JPH09186099A - Exhaust system structure for manufacture of semiconductor - Google Patents
Exhaust system structure for manufacture of semiconductorInfo
- Publication number
- JPH09186099A JPH09186099A JP35321695A JP35321695A JPH09186099A JP H09186099 A JPH09186099 A JP H09186099A JP 35321695 A JP35321695 A JP 35321695A JP 35321695 A JP35321695 A JP 35321695A JP H09186099 A JPH09186099 A JP H09186099A
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- Prior art keywords
- duct
- block
- pipe
- tube
- exhaust gas
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体製造装置の
排気系構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust system structure for semiconductor manufacturing equipment.
【０００２】[0002]
【従来の技術】ウェーハ等の基板に不純物の拡散処理等
を行う半導体製造装置では、反応室の内部をブロアー等
により吸引排気する様になっている。2. Description of the Related Art In a semiconductor manufacturing apparatus for diffusing impurities on a substrate such as a wafer, the inside of a reaction chamber is sucked and exhausted by a blower or the like.
【０００３】図３は、縦型反応炉を備えた半導体製造装
置の排気系構造の従来例を示している。反応室１に連通
して接続された排気系ダクト２は、垂直方向に配管され
た立下げダクト管３及び立上げダクト管４等から成って
いる。該立下げダクト管３と立上げダクト管４との折返
し継目部には図４に示す筐体状の折返しブロック５が配
置されている。つまり、一旦前記反応室１から立下げら
れた前記立下げダクト管３によって、反応室１から排出
される水分やリン等による気体状態の排気ガスや液体状
態の排液を下方の前記折返しブロック５に流落ち易くし
ている。FIG. 3 shows a conventional example of an exhaust system structure of a semiconductor manufacturing apparatus equipped with a vertical reactor. The exhaust system duct 2 that is connected to the reaction chamber 1 and is connected to the reaction chamber 1 is composed of a down duct pipe 3 and a rise duct pipe 4 that are vertically piped. A case-shaped turn-back block 5 shown in FIG. 4 is arranged at the turn-back joint between the lowering duct pipe 3 and the rising duct pipe 4. That is, the exhaust duct in the gas state and the drained liquid in the liquid state due to the water, phosphorus, etc. discharged from the reaction chamber 1 by the fall duct pipe 3 once lowered from the reaction chamber 1 are provided to the folding block 5 below. It is easy to wash away.
【０００４】又、前記立下げダクト管３には前記折返し
ブロック５に達する手前にガス冷却器６が設けられてい
る。該ガス冷却器６では前記反応室１から排気された排
気ガスを強制冷却して排気ガス中の水分やリン等を液化
し、その液滴を前記折返しブロック５に滴下してドレイ
ン管７から排出する様になっている。液体化が不完全で
そのまま折返しブロック５に流入された排気ガスは前記
立上げダクト管４の排気口８より上方に排気される。Further, a gas cooler 6 is provided in the falling duct pipe 3 before reaching the folding block 5. In the gas cooler 6, the exhaust gas exhausted from the reaction chamber 1 is forcibly cooled to liquefy water, phosphorus, etc. in the exhaust gas, and the droplets are dropped on the folding block 5 and discharged from the drain pipe 7. It is supposed to do. The exhaust gas, which is not completely liquefied and has flowed into the folding block 5 as it is, is exhausted upward from the exhaust port 8 of the rising duct pipe 4.
【０００５】半導体製造装置の排気圧が低下する等して
変動があると製品ウェーハの膜厚分布に影響することか
ら、排気圧変動の原因となる排液による排気系ダクト２
の詰まりは防止されなければならない。排気圧が低下し
た場合に前記折返しブロック５は排液特に前記リンの排
液の滞留状況を先ず確認する部分ともなっている。Fluctuations such as a decrease in the exhaust pressure of the semiconductor manufacturing apparatus affect the film thickness distribution of the product wafer. Therefore, the exhaust system duct 2 due to the drainage that causes the exhaust pressure fluctuations
Clogging must be prevented. When the exhaust pressure decreases, the turn-back block 5 also serves as a part for first confirming the state of retention of the drainage, particularly the phosphorus drainage.
【０００６】[0006]
【発明が解決しようとする課題】然し乍ら、前述の従来
の排気系構造に装備された筐体状の折返しブロック５の
場合、排気圧変動時に排液の滞留状況を確認するには、
立下げダクト管３や立上げダクト管４等から成る排気系
構造全体を分解しなければならず、メンテナンスに多大
な時間を要して半導体製造装置の稼働率低下の要因とな
っている。However, in the case of the case-shaped folding block 5 equipped in the above-mentioned conventional exhaust system structure, the accumulation state of the drainage can be confirmed when the exhaust pressure changes.
The entire exhaust system structure including the down duct pipe 3, the up duct pipe 4 and the like must be disassembled, which requires a lot of time for maintenance, which is a factor of lowering the operating rate of the semiconductor manufacturing apparatus.
【０００７】又、折返しブロック５はこれまでフッソ系
樹脂、例えばテフロンを機械加工して製作されており、
テフロンを機械加工する場合、材料自体の剛性が必要で
あることから肉厚を薄くすることはできず、この為充分
な内部容積を有して形成することが困難である。所要の
内部容積を確保しようとすれば、勢い折返しブロック５
が大型化してしまう不都合がある。テフロン製の場合は
特にリン系の排液の洗浄が厄介であり、洗浄後の乾燥温
度が高温の場合は熱変形を生じ易いといった不具合もあ
る。Further, the folding block 5 has been manufactured by machining a fluorine resin such as Teflon.
When machining Teflon, it is impossible to reduce the wall thickness because the material itself needs to be rigid, and therefore it is difficult to form Teflon with a sufficient internal volume. If you want to ensure the required internal volume, the momentum folding block 5
However, there is an inconvenience that it becomes large. In the case of Teflon, it is particularly difficult to wash the phosphorus-based drainage solution, and there is a problem that thermal deformation is likely to occur when the drying temperature after washing is high.
【０００８】本発明は斯かる実情に鑑みなしたものであ
り、半導体製造装置の排気系構造にあって、排液の滞留
状態の確認、排液の洗浄等のメンテナンス作業性を向上
させることである。The present invention has been made in view of the above circumstances, and in the exhaust system structure of a semiconductor manufacturing apparatus, it is possible to improve maintenance workability such as confirmation of accumulated state of drainage and cleaning of drainage. is there.
【０００９】[0009]
【課題を解決するための手段】本発明は、反応室からの
排気ガス及び排液を排出する垂直方向に配管された立下
げダクト管及び立上げダクト管を有し、該立下げダクト
管と立上げダクト管との折返し継目部に、透明材で形成
されて前記立下げダクト管から流下した前記排液をドレ
イン排出し且前記排気ガスを前記立上げダクト管から排
気する筐体状の折返しブロックを配置し、或は立下げダ
クト管下端部を折返しブロック内に突出させ、或は更
に、前記立下げダクト管に洗浄水を供給する洗浄水管を
接続したものであり、透明材で筐体状に形成された折返
しブロックでは排液の滞留状態が一目で確認でき、滞留
状態を確認する為に排気系構造全体の分解が不要であ
る。SUMMARY OF THE INVENTION The present invention has a vertical duct pipe and a vertical duct pipe for discharging exhaust gas and waste liquid from a reaction chamber. A casing-shaped turn-back formed of a transparent material at the turn-up joint with the start-up duct pipe, which drains the drainage flowing down from the turn-down duct pipe and discharges the exhaust gas from the start-up duct pipe. A block is arranged, or the lower end of the falling duct pipe is folded back to project into the block, or a washing water pipe for supplying washing water is further connected to the falling duct pipe, and the casing is made of a transparent material. With the folded block formed in a shape, the retention state of the drainage liquid can be confirmed at a glance, and it is not necessary to disassemble the entire exhaust system structure to confirm the retention state.
【００１０】[0010]
【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１１】ウェーハ等の基板に不純物（Ｐ、Ｏ、等）
の拡散処理等を行う半導体製造装置では、三塩化酸化リ
ンＰＯＣｌ3 、酸素Ｏ2 、水蒸気Ｈ2 Ｏ等の各種成膜用
の反応ガスが反応室に導入され、拡散処理等が行われ
る。反応室の内部はブロアーによって吸引排気される。Impurities (P, O, etc.) are added to substrates such as wafers.
In a semiconductor manufacturing apparatus that performs the diffusion treatment, etc., reaction gases for forming various films, such as phosphorus trichloride oxide POCl 3 , oxygen O 2 , water vapor H 2 O, etc., are introduced into the reaction chamber to perform the diffusion treatment. The inside of the reaction chamber is sucked and exhausted by a blower.
【００１２】図１に於いて、縦型反応炉を備えた半導体
製造装置の反応室１０には反応ガス導入管９が接続さ
れ、該反応ガス導入管９から前記反応ガスが導入される
様になっており、又前記反応室１０には排気系ダクト１
１が接続され内部のガスを図示しないブロアー等により
吸引排気する。前記排気系ダクト１１は前記反応室１０
から導出された排気ガス導出管１２を有し、該排気ガス
導出管１２から一旦垂直下方に配管された立下げダクト
管１３と更に垂直上方に配管された立上げダクト管１４
等から構成されている。In FIG. 1, a reaction gas introducing pipe 9 is connected to a reaction chamber 10 of a semiconductor manufacturing apparatus equipped with a vertical reaction furnace, and the reaction gas is introduced from the reaction gas introducing pipe 9. In addition, the exhaust system duct 1 is provided in the reaction chamber 10.
1 is connected and the internal gas is sucked and exhausted by a blower or the like (not shown). The exhaust duct 11 is connected to the reaction chamber 10
An exhaust gas lead-out pipe 12 which is led out from the exhaust gas lead-out pipe 12, and a rising duct pipe 14 which is once piped vertically downward from the exhaust gas lead-out pipe 12 and a rising duct pipe 14 which is further piped vertically upward.
And so on.
【００１３】前記立下げダクト管１３にはガス冷却器１
５が設けられ、該ガス冷却器１５では前記反応室１０か
ら混在して排出された水分やリン等による気体状態の排
気ガス、液体状態の排液の内、排気ガスを強制冷却して
液化する。又、前記ガス冷却器１５の下流側には前記立
下げダクト管１３に洗浄水を供給する洗浄水管１６が接
続されている。前記ガス冷却器１５を出た排液、前記洗
浄水管１６から供給された洗浄水は、前記立下げダクト
管１３を経て筐体状の折返しブロック１７に向かって流
下する。即ち、前記立下げダクト管１３と前記立上げダ
クト管１４との折返し継目部には、図２に示す筐体状の
前記折返しブロック１７が配置されている。A gas cooler 1 is attached to the down duct pipe 13.
5, the gas cooler 15 forcibly cools and liquefies the exhaust gas among the exhaust gas in the gaseous state and the liquid exhaust in the liquid state due to water and phosphorus mixedly discharged from the reaction chamber 10. . Further, a washing water pipe 16 for supplying washing water to the falling duct pipe 13 is connected to the downstream side of the gas cooler 15. The drainage discharged from the gas cooler 15 and the cleaning water supplied from the cleaning water pipe 16 flow down toward the casing-shaped folding block 17 via the falling duct pipe 13. That is, the casing-shaped folded-back block 17 shown in FIG. 2 is arranged at the folded-back joint between the down duct pipe 13 and the up-duct duct 14.
【００１４】前記折返しブロック１７には、前記ガス冷
却器１５で強制冷却した排気ガスの排液が流入し、該排
液はドレイン管２０から排出される様になっている。
又、前記ガス冷却器１５で液体化が不完全なまま導入さ
れた排気ガスは、筐体状の前記折返しブロック１７を経
て前記立上げダクト管１４の排気口２１より上方排気さ
れる。A waste liquid of the exhaust gas forcedly cooled by the gas cooler 15 flows into the folding block 17, and the waste liquid is discharged from the drain pipe 20.
Further, the exhaust gas introduced in the gas cooler 15 while being incompletely liquefied is exhausted upward from the exhaust port 21 of the rising duct pipe 14 through the folding block 17 having a housing shape.
【００１５】ここで、図２に示す断面形状の折返しブロ
ック１７は、該折返しブロック１７の本体ブロック１８
が透明材質の石英を用いて形成され、内部状態が視認で
きる様になっている。前記本体ブロック１８の底部１９
は前記ドレイン管２０に向って下る傾斜面で形成され、
前記ガス冷却器１５で液体化して流入した排液を前記ド
レイン管２０より流下排出し易くしている。Here, the folding block 17 having the sectional shape shown in FIG. 2 is a main body block 18 of the folding block 17.
Are made of transparent quartz so that the internal state can be visually confirmed. The bottom portion 19 of the body block 18
Is formed by an inclined surface that descends toward the drain pipe 20,
The drainage liquid 20 that has been liquefied by the gas cooler 15 and flows in is easily discharged downward from the drain pipe 20.
【００１６】前記立下げダクト管１３の下端部１３ａが
本体ブロック１８の内部に突出して設けられている。そ
れに対して、前記立上げダクト管１４の下端は前記本体
ブロック１８の天井面に面一に結合されている。前記立
下げダクト管１３の前記下端部１３ａを前記本体ブロッ
ク１８の内部に長く突出させることにより、排液が立上
げダクト管１４に回込んで詰まるのを防止する様に工夫
されている。A lower end portion 13a of the down duct pipe 13 is provided so as to project inside the main body block 18. On the other hand, the lower end of the rising duct pipe 14 is joined flush with the ceiling surface of the main body block 18. By making the lower end portion 13a of the lowering duct pipe 13 project into the inside of the main body block 18 for a long time, it is devised so that drainage is prevented from flowing into the rising duct pipe 14 and clogging.
【００１７】前記折返しブロック１７を透明材の石英で
筐体状に形成することにより、該折返しブロック１７内
での排液の滞留状況を視認できる。排気圧が低下等して
変動した際、先ず筐体状の前記折返しブロック１７の内
部を確認し、状況に直ちに対応することができる。この
場合、従来の様に滞留状況を確認する為に排気系構造を
その都度分解する必要はなくなる。従って、メンテナン
スは大幅に向上し、半導体製造装置の稼働率も高まる。By forming the folding-back block 17 from quartz, which is a transparent material, in the shape of a housing, the state of retention of the drainage liquid in the folding-back block 17 can be visually recognized. When the exhaust pressure fluctuates due to a decrease or the like, first, the inside of the case-shaped folding block 17 can be checked to immediately respond to the situation. In this case, it is not necessary to disassemble the exhaust system structure each time in order to confirm the staying condition as in the conventional case. Therefore, maintenance is significantly improved, and the operation rate of semiconductor manufacturing equipment is also increased.
【００１８】又、筐体状の前記折返しブロック１７の材
質に石英を用いたことにより、従来例で説明されたテフ
ロンの場合よりも内部容積を大きくすることが可能であ
る。つまり、テフロンはドリル等による切削機械加工で
内部容積を削出す為に、薄肉加工に限界があり、それだ
け内部容積が狭められる。それに対して、石英の場合は
溶融して成形するので任意の形状に形成でき薄肉にする
ことができる。又、透明質であれば石英に代えて、耐熱
性のガラスの使用も可能である。Further, by using quartz as the material of the casing-shaped folding block 17, it is possible to increase the internal volume as compared with the case of Teflon described in the conventional example. In other words, since Teflon cuts the internal volume by cutting machining with a drill or the like, there is a limit to thin-wall processing, and the internal volume is reduced accordingly. On the other hand, in the case of quartz, since it is melted and molded, it can be formed into an arbitrary shape and can be made thin. If it is transparent, heat-resistant glass can be used instead of quartz.
【００１９】筐体状の前記折返しブロック１７に石英又
は耐熱性ガラスを用いることで、平面が滑らかとなり、
特に前記リン系の排液を前記洗浄水管１６からの洗浄水
で洗浄する際の除去作業が能率アップする。又、石英又
は耐熱性ガラスとすることにより洗浄後の高温乾燥時に
熱変形を抑えることができる。By using quartz or heat resistant glass for the housing-shaped folding block 17, the flat surface becomes smooth,
In particular, the removal work when cleaning the phosphorus-based drainage with the cleaning water from the cleaning water pipe 16 improves the efficiency. Further, by using quartz or heat resistant glass, thermal deformation can be suppressed during high temperature drying after washing.
【００２０】尚、前記実施の形態では、洗浄水管１６か
ら立下げダクト管１３に洗浄水を供給するタイミング
は、反応室１０に於けるプロセス中、プロセス後の数時
間に実行できる様に設定できる。更に、前記洗浄水管１
６にバルブを設け、バルブの開閉を制御して洗浄水での
洗浄時期を制御する。In the above embodiment, the timing of supplying the cleaning water from the cleaning water pipe 16 to the down duct pipe 13 can be set so that it can be executed during the process in the reaction chamber 10 and several hours after the process. . Further, the washing water pipe 1
A valve is provided at 6, and the opening and closing of the valve is controlled to control the cleaning time with cleaning water.
【００２１】[0021]
【発明の効果】以上述べた如く本発明によれば、反応室
からの排気ガス及び排液を排出する垂直方向に配管され
た立下げダクト管と立上げダクト管との折返し継目部
に、透明材で形成された筐体状の折返しブロックを設け
たので、該折返しブロックに滞留した排液が外から確認
でき、排液の滞留状態を確認する為の分解が不要にな
る。立下げダクト管の下端部が突出しているので排液の
立下げダクト管から立上げダクト管への回込みが防止さ
れ、更に又、排口部に洗浄の為の水を流通する様にした
ので、洗浄が容易となる。その結果、メンテナンス作業
性が向上し、半導体製造装置の稼働率が高められるとい
う優れた効果を発揮する。As described above, according to the present invention, a transparent joint is provided at the turn-around joint between the vertical duct and the vertical duct for discharging exhaust gas and waste liquid from the reaction chamber. Since the housing-shaped folding block formed of the material is provided, the drainage accumulated in the folding block can be confirmed from the outside, and disassembling for confirming the retention state of the drainage is unnecessary. Since the lower end of the down duct pipe projects, drainage of drainage from the down duct pipe to the up duct pipe is prevented, and water for cleaning is circulated to the drain port. Therefore, cleaning becomes easy. As a result, the maintenance workability is improved, and the excellent effect that the operation rate of the semiconductor manufacturing apparatus is increased is exhibited.
【図１】本発明に係る半導体製造装置の排気系構造の実
施の形態を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of an exhaust system structure of a semiconductor manufacturing apparatus according to the present invention.
【図２】該実施の形態の要部である折返しブロックを示
す断面図である。FIG. 2 is a cross-sectional view showing a folded block that is a main part of the embodiment.
【図３】従来の半導体製造装置の排気系構造を示す構成
図である。FIG. 3 is a configuration diagram showing an exhaust system structure of a conventional semiconductor manufacturing apparatus.
【図４】該従来例の要部である折返しブロックを示す断
面図である。FIG. 4 is a cross-sectional view showing a folded block which is a main part of the conventional example.
１０ 反応室 １１ 排気系ダクト １３ 立下げダクト管 １４ 立上げダクト管 １５ ガス冷却器 １６ 洗浄水管 １７ 折返しブロック １８ 本体ブロック ２０ ドレイン管 10 Reaction Chamber 11 Exhaust System Duct 13 Falling Duct Pipe 14 Rising Duct Pipe 15 Gas Cooler 16 Washing Water Pipe 17 Folding Block 18 Body Block 20 Drain Pipe
Claims (3)
る垂直方向に配管された立下げダクト管及び立上げダク
ト管を有し、該立下げダクト管と立上げダクト管との折
返し継目部に、透明材で形成されて前記立下げダクト管
から流下した前記排液をドレイン排出し且前記排気ガス
を前記立上げダクト管から排気する筐体状の折返しブロ
ックを配置したことを特徴とする半導体製造装置の排気
系構造。1. A vertical duct for a discharge duct and a discharge duct for discharging exhaust gas and waste liquid from a reaction chamber, and a turn-up joint between the fall duct pipe and the rise duct pipe. And a casing-shaped turn-back block which is made of a transparent material and drains the drained liquid flowing down from the falling duct pipe and discharges the exhaust gas from the rising duct pipe. Exhaust system structure for semiconductor manufacturing equipment.
ック内に突出させた請求項１記載の半導体製造装置の排
気系構造。2. The exhaust system structure of the semiconductor manufacturing apparatus according to claim 1, wherein the lower end portion of the down duct pipe is projected into the folding block.
洗浄水管を接続した請求項１記載の半導体製造装置の排
気系構造。3. The exhaust system structure of the semiconductor manufacturing apparatus according to claim 1, wherein a cleaning water pipe for supplying cleaning water is connected to the down duct pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35321695A JP3499668B2 (en) | 1995-12-29 | 1995-12-29 | Semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35321695A JP3499668B2 (en) | 1995-12-29 | 1995-12-29 | Semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09186099A true JPH09186099A (en) | 1997-07-15 |
| JP3499668B2 JP3499668B2 (en) | 2004-02-23 |
Family
ID=18429351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35321695A Expired - Lifetime JP3499668B2 (en) | 1995-12-29 | 1995-12-29 | Semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3499668B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102679746A (en) * | 2012-05-24 | 2012-09-19 | 南京华伯仪器科技有限公司 | Atmosphere stabilizing device of diffusion hearth |
| US20160348238A1 (en) * | 2015-05-28 | 2016-12-01 | Kabushiki Kaisha Toshiba | Film forming apparatus |
-
1995
- 1995-12-29 JP JP35321695A patent/JP3499668B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102679746A (en) * | 2012-05-24 | 2012-09-19 | 南京华伯仪器科技有限公司 | Atmosphere stabilizing device of diffusion hearth |
| CN102679746B (en) * | 2012-05-24 | 2014-07-09 | 南京华伯仪器科技有限公司 | Atmosphere stabilizing device of diffusion hearth |
| US20160348238A1 (en) * | 2015-05-28 | 2016-12-01 | Kabushiki Kaisha Toshiba | Film forming apparatus |
| JP2016225411A (en) * | 2015-05-28 | 2016-12-28 | 株式会社東芝 | Deposition system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3499668B2 (en) | 2004-02-23 |
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