JPH09298344A - Wiring board with connecting terminals - Google Patents
Wiring board with connecting terminalsInfo
- Publication number
- JPH09298344A JPH09298344A JP8113438A JP11343896A JPH09298344A JP H09298344 A JPH09298344 A JP H09298344A JP 8113438 A JP8113438 A JP 8113438A JP 11343896 A JP11343896 A JP 11343896A JP H09298344 A JPH09298344 A JP H09298344A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- connecting terminals
- connection terminals
- parts
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は各種電子機器、特に
インバータや電源回路などの電力回路に使用される接続
端子付配線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various electronic devices, and more particularly to a wiring board with connection terminals used in power circuits such as inverters and power circuits.
【０００２】[0002]
【従来の技術】近年電子機器の小型化、高機能化、ある
いは複合化などによる電子部品の高密度実装が要求され
ており、使用される電子部品の発熱がそれ自身あるいは
周辺の電子部品の信頼性や寿命に影響を与えかねなくな
っている。2. Description of the Related Art In recent years, there has been a demand for high-density mounting of electronic parts due to downsizing, high functionality, or combination of electronic devices, and the heat generation of the electronic parts used causes the reliability of itself or the surrounding electronic parts. It may affect the life and life of the product.
【０００３】そのため、放熱を兼ねた熱伝導性の金属板
を使用して電子部品を搭載した配線基板が使用されてい
る。Therefore, a wiring board on which electronic parts are mounted using a heat conductive metal plate which also serves as heat dissipation is used.
【０００４】以下、従来の接続端子付配線基板を図面を
用いて説明する。図６は従来の接続端子付配線基板の斜
視図、図７は同要部の断面図であり、図６，図７におい
て、１１は電子回路を形成するために実装された電子部
品、１２は電子回路を構成するための配線パターンを形
成する導体箔、１４は片面に放熱フィン１６を設けた熱
伝導性材料でなる板状のベース金属、１３は導体箔１２
とベース金属１４を分離絶縁して接着し一体化する樹脂
材などでなる絶縁体層、１５は外部回路と電気的接続用
の金属材でなる導体ピンであり、配線パターンの導体箔
１２の上に半田付けなどにより電気的および機械的に固
定されて、配線基板の外部接続端子となっている。A conventional wiring board with connection terminals will be described below with reference to the drawings. FIG. 6 is a perspective view of a conventional wiring board with connection terminals, FIG. 7 is a cross-sectional view of the main part thereof, and in FIGS. 6 and 7, 11 is an electronic component mounted to form an electronic circuit, and 12 is an electronic component. A conductor foil forming a wiring pattern for forming an electronic circuit, 14 is a plate-shaped base metal made of a heat conductive material having a radiation fin 16 on one surface, and 13 is a conductor foil 12
An insulating layer made of a resin material or the like that separates and insulates the base metal 14 from each other and adheres them together, and 15 is a conductor pin made of a metal material for electrical connection with an external circuit, and is on the conductor foil 12 of the wiring pattern. It is electrically and mechanically fixed by soldering or the like to the external connection terminal of the wiring board.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら前記従来
の接続端子付配線基板では、絶縁体層１３が必要であ
り、外部接続端子をベース金属１４の上の導体箔１２に
別部品の導体ピン１５を半田付けなどにより構成するこ
とは、機械的強度が不充分で組立時の位置決めが難し
く、部品コスト、組立コストなどの生産コストが高くな
るという課題を有している。However, in the above-mentioned conventional wiring board with connection terminals, the insulating layer 13 is required, and the external connection terminals are provided on the conductor foil 12 on the base metal 14 with the conductor pins 15 as separate parts. The configuration by soldering or the like has a problem that mechanical strength is insufficient, positioning is difficult at the time of assembly, and production cost such as component cost and assembly cost increases.
【０００６】本発明は前記従来の課題を解決しようとす
るものであり、機械的強度と位置決め精度の優れた接続
端子を持ち、生産コストの低減が図れる接続端子付配線
基板を提供することを目的とする。SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned conventional problems, and an object of the present invention is to provide a wiring board with connection terminals which has connection terminals excellent in mechanical strength and positioning accuracy and which can reduce production cost. And
【０００７】[0007]
【課題を解決するための手段】前記課題を解決するため
に本発明は、電子回路を構成する配線パターンを形成し
た金属材でなる導体板と、熱伝導性フィラーを含有した
樹脂材でなる成形樹脂体を形成して一体化し、電子部品
を搭載接続してなる配線基板において、外部との接続端
子を曲げ加工する部分の上面および両側面部を成形樹脂
体と密着せずに露出させ、かつ、成形樹脂体の端面から
所定絶縁に必要な沿面距離位置にて曲げ加工して電子部
品搭載側に起こした、前記導体板の一部による一体化構
造とした接続端子付配線基板とする。In order to solve the above-mentioned problems, the present invention provides a conductor plate made of a metal material having a wiring pattern forming an electronic circuit and a resin material containing a heat conductive filler. In a wiring board in which a resin body is formed and integrated, and electronic components are mounted and connected, the upper surface and both side surfaces of the portion for bending the connection terminal with the outside are exposed without being in close contact with the molded resin body, and A wiring board with connection terminals is formed by bending the end surface of the molded resin body at a creeping distance required for predetermined insulation and raising it on the electronic component mounting side, and having an integrated structure with a part of the conductor plate.
【０００８】この本発明により、別部品が不要な機械的
強度や位置決め精度の優れた接続端子が得られ、生産コ
ストの低減を図ることが可能となる。According to the present invention, it is possible to obtain a connection terminal having excellent mechanical strength and excellent positioning accuracy, which does not require a separate component, and it is possible to reduce the production cost.
【０００９】[0009]
【発明の実施の形態】本発明の請求項１に記載の発明
は、電子回路を構成する配線パターンを形成した金属材
でなる導体板と、熱伝導性フィラーを含有した樹脂材で
なる成形樹脂体を成形して一体化し、電子部品を搭載接
続してなる配線基板において、外部との接続端子を前記
導体板の一部による一体化構造とした接続端子付配線基
板としたものであり、別個の部材が不要で構造が簡単に
なるという作用を有する。BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is a molding resin comprising a conductor plate made of a metal material on which a wiring pattern constituting an electronic circuit is formed, and a resin material containing a thermally conductive filler. In a wiring board formed by molding and integrating a body and mounting and connecting electronic components, a wiring board with connection terminals having an integrated structure of connection terminals with the outside by a part of the conductor plate is provided. The member is unnecessary and the structure is simplified.
【００１０】請求項２に記載の発明は、成形し一体化し
た成形樹脂体の端面から、所定絶縁に必要な沿面距離位
置にて曲げ加工して電子部品搭載側に起こした外部との
接続端子とする請求項１に記載の接続端子付配線基板と
したものであり、請求項１に記載の作用に加えて絶縁が
保持されるという作用を有する。According to a second aspect of the present invention, a connection terminal with the outside is formed by bending the end surface of the molded and integrated molded resin body at a creepage distance position required for predetermined insulation and raising it on the electronic component mounting side. According to the first aspect of the invention, the wiring board with connection terminals is provided, and in addition to the action of the first aspect, it has an action of maintaining insulation.
【００１１】請求項３に記載の発明は、曲げ加工する部
分の上面および両側面部を成形樹脂体と密着せずに露出
させた外部との接続端子とする請求項２に記載の接続端
子付配線基板としたものであり、曲げ加工における位置
精度が得られ、成形樹脂体の損傷がないという作用を有
する。According to a third aspect of the present invention, the wiring with connection terminals according to the second aspect is characterized in that the upper surface and both side surface portions of the portion to be bent are exposed as external connection terminals without adhering to the molded resin body. Since it is used as a substrate, it has an effect that positional accuracy in bending can be obtained and the molded resin body is not damaged.
【００１２】以下、本発明の一実施の形態について図面
を用いて説明する。図１は同実施の形態における接続端
子付配線基板の斜視図、図２は同電子回路形成用加工導
体板の斜視図、図３は同樹脂成形された配線基板の斜視
図、図４は同接続端子曲げ加工の要部斜視図、そして図
５は従来の接続端子曲げ加工の要部斜視図である。An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of a wiring board with connection terminals in the same embodiment, FIG. 2 is a perspective view of a processed conductor plate for forming an electronic circuit, FIG. 3 is a perspective view of a resin-molded wiring board, and FIG. FIG. 5 is a perspective view of a main part of the connecting terminal bending process, and FIG. 5 is a main part perspective view of the conventional connecting terminal bending process.
【００１３】図１〜図３において、１は導体板であり、
ニッケルや錫メッキなどの表面処理を行った銅あるいは
その合金材やアルミ材でなり、本体などへの取付孔２、
接続端子５となる接続端子部５ａ、必要な放熱に対応し
た形状と面積の搭載ランド１０、そして枠部９などでな
る電子回路を構成する配線パターン形状をプレス加工な
どにより形成している。1 to 3, 1 is a conductor plate,
It is made of copper or its alloy material or aluminum material that has been surface-treated with nickel or tin plating.
The connection terminal portion 5a to be the connection terminal 5, the mounting land 10 having a shape and area corresponding to the required heat dissipation, and the wiring pattern shape constituting the electronic circuit including the frame portion 9 are formed by press working or the like.
【００１４】４は成形樹脂体であり、熱伝導性のフィラ
ーを含有した絶縁樹脂材料を使用して本体への取付ビス
などの逃げの取付欠け部３、電子部品８の外形面積より
やや大きいサイズの搭載穴部７、接続端子部５ａを曲げ
加工して接続端子５とする端子欠け部６を設けて射出成
形などにより導体板１と一体成形している。Numeral 4 is a molded resin body, which is made of an insulating resin material containing a thermally conductive filler and has a size slightly larger than the external area of the electronic component 8 such as a mounting attachment cutout 3 such as a mounting screw to the main body. The mounting hole portion 7 and the connection terminal portion 5a are bent to provide the terminal chipped portion 6 to be the connection terminal 5, and are integrally formed with the conductor plate 1 by injection molding or the like.
【００１５】電子部品８は電子回路を構成するためのチ
ップ構造などの受動素子（抵抗、コンデンサ、インダク
タ、機構部品など）や能動素子（トランジスタ、ダイオ
ード、ＩＣなど）あるいは複合素子であり、搭載穴部７
の搭載ランド１０に半田付けあるいは導電性で熱伝導性
の接着剤により電気的かつ機械的に接続固定される。The electronic component 8 is a passive element (resistor, capacitor, inductor, mechanical component, etc.) such as a chip structure for constituting an electronic circuit, an active element (transistor, diode, IC, etc.) or a composite element, and has a mounting hole. Part 7
It is electrically and mechanically connected and fixed to the mounting land 10 by soldering or an electrically conductive and thermally conductive adhesive.
【００１６】次に、製造方法について説明する。まず、
図２に示すように所定の配線パターン形状に加工し、ま
た、取付孔２付近を完成した配線基板の下端面になるよ
うに同時あるいは後加工した導体板１を前記で説明した
取付欠け部３、端子欠け部６、搭載穴部７を設けて成形
樹脂体４で一体成形した後、図３に示すように不要な枠
部９を切断分離する。Next, the manufacturing method will be described. First,
As shown in FIG. 2, the conductor plate 1 is machined into a predetermined wiring pattern shape, and the conductor plate 1 is simultaneously or post-machined so that the vicinity of the mounting hole 2 becomes the lower end surface of the completed wiring board. After the terminal chipped portion 6 and the mounting hole portion 7 are provided and integrally molded with the molded resin body 4, the unnecessary frame portion 9 is cut and separated as shown in FIG.
【００１７】次に、所定の電子部品８を所定の搭載穴部
７の搭載ランド１０に接続固定し、接続端子部５ａを電
子部品８側に所定角度、例えば９０度などに曲げ加工し
て接続端子５とし配線基板を完成するものである。Next, the predetermined electronic component 8 is connected and fixed to the mounting land 10 of the predetermined mounting hole 7, and the connection terminal portion 5a is bent and connected to the electronic component 8 side at a predetermined angle, for example, 90 degrees. The terminal 5 is used to complete the wiring board.
【００１８】次に、接続端子５を製作する曲げ加工につ
いて説明する。図５は一般的な曲げ加工例を示したもの
であり、接続端子部５ｂをＥの位置で矢印方向に所定角
度曲げ加工する時、接続端子部５ｂの上面を除く両側面
と下面が成形樹脂体４と密着しているために曲げ加工に
おける抵抗が大きく、所定の形状や位置に精度良く曲げ
加工して接続端子５とすることが困難であるが、本発明
では図４に示すように、導体板１と成形樹脂体４との一
体化射出成形時などに金型に設けた凸状部により、絶縁
および絶縁耐圧に必要な沿面距離の距離Ｃと、接続端子
部５ａと成形樹脂体４との密着を防止する距離Ｂ（例え
ば接続端子部５ａの幅の０．５〜２倍など）でなる端子
欠け部６を設け、上記接続端子部５ａを位置Ａで矢印方
向に所定角度（例えば９０度）曲げ加工して端面距離Ｄ
を持つ接続端子５を形成するようにしているため、接続
端子部５ａ付近に成形樹脂体４がなく、また、上面およ
び両側面が成形樹脂体４と密着してないために接続端子
部５ａ付近の成形樹脂体４のわれ、かけの発生がなく、
曲げ加工の力も小さく、かつ、曲げ精度がよいものであ
る。Next, the bending process for producing the connection terminal 5 will be described. FIG. 5 shows an example of a general bending process. When the connecting terminal portion 5b is bent at a position E in the direction of the arrow at a predetermined angle, both side surfaces and the lower surface of the connecting terminal portion 5b except the upper surface are molded resin. Since it is in close contact with the body 4, the resistance in bending is large, and it is difficult to accurately bend into a predetermined shape or position to form the connection terminal 5, but in the present invention, as shown in FIG. Due to the convex portion provided on the mold during the integral injection molding of the conductor plate 1 and the molded resin body 4, the creepage distance C required for insulation and withstand voltage, the connection terminal portion 5a and the molded resin body 4 are provided. A terminal chipped portion 6 having a distance B (for example, 0.5 to 2 times the width of the connection terminal portion 5a) for preventing close contact with the connection terminal portion 5a is provided at a position A at a predetermined angle in the arrow direction (for example, 90 degree) Bending and end face distance D
Since there is no molded resin body 4 in the vicinity of the connection terminal portion 5a because the connecting terminals 5 are formed, and the upper surface and both side surfaces are not in close contact with the molded resin body 4, the vicinity of the connection terminal portion 5a There is no cracking of the molded resin body 4 of
The bending force is small and the bending accuracy is good.
【００１９】[0019]
【発明の効果】以上のように本発明によれば、別部品が
不要で、かつ機械的強度や位置決め精度の優れた外部と
の接続端子が得られ、品質の向上、生産コストの低減を
図ることが可能になるという有利な効果が得られる。As described above, according to the present invention, it is possible to obtain a connection terminal to the outside that does not require a separate part and has excellent mechanical strength and positioning accuracy, and to improve quality and reduce production cost. The advantageous effect that it becomes possible is obtained.
【図１】本発明の一実施の形態における接続端子付配線
基板の斜視図FIG. 1 is a perspective view of a wiring board with connection terminals according to an embodiment of the present invention.
【図２】同電子回路形成用加工導体板の斜視図FIG. 2 is a perspective view of the processed conductor plate for forming the electronic circuit.
【図３】同樹脂成形された配線基板の斜視図FIG. 3 is a perspective view of the resin-molded wiring board.
【図４】同接続端子曲げ加工の要部斜視図FIG. 4 is a perspective view of a main part of the same connection terminal bending process.
【図５】接続端子曲げ加工の一般的な例を示す要部斜視
図FIG. 5 is a perspective view of a main part showing a general example of bending a connection terminal.
【図６】従来の接続端子付配線基板の斜視図FIG. 6 is a perspective view of a conventional wiring board with connection terminals.
【図７】同要部の断面図FIG. 7 is a cross-sectional view of the main part.
１ 導体板 ２ 取付孔 ３ 取付欠け部 ４ 成形樹脂体 ５ 接続端子 ５ａ，５ｂ，５ｃ 接続端子部 ６ 端子欠け部 ６ａ 端子欠け部 ７ 搭載穴部 ８ 電子部品 ９ 枠部 １０ 搭載ランド DESCRIPTION OF SYMBOLS 1 conductor plate 2 mounting hole 3 mounting notch 4 molded resin body 5 connecting terminal 5a, 5b, 5c connecting terminal 6 terminal notch 6a terminal notch 7 mounting hole 8 electronic component 9 frame 10 mounting land
Claims (3)
した金属材でなる導体板と、熱伝導性フィラーを含有し
た樹脂材でなる成形樹脂体を成形して一体化し、電子部
品を搭載接続してなる配線基板において、外部との接続
端子を前記導体板の一部による一体化構造とした接続端
子付配線基板。1. A conductor plate made of a metal material having a wiring pattern forming an electronic circuit and a molded resin body made of a resin material containing a heat conductive filler are molded and integrated to mount and connect electronic components. In the wiring board, the wiring board with connection terminals has an integrated structure in which the connection terminals to the outside are integrated by a part of the conductor plate.
ら、所定絶縁に必要な沿面距離位置にて曲げ加工して電
子部品搭載側に起こした外部との接続端子とする請求項
１記載の接続端子付配線基板。2. The connecting terminal for external connection raised on the electronic component mounting side by bending the end surface of the molded and integrated molded resin body at a creepage distance position required for predetermined insulation. Wiring board with connection terminals.
を成形樹脂体と密着せずに露出させた外部との接続端子
とする請求項２記載の接続端子付配線基板。3. The wiring board with connection terminals according to claim 2, wherein the upper surface and both side surfaces of the portion to be bent are exposed as external connection terminals without adhering to the molded resin body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11343896A JP3629811B2 (en) | 1996-05-08 | 1996-05-08 | Wiring board with connection terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11343896A JP3629811B2 (en) | 1996-05-08 | 1996-05-08 | Wiring board with connection terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09298344A true JPH09298344A (en) | 1997-11-18 |
| JP3629811B2 JP3629811B2 (en) | 2005-03-16 |
Family
ID=14612236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11343896A Expired - Lifetime JP3629811B2 (en) | 1996-05-08 | 1996-05-08 | Wiring board with connection terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3629811B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6870244B2 (en) | 2000-12-27 | 2005-03-22 | Matsushita Electric Industrial Co., Ltd. | Lead frame and production process thereof and production process of thermally conductive substrate |
| JP2011187777A (en) * | 2010-03-10 | 2011-09-22 | Panasonic Corp | Insulated heat dissipating substrate |
| JP2011254020A (en) * | 2010-06-03 | 2011-12-15 | Yazaki Corp | Wiring board and method for manufacturing the same |
| JP2012015492A (en) * | 2010-06-03 | 2012-01-19 | Yazaki Corp | Laminated wiring substrate and method of manufacturing the same |
| KR101537319B1 (en) * | 2009-05-20 | 2015-07-16 | 한국단자공업 주식회사 | Metal core PCB |
| JP2016103315A (en) * | 2014-11-27 | 2016-06-02 | 東芝ライテック株式会社 | Vehicle lighting device |
| US9480142B2 (en) | 2010-06-03 | 2016-10-25 | Yazaki Corporation | Wiring substrate and manufacturing method thereof |
-
1996
- 1996-05-08 JP JP11343896A patent/JP3629811B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6870244B2 (en) | 2000-12-27 | 2005-03-22 | Matsushita Electric Industrial Co., Ltd. | Lead frame and production process thereof and production process of thermally conductive substrate |
| US7087467B2 (en) | 2000-12-27 | 2006-08-08 | Matsushita Electric Industrial Co., Ltd. | Lead frame and production process thereof and production process of thermally conductive substrate |
| KR101537319B1 (en) * | 2009-05-20 | 2015-07-16 | 한국단자공업 주식회사 | Metal core PCB |
| JP2011187777A (en) * | 2010-03-10 | 2011-09-22 | Panasonic Corp | Insulated heat dissipating substrate |
| JP2011254020A (en) * | 2010-06-03 | 2011-12-15 | Yazaki Corp | Wiring board and method for manufacturing the same |
| JP2012015492A (en) * | 2010-06-03 | 2012-01-19 | Yazaki Corp | Laminated wiring substrate and method of manufacturing the same |
| US9480142B2 (en) | 2010-06-03 | 2016-10-25 | Yazaki Corporation | Wiring substrate and manufacturing method thereof |
| US9888558B2 (en) | 2010-06-03 | 2018-02-06 | Yazaki Corporation | Wiring substrate and manufacturing method thereof |
| US9980364B2 (en) | 2010-06-03 | 2018-05-22 | Yazaki Corporation | Wiring substrate and manufacturing method thereof |
| JP2016103315A (en) * | 2014-11-27 | 2016-06-02 | 東芝ライテック株式会社 | Vehicle lighting device |
| US10260703B2 (en) | 2014-11-27 | 2019-04-16 | Toshiba Lighting & Technology Corporation | Lighting device for vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3629811B2 (en) | 2005-03-16 |
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