JPH09266405A - Radio communication equipment - Google Patents
Radio communication equipmentInfo
- Publication number
- JPH09266405A JPH09266405A JP7402396A JP7402396A JPH09266405A JP H09266405 A JPH09266405 A JP H09266405A JP 7402396 A JP7402396 A JP 7402396A JP 7402396 A JP7402396 A JP 7402396A JP H09266405 A JPH09266405 A JP H09266405A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- main body
- lid
- wireless communication
- communication device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Details Of Aerials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は無線通信機器、特
に屋外で使用される無線通信機器の筐体構造に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wireless communication device, and more particularly to a casing structure of a wireless communication device used outdoors.
【０００２】[0002]
【従来の技術】無線通信機器、特に屋外で使用される例
えばＰＨＳ(personal handyphonesystem) 基地局等の無
線通信機器の筐体は、内蔵される基板に搭載される電子
部品を防水する必要性から防水構造となっており、また
電子部品を外部からの高周波や電磁波からシールドして
ノイズの発生や誤動作を防ぎ、あるいは電子部品から発
生する高周波や電磁波を外部へ漏洩させないために、シ
ールド構造（以下、これを電磁シールド構造と略記す
る）となっているのが一般的である。2. Description of the Related Art The housing of a wireless communication device, especially a wireless communication device such as a PHS (personal handyphone system) base station used outdoors is waterproof because it is necessary to waterproof electronic components mounted on a built-in board. It has a structure, and shields the electronic components from high frequencies and electromagnetic waves from the outside to prevent noise generation and malfunction, or to prevent high frequencies and electromagnetic waves generated from electronic components from leaking to the outside, This is abbreviated as an electromagnetic shield structure).
【０００３】図１４（Ａ）は従来のこの種の無線通信機
器の筐体の構成を示す斜視図、図１４（Ｂ）はその蓋部
の裏面の構成を示す斜視図、図１５は筐体の要部断面図
である。図において、１００は筐体を構成する本体部、
２００はその蓋部、３００は内蔵されている基板を示
す。また、１０は筐体内部を防水するための防水パッキ
ン、１１は防水パッキン１０を嵌め込むための溝、１２
は基板３００を電磁シールドするためのシールド線、１
３は蓋部２００の裏面に形成されるボス部に設けられた
シールド線１２を嵌め込むための溝を示す。FIG. 14 (A) is a perspective view showing the structure of a conventional wireless communication device of this type, FIG. 14 (B) is a perspective view showing the structure of the back surface of its lid, and FIG. 15 is a case. FIG. In the figure, reference numeral 100 denotes a main body which constitutes a casing,
Reference numeral 200 indicates the lid portion, and 300 indicates the built-in substrate. Further, 10 is a waterproof packing for waterproofing the inside of the housing, 11 is a groove for fitting the waterproof packing 10, 12
Is a shield wire for electromagnetically shielding the substrate 300, 1
Reference numeral 3 denotes a groove for fitting the shield wire 12 provided on a boss portion formed on the back surface of the lid portion 200.
【０００４】従来のこの種の無線通信機器の筐体は、図
１〜図３に示すように、本体部１００と蓋部２００との
接合部（いわゆるフランジ面）に溝１１が設けられ、こ
の溝１１に防水パッキン１０を嵌め込んで組み付け筐体
内部を防水する構造としている。また、内蔵される基板
３００を電磁シールドするために、蓋部２００の裏面に
いわゆるボスを形成しこのボス部に溝１３を設け、この
溝１３にシールド線１２を嵌め込んで組み付けている。As shown in FIGS. 1 to 3, a conventional casing of this type of wireless communication device is provided with a groove 11 at a joint (so-called flange surface) between a main body 100 and a lid 200. The waterproof packing 10 is fitted into the groove 11 to assemble and waterproof the inside of the housing. Further, in order to electromagnetically shield the built-in substrate 300, a so-called boss is formed on the back surface of the lid part 200, a groove 13 is provided in this boss part, and the shield wire 12 is fitted in the groove 13 and assembled.
【０００５】[0005]
【発明が解決しようとする課題】以上のような従来の無
線通信機器では、筐体内部の防水と、内蔵される基板の
電磁シールドの両方を行うために、防水パッキンとシー
ルド線とを別々に組み付けており、そのために防水パッ
キンとシールド線との２つを用意する必要がある。ま
た、本体部には防水パッキン用の溝、蓋部裏面にはシー
ルド線用の溝を形成したボス部を設けなければならず、
工数や工費がかかり製品コストが増加する等の問題点が
あった。In the conventional wireless communication device as described above, the waterproof packing and the shield wire are separately provided in order to both waterproof the inside of the housing and electromagnetically shield the built-in board. It is assembled, and for that purpose, it is necessary to prepare two parts, a waterproof packing and a shield wire. In addition, the main body must be provided with a groove for waterproof packing, and the back of the lid must be provided with a boss having a groove for a shield wire.
There was a problem that man-hours and labor costs were required and the product cost increased.
【０００６】本発明はかかる問題点を解決するためにな
されたものであり、防水機能と基板シールド機能とを１
つのプレートで兼用させ、工数や工費を削減して製品コ
ストを低減できる無線通信機器を提供することを目的と
している。The present invention has been made to solve the above problems, and has a waterproof function and a substrate shield function.
The purpose is to provide a wireless communication device that allows two plates to be used in common and reduces man-hours and cost to reduce product cost.
【０００７】なお、本願発明と関連する先行技術として
は、例えばレーダアンテナの防水構造を開示した実開昭
６０−６８７０５号公報が存在するが、この先行技術は
防水パッキンの周囲に編組管を連接するというもので、
その構成は複雑で製作も容易でなく、本願発明の対象の
ような無線通信機器には適さない。As a prior art related to the present invention, there is, for example, Japanese Utility Model Laid-Open No. 60-68705 which discloses a waterproof structure of a radar antenna. In this prior art, a braided pipe is connected around a waterproof packing. To do so,
The configuration is complicated and the manufacture is not easy, and it is not suitable for the wireless communication device as the object of the present invention.
【０００８】[0008]
【課題を解決するための手段】本発明に係わる無線通信
機器は、請求項第１項記載の発明は、少なくとも本体部
と蓋部とを接合してその筐体が構成され、この筐体内部
に電子部品を搭載した基板を内蔵し、上記本体部と蓋部
との間は防水処理され、上記基板が高周波や電磁波から
シールドされる無線通信機器において、上記本体部と蓋
部との間に挟まれる外周部と、その端が上記筐体内で上
記基板に接触するプレート部とで構成され、その外周部
には２つの波型リブが形成され、その内の１つの波型リ
ブの表裏面に防水素材（いわゆるコンパウンド材）が配
置された導電性プレートを備えたことを特徴とする。従
って筐体内部の防水と基板の磁気シールドとを１つのプ
レートで行わせることができる。According to a first aspect of the present invention, there is provided a radio communication device, wherein at least a main body portion and a lid portion are joined together to form a casing, and the inside of the casing is formed. In a wireless communication device in which a board having electronic components mounted therein is built-in, a waterproof treatment is performed between the main body and the lid, and the board is shielded from high frequency and electromagnetic waves, between the main body and the lid. It is composed of an outer peripheral portion to be sandwiched and a plate portion whose end is in contact with the substrate in the housing, and two corrugated ribs are formed on the outer peripheral portion, and the front and back surfaces of one of the corrugated ribs are formed. It is characterized by comprising a conductive plate on which a waterproof material (so-called compound material) is arranged. Therefore, waterproofing inside the housing and magnetic shielding of the substrate can be performed by one plate.
【０００９】また、請求項第２項記載の発明は、上記防
水素材（いわゆるコンパウンド材）に導電性防水素材
（いわゆる導電性コンパウンド材）を用い、上記外周部
に形成される波型リブを１つにした導電性プレートを備
えたことを特徴とする。従って導電性プレートをより簡
易に構成することができると共に、筐体本体部や蓋部の
フランジ肉厚を薄くすることが可能となる。According to a second aspect of the present invention, a conductive waterproof material (so-called conductive compound material) is used as the waterproof material (so-called compound material), and the corrugated ribs formed on the outer peripheral portion are It is characterized in that it is provided with one conductive plate. Therefore, the conductive plate can be configured more simply, and the thickness of the flange of the housing body and the lid can be reduced.
【００１０】また、請求項第３項記載の発明は、上記蓋
部の裏面に筐体内部へ突き出す突出部を設け、この突出
部で上記導電性プレートのプレート部の端を押さえてこ
のプレート部の端と上記基板の接触部を押さえる構成を
特徴とする。従ってプレート部の端と基板との接触面圧
を高めることができる。Further, according to a third aspect of the present invention, a projecting portion is provided on the back surface of the lid portion so as to project into the housing, and the projecting portion holds down the end of the plate portion of the conductive plate. It is characterized in that the edge of the substrate and the contact portion of the substrate are pressed. Therefore, the contact surface pressure between the end of the plate portion and the substrate can be increased.
【００１１】また、請求項第４項記載の発明は、上記外
周部に形成するリブに替えて半波形状の跳上部としたこ
とを特徴とする。従って本体部や蓋部のフランジ部をさ
らに薄くすることができる。The invention according to claim 4 is characterized in that the rib formed on the outer peripheral portion is replaced with a half-wave shaped jumping portion. Therefore, the flange portions of the main body portion and the lid portion can be made thinner.
【００１２】また、請求項第５項記載の発明は、上記本
体部あるいは蓋部の接合面（フランジ面）に上記本体部
あるいは蓋部と一体に形成した突起と、上記導電性プレ
ートの外周部の上記突起に対応する位置に設けられる嵌
合穴とを備え、上記嵌合穴に上記突起を嵌合させること
で上記導電性プレートの位置決めを行うことを特徴とす
る。従って導電性プレートの位置決めが容易かつ正確に
行えることになる。According to a fifth aspect of the present invention, a protrusion integrally formed with the main body portion or the lid portion on a joint surface (flange surface) of the main body portion or the lid portion, and an outer peripheral portion of the conductive plate. And a fitting hole provided at a position corresponding to the protrusion, and the conductive plate is positioned by fitting the protrusion into the fitting hole. Therefore, the conductive plate can be easily and accurately positioned.
【００１３】また、請求項第６項記載の発明は、上記本
体部あるいは蓋部と一体に形成される突起に替えて、上
記本体部あるいは蓋部とは別体に形成されたピンを用い
ることを特徴とする。従ってピンを設ける位置を調整す
ることで導電性プレートの位置決め精度をさらに高める
ことができるようになる。According to the sixth aspect of the present invention, instead of the protrusion integrally formed with the main body portion or the lid portion, a pin formed separately from the main body portion or the lid portion is used. Is characterized by. Therefore, the positioning accuracy of the conductive plate can be further improved by adjusting the position where the pin is provided.
【００１４】また、請求項第７項記載の発明は、上記導
電性プレートのプレート部に一体に固定した押圧片を設
け、上記本体部と蓋部とが接合されることで上記蓋部の
裏面がこの押圧片を押し、この押圧片と一体となった上
記プレート部が押されてこのプレート部の端と上記基板
との接触部を押さえる特徴とする。従って、プレート部
の端を基板に押圧して接触させることができるようにな
る。Further, according to a seventh aspect of the present invention, a pressing piece integrally fixed to the plate portion of the conductive plate is provided, and the main body portion and the lid portion are joined to each other, whereby the back surface of the lid portion is joined. Presses the pressing piece, and the plate portion integrated with the pressing piece is pressed to press the contact portion between the end of the plate portion and the substrate. Therefore, it becomes possible to press the end of the plate portion against the substrate to bring it into contact with the substrate.
【００１５】さらに、請求項第８項記載の発明は、上記
押圧片を、上記導電性プレートのプレート部の一部を切
って***させた***突出部で形成したことを特徴とす
る。従って、プレート部に別の押圧片を設ける必要がな
くなる。Further, the invention according to claim 8 is characterized in that the pressing piece is formed by a raised protrusion which is formed by cutting a part of the plate portion of the conductive plate to raise it. Therefore, it is not necessary to provide another pressing piece on the plate portion.
【００１６】[0016]
実施形態１．以下、この発明の実施形態を図面を用いて
説明する。図１〜図３はこの発明の実施形態１に係わる
無線通信機器の筐体の構成を説明するための図であり、
図１（Ａ）は筐体全体の構成を示す分解斜視図である。
図１（Ａ）において、１は導電性プレート（以下、単に
プレート１とも略記する）、１００は無線通信機器の筐
体を構成する本体部、２００はその蓋部である。図１
（Ｂ）は蓋部２００の裏面側の構成を示す斜視図であ
り、図１４（Ｂ）に示す従来の蓋部裏面と異なり、ボス
部や溝１３を設ける必要がないため単純な構造となって
いる。Embodiment 1 FIG. Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views for explaining the configuration of the housing of the wireless communication device according to the first embodiment of the present invention.
FIG. 1A is an exploded perspective view showing the configuration of the entire housing.
In FIG. 1A, reference numeral 1 is a conductive plate (hereinafter, also simply referred to as plate 1), 100 is a main body forming a casing of a wireless communication device, and 200 is a lid thereof. FIG.
FIG. 14B is a perspective view showing the configuration of the back surface side of the lid portion 200, and unlike the conventional lid back surface shown in FIG. 14B, it is not necessary to provide the boss portion or the groove 13 and has a simple structure. ing.
【００１７】図２は、図１に示す筐体の要部断面図であ
り、３００は筐体内に内蔵される基板である。図１，図
２に示すように、プレート１は、本体部１００と蓋部２
００との間に挟まれる外周部１ａと、その端が筐体内で
基板３００と接するプレート部１ｂとで構成される。図
３は、プレート１の外周部１ａ付近の構成を説明するた
めの図であり、２０は筐体内を防水するために外周部先
端の防水処理を施した部分、２１は本体部１００と蓋部
２００との間にできる隙間の電磁シールドを強化する部
分である。FIG. 2 is a cross-sectional view of the main part of the housing shown in FIG. 1, and 300 is a substrate built in the housing. As shown in FIGS. 1 and 2, the plate 1 includes a main body 100 and a lid 2.
And an outer peripheral portion 1a sandwiched between the outer peripheral portion 1 and the outer peripheral portion 00, and a plate portion 1b whose end is in contact with the substrate 300 in the housing. 3A and 3B are views for explaining the configuration in the vicinity of the outer peripheral portion 1a of the plate 1, 20 is a portion of the outer peripheral portion whose end is waterproofed to waterproof the inside of the housing, and 21 is a main body portion 100 and a lid portion. This is a portion that strengthens the electromagnetic shield in the gap formed with 200.
【００１８】この実施形態１に示す無線通信機器の筐体
は、図１〜図３で説明するように構成されており、プレ
ート１で筐体内部の防水を行うと共に、基板３００の電
磁シールドも行わせる。すなわちプレート１を、金属等
の導電性素材を用い、本体部１００と蓋部２００との接
合面（フランジ面）に挟まれるプレート１の外周部１ａ
に、図３に示すように２つの波型リブを成形すると共
に、図２に示すようにプレート部１ｂの端が基板３００
に接触するような形に成形する。そして外周部１ａに設
けられる波型リブの１つに、防水素材（いわゆるコンパ
ウンド材）を塗布または貼り付け、防水処理を施した部
分２０とする。そして、この外周部１ａを挟み本体部１
００と蓋部２００とを接合することで、波型リブが弾性
力を持って本体部１００と蓋部２００との間で圧接さ
れ、またプレート部１ｂの端が基板３００に接し、筐体
内部を防水し、基板３００をこのプレート部１ｂで覆っ
て確実な電磁シールドが行える構造とした。The casing of the wireless communication device according to the first embodiment is configured as described with reference to FIGS. 1 to 3, and the plate 1 waterproofs the inside of the casing and also the electromagnetic shield of the substrate 300. Let it be done. That is, the plate 1 is made of a conductive material such as metal and is sandwiched between the joint surface (flange surface) of the main body 100 and the lid 200.
At the same time, two corrugated ribs are formed as shown in FIG. 3, and as shown in FIG.
It is shaped so as to come into contact with. Then, a waterproof material (so-called compound material) is applied or attached to one of the corrugated ribs provided on the outer peripheral portion 1a to form the waterproofed portion 20. The main body 1 is sandwiched by the outer peripheral portion 1a.
00 and the lid portion 200 are joined together, the corrugated ribs are elastically pressed between the main body portion 100 and the lid portion 200, and the end of the plate portion 1b is brought into contact with the substrate 300. Is waterproofed, and the substrate 300 is covered with the plate portion 1b to provide a reliable electromagnetic shield.
【００１９】この実施形態１に係わる無線通信機器は上
述のような構成とすることにより、筐体内部の防水と磁
気シールドとを１枚のプレートで行わせることができ、
溝加工や防水パッキン，シールド線が不要となると共
に、組立が容易に行えるので組立工数を減らせることが
できる。なお２つの波型リブは図１では省略している
が、外周部１ａ全体に設けられるものであり、また防水
処理を施す波型リブは何方の波型リブでも良いことは言
うまでもない。By configuring the wireless communication device according to the first embodiment as described above, it is possible to waterproof and magnetically shield the inside of the housing with one plate.
Grooving, waterproof packing, and shield wire are not required, and the assembling can be done easily, so the number of assembling steps can be reduced. Although not shown in FIG. 1, the two corrugated ribs are provided on the entire outer peripheral portion 1a, and it goes without saying that the corrugated rib to be waterproofed may be any corrugated rib.
【００２０】実施形態２．図４，図５は、この発明の実
施形態２を説明するための図であり、図において、図１
〜図３と同一符号は同一又は相当部分を示し、２２はプ
レート１に導電性防水素材を施した部分である。この実
施形態２では、プレート１の表裏面に塗布または接着さ
れる防水素材（コンパウンド材）に、導電性防水素材
（導電性コンパウンド材）２２を用いることにより、フ
ランジ面に挟まれる外周部１ａに形成する波型リブを１
つに省略することとしたものである。Embodiment 2 4 and 5 are views for explaining a second embodiment of the present invention, and in FIG.
The same reference numerals as those in FIG. 3 denote the same or corresponding portions, and 22 denotes a portion in which the plate 1 is provided with a conductive waterproof material. In the second embodiment, the conductive waterproof material (conductive compound material) 22 is used as the waterproof material (compound material) applied or adhered to the front and back surfaces of the plate 1, so that the outer peripheral portion 1a sandwiched between the flange surfaces is covered. 1 corrugated rib to be formed
It will be omitted once.
【００２１】この実施形態２に係わる無線通信機器は上
述のような構成とすることにより、同じ機能を有するプ
レート１を、更に簡易に構成することができると共に、
本体部１００および蓋部２００のフランジ面の肉厚をさ
らに薄くすることができるようになる。By configuring the wireless communication device according to the second embodiment as described above, the plate 1 having the same function can be more simply configured, and
The wall thickness of the flange surfaces of the main body portion 100 and the lid portion 200 can be further reduced.
【００２２】実施形態３．図６はこの発明の実施形態３
を説明するための筐体の要部断面図であり、図におい
て、図４と同一符号は同一又は相当部分を示し、２は蓋
部２００の裏面に設けられた突出部（ボス）である。こ
の実施形態３では、図６に示すような突出部２を設け、
この突出部２でプレート部１ｂの端を押さえ、基板３０
０との接触性を高める構成としたものである。Embodiment 3 FIG. FIG. 6 shows a third embodiment of the present invention.
5 is a cross-sectional view of a main part of a housing for explaining the above, in which the same reference numerals as those in FIG. 4 denote the same or corresponding parts, and 2 denotes a protrusion (boss) provided on the back surface of the lid 200. In the third embodiment, the protrusion 2 as shown in FIG. 6 is provided,
The protruding portion 2 holds down the edge of the plate portion 1b, and the substrate 30
It is configured to enhance the contact property with 0.
【００２３】この実施形態３に係わる無線通信機器は上
述のような構成とすることにより、プレート部１ｂと基
板３００との接触面圧を上げることができ、基板３００
の電磁シールド機能を高めることができる。By configuring the wireless communication device according to the third embodiment as described above, the contact surface pressure between the plate portion 1b and the substrate 300 can be increased, and the substrate 300
The electromagnetic shield function of can be enhanced.
【００２４】実施形態４．図７はこの発明の実施形態４
を説明するための筐体の要部断面図であり、図におい
て、図６と同一符号は同一又は相当部分を示し、８は半
波形状の跳上部である。この実施形態４ではプレート１
の本体部１００と蓋部２００との接合面（フランジ面）
に挟まれる外周部１ａに、波型のリブではなく半波形状
の跳上部３を設けることとし、より簡易な構成としたも
のである。Embodiment 4. FIG. 7 shows a fourth embodiment of the present invention.
7 is a cross-sectional view of a main part of a housing for explaining the above. In the figure, the same reference numerals as those in FIG. 6 denote the same or corresponding portions, and 8 denotes a half-wave shaped jumping portion. In this Embodiment 4, the plate 1
Surface (flange surface) between the main body 100 and the lid 200 of the
Instead of the corrugated rib, the half-wave shaped jumping portion 3 is provided on the outer peripheral portion 1a sandwiched between the upper and lower portions, thereby providing a simpler configuration.
【００２５】この実施形態４に係わる無線通信機器は上
述のような構成とすることにより、筐体を構成するダイ
キャスト等で成形される本体部１００や蓋部２００のフ
ランジ肉圧をさらに薄くすることができる。By configuring the wireless communication device according to the fourth embodiment as described above, it is possible to further reduce the flange wall pressure of the main body 100 and the lid 200 formed by die casting or the like which form the housing. be able to.
【００２６】実施形態５．図８はこの発明の実施形態５
を説明するための筐体全体の構成を示す分解斜視図、図
９は筐体の要部断面図である。図において、図１，図４
と同一符号は同一又は相当部分を示し、４は本体部１０
０の蓋部２００との接合面（フランジ面）に設けられた
嵌合突起、５はプレート１の外周部１ａに設けられ突起
４が嵌合する嵌合穴である。この実施形態５では、図に
示すように嵌合穴５に嵌合突起４を嵌合させる構成とす
ることで、プレート１の位置決めを正確，容易に行わせ
る構成としたものである。Embodiment 5. FIG. 8 shows a fifth embodiment of the present invention.
FIG. 9 is an exploded perspective view showing the configuration of the entire housing for explaining the above, and FIG. 9 is a cross-sectional view of the main parts of the housing. In the figure, FIG.
The same reference numerals as in FIG.
No. 0 is a fitting protrusion provided on the joint surface (flange surface) with the lid 200, and 5 is a fitting hole provided on the outer peripheral portion 1 a of the plate 1 into which the protrusion 4 fits. In the fifth embodiment, the fitting projection 4 is fitted into the fitting hole 5 as shown in the figure, so that the plate 1 can be accurately and easily positioned.
【００２７】この実施形態５に係わる無線通信機器は上
述のような構成とすることにより、ボルトとボルト穴と
を用いて位置決めを行う上述の先行技術に比べ、手間と
ズレとを防止でき、より正確，容易にプレート１の位置
合わせを行うことができるようになる。なお、嵌合突起
４および嵌合穴５の位置および数は、図８，図９に示す
ものに特に限定されるものではないことは言うまでもな
く、また図８，図９では本体部１００側に嵌合突起４を
設ける構成としているが、蓋部２００の接合面（フラン
ジ面）に設けることとしても良い。By configuring the wireless communication device according to the fifth embodiment as described above, compared to the above-mentioned prior art in which positioning is performed using bolts and bolt holes, it is possible to prevent labor and displacement, and The plate 1 can be accurately and easily aligned. Needless to say, the positions and numbers of the fitting protrusions 4 and the fitting holes 5 are not particularly limited to those shown in FIGS. 8 and 9, and in FIGS. Although the fitting protrusion 4 is provided, it may be provided on the joint surface (flange surface) of the lid portion 200.
【００２８】実施形態６．図１０はこの発明の実施形態
６を説明するための筐体の要部断面図である。図におい
て、図９と同一符号は同一又は相当部分を示し、６は本
体部１００の接合面（フランジ面）に圧入された本体部
１００とは別体に形成されるピンである。この実施形態
６では、図１０に示すように本体部１００とは別体で形
成されるピン６を本体部１００の接合面（フランジ面）
に圧入し、このピン６の頭部に嵌合穴５を嵌合してプレ
ート１の位置決めを正確，容易に行わせる構成としたも
のである。Embodiment 6 FIG. FIG. 10 is a sectional view of a main part of a casing for explaining the sixth embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 9 indicate the same or corresponding parts, and 6 is a pin which is formed separately from the main body 100 and is press-fitted into the joint surface (flange surface) of the main body 100. In the sixth embodiment, as shown in FIG. 10, the pin 6 formed separately from the main body 100 is provided on the joint surface (flange surface) of the main body 100.
The pin 1 is press-fitted into the fitting hole 5, and the fitting hole 5 is fitted in the head portion of the pin 6 to accurately and easily position the plate 1.
【００２９】この実施形態６に係わる無線通信機器は上
述のようにピン６を用いる構成とすることにより、ピン
６を設ける位置を調整することで、プレート１の位置精
度をさらに正確に位置決めできるようになる。By configuring the wireless communication device according to the sixth embodiment to use the pin 6 as described above, the position accuracy of the plate 1 can be more accurately adjusted by adjusting the position at which the pin 6 is provided. become.
【００３０】実施形態７．図１１はこの発明の実施形態
７を説明するための筐体の要部断面図であり、図におい
て、図４と同一符号は同一又は相当部分を示し、６はプ
レート１のプレート部１ｂの背部に設けらた押圧片であ
る。図１１に示すように、この実施形態７はプレート部
１ｂに押圧片７を設け、本体部１００に蓋部２００を接
合させた時に、この押圧片７が蓋部２００の裏面で押さ
れてプレート部１ｂを下方へ押し、プレート部１ｂの端
と基板３００との接触面圧を上げ接触が良好に行われる
ように構成したものである。Embodiment 7. 11 is a sectional view of a main part of a casing for explaining a seventh embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 4 denote the same or corresponding parts, and 6 denotes a back part of the plate part 1b of the plate 1. It is a pressing piece provided in. As shown in FIG. 11, in the seventh embodiment, when the pressing portion 7 is provided on the plate portion 1b and the lid portion 200 is joined to the main body portion 100, the pressing portion 7 is pushed by the back surface of the lid portion 200 to plate the plate. The portion 1b is pushed downward to increase the contact surface pressure between the end of the plate portion 1b and the substrate 300 so that good contact is achieved.
【００３１】図１２はこの発明の実施形態７の他の例を
示す筐体の要部断面図である。図において、図１１と同
一符号は同一又は相当部分を示し、２は蓋部２００の裏
面に設けられた突出部（ボス）である。図１２に示すよ
うに、押圧片７に加えてさらに蓋部２００の裏面に突出
部（ボス部）２を設けることにより、プレートｂ１の端
と基板３００との接触面圧をさらに上げ、接触が更に良
好に行われるようにしたものである。FIG. 12 is a sectional view of a main part of a case showing another example of the seventh embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 11 denote the same or corresponding portions, and 2 denotes a protruding portion (boss) provided on the back surface of the lid portion 200. As shown in FIG. 12, by providing a protrusion (boss) 2 on the back surface of the lid 200 in addition to the pressing piece 7, the contact surface pressure between the end of the plate b1 and the substrate 300 is further increased, and contact is made. It is designed to be performed even better.
【００３２】この実施形態８に係わる無線通信機器は上
述のような構成とすることにより、プレート部１ｂの端
と基板３００との接触をさらに良好に行わせ、基板シー
ルド機能を強化させることができるようになる。By configuring the wireless communication device according to the eighth embodiment as described above, the edge of the plate portion 1b and the substrate 300 can be brought into contact with each other better, and the substrate shield function can be enhanced. Like
【００３３】実施形態８．図１３はこの発明の実施形態
８を説明するための筐体の要部断面図である。図におい
て、図１２と同一符号は同一又は相当部分を示し、８は
プレート部１ｂにこのプレート部１ｂの一部を切って隆
起させた***突出部である。図１３に示すように、この
実施形態９はプレート部１ｂとは別体に成形される押圧
片７の替わりに、プレート部１ｂの一部を切って***さ
せた***突出部８を設けることで、より簡易な構造で、
プレート部１ｂの端と基板３００との接触が良好に行わ
れるようにしたものである。Embodiment 8. FIG. 13 is a cross-sectional view of a main part of a casing for explaining the eighth embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 12 indicate the same or corresponding portions, and 8 is a raised protrusion formed by cutting a part of the plate portion 1b and raising the plate portion 1b. As shown in FIG. 13, in the ninth embodiment, instead of the pressing piece 7 that is molded separately from the plate portion 1b, a protruding protrusion 8 that is formed by cutting a part of the plate portion 1b and raising it is provided. , With a simpler structure,
The contact between the end of the plate portion 1b and the substrate 300 is made good.
【００３４】この実施形態８に係わる無線通信機器は上
述のような構成とすることにより、プレート部１ｂに別
の押圧片を加工する必要がなくなり、より簡易で同等の
機能が得られる構成とできる。By configuring the wireless communication device according to the eighth embodiment as described above, it is not necessary to process another pressing piece on the plate portion 1b, and a simpler and equivalent function can be obtained. .
【００３５】[0035]
【発明の効果】本発明の無線通信機器は以上説明したよ
うに、請求項第１項記載の発明においては、外周部には
２つの波型リブが形成され、その内の１つの波型リブの
表裏面に防水素材が配置された導電性プレートを備える
構成とすることにより、筐体内部の防水と基板の磁気シ
ールドとを１つのプレートで行わせることができ、溝加
工や防水パッキン，シールド線が不要となると共に、組
立が容易に行えるので組立工数を減らせることができ、
製品コストを低減させることができるという効果があ
る。As described above, in the wireless communication device of the present invention, in the invention described in claim 1, two corrugated ribs are formed in the outer peripheral portion, and one corrugated rib among them is formed. By providing a conductive plate having a waterproof material disposed on the front and back surfaces of the device, it is possible to perform waterproofing inside the housing and magnetic shielding of the substrate with one plate, and groove processing, waterproof packing, shield No wires are required and the assembly can be done easily, so the number of assembly steps can be reduced.
There is an effect that the product cost can be reduced.
【００３６】また、請求項第２項記載の発明において
は、導電性コンパウンド材を用いて、外周部に形成され
る波型リブを１つに減らす構成としたので、導電性プレ
ートをより簡易に構成することができると共に、筐体本
体部や蓋部のフランジ肉厚を薄くすることができ、さら
なる製品コストの低減と、製品の小型，軽量化が可能と
なるという効果がある。According to the second aspect of the invention, since the conductive compound material is used to reduce the number of corrugated ribs formed on the outer peripheral portion to one, the conductive plate can be made simpler. In addition to being able to be configured, the thickness of the flange of the housing main body and the lid can be reduced, which has the effect of further reducing the product cost and reducing the size and weight of the product.
【００３７】また、請求項第３項記載の発明において
は、蓋部裏面に突出部を設け、この突出部でプレート部
の端を押さえて接触面圧を高める構成としたので、基板
の電磁シールド機能を強化させることができるという効
果がある。Further, according to the third aspect of the invention, since the protrusion is provided on the back surface of the lid and the edge of the plate is pressed by the protrusion to increase the contact surface pressure, the electromagnetic shield of the substrate is shielded. There is an effect that the function can be enhanced.
【００３８】また、請求項第４項記載の発明において
は、外周部に形成するリブに替えて半波形状の跳上部と
したので、筐体本体部や蓋部のフランジ肉厚をさらに薄
くすることができ、さらなる製品コストの低減と小型，
軽量化が可能となるという効果がある。Further, in the invention according to the fourth aspect, since the rib formed on the outer peripheral portion is replaced with the half-wave shaped jumping portion, the thickness of the flange of the main body of the casing and the lid is further reduced. It is possible to further reduce the product cost and small size,
There is an effect that the weight can be reduced.
【００３９】また、請求項第５項記載の発明において
は、本体部あるいは蓋部の接合面に一体に形成した突起
を設けると共に導電性プレートに嵌合穴を設け、嵌合穴
に突起を嵌合させることで導電性プレートの位置決めを
行う構成としたので、ボルトとボルト穴とを用いて位置
決めを行う従来の構成に比べ、工数を簡略化できると共
にボルト穴に起因する位置ズレを防止でき、導電性プレ
ートの位置決めが正確，容易に行えるという効果があ
る。According to the fifth aspect of the present invention, a projection integrally formed on the joint surface of the main body portion or the lid portion is provided, a fitting hole is provided in the conductive plate, and the projection is fitted in the fitting hole. Since it is configured to position the conductive plate by combining, it is possible to simplify the man-hours and prevent the positional deviation due to the bolt hole, as compared with the conventional configuration in which the positioning is performed using the bolt and the bolt hole. The conductive plate can be positioned accurately and easily.
【００４０】また、請求項第６項記載の発明において
は、突起に替えて別体に形成されたピンを用いて導電性
プレートの位置決めを行う構成としたので、ピンを設け
る位置を調整することで導電性プレートの位置決め精度
をさらに高めることができるという効果がある。In the sixth aspect of the invention, since the conductive plate is positioned by using a pin formed separately instead of the protrusion, the position where the pin is provided can be adjusted. Therefore, the positioning accuracy of the conductive plate can be further improved.
【００４１】また、請求項第７項記載の発明において
は、プレート部に一体に固定した押圧片を設け、蓋部と
が接合されることでこのプレート部が押されてこのプレ
ート部の端と基板の接触部を押さえる構成とすることに
より、基板の電磁シールド機能を更に強化させることが
できるという効果がある。Further, in the invention according to claim 7, a pressing piece integrally fixed to the plate portion is provided, and the plate portion is pushed by being joined to the lid portion and the end of the plate portion is There is an effect that the electromagnetic shield function of the substrate can be further enhanced by adopting a configuration of pressing the contact portion of the substrate.
【００４２】さらに、請求項第８項記載の発明において
は、押圧片を、導電性プレートのプレート部の一部を切
って***させた***突出部で形成することとしたので、
プレート部に別の押圧片を設ける必要がなく切削加工で
形成でき、基板の電磁シールド機能を更に強化させなが
らより簡易な構成とすることができる等の効果がある。Further, in the invention according to the eighth aspect, since the pressing piece is formed by the protruding protrusion which is formed by cutting a part of the plate portion of the conductive plate to raise it.
Since it is not necessary to provide another pressing piece on the plate portion, the plate portion can be formed by cutting, and there is an effect that a simpler configuration can be achieved while further enhancing the electromagnetic shield function of the substrate.
【図１】 この発明の実施形態１を説明するための図で
ある。FIG. 1 is a diagram for explaining a first embodiment of the present invention.
【図２】 図１に示す筐体の要部構成を示す部分断面図
である。FIG. 2 is a partial cross-sectional view showing the main configuration of the housing shown in FIG.
【図３】 図１，図２に示すプレートの外周部の構成を
示す図である。FIG. 3 is a diagram showing a configuration of an outer peripheral portion of the plate shown in FIGS. 1 and 2.
【図４】 この発明の実施形態２を説明するための図で
ある。FIG. 4 is a diagram for explaining a second embodiment of the present invention.
【図５】 図４に示す実施形態２のプレートの外周部の
構成を示す図である。FIG. 5 is a diagram showing a configuration of an outer peripheral portion of the plate according to the second embodiment shown in FIG.
【図６】 この発明の実施形態３を説明するための図で
ある。FIG. 6 is a diagram for explaining a third embodiment of the present invention.
【図７】 この発明の実施形態４を説明するための図で
ある。FIG. 7 is a diagram for explaining a fourth embodiment of the present invention.
【図８】 この発明の実施形態５を説明するための図で
ある。FIG. 8 is a diagram for explaining a fifth embodiment of the present invention.
【図９】 図８に示す筐体の要部構成を示す部分断面図
である。9 is a partial cross-sectional view showing the main configuration of the housing shown in FIG.
【図１０】 この発明の実施形態６を説明するための図
である。FIG. 10 is a diagram for explaining the sixth embodiment of the present invention.
【図１１】 この発明の実施形態７を説明するための図
である。FIG. 11 is a diagram for explaining the seventh embodiment of the present invention.
【図１２】 この発明の実施形態７の他の例を説明する
ための図である。FIG. 12 is a diagram for explaining another example of the seventh embodiment of the present invention.
【図１３】 この発明の実施形態８を説明するための図
である。FIG. 13 is a diagram for explaining the eighth embodiment of the present invention.
【図１４】 従来の無線通信機器の筐体の構成を説明す
るための図である。FIG. 14 is a diagram illustrating a configuration of a housing of a conventional wireless communication device.
【図１５】 図１４に示す筐体の要部構成を示す部分断
面図である。FIG. 15 is a partial cross-sectional view showing the main configuration of the housing shown in FIG.
【符号の説明】 １ 導電性プレート、１ａ 導電性プレートの外周部、
１ｂ 導電性プレートのプレート部、２ 突出部、３
跳上部、４ 嵌合突起、５ 嵌合穴、６ ピン、７ 押
圧片、８ ***突起部、１０ 防水パッキン、１１
溝、１２ シールド線、１３ 溝、２０ 外周部の防水
処理を施した部分、２１ 外周部の電磁シールドを強化
する部分、２２ 導電性防水素材、１００ 本体部、２
００ 蓋部、３００ 基板。[Explanation of reference numerals] 1 conductive plate, 1a outer peripheral portion of the conductive plate,
1b Plate part of conductive plate, 2 protrusion part, 3
Jumping part, 4 fitting protrusions, 5 fitting holes, 6 pins, 7 pressing pieces, 8 raised protrusions, 10 waterproof packing, 11
Grooves, 12 shielded wires, 13 grooves, 20 outer peripheral waterproofed portion, 21 outer peripheral electromagnetic shield strengthening portion, 22 conductive waterproof material, 100 main body portion, 2
00 lid, 300 substrate.
Claims (8)
の筐体が構成され、この筐体内部に電子部品を搭載した
基板を内蔵し、上記本体部と蓋部との間は防水処理さ
れ、上記基板が高周波や電磁波からシールドされる無線
通信機器において、 上記本体部と蓋部との間に挟まれる外周部と、その端が
上記筐体内で上記基板に接触するプレート部とで構成さ
れ、その外周部には２つの波型リブが形成され、その内
の１つの波型リブの表裏面に防水素材（いわゆるコンパ
ウンド材）が配置された導電性プレートを備えたことを
特徴とする無線通信機器。1. A housing is constructed by joining at least a main body and a lid, and a substrate having electronic components mounted therein is built in the housing, and a waterproof treatment is provided between the main body and the lid. In the wireless communication device in which the substrate is shielded from high frequency and electromagnetic waves, the outer peripheral portion sandwiched between the main body portion and the lid portion and the plate portion whose end is in contact with the substrate inside the housing are configured. Two corrugated ribs are formed on the outer periphery of the corrugated rib, and a conductive plate having a waterproof material (so-called compound material) arranged on the front and back surfaces of one of the corrugated ribs is provided. Wireless communication equipment.
材）に導電性防水素材（いわゆる導電性コンパウンド
材）を用い、上記外周部に形成される波型リブを１つに
した導電性プレートを備えたことを特徴とする請求項１
記載の無線通信機器。2. A conductive plate having a corrugated rib formed on the outer peripheral portion thereof, wherein a conductive waterproof material (so-called compound material) is used as the waterproof material (so-called compound material). Claim 1 characterized by the above-mentioned.
The described wireless communication device.
出部を設け、この突出部で上記導電性プレートのプレー
ト部の端を押さえてこのプレート部の端と上記基板の接
触部を押さえる構成を特徴とする請求項１または請求項
２記載の無線通信機器。3. A projecting part that projects into the housing is provided on the back surface of the lid part, and the projecting part presses the end of the plate part of the conductive plate and presses the contact part of the plate part and the substrate. The wireless communication device according to claim 1, wherein the wireless communication device has a configuration.
形状の跳上部としたことを特徴とする請求項２または請
求項３記載の無線通信機器。4. The wireless communication device according to claim 2, wherein the rib formed on the outer peripheral portion is replaced with a half-wave jump portion.
ンジ面）に上記本体部あるいは蓋部と一体に形成した突
起と、 上記導電性プレートの外周部の上記突起に対応する位置
に設けられる嵌合穴とを備え、 上記嵌合穴に上記突起を嵌合させることで上記導電性プ
レートの位置決めを行うことを特徴とする請求項１〜請
求項４記載の無線通信機器。5. A protrusion formed integrally with the main body portion or the lid portion on a joint surface (flange surface) of the main body portion or the lid portion, and provided at a position corresponding to the protrusion on the outer peripheral portion of the conductive plate. The wireless communication device according to claim 1, further comprising: a fitting hole, wherein the conductive plate is positioned by fitting the protrusion into the fitting hole.
れる突起に替えて、上記本体部あるいは蓋部とは別体に
形成されたピンを用いることを特徴とする請求項５記載
の無線通信機器。6. The wireless device according to claim 5, wherein a pin formed separately from the main body or the lid is used instead of the protrusion integrally formed with the main body or the lid. Communication equipment.
に固定した押圧片を設け、上記本体部と蓋部とが接合さ
れることで上記蓋部の裏面がこの押圧片を押し、この押
圧片と一体となった上記プレート部が押されてこのプレ
ート部の端と上記基板との接触部を押さえる構成を特徴
とする請求項１〜請求項６記載の無線通信機器。7. A pressing piece integrally fixed to the plate portion of the conductive plate is provided, and the back surface of the lid portion pushes the pressing piece by joining the main body portion and the lid portion, and the pressing piece is formed. The wireless communication device according to any one of claims 1 to 6, wherein the plate unit integrated with the above is pressed to press a contact portion between the end of the plate unit and the substrate.
レート部の一部を切って***させた***突出部で形成し
たことを特徴とする請求項７記載の無線通信機器。8. The wireless communication device according to claim 7, wherein the pressing piece is formed by a raised protrusion formed by cutting a part of a plate portion of the conductive plate and raising the conductive plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07402396A JP3523959B2 (en) | 1996-03-28 | 1996-03-28 | Wireless communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07402396A JP3523959B2 (en) | 1996-03-28 | 1996-03-28 | Wireless communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09266405A true JPH09266405A (en) | 1997-10-07 |
| JP3523959B2 JP3523959B2 (en) | 2004-04-26 |
Family
ID=13535120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07402396A Expired - Fee Related JP3523959B2 (en) | 1996-03-28 | 1996-03-28 | Wireless communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3523959B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110263A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Heat dissipation structure, package assembly and heat dissipation sheet |
| CN103281891A (en) * | 2013-05-08 | 2013-09-04 | 西安电子工程研究所 | Electromagnetic shielding and sealing water-proof method for onboard electronic nacelle body covering cap |
| JP2015046464A (en) * | 2013-08-28 | 2015-03-12 | 株式会社オートネットワーク技術研究所 | Housing for electrical equipment of automobile, and electrical equipment of automobile |
-
1996
- 1996-03-28 JP JP07402396A patent/JP3523959B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110263A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Heat dissipation structure, package assembly and heat dissipation sheet |
| CN103281891A (en) * | 2013-05-08 | 2013-09-04 | 西安电子工程研究所 | Electromagnetic shielding and sealing water-proof method for onboard electronic nacelle body covering cap |
| JP2015046464A (en) * | 2013-08-28 | 2015-03-12 | 株式会社オートネットワーク技術研究所 | Housing for electrical equipment of automobile, and electrical equipment of automobile |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3523959B2 (en) | 2004-04-26 |
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