JPH09225931A - Multi-electroforming blade with base and its production - Google Patents
Multi-electroforming blade with base and its productionInfo
- Publication number
- JPH09225931A JPH09225931A JP3510496A JP3510496A JPH09225931A JP H09225931 A JPH09225931 A JP H09225931A JP 3510496 A JP3510496 A JP 3510496A JP 3510496 A JP3510496 A JP 3510496A JP H09225931 A JPH09225931 A JP H09225931A
- Authority
- JP
- Japan
- Prior art keywords
- base
- electroformed
- electroforming
- blade
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000005323 electroforming Methods 0.000 title abstract description 11
- 239000006061 abrasive grain Substances 0.000 claims abstract description 13
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 13
- 239000010432 diamond Substances 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 12
- 125000006850 spacer group Chemical group 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基台付きマルチ電
鋳ブレード及びその製造方法に関する。TECHNICAL FIELD The present invention relates to a multi-electroformed blade with a base and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】半導体ウェーハ等を切削する電鋳ブレー
ドは、従来アルミ等の基台の片面側にダイヤモンド等の
砥粒を含む電鋳層が形成されたものであるが、スペーサ
を介在させて、又はハブブレードに一体に形成されたス
ペーサによって２或はそれ以上の電鋳層を有する所謂マ
ルチブレードも知られている。このようなマルチ電鋳ブ
レードは、スペーサの間隔によって複数の電鋳ブレード
が所定間隔に同軸に形成される。2. Description of the Related Art Electroformed blades for cutting semiconductor wafers and the like are conventionally formed by forming an electroformed layer containing abrasive grains such as diamond on one side of a base made of aluminum or the like. , Or a so-called multi-blade having two or more electroformed layers by a spacer integrally formed with the hub blade is also known. In such a multi-electroformed blade, a plurality of electroformed blades are coaxially formed at predetermined intervals depending on the spacing of the spacers.
【０００３】[0003]
【発明が解決しようとする課題】従来のマルチ電鋳ブレ
ードによると、スペーサの調整が難しく切削刃間隔の精
度に問題があり、特に切削刃が薄い（５〜２００μｍ）
場合には組み付けにより（例えばナットの締め付け具合
により）精度を出すのは困難である。又、組み付けには
熟練と多くの時間とを要する。そこで、本発明は基台の
幅を高精度に形成し、その基台の両側に電鋳層を形成す
ることにより、薄い切削刃であっても間隔精度の高いマ
ルチ電鋳ブレード及びその製造方法を提供することを目
的とする。According to the conventional multi-electroformed blade, it is difficult to adjust the spacer, and there is a problem in the accuracy of the cutting blade interval, and especially the cutting blade is thin (5 to 200 μm).
In this case, it is difficult to obtain accuracy by assembling (for example, how tight the nut is). Further, the assembling requires skill and much time. Therefore, the present invention forms the width of the base with high accuracy, and by forming the electroformed layers on both sides of the base, a multi-electroformed blade with high spacing accuracy even with a thin cutting blade and a method for manufacturing the same. The purpose is to provide.
【０００４】[0004]
【課題を解決するための手段】前記課題を技術的に解決
するための手段として、本発明は、所定幅に形成された
アルミ等の基台の両側面にダイヤモンド等の砥粒を含む
電鋳層が形成されていて、この電鋳層の端部は前記基台
の端部より所要量突出している、基台付きマルチ電鋳ブ
レードを要旨とする。又、所定幅に形成されたアルミ等
の基台の第１の面にダイヤモンド等の砥粒を含む第１の
電鋳層を形成する工程と、その後前記基台の第２の面に
ダイヤモンド等の砥粒を含む第２の電鋳層を形成する工
程と、前記基台の両側面に形成された第１、第２の電鋳
層の端部を基台の端部より所要量突出させる工程と、を
少なくとも含む基台付きマルチ電鋳ブレードの製造方法
を要旨とする。Means for Solving the Problems As a means for technically solving the above problems, the present invention is an electroforming method in which both sides of a base made of aluminum or the like having a predetermined width contains abrasive grains such as diamond. A gist is a multi-electroformed blade with a base, in which a layer is formed, and an end portion of the electroformed layer protrudes from the end portion of the base by a required amount. In addition, a step of forming a first electroformed layer containing abrasive grains such as diamond on the first surface of a base made of aluminum or the like having a predetermined width, and then diamond or the like on the second surface of the base. A step of forming a second electroformed layer containing abrasive grains, and causing the end portions of the first and second electroformed layers formed on both side surfaces of the base to protrude from the end of the base by a required amount. The gist is a method of manufacturing a multi-electroformed blade with a base including at least steps.
【０００５】[0005]
【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づいて詳説する。図１は基台付きマルチ電鋳ブ
レードの製造工程例を示すもので、電鋳層が形成される
円盤状基台の外周部のみの断面を示したものである。
(イ) は所定幅Ｍに高精度に形成されたアルミ等の基台１
の第１の面１ａに、ダイヤモンド等の砥粒を含む第１の
電鋳層２を形成する工程であり、第１の面１ａの非電鋳
層部分及び第２の面１ｂにはシール３が施されている。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows an example of a manufacturing process of a multi-electroformed blade with a base, and shows a cross section of only the outer peripheral portion of a disk-shaped base on which an electroformed layer is formed.
(A) is a base 1 made of aluminum or the like with a high precision formed in a predetermined width M.
Is a step of forming a first electroformed layer 2 containing abrasive grains such as diamond on the first surface 1a of the above, and a seal 3 is formed on the non-electroformed layer portion of the first surface 1a and the second surface 1b. Has been applied.
【０００６】図１(ロ) は表裏面を反転させ前記基台１の
第２の面１ｂにダイヤモンド等の砥粒を含む第２の電鋳
層４を形成する工程であり、前記第１の電鋳層２と連続
して全体が断面略コ状となるようにしてあり、かつ端部
を除く両側面の第１の電鋳層２、第２の電鋳層４の厚さ
が等しくなるようにする。この際、所要の位置にシール
３′が施される。FIG. 1B shows a step of inverting the front and back surfaces to form a second electroformed layer 4 containing abrasive grains such as diamond on the second surface 1b of the base 1. The electroformed layer 2 is continuously formed into a generally U-shaped cross section, and the thicknesses of the first electroformed layer 2 and the second electroformed layer 4 on both side surfaces except the end portions are equal. To do so. At this time, the seal 3'is provided at a required position.
【０００７】図１(ハ) 、(ニ) は前記基台１の両側面に形
成された第１の電鋳層２、第２の電鋳層４の端部を基台
の端部より突出させる工程であり、先に(ハ) のようにシ
ール３を除去して全体の外周部を円筒研削して端部の電
鋳層を除去すると共に、両側面の第１の電鋳層２、第２
の電鋳層４を所定の長さＬを残して所定の直径Ｒになる
ように研削加工し、次いで(ニ) のように基台１の外周部
を水酸化ナトリウム水溶液等でエッチングして第１の電
鋳層２、第２の電鋳層４の端部を基台１の端部１ｃより
所要量Ｐ突出させる。1 (c) and 1 (d), the ends of the first electroformed layer 2 and the second electroformed layer 4 formed on both side surfaces of the base 1 are projected from the end of the base. This is the process of removing the seal 3 and removing the electroformed layer at the end by cylindrically grinding the entire outer peripheral portion as shown in (c), and at the same time, removing the electroformed layer 2 on both side surfaces. Second
The electroformed layer 4 is ground to have a predetermined diameter R while leaving a predetermined length L, and then the outer peripheral portion of the base 1 is etched with a sodium hydroxide aqueous solution or the like as shown in (d). The end portions of the first electroformed layer 2 and the second electroformed layer 4 are protruded from the end portion 1c of the base 1 by a required amount P.
【０００８】このようにして製造されたマルチ電鋳ブレ
ード５は、前記基台１の幅Ｍが予め高精度に形成され、
その両側面に第１の電鋳層２、第２の電鋳層４を形成し
たので、薄い切削刃であっても従来のようにスペーサの
調整をすることなく切削刃の間隔精度の高いものが得ら
れる。In the multi-electroformed blade 5 manufactured as described above, the width M of the base 1 is formed with high precision in advance,
Since the first electroformed layer 2 and the second electroformed layer 4 are formed on both side surfaces thereof, even if the cutting blade is thin, the spacing between the cutting blades is high without adjusting the spacer as in the conventional case. Is obtained.
【０００９】図２は基台付きマルチ電鋳ブレードの他の
製造工程例を示すもので、前記同様電鋳層が形成される
円盤状基台の外周部のみの断面を示したものである。
(イ) はアルミ等の円盤状基台１１の第１の面１１ａの外
周部にダイヤモンド等の砥粒を含む第１の電鋳層１２を
形成する工程であり、第１の面１１ａの非電鋳層部分及
び第２の面１１ｂ及び端面１１ｃにはパッキン（シー
ル）１３が施される。FIG. 2 shows another example of the manufacturing process of the multi-electroformed blade with the base, and shows a cross section of only the outer peripheral portion of the disk-shaped base on which the electroformed layer is formed as in the above.
(A) is a step of forming the first electroformed layer 12 containing abrasive grains such as diamond on the outer periphery of the first surface 11a of the disk-shaped base 11 made of aluminum or the like, and A packing (seal) 13 is applied to the electroformed layer portion and the second surface 11b and the end surface 11c.
【００１０】図２(ロ) は外径修正工程であり、即ち基台
１１の外周部を切削して前記第１の電鋳層１２を所定の
長さＬ′に調整する。FIG. 2B shows an outer diameter correcting step, that is, the outer peripheral portion of the base 11 is cut to adjust the first electroformed layer 12 to a predetermined length L '.
【００１１】次に、図２(ハ) のように基台１１の第２の
面１１ｂを精密旋盤（図略）等で機械加工し、基台１１
の外周部を所定の幅Ｍ′に切削する工程を行う。前記し
た製造工程においては、予め外周部を所定の幅Ｍに形成
したが、この製造工程においては第１の電鋳層を形成し
た後に外周部を所定の幅Ｍ′に切削加工する。これは、
幅が比較的厚い場合は予め所定幅に形成しても問題はな
いが、所定幅が５００μｍ以下と薄い場合は歪が生じて
問題がある。そこで、第１の電鋳層を形成し、それを補
強材として所定幅Ｍ′になるまで削り込む工程を設けた
のである。Next, as shown in FIG. 2C, the second surface 11b of the base 11 is machined by a precision lathe (not shown), etc.
Then, a step of cutting the outer peripheral portion to a predetermined width M'is performed. In the manufacturing process described above, the outer peripheral portion is formed to have a predetermined width M in advance. However, in this manufacturing process, the outer peripheral portion is cut to have a predetermined width M'after forming the first electroformed layer. this is,
If the width is relatively thick, there is no problem even if it is formed to a predetermined width in advance, but if the predetermined width is as thin as 500 μm or less, distortion occurs and there is a problem. Therefore, a step of forming a first electroformed layer and using it as a reinforcing material until it has a predetermined width M'is provided.
【００１２】この後、図２(ニ) のように切削加工された
基台１１の第２の面１１ｂ′及び端面にダイヤモンド等
の砥粒を含む第２の電鋳層１４を形成する工程を行い、
前記第１の電鋳層１２と連続させ、これらの電鋳層の厚
さが同じになるようにする。この際、基台１１の第１の
面１１ａ側には全体を覆うようにしてパッキン（シー
ル）１３′が施される。Thereafter, as shown in FIG. 2D, a step of forming a second electroformed layer 14 containing abrasive grains such as diamond on the second surface 11b 'and the end surface of the machined base 11 is performed. Done,
It is continuous with the first electroformed layer 12 so that these electroformed layers have the same thickness. At this time, a packing (seal) 13 'is provided on the first surface 11a side of the base 11 so as to cover the entire surface.
【００１３】図２(ホ) 、(ヘ) は前記基台１１の両側面に
形成された第１の電鋳層１２、第２の電鋳層１４の端部
を基台１１の端部より突出させる工程であり、先に(ホ)
のように全体の外周部を円筒研削して端面部の電鋳層を
除去すると共に所定の直径Ｒ′になるように研削加工
し、次いで(ヘ) のように基台１１の外周部を水酸化ナト
リウム水溶液等でエッチングして電鋳層１２、１４の端
部を基台１１の端部１１ｃ′より所要量Ｐ′突出させ
る。2 (e) and (f) show the ends of the first electroformed layer 12 and the second electroformed layer 14 formed on both side surfaces of the base 11 from the end of the base 11. This is the process of projecting, first (e)
As shown in (f), the outer peripheral portion of the entire base is cylindrically ground to remove the electroformed layer on the end face portion, and the outer peripheral portion of the base 11 is wetted as shown in (f). The end portions of the electroformed layers 12 and 14 are made to project from the end portion 11c 'of the base 11 by a required amount P'by etching with an aqueous solution of sodium oxide or the like.
【００１４】このようにして製造されたマルチ電鋳ブレ
ード１５は、前記基台１１の幅Ｍ′が製造工程中で高精
度に形成され、その両側面に第１の電鋳層１２、第２の
電鋳層１４を形成したので、薄い切削刃であっても従来
のようにスペーサの調整をすることなく切削刃の間隔が
高精度のものが得られる。In the multi-electroformed blade 15 thus manufactured, the width M'of the base 11 is formed with high precision during the manufacturing process, and the first electroformed layer 12 and the second electroformed layer 12 are formed on both side surfaces thereof. Since the electroformed layer 14 is formed, even if the cutting blade is thin, it is possible to obtain a highly accurate cutting blade interval without adjusting the spacer as in the conventional case.
【００１５】前記マルチ電鋳ブレード５（マルチ電鋳ブ
レード１５も同様であるのでマルチ電鋳ブレード５につ
いて説明する）は、例えば図３に示すようなダイシング
装置に取り付けて使用される。このダイシング装置は、
カセット載置領域Ａ上に載置されたカセットＣ内から、
搬出入手段ＢによってウェーハＷ（接着テープＮを介し
てフレームＦに固定）を待機領域Ｄに搬出し、旋回アー
ムを有する搬送手段ＥにてそのウェーハＷをチャックテ
ーブルＴに搬送し、ウェーハＷを吸引保持したチャック
テーブルＴを移動してアライメント手段Ｇに位置付け、
アライメントした後に回転ブレードを取り付けた切削手
段Ｈにて切削する。The multi-electroformed blade 5 (the multi-electroformed blade 15 is also the same, so the multi-electroformed blade 5 will be described) is used by being attached to a dicing apparatus as shown in FIG. 3, for example. This dicing device
From inside the cassette C placed on the cassette placement area A,
The wafer W (fixed to the frame F via the adhesive tape N) is unloaded to the standby area D by the loading / unloading means B, and the wafer W is transferred to the chuck table T by the transfer means E having a swing arm to transfer the wafer W. The chuck table T sucked and held is moved and positioned on the alignment means G,
After the alignment, the cutting means H equipped with a rotary blade cuts.
【００１６】前記回転ブレードとしてマルチ電鋳ブレー
ド５が取り付けられるのであり、即ち図４(イ) 、(ロ) に
示すように切削手段Ｈにおけるスピンドル軸Ｓの先端部
に、マルチ電鋳ブレード５を嵌合すると共に、ナットＫ
により締め付け固定される。The multi-electroformed blade 5 is attached as the rotary blade, that is, the multi-electroformed blade 5 is attached to the tip of the spindle shaft S in the cutting means H as shown in FIGS. 4 (a) and 4 (b). Fitting and nut K
It is tightened and fixed by.
【００１７】この場合、被切削物であるウェーハＷの切
断線の間隔に合わせてマルチ電鋳ブレード５の間隔Ｍを
予め設定しておけば、一度に２本の切断線を精密に切削
することが可能となり、ダイシングの作業能率を著しく
向上させることができる。In this case, if the distance M between the multi-electroformed blades 5 is set in advance in accordance with the distance between the cutting lines of the wafer W which is the object to be cut, two cutting lines can be precisely cut at one time. It is possible to significantly improve the working efficiency of dicing.
【００１８】[0018]
【発明の効果】以上説明したように、本発明によれば、
アルミ等の基台の幅を高精度に形成し、その両側面に電
鋳層を形成するようにしたので、薄い切削刃であっても
スペーサ調整をすることなく切削刃間隔の高精度なマル
チ電鋳ブレードが得られ、これにより半導体ウェーハ等
の精密切削を保障する効果を奏する。As described above, according to the present invention,
The width of the base such as aluminum is formed with high accuracy, and the electroformed layers are formed on both sides of the base, so even if the cutting blade is thin, it is possible to use a high-precision multi-blade with a cutting blade spacing without spacer adjustment. An electroformed blade is obtained, which has the effect of ensuring precision cutting of semiconductor wafers and the like.
【図１】 (イ) 〜(ニ) は本発明に係る基台付きマルチ電
鋳ブレードの製造工程例を示す説明図である。1A to 1D are explanatory views showing an example of a manufacturing process of a multi-electroformed blade with a base according to the present invention.
【図２】 (イ) 〜(ヘ) は他の製造工程例を示す説明図で
ある。2A to 2F are explanatory views showing another example of the manufacturing process.
【図３】 マルチ電鋳ブレードを取り付ける精密切削装
置の一例を示す斜視図である。FIG. 3 is a perspective view showing an example of a precision cutting device to which a multi-electroformed blade is attached.
【図４】 (イ) は電鋳ブレードの取付例を示す斜視図、
(ロ) はその要部の分解斜視図である。FIG. 4A is a perspective view showing an example of mounting an electroformed blade,
(B) is an exploded perspective view of the main part thereof.
１…基台 １ａ…第１の面 １ｂ…第２の面 １ｃ…端部 ２…第１の電鋳層 ３…シール ４…第２の電鋳層 ５…マルチ電鋳ブレード １１…基台 １１ａ…第１の面 １１ｂ…第２の面 １１ｃ…端
面 １２…第１の電鋳層 １３…パッキン １４…第２の電鋳層 １５…マルチ電鋳ブレードDESCRIPTION OF SYMBOLS 1 ... Base 1a ... 1st surface 1b ... 2nd surface 1c ... End part 2 ... 1st electroformed layer 3 ... Seal 4 ... 2nd electroformed layer 5 ... Multi electroformed blade 11 ... Base 11a ... 1st surface 11b ... 2nd surface 11c ... End surface 12 ... 1st electroformed layer 13 ... Packing 14 ... 2nd electroformed layer 15 ... Multi electroformed blade
Claims (2)
側面にダイヤモンド等の砥粒を含む電鋳層が形成されて
いて、この電鋳層の端部は前記基台の端部より所要量突
出している、基台付きマルチ電鋳ブレード。1. An electroformed layer containing abrasive grains such as diamond is formed on both side surfaces of a base made of aluminum or the like having a predetermined width, and the end of the electroformed layer is an end of the base. A multi-electroformed blade with a base that projects more than required.
１の面にダイヤモンド等の砥粒を含む第１の電鋳層を形
成する工程と、その後前記基台の第２の面にダイヤモン
ド等の砥粒を含む第２の電鋳層を形成する工程と、前記
基台の両側面に形成された第１、第２の電鋳層の端部を
基台の端部より所要量突出させる工程と、を少なくとも
含む基台付きマルチ電鋳ブレードの製造方法。2. A step of forming a first electroformed layer containing abrasive grains such as diamond on a first surface of a base made of aluminum or the like having a predetermined width, and then a second surface of the base. A step of forming a second electroformed layer containing abrasive grains such as diamond, and the end portions of the first and second electroformed layers formed on both side surfaces of the base are required from the end of the base. A method for manufacturing a multi-electroformed blade with a base, the method including at least the step of projecting a certain amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3510496A JPH09225931A (en) | 1996-02-22 | 1996-02-22 | Multi-electroforming blade with base and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3510496A JPH09225931A (en) | 1996-02-22 | 1996-02-22 | Multi-electroforming blade with base and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09225931A true JPH09225931A (en) | 1997-09-02 |
Family
ID=12432635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3510496A Pending JPH09225931A (en) | 1996-02-22 | 1996-02-22 | Multi-electroforming blade with base and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09225931A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002118080A (en) * | 2000-10-06 | 2002-04-19 | Disco Abrasive Syst Ltd | Method of dividing semiconductor plate and cutting blade |
| US6609965B2 (en) * | 2001-05-09 | 2003-08-26 | Disco Corporation | Cutting blade |
-
1996
- 1996-02-22 JP JP3510496A patent/JPH09225931A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002118080A (en) * | 2000-10-06 | 2002-04-19 | Disco Abrasive Syst Ltd | Method of dividing semiconductor plate and cutting blade |
| US6609965B2 (en) * | 2001-05-09 | 2003-08-26 | Disco Corporation | Cutting blade |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2943673B2 (en) | Apparatus and method for manufacturing semiconductor substrate | |
| JPH09225931A (en) | Multi-electroforming blade with base and its production | |
| JPH0212729B2 (en) | ||
| JPS63306864A (en) | Method of grinding cutting tool for separating disk from rod-shaped or block-shaped work and separation method | |
| JP2509265B2 (en) | Wafer manufacturing method and apparatus | |
| JPS61172220A (en) | Production of disk substrate | |
| JP2942989B1 (en) | Method of manufacturing disc-shaped blade and multi-blade apparatus | |
| JPH097149A (en) | Method for working magnetic head slider | |
| JPH02155231A (en) | Manufacture of wafer | |
| JP2908915B2 (en) | Wafer cutting method and apparatus | |
| JP2001006141A (en) | Manufacture of magnetic head | |
| JPH0458546A (en) | Cutting method for semiconductor wafer | |
| JPH0443734B2 (en) | ||
| JP2000349048A (en) | Manufacture of quartz crystal piece | |
| JPH08316174A (en) | Method of cutting semiconductor wafer having glass | |
| JPH11179638A (en) | Manufacture of semiconductor wafer and device therefor | |
| JPS5815674A (en) | Precision built-up method for thin edge multiple grinding stone | |
| JPH04113619A (en) | Wafer and its manufacture | |
| JP2001302265A (en) | Cutter wheel for cutting glass | |
| JPH03270879A (en) | Thin cutting edge grinder wheel with hub | |
| JPH02255304A (en) | Apparatus and method for slicing semiconductor wafer | |
| JPH0592365A (en) | Method of correcting ultra abrasive grain grinding wheel | |
| JPH05169365A (en) | Polishing device for both faces of semiconductor wafer | |
| JPH07204997A (en) | Method of polishing circular saw row setting type cutter and circular cutter | |
| JP2019123058A (en) | Manufacturing method of shape correction jig |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050111 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050118 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050607 |