JPH09246766A - Enclosed electronic equipment case - Google Patents
Enclosed electronic equipment caseInfo
- Publication number
- JPH09246766A JPH09246766A JP8303096A JP8303096A JPH09246766A JP H09246766 A JPH09246766 A JP H09246766A JP 8303096 A JP8303096 A JP 8303096A JP 8303096 A JP8303096 A JP 8303096A JP H09246766 A JPH09246766 A JP H09246766A
- Authority
- JP
- Japan
- Prior art keywords
- air
- case
- fan
- electronic device
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する利用分野】電子機器ケースに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device case.
【０００２】[0002]
【従来の技術】機械工場などの厳しい環境の下で使用さ
れる制御装置などの電子部品を収納した電子機器におい
ては、異物の侵入を防ぐために密閉型の電子機器ケース
が使用される。密閉型電子機器ケースでは、該ケースに
内蔵された電子部品の信頼性を該ケース内に発生する熱
を効率的に放熱することが重要であるが、従来は発熱す
る電子部品の近傍にファンを設け、ファンによる電子部
品への直接冷却によってのみ電子機器ケースの放熱を行
っていた。2. Description of the Related Art In an electronic device containing electronic parts such as a control device used in a harsh environment such as a machine shop, a sealed electronic device case is used to prevent foreign matter from entering. In a sealed electronic device case, it is important that the heat generated in the case is efficiently dissipated for the reliability of the electronic components contained in the case. Conventionally, however, a fan is installed near the heat-generating electronic components. The electronic device case is provided with heat only by cooling the electronic parts directly with a fan.
【０００３】図５は従来の電子機器ケース２０内のファ
ン５による放熱の様子を示している。ファン５の回転に
よりプリント板４に実装されたファン５近傍にある発熱
量の大きい電子部品６は冷却され、ファン５によって電
子部品６に吹き付けられた空気は図５のＡに示すように
電子機器ケース内の空間に飛散する。しかし、この構成
では、空気の循環が悪く、ファン５より遠い位置にある
電子部品６’はなかなか冷やされない。FIG. 5 shows how heat is dissipated by the fan 5 in the conventional electronic device case 20. The rotation of the fan 5 cools the electronic component 6 mounted on the printed board 4 and having a large heat generation amount in the vicinity of the fan 5, and the air blown to the electronic component 6 by the fan 5 is an electronic device as shown in A of FIG. Scatter in the space inside the case. However, in this configuration, the circulation of air is poor, and the electronic component 6 ′ located far from the fan 5 is not cooled easily.
【０００４】[0004]
【発明が解決しようとする課題】このように、従来のフ
ァンのみによる冷却では、電子機器ケース内の空気の循
環が充分に行なわれず、ファン近傍の電子部品の冷却に
は効果を奏するが、ファンより離れた位置にある電子部
品には充分な冷却が施されず、その結果、電子機器ケー
スの放熱効果は充分ではなかった。As described above, the conventional cooling using only the fan does not sufficiently circulate the air in the electronic device case, and is effective in cooling the electronic parts near the fan. Sufficient cooling was not applied to the electronic components located farther away, and as a result, the heat dissipation effect of the electronic device case was not sufficient.
【０００５】[0005]
【課題を解決するための手段】本発明は、ファンによっ
て攪拌された空気が上記ケース内の全体に循環するよう
な通路を設けること、上記ケースの外壁に放熱効率の良
い金属を用いること、また、上記空気の循環経路に放熱
フィンを設けることにより、電子機器ケース内に発生す
る熱を効率よく放熱する。SUMMARY OF THE INVENTION The present invention provides a passage through which air agitated by a fan circulates in the entire case, uses a metal having high heat dissipation efficiency on the outer wall of the case, By providing the heat radiation fins in the air circulation path, the heat generated in the electronic device case is efficiently radiated.
【０００６】[0006]
【発明の実施の形態】図１は本発明の第１の実施形態を
示す密閉型電子機器ケースの要部断面図である。該第１
の実施形態においては、空気を循環する通路を確保する
ためのパーティション７が電子機器ケース１内に設けら
れている。パーティション７は電子機器ケース１の一部
外壁２と平行に設けられ、両端に開口部を設けており、
一方の開口部にはファン５をとりつけることによって、
図１の例では空気吐出口とされ、空気は図の他方の開口
部（吸入口）から該ケース外壁内面を這って流れ、吐出
口のファン５の下方フランジ部からファン５に吸い込ま
れるようになっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view of a main part of a sealed electronic device case showing a first embodiment of the present invention. The first
In the embodiment, the partition 7 for ensuring the passage for circulating the air is provided in the electronic device case 1. The partition 7 is provided in parallel with a part of the outer wall 2 of the electronic device case 1, and has openings at both ends.
By attaching the fan 5 to one opening,
In the example of FIG. 1, it is an air outlet, and air flows along the inner surface of the outer wall of the case from the other opening (intake) in the figure, and is sucked into the fan 5 from the lower flange portion of the fan 5 at the outlet. Has become.
【０００７】また、パーティション７の空気吸入口７’
を構成する開口部はファン５より出来るだけ離れた位置
に設けられ、空気がケース内全体に循環出来るようにす
ると共に、空気がケース外壁２に沿って流れる距離を長
くして放熱効果を上げるようにしている。The air inlet 7'of the partition 7
The opening part that constitutes the above is provided at a position as far as possible from the fan 5 so that the air can circulate in the entire case, and the distance through which the air flows along the case outer wall 2 is increased to enhance the heat dissipation effect. I have to.
【０００８】これにより、図１の空気通路Ｂに示すよう
に、ファン５によって攪拌された空気は電子部品６に吹
き付けられ、プリント板４とパーティション７の間、お
よびプリント板４と装着部品（本実施の形態では表示
器）３の間を流れ、パーティション７の空気吸入口７’
を構成する開口部に送られる。As a result, as shown in the air passage B of FIG. 1, the air agitated by the fan 5 is blown to the electronic parts 6, and the space between the printed board 4 and the partition 7 and between the printed board 4 and the mounting parts (book). In the embodiment, it flows between the indicators 3 and the air inlet 7 ′ of the partition 7
Is sent to the opening that constitutes the.
【０００９】上記の通路を空気が循環することにより、
暖かい空気が該電子機器ケースの外壁に接触することに
より冷やされるから電子機器ケースは効率的に冷却され
る。By circulating the air through the above passage,
Since the warm air is cooled by coming into contact with the outer wall of the electronic device case, the electronic device case is efficiently cooled.
【００１０】ケース外壁２に沿って流れることにより冷
却された空気が吐出される位置は、発熱量の大きい電子
部品６の位置であることが望ましい。図１の例では、発
熱量の大きい電子部品６が右隅に設けられ、該電子部品
６に対して吐出口（ファン５）が設けられ、該吐出口よ
り遠い左隅に空気吸入口７’を設け、空気が外壁２に沿
って流れる距離を長くして、空気が充分に冷却されるよ
うにしている。The position where the air cooled by flowing along the outer wall 2 of the case is discharged is preferably the position of the electronic component 6 which generates a large amount of heat. In the example of FIG. 1, the electronic component 6 having a large heat generation amount is provided in the right corner, the discharge port (fan 5) is provided for the electronic component 6, and the air suction port 7 ′ is provided in the left corner far from the discharge port. It is provided to increase the distance that the air flows along the outer wall 2 so that the air is sufficiently cooled.
【００１１】このように、循環する空気を冷却するに
は、該外壁に沿って流れる距離を長くする必要があり、
プリント板４に電子部品を装着する際には、発熱量が大
きい部品を隅に配置することが望ましい。しかし、配線
等の都合上発熱量の大きい部品を中央に配置した場合
は、該位置に吐出口を設け、該吐出口より出来るだけ遠
い周辺の複数の位置に吸入口を設ける。As described above, in order to cool the circulating air, it is necessary to lengthen the distance flowing along the outer wall,
When mounting electronic components on the printed board 4, it is desirable to place components that generate a large amount of heat in the corners. However, when a component such as wiring that generates a large amount of heat is arranged in the center, a discharge port is provided at that position, and suction ports are provided at a plurality of peripheral positions as far as possible from the discharge port.
【００１２】図２は本発明の第２の実施形態を示す例
で、図１で示す例と相違する点は、電子機器ケース１の
外壁２の一部８に熱伝導性の良い金属板を使用したこと
である。電子機器ケースは通常プラスチックで出来てい
るが、空気通路Ｂを形成する外壁の部分を熱伝導性の良
いアルミ板８で構成することによって、さらに放熱効率
を高めた。なお、電子機器ケース１全体を熱伝導性の良
い金属板で構成しても良い。FIG. 2 shows an example of the second embodiment of the present invention. The difference from the example shown in FIG. 1 is that a metal plate having good thermal conductivity is provided on a part 8 of the outer wall 2 of the electronic equipment case 1. I used it. Although the electronic device case is usually made of plastic, the heat dissipation efficiency is further improved by forming the outer wall portion forming the air passage B with the aluminum plate 8 having good thermal conductivity. The entire electronic device case 1 may be made of a metal plate having good thermal conductivity.
【００１３】図３は図１、図２の本実施形態においてケ
ース外壁２とパーティション７によって形成される空気
通路を長くしたもので、パーティション１０を設け、空
気通路をジグザグにし、循環する空気が外壁と長い距離
（時間）接するように構成することにより、放熱効果を
上げ空気を冷却するようにしたものである。FIG. 3 shows a long air passage formed by the case outer wall 2 and the partition 7 in the present embodiment shown in FIGS. 1 and 2. A partition 10 is provided, the air passage is zigzag, and the circulating air is the outer wall. Is configured to be in contact with a long distance (time) to enhance the heat dissipation effect and cool the air.
【００１４】即ち、暖められた空気は図３の空気通路Ｃ
のようにこのパーティション１０に沿って流れるため、
放熱効果を高めることが出来た。That is, the warmed air is the air passage C in FIG.
Because it flows along this partition 10 like
The heat dissipation effect could be improved.
【００１５】図４は、図３の実施形態と同様に循環する
空気の冷却効率を上げるようにしたもので、図１、図２
の実施形態において、ケース外壁２とパーティション７
によって形成される空気通路に平行に複数枚の放熱フィ
ン９を設置したものである。暖かい空気は図４の空気通
路Ｄに沿って流れるのでこの放熱フィン９によってさら
に放熱される。FIG. 4 is designed to improve the cooling efficiency of the circulating air as in the embodiment of FIG. 3, and FIGS.
In the embodiment of FIG.
A plurality of heat radiation fins 9 are installed in parallel to the air passage formed by. The warm air flows along the air passage D in FIG. 4, so that the heat radiation fins 9 further radiate the heat.
【００１６】[0016]
【発明の効果】密閉型電子機器ケースにおいて、ファン
による空気攪拌通路を空気がケース内を完全に循環する
ような通路を設けることにより、電子機器ケース内温度
の放熱効率を高めた。また、ケース外壁に放熱性の良い
金属板を使用することにより放熱効率を高めた。さらに
空気循環通路に放熱フィンを設置することでさらに放熱
効率を高めた。In the sealed electronic device case, the efficiency of heat dissipation of the temperature inside the electronic device case is improved by providing the air agitation passage by the fan so that the air circulates completely inside the case. In addition, the heat dissipation efficiency is improved by using a metal plate with good heat dissipation for the outer wall of the case. Furthermore, heat radiation efficiency was further improved by installing heat radiation fins in the air circulation passage.
【図１】本発明の第１の実施形態の要部断面図である。FIG. 1 is a sectional view of a main part of a first embodiment of the present invention.
【図２】本発明の第２の実施形態の要部断面図である。FIG. 2 is a cross-sectional view of main parts of a second embodiment of the present invention.
【図３】本発明の第３の実施形態の要部説明図である。FIG. 3 is an explanatory diagram of a main part of a third embodiment of the present invention.
【図４】本発明の第４の実施形態の要部説明図である。FIG. 4 is an explanatory view of a main part of a fourth embodiment of the present invention.
【図５】従来の密閉型電子機器ケースの要部断面図であ
る。FIG. 5 is a cross-sectional view of essential parts of a conventional sealed electronic device case.
１ 本願発明の電子機器ケース ２ 電子機器ケース外壁 ３ 表示器 ４ プリント板 ５ ファン ６，６’ 電子部品 ７，１０ パーティション ７’ 空気吸入口 ８ 電子機器ケース外壁（良放熱体部） ９ 放熱フィン ２０ 従来の電子機器ケース Ａ，Ｂ，Ｃ，Ｄ 空気通路 DESCRIPTION OF SYMBOLS 1 Electronic device case of this invention 2 Electronic device case outer wall 3 Indicator 4 Printed board 5 Fan 6,6 'Electronic component 7,10 Partition 7'Air intake port 8 Electronic device case outer wall (good radiator part) 9 Radiating fin 20 Conventional electronic equipment case A, B, C, D Air passage
Claims (4)
ケースにおいて、該ケース内に設けたファンで攪拌した
空気が該ケース内全体に循環するような通路をパーティ
ションを設けて構成したことを特徴とする密閉型電子機
器ケース。1. An electronic equipment case having a sealed structure containing electronic components, wherein a partition is provided to provide a passage through which air agitated by a fan provided in the case circulates throughout the case. A sealed electronic device case.
おいて、該ケースの外壁の一部又は全体に熱伝導性のよ
い金属板を使用したことを特徴とする密閉型電子機器ケ
ース。2. The sealed electronic device case according to claim 1, wherein a metal plate having good thermal conductivity is used for a part or all of an outer wall of the sealed electronic device case.
た空気がファンによって該ケース内を循環する通路に放
熱フィンを設け、さらに放熱効果を向上させたことを特
徴とする請求項１又は請求項２記載の密閉型電子機器ケ
ース。3. A heat radiation fin is provided in a passage through which air warmed by heat generated from an electronic component is circulated in the case by a fan to further improve the heat radiation effect. The sealed electronic device case described in 2.
るパーティションを設け発熱量が大きい電子部品の配置
位置に対応して前記空気通路の空気吐き出し口を設け、
該吐き出し口から離れた位置に前記空気通路の吸入口を
設けた請求項１ないし請求項３記載のいずれか１項記載
の密閉型電子機器ケース。4. A partition forming an air passage with the outer wall of the case is provided, and an air outlet of the air passage is provided in correspondence with an arrangement position of an electronic component that generates a large amount of heat.
The sealed electronic device case according to any one of claims 1 to 3, wherein a suction port of the air passage is provided at a position apart from the discharge port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8303096A JPH09246766A (en) | 1996-03-13 | 1996-03-13 | Enclosed electronic equipment case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8303096A JPH09246766A (en) | 1996-03-13 | 1996-03-13 | Enclosed electronic equipment case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09246766A true JPH09246766A (en) | 1997-09-19 |
Family
ID=13790842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8303096A Withdrawn JPH09246766A (en) | 1996-03-13 | 1996-03-13 | Enclosed electronic equipment case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09246766A (en) |
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| WO1999051073A1 (en) * | 1998-04-01 | 1999-10-07 | Omron Corporation | Electronic device, panel device, and supporting rail |
| JP2006351858A (en) * | 2005-06-16 | 2006-12-28 | Oki Joho Systems:Kk | Cooling device |
| JP2009126311A (en) * | 2007-11-22 | 2009-06-11 | Kojima Press Co Ltd | On-vehicle display device |
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-
1996
- 1996-03-13 JP JP8303096A patent/JPH09246766A/en not_active Withdrawn
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|---|---|---|---|---|
| WO1999051073A1 (en) * | 1998-04-01 | 1999-10-07 | Omron Corporation | Electronic device, panel device, and supporting rail |
| US6563710B1 (en) | 1998-04-01 | 2003-05-13 | Omron Corporation | Electronic device, panel device, and supporting rail |
| JP2006351858A (en) * | 2005-06-16 | 2006-12-28 | Oki Joho Systems:Kk | Cooling device |
| JP2009126311A (en) * | 2007-11-22 | 2009-06-11 | Kojima Press Co Ltd | On-vehicle display device |
| US11013142B2 (en) | 2008-03-03 | 2021-05-18 | Manufacturing Resources International, Inc. | Electronic display with cooling |
| US10721836B2 (en) | 2008-03-03 | 2020-07-21 | Manufacturing Resources International, Inc. | Electronic display with cooling |
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