JPH09296156A - Thin metal layer-having interlayer adhesive film for multilayered printed wiring board, and multilayered printed wiring board using the same and its production - Google Patents
Thin metal layer-having interlayer adhesive film for multilayered printed wiring board, and multilayered printed wiring board using the same and its productionInfo
- Publication number
- JPH09296156A JPH09296156A JP8110734A JP11073496A JPH09296156A JP H09296156 A JPH09296156 A JP H09296156A JP 8110734 A JP8110734 A JP 8110734A JP 11073496 A JP11073496 A JP 11073496A JP H09296156 A JPH09296156 A JP H09296156A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- printed wiring
- adhesive film
- wiring board
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導体回路層と絶縁層と
を交互に積み上げたビルドアップ方式の多層プリント配
線板において、絶縁層上に密着性に優れた導体層を簡易
に所望の厚みで形成し得る金属薄層付き多層プリント配
線板用層間接着フィルム、及びこれを用いた多層プリン
ト配線板とその製造法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a build-up type multilayer printed wiring board in which conductor circuit layers and insulating layers are alternately stacked, and a conductor layer having excellent adhesion is easily formed on an insulating layer to a desired thickness. The present invention relates to an interlayer adhesive film for a multilayer printed wiring board with a thin metal layer, which can be formed by, a multilayer printed wiring board using the same, and a method for producing the same.
【０００２】[0002]
【従来の技術】従来、多層プリント配線板の製造方法と
して、回路形成された内層回路板に絶縁接着層としてガ
ラスクロスにエポキシ樹脂を含浸しＢステージ化したプ
リプレグシートを数枚介して積層プレスし、スルーホー
ルによって層間導通をとる方法が知られている。しか
し、本方法では積層プレスにて加熱、加圧成形を行うた
め大掛かりな設備と長時間を要しコスト高となる上、プ
リプレグシートに比較的誘電率の高いガラスクロスを用
いるため層間厚みの薄化に制限があるほか、ＣＡＦによ
る絶縁性不安など問題を抱えていた。2. Description of the Related Art Conventionally, as a method of manufacturing a multilayer printed wiring board, a circuit-formed inner layer circuit board is laminated and pressed through a plurality of B-staged prepreg sheets obtained by impregnating glass cloth with an epoxy resin as an insulating adhesive layer. A method is known in which interlayer conduction is achieved by using through holes. However, in this method, heating and pressure molding are performed by a laminating press, which requires a large amount of equipment and a long time, which results in high cost.Because a glass cloth having a relatively high dielectric constant is used for the prepreg sheet, the interlayer thickness is thin. In addition to restrictions on the use of CAF, there were problems such as insulation anxiety caused by CAF.
【０００３】[0003]
【発明が解決しようとする課題】このような問題を解決
する方法として、近年内層回路板の導体層上に有機絶縁
層を交互に積み上げていくビルドアップ方式の多層プリ
ント配線板の製造技術が注目されている。特開平７ー２
０２４１８、７ー２０２４２６には、接着剤付き銅箔を
用いて、内層回路板にラミネートし硬化させる方法が開
示されているが、強度的問題から銅箔の薄化に制限があ
る上、スルーホールメッキが加わった場合さらに厚みが
増し、ファインパターンの形成に不向きとなる問題があ
る。また、他の方法としては、アディティブ法において
メッキ触媒入り接着フィルムを用いるもの（特開平６ー
１０８０１６）、内層回路板上に形成した接着剤層を介
して無電解、電解銅メッキにより導体層を形成する方法
（特開平７ー３０４９３３）が知られている。しかしな
がら、これらの方法では実用に耐える密着性に優れた導
体層を形成するには、前行程として接着層表面の粗化が
必須かつ管理が難しい上、接着層に有機または無機の粗
化成分を含むため、耐熱性、電気特性など絶縁接着層に
要求される特性全般を満足するものを得るのは至難の業
であった。また、インキ形態で接着層を形成する場合、
工程中接着層にゴミの入る可能性が大きく、断線、ショ
ート等の回路不良を起こすという問題もあった。As a method for solving such a problem, a manufacturing technique of a build-up type multilayer printed wiring board in which organic insulating layers are alternately stacked on conductor layers of an inner layer circuit board has been attracting attention in recent years. Has been done. JP-A-7-2
No. 02418, 7-202426 discloses a method of laminating and curing an inner layer circuit board by using a copper foil with an adhesive, but there is a limitation on thinning of the copper foil due to a strength problem, and a through hole. When plating is added, the thickness is further increased, which is not suitable for forming a fine pattern. As another method, an adhesive film containing a plating catalyst is used in the additive method (JP-A-6-108016), and a conductor layer is formed by electroless copper plating through an adhesive layer formed on an inner circuit board. A forming method (Japanese Patent Laid-Open No. 7-304933) is known. However, in these methods, in order to form a conductor layer having excellent adhesion that can be practically used, roughening of the adhesive layer surface is essential and difficult to manage as a preceding step, and an organic or inorganic roughening component is added to the adhesive layer. Therefore, it has been extremely difficult to obtain materials that satisfy all the properties required for the insulating adhesive layer, such as heat resistance and electrical characteristics. When forming the adhesive layer in the form of ink,
There is a great possibility that dust may enter the adhesive layer during the process, and there is also a problem that circuit failure such as disconnection or short circuit occurs.
【０００４】[0004]
【問題を解決するための手段】上記問題点を顧みて、本
発明者らは鋭意検討しビルドアップ方式の多層プリント
配線板の製造において、ファインパターンの形成に適し
かつ、厳密な管理を要する接着剤層の粗化工程、接着剤
中の粗化成分を必要とせず密着性に優れた導体層を簡易
に形成する方法を開発するに到った。すなわち本発明
は、必要に応じて支持ベースフィルム上に形成した、熱
流動性を有する厚さ１０〜２００μｍの接着フィルム層
の上に蒸着法、スパッタリング法またはイオンプレーテ
ィング法により厚さ０．０５〜５μｍの金属薄層を形成
した、金属薄層付き多層プリント配線板用層間接着フィ
ルム、または支持ベースフィルム上に蒸着法、スパッタ
リング法またはイオンプレーティング法により厚さ０．
０５〜５μｍの金属薄層を形成し、その上に熱流動性を
有する厚さ１０〜２００μｍの接着フィルム層を形成し
た転写用金属薄層付き多層プリント配線板用層間接着フ
ィルム、及びこれを内層回路板にラミネートし、硬化さ
せることを特徴とする多層プリント配線板とその製造法
である。In consideration of the above problems, the present inventors have made diligent studies and, in the production of build-up type multilayer printed wiring boards, are suitable for forming fine patterns and require strict control. The inventors have developed a method for easily forming a conductor layer having excellent adhesiveness without requiring a roughening step of the agent layer and a roughening component in the adhesive. That is, the present invention has a thickness of 0.05 to 10 μm by a vapor deposition method, a sputtering method, or an ion plating method on an adhesive film layer having a thickness of 10 to 200 μm and having heat flowability, which is formed on a supporting base film as needed. A metal thin layer having a thickness of about 5 μm is formed on the interlayer adhesive film for a multilayer printed wiring board with a metal thin layer, or a supporting base film by a vapor deposition method, a sputtering method or an ion plating method to have a thickness of 0.
An interlayer adhesive film for a multilayer printed wiring board with a metal thin layer for transfer, in which a metal thin layer having a thickness of 05 to 5 μm is formed, and an adhesive film layer having a thickness of 10 to 200 μm having thermal fluidity is formed thereon, and an inner layer of the same A multilayer printed wiring board characterized by being laminated on a circuit board and cured, and a method for manufacturing the same.
【０００５】[0005]
【発明の実施の形態】本発明における熱流動性を有する
接着フィルム層としては、加熱により軟化し、フィルム
形成能のある樹脂組成物であり、かつ熱硬化により耐熱
性、電気特性など絶縁接着層に要求される特性を満足す
るものであれば特に限定されるものではない。例えば、
エポキシ樹脂系、アクリル樹脂系、ポリイミド樹脂系、
ポリアミドイミド樹脂系、ポリシアネート樹脂系、ポリ
エステル樹脂系、熱硬化型ポリフェニレンエーテル樹脂
系等が挙げられ、これらを２種以上組み合わせて使用し
たり、多層構造を有する接着フィルム層とすることも可
能である。また、熱可塑性ポリイミド等の熱可塑性高耐
熱エンジニアリングプラスチックを使用すれば、熱硬化
工程を省略することもできる。BEST MODE FOR CARRYING OUT THE INVENTION The heat-adhesive adhesive film layer in the present invention is a resin composition which is softened by heating and has a film-forming ability, and which is an insulating adhesive layer such as heat resistance and electric characteristics by heat curing. There is no particular limitation as long as it satisfies the characteristics required for. For example,
Epoxy resin type, acrylic resin type, polyimide resin type,
Examples include polyamide-imide resin-based, polycyanate resin-based, polyester resin-based, and thermosetting polyphenylene ether resin-based. It is also possible to use a combination of two or more of these or to form an adhesive film layer having a multilayer structure. is there. Further, if a thermoplastic high heat resistant engineering plastic such as thermoplastic polyimide is used, the thermosetting step can be omitted.
【０００６】さらに接着フィルム層には上記樹脂成分の
他に、公知慣用の添加剤を用いることができる。例えば
硫酸バリウム、チタン酸バリウム、酸化ケイ素粉、無定
形シリカ、タルク、クレー、炭酸マグネシウム、炭酸カ
ルシウム、雲母粉などの無機充填剤、シリコンパウダ
ー、ナイロンパウダー、フッ素パウダーの如き有機充填
剤、アスベスト、オルベン、ベントン等の増粘剤、シリ
コーン系、フッ素系、高分子系の消泡剤及び／またはレ
ベリング剤、イミダゾール系、チアゾール系、トリアゾ
ール系、シランカップリング剤等の密着性付与剤のよう
な添加剤を使用できる。また、必要に応じてフタロシア
ニン・ブルー、フタロシアニン・グリーン、アイオジン
・グリーン、ジスアゾイエロー、酸化チタン、カーボン
ブラック等の公知慣用の着色剤を用いることができる。Further, in addition to the above resin components, known and commonly used additives can be used in the adhesive film layer. For example, barium sulfate, barium titanate, silicon oxide powder, amorphous silica, talc, clay, magnesium carbonate, calcium carbonate, inorganic fillers such as mica powder, silicon powder, nylon powder, organic fillers such as fluorine powder, asbestos, Thickeners such as Orben, Benton, etc., silicone-based, fluorine-based, polymer-based defoamers and / or leveling agents, adhesion promoters such as imidazole-based, thiazole-based, triazole-based, silane coupling agents, etc. Additives can be used. Further, if necessary, known and commonly used colorants such as phthalocyanine blue, phthalocyanine green, iodin green, disazo yellow, titanium oxide, carbon black and the like can be used.
【０００７】このような接着フィルム層は単独で熱成形
するほか、ベースフィルムを支持体として所定の溶剤に
溶解した上記樹脂ワニスを塗布し、溶剤を乾燥除去する
ことにより作製することができる。支持ベースフィルム
としては、ポリエチレン、ポリ塩化ビニル等のポリオレ
フィン、ポリエステル、ポリカーボネート等が挙げられ
るが、中でも１０〜２００μｍ厚のポリエチレンテレフ
タレートフィルムが好ましい。接着フィルム層の厚み
は、ラミネートされる内層回路板の導体厚以上で、１０
〜２００μｍの範囲であれば特に限定されるものではな
いが、層間絶縁信頼性、薄層化の面から１５〜１２０μ
ｍが好ましい。Such an adhesive film layer can be prepared by thermoforming alone, or by applying the above resin varnish dissolved in a predetermined solvent with the base film as a support and drying and removing the solvent. Examples of the supporting base film include polyolefins such as polyethylene and polyvinyl chloride, polyesters and polycarbonates, and among them, a polyethylene terephthalate film having a thickness of 10 to 200 μm is preferable. The thickness of the adhesive film layer is not less than the conductor thickness of the inner layer circuit board to be laminated and is 10 or more.
The thickness is not particularly limited as long as it is in the range of 200 to 200 μm, but is 15 to 120 μ in view of reliability of interlayer insulation and thinning.
m is preferred.
【０００８】上記のようにして得られた接着フィルム層
の上に、蒸着法、スパッタリング法またはイオンプレー
ティング法により金属薄層を形成する。こららは、公知
慣用の方法で行われるが、例えばフィルムが巻回されて
いるロールを真空槽内に入れ、連続的にフィルム上に金
属の蒸着を施すことにより形成できる。金属材料として
は、通常銅が使用されるが、それ以外にニッケル、銀、
アルミニウムまたはこれらの複合系が挙げられる。金属
薄層は、必要に応じてその上に電解または無電解メッキ
して厚みを調整することができるが、厚みは０．０５〜
５μｍの範囲にあるのが好ましい。０．０５μｍより薄
いと後工程の管理が厳密になるし、５μｍを越えると樹
脂付き銅箔と同じくファインパターンに適さなくなる。
また、形成された金属薄層面は、必要に応じて支持ベー
スフィルムの如き保護フィルムでカバーしたり、イミダ
ゾール系の有機皮膜形成法や、クロメート処理、ジンケ
ート処理など公知慣用の防錆処理を施し、長期保存安定
性を確保できる。以上のようにして金属薄層付き多層プ
リント配線板用層間接着フィルムが形成される。A thin metal layer is formed on the adhesive film layer obtained as described above by a vapor deposition method, a sputtering method or an ion plating method. These are carried out by a known and commonly used method, for example, they can be formed by placing a roll around which a film is wound in a vacuum chamber and continuously depositing a metal on the film. Copper is usually used as the metal material, but nickel, silver,
Aluminum or a composite system thereof may be used. The thickness of the thin metal layer can be adjusted by electrolytic or electroless plating if necessary, but the thickness is 0.05 to
It is preferably in the range of 5 μm. If it is thinner than 0.05 μm, the control of the post-process becomes strict, and if it exceeds 5 μm, it becomes unsuitable for fine patterns like the copper foil with resin.
Further, the formed metal thin layer surface, if necessary, covered with a protective film such as a supporting base film, an imidazole-based organic film forming method, chromate treatment, a known rust-proof treatment such as zincate treatment, Long-term storage stability can be secured. As described above, the interlayer adhesive film for a multilayer printed wiring board with a thin metal layer is formed.
【０００９】さらに、接着フィルム層と金属薄層の構成
を逆にして、支持ベースフィルムの上に蒸着法、スパッ
タリング法またはイオンプレーティング法により金属薄
層を形成した後、接着フィルム層を形成した転写用金属
薄層付き多層プリント配線板用層間接着フィルムにおい
ても、本発明の効果を達成することができる。Further, the adhesive film layer and the metal thin layer are reversed in structure, and after the metal thin layer is formed on the supporting base film by the vapor deposition method, the sputtering method or the ion plating method, the adhesive film layer is formed. The effect of the present invention can be achieved also in an interlayer adhesive film for a multilayer printed wiring board with a transfer thin metal layer.
【００１０】[0010]
【実施例】以下、本発明を適用した実施例について図面
を参照しながら詳細に説明する。金属薄層付き層間接着
フィルム（図１、図２）または、転写用金属薄層付き層
間接着フィルム（図３）は、通常ドライフィルムラミネ
ーターにより内層回路基板（図４）にラミネートし、硬
化させることのより外層に金属薄層を有する多層プリン
ト配線板（図５）を形成することができる。ラミネート
する圧着ロールの温度、圧力は使用する接着フィルムの
樹脂組成物、内層回路板の導体層の厚みにより最適値が
異なるが、一般的に温度は１００〜１６０℃、加圧力は
１０〜６０Ｋｇ／ｃｍ2である。また、ラミネートの前
に内層回路板上に予め接着フィルム層と同様の組成を有
する接着剤ワニスを塗布、乾燥して回路上を平坦化させ
ておくことも可能である。ラミネート後、必要に応じて
１３０〜２００℃にて１５〜９０分間熱硬化させること
により、接着フィルム層は層間絶縁材としての特性を有
するものとなる。Embodiments to which the present invention is applied will be described below in detail with reference to the drawings. The interlayer adhesive film with a thin metal layer (Figs. 1 and 2) or the interlayer adhesive film with a thin metal layer for transfer (Fig. 3) is usually laminated on an inner circuit board (Fig. 4) by a dry film laminator and cured. It is possible to form a multilayer printed wiring board (FIG. 5) having a thin metal layer as an outer layer. The optimum values of the temperature and pressure of the pressure-bonding roll to be laminated differ depending on the resin composition of the adhesive film used and the thickness of the conductor layer of the inner circuit board, but generally the temperature is 100 to 160 ° C., the pressure is 10 to 60 kg / cm 2 . It is also possible to apply an adhesive varnish having the same composition as that of the adhesive film layer on the inner layer circuit board in advance and laminate it on the inner circuit board to dry it before the lamination. After laminating, the adhesive film layer has properties as an interlayer insulating material by optionally heat curing at 130 to 200 ° C. for 15 to 90 minutes.
【００１１】その後、必要に応じて所定のスルーホー
ル、ビアホール部等にドリルまたはレーザー光により穴
開けを行った後（図６）、無電解銅メッキ及び／または
電解銅メッキにより導体層を所望の厚み、好ましくは５
〜２０μｍの厚さに被覆し（図７）、サブトラクティブ
法に従って所定の回路パターンを形成する（図９）。あ
るいは、アディティブ法により穴開け後メッキレジスト
を形成し、導体層を無電解銅メッキ及び／または電解銅
メッキにより形成し（図８）、メッキレジストを剥離し
た後、金属薄層をエッチングにより除去し所定の回路パ
ターンを形成することができる（図９）。こうして形成
された多層プリント配線板の導体層はいずれの方法で
も、絶縁層となる接着フィルムに蒸着法、スパッタリン
グ法またはイオンプレーティング法により形成された金
属薄層を下地にしているので、優れた密着性を有してい
る。Thereafter, if necessary, a predetermined through hole, a via hole or the like is perforated with a drill or a laser beam (FIG. 6), and then a conductive layer is formed into a desired layer by electroless copper plating and / or electrolytic copper plating. Thickness, preferably 5
It is coated to a thickness of ˜20 μm (FIG. 7), and a predetermined circuit pattern is formed according to the subtractive method (FIG. 9). Alternatively, after forming holes by an additive method, a plating resist is formed, a conductor layer is formed by electroless copper plating and / or electrolytic copper plating (FIG. 8), and after removing the plating resist, the metal thin layer is removed by etching. A predetermined circuit pattern can be formed (FIG. 9). In any method, the conductor layer of the multilayer printed wiring board thus formed is excellent because the adhesive film serving as an insulating layer is based on a thin metal layer formed by a vapor deposition method, a sputtering method or an ion plating method. Has adhesion.
【００１２】[0012]
【実施例１】以下に製造例、実施例及び比較例を示して
本発明を具体的に説明するが、本発明はこれに限定され
るものではない。ビスフェノールＡ型エポキシ樹脂（エ
ポキシ当量３３４０、大日本インキ化学（株）製 エピ
クロンＨＭー１０１）１００重量部（以下、配合量は全
て重量部で表す）、テトラブロモビスフェノールＡ型エ
ポキシ樹脂（エポキシ当量４００、大日本インキ化学
（株）製エピクロン１５３）２０部、ビスフェノールＡ
型エポキシ樹脂（エポキシ当量１８５、油化シェルエポ
キシ（株）製エピコート８２８）３０部とをメチルエチ
ルケトン（以下、ＭＥＫと記す）に攪拌しながら加熱溶
解させ、そこへエポキシ硬化剤としてジシアンジアミド
３部と、２、４ージアミノー６ー（２ーメチルー１ーイ
ミダゾリル）ーエチルー１、３、５ートリアジン０．２
部、シリコーン系レべリング剤１部を添加し接着剤ワニ
スを作製した。そのワニスを厚さ６０μｍのポリエチレ
ンテレフタレート（以下、ＰＥＴと記す）フィルム上
に、乾燥後の厚みが４０μｍとなるようにローラーコー
ターにて塗布、乾燥した後、接着フィルム層上に蒸着法
にて厚さ０．５μｍの銅薄層を形成し銅薄層付き接着フ
ィルムを得た。一方、銅箔１８μｍのガラスエポキシ両
面銅張積層板から内層回路板を作製し、次いで銅薄層付
き接着フィルムをドライフィルムラミネーターにより両
面にラミネートし、１７０℃で３０分間熱硬化させた。
その後、所定のスルーホール、ビアホール部等にドリル
またはレーザー光により穴開けを行い、市販のメッキレ
ジストを形成し、導体層を無電解銅メッキ及び電解銅メ
ッキにより形成した。次いで、メッキレジストを剥離
し、銅薄層をエッチングにより除去、４層プリント配線
板を得た。Example 1 The present invention will be specifically described below with reference to Production Examples, Examples and Comparative Examples, but the present invention is not limited thereto. Bisphenol A type epoxy resin (epoxy equivalent 3340, manufactured by Dainippon Ink and Chemicals, Inc. Epicron HM-101) 100 parts by weight (hereinafter, all compounding amounts are expressed in parts by weight), tetrabromobisphenol A type epoxy resin (epoxy equivalent 400 , Dainippon Ink and Chemicals, Inc. Epicron 153) 20 parts, bisphenol A
30 parts of epoxy resin (epoxy equivalent 185, Epicoat 828 manufactured by Yuka Shell Epoxy Co., Ltd.) is dissolved in methyl ethyl ketone (hereinafter referred to as MEK) while stirring, and 3 parts of dicyandiamide as an epoxy curing agent is added thereto. 2,4-diamino-6- (2-methyl-1-imidazolyl) -ethyl-1,3,5-triazine 0.2
Parts and 1 part of a silicone-based leveling agent were added to prepare an adhesive varnish. The varnish was applied on a polyethylene terephthalate (hereinafter referred to as PET) film having a thickness of 60 μm by a roller coater so that the thickness after drying was 40 μm, dried, and then deposited on the adhesive film layer by vapor deposition. A 0.5 μm thick copper thin layer was formed to obtain an adhesive film with a copper thin layer. On the other hand, an inner layer circuit board was prepared from a glass epoxy double-sided copper clad laminate having a copper foil of 18 μm, and then an adhesive film with a thin copper layer was laminated on both sides by a dry film laminator and heat-cured at 170 ° C. for 30 minutes.
After that, a predetermined through hole, a via hole or the like was perforated with a drill or a laser beam to form a commercially available plating resist, and a conductor layer was formed by electroless copper plating and electrolytic copper plating. Then, the plating resist was peeled off, the copper thin layer was removed by etching, and a four-layer printed wiring board was obtained.
【００１３】[0013]
【実施例２】厚さ６０μｍのＰＥＴフィルムに蒸着法に
て厚さ１．０μｍの銅薄層を形成した後、その上に実施
例１で得られた接着剤ワニスを乾燥後の厚みが４０μｍ
となるようにローラーコーターにて塗布、乾燥して転写
用銅薄層付き接着フィルムを得た。これを内層回路板の
両面にラミネートしＰＥＴフィルムを剥離、１７０℃で
３０分間熱硬化させ、実施例１と同様にして４層プリン
ト配線板を得た。Example 2 A thin copper layer having a thickness of 1.0 μm was formed on a PET film having a thickness of 60 μm by a vapor deposition method, and then the adhesive varnish obtained in Example 1 was dried to a thickness of 40 μm.
Was coated with a roller coater so as to be dried and dried to obtain an adhesive film with a thin copper layer for transfer. This was laminated on both sides of the inner layer circuit board, the PET film was peeled off, and heat cured at 170 ° C. for 30 minutes to obtain a four-layer printed wiring board in the same manner as in Example 1.
【００１４】[0014]
【実施例３】フェノキシ樹脂（東都化成（株）製、ＹＰ
ー５０）の３５％ＭＥＫ溶液２００部に、ＨＤＩ系ブロ
ック型イソシアネートの８０％ＭＥＫ溶液（日本ポリウ
レタン工業（株）製、コロネート２５０７）３０部、Ｍ
ＤＩ系ブロック型イソシアネート（日本ポリウレタン工
業（株）製、コロネート２５０３）２０部を入れ攪拌し
ながら溶解し、それにフッ素系レべリング剤２部を添加
し接着剤ワニスを作製した。そのワニスを用いて実施例
１と同様に、ＰＥＴフィルム上に１００μｍ厚の接着フ
ィルム層を形成し、その上にスパッタリング法と電解銅
メッキにて厚さ２．５μｍの銅薄層を形成した銅薄層付
き接着フィルムを得た。そして、実施例１と全く同様に
して４層プリント配線板を得た。[Example 3] Phenoxy resin (YP manufactured by Tohto Kasei Co., Ltd.)
50 parts) to 35 parts of 35% MEK solution, 30 parts of 80% MEK solution of HDI block type isocyanate (Nippon Polyurethane Industry Co., Ltd., Coronate 2507), M
20 parts of DI block type isocyanate (Coronate 2503, manufactured by Nippon Polyurethane Industry Co., Ltd.) was added and dissolved with stirring, and 2 parts of a fluorine leveling agent was added thereto to prepare an adhesive varnish. Using the varnish, an adhesive film layer having a thickness of 100 μm was formed on a PET film, and a thin copper layer having a thickness of 2.5 μm was formed on the PET film by a sputtering method and electrolytic copper plating in the same manner as in Example 1. An adhesive film with a thin layer was obtained. Then, a four-layer printed wiring board was obtained in exactly the same manner as in Example 1.
【００１５】[0015]
【実施例４】熱硬化型アリル化ポリフェニレンエーテル
樹脂ＭＥＫワニス、樹脂成分１００部、ビスアリルナジ
イミド樹脂ＭＥＫワニス（丸善石油化学（株）製、ＢＡ
ＮＩー１００Ｖ）樹脂成分２５部に、有機過酸化物（日
本油脂（株）製、パーブチルＰ）０．５部、シリコーン
系レべリング剤１部を添加し接着剤ワニスを作製した。
そのワニスを用いて実施例１と同様に、ＰＥＴフィルム
上に６０μｍ厚の接着フィルム層を形成し、その上に蒸
着法にて厚さ０．１μｍの銅薄層を形成した銅薄層付き
接着フィルムを得た。そして、内層回路板の両面にラミ
ネートし、１８０℃で３０分間熱硬化させた後、所定の
スルーホール、ビアホール部等にドリルまたはレーザー
光により穴開けを行い、無電解銅メッキ及び電解銅メッ
キにより全面に導体層を形成した。その後、市販の液状
エッチングレジストにて外層回路パターンを形成し４層
プリント配線板を得た。Example 4 Thermosetting Allylated Polyphenylene Ether Resin MEK Varnish, 100 Parts of Resin Component, Bisallyl Nadimide Resin MEK Varnish (Maruzen Petrochemical Co., Ltd., BA
To 100 parts of (NI-100V) resin component, 0.5 parts of organic peroxide (Perbutyl P, manufactured by NOF CORPORATION) and 1 part of silicone leveling agent were added to prepare an adhesive varnish.
Using the varnish, as in Example 1, a 60 μm thick adhesive film layer was formed on a PET film, and a 0.1 μm thick copper thin layer was formed thereon by a vapor deposition method. I got a film. Then, after laminating on both sides of the inner layer circuit board and heat-curing at 180 ° C. for 30 minutes, the predetermined through holes, via holes, etc. are perforated by drilling or laser light, and electroless copper plating and electrolytic copper plating are performed. A conductor layer was formed on the entire surface. Then, an outer layer circuit pattern was formed with a commercially available liquid etching resist to obtain a four-layer printed wiring board.
【００１６】[0016]
【比較例１、２、３】実施例１、３、４で得られた接着
フィルム層の上に蒸着法、またはスパッタリング法にて
銅薄層を形成することなく、内層回路板にラミネート、
同条件、同工程を経て、比較用４層プリント配線板を得
た。実施例１の接着フィルムを使用したものを比較例
１、実施例３の接着フィルムを使用したものを比較例
２、実施例４の接着フィルムを使用したものを比較例３
とした。[Comparative Examples 1, 2, 3] Laminated on an inner layer circuit board without forming a thin copper layer on the adhesive film layers obtained in Examples 1, 3, 4 by vapor deposition or sputtering.
A 4-layer printed wiring board for comparison was obtained through the same conditions and the same steps. The adhesive film of Example 1 was used for Comparative Example 1, the adhesive film of Example 3 was used for Comparative Example 2, and the adhesive film of Example 4 was used for Comparative Example 3.
And
【００１７】このようにして得られたプリント配線板の
評価結果を表１に示す。結果から、本発明の方法に従え
ば密着性に優れた導体層を簡易に形成できることは明ら
かである。Table 1 shows the evaluation results of the printed wiring board thus obtained. From the results, it is clear that according to the method of the present invention, a conductor layer having excellent adhesion can be easily formed.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【発明の効果】本発明の方法に従うと、ビルドアップ方
式の多層プリント配線板の製造において、ファインパタ
ーンの形成に適しかつ、厳密な管理を要する接着剤層の
粗化工程、接着剤中の粗化成分を必要とせず密着性に優
れた導体層を簡易に形成することができる。According to the method of the present invention, in the production of a build-up type multilayer printed wiring board, a roughening step of an adhesive layer suitable for forming a fine pattern and requiring strict control, and a roughening step in the adhesive are required. It is possible to easily form a conductor layer having excellent adhesiveness without requiring a chemical component.
【図１】金属薄層付フィルムFigure 1: Film with thin metal layer
【図２】金属薄層付層間接着フィルムFIG. 2 Interlayer adhesive film with thin metal layer
【図３】転写用金属薄層付層間接着フィルムFIG. 3 Interlayer adhesive film with a thin metal layer for transfer
【図４】内層回路基板FIG. 4 Inner layer circuit board
【図５】外層金属多薄層プリント配線板FIG. 5: Outer metal multi-thin layer printed wiring board
【図６】穴あけ外層金属多薄層プリント配線板[Fig. 6] Perforated outer layer metal multi-layer printed wiring board
【図７】銅メッキ外層金属多薄層プリント配線板[Fig. 7] Copper-plated outer layer metal multi-layer printed wiring board
【図８】メッキレジスト処理した銅メッキ外層金属多薄
層プリント配線板FIG. 8: Copper-plated outer layer metal multi-layer printed wiring board treated with plating resist
【図９】金属薄層除去後の回路パターンFIG. 9: Circuit pattern after thin metal layer is removed
１ 金属薄層 ２ 接着フィルム層 ３ 支持ベースフィルム ４ 内層導体層 ５ 内層回路板 ６ ビアホール ７ スルーホール ８ メッキレジスト 1 Metal thin layer 2 Adhesive film layer 3 Support base film 4 Inner conductor layer 5 Inner circuit board 6 Via hole 7 Through hole 8 Plating resist
Claims (5)
接着フィルム層の上に蒸着法、スパッタリング法または
イオンプレーティング法により厚さ０．０５〜５μｍの
金属薄層を形成した、金属薄層付き多層プリント配線板
用層間接着フィルム。1. A thin metal film, wherein a thin metal layer having a thickness of 0.05 to 5 μm is formed on an adhesive film layer having a heat fluidity of 10 to 200 μm by a vapor deposition method, a sputtering method or an ion plating method. Interlayer adhesive film for multilayer printed wiring boards with layers.
ースフィルム上に形成することを特徴とする、金属薄層
付き多層プリント配線板用層間接着フィルム。2. An interlayer adhesive film for a multilayer printed wiring board with a thin metal layer, characterized in that the adhesive film layer according to claim 1 is formed on a supporting base film.
リング法またはイオンプレーティング法により厚さ０．
０５〜５μｍの金属薄層を形成し、その上に熱流動性を
有する厚さ１０〜２００μｍの接着フィルム層を形成し
た転写用金属薄層付き多層プリント配線板用層間接着フ
ィルム。3. A support base film having a thickness of 0..3 by a vapor deposition method, a sputtering method or an ion plating method.
An interlayer adhesive film for a multilayer printed wiring board with a metal thin layer for transfer, in which a thin metal layer having a thickness of 05 to 5 μm is formed, and an adhesive film layer having a thickness of 10 to 200 μm having thermal fluidity is formed thereon.
とを特徴とする、金属薄層付き多層プリント配線板用層
間接着フィルム。4. An interlayer adhesive film for a multilayer printed wiring board with a metal thin layer, wherein the metal thin layer according to claim 1 is copper.
ント配線板用層間接着フィルムを内層回路板にラミネー
トし、硬化させることを特徴とする多層プリント配線
板、及びその製造法。5. A multilayer printed wiring board, comprising laminating the interlayer adhesive film for a multilayer printed wiring board with a thin metal layer according to claim 1 to an inner layer circuit board and curing the same, and a method for producing the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8110734A JPH09296156A (en) | 1996-05-01 | 1996-05-01 | Thin metal layer-having interlayer adhesive film for multilayered printed wiring board, and multilayered printed wiring board using the same and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8110734A JPH09296156A (en) | 1996-05-01 | 1996-05-01 | Thin metal layer-having interlayer adhesive film for multilayered printed wiring board, and multilayered printed wiring board using the same and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09296156A true JPH09296156A (en) | 1997-11-18 |
Family
ID=14543170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8110734A Pending JPH09296156A (en) | 1996-05-01 | 1996-05-01 | Thin metal layer-having interlayer adhesive film for multilayered printed wiring board, and multilayered printed wiring board using the same and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09296156A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001059023A1 (en) * | 2000-02-08 | 2001-08-16 | Ajinomoto Co., Inc. | Adhesive film and method for manufacturing multilayer printed wiring board |
| JP2002314247A (en) * | 2001-04-13 | 2002-10-25 | Hitachi Chem Co Ltd | Multilayer printed wiring board and its manufacturing method |
| JP2008016520A (en) * | 2006-07-04 | 2008-01-24 | Nitto Denko Corp | Method of manufacturing through-hole and wiring circuit board |
| US7338884B2 (en) * | 2001-09-03 | 2008-03-04 | Nec Corporation | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
| US7758222B2 (en) * | 2001-01-18 | 2010-07-20 | Ventra Greenwich Holdings Corp. | Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
| KR20110046572A (en) | 2008-08-29 | 2011-05-04 | 아지노모토 가부시키가이샤 | Metal film attachment film |
| KR20110053374A (en) | 2008-08-29 | 2011-05-20 | 아지노모토 가부시키가이샤 | Method for manufacturing circuit board |
| US8357443B2 (en) | 2007-03-01 | 2013-01-22 | Ajinomoto Co., Inc. | Laminate including water soluble release layer for producing circuit board and method of producing circuit board |
| US8584352B2 (en) | 2008-02-27 | 2013-11-19 | Ajinomoto Co., Inc. | Process for producing multilayer printed wiring board |
| JP2015077777A (en) * | 2013-10-14 | 2015-04-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Copper-clad laminate and method for producing the same |
| US11453823B2 (en) * | 2017-02-20 | 2022-09-27 | InkTee Co., Ltd. | Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite |
-
1996
- 1996-05-01 JP JP8110734A patent/JPH09296156A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001059023A1 (en) * | 2000-02-08 | 2001-08-16 | Ajinomoto Co., Inc. | Adhesive film and method for manufacturing multilayer printed wiring board |
| US7758222B2 (en) * | 2001-01-18 | 2010-07-20 | Ventra Greenwich Holdings Corp. | Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
| JP2002314247A (en) * | 2001-04-13 | 2002-10-25 | Hitachi Chem Co Ltd | Multilayer printed wiring board and its manufacturing method |
| US7338884B2 (en) * | 2001-09-03 | 2008-03-04 | Nec Corporation | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
| JP2008016520A (en) * | 2006-07-04 | 2008-01-24 | Nitto Denko Corp | Method of manufacturing through-hole and wiring circuit board |
| US8357443B2 (en) | 2007-03-01 | 2013-01-22 | Ajinomoto Co., Inc. | Laminate including water soluble release layer for producing circuit board and method of producing circuit board |
| US8584352B2 (en) | 2008-02-27 | 2013-11-19 | Ajinomoto Co., Inc. | Process for producing multilayer printed wiring board |
| KR20110046572A (en) | 2008-08-29 | 2011-05-04 | 아지노모토 가부시키가이샤 | Metal film attachment film |
| KR20110053374A (en) | 2008-08-29 | 2011-05-20 | 아지노모토 가부시키가이샤 | Method for manufacturing circuit board |
| JP2015077777A (en) * | 2013-10-14 | 2015-04-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Copper-clad laminate and method for producing the same |
| US11453823B2 (en) * | 2017-02-20 | 2022-09-27 | InkTee Co., Ltd. | Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite |
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