JPH09277140A - Method of printed board drilling - Google Patents
Method of printed board drillingInfo
- Publication number
- JPH09277140A JPH09277140A JP9422296A JP9422296A JPH09277140A JP H09277140 A JPH09277140 A JP H09277140A JP 9422296 A JP9422296 A JP 9422296A JP 9422296 A JP9422296 A JP 9422296A JP H09277140 A JPH09277140 A JP H09277140A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- boring
- drilling
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板の穴
明け加工、特に、ブラインドホールの加工に好適なプリ
ント基板の穴明け加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for boring a printed circuit board, and more particularly to a method for boring a printed circuit board suitable for processing blind holes.
【０００２】[0002]
【従来の技術】プリント基板は、配線や部品の実装の高
密度化に伴って多層化が進められている。この多層化を
達成するためには、各層間を接続するための止まり穴
（ブラインドホール）を±０．０５ｍｍ以下の高い加工
精度で加工する必要がある。このような加工装置が、例
えば特開平２−２４３２１０号公報に示されている。そ
のような加工装置の概略を図３により説明する。2. Description of the Related Art Printed circuit boards are being multilayered as wiring and components are mounted at higher densities. In order to achieve this multi-layering, it is necessary to process blind holes for connecting the layers with a high processing accuracy of ± 0.05 mm or less. Such a processing device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2-243210. An outline of such a processing apparatus will be described with reference to FIG.
【０００３】図３は従来の穴明け機の構成を説明する図
である。この図で、１はテーブル、２はテーブル１に載
置されたプリント基板、３はテーブル１の所定位置に設
けられたドリル保持装置、４はドリル高さ検出装置であ
る。５は穴明け機を示す。穴明け機５は、スピンドル支
持体（スピンドルキャリッジ）５０、このスピンドルキ
ャリッジ５０に支持されたスピンドル５１、スピンドル
ユニット５２、スピンドルユニット５２の回転先端に装
着されたドリル５３、スピンドルキャリッジ５０に支持
されたエアシリンダ５４、このエアシリンダ５４のロッ
ドに結合された基板抑え部５５とその先端５５１、基板
抑え部５５に固定された棒体５６１の変位を検出するリ
ニアスケール５６、スピンドルキャリッジ５０をＺ軸方
向（図で上下方向）に駆動するＺ軸駆動モータ５７、Ｚ
軸駆動ボールスクリュー５８、および制御装置５９で構
成されている。FIG. 3 is a diagram for explaining the structure of a conventional punching machine. In this figure, 1 is a table, 2 is a printed circuit board mounted on the table 1, 3 is a drill holding device provided at a predetermined position of the table 1, and 4 is a drill height detecting device. Reference numeral 5 indicates a hole punching machine. The hole punching machine 5 is supported by a spindle support (spindle carriage) 50, a spindle 51 supported by the spindle carriage 50, a spindle unit 52, a drill 53 attached to the rotating tip of the spindle unit 52, and a spindle carriage 50. The air cylinder 54, the substrate holding portion 55 connected to the rod of the air cylinder 54 and its tip 551, the linear scale 56 for detecting the displacement of the rod body 561 fixed to the substrate holding portion 55, and the spindle carriage 50 are set in the Z-axis direction. Z-axis drive motors 57 and Z that are driven (up and down direction in the figure)
It is composed of an axial drive ball screw 58 and a control device 59.
【０００４】穴明け加工において、最初、スピンドルユ
ニット５２の先端が、ドリル保持装置３の所望のドリル
上に位置するようにスピンドルキャリッジ５０が駆動さ
れ、次いでＺ軸駆動モータ５７によりスピンドルキャリ
ッジ５０が下降され、所望のドリルがスピンドルユニッ
ト先端に装着される。次いで、スピンドルキャリッジ５
０がドリル高さ検出装置４の上へ移行され、Ｚ軸駆動モ
ータ５７により下降される。やがて基板抑え板５５の先
端５５１がドリル高さ検出装置４の上端に当接するが、
Ｚ軸駆動モータ５７はさらに駆動を継続する。これによ
り、エアシリンダ５４のロッドは縮んでゆき、一方、棒
体５６１は相対的にリニアスケール５６内で上方へ移動
する。リニアスケール５６は棒体５６１の移動の瞬間か
ら、移動量に応じたパルスを制御装置５９へ出力する。In drilling, first, the spindle carriage 50 is driven so that the tip of the spindle unit 52 is positioned on the desired drill of the drill holding device 3, and then the spindle carriage 50 is lowered by the Z-axis drive motor 57. Then, a desired drill is attached to the tip of the spindle unit. Then, the spindle carriage 5
0 is moved to the top of the drill height detecting device 4 and lowered by the Z-axis drive motor 57. Eventually, the tip 551 of the substrate holding plate 55 comes into contact with the upper end of the drill height detecting device 4,
The Z-axis drive motor 57 continues to be driven. As a result, the rod of the air cylinder 54 shrinks, while the rod 561 relatively moves upward in the linear scale 56. The linear scale 56 outputs a pulse corresponding to the movement amount to the control device 59 from the moment the rod body 561 moves.
【０００５】ドリル高さ検出装置４は、その上端から所
定距離Ｌ2 の位置に発光源とこれに対向する受光器とを
有し、上記スピンドルキャリッジ５０の下降により、装
着されたドリル５３の先端が発光源からの光を遮った瞬
間に制御装置５９へ信号を出力し、制御装置５９は当該
信号の入力時点におけるリニアスケール５６の出力信号
Ｌを採取する。この信号Ｌは、基板抑え板５５の先端５
５１がドリル高さ検出装置４の上端に当接した後、ドリ
ル５３の先端が発光源に達するまでの距離であるので、
ドリル５３の先端から基板抑え板５５の先端５５１まで
の距離をＬ1 とすると、 Ｌ ＝Ｌ1 ＋Ｌ2 …………（１） で表わされ、この式から距離Ｌ1 は、 Ｌ1 ＝Ｌ−Ｌ2 …………（２） となる。The drill height detecting device 4 has a light emitting source and a light receiving device facing the light emitting device at a position at a predetermined distance L 2 from the upper end thereof, and by lowering the spindle carriage 50, the tip of the drill 53 mounted. A signal is output to the control device 59 at the moment when the light from the light emitting source is blocked, and the control device 59 samples the output signal L of the linear scale 56 at the time of inputting the signal. This signal L is applied to the tip 5 of the board holding plate 55.
Since 51 is the distance until the tip of the drill 53 reaches the light emission source after the contact with the upper end of the drill height detection device 4,
If the distance from the tip of the drill 53 to the tip 551 of the substrate holding plate 55 is L 1 , then L = L 1 + L 2 (1), and from this equation, the distance L 1 is L 1 = LL 2 (2)
【０００６】この状態で、スピンドルキャリッジ５０は
最初の加工位置へ移動され、Ｚ軸駆動モータ５７により
下降され、基板抑え板５５の先端５５１がプリント基板
２の表面に当接した状態でさらに下降され、エアシリン
ダ５４のロッドを縮めながら回転しているドリル５３に
よりブラインドホール２１を加工成形する。この場合、
ブラインドホール２１の深さＬ3 は制御装置５９に指令
値として入力されており、制御装置５９は、さきに求め
られた距離Ｌ1 を用いて、リニアスケール５６が距離
（Ｌ1 ＋Ｌ3 ）に相当するパルスを出力するまでＺ軸駆
動モータ５７を駆動する。これにより、所要の距離Ｌ3
の深さのブラインドホール２１を正確に明けることがで
きる。In this state, the spindle carriage 50 is moved to the first processing position, lowered by the Z-axis drive motor 57, and further lowered with the tip 551 of the substrate holding plate 55 in contact with the surface of the printed circuit board 2. The blind hole 21 is processed and formed by the drill 53 rotating while the rod of the air cylinder 54 is contracted. in this case,
The depth L 3 of the blind hole 21 is input to the control device 59 as a command value, and the control device 59 uses the distance L 1 obtained earlier to set the linear scale 56 to the distance (L 1 + L 3 ). The Z-axis drive motor 57 is driven until the corresponding pulse is output. As a result, the required distance L 3
The blind hole 21 with the depth of can be accurately opened.
【０００７】この穴明け加工が終了すると、制御装置５
９はＺ軸駆動モータ５７を駆動して基板抑え板５５の先
端５５１を基準位置Ｌ0 まで引上げ、次いでスピンドル
キャリッジ５０を次の穴加工位置の上まで移動させ、上
記と同様にして当該穴の加工を行なう。この穴の加工が
終了すると、制御装置５９は再び基板抑え板５５の先端
５５１を基準位置Ｌ0 まで引上げ、スピンドルキャリッ
ジ５０を次の穴加工位置の上まで移動させる。このよう
な動作を繰り返してプリント基板２に所要の穴加工を施
す。When the boring process is completed, the control device 5
9 drives the Z-axis drive motor 57 to pull up the front end 551 of the substrate holding plate 55 to the reference position L 0 , and then moves the spindle carriage 50 to the position above the next hole processing position. Perform processing. When the processing of this hole is completed, the control device 59 again raises the tip 551 of the substrate holding plate 55 to the reference position L 0 , and moves the spindle carriage 50 to the position above the next hole processing position. By repeating such an operation, required holes are formed in the printed circuit board 2.
【０００８】[0008]
【発明が解決しようとする課題】ところで、プリント基
板２の表面には、種々の傷が存在し、又、既加工穴のバ
リや切り粉、ゴミ等が付着している。このため、穴の加
工時、基板抑え板５５の先端５５１がプリント基板２に
当接したとき、両者の間に上記傷やバリ等が介在する
と、その分だけ穴の深さの寸法に誤差が生じる。このよ
うな誤差は、特にブラインドホールの場合、後刻、当該
ブラインドホールの内壁に導体を塗布してプリント基板
２の表面導体と中間層の導体との間の電気的接続を行な
う場合に、当該電気的接続が得られなくなる事態を生じ
ることとなる。そして、このような導通不良が１つでも
発生するとプリント基板の加工不良となり、加工不良個
所は加工工程終了後の後工程でしか発見することができ
ず、その発見には長時間を要し、生産効率を低下させて
いた。By the way, various scratches are present on the surface of the printed circuit board 2, and burrs, swarf, dust, etc. of the processed holes are attached. Therefore, when the tip 551 of the board holding plate 55 contacts the printed circuit board 2 during processing of the hole, if the above-mentioned scratches or burrs are present between the two, an error in the depth of the hole will occur. Occurs. Such an error is particularly caused in the case of a blind hole when the conductor is applied to the inner wall of the blind hole later to make an electrical connection between the surface conductor of the printed circuit board 2 and the conductor of the intermediate layer. This will cause a situation in which the physical connection cannot be obtained. If even one such conduction failure occurs, the printed circuit board becomes defective, and the defective portion can be found only in a post-process after the end of the working process, and it takes a long time to find it. It had reduced production efficiency.
【０００９】本発明の目的は、上記従来技術における課
題を解決し、加工中に加工不良を防止することができる
プリント基板の穴明け加工方法を提供することにある。An object of the present invention is to solve the above-mentioned problems in the prior art and to provide a method of drilling a printed circuit board, which is capable of preventing processing defects during processing.
【００１０】[0010]
【課題を解決するための手段】上記の目的を達成するた
め、請求項１記載の発明は、プリント基板を載置したテ
ーブルと、このテーブルに対向して配置された支持体
と、この支持体に支持されて回転するスピンドルと、こ
のスピンドルの先端に装着されたドリルと、前記支持体
にシリンダを介して連結された基板抑え板と、前記支持
体が下降して前記基板抑え板の先端が前記プリント基板
の表面に当接したときこれを検出するセンサとを備えた
穴明機を用いて前記プリント基板に多数の穴明けを行な
うプリント基板の穴明け加工方法において、穴明け予定
位置における前記プリント基板の表面高さを検出し、当
該穴明け予定位置直前の穴明け位置から順に所定数だけ
さかのぼった各穴明け位置の表面高さの平均値を演算
し、当該穴明け位置の表面高さと前記平均値とを比較
し、両者の差が所定値未満であるときには穴明け加工を
実施して次の穴明け予定位置へ移動し、両者の差が所定
値以上であるときには加工を停止することを特徴とす
る。In order to achieve the above object, the invention according to claim 1 has a table on which a printed circuit board is mounted, a support arranged to face the table, and the support. A spindle which is supported and rotated by a spindle, a drill which is attached to the tip of the spindle, a substrate holding plate which is connected to the supporting body through a cylinder, and the supporting body which descends so that the tip of the substrate holding plate is lowered. In a method for boring a printed circuit board, wherein a large number of holes are formed in the printed circuit board by using a hole punching machine equipped with a sensor that detects when the printed circuit board comes into contact with the surface of the printed circuit board. The surface height of the printed circuit board is detected, and the average value of the surface heights of the respective drilling positions, which are traced back by a predetermined number from the drilling position immediately before the planned drilling position, is calculated to calculate the average of the drilling positions. The surface height and the average value are compared, and when the difference between the two is less than a predetermined value, drilling is performed to move to the next planned drilling position, and when the difference between the two is more than the predetermined value, the machining is performed. It is characterized by stopping.
【００１１】又、請求項２記載の発明は、請求項１記載
のプリント基板の穴明け加工方法において、前記プリン
ト基板を複数の領域に分割し、予め各領域毎に前記所定
値を定め、穴明け予定位置の表面高さと前記平均値との
差を比較する所定値は、当該穴明け予定位置が属する領
域の所定値を用いることを特徴とする。According to a second aspect of the present invention, in the method of boring a printed circuit board according to the first aspect, the printed circuit board is divided into a plurality of areas, and the predetermined value is set for each area in advance. The predetermined value for comparing the difference between the surface height of the planned opening position and the average value is characterized by using the predetermined value of the region to which the planned opening position belongs.
【００１２】さらに、請求項３記載の発明は、請求項１
記載のプリント基板の穴明け加工方法において、前記次
の穴明け位置への移動距離が所定の距離以上であると
き、再度、前記平均値の演算、および穴明け予定位置の
表面高さと当該平均値の差と前記所定値との比較を行な
うことを特徴とする。Further, the invention according to claim 3 is the invention according to claim 1.
In the method for boring a printed circuit board as described above, when the movement distance to the next boring position is a predetermined distance or more, again, the calculation of the average value, and the surface height of the planned boring position and the average value. Is compared with the predetermined value.
【００１３】[0013]
【発明の実施の形態】以下、本発明を図示の実施の形態
に基づいて説明する。図１は穴明け機の制御装置の動作
を説明するフローチャートである。本実施の形態におい
て用いられる穴明け機は、図３に示す制御装置の制御内
容の一部が異なるのみで、他の構成は図３に示す構成と
同じである。本実施の形態でも、ドリル保持装置３にお
ける所望のドリルを装着する動作、およびドリル高さ検
出装置４における装着ドリルの先端と基板抑え板５５の
先端５５１との間の距離Ｌ1 の検出動作は同じである。
制御装置は、穴加工の数ｎを「１」として（図１に示す
手順Ｓ1 ）最初の穴の加工位置へスピンドルキャリッジ
５０を移動させる（手順Ｓ2 ）。このとき、基板抑え板
５５の先端５５１は基準位置Ｌ0 にある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. FIG. 1 is a flow chart for explaining the operation of the control device for the punching machine. The punching machine used in the present embodiment is the same as the configuration shown in FIG. 3 except for a part of the control contents of the control device shown in FIG. Also in this embodiment, the operation of mounting a desired drill in the drill holding device 3 and the operation of detecting the distance L 1 between the tip of the mounted drill and the tip 551 of the substrate holding plate 55 in the drill height detecting device 4 are performed. Is the same.
The control device sets the number n of hole machining to “1” (procedure S 1 shown in FIG. 1 ) and moves the spindle carriage 50 to the machining position of the first hole (procedure S 2 ). At this time, the front end 551 of the substrate holding plate 55 is at the reference position L 0 .
【００１４】次いで制御装置は、当該加工位置のプリン
ト基板２の表面高さＺn を検出する（手順Ｓ3 ）。な
お、この場合の「Ｚn 」は、手順Ｓ1 の処理で、ｎ＝１
とされているので、第１番目の表面高さＺ1 を意味す
る。この表面高さの検出は、制御装置がＺ軸駆動モータ
５７に下降指令を出力して、基板抑え板５５の先端５５
１がプリント基板２の表面に当接しリニアスケール５０
から最初の信号が出力されるまでの間にスピンドルキャ
リッジ５０が移動した距離、即ち加工位置における基準
位置Ｌ0 からプリント基板２の表面までの距離であり、
制御装置により検出される。Next, the control device detects the surface height Z n of the printed circuit board 2 at the processing position (step S 3 ). Incidentally, "Z n" in this case, the processing of Step S 1, n = 1
Therefore, it means the first surface height Z 1 . To detect the surface height, the control device outputs a descending command to the Z-axis drive motor 57, and the tip 55 of the substrate holding plate 55 is detected.
1 contacts the surface of the printed circuit board 2 and the linear scale 50
From the reference position L 0 at the processing position to the surface of the printed circuit board 2,
Detected by the controller.
【００１５】次に、制御装置は、ｎが所定の数Ｎ（例え
ば「５」）以上か否か判断し（手順Ｓ4 ）、この場合、
最初の加工位置であるので、ｎ＜Ｎであり、次いで手順
Ｓ5の処理で数ｎが所定数Ｎと等しいか否か判断し（手
順Ｓ5 ）、等しくないので処理を手順Ｓ6 に移行させて
当該第１番目の穴明け加工を行なう（手順Ｓ6 ）。次
に、全部の穴加工が終了したか否か判断し（手順Ｓ
7 ）、未了であるので、処理を手順Ｓ8 に移行させる。
手順Ｓ8 の処理では、スピンドルキャリッジ５０を次の
加工位置へ移動させ、次いで数ｎに「１」を足し（手順
Ｓ9 ）、ｎを「２」として、この第２番目の加工位置が
第１番目の加工位置とは異なる領域となったか否か判断
する（手順Ｓ10）。なお、上記「領域」については後述
する。今、当該領域は変わらないとすると、制御装置は
処理を手順Ｓ3 へ戻す。Next, the control unit, n is a predetermined number N (for example, "5") or whether it is determined (Step S 4), in this case,
Since the first processing position, n <N, and then proceeds the number n in the processing of Step S 5 it is determined whether or not equal to the predetermined number N (Step S 5), the process since not equal to Step S 6 It is allowed to perform the first-th drilling (Step S 6). Next, it is determined whether or not all the holes have been drilled (step S
7 ) Since it has not been completed, the process proceeds to step S 8 .
In the processing of steps S 8 moves the spindle carriage 50 to the next processing position, then adding "1" to the number n (Step S 9), the n as "2", the second second processing position is first determining whether a region different from the first machining position (Step S 10). The "area" will be described later. Now, assuming that the area does not change, the control device returns the process to step S 3 .
【００１６】このようにして、手順Ｓ3 〜Ｓ10の処理が
繰り返され、やがて手順Ｓ5 の処理で、数ｎが所定数Ｎ
に等しいと判断されると、制御装置は、それまでに検出
されたＮ個の表面高さの平均値Ｚm の演算を行なう（手
順Ｓ11）。この演算式を下記に示す。 Ｚm ＝（Ｚ1 ＋Ｚ2 ＋Ｚ3 ＋…………＋ＺN ）／Ｎ…………（３） 次いで制御装置は、それまでに得られた各表面高さＺ
1 、Ｚ2 、Ｚ3 、…………、ＺN と平均値Ｚm との差の
絶対値を演算し、それらが所定値δ未満か否かを判断す
る（手順Ｓ12）。所定値δ未満であれば、それまでのＮ
個の穴明け加工が所定のものであったと判断して、処理
を手順Ｓ8 へ移行する。又、１つでも所定値δ以上の値
がある場合には、それらの穴明け加工において、基板抑
え板５５の先端５５１とプリント基板表面との間にゴミ
等が介在した状態で穴明け加工が行なわれたと判断し、
穴明け機の駆動を一旦停止させ（手順Ｓ13）、所定値δ
以上の値となる穴明け加工についてチェックを行ない、
不良原因を排除した後、再び穴明け加工を続行する。In this way, the processes of steps S 3 to S 10 are repeated, and eventually, in the process of step S 5 , the number n becomes the predetermined number N.
If it is determined that the average value Z m is equal to, the controller calculates the average value Z m of the N surface heights detected so far (step S 11 ). This arithmetic expression is shown below. Z m = (Z 1 + Z 2 + Z 3 + ………… + Z N ) / N (3) Then, the control device controls the surface heights Z obtained so far.
The absolute value of the difference between 1 , Z 2 , Z 3 , ..., Z N and the average value Z m is calculated, and it is determined whether or not they are less than the predetermined value δ (step S 12 ). If less than the predetermined value δ, then N
When it is determined that the drilling of the individual pieces is the predetermined one, the process proceeds to step S 8 . In addition, if even one has a value equal to or greater than the predetermined value δ, in the drilling process, the drilling process is performed with dust or the like interposed between the tip 551 of the substrate holding plate 55 and the printed circuit board surface. Judging that it was done,
Temporarily stops driving the drilling machine (Step S 13), the predetermined value δ
Check the drilling process with the above values,
After eliminating the cause of the defect, continue drilling.
【００１７】手順Ｓ12の処理で、Ｎ個の穴明け加工が所
定のものであったと判断された場合、手順Ｓ8 〜Ｓ10、
Ｓ3 の処理を経て、手順Ｓ4 の処理でｎ＞Ｎと判断さ
れ、処理は手順Ｓ14へ移行する。手順Ｓ14の処理では、
第（Ｎ＋１）番目の加工位置に対して手順Ｓ3 の処理で
検出した表面高さＺn （ｎ＝Ｎ＋１）と手順Ｓ11の処理
で算出した平均値Ｚm との差の絶対値を演算し、これが
所定値δ未満であるか否か判断する（手順Ｓ14）。所定
値δ以上である場合には処理を手順Ｓ13へ移行させて機
械を停止させ、所定値δ未満であればゴミ等が介在して
いない状態であると判断して第（Ｎ＋１）番目の穴明け
加工を行なう（手順Ｓ15）。[0017] In process step S 12, if the N drilling is determined to be of a predetermined procedure S 8 to S 10,
After the process of S 3 , it is determined that n> N in the process of step S 4 , and the process proceeds to step S 14 . In the process of step S 14 ,
The absolute value of the difference between the surface height Z n (n = N + 1) detected in the process of step S 3 and the average value Z m calculated in the process of step S 11 is calculated for the (N + 1) th processing position. and, it is determined whether or not less than a predetermined value [delta] (Step S 14). If it is greater than or equal to the predetermined value δ, the process proceeds to step S 13 to stop the machine, and if it is less than the predetermined value δ, it is determined that dust or the like is not present, and the (N + 1) th performing drilling (Step S 15).
【００１８】次いで、制御装置は、全部の加工が終了し
たか否か判断し（手順Ｓ16）、終了していなければ再び
表面高さの平均値Ｚm の演算を行なう（手順Ｓ17）。こ
の場合の平均値Ｚm の演算は、第（Ｎ＋１）番目の表面
高さから順にさかのぼるＮ個の表面高さの平均値であ
る。この場合は、第２番目〜第（Ｎ＋１）番目の表面高
さの平均値である。次いで、制御装置は、手順Ｓ8 、Ｓ
9 、Ｓ10、Ｓ3 、Ｓ4 、Ｓ14、Ｓ15、Ｓ16、Ｓ17、Ｓ8
の処理を順次繰り返して実行する。この繰り返し処理に
おいて、手順Ｓ17の平均値Ｚm の演算処理は、直前に穴
明け加工した加工位置の表面高さから順にさかのぼるＮ
個の表面高さの平均値の演算となる。Next, the control device judges whether or not all the machining is completed (step S 16 ), and if not completed, the average value Z m of the surface height is calculated again (step S 17 ). The calculation of the average value Z m in this case is an average value of N surface heights that are traced back from the (N + 1) th surface height. In this case, it is an average value of the second to (N + 1) th surface heights. Then, the control device performs steps S 8 and S
9 , S 10 , S 3 , S 4 , S 14 , S 15 , S 16 , S 17 , S 8
The process of is repeatedly executed in sequence. In this iterative process, the process of calculating the average value Z m in step S 17 is performed N starting from the surface height of the machining position where the immediately preceding drilling process was performed.
This is the calculation of the average value of the surface height of each piece.
【００１９】このように、本実施の形態では、穴明け加
工終了毎に、その直前から順にＮ個さかのぼる表面高さ
の平均値を算出し、穴明け位置に移動する毎に、その位
置の表面高さと平均値の差が所定値δ以下か否か判断す
るようにしたので、基板抑え板５５の先端５５１とプリ
ント基板表面との間にゴミ等が介在した状態での穴明け
加工を防止することができ、加工中でも加工不良を防止
することができる。As described above, in the present embodiment, each time the boring process is completed, the average value of the surface heights dating back from the last N is calculated, and every time the boring position is moved, the surface at that position is moved. Since it is determined whether or not the difference between the height and the average value is less than or equal to the predetermined value δ, it is possible to prevent the drilling process in the state where dust or the like is present between the tip 551 of the board holding plate 55 and the surface of the printed board. It is possible to prevent processing defects even during processing.
【００２０】次に、上記フローチャートにおける手順Ｓ
10の「領域」について、図２を参照して説明する。図２
はプリント基板２の平面図である。通常、プリント基板
は異なる材料を貼り合わせて作成されているので、全体
にうねりや厚さの不均一が存在する。特に、このような
うねりや厚さの不均一は、プリント基板が大きくなるほ
ど増大する。したがって、上記の処理のように、加工位
置の表面高さを順次それまでの平均値と比較してゆく手
段では、次の加工位置が現在の加工位置から大きく離れ
ている場合、両位置におけるうねりや厚さに可成りの差
があることが多く、このような差があると、次の加工位
置の表面高さと平均値との差が所定値δを超えると判断
され、加工が可能であるにもかかわらず加工不能として
穴明け機を停止してしまう場合が生じ、生産効率が著し
く低下する。Next, step S in the above flow chart.
The "area" of 10 will be described with reference to FIG. FIG.
FIG. 3 is a plan view of the printed circuit board 2. Usually, since the printed circuit board is made by bonding different materials, there are undulations and non-uniformity of thickness on the whole. In particular, such waviness and nonuniformity in thickness increase as the printed circuit board becomes larger. Therefore, as in the above processing, when the surface height at the processing position is sequentially compared with the average value up to that point, when the next processing position is far from the current processing position, the undulations at both positions There is often a considerable difference in thickness and thickness, and if there is such a difference, it is judged that the difference between the surface height at the next processing position and the average value exceeds the predetermined value δ, and processing is possible. Nevertheless, there is a case where the punching machine is stopped because it cannot be processed, and the production efficiency is significantly reduced.
【００２１】そこで、本実施の形態では、図２に示すよ
うに、プリント基板２を複数個の領域、図では領域Ａ〜
Ｐの１６の領域に分割し、いずれかの領域を基準とし、
この領域に対する他の各領域のうねりや厚さの差を測定
しておき、この差に基づいて各領域の所定値δを設定
し、これを制御装置のメモリに記憶しておく。そして、
加工位置が領域を超える毎に、所定値δを移動先の領域
の所定値に変更する。即ち、制御装置は、図１に示すフ
ローチャートにおいて、手順Ｓ8 の処理でスピンドルキ
ャリッジ５０を次の加工位置へ移動させ、手順Ｓ9 の処
理で加工位置の番号を変更させた後、手順Ｓ10の処理で
次の加工位置の領域が、その直前の加工位置の領域と変
わったか否か判断する。変わったと判断した場合には、
次の加工位置の領域の所定値δをメモリから取り出し
（手順Ｓ18）、それまでの所定値δと入替え（手順
Ｓ19）た後、処理を手順Ｓ3 へ移行させる。Therefore, in the present embodiment, as shown in FIG. 2, the printed circuit board 2 is provided in a plurality of regions, that is, regions A to A in the figure.
Divide into 16 areas of P, and use either area as a reference,
A difference in swell and thickness of each of the other regions with respect to this region is measured, a predetermined value δ of each region is set based on the difference, and this is stored in the memory of the control device. And
Every time the machining position exceeds the area, the predetermined value δ is changed to the predetermined value of the destination area. That is, the control device, in the flowchart shown in FIG. 1, a spindle carriage 50 is moved to the next processing position by the processing in steps S 8, after change the number of the processing position in the processing of steps S 9, Step S 10 It is determined whether or not the area of the next processing position has been changed to the area of the processing position immediately before by the processing. If you judge that it has changed,
The predetermined value δ of the area of the next processing position is taken out from the memory (step S 18 ), replaced with the predetermined value δ so far (step S 19 ), and then the process proceeds to step S 3 .
【００２２】このようにしたので、移動距離が大きく、
プリント基板２のうねりや厚さの不均一が生じることに
なっても、加工不能として穴明け機を停止してしまうこ
とはなく、生産効率を低下させることはない。Since this is done, the movement distance is large,
Even if the printed circuit board 2 becomes wavy or has a non-uniform thickness, it does not stop the drilling machine because it cannot be machined, and does not reduce the production efficiency.
【００２３】なお、上記のうねりや厚さの不均一に対応
するには、領域を定める手段以外に次のような手段もあ
る。即ち、現在の加工位置から次の加工位置までの距離
が所定の距離以上であるとき、それまでに得られた平均
値Ｚm を捨て、新たに最初からＮ個の表面高さの平均値
をとり、この平均値と加工位置の表面高さとの差を所定
値δと比較するようにしてもよい。この手段では、領域
を定めて予め各領域のうねりや厚さの不均一を測定する
必要がなく、その分の手間と時間を省くことができる。Incidentally, in order to deal with the above-mentioned undulations and non-uniformity of thickness, there are the following means other than the means for defining the region. That is, when the distance from the current processing position to the next processing position is equal to or greater than the predetermined distance, the average value Z m obtained up to that point is discarded and a new average value of N surface heights from the beginning is newly calculated. Alternatively, the difference between the average value and the surface height at the processing position may be compared with the predetermined value δ. With this means, it is not necessary to determine the regions and measure the undulations and the nonuniformity of the thickness of each region in advance, and the labor and time can be saved.
【００２４】なお又、プリント基板２が小型のサイズの
ものである場合には、上記うねりや厚さの不均一は極め
て僅かで無視できる程度の場合が多いので、うねりや厚
さの不均一に対処する手段を講じなくてもよいのは明ら
かである。If the printed circuit board 2 is of a small size, the above-mentioned undulations and uneven thickness are often negligible and negligible. Obviously, no action need be taken.
【００２５】[0025]
【発明の効果】以上述べたように、本発明では、穴明け
加工終了毎に、その直前から順にＮ個さかのぼる表面高
さの平均値を算出し、穴明け位置に移動する毎に、その
位置の表面高さと平均値の差が所定値δ未満か否か判断
するようにしたので、基板抑え板の先端とプリント基板
表面との間にゴミ等が介在した状態での穴明け加工を防
止することができ、加工中でも加工不良を防止すること
ができる。又、プリント基板のうねりや厚さの不均一を
考慮した処理を行なうようにすることにより、不必要な
機械の停止を防止することができる。As described above, in the present invention, an average value of N surface heights dating from immediately before that is calculated each time the boring process is completed, and the position is calculated each time the boring position is moved. Since it is determined whether the difference between the surface height and the average value is less than the predetermined value δ, it is possible to prevent the drilling process when dust or the like is present between the tip of the board holding plate and the printed circuit board surface. It is possible to prevent processing defects even during processing. Further, by performing the processing in consideration of the undulation of the printed circuit board and the nonuniformity of the thickness, it is possible to prevent unnecessary stoppage of the machine.
【図１】穴明け機の制御装置の動作を説明するフローチ
ャートである。FIG. 1 is a flowchart illustrating an operation of a control device for a punching machine.
【図２】プリント基板の平面図である。FIG. 2 is a plan view of a printed circuit board.
【図３】従来の穴明け機の構成を説明する図である。FIG. 3 is a diagram illustrating a configuration of a conventional punching machine.
Ｓ1 〜Ｓ19 処理手順S 1 to S 19 processing procedure
Claims (3)
のテーブルに対向して配置された支持体と、この支持体
に支持されて回転するスピンドルと、このスピンドルの
先端に装着されたドリルと、前記支持体にシリンダを介
して連結された基板抑え板と、前記支持体が下降して前
記基板抑え板の先端が前記プリント基板の表面に当接し
たときこれを検出するセンサとを備えた穴明機を用いて
前記プリント基板に多数の穴明けを行なうプリント基板
の穴明け加工方法において、穴明け予定位置における前
記プリント基板の表面高さを検出し、当該穴明け予定位
置直前の穴明け位置から順に所定数だけさかのぼった各
穴明け位置の表面高さの平均値を演算し、当該穴明け位
置の表面高さと前記平均値とを比較し、両者の差が所定
値未満であるときには穴明け加工を実施して次の穴明け
予定位置へ移動し、両者の差が所定値以上であるときに
は加工を停止することを特徴とするプリント基板の穴明
け加工方法。1. A table on which a printed circuit board is placed, a support arranged to face the table, a spindle supported by the support to rotate, and a drill attached to the tip of the spindle. A hole provided with a substrate holding plate connected to the supporting body via a cylinder, and a sensor for detecting when the supporting body descends and the tip of the substrate holding plate comes into contact with the surface of the printed circuit board. In a method for boring a printed circuit board, which performs a large number of holes in the printed circuit board using a drilling machine, the surface height of the printed circuit board at the planned boring position is detected, and the boring position immediately before the planned boring position is obtained. The average value of the surface heights of the respective drilling positions traced back by a predetermined number from the above is calculated, and the surface height of the drilling positions and the average value are compared, and when the difference between the two is less than the predetermined value. Is a method for boring a printed circuit board, which performs boring processing, moves to the next planned boring position, and stops the processing when the difference between the two is a predetermined value or more.
工方法において、前記プリント基板を複数の領域に分割
し、予め各領域毎に前記所定値を定め、穴明け予定位置
の表面高さと前記平均値との差を比較する所定値は、当
該穴明け予定位置が属する領域の所定値を用いることを
特徴とするプリント基板の穴明け加工方法。2. The method for boring a printed circuit board according to claim 1, wherein the printed circuit board is divided into a plurality of areas, and the predetermined value is set in advance for each area, and the surface height at a planned drilling position and the surface height A method of punching a printed circuit board, wherein a predetermined value for comparing the difference with the average value is a predetermined value of a region to which the planned punching position belongs.
工方法において、前記次の穴明け位置への移動距離が所
定の距離以上であるとき、再度、前記平均値の演算、お
よび穴明け予定位置の表面高さと当該平均値の差と前記
所定値との比較を行なうことを特徴とするプリント基板
の穴明け加工方法。3. The method of boring a printed circuit board according to claim 1, wherein when the moving distance to the next boring position is a predetermined distance or more, the average value is calculated again and the boring schedule is set. A method of punching a printed circuit board, comprising: comparing a surface height at a position with a difference between the average value and the predetermined value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09422296A JP3375113B2 (en) | 1996-04-16 | 1996-04-16 | Drilling method for printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09422296A JP3375113B2 (en) | 1996-04-16 | 1996-04-16 | Drilling method for printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09277140A true JPH09277140A (en) | 1997-10-28 |
| JP3375113B2 JP3375113B2 (en) | 2003-02-10 |
Family
ID=14104298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09422296A Expired - Fee Related JP3375113B2 (en) | 1996-04-16 | 1996-04-16 | Drilling method for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3375113B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006263889A (en) * | 2005-03-25 | 2006-10-05 | Hitachi Via Mechanics Ltd | Printed circuit board processing machine |
| JP2011034501A (en) * | 2009-08-05 | 2011-02-17 | Fanuc Ltd | Numerical control device with machining head fall-preventing function |
| US7952050B2 (en) | 2006-09-21 | 2011-05-31 | Hitachi Via Mechanics, Ltd. | Drilling method and laser machining apparatus |
| JP2014113662A (en) * | 2012-12-10 | 2014-06-26 | Via Mechanics Ltd | Apparatus and method for drilling substrate |
| JP2015223686A (en) * | 2014-05-30 | 2015-12-14 | ビアメカニクス株式会社 | Substrate drilling device and substrate drilling method |
| JP2016016458A (en) * | 2014-07-04 | 2016-02-01 | ビアメカニクス株式会社 | Drilling device and drilling method |
| JP2017092259A (en) * | 2015-11-11 | 2017-05-25 | 大船企業日本株式会社 | Back drilling processing method and substrate processing apparatus in multilayer printed wiring board |
| JP2018099737A (en) * | 2016-12-19 | 2018-06-28 | ビアメカニクス株式会社 | Drill processing device and drill processing method |
| CN114158191A (en) * | 2021-11-19 | 2022-03-08 | 江门市浩远科技有限公司 | Punching method and punching system for flexible circuit board |
-
1996
- 1996-04-16 JP JP09422296A patent/JP3375113B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006263889A (en) * | 2005-03-25 | 2006-10-05 | Hitachi Via Mechanics Ltd | Printed circuit board processing machine |
| JP4620510B2 (en) * | 2005-03-25 | 2011-01-26 | 日立ビアメカニクス株式会社 | Printed circuit board processing machine |
| US7952050B2 (en) | 2006-09-21 | 2011-05-31 | Hitachi Via Mechanics, Ltd. | Drilling method and laser machining apparatus |
| JP2011034501A (en) * | 2009-08-05 | 2011-02-17 | Fanuc Ltd | Numerical control device with machining head fall-preventing function |
| JP2014113662A (en) * | 2012-12-10 | 2014-06-26 | Via Mechanics Ltd | Apparatus and method for drilling substrate |
| JP2015223686A (en) * | 2014-05-30 | 2015-12-14 | ビアメカニクス株式会社 | Substrate drilling device and substrate drilling method |
| JP2016016458A (en) * | 2014-07-04 | 2016-02-01 | ビアメカニクス株式会社 | Drilling device and drilling method |
| JP2017092259A (en) * | 2015-11-11 | 2017-05-25 | 大船企業日本株式会社 | Back drilling processing method and substrate processing apparatus in multilayer printed wiring board |
| JP2018099737A (en) * | 2016-12-19 | 2018-06-28 | ビアメカニクス株式会社 | Drill processing device and drill processing method |
| CN114158191A (en) * | 2021-11-19 | 2022-03-08 | 江门市浩远科技有限公司 | Punching method and punching system for flexible circuit board |
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| Publication number | Publication date |
|---|---|
| JP3375113B2 (en) | 2003-02-10 |
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