JPH09253995A - Detent surface engraving method for ceramics flat plate - Google Patents
Detent surface engraving method for ceramics flat plateInfo
- Publication number
- JPH09253995A JPH09253995A JP5919596A JP5919596A JPH09253995A JP H09253995 A JPH09253995 A JP H09253995A JP 5919596 A JP5919596 A JP 5919596A JP 5919596 A JP5919596 A JP 5919596A JP H09253995 A JPH09253995 A JP H09253995A
- Authority
- JP
- Japan
- Prior art keywords
- shaft
- flat plate
- grindstone
- ceramic flat
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、円盤状のセラミッ
クス平板に法面を持つ凹面を彫り込み加工する方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for engraving a concave surface having a slope on a disk-shaped ceramic flat plate.
【０００２】[0002]
【従来の技術】凹面付きの円盤状セラミックス平板の凹
面を所定の寸法精度に精密加工するには、図３に示され
るようにセラミックス平板１を内面研削盤やフライス盤
等の主軸２に取り付けてその中心軸Ｃ0 の回りに回転さ
せながら、セラミックス平板１の中心軸Ｃ0 と平行な軸
線Ｃ1 の回りに回転する軸付き砥石３により研削加工を
行うのが普通である。このとき軸付き砥石３を先端にテ
ーパ面４を持つ総形砥石としておけば、軸付き砥石３の
先端面５により彫り込み凹面の底面６が研削され、また
軸付き砥石３のテーパ面４により彫り込み凹面の法面７
が研削されることとなる。また、図４に示されるような
テーパ面を持たない軸付き砥石９であっても、ＮＣ装置
付きの研削盤であれば、軸付き砥石９に矢Ａのような動
作を行わせることによって凹面の底面６と法面７とが研
削できる。2. Description of the Related Art In order to precisely machine a concave surface of a disk-shaped ceramics flat plate having a concave surface to a predetermined dimensional accuracy, the ceramics flat plate 1 is attached to a spindle 2 of an inner surface grinding machine or a milling machine as shown in FIG. while rotating around the central axis C 0, it is usual to carry out the grinding by shafted grindstone 3 which rotates about the central axis C 0 axis parallel C 1 of the ceramic plate 1. At this time, if the grindstone 3 with a shaft is formed as a full-form grindstone having a tapered surface 4 at the tip, the tip surface 5 of the grindstone 3 with a shaft engraves the concave bottom surface 6 and the tapered surface 4 of the grindstone 3 with a shaft carves Concave slope 7
Will be ground. Further, even in the case of the grindstone 9 with a shaft having no taper surface as shown in FIG. 4, if the grinder with an NC device is used, the grindstone 9 with a shaft is caused to perform an operation like an arrow A to form a concave surface. The bottom surface 6 and the slope 7 can be ground.
【０００３】ところがこの図３の方法では、軸付き砥石
３の先端面５がセラミックス平板１と面接触するため、
接触面の発熱が大きく研削抵抗が大きくなる。その結
果、頻繁に軸付き砥石３のドレッシングを行う必要があ
り作業性が悪いこと、砥石の寿命を考慮すると粗い砥粒
を硬質ボンドで結合した軸付き砥石３を用いる必要があ
り更に研削抵抗が上昇すること、仕上げ用にレジンボン
ド砥石を使用するが、この場合にもレジンボンド砥石へ
の負荷が大きいためにその切込み量を１パス当たり20μ
m 以下としなければならず、仕上げにも長時間を要する
こと等の問題があった。However, in the method of FIG. 3, since the tip surface 5 of the grindstone 3 with a shaft comes into surface contact with the ceramic flat plate 1,
The contact surface generates a large amount of heat and the grinding resistance increases. As a result, it is necessary to frequently perform the dressing of the grindstone with a shaft 3 and the workability is poor. Considering the life of the grindstone, it is necessary to use the grindstone with a shaft 3 in which coarse abrasive grains are bonded by a hard bond, and further the grinding resistance is further increased. Ascending and using a resin bond grindstone for finishing, but in this case as well, since the load on the resin bond grindstone is large, the depth of cut is 20μ per pass.
It has to be less than m and there is a problem that it takes a long time to finish.
【０００４】また、図５に示すようにセラミックス平板
１を端面研削盤やフライス盤等の主軸２に取り付けてそ
の中心軸Ｃ0 の回りに回転させながら、セラミックス平
板１の中心軸Ｃ0 に対して直角な軸線Ｃ2 の回りに回転
する円盤状の軸付き砥石８により研削加工を行うことも
考えられる。この方法は図３及び図４の方法とは異な
り、軸付き砥石８とセラミックス平板１とが線接触する
ので、接触部の発熱量が小さく研削抵抗も小さくなる。Further, as shown in FIG. 5, the ceramic flat plate 1 is attached to a spindle 2 of an end face grinding machine or a milling machine and rotated about its central axis C 0 , while the ceramic flat plate 1 is rotated with respect to the central axis C 0 of the ceramic flat plate 1. It is also conceivable to carry out the grinding process by means of a disk-shaped grindstone 8 with a shaft that rotates around a perpendicular axis C 2 . This method differs from the methods shown in FIGS. 3 and 4 in that the grindstone 8 with a shaft and the ceramic flat plate 1 make a line contact, so that the amount of heat generated at the contact portion is small and the grinding resistance is also small.
【０００５】しかしこの方法では図６に示したように、
軸付き砥石８を彫り込み凹面の法面７に接近させて行く
と、軸付き砥石８とセラミックス平板１との線接触して
いる研削部Ａが法面７に接触する前に、軸付き砥石８の
両側のコーナー部Ｂが法面７に接触してしまう。このた
めに実際には図５のように法面７の下端に軸付き砥石８
を当てることができず、法面７を正確な斜面に研削する
ことができないという問題があった。However, in this method, as shown in FIG.
When the grindstone 8 with a shaft is approached to the carved concave slope 7, the grindstone A with a shaft 8 and the ceramic flat plate 1 are in line contact with each other before the ground portion A comes into contact with the slope 7. The corner portions B on both sides of the contact surface contact the slope 7. Therefore, in practice, as shown in FIG. 5, a grindstone 8 with a shaft is attached to the lower end of the slope 7.
However, there was a problem that the slope 7 could not be ground to an accurate slope.
【０００６】[0006]
【発明が解決しようとする課題】本発明は上記した従来
の問題点を解決して、セラミックス平板に彫り込み凹面
を作業性良く、かつ面精度良く研削加工することがで
き、しかも法面を正確な形状に研削することができるセ
ラミックス平板の凹面彫り込み加工方法を提供するため
になされたものである。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and allows a concave surface to be engraved on a ceramic flat plate to be ground with good workability and surface accuracy, and the slope to be cut accurately. The present invention has been made to provide a method for engraving a concave surface of a ceramic flat plate that can be ground into a shape.
【０００７】[0007]
【課題を解決するための手段】上記の課題を解決するた
めになされた本発明は、セラミックス平板をその中心軸
の回りに回転させつつ、円筒面の先端にテーパ面を持つ
軸付き砥石を、そのテーパ面が彫り込み凹面の底面に接
触し、円筒面が彫り込み凹面の法面に接触するよう傾斜
させた軸の回りに回転させながら、セラミックス平板に
凹面を彫り込むことを特徴とするものである。なお、セ
ラミックス平板の中心軸に対する軸付き砥石の軸の傾斜
角を２〜20度とし、テーパ面の軸線方向の長さを２〜５
mmとした軸付き砥石を用いることが好ましい。SUMMARY OF THE INVENTION The present invention, which has been made to solve the above problems, provides a shaft-attached grindstone having a tapered surface at the tip of a cylindrical surface while rotating a ceramic flat plate around its central axis. The tapered surface is in contact with the bottom surface of the engraved concave surface, and the cylindrical surface is engraved with the concave surface while rotating around an axis inclined so that the cylindrical surface contacts the slope of the engraved concave surface. . The inclination angle of the axis of the grindstone with a shaft relative to the central axis of the ceramic flat plate is 2 to 20 degrees, and the length of the tapered surface in the axial direction is 2 to 5 degrees.
It is preferable to use a grindstone with a shaft of mm.
【０００８】[0008]
【発明の実施の形態】以下に図１、図２を参照しつつ、
本発明の好ましい実施の形態を説明する。図１におい
て、１は加工されるセラミックス平板であり、内面研削
盤やフライス盤等の主軸２に取り付けてその中心軸Ｃ0
の回りに回転させる。10は本発明において用いられる軸
付き砥石であって、軸11と円筒面12と先端のテーパ面13
とを備えたものである。DETAILED DESCRIPTION OF THE INVENTION Referring to FIGS. 1 and 2,
A preferred embodiment of the present invention will be described. In FIG. 1, reference numeral 1 denotes a ceramic flat plate to be processed, which is attached to a main shaft 2 of an inner surface grinding machine, a milling machine or the like and has a central axis C 0.
Rotate around. 10 is a grindstone with a shaft used in the present invention, the shaft 11, a cylindrical surface 12 and a tapered surface 13 at the tip.
It is provided with.
【０００９】本発明では図示のように、軸付き砥石10の
テーパ面13をセラミックス平板１の彫り込み凹面の底面
６に接触させ、円筒面12を彫り込み凹面の法面７に接触
させることができるように軸付き砥石10を傾斜させる。
そして軸付き砥石10をこのように傾斜させた軸線Ｃ3 の
回りに回転させながら、矢印のようにセラミックス平板
１の表面に沿って移動させつつ凹面を彫り込む。In the present invention, as shown in the drawing, the tapered surface 13 of the grindstone with a shaft 10 can be brought into contact with the bottom surface 6 of the concave engraving surface of the ceramic flat plate 1, and the cylindrical surface 12 can be brought into contact with the sloped surface 7 of the concave engraving surface. Tilt the whetstone 10 with a shaft.
Then, while rotating the grindstone 10 with a shaft around the axis C 3 inclined in this way, the concave surface is engraved while moving along the surface of the ceramic flat plate 1 as indicated by the arrow.
【００１０】このような加工方法を取れば、軸付き砥石
10のテーパ面13と円筒面12がともにセラミックス平板１
に対して線接触した状態で研削加工が行われるので、発
熱量が少なくかつ研削抵抗も小さくなる。その結果、砥
石の寿命も長くなり頻繁にドレッシングを行う必要がな
くなるうえ、面精度もRa＝0.4 μm 以下と良くなる。ま
たこの方法によれば図１に示すとおり軸付き砥石10の円
筒面12を彫り込み凹面の法面７に正確に接触させること
ができるため、所望の形状に法面７の加工を行うことが
できる。With such a processing method, a grindstone with a shaft
Both the tapered surface 13 and the cylindrical surface 12 of 10 are ceramic flat plates 1
Since the grinding is performed in a state of being in line contact with, the amount of heat generation is small and the grinding resistance is small. As a result, the life of the grindstone is extended, frequent dressing is not required, and the surface accuracy is Ra = 0.4 μm or less. Further, according to this method, as shown in FIG. 1, the cylindrical surface 12 of the grindstone 10 with a shaft can be accurately brought into contact with the sloped concave surface 7, so that the sloped surface 7 can be processed into a desired shape. .
【００１１】また図２に示すように、ＮＣ装置付きの研
削盤であれば軸付き砥石10の円筒面12を法面７に接触さ
せなくても、テーパ面13を使用して矢Ａのような動作に
より法面７の加工ができる。As shown in FIG. 2, in the case of a grinder equipped with an NC device, even if the cylindrical surface 12 of the grindstone 10 with a shaft is not brought into contact with the slope 7, the tapered surface 13 is used to form an arrow A. The slope 7 can be processed by various operations.
【００１２】なお、セラミックス平板１の中心軸Ｃ0 に
対して軸付き砥石10の軸線Ｃ3 がなす傾斜角αは２〜20
度とすることが好ましい。これは傾斜角αが２度未満で
あると、軸付き砥石10のテーパ面13とセラミックス平板
１の彫り込み凹面の底面６との間に冷却液を供給するこ
とが困難となり、研削不良を生じ易いためである。逆に
この傾斜角αが大きくなると、法面７の形状が制限され
てしまうため汎用性が少なくなり、好ましくない。また
傾斜角αが大きくなると図１に示すように研削力Ｆの分
力ｆ（Ｆsin α) が大きくなり、小径の軸付き砥石10を
使用する場合には軸付き砥石10の軸11に作用する曲げ荷
重が大きくなって研削中に振動したり折損のおそれがあ
るので、傾斜角αは小さい方が好ましく、φ25以上の凹
面加工において傾斜角αの上限は20度程度である。The inclination angle α formed by the axis C 3 of the grindstone 10 with the axis with respect to the central axis C 0 of the ceramic flat plate 1 is 2 to 20.
It is preferable to set the frequency. This is because if the inclination angle α is less than 2 degrees, it becomes difficult to supply the cooling liquid between the tapered surface 13 of the grindstone with a shaft 10 and the bottom surface 6 of the engraved concave surface of the ceramic flat plate 1, and a grinding failure is likely to occur. This is because. On the contrary, if the inclination angle α becomes large, the shape of the slope 7 is limited, and the versatility is reduced, which is not preferable. As the inclination angle α increases, the component force f (Fsin α) of the grinding force F increases as shown in FIG. 1, and when the grindstone 10 with a small diameter shaft is used, it acts on the shaft 11 of the grindstone 10 with shaft. Since the bending load becomes large and vibration or breakage may occur during grinding, it is preferable that the inclination angle α is small, and the upper limit of the inclination angle α is about 20 degrees in the concave surface machining of φ25 or more.
【００１３】また、軸付き砥石10のテーパ面13の軸線方
向の長さＬは２〜５mmとしておくことが好ましい。これ
は長さＬが２mm未満であると彫り込み凹面の底面６が渦
巻き状となって面精度が低下し、逆に５mmを越えると軸
付き砥石10の負荷が大きくなってビビリ振動が生じ、彫
り込み凹面の底面６が波状となって面精度が低下し易い
ためである。The axial length L of the tapered surface 13 of the grindstone with a shaft 10 is preferably 2 to 5 mm. This is because when the length L is less than 2 mm, the bottom surface 6 of the engraved concave surface becomes a spiral shape and the surface accuracy deteriorates. On the contrary, when it exceeds 5 mm, the load on the grindstone 10 with a shaft increases and chatter vibration occurs, resulting in engraving. This is because the concave bottom surface 6 becomes corrugated and the surface accuracy is likely to deteriorate.
【００１４】[0014]
【実施例】直径200 mmのアルミナ製のセラミックス平板
に対して、図１に示した本発明の方法と図２に示した従
来方法とによって凹面彫り込み加工を行った。彫り込み
凹面の直径は180 mm、その深さは１mmであり、法面は底
面に対して60度の斜面である。本発明において使用した
軸付き砥石の傾斜角αは５度、テーパ面13の軸線方向の
長さＬは３mmである。その結果を表１に示す。EXAMPLE A ceramic flat plate made of alumina having a diameter of 200 mm was subjected to concave engraving by the method of the present invention shown in FIG. 1 and the conventional method shown in FIG. The diameter of the engraved concave surface is 180 mm, the depth is 1 mm, and the slope is a slope of 60 degrees with respect to the bottom surface. The grindstone with a shaft used in the present invention has an inclination angle α of 5 degrees, and the tapered surface 13 has a length L in the axial direction of 3 mm. Table 1 shows the results.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【発明の効果】以上の説明から明らかなように、本発明
のセラミックス平板の凹面彫り込み加工方法によれば、
セラミックス平板に彫り込み凹面を作業性良く、かつ面
精度良く研削加工することができる。また本発明によれ
ば砥石とセラミックス平板との干渉を回避し、彫り込み
凹面の法面を正確な形状に研削することができる利点が
ある。As is apparent from the above description, according to the method of engraving a concave surface of a ceramic flat plate of the present invention,
It is possible to grind a concave surface engraved on a ceramic flat plate with good workability and surface accuracy. Further, according to the present invention, there is an advantage that interference between the grindstone and the ceramics flat plate can be avoided, and the carved concave slope can be ground into an accurate shape.
【図１】本発明の加工方法を示す断面図である。FIG. 1 is a cross-sectional view showing a processing method of the present invention.
【図２】本発明の他の加工方法を示す断面図である。FIG. 2 is a cross-sectional view showing another processing method of the present invention.
【図３】従来の加工方法を示す断面図である。FIG. 3 is a cross-sectional view showing a conventional processing method.
【図４】従来の他の加工方法を示す断面図である。FIG. 4 is a cross-sectional view showing another conventional processing method.
【図５】従来の他の加工方法を示す断面図である。FIG. 5 is a cross-sectional view showing another conventional processing method.
【図６】図５の加工方法の問題点を説明する側面図であ
る。FIG. 6 is a side view illustrating a problem of the processing method of FIG.
１ セラミックス平板、２ 主軸、３ 従来法の軸付き
砥石、４ テーパ面、５ 軸付き砥石の先端面、６ 彫
り込み凹面の底面、７ 彫り込み凹面の法面、８ 従来
法の軸付き砥石、９ 従来法の軸付き砥石、10 本発明
において用いられる軸付き砥石、11 軸、12 円筒面、
13 テーパ面、Ｃ0 セラミックス平板の中心軸、Ｃ1
Ｃ0 に対して平行な軸線、Ｃ2 Ｃ0 に対して直角な
軸線、、Ｃ3 Ｃ0 に対して傾斜させた軸線、α 傾斜
角、L 軸付き砥石のテーパ面の軸線方向の長さ1 ceramic flat plate, 2 spindle, 3 conventional grinding wheel with shaft, 4 taper surface, 5 tip surface of grinding wheel with 6 shaft, 6 bottom surface of engraved concave surface, 7 concave surface of engraved surface, 8 conventional grinding wheel with shaft, 9 conventional Method whetstone with shaft, 10 whetstone with shaft used in the present invention, 11 axis, 12 cylindrical surface,
13 Tapered surface, C 0 Central axis of ceramic flat plate, C 1
C 0 axis parallel with respect to, an axis perpendicular ,, C 3 C 0 axis that is inclined with respect, alpha tilt angle, the axial length of the tapered surface of the L axis with the grinding wheel with respect to C 2 C 0
Claims (3)
回転させつつ、円筒面の先端にテーパ面を持つ軸付き砥
石を、そのテーパ面が彫り込み凹面の底面に接触するよ
うに傾斜させた軸の回りに回転させながら、セラミック
ス平板に凹面を彫り込むことを特徴とするセラミックス
平板の凹面彫り込み加工方法。Claim: What is claimed is: 1. A ceramic grindstone is rotated about its central axis, while a grindstone with a shaft having a tapered surface at the tip of a cylindrical surface is inclined so that the tapered surface contacts the bottom surface of the engraved concave surface. A method for engraving a concave surface of a ceramic flat plate, which comprises engraving a concave surface on the ceramic flat plate while rotating it around.
き砥石の軸の傾斜角を２〜20度として加工を行う請求項
１に記載のセラミックス平板の凹面彫り込み加工方法。2. The method for engraving a concave surface of a ceramic flat plate according to claim 1, wherein the grindstone with a shaft has a tilt angle of 2 to 20 degrees with respect to a central axis of the ceramic flat plate.
した軸付き砥石を用いる請求項１に記載のセラミックス
平板の凹面彫り込み加工方法。3. The method for engraving a concave surface of a ceramic flat plate according to claim 1, wherein a grindstone with a shaft having a taper surface with an axial length of 2 to 5 mm is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5919596A JPH09253995A (en) | 1996-03-15 | 1996-03-15 | Detent surface engraving method for ceramics flat plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5919596A JPH09253995A (en) | 1996-03-15 | 1996-03-15 | Detent surface engraving method for ceramics flat plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09253995A true JPH09253995A (en) | 1997-09-30 |
Family
ID=13106406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5919596A Pending JPH09253995A (en) | 1996-03-15 | 1996-03-15 | Detent surface engraving method for ceramics flat plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09253995A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016162979A1 (en) * | 2015-04-08 | 2016-10-13 | 三菱電機株式会社 | Grinding method and grinding apparatus |
-
1996
- 1996-03-15 JP JP5919596A patent/JPH09253995A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016162979A1 (en) * | 2015-04-08 | 2016-10-13 | 三菱電機株式会社 | Grinding method and grinding apparatus |
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