JPH09271937A - Joining device - Google Patents
Joining deviceInfo
- Publication number
- JPH09271937A JPH09271937A JP8508196A JP8508196A JPH09271937A JP H09271937 A JPH09271937 A JP H09271937A JP 8508196 A JP8508196 A JP 8508196A JP 8508196 A JP8508196 A JP 8508196A JP H09271937 A JPH09271937 A JP H09271937A
- Authority
- JP
- Japan
- Prior art keywords
- heater chip
- pressing surface
- heat
- coil
- thermocompression bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- General Induction Heating (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、被接合物を加圧し
ながら加熱する熱圧着ツールを用いてリフロソルダリン
グや熱圧着等を行う接合装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining device for performing reflow soldering, thermocompression bonding or the like using a thermocompression bonding tool for heating an object to be bonded while pressing it.
【０００２】[0002]
【従来の技術】従来より、被接合物を局部的に加熱する
ことによって薄膜基板等へのリード線の熱圧着や、プリ
ント基板へのＩＣリードのリフロソルダリングなどを行
う接合装置があり、この接合装置で用いられる局部加熱
法の１方式としてパルスヒート法がある。パルスヒート
法は、熱圧着ツールによって被接合物を加圧しながら、
この熱圧着ツールに大電流を流して、そこで発生するジ
ュール熱により被接合物（リフロソルダリングの場合に
は半田）を溶融させて接合を得るものである。2. Description of the Related Art Conventionally, there has been a bonding apparatus for locally heating an object to be bonded, such as thermocompression bonding of a lead wire to a thin film substrate or the like, and reflow soldering of an IC lead to a printed circuit board. A pulse heating method is one of the local heating methods used in the bonding apparatus. The pulse heat method, while pressurizing the objects to be joined with a thermocompression bonding tool,
A large current is passed through this thermocompression bonding tool, and the objects to be joined (solder in the case of reflow soldering) are melted by the Joule heat generated there to obtain a joint.
【０００３】図４は従来の熱圧着ツールの斜視図であ
り、１３は熱圧着ツールを接合装置に取り付けるための
給電端子である。この熱圧着ツールの下面が被接合物と
接触する押圧面であり、図４では集積回路等の多数のリ
ード線を一度に半田付けできるように四辺形をしている
が、被接合物の形状に応じた様々な形状がある。接合装
置は、この熱圧着ツールによって被接合物を加圧しなが
ら、熱圧着ツールの給電端子１３にパルス電流を流し
て、熱伝導によって被接合物を加熱する。FIG. 4 is a perspective view of a conventional thermocompression bonding tool, and 13 is a power supply terminal for attaching the thermocompression bonding tool to a joining device. The lower surface of this thermocompression bonding tool is a pressing surface that comes into contact with the article to be joined. In FIG. 4, the shape of the article to be joined is a quadrangle so that many lead wires of an integrated circuit or the like can be soldered at once. There are various shapes according to. The joining apparatus applies a pulse current to the power supply terminal 13 of the thermocompression bonding tool while pressing the object to be joined by the thermocompression bonding tool to heat the object to be bonded by heat conduction.
【０００４】したがって、良好な接合状態を得るために
は、押圧面ができるだけ広い範囲にわたって均一な温度
に保たれていることが望ましい。ところが、このような
熱圧着ツールでは、電流供給とツール保持のための給電
端子１３が必要なため、押圧面の熱が給電端子１３に逃
げる。これにより、給電端子１３に近い押圧面の温度が
低くなり、給電端子１３から遠い部分との間で温度の不
均一性が強くなる。よって、一定の許容温度範囲内に入
る押圧面の長さ（均熱長）が短くなり、一度に接合する
被接合物の各部において、接合状態にばらつきが生じ
る。例えば、リフロソルダリングの場合には半田付けの
状態が不均一となり、最悪の場合半田付け不良が発生す
る。Therefore, in order to obtain a good joining state, it is desirable that the pressing surface is kept at a uniform temperature over as wide a range as possible. However, in such a thermocompression bonding tool, since the power supply terminal 13 for supplying current and holding the tool is required, the heat of the pressing surface escapes to the power supply terminal 13. As a result, the temperature of the pressing surface close to the power supply terminal 13 becomes low, and the temperature nonuniformity between the pressing surface and the part far from the power supply terminal 13 becomes strong. Therefore, the length of the pressing surface (soaking length) that falls within a certain allowable temperature range becomes short, and the bonding state varies in each part of the objects to be bonded at one time. For example, in the case of reflow soldering, the soldering state becomes uneven, and in the worst case, soldering failure occurs.
【０００５】[0005]
【発明が解決しようとする課題】以上のように従来の接
合装置では、熱圧着ツールの押圧面の温度が不均一とな
り、被接合物の接合状態が不均一になるという問題点が
あった。本発明は、上記課題を解決するためになされた
もので、熱圧着ツールの押圧面の温度が均一となる接合
装置を提供することを目的とする。As described above, the conventional joining apparatus has a problem in that the temperature of the pressing surface of the thermocompression bonding tool becomes non-uniform and the joining state of the articles to be joined becomes non-uniform. The present invention has been made to solve the above problems, and an object of the present invention is to provide a joining device in which the temperature of the pressing surface of the thermocompression bonding tool is uniform.
【０００６】[0006]
【課題を解決するための手段】本発明は、被接合物と接
触する押圧面により被接合物を加圧しながら加熱する熱
圧着ツールと、この熱圧着ツールに交流電流を供給する
給電手段とを有し、熱圧着ツールは、給電手段に接続さ
れたコイルと、一端が押圧面となる管状の金属からなる
ヒータチップと、コイルから発生した磁束がヒータチッ
プと鎖交し、かつヒータチップの押圧面が下端に位置す
るように、コイル及びヒータチップを支持するチップホ
ルダとからなるものである。このように給電手段からコ
イルに交流電流を供給して、コイルから発生した磁束を
ヒータチップと鎖交させることにより、ヒータチップに
誘導電流が流れ、ジュール熱によりヒータチップが発熱
する。According to the present invention, there is provided a thermocompression bonding tool for heating an object to be bonded while pressing the object to be bonded with a pressing surface in contact with the object to be bonded, and a power feeding means for supplying an alternating current to the thermocompression bonding tool. The thermocompression bonding tool has a coil connected to the power feeding means, a heater chip made of a tubular metal whose one end serves as a pressing surface, and a magnetic flux generated from the coil interlinks with the heater chip and presses the heater chip. A chip holder that supports the coil and the heater chip so that the surface is located at the lower end. In this way, by supplying an alternating current to the coil from the power feeding means and interlinking the magnetic flux generated from the coil with the heater chip, an induced current flows in the heater chip and Joule heat causes the heater chip to generate heat.
【０００７】[0007]
【発明の実施の形態】図１（ａ）は本発明の第１の実施
の形態を示す接合装置のブロック図、図１（ｂ）はこの
接合装置の熱圧着ツールの構造図である。１は熱圧着ツ
ール、２は空心コイル、３は一端が被接合物と接触する
押圧面となる管状のヒータチップ、４は抵抗溶接あるい
は銀ろう等によるろう接によってヒータチップ３に取り
付けられた熱電対、５ａ、５ｂはコイル２から発生した
磁束がヒータチップ３と鎖交し、かつヒータチップ３の
押圧面が下端に位置するように、コイル２及びヒータチ
ップ３を支持するチップホルダである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a block diagram of a welding apparatus showing a first embodiment of the present invention, and FIG. 1B is a structural diagram of a thermocompression bonding tool of this welding apparatus. Reference numeral 1 is a thermocompression bonding tool, 2 is an air-core coil, 3 is a tubular heater chip whose one end serves as a pressing surface for contact with an object to be joined, and 4 is a thermoelectric element attached to the heater chip 3 by resistance welding or brazing with silver solder or the like. Pairs 5a and 5b are chip holders that support the coil 2 and the heater chip 3 so that the magnetic flux generated from the coil 2 interlinks with the heater chip 3 and the pressing surface of the heater chip 3 is located at the lower end.
【０００８】また、６は例えば１ｋＨｚの交流電圧を発
生する交流電源、７は交流電源６から出力された交流電
圧をスイッチングするトライアック、８はトライアック
７の出力を低電圧、大電流に変換してコイル２に供給す
るトランス、９はヒータチップ３の温度を設定するため
の温度設定スイッチ、１０はトライアック７をオン／オ
フさせることによってコイル２に流れる電流を制御する
制御回路、１１はＩＣ等の被接合物、１２は基板であ
る。Further, 6 is an AC power supply for generating an AC voltage of 1 kHz, 7 is a triac for switching the AC voltage output from the AC power supply 6, and 8 is an output of the triac 7 converted into a low voltage and a large current. A transformer supplied to the coil 2, 9 is a temperature setting switch for setting the temperature of the heater chip 3, 10 is a control circuit for controlling the current flowing in the coil 2 by turning on / off the triac 7, and 11 is an IC or the like. The object to be bonded, 12 is a substrate.
【０００９】ヒータチップ３は、金属製の短い管であ
り、その一端が被接合物（本実施の形態では被接合物１
１のリード）と接触する押圧面となる。このヒータチッ
プ３は、それ自体が例えば２００〜３００℃程度の温度
になることから耐熱性に優れ、かつジュール熱によって
発熱させることから抵抗値が大きい方が望ましい。これ
らの条件を満足するものとして、モリブデン、タングス
テン、ステンレスなどの耐熱合金が用いられる。The heater chip 3 is a short tube made of metal, and one end of the heater chip 3 is an object to be bonded (in the present embodiment, the object to be bonded 1
It becomes a pressing surface that comes into contact with the lead 1). It is desirable that the heater chip 3 has excellent heat resistance since it reaches a temperature of about 200 to 300 ° C., and has a large resistance value because it is heated by Joule heat. Heat-resistant alloys such as molybdenum, tungsten, and stainless steel are used to satisfy these conditions.
【００１０】なお、リフロソルダリングを行う場合に
は、半田が付着しないことが要求されるので、モリブデ
ン、タングステンなどを用いる。また、その他の金属で
半田が付着しないようにするためには、ヒータチップ３
の表面を高熱伝導性のセラミックスで覆うようにすれば
よい。When performing reflow soldering, molybdenum, tungsten or the like is used because it is required that solder does not adhere. In addition, in order to prevent solder from adhering to other metals, the heater chip 3
It suffices that the surface of is covered with ceramics having high thermal conductivity.
【００１１】チップホルダ５ａは、一端（図１（ｂ）で
は下側）が閉じて他端（上側）が開いた円筒状の形をし
ており、その内部にコイル２が収められる。そして、ヒ
ータチップ３は、チップホルダ５ａ側からねじ止めされ
てチップホルダ５ａの底に取り付けられる。また、チッ
プホルダ５ｂは、その一端がチップホルダ５ａに取り付
けられ、もう一端が図示しない駆動手段に取り付けられ
る。そして、駆動手段によってチップホルダ５ｂを下降
させることにより、ヒータチップ３の押圧面を被接合物
１１のリードに接触させてリードを加圧することが可能
となる。The tip holder 5a has a cylindrical shape in which one end (lower side in FIG. 1B) is closed and the other end (upper side) is opened, and the coil 2 is housed therein. The heater chip 3 is screwed from the chip holder 5a side and attached to the bottom of the chip holder 5a. The tip holder 5b has one end attached to the tip holder 5a and the other end attached to a driving means (not shown). Then, by lowering the chip holder 5b by the driving means, it becomes possible to bring the pressing surface of the heater chip 3 into contact with the lead of the article 11 to be pressed.
【００１２】このチップホルダ５ａ、５ｂは、ヒータチ
ップ３で発生した熱が被接合物以外の部分に逃げないよ
うに、断熱性に優れているものが望ましく、かつ後述す
るコイル２からの磁束によって誘導電流が生じないよう
に、電気絶縁性に優れているものが望ましい。これらの
条件を満足するものとして、ガラスあるいは断熱性のセ
ラミックスが用いられる。The tip holders 5a, 5b are preferably those having excellent heat insulation so that the heat generated in the heater tip 3 does not escape to a portion other than the object to be joined, and by the magnetic flux from the coil 2 described later. It is desirable that the material has excellent electrical insulation so that an induced current is not generated. Glass or heat-insulating ceramics is used to satisfy these conditions.
【００１３】次に、このような接合装置の動作を説明す
る。図２はヒータチップ３の発熱の基本原理を説明する
ための図である。制御回路１０が動作を開始してトライ
アック７に制御信号を出力すると、トライアック７がオ
ンとなり、交流電源６からの交流電圧がトランス８に印
加され、コイル２に電流Ｉが流れる。Next, the operation of such a joining device will be described. FIG. 2 is a diagram for explaining the basic principle of heat generation of the heater chip 3. When the control circuit 10 starts operating and outputs a control signal to the triac 7, the triac 7 is turned on, the AC voltage from the AC power supply 6 is applied to the transformer 8, and the current I flows through the coil 2.
【００１４】コイル２に電流Ｉが流れると、図２の破線
のように磁束が発生する。この電流Ｉは１ｋＨｚの交流
電流なので、発生する磁束が時間的に変化し、この磁束
がヒータチップ３と鎖交することにより、ヒータチップ
３に誘導起電力が生じて誘導電流ｉが流れる。この誘導
電流ｉがヒータチップ３に流れると、ｉ2 ×Ｒ（Ｒはヒ
ータチップ３の抵抗値）のジュール熱が発生する。When the current I flows through the coil 2, magnetic flux is generated as shown by the broken line in FIG. Since this current I is an alternating current of 1 kHz, the generated magnetic flux changes with time, and this magnetic flux interlinks with the heater chip 3, whereby an induced electromotive force is generated in the heater chip 3 and an induced current i flows. When this induced current i flows through the heater chip 3, Jo 2 heat of i 2 × R (R is the resistance value of the heater chip 3) is generated.
【００１５】このようにしてヒータチップ３を加熱しな
がら、前述した駆動手段によりツール１を下降させてヒ
ータチップ３の押圧面で被接合物１１のリードを押さえ
る。一方、ヒータチップ３の温度は熱電対４によって電
圧に変換される。制御回路１０は、熱電対４の熱起電力
を増幅した電圧と、設定温度に対応するスイッチ９から
の電圧との差を求め、この差に基づきヒータチップ３の
温度が設定温度になるようにトライアック７を位相制御
する。While heating the heater chip 3 in this way, the tool 1 is lowered by the above-mentioned driving means to press the lead of the article 11 to be bonded by the pressing surface of the heater chip 3. On the other hand, the temperature of the heater chip 3 is converted into a voltage by the thermocouple 4. The control circuit 10 obtains the difference between the voltage obtained by amplifying the thermoelectromotive force of the thermocouple 4 and the voltage from the switch 9 corresponding to the set temperature, and based on this difference, the temperature of the heater chip 3 becomes the set temperature. Phase control of the triac 7 is performed.
【００１６】図３はトランス８に供給される電流（実
線）の波形図であり、斜線部は供給される電力を示す。
位相制御は、交流波形の斜線部だけを使用し、その割合
を半周期ごとにトライアック７の点弧角で制御する方法
である。つまり、制御回路１０は、ヒータチップ３の温
度が上昇して設定温度に近づくにつれて、図３に示すよ
うに電流を減らしていくことによりヒータチップ３の温
度を設定温度に保つ。FIG. 3 is a waveform diagram of the current (solid line) supplied to the transformer 8, and the hatched portion shows the supplied power.
The phase control is a method in which only the shaded portion of the AC waveform is used and the ratio is controlled by the firing angle of the triac 7 every half cycle. That is, the control circuit 10 maintains the temperature of the heater chip 3 at the set temperature by reducing the current as shown in FIG. 3 as the temperature of the heater chip 3 rises and approaches the set temperature.
【００１７】半田が溶けるのに十分な熱と圧力をかけた
後、電流の供給を停止して冷却を行い、半田が固まった
ところで熱圧着ツール１を上昇させる。こうして、被接
合物１１のリードが基板１２のパターンに半田付けされ
る。以上のように、本実施の形態では電磁誘導作用によ
って熱圧着ツール１のヒータチップ３を発熱させるた
め、給電端子が不要となり、給電端子に熱が逃げること
がなくなるので、押圧面の温度分布を均一にすることが
できる。チップホルダ５ａ、５ｂは断熱性に優れ、かつ
ヒータチップ３に対して均等に接触しているので、これ
によって押圧面の温度分布が不均一になることはない。After applying sufficient heat and pressure to melt the solder, the supply of electric current is stopped and cooling is performed, and when the solder is solidified, the thermocompression bonding tool 1 is raised. In this way, the lead of the article 11 is soldered to the pattern of the substrate 12. As described above, in the present embodiment, since the heater chip 3 of the thermocompression bonding tool 1 is caused to generate heat by the electromagnetic induction action, the power supply terminal is not necessary and heat does not escape to the power supply terminal, so that the temperature distribution on the pressing surface can be reduced. Can be uniform. Since the chip holders 5a and 5b have excellent heat insulating properties and evenly contact the heater chips 3, the temperature distribution on the pressing surface does not become non-uniform.
【００１８】なお、本実施の形態では、ジュール熱によ
る発熱作用のみを記述したが、ヒータチップ３が磁性体
であれば、ヒステリシス損による発熱も存在する。ま
た、本実施の形態では、押圧面が輪形となる管状のヒー
タチップ３で説明したが、ヒータチップ３は被接合物の
形状に応じて製作されるものなので、図４のように押圧
面が四辺形となる管状など他の形状であってもよいこと
は言うまでもない。In the present embodiment, only the heat generation effect due to Joule heat is described, but if the heater chip 3 is a magnetic material, there is also heat generation due to hysteresis loss. Further, in the present embodiment, the tubular heater chip 3 having a ring-shaped pressing surface has been described. However, since the heater chip 3 is manufactured according to the shape of the object to be bonded, the pressing surface has a pressing surface as shown in FIG. It goes without saying that other shapes such as a quadrilateral tubular shape may be used.
【００１９】また、本実施の形態では、熱電対４による
フィードバックによってヒータチップ３の温度を制御す
る方式としたが、トランス８の２次側にホール電流検出
器などの電流検出器を設けてコイル２に流れる電流値を
フィードバックし、この電流値を制御するようにしても
よい。この場合には、熱電対４が不要となるので、押圧
面の温度をより均一にすることができる。In this embodiment, the temperature of the heater chip 3 is controlled by the feedback from the thermocouple 4, but a current detector such as a Hall current detector is provided on the secondary side of the transformer 8 to form a coil. The current value flowing in 2 may be fed back to control this current value. In this case, since the thermocouple 4 is unnecessary, the temperature of the pressing surface can be made more uniform.
【００２０】[0020]
【発明の効果】本発明によれば、給電手段からコイルに
交流電流を供給して、コイルから発生した磁束をヒータ
チップと鎖交させることにより、電磁誘導作用によって
ヒータチップに誘導電流が流れてヒータチップが発熱す
るので、従来のような給電端子が不要となり、給電端子
に熱が逃げることがなくなるので、ヒータチップの押圧
面の温度分布を均一にすることができる。これにより、
良好な接合状態を得ることができる。According to the present invention, an alternating current is supplied from the power feeding means to the coil so that the magnetic flux generated from the coil is linked to the heater chip, so that the induction current flows through the heater chip by the electromagnetic induction action. Since the heater chip generates heat, a conventional power supply terminal is not required and heat does not escape to the power supply terminal, so that the temperature distribution on the pressing surface of the heater chip can be made uniform. This allows
A good bonding state can be obtained.
【図１】 本発明の第１の実施の形態を示す接合装置の
ブロック図及び熱圧着ツールの構造図である。FIG. 1 is a block diagram of a joining device and a structural diagram of a thermocompression bonding tool showing a first embodiment of the present invention.
【図２】 ヒータチップの発熱の基本原理を説明するた
めの図である。FIG. 2 is a diagram for explaining a basic principle of heat generation of a heater chip.
【図３】 トランスに供給される電流の波形図である。FIG. 3 is a waveform diagram of a current supplied to a transformer.
【図４】 従来の熱圧着ツールの斜視図である。FIG. 4 is a perspective view of a conventional thermocompression bonding tool.
１…熱圧着ツール、２…コイル、３…ヒータチップ、４
…熱電対、５ａ、５ｂ…チップホルダ、６…交流電源、
７…トライアック、８…トランス、９…温度設定スイッ
チ、１０…制御回路。1 ... Thermocompression bonding tool, 2 ... Coil, 3 ... Heater chip, 4
… Thermocouple, 5a, 5b… Chip holder, 6… AC power supply,
7 ... Triac, 8 ... Transformer, 9 ... Temperature setting switch, 10 ... Control circuit.
Claims (1)
物を加圧しながら加熱する熱圧着ツールと、この熱圧着
ツールに交流電流を供給する給電手段とを有する接合装
置であって、 前記熱圧着ツールは、給電手段に接続されたコイルと、 一端が前記押圧面となる管状の金属からなるヒータチッ
プと、 コイルから発生した磁束がヒータチップと鎖交し、かつ
ヒータチップの前記押圧面が下端に位置するように、コ
イル及びヒータチップを支持するチップホルダとからな
るものであることを特徴とする接合装置。1. A joining device comprising a thermocompression bonding tool for heating an object to be bonded while pressing the object to be bonded with a pressing surface that is in contact with the object to be bonded, and a power feeding means for supplying an alternating current to the thermocompression bonding tool. The thermocompression bonding tool includes a coil connected to a power feeding means, a heater chip made of a tubular metal having one end serving as the pressing surface, a magnetic flux generated from the coil interlinks with the heater chip, and the pressing surface of the heater chip. And a chip holder that supports the coil and the heater chip so that the coil is located at the lower end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8508196A JPH09271937A (en) | 1996-04-08 | 1996-04-08 | Joining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8508196A JPH09271937A (en) | 1996-04-08 | 1996-04-08 | Joining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09271937A true JPH09271937A (en) | 1997-10-21 |
Family
ID=13848669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8508196A Pending JPH09271937A (en) | 1996-04-08 | 1996-04-08 | Joining device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09271937A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011025257A (en) * | 2009-07-22 | 2011-02-10 | Alonics Ltd | Induction heating type soldering device |
-
1996
- 1996-04-08 JP JP8508196A patent/JPH09271937A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011025257A (en) * | 2009-07-22 | 2011-02-10 | Alonics Ltd | Induction heating type soldering device |
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