JPH09191195A - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JPH09191195A JPH09191195A JP8002008A JP200896A JPH09191195A JP H09191195 A JPH09191195 A JP H09191195A JP 8002008 A JP8002008 A JP 8002008A JP 200896 A JP200896 A JP 200896A JP H09191195 A JPH09191195 A JP H09191195A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- nozzle
- camera
- transfer head
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を基板に
移送搭載する電子部品実装装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for transferring and mounting electronic components on a substrate.
【０００２】[0002]
【従来の技術】電子部品実装装置は移載ヘッドのノズル
の下端部に電子部品を真空吸着して保持し、基板の所定
の座標位置に移送搭載するようになっている。図５は従
来の電子部品実装装置の移載ヘッドの側面図である。移
載ヘッド１は、その下部にノズル２を備えており、また
その下面にはバックプレート３が設けられている。ノズ
ル２はその下端部に電子部品４を真空吸着して保持して
いる。移載ヘッド１の移動路にはカメラ５と光源６が設
けられており、光源６の光をバックプレート３へ向って
照射し、電子部品４のシルエットを下方のカメラ５で観
察するようになっている。2. Description of the Related Art An electronic component mounting apparatus is adapted to vacuum-hold and hold an electronic component at a lower end portion of a nozzle of a transfer head, and transfer and mount the electronic component at a predetermined coordinate position on a substrate. FIG. 5 is a side view of a transfer head of a conventional electronic component mounting apparatus. The transfer head 1 is provided with a nozzle 2 at its lower portion, and a back plate 3 is provided on the lower surface thereof. The nozzle 2 holds the electronic component 4 by vacuum suction at its lower end. A camera 5 and a light source 6 are provided on the moving path of the transfer head 1, and the light of the light source 6 is emitted toward the back plate 3 so that the silhouette of the electronic component 4 can be observed by the lower camera 5. ing.
【０００３】図６は従来の電子部品実装装置のカメラの
視野の画像図であって、４’は電子部品４のシルエット
画像である。電子部品４は小形であり、このためノズル
２の下面は電子部品４からばり出して黒いシルエット画
像２’として観察される。FIG. 6 is an image view of a field of view of a camera of a conventional electronic component mounting apparatus, and 4'is a silhouette image of the electronic component 4. Since the electronic component 4 is small, the lower surface of the nozzle 2 is projected from the electronic component 4 and is observed as a black silhouette image 2 '.
【０００４】[0004]
【発明が解決しようとする課題】図６に示すように、電
子部品４が小形の場合、ノズル２の下面は電子部品４か
らばり出しやすく、電子部品４のシルエット画像４’と
ノズル２のシルエット画像２’は一体化してカメラ５で
観察されるため、ノズル２のシルエット画像２’がノイ
ズとなって電子部品４の位置認識を行いにくいという問
題点があった。このような問題点を解決するためには、
ノズル２の直径を小さくすればよいのであるが、ノズル
２の直径を小さくすることは加工技術上の限界があり、
またノズル２が小さくなるとその強度は低下してたわみ
を生じたり、その下面が摩耗しやすいなどの新たな問題
点が生じる。因みに、従来のノズル２はステンレス鋼な
どの硬質金属にて作られている。As shown in FIG. 6, when the electronic component 4 is small, the lower surface of the nozzle 2 is easily projected from the electronic component 4, and the silhouette image 4'of the electronic component 4 and the silhouette of the nozzle 2 are formed. Since the image 2'is integrally observed by the camera 5, the silhouette image 2'of the nozzle 2 becomes noise, which makes it difficult to recognize the position of the electronic component 4. In order to solve such problems,
It suffices to reduce the diameter of the nozzle 2, but there is a limit in processing technology to reduce the diameter of the nozzle 2,
Further, when the nozzle 2 becomes smaller, its strength is lowered and bending occurs, and new problems occur such that its lower surface is easily worn. Incidentally, the conventional nozzle 2 is made of a hard metal such as stainless steel.
【０００５】したがって本発明は、上記従来のノズルの
問題点を解消できる電子部品実装装置を提供することを
目的とする。Therefore, it is an object of the present invention to provide an electronic component mounting apparatus which can solve the problems of the conventional nozzle.
【０００６】[0006]
【課題を解決するための手段】このために本発明は、移
載ヘッドに備えられたノズルの少なくともカメラの焦点
範囲をルビーやサファイアなどの透明体により形成した
ものである。To this end, according to the present invention, at least the focal range of the camera of the nozzle provided in the transfer head is formed of a transparent body such as ruby or sapphire.
【０００７】[0007]
【発明の実施の形態】本発明によれば、ノズルの少なく
ともカメラの焦点範囲に位置する部分を透明体としてい
るので、ノズルの下面が電子部品からばり出していても
カメラには観察されず、電子部品のみのシルエットを的
確に認識できる。According to the present invention, since at least the portion of the nozzle located in the focal range of the camera is made transparent, even if the lower surface of the nozzle is protruding from the electronic component, it is not observed by the camera, The silhouette of only electronic parts can be accurately recognized.
【０００８】次に、本発明の一実施の形態を図面を参照
して説明する。図１は、本発明の一実施の形態による電
子部品実装装置の全体図、図２は同移載ヘッドの側面
図、図３は同移載ヘッドのノズルの断面図、図４は同カ
メラの視野の画像図である。Next, an embodiment of the present invention will be described with reference to the drawings. 1 is an overall view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the transfer head, FIG. 3 is a sectional view of a nozzle of the transfer head, and FIG. 4 is a view of the camera. It is an image figure of a visual field.
【０００９】図１において、１は移載ヘッドであり、そ
の下部にノズル１０を有しており、またその下面にはバ
ックプレート３が装着されている。移載ヘッド１はＸテ
ーブル９ＡとＹテーブル９Ｂから成る移動手段に駆動さ
れてパーツフィーダ７と基板８の間を移動し、パーツフ
ィーダ７に備えられた電子部品４を基板８の所定の座標
位置に移送搭載する。また移載ヘッド１の移動路の下方
には、カメラ５と光源６が設けられている。In FIG. 1, reference numeral 1 is a transfer head, which has a nozzle 10 in its lower portion, and a back plate 3 is attached to the lower surface thereof. The transfer head 1 is driven by a moving means composed of an X table 9A and a Y table 9B to move between a parts feeder 7 and a board 8, and the electronic component 4 provided in the parts feeder 7 is moved to a predetermined coordinate position of the board 8. It is transferred to and mounted on. A camera 5 and a light source 6 are provided below the moving path of the transfer head 1.
【００１０】図２および図３において、ノズル１０は上
端部１１と、この上端部１１に装着された下端部１２か
ら成っている。上端部１１の直径は下端部１２の直径よ
りもかなり大きく、ステンレス鋼などの硬質金属にて作
られている。これに対し、下端部１２は光を透過して外
部に拡散する透明体から成っている。下端部１２の素材
としては、強度および耐摩耗性が大きく、かつ加工性に
すぐれたものが望ましく、具体的には、ルビーやサファ
イアなどが望ましい。2 and 3, the nozzle 10 comprises an upper end 11 and a lower end 12 mounted on the upper end 11. The diameter of the upper end portion 11 is considerably larger than the diameter of the lower end portion 12, and is made of a hard metal such as stainless steel. On the other hand, the lower end 12 is made of a transparent body that transmits light and diffuses it to the outside. The material of the lower end portion 12 is preferably one having high strength and wear resistance and excellent workability, and specifically, ruby, sapphire or the like is desirable.
【００１１】図１において、移載ヘッド１は、パーツフ
ィーダ７の電子部品４をノズル１０の下端部に真空吸着
してピックアップし、基板８へ向って移送するが、その
移送の途中で、カメラ５により電子部品４を下方から観
察し、その位置認識を行う。そして位置認識の結果にし
たがって電子部品４の位置ずれを補正し、基板８の所定
の座標位置に搭載する。図４は、カメラ５の視野Ａの画
像図である。ノズル１０の下端部１２は透明体であるか
ら、カメラ５には観察されず、電子部品４のみが観察さ
れてそのシルエット画像４’が入手される。したがって
ノズル１０の下端部１２はノイズとはならず、電子部品
４の位置認識を的確に行える。In FIG. 1, the transfer head 1 vacuum-sucks the electronic component 4 of the parts feeder 7 to the lower end of the nozzle 10 and picks it up and transfers it toward the substrate 8. The electronic component 4 is observed from below by 5 and its position is recognized. Then, the positional deviation of the electronic component 4 is corrected according to the result of the position recognition, and the electronic component 4 is mounted at a predetermined coordinate position on the substrate 8. FIG. 4 is an image view of the field of view A of the camera 5. Since the lower end portion 12 of the nozzle 10 is a transparent body, it is not observed by the camera 5, but only the electronic component 4 is observed and the silhouette image 4 ′ is obtained. Therefore, the lower end 12 of the nozzle 10 does not cause noise, and the position of the electronic component 4 can be accurately recognized.
【００１２】なお図２において、ノズル１０の上端部１
１は非透明体であり、この上端部１１がカメラ５で観察
されるとノイズになってしまう。そこでカメラ５の焦点
範囲Ｆ（図２）には透明体である下端部１２のみが位置
するようにし、上端部１１は焦点範囲外にして観察され
ないようにする。また下端部１２は、その下面が電子部
品４からばり出してもカメラ５で認識されないので、図
３に示すように下端部１２の外径Ｄを大きくしてその強
度や耐摩耗性を大きくすることもできる。また下端部１
２の孔径ｄの大きさは比較的小径にし、外径Ｄを大きく
して下端部１２の厚さＥを肉厚にすることにより、単に
ノズル１０の強度が大きくなるだけでなく、小形の電子
部品４だけでなく大形の電子部品も広面積の下面に真空
吸着できるので、電子部品の品種変更にともなうノズル
１０の交換頻度も低減できる。In FIG. 2, the upper end portion 1 of the nozzle 10 is
Reference numeral 1 is a non-transparent body, and when this upper end 11 is observed by the camera 5, it becomes noise. Therefore, only the lower end 12 which is a transparent body is positioned in the focal range F (FIG. 2) of the camera 5, and the upper end 11 is out of the focal range so as not to be observed. Further, since the lower surface of the lower end portion 12 is not recognized by the camera 5 even if the lower surface thereof protrudes from the electronic component 4, the outer diameter D of the lower end portion 12 is increased to increase its strength and wear resistance as shown in FIG. You can also Also the lower end 1
The hole diameter d of 2 is made relatively small, the outer diameter D is made large, and the thickness E of the lower end portion 12 is made thick so that not only the strength of the nozzle 10 is increased but also a small electronic Since not only the component 4 but also a large electronic component can be vacuum-sucked on the lower surface of a large area, the frequency of replacement of the nozzle 10 due to the change of the type of electronic component can be reduced.
【００１３】[0013]
【発明の効果】本発明によれば、ノズルの少なくともカ
メラの焦点範囲に位置する部分を透明体としているの
で、ノズルの下面が電子部品からばり出していてもカメ
ラには観察されず、電子部品のみのシルエットを的確に
認識できる。またノズルが電子部品からばり出してもノ
イズにはならないので、ノズルの外径を大きくし、且つ
肉厚にして強度や耐摩耗性を大きくすることができる。
さらには小形の電子部品だけでなく大形の電子部品も真
空吸着できるので、電子部品の品種変更にともなうノズ
ルの交換頻度も低減できる。According to the present invention, since at least the portion of the nozzle located in the focal range of the camera is made transparent, even if the lower surface of the nozzle is projected from the electronic component, it is not observed by the camera and the electronic component is not observed. You can accurately recognize only the silhouette. Further, even if the nozzle is projected from the electronic component, it does not cause noise, so that it is possible to increase the outer diameter of the nozzle and increase the wall thickness to increase strength and wear resistance.
Furthermore, since not only small electronic components but also large electronic components can be vacuum-sucked, it is possible to reduce the frequency of replacement of nozzles due to a change in the type of electronic components.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の一実施の形態による電子部品実装装置
の全体図FIG. 1 is an overall view of an electronic component mounting apparatus according to an embodiment of the present invention
【図２】本発明の一実施の形態による電子部品実装装置
の移載ヘッドの側面図FIG. 2 is a side view of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.
【図３】本発明の一実施の形態による電子部品実装装置
の移載ヘッドのノズルの断面図FIG. 3 is a sectional view of a nozzle of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention.
【図４】本発明の一実施の形態による電子部品実装装置
のカメラの視野の画像図FIG. 4 is an image view of a field of view of a camera of the electronic component mounting apparatus according to the embodiment of the present invention.
【図５】従来の電子部品実装装置の移載ヘッドの側面図FIG. 5 is a side view of a transfer head of a conventional electronic component mounting apparatus.
【図６】従来の電子部品実装装置のカメラの視野の画像
図FIG. 6 is an image view of a field of view of a camera of a conventional electronic component mounting apparatus.
１ 移載ヘッド ４ 電子部品 ５ カメラ ８ 基板 １０ ノズル １２ 下端部 1 Transfer Head 4 Electronic Component 5 Camera 8 Substrate 10 Nozzle 12 Lower End
Claims (1)
電子部品を真空吸着して基板へ向って移送し、この移送
の途中に下方のカメラにより電子部品を観察して電子部
品の位置認識を行った後、電子部品を基板に搭載する電
子部品実装装置であって、前記ノズルの少なくとも前記
カメラの焦点範囲に位置する部分を透明体により形成し
たことを特徴とする電子部品実装装置。1. An electronic component is vacuum-sucked to a lower end portion of a nozzle provided in a transfer head and transferred toward a substrate. During the transfer, the electronic component is observed by a lower camera to position the electronic component. After recognizing, an electronic component mounting apparatus for mounting an electronic component on a substrate, wherein at least a portion of the nozzle located in a focal range of the camera is formed of a transparent body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8002008A JPH09191195A (en) | 1996-01-10 | 1996-01-10 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8002008A JPH09191195A (en) | 1996-01-10 | 1996-01-10 | Electronic component mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09191195A true JPH09191195A (en) | 1997-07-22 |
Family
ID=11517368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8002008A Pending JPH09191195A (en) | 1996-01-10 | 1996-01-10 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09191195A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1468591A1 (en) * | 2001-09-05 | 2004-10-20 | Delaware Capital Formation, Inc. | Method and apparatus for mounting a component |
-
1996
- 1996-01-10 JP JP8002008A patent/JPH09191195A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1468591A1 (en) * | 2001-09-05 | 2004-10-20 | Delaware Capital Formation, Inc. | Method and apparatus for mounting a component |
| EP1468591A4 (en) * | 2001-09-05 | 2008-06-11 | Ui Holding Co | Method and apparatus for mounting a component |
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