JPH09232179A - Laminated ceramic part - Google Patents
Laminated ceramic partInfo
- Publication number
- JPH09232179A JPH09232179A JP3338196A JP3338196A JPH09232179A JP H09232179 A JPH09232179 A JP H09232179A JP 3338196 A JP3338196 A JP 3338196A JP 3338196 A JP3338196 A JP 3338196A JP H09232179 A JPH09232179 A JP H09232179A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- electrode
- laminated
- internal electrodes
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は積層セラミックコン
デンサなどの積層セラミック部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated ceramic component such as a laminated ceramic capacitor.
【０００２】[0002]
【従来の技術】従来の積層セラミック部品について、以
下に図面を参照しながら説明する。図４は積層セラミッ
ク部品の代表とも言える積層チップコンデンサを示す断
面図である。2. Description of the Related Art A conventional laminated ceramic component will be described below with reference to the drawings. FIG. 4 is a sectional view showing a multilayer chip capacitor which can be said to be a representative of multilayer ceramic parts.
【０００３】図４に示すように、積層チップコンデンサ
は、一般的に交互に積層されたセラミック層５と内部電
極６、及び上記内部電極６と導通した外部電極７とを備
えている。そしてこの内部電極６は、図４に示すよう
に、上記セラミック層５を挟んで対向する重なり部６ａ
と、この重なり部６ａから積層チップコンデンサ素子の
相対する両端部の外部電極７のどちらか一方へ交互に導
通するように引き出された引き出し電極部６ｂとからな
っており、従来上記重なり部６ａと引き出し電極部６ｂ
とは、同じ電極厚みであった。As shown in FIG. 4, the multilayer chip capacitor generally comprises ceramic layers 5 and internal electrodes 6 which are alternately laminated, and external electrodes 7 which are electrically connected to the internal electrodes 6. Then, as shown in FIG. 4, the internal electrodes 6 are overlapped with each other with the ceramic layer 5 sandwiched therebetween.
And an extraction electrode portion 6b which is drawn out from the overlapping portion 6a so as to be alternately conducted to either one of the external electrodes 7 at opposite ends of the multilayer chip capacitor element. Lead electrode part 6b
And had the same electrode thickness.
【０００４】[0004]
【発明が解決しようとする課題】近年積層セラミック部
品においては、薄膜高積層化傾向にあり、誘電体セラミ
ック層５を１００層以上も積層するような場合、従来の
ものでは、積層体内における内部電極６の重なり部６ａ
と引き出し電極部６ｂの積層数の違いから生じる段差が
積層数に比例して増大し、積層時に圧着しても、段差が
大きいため圧力が均一にかからずにセラミック層５の密
着不良がおこり、切断した際にセラミック層５間での剥
離・密着不良の原因となるという問題を有していた。In recent years, in laminated ceramic parts, there is a tendency for thin films to be formed in a high degree of lamination, and when 100 or more dielectric ceramic layers 5 are laminated, in the conventional case, the internal electrodes in the laminated body are 6 overlapping part 6a
The difference in the number of laminated layers of the lead electrode portion 6b and the extraction electrode portion 6b increases in proportion to the number of laminated layers, and even if pressure is applied during lamination, the pressure difference is large and the pressure is not evenly applied, resulting in poor adhesion of the ceramic layer 5. However, there is a problem that it causes peeling and poor adhesion between the ceramic layers 5 when cut.
【０００５】そこで本発明は、積層体内での内部電極の
積層数の違いから生じる段差をなくし、セラミック層間
の剥離・密着不良のない積層セラミック部品を提供する
ことを目的とするものである。Therefore, an object of the present invention is to provide a laminated ceramic component which eliminates a step caused by a difference in the number of laminated internal electrodes in a laminated body and which is free from peeling and poor adhesion between ceramic layers.
【０００６】[0006]
【課題を解決するための手段】この課題を解決するため
に、本発明による積層セラミック部品は、複数のセラミ
ック層と複数の内部電極とを交互に積層した積層体であ
って、この内部電極は、上記セラミック層を挟んで対向
する重なり部と、この重なり部から上記積層体の両端部
のどちらか一方の端部へ交互に導出する引き出し電極部
とからなり、この引き出し電極部の電極厚みより、上記
重なり部の電極厚みを薄くしたものである。In order to solve this problem, a laminated ceramic component according to the present invention is a laminated body in which a plurality of ceramic layers and a plurality of internal electrodes are alternately laminated. , The overlapping portions facing each other with the ceramic layer sandwiched therebetween, and the lead-out electrode portions that lead out alternately from the overlapping portion to either one of the two end portions of the laminated body. The electrode thickness of the overlapping portion is reduced.
【０００７】この本発明によれば、内部電極の重なり部
の電極厚みを引き出し電極部よりも薄くしたので、積層
体内での内部電極の積層数の違いから生じる段差が少な
くなり、セラミック層間の剥離・密着不良のない積層セ
ラミック部品を得ることができる。According to the present invention, since the electrode thickness of the overlapping portion of the internal electrodes is made thinner than that of the lead electrode portion, the step caused by the difference in the number of laminated internal electrodes in the laminated body is reduced, and the separation between the ceramic layers is reduced. -A monolithic ceramic component without poor adhesion can be obtained.
【０００８】[0008]
【発明の実施の形態】本発明の請求項１に記載の発明
は、複数のセラミック層と複数の内部電極とを交互に積
層した積層体であって、この内部電極は、上記セラミッ
ク層を挟んで対向する重なり部と、この重なり部から上
記積層体の両端部のどちらか一方の端部へ交互に導出す
る引き出し電極部とからなり、この引き出し電極部の電
極厚みより、上記重なり部の電極厚みを薄くしたことを
特徴とする積層セラミック部品であり、このような積層
セラミック部品では、内部電極の引き出し電極部の電極
より重なり部の電極厚みが薄いので高積層化した場合で
も、引き出し電極部の積層数が重なり部の積層数の約半
分しかなくても、積層数の違いから生じる引き出し電極
部と重なり部との段差が生じなくなる。従って、圧着す
る際に圧力が均一にかかるので、積層時の密着性の低下
を抑制し、剥離・密着不良のない積層セラミック部品を
得ることができるという作用を有する。BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is a laminated body in which a plurality of ceramic layers and a plurality of internal electrodes are alternately laminated, and the internal electrodes sandwich the ceramic layers. And an extraction electrode part which is led out alternately from the overlap part to either one of the both ends of the laminate from the overlap part, and the electrode of the overlap part is formed from the electrode thickness of the extraction electrode part. This is a laminated ceramic component characterized by a reduced thickness.In such a laminated ceramic component, the electrode thickness of the overlapping portion is smaller than that of the electrode of the extraction electrode portion of the internal electrode, so even if it is highly laminated, the extraction electrode portion Even if the number of stacked layers is only about half of the number of stacked layers, the step between the lead-out electrode portion and the overlapping portion caused by the difference in the number of stacked layers does not occur. Therefore, since pressure is applied uniformly during pressure bonding, there is an effect that it is possible to suppress a decrease in adhesion during lamination and obtain a laminated ceramic component without peeling and adhesion failure.
【０００９】以下、本発明の一実施形態について、図１
から図３を用いて説明する。図１は本発明による積層セ
ラミック部品の断面図を示し、図１において積層体１は
複数のセラミック層２と複数の内部電極３とが交互に積
層されており、内部電極３はセラミック層２を挟んで対
向する重なり部３ａと、この重なり部３ａから上記積層
体１の両端部のどちらか一方の端部へ交互に導出され外
部電極４と導通する引き出し電極部３ｂとからなってい
る。そして、この引き出し電極部３ｂの電極厚みより、
上記重なり部３ａの電極厚みよりも薄くしているので、
高積層化した場合でも引き出し電極部３ｂの積層数が、
重なり部３ａの積層数の約半分しかなくても、積層数の
違いから生じる引き出し電極部３ｂと重なり部３ａとの
段差がなくなり、圧着する際にも圧力が均一にかかって
積層時の密着性の低下を招くことなく、剥離・密着不良
のない積層セラミック部品を得られるという作用を奏す
る。なおセラミック層２はチタン酸バリウムなどを主成
分とするセラミック材料から、内部電極３はパラジウム
などを主成分とする電極材料から構成されている。An embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIG. FIG. 1 is a cross-sectional view of a laminated ceramic component according to the present invention. In FIG. 1, a laminated body 1 has a plurality of ceramic layers 2 and a plurality of internal electrodes 3 alternately laminated, and the internal electrodes 3 include the ceramic layers 2. It is composed of an overlapping portion 3a which is sandwiched and opposed to each other, and an extraction electrode portion 3b which is alternately led out from the overlapping portion 3a to either one of both end portions of the laminated body 1 and which is electrically connected to the external electrode 4. Then, from the electrode thickness of the extraction electrode portion 3b,
Since it is thinner than the electrode thickness of the overlapping portion 3a,
Even if the number of layers of the extraction electrode portion 3b is high,
Even if there are only about half the number of layers of the overlapping portion 3a, there is no step between the extraction electrode portion 3b and the overlapping portion 3a caused by the difference in the number of layers, and the pressure is evenly applied during pressure bonding to ensure adhesion at the time of lamination. It is possible to obtain a monolithic ceramic component free from peeling and poor adhesion without deteriorating. The ceramic layer 2 is made of a ceramic material containing barium titanate as a main component, and the internal electrode 3 is made of an electrode material containing palladium as a main component.
【００１０】次に本発明の具体例を説明する。Next, a specific example of the present invention will be described.
【００１１】[0011]
【実施例】まず、代表的な積層セラミック部品である積
層セラミックコンデンサの製造方法を説明するとチタン
酸バリウムを主成分とするセラミック材料粉末をポリビ
ニルブチラール系有機結合剤、可塑剤としてフタル酸ジ
ブチル、有機溶剤としてメチルエチルの所定量と配合
し、４８時間ボールミリングすることによりセラミック
ススラリーを得る。次に、図２に示すごとくこのスラリ
ーを用いてロールコート法により、厚み１０μｍのセラ
ミックグリーンシート５を成形し、このセラミックグリ
ーンシート５上に、パラジウムペーストをスクリーン印
刷して内部電極３を形成する。内部電極３が印刷されて
いないセラミックグリーンシート５を積層した無効層上
に上記内部電極３を設けたセラミックグリーンシート５
を、図１のごとく内部電極３の引き出し電極３ｂがセラ
ミック層２を挟んで対向する重なり部３ａより積層体１
の両端部のどちらか一方の端部へ交互に導出されるよう
に所望数積層し、その後、この上に内部電極３の付与さ
れていないセラミックグリーンシート５を積層して無効
層とする。EXAMPLES First, a method of manufacturing a laminated ceramic capacitor, which is a typical laminated ceramic component, will be described. A ceramic material powder containing barium titanate as a main component is used as a polyvinyl butyral organic binder, dibutyl phthalate as a plasticizer, and an organic material. A ceramic slurry is obtained by blending with a predetermined amount of methyl ethyl as a solvent and ball milling for 48 hours. Next, as shown in FIG. 2, a 10 μm-thick ceramic green sheet 5 is formed by a roll coating method using this slurry, and a palladium paste is screen-printed on the ceramic green sheet 5 to form the internal electrodes 3. . Ceramic green sheet 5 in which the internal electrodes 3 are provided on the ineffective layer in which the ceramic green sheets 5 on which the internal electrodes 3 are not printed are laminated.
As shown in FIG. 1, the lead-out electrode 3b of the internal electrode 3 is laminated from the overlapping portion 3a facing each other with the ceramic layer 2 in between.
A desired number of layers are laminated so that they are alternately led out to either one of both ends of the above, and thereafter, the ceramic green sheet 5 to which the internal electrodes 3 are not applied is laminated to form an ineffective layer.
【００１２】次に積層体１を温度７５℃、圧力３００kg
／cm2の加熱加圧条件にて熱圧着して、積層体ブロック
を形成し、切断刃にて積層体ブロックを所定形状に切断
して、独立した積層体グリーンチップを得る。Next, the laminated body 1 is heated at a temperature of 75 ° C. and a pressure of 300 kg.
The laminate block is formed by thermocompression bonding under a heating / pressurizing condition of / cm 2 , and the laminate block is cut into a predetermined shape by a cutting blade to obtain an independent laminate green chip.
【００１３】以上のようにして得られた積層体グリーン
チップの個別分離を完全に行い、焼成用セッター上に整
列させ、融着防止剤としてジルコニア粉末を少量散布し
てバーンアウト炉に投入し、室温から４００℃まで、約
３０時間のバーンアウトを行った後、次に焼成炉に投入
して、最高温度１３００℃、約２０時間のプロフィール
にて焼成を実施する。The laminated green chips obtained as described above were completely separated, aligned on a setter for firing, and a small amount of zirconia powder was sprayed as a fusion inhibitor and charged into a burnout furnace. After performing a burnout from room temperature to 400 ° C. for about 30 hours, it is then placed in a firing furnace and firing is performed at a maximum temperature of 1300 ° C. for a profile of about 20 hours.
【００１４】こうして得られた焼結体をバレルに投入し
端面研磨（１５０ｒｐｍ×２０分）を施した後、焼結体
の両端部に外部電極４を設け、内部電極３との導通を得
る。The sintered body thus obtained is put into a barrel and end face polishing (150 rpm × 20 minutes) is performed, and then external electrodes 4 are provided at both ends of the sintered body to obtain electrical connection with the internal electrodes 3.
【００１５】以上のようにして得られた本実施例の積層
セラミックコンデンサにおいては、グリーンシート５上
に内部電極３を設ける際、図３に示すように、重なり部
３ａ部分の電極厚みよりも、引き出し電極部３ｂ部分の
電極厚みを二度塗り等をして厚く印刷しており、積層し
た際に、重なり部３ａと引き出し電極部３ｂの段差が起
因しておこるセラミック層２の接着不良・剥離を防止で
きることとなる。In the monolithic ceramic capacitor of the present embodiment obtained as described above, when the internal electrodes 3 are provided on the green sheet 5, as shown in FIG. The electrode thickness of the lead-out electrode portion 3b is double-coated and thickly printed, and when the layers are stacked, adhesion failure / peeling of the ceramic layer 2 caused by a step between the overlapping portion 3a and the lead-out electrode portion 3b Can be prevented.
【００１６】また、従来端面研磨は、１５０ｒｐｍ×１
５０分の処理が必要であったが、本実施例においては、
外部電極と接続される内部電極の引き出し電極部３ｂの
電極厚みが厚いため、２０分程度の端面研磨でも外部電
極４との接続が完全なものとなる。Further, in the conventional end face polishing, 150 rpm × 1
Although 50 minutes of processing was required, in this embodiment,
Since the electrode thickness of the extraction electrode portion 3b of the internal electrode connected to the external electrode is large, the connection with the external electrode 4 will be complete even if the end surface is polished for about 20 minutes.
【００１７】以上のように、本実施例においては、積層
セラミックコンデンサの場合について述べたが、本発明
は積層セラミックコンデンサに係わらず、積層チップバ
リスタなどの積層セラミック部品においても同様に実施
可能である。As described above, in the present embodiment, the case of the monolithic ceramic capacitor has been described, but the present invention can be similarly applied to a monolithic ceramic component such as a monolithic chip varistor regardless of the monolithic ceramic capacitor. .
【００１８】[0018]
【発明の効果】以上のように本発明によれば、セラミッ
ク層を挟んで対向する内部電極の重なり部の電極厚みを
引き出し電極部電極厚みより薄くすることで、積層体で
の重なり部と引き出し電極部の段差をなくすこととな
り、圧着する際に圧力が積層体に均一にかかることとな
って、セラミック層の密着性を向上することができ、ま
た切断時における剥離不良をも低減でき、歩留り向上を
図るという効果が得られる。As described above, according to the present invention, the electrode thickness of the overlapping portion of the internal electrodes facing each other with the ceramic layer interposed therebetween is made thinner than the extraction electrode portion electrode thickness, so that the overlapping portion and the extraction portion in the laminated body are extended. By eliminating the stepped portion of the electrode part, the pressure is evenly applied to the laminated body at the time of pressure bonding, the adhesion of the ceramic layer can be improved, and peeling defects at the time of cutting can be reduced. The effect of improving is obtained.
【図１】本発明の一実施の形態による積層セラミック部
品を示す断面図FIG. 1 is a cross-sectional view showing a laminated ceramic component according to an embodiment of the present invention.
【図２】本発明の一実施の形態による内部電極を設けた
グリーンシートを示す上面図FIG. 2 is a top view showing a green sheet provided with internal electrodes according to an embodiment of the present invention.
【図３】図２のグリーンシートの断面図FIG. 3 is a sectional view of the green sheet of FIG.
【図４】従来の積層セラミックコンデンサを示す断面図FIG. 4 is a sectional view showing a conventional monolithic ceramic capacitor.
１ 積層体 ２ セラミック層 ３ 内部電極 ３ａ 重なり部 ３ｂ 引き出し電極部 ４ 外部電極 DESCRIPTION OF SYMBOLS 1 Laminated body 2 Ceramic layer 3 Internal electrode 3a Overlapping part 3b Extraction electrode part 4 External electrode
Claims (1)
を交互に積層した積層体であって、この内部電極は、上
記セラミック層を挟んで対向する重なり部と、この重な
り部から上記積層体の両端部のどちらか一方の端部へ交
互に導出する引き出し電極部とからなり、この引き出し
電極部の電極厚みより、上記重なり部の電極厚みを薄く
したことを特徴とする積層セラミック部品。1. A laminated body in which a plurality of ceramic layers and a plurality of internal electrodes are alternately laminated, wherein the internal electrodes have overlapping portions facing each other with the ceramic layer interposed therebetween, and the laminated body from the overlapping portions. And a lead-out electrode portion that is led out to either one of the two end portions of the lead electrode alternately, and the electrode thickness of the overlapping portion is thinner than the electrode thickness of the lead-out electrode portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3338196A JPH09232179A (en) | 1996-02-21 | 1996-02-21 | Laminated ceramic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3338196A JPH09232179A (en) | 1996-02-21 | 1996-02-21 | Laminated ceramic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09232179A true JPH09232179A (en) | 1997-09-05 |
Family
ID=12385024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3338196A Pending JPH09232179A (en) | 1996-02-21 | 1996-02-21 | Laminated ceramic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09232179A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7319582B2 (en) * | 2004-06-03 | 2008-01-15 | Murata Manufacturing Co., Ltd. | Multilayer capacitor and method of manufacturing the same |
| US7329976B2 (en) | 2005-04-27 | 2008-02-12 | Kyocera Corporation | Laminated electronic component |
| US20100085682A1 (en) * | 2008-10-03 | 2010-04-08 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for manufacturing the same |
| CN103258644A (en) * | 2012-02-17 | 2013-08-21 | 三星电机株式会社 | Multilayered ceramic electronic component and fabricating method thereof |
| US20130279070A1 (en) * | 2012-04-24 | 2013-10-24 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| KR20150080799A (en) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | Multilayered ceramic electronic component |
| KR20170071192A (en) * | 2015-12-15 | 2017-06-23 | 삼성전기주식회사 | Capacitor and manufacturing method of the same |
-
1996
- 1996-02-21 JP JP3338196A patent/JPH09232179A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7319582B2 (en) * | 2004-06-03 | 2008-01-15 | Murata Manufacturing Co., Ltd. | Multilayer capacitor and method of manufacturing the same |
| US7329976B2 (en) | 2005-04-27 | 2008-02-12 | Kyocera Corporation | Laminated electronic component |
| US20100085682A1 (en) * | 2008-10-03 | 2010-04-08 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for manufacturing the same |
| US8325462B2 (en) | 2008-10-03 | 2012-12-04 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for manufacturing the same |
| CN103258644A (en) * | 2012-02-17 | 2013-08-21 | 三星电机株式会社 | Multilayered ceramic electronic component and fabricating method thereof |
| US10347421B2 (en) | 2012-02-17 | 2019-07-09 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and method of manufacturing the same |
| US20130279070A1 (en) * | 2012-04-24 | 2013-10-24 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| US9111691B2 (en) * | 2012-04-24 | 2015-08-18 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| KR20150080799A (en) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | Multilayered ceramic electronic component |
| KR20170071192A (en) * | 2015-12-15 | 2017-06-23 | 삼성전기주식회사 | Capacitor and manufacturing method of the same |
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