JPH09232112A - Electrode coating means for chip-type electronic component - Google Patents
Electrode coating means for chip-type electronic componentInfo
- Publication number
- JPH09232112A JPH09232112A JP8058590A JP5859096A JPH09232112A JP H09232112 A JPH09232112 A JP H09232112A JP 8058590 A JP8058590 A JP 8058590A JP 5859096 A JP5859096 A JP 5859096A JP H09232112 A JPH09232112 A JP H09232112A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- groove
- material bar
- electrode
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、素材シートｔ″を縦分
割して設定数の素材バーｔ´を設け、該素材バーｔ´の
両側面に電極用のペーストを塗布し、次でこれを乾燥し
たのち、横分割して個々のチップ型抵抗器ｔを設けるよ
うにしたチップ型抵抗器の製造工程のうちの、素材バー
ｔ´の両側面に極めて正確に電極用のペーストを塗布で
きるようにしたことを特徴とするチップ型電子部品の電
極塗布手段を提供するものである。BACKGROUND OF THE INVENTION In the present invention, a material sheet t ″ is vertically divided to provide a set number of material bars t ′, and electrode paste is applied to both side surfaces of the material bar t ′. After being dried, the electrode paste can be applied extremely accurately to both side surfaces of the material bar t'in the manufacturing process of the chip resistor in which the chip resistor t is divided into horizontal parts and provided. The present invention provides an electrode coating means for a chip-type electronic component characterized by the above.
【０００２】[0002]
【従来技術】現在、長方形のセラミック基板の表面に抵
抗膜を形成し両側端に電極を形成した、チップ型抵抗器
の製造は下記の工程で行われている。即ち、予じめチッ
プの寸法を見合った所定の寸法で溝（縦分割用及び横分
割用）を形成した素材シートｔ″の表裏面の各チップ部
分に下電極、抵抗膜、符号等の印刷を行ったのち、１次
割り工程で縦分割して狭長板状の素材バーｔ´を設け、
該素材バーｔ´の長手両側面に電極用のペースト（例、
銀パラジュームペースト、以下、単にペーストと記
す。）を適宜手段で塗布し、それをＵＶ乾燥装置を通し
て乾燥したのち、２次割り工程で横分割して個々のチッ
プ型抵抗器ｔを製造することが行われている。（図１４
参照）2. Description of the Related Art At present, a chip type resistor having a rectangular ceramic substrate having a resistive film formed on its surface and electrodes formed on both ends thereof is manufactured by the following steps. That is, a lower electrode, a resistance film, a code or the like is printed on each chip portion on the front and back surfaces of the material sheet t ″ in which grooves (for vertical division and for horizontal division) are formed in a predetermined size corresponding to the size of the preliminarily formed chip. After that, the material bar t'in the form of a narrow plate is provided by vertically dividing in the primary dividing step,
Paste for electrodes (eg, on both sides of the length of the material bar t ′)
Silver paradium paste, hereinafter simply referred to as paste. ) Is applied by an appropriate means, dried through a UV dryer, and then laterally divided in a secondary dividing step to manufacture individual chip resistors t. (Fig. 14
reference)
【０００３】現在、例えば、１６０８型（１．６×０．
８ｍｍ）、１００５型（１．０×０．５ｍｍ）等、極め
て小形なチップ型抵抗器が上記製造工程で製造されてい
る。At present, for example, type 1608 (1.6 × 0.
8 mm), 1005 type (1.0 × 0.5 mm), and other extremely small chip resistors are manufactured in the above manufacturing process.
【０００４】然して、上記製造工程において、素材シー
トを設け該素材シートを１次割り工程で縦分割して素材
バーを設ける工程、及び、電極用ペースト塗布済みの素
材バーを乾燥炉で乾燥し、それを２次割り工程で横分割
して個々のチップ型抵抗器に仕上げる工程は、各従来技
術共、概ね共通しており、夫々効率をあげているが、However, in the above manufacturing process, the step of providing the material sheet and vertically dividing the material sheet in the primary dividing step to provide the material bar, and drying the material bar to which the electrode paste has been applied in a drying oven, The process of laterally dividing it in the secondary dividing process to finish it into individual chip resistors is generally common to each of the prior arts, and each of them improves efficiency.
【０００５】縦分割した素材バーの両側面に電極用ペー
ストを効率的かつ正確に塗布する、電極塗布工程は、従
来、下記のように行われており、夫々に課題が存在して
いた。Conventionally, the electrode coating step of efficiently and accurately coating the electrode paste on both side surfaces of the vertically divided material bar has been performed as follows, and each has its problems.
【０００６】その１は、図１の如く、円柱状のローター
２の周面の軸方向全長に等間隔に、電極用のペースト３
を充填するための設定寸法の幅、深さを有する直線状の
溝１を切設し、該ローター２を溝１の間隔でステップ回
転して、その周面にペースト３を塗布すると共にスキー
ジー４で溝１内のペースト３を残し余分のものを掻き取
り、ローター２の上方から両端部を支持した素材バーｔ
´を溝１のペースト３中に押圧下降し設定寸法浸漬した
のち引上げて、素材バーｔ´の側面にペースト３を塗布
することを繰り返して、次々と素材バーｔ´の側面に電
極用のペースト３を塗布するようにした、チップ型電子
部品の電極塗布手段であり、The first is, as shown in FIG. 1, a paste 3 for electrodes, which is arranged at equal intervals along the entire axial length of the circumferential surface of a cylindrical rotor 2.
A linear groove 1 having a width and a depth of a set dimension for filling the groove is cut, and the rotor 2 is step-rotated at intervals of the groove 1 to apply the paste 3 to the peripheral surface thereof and the squeegee 4 The material bar t supporting the both ends of the rotor 2 from above the rotor 2 by scraping off the excess paste 3 in the groove 1
′ ′ Is pressed down into the paste 3 of the groove 1 to be immersed in the set dimension, then pulled up, and the paste 3 is applied to the side surface of the material bar t ′, and the paste for electrodes is successively applied to the side surface of the material bar t ′. 3 is an electrode applying means for chip type electronic parts, which is applied to
【０００７】その２は、図２の如く、長方形板状のプレ
ート６の下面の横方向全長に等間隔に、電極用のペース
ト３を充填するための設定寸法幅、深さを有する直線状
の溝１を切設し、該プレート６の下面に塗布ローラー７
でペースト３を塗布すると共にスキージーローラ８ーで
溝１内のペースト３を残し余分のものを掻き取り、各溝
１にペースト３を充填したプレート６を移動したのち、
該プレート６の各溝１のペースト３中に両端部を支持し
た各素材バーｔ´を一斉に押圧上昇し設定寸法浸漬した
のち引下して、素材バーｔ´の側面にペースト３を塗布
するようにした、チップ型電子部品の電極塗布手段であ
る。As shown in FIG. 2, the second part is a linear plate having a set dimension width and depth for filling the electrode paste 3 at equal intervals along the entire lateral length of the lower surface of the rectangular plate 6. The groove 1 is cut, and the coating roller 7 is provided on the lower surface of the plate 6.
After applying the paste 3 with the squeegee roller, the squeegee roller 8 leaves the paste 3 in the groove 1 and scrapes off the excess, and after moving the plate 6 filled with the paste 3 in each groove 1,
Each material bar t'supporting both ends in the paste 3 of each groove 1 of the plate 6 is pushed up all at once, immersed in a set dimension, and then pulled down to apply the paste 3 to the side surface of the material bar t '. This is an electrode application means for the chip-type electronic component.
【０００８】なお、上記２例の何れにおいても、上記の
ようにして素材バーｔ´の上（または下）側面にペース
トを塗布したのち、同じ工程で下（または上）側面にペ
ーストを塗布して、素材バーｔ´の上下両側面にペース
トを塗布して、電極塗布工程を終了し、次の乾燥工程へ
送るものである。In any of the above two examples, after applying the paste on the upper (or lower) side surface of the material bar t'as described above, the paste is applied on the lower (or upper) side surface in the same process. Then, the paste is applied to both upper and lower surfaces of the material bar t ′, the electrode application process is completed, and the material is sent to the next drying process.
【０００９】[0009]
【従来技術の課題】上記の如く、従来例の何れにおいて
も、素材バーｔ´の上下両側面のペーストを塗布し、こ
れが後の工程でチップｔの両電極となるものであるの
で、素材バーｔ´を支持して、ローターまたはプレート
の溝のペースト中に押圧浸漬する場合に、必然的に素材
バーｔ´の左右両端部を支持して行うことになる。つま
り、上記のように素材バーｔ´の上下両側面に塗布せね
ばならぬため、中央部等の両端部以外の部分を支持する
ことができないのである。2. Description of the Related Art As described above, in any of the conventional examples, the paste on the upper and lower sides of the material bar t'is applied and both electrodes of the chip t will be applied in a later step. When pressing and immersing in the paste of the groove of the rotor or the plate while supporting t ', the left and right ends of the material bar t'are inevitably supported. In other words, as described above, the material bar t'has to be applied to both upper and lower side surfaces, so that it is impossible to support a portion other than both end portions such as the central portion.
【００１０】一方、電極用のペーストはペースト（糊）
状で粘性を有するため、該ペースト中に素材バー等の物
体を押圧浸漬せんとすると、その押圧力に反発して物体
を押し戻そうとする反発力が働く。即ち、上記のように
素材バーｔ´を溝のペースト中に押圧力をもって浸漬せ
んとすると、該素材バーｔ´に対して上記の反発力が働
く、また、溝の形状が深さ、幅が同一の直線状であるた
め素材バーの浸漬によるペーストの移動量及び方向が溝
の全長にわたって同じであり、よって、反発力は溝の全
長にわたって同じである。On the other hand, the electrode paste is a paste.
Since the material is viscous and viscous, when an object such as a material bar is dipped into the paste, a repulsive force acts to repel the object against the pressing force. That is, when the material bar t ′ is immersed in the groove paste with a pressing force as described above, the repulsive force acts on the material bar t ′, and the shape of the groove has a depth and a width. Since they have the same linear shape, the amount and direction of movement of the paste due to the dipping of the material bar are the same over the entire length of the groove, and therefore the repulsive force is the same over the entire length of the groove.
【００１１】ところが、素材バーは両端部を支持されて
いるため、該両端部は上記反発力に打勝って設定寸法浸
漬するが、支持するものが無く反発力に対抗するものが
素材バーｔ´だけである内方（中央）部分は反発力に敗
けて湾曲してしまうことになる。（図１３、１４参照）However, since both ends of the material bar are supported, the both ends overcome the above-mentioned repulsive force and are immersed in the set dimension, but there is nothing to support and the one opposite to the repulsive force is the material bar t '. Only the inner part (center) loses the repulsive force and bends. (See FIGS. 13 and 14)
【００１２】従って、上記の浸漬状態で素材バーｔ´を
引上げると、素材バーｔ´には図１５のように、両端部
は設定寸法で内方（中央）部に向って次第に塗布幅が小
な塗布が行われる。Therefore, when the material bar t'is pulled up in the above-mentioned immersion state, the material bar t'has the coating width gradually increasing toward the inner (center) part at the set dimensions as shown in FIG. A small application is done.
【００１３】その結果は、該素材バーｔ´を乾燥処理
後、二次分割工程で個々のチップｔとしたとき、その電
極の寸法にばらつきが生じ、不均等となり、不良品発生
の大きな原因となっていたものである。As a result, when the raw material bar t ′ is dried and then the individual chips t are formed in the secondary dividing step, the dimensions of the electrodes are varied and become uneven, which is a major cause of defective products. It was what was.
【００１４】[0014]
【本発明の目的】上記従来の課題に鑑みて、本発明は、
素材バーｔ´の両端部を支持して溝のペースト中に押圧
浸漬したときに、該素材バーｔ´の押圧浸漬でその周囲
に押しのけ移動されるペーストの移動が、従来の溝のペ
ーストの場合に比して、小さな力で容易に行われるよう
にすることによって、ペーストの素材バーｔ´に対する
反発力を弱くコントロールできることを考案し、In view of the above-mentioned conventional problems, the present invention provides
When the both ends of the material bar t ′ are supported by pressure dipping in the groove paste, the movement of the paste displaced to the periphery by the pressure dipping of the material bar t ′ is the case of the conventional groove paste. In comparison with the above, it was devised that the repulsive force of the paste against the material bar t ′ can be weakly controlled by making it easy to perform with a small force,
【００１５】そのために溝の深さ、幅の寸法を両端部よ
りもその内方（中央）部で大に形成し、つまり、該部の
充填ペーストの容積を大とすると共にペーストが移動で
きる寸法も大としてペーストを移動し易くしたペースト
の逃げ部を形成することによって、素材バーを両端部を
支持して溝のペースト中に押圧浸漬したときに、反発力
に弱い内方（中央）部も小さな押圧力で正確に設定寸法
浸漬できるようにしたものである。Therefore, the depth and width of the groove are formed to be larger at the inner (center) part than at both ends, that is, the volume of the filling paste in that part is large and the paste can move. By forming a relief area for the paste that makes it easier for the paste to move, the inner (center) portion that is weak against repulsion when the material bar is pressed and dipped in the paste of the groove while supporting both ends It is designed so that the set dimension can be accurately immersed with a small pressing force.
【００１６】[0016]
【課題を解決する手段】即ち、本発明は、ローター、プ
レート、その他の電極用のペーストの保持体に切設した
設定長さ、幅及び深さの直線状の溝内にペーストを充填
し、素材バーｔ´の両端を支持して上記溝のペースト中
に設定寸法、押圧浸漬したのち引上げて、素材バーの側
面にペーストを塗布するようにした、チップ型電子部品
の電極塗布手段において、Means for Solving the Problems That is, the present invention fills a paste into a linear groove having a set length, width and depth cut in a holder for a paste for a rotor, a plate, and other electrodes, In the electrode application means of the chip-type electronic component, which supports both ends of the material bar t ′, sets the dimension of the material in the groove paste by pressure soaking, and then pulls up to apply the paste to the side surface of the material bar,
【００１７】上記溝の両端部を残した内方部分の深さ若
しくは幅の一方若しくは両方の寸法を上記直線状よりも
大としてペーストの逃げ部を形成したものであり、素材
バーｔ´を溝のペースト中に押圧浸漬したとき、ペース
トが該逃げ部の方へ移動して、素材バーｔ´の押圧力に
ペーストが反発して素材バーを押し戻そうとする反発力
を逃げ部の方向へ分散、吸収することにより、素材バー
ｔ´の中央部が湾曲するのを防止するように備えたこと
を特徴とする、チップ型電子部品の電極塗布手段によっ
て課題を解決したものである。The recesses of the paste are formed by making the depth and / or width of the inner portion of the groove, which is left at both ends, larger than that of the straight line, and forming the paste relief portion. When the paste is dipped in the paste, the paste moves toward the escape portion, and the repulsive force that the paste repels against the pressing force of the material bar t ′ and pushes back the material bar toward the escape portion. The problem is solved by an electrode application unit for a chip-type electronic component, which is provided so as to prevent the central portion of the material bar t ′ from being curved by being dispersed and absorbed.
【００１８】[0018]
【実施例１】本発明の実施例を図面につき説明する。円
柱状のローター２の周面の軸方向全長に等間隔に電極用
のペースト３を充填するための設定寸法の幅、深さを有
する直線状の溝１を切設し、該ローター２を溝１の間隔
でステップ回転してその円周面にペースト３を塗布する
と共にスキージー４で溝１内のペースト３を残し余分の
ものを掻き取る等の充填手段で、該各溝１内にペースト
３を充填し、Embodiment 1 An embodiment of the present invention will be described with reference to the drawings. A linear groove 1 having a width and a depth of a set dimension for filling the electrode paste 3 at equal intervals is cut along the entire axial length of the cylindrical rotor 2 and the rotor 2 is grooved. The paste 3 is applied in each groove 1 by a step of rotating at intervals of 1 to apply the paste 3 on the circumferential surface thereof and at the same time filling means such as scraping off the extra paste 3 in the groove 1 with a squeegee 4. Fill the
【００１９】上記のペースト３を充填した溝１に素材バ
ーｔ´を設定寸法押圧浸漬したのち引上げて、素材バー
ｔ´の側面にペースト３を電極の形状に塗布するように
した、チップ型電子部品の電極塗布手段において、（図
１参照）The material bar t'is dipped in the groove 1 filled with the above-mentioned paste 3 by a predetermined size and then pulled up, and then the paste 3 is applied to the side surface of the material bar t'in the shape of an electrode. In the electrode application means of the component (see FIG. 1)
【００２０】上記の溝１の両端部１ａを除いた内方部分
（中央部分を含む、以下同じ。）１ｂの深さ若しくは幅
の一方若しくは両方の寸法を上記直線状よりも大として
ペースト３の逃げ部を形成したものであり、One or both of the depth and / or width of the inner portion (including the central portion, the same applies hereinafter) 1b of the groove 1 excluding both ends 1a is made larger than that of the linear shape of the paste 3. It is a relief part,
【００２１】素材バーｔ´の両端部１ａを支持して溝の
ペースト３中に押圧浸漬したとき、ペースト３が該逃げ
部５の方へ移動して、素材バーｔ´の押圧力にペースト
３が反発して素材バーｔ´を押し戻そうとする反発力を
逃げ部５の方向へ分散、吸収することにより、素材バー
ｔ´の中央部１ｂが湾曲するのを防止するように備えた
チップ型電子部品の電極塗布手段である。（図３〜１２
参照）When both ends 1a of the material bar t ′ are supported and pressed and dipped in the paste 3 of the groove, the paste 3 moves toward the escape portion 5 and the paste 3 is pressed by the pressing force of the material bar t ′. The tip provided to prevent the central portion 1b of the material bar t ′ from being curved by dispersing and absorbing the repulsive force that pushes back the material bar t ′ in the direction of the escape portion 5 due to the repulsion of the material bar t ′. It is a means for applying electrodes of die-type electronic parts. (Figs. 3-12
reference)
【００２２】[0022]
【実施例２】長方形板状のプレート６の下面に横方向全
長に等間隔に電極用のペースト３を充填するための設定
寸法の幅・深さを有する直線状の溝１を切設し、塗布ロ
ーラー７等でプレート６下面にペースト３を塗布すると
共にスキージーローラー８等で溝１内のペースト３を残
し余分のものを掻き取る等の充填手段で、該各溝１内に
ペースト３を充填し、[Embodiment 2] A linear groove 1 having a width and depth of set dimensions for filling the electrode paste 3 at equal intervals along the entire length in the lateral direction is cut on the lower surface of a rectangular plate-shaped plate 6, The paste 3 is applied to the lower surface of the plate 6 by the application roller 7 or the like, and the paste 3 is left in the groove 1 by the squeegee roller 8 or the like to scrape off the excess material, and the like. Then
【００２３】上記プレート６のペースト３を充填した各
溝１に各素材バーｔ´を一斉に設定寸法押圧浸漬したの
ち引上げて、各素材バーｔ´の側面にペーストを電極の
形状に塗布するようにした、チップ型電子部品の電極塗
布手段において、（図２参照）Each material bar t'is simultaneously immersed in the groove 1 filled with the paste 3 of the plate 6 with a set dimension and then pulled up, and the paste is applied to the side surface of each material bar t'in the shape of an electrode. In the electrode application means for the chip-type electronic component, which has been set (see FIG. 2)
【００２４】上記の溝１の両端部１ａを除いた内方部分
１ｂの深さ若しくは幅の一方若しくは両方の寸法を上記
直線状よりも大としてペースト３の逃げ部５を形成した
ものであり、The recessed portion 5 of the paste 3 is formed by making one or both of the depth and the width of the inner portion 1b of the groove 1 excluding both ends 1a larger than the linear shape.
【００２５】素材バーｔ´の両端部１ａを支持して溝１
のペースト３中に押圧浸漬したとき、ペースト３が該逃
げ部５の方へ移動して、素材バーｔ´の押圧力にペース
ト３が反発して素材バーｔ´を押し戻そうとする反発力
を逃げ部５の方向へ分散、吸収することにより、素材バ
ーｔ´の中央部１ｂが湾曲するのを防止するように備え
たチップ型電子部品の電極塗布手段である。The groove 1 is supported by supporting both ends 1a of the material bar t '.
When the paste 3 is pressed and dipped in the paste 3, the paste 3 moves toward the escape portion 5, and the paste 3 repels the pressing force of the material bar t ′ to push back the material bar t ′. Is an electrode application unit for a chip-type electronic component provided so as to prevent the central portion 1b of the material bar t ′ from being curved by dispersing and absorbing the material in the direction of the escape portion 5.
【００２６】上記の実施例１、２において、溝１の深さ
若しくは幅の一方若しくは両方を、両端部よりも寸法の
大な直線状に形成したペーストの逃げ部を設けるか、
（図７、８参照）In Embodiments 1 and 2 described above, one or both of the depth and the width of the groove 1 are provided with a paste relief portion formed in a linear shape having a larger dimension than both end portions, or
(See Figures 7 and 8)
【００２７】若しくは、溝１の深さ若しくは幅の一方若
しくは両方を、両端部１ａより中央部１ｂに向かい次第
に寸法の大な曲線状に形成したペースト３の逃げ部５を
設けるなど（図９、１０参照）、要するに、素材バーｔ
´をペースト３中に押圧浸漬したときに、特に、内方
（中央）部１ｂのペースト３が容易に移動できるように
溝の深さ若しくは幅の一方若しくは両方を広く形成して
逃げ部５を設けるようにしたものである。Alternatively, one or both of the depth or the width of the groove 1 is gradually provided from the both end portions 1a toward the central portion 1b, and an escape portion 5 for the paste 3 is formed in a curved shape having a large size (FIG. 9, FIG. 9). 10), in short, the material bar t
When ‘′ is pressed and dipped in the paste 3, one or both of the depth and width of the groove are formed to be wide so that the paste 3 in the inner (center) portion 1 b can easily move. It is provided.
【００２８】[0028]
【効果】電極用のペーストを充填する溝の深さ若しくは
幅の一方若しくは両方を、溝の両端部を除き内方（中
央）部で大にしてペーストの逃げ部を設けたので、両端
部を支持した素材バーを溝のペースト中に設定寸法押圧
浸漬したとき、両端部は支持されているため正確に設定
寸法浸漬する。[Effect] One or both of the depth or width of the groove for filling the electrode paste is enlarged at the inner (center) part except the both ends of the groove to provide the escape portion for the paste. When the supported material bar is dipped in the groove paste by a set dimension, the both ends are accurately dipped because the both ends are supported.
【００２９】一方、その内方（中央）部は支持されてい
ないため、ペーストの反発力に対する対抗力が弱いが、
本発明の場合、ペーストが素材バーの浸漬で押圧された
ときに容易に逃げ部の方へ移動し、その方向にペースト
の反発力を分散、吸収してしまうため、素材バーの内方
（中央）部に対する反発力が小さくなり、よって、該部
が湾曲することがなく、正確に設定寸法まで浸漬される
こととなり、On the other hand, since the inner (center) portion thereof is not supported, the opposition force against the repulsive force of the paste is weak,
In the case of the present invention, when the paste is pressed by immersion of the material bar, it easily moves toward the escape portion, and the repulsive force of the paste is dispersed and absorbed in that direction, so that the inside of the material bar (center ) Portion, the repulsive force becomes small, so that the portion will not be curved and it will be immersed exactly to the set dimension,
【００３０】上記状態で引き上げた素材バーにはその全
長にわたって、正確に設定寸法の電極の形状にペースト
が塗布されたものとなる。よって、それを乾燥処理した
のち二次分割工程で個々のチップｔとしたとき、均質優
秀なチップｔが得られて、不良品の発生を減少し得る。The material bar pulled up in the above state has the paste applied in the shape of the electrode having the set dimensions accurately over the entire length thereof. Therefore, when the chips t are dried and then formed into individual chips t in the secondary dividing step, homogeneous and excellent chips t can be obtained, and the number of defective products can be reduced.
【００３１】従来手段に比し、溝の両端部を除く内方
（中央）部の深さ、幅等の寸法を大きく（広く）した逃
げ部を形成するだけで足りるので、経費的にも負担とな
らない。Compared with the conventional means, it is sufficient to form an escape portion having a larger (wider) depth, width, etc. of the inner (center) portion excluding both ends of the groove, which is also a cost burden. It does not become.
【００３２】素材バーの両端部を支持して溝のペースト
中に押圧浸漬するとき、逃げ部の作用により、従来に比
し格段に小な押圧力で設定寸法まで正確、容易に浸漬し
得るので、従来多発した、大きな押圧によって素材バー
の内方（中央）部を破損する事故を無くし、もって、製
品の歩留りを格段に向上し得る。When supporting both ends of the material bar and immersing them in the paste of the groove by pressing, the escaping portion makes it possible to immerse accurately and easily to the set dimension with a remarkably smaller pressing force than before. In addition, it is possible to eliminate the accident that damages the inner (center) portion of the material bar due to a large pressure, which has been frequently generated in the past, so that the yield of products can be significantly improved.
【図１】本発明実施例の構成概略及び作用を示す説明正
面図及び右側面図。FIG. 1 is an explanatory front view and a right side view showing a schematic configuration and operation of an embodiment of the present invention.
【図２】本発明の他の実施例のの構成概略及び作用を示
す説明正面図。FIG. 2 is an explanatory front view showing the schematic configuration and operation of another embodiment of the present invention.
【図３】溝の実施例で両端部を除き内方（中央）部の深
さ寸法を大にした逃げ部を設けた平面図。FIG. 3 is a plan view in which an escape portion is provided in which an inner (center) portion has a large depth dimension except for both end portions in an embodiment of a groove.
【図４】図３のＡ−Ａ線矢視断面図で、併せて作用を説
明する図。FIG. 4 is a cross-sectional view taken along the line AA of FIG. 3, which also illustrates the operation.
【図５】図４のＢ−Ｂ線矢視拡大断面図で、併せて作用
を説明する図。5 is an enlarged cross-sectional view taken along the line BB of FIG. 4, which also illustrates the operation.
【図６】本発明手段で電極用のペーストを塗布した素材
バーｔ´の平面図。FIG. 6 is a plan view of a material bar t ′ coated with an electrode paste by the means of the present invention.
【図７】溝の実施例で両端部を除き内方（中央部）の幅
寸法を大にした直線状の逃げ部を設けた平面図。FIG. 7 is a plan view in which a linear relief portion having a large width dimension inward (center portion) is provided except for both end portions in an embodiment of a groove.
【図８】図７のＣ−Ｃ線矢視拡大断面図。8 is an enlarged cross-sectional view taken along the line CC of FIG.
【図９】溝の実施例で両端部を除き内方（中央）部の深
さ寸法を次第に大にした曲線状の逃げ部を設けた断面
図。FIG. 9 is a cross-sectional view in which an example of a groove is provided with a curved relief portion in which a depth dimension of an inner (center) portion is gradually increased except for both end portions.
【図１０】溝の実施例で両端部を内方（中央部）の幅寸
法を次第に大にした曲線状の逃げ部を設けた平面図。FIG. 10 is a plan view of the embodiment of the groove, in which both end portions are provided with curved relief portions whose inner (center portion) width dimension is gradually increased.
【図１１】従来手段の、設定寸法の長さ、幅、及び深さ
からなる直線状の溝の平面図。FIG. 11 is a plan view of a linear groove having a set dimension of length, width, and depth according to the conventional means.
【図１２】図１１のＤ−Ｄ線矢視拡大断面図。12 is an enlarged cross-sectional view taken along the line DD of FIG.
【図１３】図１１のＥ−Ｅ線矢視断面図で、併せて作用
を説明する図。13 is a cross-sectional view taken along the line EE of FIG. 11, which also illustrates the operation.
【図１４】図１３のＦ−Ｆ線矢視拡大断面図で、併せて
作用を説明する図。FIG. 14 is an enlarged cross-sectional view taken along the line FF of FIG. 13, which also illustrates the operation.
【図１５】従来手段で電極用のペーストを塗布した素材
バーｔ´の平面図。FIG. 15 is a plan view of a material bar t ′ coated with an electrode paste by a conventional means.
【図１６】素材シートｔ″を１次割り工程で素材バーｔ
´を設け、電極塗布手段で電極を塗布し、これを乾燥し
たのち２次割り工程で個々のチップ型電子部品ｔを設け
る工程の説明図。FIG. 16: Material bar t in the primary splitting process of material sheet t ″
Explanatory drawing of the process of providing each chip type electronic component t in the secondary splitting process after the electrode is coated with an electrode by means of electrode coating means and dried.
ｔ チップ、チップ型電子部品 ｔ´ 素材バー ｔ″ 素材シート １ 溝 １ａ 両端部 １ｂ 内方（中央）部 ２ ローター ３ 電極用のペースト ４ スキージー ５ 逃げ部 ６ プレート ７ 塗布ローラー ８ スキージーローラー t Chip, chip-type electronic component t'Material bar t "Material sheet 1 Groove 1a Both ends 1b Inner (center) part 2 Rotor 3 Electrode paste 4 Squeegee 5 Relief part 6 Plate 7 Application roller 8 Squeegee roller
Claims (5)
ーストの保持体に切設した設定長さ、幅及び深さの直線
状の溝内にペーストを充填し、素材バーｔ´の両端を支
持して上記溝のペースト中に設定寸法、押圧浸漬したの
ち引上げて、素材バーの側面にペーストを電極の形状に
塗布するようにした、チップ型電子部品の電極塗布手段
において、 上記溝の両端部を残した内方部分の深さ若しくは幅の一
方若しくは両方の寸法を上記直線状よりも大としてペー
ストの逃げ部を形成したものであり、素材バーｔ´を溝
のペースト中に押圧浸漬したとき、ペーストが該逃げ部
の方へ移動して、素材バーｔ´の押圧力にペーストが反
発して素材バーを押し戻そうとする反発力を逃げ部の方
向へ分散、吸収することにより、素材バーｔ´の中央部
が湾曲するのを防止するように備えたことを特徴とす
る、 チップ型電子部品の電極塗布手段。1. A paste is filled in a linear groove of a set length, width and depth cut in a holder of paste for a rotor, a plate and other electrodes to support both ends of a material bar t '. Then, in the electrode coating means of the chip-type electronic component, the electrode is applied to the side face of the material bar by applying the paste to the side face of the material bar by pressing and soaking the set size in the paste of the groove. When one or both of the depth or the width of the inner portion which left is larger than the linear shape to form the escape portion of the paste, when the material bar t ′ is pressed and dipped in the paste of the groove, , The paste moves toward the relief portion, the paste repels the pressing force of the material bar t ′, and the repulsive force that tries to push back the material bar is dispersed and absorbed in the direction of the relief portion. The central part of the bar t'is curved Characterized by comprising to prevent the chip-type electronic component of the electrode coating means.
間隔に電極用のペーストを充填するための設定寸法の
幅、深さを有する直線状の溝を切設し、該ローターを溝
の間隔でステップ回転してその円周面にペーストを塗布
すると共にスキージーで溝内のペーストを残し余分のも
のを掻き取る等の充填手段で、該各溝内にペーストを充
填し、ローターを溝の間隔で間欠回転するように備え、 上記のペーストを充填した溝に素材バーｔ´を設定寸法
押圧浸漬したのち引上げて、素材バーｔ´の側面にペー
ストを電極の形状に塗布するようにした、チップ型電子
部品の電極塗布手段において、 上記の溝の両端部を除いた内方部分の深さ若しくは幅の
一方若しくは両方の寸法を上記直線状よりも大としてペ
ーストの逃げ部を形成したものであり、 素材バーｔ´の両端部を支持して溝のペースト中に押圧
浸漬したとき、ペーストが該逃げ部の方へ移動して、素
材バーｔ´の押圧力にペーストが反発して素材バーを押
し戻そうとする反発力を逃げ部の方向へ分散、吸収する
ことにより、素材バーｔ´の中央部が湾曲するのを防止
するように備えたことを特徴とする、 請求項１のチップ型電子部品の電極塗布手段。2. A linear groove having a set width and depth for filling the electrode paste at equal intervals is cut along the entire axial length of the cylindrical rotor, and the rotor is cut. Fill the paste in each groove with a squeegee to fill the paste in the groove with a squeegee to leave the paste in the groove and scrape the excess by applying a paste to the circumferential surface by rotating the rotor in steps. In preparation for intermittent rotation at the groove intervals, the material bar t ′ is immersed in the groove filled with the above-mentioned paste with a set size and then pulled up, and the paste is applied to the side surface of the material bar t ′ in the shape of an electrode. In the electrode applying means for the chip-type electronic component, one or both of the depth or width of the inner portion excluding both ends of the groove is made larger than the linear shape to form the escape portion of the paste. The material When the both ends of the bar t ′ are supported and pressed and dipped in the paste of the groove, the paste moves toward the escape portion and the paste repels the pressing force of the material bar t ′ to push back the material bar. The chip-type electronic component according to claim 1, wherein the chip-type electronic component is provided so as to prevent the center portion of the material bar t ′ from being curved by dispersing and absorbing the repulsive force to the escape portion. Electrode coating means.
に等間隔に電極用のペーストを充填するための設定寸法
の幅・深さを有する直線状の溝を切設し、塗布ローラー
等でプレート下面にペーストを塗布すると共にスキージ
ーローラー等で溝内のペーストを残し余分のものを掻き
取る等の充填手段で、該各溝内にペーストを充填し、 上記プレートのペーストを充填した各溝に各素材バーｔ
´を一斉に設定寸法押圧浸漬したのち引上げて、各素材
バーｔ´の側面にペーストを電極の形状に塗布するよう
にした、チップ型電子部品の電極塗布手段において、 上記の溝の両端部を除いた内方部分の深さ若しくは幅の
一方若しくは両方の寸法を上記直線状よりも大としてペ
ーストの逃げ部を形成したものであり、 素材バーｔ´の両端部を支持して溝のペースト中に押圧
浸漬したとき、ペーストが該逃げ部の方へ移動して、素
材バーｔ´の押圧力にペーストが反発して素材バーｔ´
を押し戻そうとする反発力を逃げ部の方向へ分散、吸収
することにより、素材バーｔ´の中央部が湾曲するのを
防止するように備えたことを特徴とする、 請求項１のチップ型電子部品の電極塗布手段。3. A rectangular plate-shaped plate is provided with a linear groove having a set width and depth for filling the electrode paste at equal intervals along the entire length in the lateral direction, and a coating roller or the like is formed. The paste is applied to the lower surface of the plate with a squeegee roller, and the excess paste is scraped off with a squeegee roller or the like to fill the paste in each groove, and each groove is filled with the paste of the plate. Each material bar t
In the electrode application means of the chip-type electronic component, in which the paste is applied to the side surface of each material bar t'in the shape of an electrode by simultaneously immersing the ‘ One or both of the depth or width of the removed inner portion is made larger than the above linear shape to form the escape portion of the paste. When pressed and dipped in the material bar t ', the paste moves toward the relief portion, and the paste repels the pressing force of the material bar t'and the material bar t'
The tip according to claim 1, characterized in that the repulsive force for pushing back the material is dispersed and absorbed in the direction of the escape portion so as to prevent the central portion of the material bar t ′ from being curved. Electrode coating means for electronic parts.
を、両端部よりも寸法の大きな直線状に形成したペース
トの逃げ部を設けた、 請求項１のチップ型電子部品の電極塗布手段。4. The electrode coating means for a chip type electronic component according to claim 1, wherein one or both of the depth and / or width of the groove is provided with a paste relief portion formed in a linear shape having a larger dimension than both end portions.
を、両端部より中央部に向い次第に寸法の大な曲線状に
形成したペーストの逃げ部を設けた、 請求項１のチップ型電子部品の電極塗布手段。5. The chip type electronic component according to claim 1, wherein one or both of the depth and the width of the groove is provided with a relief portion for the paste, which is formed in a curved shape having a large dimension gradually toward the central portion from both end portions. Electrode coating means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8058590A JPH09232112A (en) | 1996-02-21 | 1996-02-21 | Electrode coating means for chip-type electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8058590A JPH09232112A (en) | 1996-02-21 | 1996-02-21 | Electrode coating means for chip-type electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09232112A true JPH09232112A (en) | 1997-09-05 |
Family
ID=13088710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8058590A Pending JPH09232112A (en) | 1996-02-21 | 1996-02-21 | Electrode coating means for chip-type electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09232112A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003068553A (en) * | 2001-08-24 | 2003-03-07 | Matsushita Electric Ind Co Ltd | Electrode formation method of chip electronic component |
| CN103400673A (en) * | 2013-07-31 | 2013-11-20 | 广东风华高新科技股份有限公司 | Preparation system for side circumferential segmented-electrode annular voltage dependent resistor |
| CN103400672A (en) * | 2013-07-31 | 2013-11-20 | 广东风华高新科技股份有限公司 | Preparation method for circular varistor with segmented electrodes on side periphery |
-
1996
- 1996-02-21 JP JP8058590A patent/JPH09232112A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003068553A (en) * | 2001-08-24 | 2003-03-07 | Matsushita Electric Ind Co Ltd | Electrode formation method of chip electronic component |
| CN103400673A (en) * | 2013-07-31 | 2013-11-20 | 广东风华高新科技股份有限公司 | Preparation system for side circumferential segmented-electrode annular voltage dependent resistor |
| CN103400672A (en) * | 2013-07-31 | 2013-11-20 | 广东风华高新科技股份有限公司 | Preparation method for circular varistor with segmented electrodes on side periphery |
| CN103400672B (en) * | 2013-07-31 | 2016-07-06 | 广东风华高新科技股份有限公司 | Side circumferential sectors electrode ring varistor preparation method |
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