JPH09252030A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPH09252030A
JPH09252030A JP8058852A JP5885296A JPH09252030A JP H09252030 A JPH09252030 A JP H09252030A JP 8058852 A JP8058852 A JP 8058852A JP 5885296 A JP5885296 A JP 5885296A JP H09252030 A JPH09252030 A JP H09252030A
Authority
JP
Japan
Prior art keywords
capillary
bonding
ultrasonic horn
hole
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8058852A
Other languages
Japanese (ja)
Inventor
Fumishi Nagasawa
史司 永澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Japan Semiconductor Corp
Original Assignee
Toshiba Corp
Iwate Toshiba Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Iwate Toshiba Electronics Co Ltd filed Critical Toshiba Corp
Priority to JP8058852A priority Critical patent/JPH09252030A/en
Publication of JPH09252030A publication Critical patent/JPH09252030A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78308—Removable capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a wire bonding device in which there is little fear that ultrasonic vibration transmitted to a capillary is not changed even at the time of replacement, so that a bonding work is easy and not troublesome. SOLUTION: An attaching part 23 for vertically supporting a capillary 22 for holding a bonding wire and executing bonding is formed at the end of an ultrasonic horn 21. The attaching part 23 is constructed by an attaching hole 28 and a slit 29. A projection 32 in contact with the outer face of a right cylindrical part 24 of the capillary 22 to hold the capillary 22 is formed on the inner face of the attaching hole 28 for directly supporting the capillary 22. By screwing a screw 35 into a screw hole formed in the attaching part 23, a gap 29a of the slit 29 is narrowed and the top 32a of the projection 32 always comes into contact with the outer face of the capillary 22. Consequently, the impedance is hardly changed every bonding and the conversion efficiency of ultrasonic energy is constant.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、例えば半導体装置
の製造工程でリードフレーム上にマウントされたチップ
のパッド部とリードフレームのリード部に、ボンディン
グワイヤを超音波接合するために使用されるワイヤボン
ディング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire used for ultrasonically bonding a bonding wire to a pad portion of a chip mounted on a lead frame and a lead portion of the lead frame in a semiconductor device manufacturing process. Bonding apparatus

【０００２】[0002]

【従来の技術】従来、ワイヤボンディング装置のうち超
音波によってボンディングワイヤを接合する装置におい
ては、超音波ホーンの先端部に取着されたキャピラリに
先端からボンディングワイヤを引き出すよう挿通保持
し、接合を行う部位にボンディングワイヤをキャピラリ
に超音波を加えながら押圧して接合がなされる。2. Description of the Related Art Conventionally, in a wire bonding apparatus for bonding bonding wires by ultrasonic waves, a capillary attached to the tip of an ultrasonic horn is inserted and held so as to pull out the bonding wire from the tip, and bonding is performed. Bonding is performed by pressing the bonding wire to the part to be performed while applying ultrasonic waves to the capillary.

【０００３】以下、従来のワイヤボンディング装置の要
部について図９及び図１０を参照して説明する。図９は
要部の斜視図であり、図１０は超音波ホーンの先端部の
平面図である。The main part of the conventional wire bonding apparatus will be described below with reference to FIGS. 9 and 10. FIG. 9 is a perspective view of a main part, and FIG. 10 is a plan view of the tip of the ultrasonic horn.

【０００４】図９及び図１０において、１は先細となる
ように形成された超音波ホーンであり、２は超音波ホー
ン１の先端部の取着部３に取り付けられたキャピラリで
ある。キャピラリ２は、直円筒部４とテーパー部５とで
構成され、両部の中心部分には貫通するようにワイヤ挿
通孔６が形成されている。In FIGS. 9 and 10, reference numeral 1 is an ultrasonic horn formed so as to be tapered, and 2 is a capillary attached to the attachment portion 3 at the tip of the ultrasonic horn 1. The capillary 2 is composed of a right cylindrical portion 4 and a tapered portion 5, and a wire insertion hole 6 is formed in the central portion of both portions so as to penetrate therethrough.

【０００５】また超音波ホーン１の取着部３には、キャ
ピラリ２の直円筒部４の外径に略等しい内径を有する取
着孔７と、すり割り８及びねじ孔９と固定孔１０が形成
されていて、キャピラリ２はその直円筒部４を超音波ホ
ーン１の取着孔７に差し込まれた状態で、ねじ孔９に固
定孔１０を介してねじ１１を螺着することにより固定さ
れている。Further, the attachment portion 3 of the ultrasonic horn 1 is provided with an attachment hole 7 having an inner diameter substantially equal to the outer diameter of the right cylindrical portion 4 of the capillary 2, a slot 8, a screw hole 9 and a fixing hole 10. The capillary 2 is formed and fixed by screwing a screw 11 into a screw hole 9 through a fixing hole 10 in a state where the right cylindrical portion 4 is inserted into the attachment hole 7 of the ultrasonic horn 1. ing.

【０００６】さらに、キャピラリ２のワイヤ挿通孔６に
はボンディングワイヤ１２が、直円筒部４側の端部分か
らテーパー部５の先細となった先端部分にかけて挿通さ
れており、テーパー部５の先端部分からボンディングワ
イヤ１２の先端部分が出た状態になっている。Further, a bonding wire 12 is inserted through the wire insertion hole 6 of the capillary 2 from the end portion on the right cylindrical portion 4 side to the tapered tip portion of the taper portion 5, and the tip portion of the taper portion 5 is formed. The tip portion of the bonding wire 12 is exposed from.

【０００７】そして、ボンディングワイヤ１２を接合部
分に超音波接合する際には、ボンディングワイヤ１２が
出ているキャピラリ２の先細の先端部分を、超音波ホー
ン１を介して超音波を加えながら接合する部位に押し当
てることによって超音波接合が行われる。When the bonding wire 12 is ultrasonically bonded to the bonding portion, the tapered tip portion of the capillary 2 from which the bonding wire 12 is exposed is bonded while applying ultrasonic waves through the ultrasonic horn 1. Ultrasonic bonding is performed by pressing on the site.

【０００８】このような従来の従来技術においてはキャ
ピラリ２の超音波ホーン１への取り付けが、キャピラリ
２を取着孔７に差し込んだ状態ですり割り８のギャプを
利用し、ねじ１１を螺着し固定することによって行われ
ており、キャピラリ２の直円筒部４の外面が取着孔７の
孔内面に全面接触するようにして取り付けられる。In the conventional prior art as described above, the capillary 2 is attached to the ultrasonic horn 1 in a state where the capillary 2 is inserted into the attachment hole 7 by using the gap 8 and the screw 11 is screwed. The outer surface of the straight cylindrical portion 4 of the capillary 2 is attached so that the outer surface of the right cylindrical portion 4 of the capillary 2 is in full contact with the inner surface of the mounting hole 7.

【０００９】しかしながら、キャピラリ２の外面加工及
び取着孔７の内面加工にそれぞればらつきがあるため、
超音波ホーン１とキャピラリ２が全面で接触せず一部の
みで接触する形態となる。このため、取着部３にキャピ
ラリ２を取り付ける度に接触面積が変化し、接触面積が
変化することでキャピラリ２の超音波ホーン１への取り
付け部分においてインピーダンスが変化する虞がある。However, there are variations in the machining of the outer surface of the capillary 2 and the machining of the inner surface of the attachment hole 7,
The ultrasonic horn 1 and the capillary 2 are not in contact with each other over the entire surface, but are in contact with each other only partially. Therefore, the contact area changes each time the capillary 2 is attached to the attachment portion 3, and the impedance may change at the attachment portion of the capillary 2 to the ultrasonic horn 1 due to the change of the contact area.

【００１０】これによって超音波ホーン１でのキャピラ
リ２への超音波エネルギの変換効率が一定でなくなり、
超音波ホーン１からキャピラリ２に伝達される超音波振
動が変化するものとなっていた。その結果、ボンディン
グワイヤ１２の接合に際し、常に接合条件をチェックし
たり調整したりする必要が生じ、手間が掛かり接合作業
をやり難いものとしていた。As a result, the conversion efficiency of the ultrasonic energy to the capillary 2 in the ultrasonic horn 1 is not constant,
The ultrasonic vibration transmitted from the ultrasonic horn 1 to the capillary 2 was changed. As a result, when bonding the bonding wire 12, it is necessary to constantly check and adjust the bonding conditions, which is troublesome and difficult to perform the bonding work.

【００１１】[0011]

【発明が解決しようとする課題】上記のように超音波ホ
ーンの取着部にキャピラリを取り付ける度にキャピラリ
に伝達される超音波振動が変化し、接合を行う際にはそ
の都度接合条件のチェックや調整が必要となり、接合作
業を手間が掛かるやり難いものとしていた。このような
状況に鑑みて本発明はなされたもので、キャピラリに伝
達される超音波振動が取り替えを行った場合でも変化す
る虞がなく、接合作業がやり易く手間が掛からないもの
とするワイヤボンディング装置を提供することを目的と
する。As described above, the ultrasonic vibration transmitted to the capillary changes every time the capillary is attached to the attachment portion of the ultrasonic horn, and the bonding condition is checked each time the bonding is performed. It was necessary to make adjustments and adjustments, making the joining work difficult and difficult. The present invention has been made in view of such a situation, and there is no fear that the ultrasonic vibration transmitted to the capillaries will change even when replacement is performed, and the bonding work is easy and labor-free. The purpose is to provide a device.

【００１２】[0012]

【課題を解決するための手段】本発明のワイヤボンディ
ング装置は、ボンディングワイヤを保持してボンディン
グを行うキャピラリと、このキャピラリを取着部に支持
する超音波ホーンとを備えてなるワイヤボンディング装
置において、取着部は、取着孔とすり割りとによりなる
と共に、該取着孔の孔内面にキャピラリの外面に当接し
該キャピラリを保持する凸部が形成されていることを特
徴とするものであり、さらに、凸部が、取着孔の貫通方
向に複数延在する直線状の凸条により形成されたもので
あることを特徴とするものであり、さらに、凸条は、断
面形状が台形をなすと共に１２０°間隔で３本設けられ
ていることを特徴とするものであり、さらに、凸部が、
螺旋状の凸条により形成されたものであることを特徴と
するものであり、さらに、凸部が、複数の突起により形
成されたものであることを特徴とするものである。A wire bonding apparatus of the present invention is a wire bonding apparatus comprising a capillary for holding a bonding wire for bonding and an ultrasonic horn for supporting the capillary in a mounting portion. The attachment part is composed of an attachment hole and a slot, and a convex part that is in contact with the outer surface of the capillary and holds the capillary is formed on the inner surface of the hole of the attachment hole. Further, the convex portion is formed by a plurality of linear ridges extending in the penetrating direction of the attachment hole, and the ridge has a trapezoidal sectional shape. And three projections are provided at 120 ° intervals.
The present invention is characterized in that it is formed by a spiral ridge, and further that the projection is formed by a plurality of protrusions.

【００１３】[0013]

【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して説明する。Embodiments of the present invention will be described below with reference to the drawings.

【００１４】まず、第１の実施形態を図１乃至図４によ
り説明する。図１は要部の斜視図であり、図２は要部の
平面図であり、図３は超音波ホーンの先端部の一部断面
にして示す斜視図であり、図４はキャピラリの正面図で
ある。First, a first embodiment will be described with reference to FIGS. 1 is a perspective view of a main portion, FIG. 2 is a plan view of the main portion, FIG. 3 is a perspective view showing a partial cross section of a tip portion of an ultrasonic horn, and FIG. 4 is a front view of a capillary. Is.

【００１５】図１乃至図４において、２１は所定のテー
パー状が付けられ先細となるように形成された超音波ホ
ーンで、図示しない超音波源に接続されている。超音波
ホーン２１は水平方向に延在するように設けられ、その
先端部には棒状のキャピラリ２２を垂直となるように取
り付けるための取着部２３が形成されている。In FIGS. 1 to 4, reference numeral 21 denotes an ultrasonic horn formed into a taper with a predetermined taper shape, which is connected to an ultrasonic source (not shown). The ultrasonic horn 21 is provided so as to extend in the horizontal direction, and an attachment portion 23 for vertically attaching a rod-shaped capillary 22 is formed at the tip portion thereof.

【００１６】キャピラリ２２は上方側に直円筒部２４、
下方側にテーパー部２５を設けて構成され、両部は中心
部分に連通するようにワイヤ挿通孔２６が貫通してお
り、このワイヤ挿通孔２６にはボンディングワイヤ２７
が、直円筒部２４側の上端部分からテーパー部２５の先
細となった先端部分にかけて挿通されており、接合に際
してテーパー部２５の先端部分からボンディングワイヤ
２７の先端が延出するようになっている。The capillary 22 has an upright cylindrical portion 24,
A taper portion 25 is provided on the lower side, and a wire insertion hole 26 penetrates through both portions so as to communicate with the central portion. The wire insertion hole 26 has a bonding wire 27.
Is inserted from the upper end portion on the right cylindrical portion 24 side to the tapered tip portion of the taper portion 25, and the tip of the bonding wire 27 extends from the tip portion of the taper portion 25 during joining. .

【００１７】また、超音波ホーン２１の取着部２３には
取着孔２８と、すり割り２９及びねじ孔３０と固定孔３
１が形成されている。取着孔２８は超音波ホーン２１を
垂直方向に貫通するように形成されており、孔内面には
１２０°間隔で３本の断面形状が台形の直線状の凸条３
２により形成された凸部が、取着孔２８の貫通方向に設
けられている。そして３本の凸条３２の頂部３２ａによ
り形成される円筒状の包絡面は、キャピラリ２２の直円
筒部２４の外径に略等しい直径を有するようになってい
る。The attachment portion 23 of the ultrasonic horn 21 has an attachment hole 28, a slot 29, a screw hole 30, and a fixing hole 3.
1 is formed. The attachment holes 28 are formed so as to penetrate the ultrasonic horn 21 in the vertical direction, and three linear projections 3 each having a trapezoidal cross section are formed on the inner surface of the hole at 120 ° intervals.
The convex portion formed by 2 is provided in the penetrating direction of the attachment hole 28. The cylindrical envelope surface formed by the top portions 32a of the three convex stripes 32 has a diameter substantially equal to the outer diameter of the right cylindrical portion 24 of the capillary 22.

【００１８】また、すり割り２９は超音波ホーン２１の
先端から根元方向に向け所定の隙間２９ａが設けられる
ように形成されたもので、超音波ホーン２１の先端に割
り方向が垂直方向となるように割り口２９ｂが形成され
ると共に、取着孔２８の中心線を通るようにして深く割
り込んだ形態となっている。The slot 29 is formed so that a predetermined gap 29a is provided from the tip of the ultrasonic horn 21 toward the root, and the split direction is perpendicular to the tip of the ultrasonic horn 21. A split opening 29b is formed in the groove and a deep cut is formed so as to pass through the center line of the attachment hole 28.

【００１９】これに対しねじ孔３０と固定孔３１は、超
音波ホーン２１の隙間２９ａをおいて分離された部分の
取着孔２８よりも根元側に、互いの中心線が一致するよ
うにしてすり割り２９に直交するように形成されてい
る。さらに、ねじ孔３０と固定孔３１が開口する超音波
ホーン２１の外面には、凹部３３，３４が各孔にそれぞ
れの底面が直交するように設けられている。なお、３５
はねじ孔３０に固定孔３１を介し螺着されるねじであ
る。On the other hand, the screw hole 30 and the fixing hole 31 have their center lines aligned with each other on the root side of the attachment hole 28 of the portion separated by the gap 29a of the ultrasonic horn 21. It is formed so as to be orthogonal to the slot 29. Further, recesses 33 and 34 are provided on the outer surface of the ultrasonic horn 21 where the screw holes 30 and the fixing holes 31 are opened such that the bottom surfaces of the holes are orthogonal to each other. Note that 35
Is a screw screwed into the screw hole 30 through the fixing hole 31.

【００２０】また、取着部２３にはキャピラリ２２が、
取着孔２８に差し込んだ状態で固定孔３１を介しねじ孔
３０にねじ３５を螺着することによって取り付けられて
いる。すなわち、ねじ３５を締め込むことによってすり
割り２９の隙間２９ａが少なくなり、キャピラリ２２の
直円筒部２４の外面に取着孔２８の３本の凸条３２の頂
部３２ａが当接し、さらにねじ３５を締め込むことによ
って凸条３２の頂部３２ａが直円筒部２４の外面を押圧
し、キャピラリ２２が取着部２３に取り付けられる。Further, the capillary 22 is attached to the attaching portion 23.
It is attached by screwing a screw 35 into a screw hole 30 through a fixing hole 31 in a state of being inserted into the attachment hole 28. That is, by tightening the screw 35, the gap 29a of the slot 29 is reduced, and the tops 32a of the three ridges 32 of the attachment hole 28 come into contact with the outer surface of the right cylindrical portion 24 of the capillary 22, and the screw 35 By tightening, the top portion 32a of the ridge 32 presses the outer surface of the straight cylindrical portion 24, and the capillary 22 is attached to the attachment portion 23.

【００２１】さらに、キャピラリ２２のワイヤ挿通孔２
６にはボンディングワイヤ２７が、直円筒部２４側の端
部分からテーパー部２５の先細となった先端部分にかけ
て挿通されており、テーパー部２５の先端部分からボン
ディングワイヤ２７の先端部分が出た状態になってい
る。Further, the wire insertion hole 2 of the capillary 22
6, the bonding wire 27 is inserted from the end portion on the right cylindrical portion 24 side to the tapered tip portion of the taper portion 25, and the tip portion of the bonding wire 27 is protruded from the tip portion of the taper portion 25. It has become.

【００２２】そして、ボンディングワイヤ２７を接合部
分に超音波接合する際には、ボンディングワイヤ２７が
出ているキャピラリ２２の先細の先端部分を、超音波ホ
ーン２１を介して超音波を加えながら接合する部位に押
し当てることによって超音波接合が行われる。When ultrasonically bonding the bonding wire 27 to the bonding portion, the tapered tip portion of the capillary 22 from which the bonding wire 27 is exposed is bonded while applying ultrasonic waves through the ultrasonic horn 21. Ultrasonic bonding is performed by pressing on the site.

【００２３】このように構成されたものでは、取着部２
３へのキャピラリ２２の取り付け取り外しは、ねじ３５
を締め込んだり緩めたりすることによって行われ、これ
にともない取着孔２８の直線状の凸条３２の頂部３２ａ
が、キャピラリ２２の直円筒部２４の外面に押圧するよ
うにして確実に接触したり、また離れたりする。In the structure thus constructed, the attaching portion 2
Attaching and detaching the capillary 22 to and from the
Is performed by tightening or loosening, and the top 32a of the linear ridge 32 of the attachment hole 28 is accompanied by this.
However, the outer surface of the right cylindrical portion 24 of the capillary 22 is pressed to surely contact with or separate from the outer surface.

【００２４】このため、キャピラリ２２の取り外しを行
い、再び取り付けを行った場合でも、その前後での超音
波ホーン２１とキャピラリ２２との接触面積の変化が少
ないものとなり、取り付けを行う度にキャピラリ２２の
超音波ホーン２１への取り付け部分におけるインピーダ
ンスの変化は少ないものとなる。Therefore, even if the capillary 22 is removed and then attached again, the contact area between the ultrasonic horn 21 and the capillary 22 before and after the change is small, and the capillary 22 is attached each time it is attached. The change in impedance at the portion where the above is attached to the ultrasonic horn 21 is small.

【００２５】そして超音波ホーン２１からキャピラリ２
２への超音波エネルギの変換効率が一定したものとな
り、超音波ホーン２１からキャピラリ２２に伝達される
超音波振動の変化は少なくなる。その結果、ボンディン
グワイヤ２７の接合に際し、常に接合条件をチェックし
たり調整したりする必要がなくなり、接合作業はやり易
くなり、手間が掛からないものとなる。Then, from the ultrasonic horn 21 to the capillary 2
The conversion efficiency of the ultrasonic energy into 2 becomes constant, and the change of the ultrasonic vibration transmitted from the ultrasonic horn 21 to the capillary 22 becomes small. As a result, when bonding the bonding wire 27, it is not necessary to always check or adjust the bonding conditions, and the bonding work is easy and labor-free.

【００２６】次に、第２の実施形態を図５及び図６によ
り説明する。図５は要部の平面図であり、図６は超音波
ホーンの先端部の一部断面にして示す斜視図である。Next, a second embodiment will be described with reference to FIGS. FIG. 5 is a plan view of a main part, and FIG. 6 is a perspective view showing a partial cross section of the tip of the ultrasonic horn.

【００２７】図５及び図６において、４１は所定のテー
パー状が付けられ先細となるように形成された超音波ホ
ーンで、図示しない超音波源に接続されている。超音波
ホーン４１は水平方向に延在するように設けられ、その
先端部には棒状のキャピラリ２２を垂直となるように取
り付けるための取着部４２が形成されている。In FIGS. 5 and 6, reference numeral 41 denotes an ultrasonic horn formed into a taper with a predetermined taper shape, which is connected to an ultrasonic source (not shown). The ultrasonic horn 41 is provided so as to extend in the horizontal direction, and an attachment portion 42 for vertically attaching the rod-shaped capillaries 22 is formed at the tip portion thereof.

【００２８】この取着部４２には取着孔４３が、超音波
ホーン４１を垂直方向に貫通するように形成されてお
り、取着孔４３の中心線を通り深く割り込まれた形態の
すり割り２９によって分割された孔内面には、２本の断
面形状が台形の螺旋状の凸条４４により形成された凸部
が取着孔４３の貫通方向に設けられている。そして２本
の凸条４４の頂部４４ａにより形成される円筒状の包絡
面は、キャピラリ２２の直円筒部２４の外径に略等しい
直径を有するようになっている。An attachment hole 43 is formed in the attachment portion 42 so as to penetrate the ultrasonic horn 41 in the vertical direction, and a slot having a form that is deeply cut through the center line of the attachment hole 43. On the inner surface of the hole divided by 29, a convex portion formed by two spiral convex ridges 44 having a trapezoidal cross section is provided in the penetrating direction of the attachment hole 43. The cylindrical envelope surface formed by the tops 44a of the two convex ridges 44 has a diameter substantially equal to the outer diameter of the right cylindrical portion 24 of the capillary 22.

【００２９】また取着部４２にはキャピラリ２２が、取
着孔４３に差し込んだ状態で固定孔３１を介しねじ孔３
０にねじ３５を螺着することによって取り付けられてい
る。すなわち、ねじ３５を締め込むことによってすり割
り２９の隙間２９ａが少なくなり、キャピラリ２２の直
円筒部２４の外面に取着孔４３の２本の凸条４４の頂部
４４ａが当接し、さらにねじ３５を締め込むことによっ
て凸条４４の頂部４４ａが直円筒部２４の外面を押圧
し、キャピラリ２２が取着部４２に取り付けられる。Further, in the mounting portion 42, the capillary 22 is inserted into the mounting hole 43, and the screw hole 3 is inserted through the fixing hole 31.
It is attached by screwing a screw 35 to 0. That is, by tightening the screw 35, the gap 29a of the slot 29 is reduced, the tops 44a of the two ridges 44 of the attachment hole 43 come into contact with the outer surface of the right cylindrical portion 24 of the capillary 22, and the screw 35 By tightening, the top portion 44a of the ridge 44 presses the outer surface of the straight cylindrical portion 24, and the capillary 22 is attached to the attachment portion 42.

【００３０】そして、ボンディングワイヤ２７を接合部
分に超音波接合する際には、キャピラリ２２のワイヤ挿
通孔２６に、ボンディングワイヤ２７を先端部分がキャ
ピラリ２２のテーパー部の先端部分から出るように挿通
させ、このボンディングワイヤ２７が出ているキャピラ
リ２２の先細の先端部分を、超音波ホーン４１を介して
超音波を加えながら接合する部位に押し当てることによ
って超音波接合が行われる。When the bonding wire 27 is ultrasonically bonded to the bonding portion, the bonding wire 27 is inserted through the wire insertion hole 26 of the capillary 22 so that the tip portion of the bonding wire 27 comes out from the tip portion of the tapered portion of the capillary 22. Ultrasonic bonding is performed by pressing the tapered tip end portion of the capillary 22 from which the bonding wire 27 is exposed against the site to be bonded while applying ultrasonic waves via the ultrasonic horn 41.

【００３１】このように構成されたものでは、取着部４
２へのキャピラリ２２の取り付け取り外しは、ねじ３５
を締め込んだり緩めたりすることによって行われ、これ
にともない取着孔４３の螺旋状の凸条４４の頂部４４ａ
が、キャピラリ２２の直円筒部２４の外面に押圧するよ
うにして確実に接触したり、また離れたりする。In the structure thus constructed, the attaching portion 4
To attach and detach the capillary 22 to and from the screw 2, use the screw 35
Is performed by tightening or loosening, and the top portion 44a of the spiral ridge 44 of the attachment hole 43 is accompanied by this.
However, the outer surface of the right cylindrical portion 24 of the capillary 22 is pressed to surely contact with or separate from the outer surface.

【００３２】このため、第１の実施形態におけると同様
にキャピラリ２２の取り外しを行い、再び取り付けを行
った場合でも、その前後での超音波ホーン４１とキャピ
ラリ２２との接触面積の変化が少ないものとなり、取り
付けを行う度にキャピラリ２２の超音波ホーン４１への
取り付け部分におけるインピーダンスの変化は少ないも
のとなる。For this reason, even when the capillary 22 is removed and reattached as in the first embodiment, the contact area between the ultrasonic horn 41 and the capillary 22 before and after the change is small. Therefore, the impedance change in the portion where the capillary 22 is attached to the ultrasonic horn 41 is small each time the attachment is performed.

【００３３】そして超音波ホーン４１からキャピラリ２
２への超音波エネルギの変換効率が一定したものとなっ
て、第１の実施形態におけると同様の作用、効果が得ら
れる。Then, from the ultrasonic horn 41 to the capillary 2
The conversion efficiency of the ultrasonic energy to 2 becomes constant, and the same operation and effect as in the first embodiment can be obtained.

【００３４】次に、第３の実施形態を図７及び図８によ
り説明する。図７は要部の平面図であり、図８は超音波
ホーンの先端部の一部断面にして示す斜視図である。Next, a third embodiment will be described with reference to FIGS. FIG. 7 is a plan view of the main part, and FIG. 8 is a perspective view showing a partial cross section of the tip of the ultrasonic horn.

【００３５】図７及び図８において、５１は所定のテー
パー状が付けられ先細となるように形成された超音波ホ
ーンで、図示しない超音波源に接続されている。超音波
ホーン５１は水平方向に延在するように設けられ、その
先端部には棒状のキャピラリ２２を垂直となるように取
り付けるための取着部５２が形成されている。In FIGS. 7 and 8, reference numeral 51 denotes an ultrasonic horn formed into a taper with a predetermined taper shape, which is connected to an ultrasonic source (not shown). The ultrasonic horn 51 is provided so as to extend in the horizontal direction, and an attachment portion 52 for vertically attaching the rod-shaped capillary 22 is formed at the tip portion thereof.

【００３６】この取着部５２には取着孔５３が、超音波
ホーン５１を垂直方向に貫通するように形成されてお
り、取着孔５３の中心線を通り深く割り込まれた形態の
すり割り２９によって分割された孔内面には、複数の断
面形状が台形の突起５４により形成された凸部が設けら
れている。そして複数の突起５４の頂部５４ａにより形
成される円筒状の包絡面は、キャピラリ２２の直円筒部
２４の外径に略等しい直径を有するようになっている。An attachment hole 53 is formed in the attachment portion 52 so as to penetrate the ultrasonic horn 51 in the vertical direction, and a slot having a deeply cut shape passing through the center line of the attachment hole 53. The inner surface of the hole divided by 29 is provided with a convex portion formed by a plurality of trapezoidal protrusions 54 in cross section. The cylindrical envelope surface formed by the tops 54a of the plurality of protrusions 54 has a diameter substantially equal to the outer diameter of the right cylindrical portion 24 of the capillary 22.

【００３７】また取着部５２にはキャピラリ２２が、取
着孔５３に差し込んだ状態で固定孔３１を介しねじ孔３
０にねじ３５を螺着することによって取り付けられてい
る。すなわち、ねじ３５を締め込むことによってすり割
り２９の隙間２９ａが少なくなり、キャピラリ２２の直
円筒部２４の外面に取着孔５３の突起５４の頂部５４ａ
が当接し、さらにねじ３５を締め込むことによって突起
５４の頂部５４ａが直円筒部２４の外面を押圧し、キャ
ピラリ２２が取着部５２に取り付けられる。Further, in the attachment portion 52, the capillary 22 is inserted into the attachment hole 53 and the screw hole 3 is inserted through the fixing hole 31.
It is attached by screwing a screw 35 to 0. That is, by tightening the screw 35, the gap 29a of the slot 29 is reduced, and the top 54a of the protrusion 54 of the attachment hole 53 is formed on the outer surface of the right cylindrical portion 24 of the capillary 22.
Are abutted against each other, and by further tightening the screw 35, the top portion 54a of the protrusion 54 presses the outer surface of the right cylindrical portion 24, and the capillary 22 is attached to the attachment portion 52.

【００３８】そして、ボンディングワイヤ２７を接合部
分に超音波接合する際には、キャピラリ２２のワイヤ挿
通孔２６に、ボンディングワイヤ２７を先端部分がキャ
ピラリ２２のテーパー部の先端部分から出るように挿通
させ、このボンディングワイヤ２７が出ているキャピラ
リ２２の先細の先端部分を、超音波ホーン５１を介して
超音波を加えながら接合する部位に押し当てることによ
って超音波接合が行われる。Then, when ultrasonically bonding the bonding wire 27 to the bonding portion, the bonding wire 27 is inserted into the wire insertion hole 26 of the capillary 22 so that the distal end portion comes out from the distal end portion of the tapered portion of the capillary 22. Ultrasonic bonding is performed by pressing the tapered tip end portion of the capillary 22 from which the bonding wire 27 is exposed against the bonding site while applying ultrasonic waves via the ultrasonic horn 51.

【００３９】このように構成されたものでは、取着部５
２へのキャピラリ２２の取り付け取り外しは、ねじ３５
を締め込んだり緩めたりすることによって行われ、これ
にともない取着孔５３の突起５４の頂部５４ａが、キャ
ピラリ２２の直円筒部２４の外面に押圧するようにして
確実に接触したり、また離れたりする。In the structure thus constructed, the attachment portion 5
To attach and detach the capillary 22 to and from the screw 2, use the screw 35
Is performed by tightening or loosening, and the tops 54a of the projections 54 of the attachment holes 53 are pressed against the outer surface of the right cylindrical portion 24 of the capillary 22 to be surely brought into contact with each other or separated from each other. Or

【００４０】このため、第１の実施形態におけると同様
にキャピラリ２２の取り外しを行い、再び取り付けを行
った場合でも、その前後での超音波ホーン５１とキャピ
ラリ２２との接触面積の変化が少ないものとなり、取り
付けを行う度にキャピラリ２２の超音波ホーン５１への
取り付け部分におけるインピーダンスの変化は少ないも
のとなる。Therefore, even when the capillary 22 is detached and reattached as in the first embodiment, the contact area between the ultrasonic horn 51 and the capillary 22 before and after the change is small. Therefore, the impedance change in the portion where the capillary 22 is attached to the ultrasonic horn 51 is small each time the attachment is performed.

【００４１】そして超音波ホーン５１からキャピラリ２
２への超音波エネルギの変換効率が一定したものとなっ
て、第１の実施形態におけると同様の作用、効果が得ら
れる。Then, from the ultrasonic horn 51 to the capillary 2
The conversion efficiency of the ultrasonic energy to 2 becomes constant, and the same operation and effect as in the first embodiment can be obtained.

【００４２】[0042]

【発明の効果】以上の説明から明らかなように、本発明
は超音波ホーンに形成されたボンディングワイヤを保持
しボンディングを行うキャピラリを支持する取着部が、
取着孔とすり割りとによりなると共に、該取着孔の孔内
面にキャピラリの外面に当接し該キャピラリを保持する
凸部が形成されているよう構成したことにより、キャピ
ラリの取り替えを行った場合でも伝達される超音波振動
が変化する虞がなく、また接合作業がやり易く手間が掛
からなくなる等の効果を奏する。As is apparent from the above description, according to the present invention, the attachment portion for holding the bonding wire formed on the ultrasonic horn and supporting the capillary for bonding is
When the capillaries are replaced by being configured with a mounting hole and a slot, and by forming a convex portion for holding the capillary in contact with the outer surface of the capillary on the inner surface of the mounting hole. However, the ultrasonic vibrations transmitted are not likely to change, and the joining work is easy and labor-free.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第１の実施形態における要部を示す斜
視図である。FIG. 1 is a perspective view showing a main part according to a first embodiment of the present invention.

【図２】本発明の第１の実施形態における要部の平面図
である。FIG. 2 is a plan view of a main part according to the first embodiment of the present invention.

【図３】本発明の第１の実施形態に係る超音波ホーンの
先端部の一部断面にして示す斜視図である。FIG. 3 is a perspective view showing a partial cross section of a tip portion of the ultrasonic horn according to the first embodiment of the present invention.

【図４】本発明の第１の実施形態に係るキャピラリの正
面図である。FIG. 4 is a front view of the capillary according to the first embodiment of the present invention.

【図５】本発明の第２の実施形態における要部の平面図
である。FIG. 5 is a plan view of a main part according to a second embodiment of the present invention.

【図６】本発明の第２の実施形態に係る超音波ホーンの
先端部の一部断面にして示す斜視図である。FIG. 6 is a perspective view showing a partial cross section of a tip portion of an ultrasonic horn according to a second embodiment of the present invention.

【図７】本発明の第３の実施形態における要部の平面図
である。FIG. 7 is a plan view of a main part according to a third embodiment of the present invention.

【図８】本発明の第３の実施形態に係る超音波ホーンの
先端部の一部断面にして示す斜視図である。FIG. 8 is a perspective view showing a partial cross section of a tip portion of an ultrasonic horn according to a third embodiment of the present invention.

【図９】従来例の要部の斜視図である。FIG. 9 is a perspective view of a main part of a conventional example.

【図１０】従来例に係る超音波ホーンの先端部の平面図
である。FIG. 10 is a plan view of a tip portion of an ultrasonic horn according to a conventional example.

【符号の説明】[Explanation of symbols]

２１，４１，５１…超音波ホーン ２２…キャピラリ ２３，４２，５２…取着部 ２４…直円筒部 ２７…ボンディングワイヤ ２８，４３，５３…取着孔 ２９…すり割り ２９ａ…隙間 ３０…ねじ孔 ３２，４４…凸条 ３２ａ，４４ａ，５４ａ…頂部 ３５…ねじ ５４…突起 21, 41, 51 ... Ultrasonic horn 22 ... Capillary 23, 42, 52 ... Attachment part 24 ... Straight cylindrical part 27 ... Bonding wire 28, 43, 53 ... Attachment hole 29 ... Slot 29a ... Gap 30 ... Screw hole 32, 44 ... Convex strips 32a, 44a, 54a ... Top 35 ... Screw 54 ... Protrusion

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 ボンディングワイヤを保持してボンディ
ングを行うキャピラリと、このキャピラリを取着部に支
持する超音波ホーンとを備えてなるワイヤボンディング
装置において、前記取着部は、取着孔とすり割りとによ
りなると共に、該取着孔の孔内面に前記キャピラリの外
面に当接し該キャピラリを保持する凸部が形成されてい
ることを特徴とするワイヤボンディング装置。1. A wire bonding apparatus comprising a capillary for holding a bonding wire and performing bonding, and an ultrasonic horn for supporting the capillary in the attachment section, wherein the attachment section is a mounting hole and a ground. The wire bonding apparatus is characterized in that a convex portion is formed on the inner surface of the attachment hole, the projection being in contact with the outer surface of the capillary and holding the capillary. 【請求項２】 凸部が、取着孔の貫通方向に複数延在す
る直線状の凸条により形成されたものであることを特徴
とする請求項１記載のワイヤボンディング装置。2. The wire bonding apparatus according to claim 1, wherein the convex portion is formed by a linear convex strip extending in the penetrating direction of the attachment hole. 【請求項３】 凸条は、断面形状が台形をなすと共に１
２０°間隔で３本設けられていることを特徴とする請求
項２記載のワイヤボンディング装置。3. The ridge has a trapezoidal cross section, and
3. The wire bonding apparatus according to claim 2, wherein three wires are provided at intervals of 20 degrees. 【請求項４】 凸部が、螺旋状の凸条により形成された
ものであることを特徴とする請求項１記載のワイヤボン
ディング装置。4. The wire bonding apparatus according to claim 1, wherein the protrusion is formed by a spiral protrusion. 【請求項５】 凸部が、複数の突起により形成されたも
のであることを特徴とする請求項１記載のワイヤボンデ
ィング装置。5. The wire bonding apparatus according to claim 1, wherein the protrusion is formed by a plurality of protrusions.
JP8058852A 1996-03-15 1996-03-15 Wire bonding device Pending JPH09252030A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8058852A JPH09252030A (en) 1996-03-15 1996-03-15 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8058852A JPH09252030A (en) 1996-03-15 1996-03-15 Wire bonding device

Publications (1)

Publication Number Publication Date
JPH09252030A true JPH09252030A (en) 1997-09-22

Family

ID=13096225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8058852A Pending JPH09252030A (en) 1996-03-15 1996-03-15 Wire bonding device

Country Status (1)

Country Link
JP (1) JPH09252030A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030066348A (en) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 Method for the calibration of a wire bonder
CN107533989A (en) * 2015-12-17 2018-01-02 株式会社海上 Capillary conveying device, capillary erecting device, capillary more changing device, capillary delivery method, capillary installation method and capillary replacing options

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030066348A (en) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 Method for the calibration of a wire bonder
CN107533989A (en) * 2015-12-17 2018-01-02 株式会社海上 Capillary conveying device, capillary erecting device, capillary more changing device, capillary delivery method, capillary installation method and capillary replacing options
TWI632652B (en) * 2015-12-17 2018-08-11 海上股份有限公司 Welding pin transfer device, welding pin mounting device, welding pin replacement device, welding pin transfer method, welding pin mounting method, and welding pin replacement method

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