en) * 2014-03-03 2015-09-17 セイコーエプソン株式会社 Liquid discharge device, head unit, and liquid discharge device control method
JP2015207962A (en) * 2014-04-23 2015-11-19 日本特殊陶業株式会社 control device

Similar Documents

Publication Publication Date Title
JP2002290087A (en) On-board mounting-type electronic equipment and on- board mounting-type power-supply unit
JPH06169189A (en) Chip type heat generating component and packaging thereof
JPH09307253A (en) Dropper type stabilized power source
US5757619A (en) Cooling apparatus for electronic components
JPH06268341A (en) Method and structure for dissipating heat from electronic component
JP2008282830A (en) Printed board structure
KR20180060572A (en) Device package having heat dissipating member and the manufacturing method thereof
JPH05259669A (en) Heat radiating structure of printed wiring board
JPH03296292A (en) Hybrid integrated circuit component
JP2003318579A (en) Heat radiation method for fet with heat sink plate
JP2002094196A (en) Electronic part heat dissipating structure of printed wiring board
JPH03150892A (en) Electron power componet circuit
JP7342803B2 (en) Electronic component built-in substrate and electronic equipment equipped with the same
JP2684893B2 (en) Hybrid integrated circuit device
JP2553083Y2 (en) Hybrid integrated circuit device
JP2579336Y2 (en) Connection structure of circuit element to wiring board
JP2003258465A (en) Electronic circuit unit
JPH08162725A (en) Circuit board
JPH0536890U (en) Heat dissipation structure for integrated circuits
JPH1154883A (en) Heat-radiating structure of electronic component
JPS59165443A (en) Heat dissipation system of heat-generating parts on split circuit board
JP3597004B2 (en) Heatsink mounting structure
JP2001068878A (en) Control device having metal core near electrical heating element
JPH10173298A (en) Electronic equipment
JPH10135672A (en) Heat flow control cabinent for electronic device

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19980421