JPH09172052A - Apparatus and method for transferring wafer - Google Patents
Apparatus and method for transferring waferInfo
- Publication number
- JPH09172052A JPH09172052A JP33051495A JP33051495A JPH09172052A JP H09172052 A JPH09172052 A JP H09172052A JP 33051495 A JP33051495 A JP 33051495A JP 33051495 A JP33051495 A JP 33051495A JP H09172052 A JPH09172052 A JP H09172052A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- carrier
- wafers
- pitch
- wafer transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Stacking Of Articles And Auxiliary Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はキャリア内に収納さ
れている複数のウェーハを一括して他のキャリアに移載
する装置と方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for collectively transferring a plurality of wafers stored in a carrier to another carrier.
【０００２】[0002]
【従来の技術】半導体装置の製造工程においては複数の
ウェーハをキャリアに収納してハンドリングすることが
多いが、工程によっては材質や形状の異なるキャリアに
移し替える必要がある。例えば洗浄やＣＶＤ等の工程で
は（特にバッチ方式で処理する場合）ウェーハを搬送用
のポリプロピレン樹脂製キャリアから弗素樹脂製または
石英ガラス製のキャリア（バスケット、ボート等と呼ぶ
ものを含む）に移し替え、処理後、この逆の移し替えを
行う。この移し替えにウェーハ移載装置が使用される。2. Description of the Related Art In a manufacturing process of a semiconductor device, a plurality of wafers are often accommodated in a carrier for handling. However, depending on the process, it is necessary to transfer the wafers to carriers having different materials and shapes. For example, in processes such as cleaning and CVD (especially when processing in a batch system), wafers are transferred from a carrier made of polypropylene resin for transport to a carrier made of fluororesin or quartz glass (including baskets, boats, etc.). After processing, the reverse transfer is performed. A wafer transfer device is used for this transfer.
【０００３】従来のウェーハ移載装置とウェーハ移載方
法を図５を参照しながら説明する。図５は従来のウェー
ハ移載装置の概略図であり、（Ａ）は側面図、（Ｂ）は
正面図である。１はウェーハ、２Ａは第一のキャリア、
２Ｂは第二のキャリア、１１は往復テーブル、１２はウ
ェーハ搬送部、１４はウェーハ保持部である。A conventional wafer transfer device and wafer transfer method will be described with reference to FIG. FIG. 5 is a schematic view of a conventional wafer transfer device, (A) is a side view and (B) is a front view. 1 is a wafer, 2A is a first carrier,
2B is a second carrier, 11 is a reciprocating table, 12 is a wafer transfer unit, and 14 is a wafer holding unit.
【０００４】第一および第二のキャリア２Ａ，２Ｂはそ
れぞれウェーハ１を直立収納するための案内溝を多数有
し、ウェーハ収納ピッチは同じである。ウェーハ搬送部
１２およびウェーハ保持部１４はそれぞれキャリア２
Ａ，２Ｂのウェーハ収納ピッチに等しいピッチでＹ字状
断面の案内溝を設けたウェーハ支持部材１３，ウェーハ
保持部材１５を備えている。The first and second carriers 2A and 2B each have a large number of guide grooves for vertically storing the wafer 1, and have the same wafer storing pitch. The wafer transfer unit 12 and the wafer holding unit 14 are the carriers 2 respectively.
A wafer supporting member 13 and a wafer holding member 15 provided with guide grooves having a Y-shaped cross section are provided at a pitch equal to the wafer storage pitch of A and 2B.
【０００５】先ず往復テーブル１１上に、移載元となる
ウェーハ１を収納したキャリア（第一のキャリア２Ａ）
と移載先となる空のキャリア（第二のキャリア２Ｂ）と
を搭載する。第一のキャリア２Ａがホームポジションに
あるウェーハ支持部材１３の上方となるように往復テー
ブル１１を移動し、この状態でウェーハ支持部材１３を
上昇させ、第一のキャリア２Ａ内の総てのウェーハ１を
載置してウェーハ保持部１４に搬送する。ここでウェー
ハ保持部材１５がこれらを保持すると、ウェーハ支持部
材１３は空になった第一のキャリア２Ａの下方のホーム
ポジションに戻る。First, a carrier (first carrier 2A) in which a wafer 1 as a transfer source is stored on the reciprocating table 11.
And an empty carrier (second carrier 2B) which is a transfer destination. The reciprocating table 11 is moved so that the first carrier 2A is located above the wafer supporting member 13 at the home position, and the wafer supporting member 13 is raised in this state, and all the wafers 1 in the first carrier 2A are moved. Is placed and conveyed to the wafer holder 14. When the wafer holding member 15 holds them here, the wafer supporting member 13 returns to the home position below the empty first carrier 2A.
【０００６】次に第二のキャリア２Ｂがウェーハ支持部
材１３の上方となるように往復テーブル１１を移動し、
この状態で再びウェーハ支持部材１３を上昇させ、これ
にウェーハ保持部材１４が保持する総てのウェーハ１を
載置したのち下降し、下降の途中でこれらのウェーハ１
を第二のキャリア２Ｂ内に残してホームポジションに戻
り、ウェーハ移載を終了する。Next, the reciprocating table 11 is moved so that the second carrier 2B is above the wafer supporting member 13.
In this state, the wafer support member 13 is raised again, all the wafers 1 held by the wafer holding member 14 are placed on the wafer support member 13, and then the wafer support member 13 is lowered.
Leaving the inside of the second carrier 2B and returning to the home position, the wafer transfer is completed.
【０００７】[0007]
【発明が解決しようとする課題】ところが、このような
従来の装置では、ウェーハをウェーハ搬送部で搬送する
際、ウェーハはその最下部だけで支持されており、しか
もその搬送部の案内溝の幅がウェーハの厚さより広く作
られているから、ウェーハは多少傾くことが多く、その
結果、ウェーハ搬送（上昇および下降）時にウェーハの
周縁部がキャリアの案内溝側壁に触れて表面に擦り傷が
付くとともに発塵することがある、という問題があっ
た。However, in such a conventional apparatus, when the wafer is transferred by the wafer transfer section, the wafer is supported only by the lowermost part thereof, and the width of the guide groove of the transfer section is increased. Since the wafer is made wider than the thickness of the wafer, the wafer often tilts slightly, and as a result, the peripheral edge of the wafer touches the guide groove side wall of the carrier when the wafer is transferred (raised and lowered), and the surface is scratched. There was a problem that it might generate dust.
【０００８】本発明は、このような問題を解決して、ウ
ェーハ搬送時にウェーハの周縁部がキャリアの案内溝側
壁に触れることを防止したウェーハ移載装置およびウェ
ーハ移載方法を提供することを目的とする。It is an object of the present invention to solve the above problems and provide a wafer transfer device and a wafer transfer method which prevent the peripheral edge of the wafer from touching the side wall of the guide groove of the carrier during wafer transfer. And
【０００９】[0009]
【課題を解決するための手段】この目的を達成するた
め、本発明は、第一のキャリアに所定のピッチで直立収
納された複数のウェーハを該ピッチを変えることなく一
括して第二のキャリアに移載する装置において、該第一
および第二のキャリアのウェーハ収納ピッチに等しいピ
ッチで案内溝を設けた支持部材を備え該複数のウェーハ
を支持して上方および下方に搬送するウェーハ搬送部
と、該ウェーハ搬送部が該第一のキャリアから上方に搬
送した複数のウェーハを一時的に保持するウェーハ保持
部と、該ウェーハ収納ピッチに等しいピッチで複数のＶ
字状若しくはＹ字状の案内溝を設けた傾斜抑制部材を備
えたウェーハ傾斜抑制部と、を有し、該傾斜抑制部材の
案内溝に該ウェーハの周端部を挿入した状態で該ウェー
ハを支持部材に載置して搬送することを特徴とするウェ
ーハ移載装置としている。In order to achieve this object, the present invention relates to a plurality of wafers which are vertically stored in a first carrier at a predetermined pitch and are collectively used as a second carrier without changing the pitch. And a wafer transfer unit for supporting the plurality of wafers and transferring the wafers upward and downward, including a supporting member having guide grooves provided at a pitch equal to the wafer storage pitch of the first and second carriers. A wafer holding part for temporarily holding a plurality of wafers transferred upward from the first carrier by the wafer transfer part, and a plurality of Vs at a pitch equal to the wafer storage pitch.
A wafer inclination suppressing portion having an inclination suppressing member provided with a V-shaped or Y-shaped guide groove, and the wafer in a state in which a peripheral end portion of the wafer is inserted in the guide groove of the inclination suppressing member. The wafer transfer device is characterized by being placed on a support member and conveyed.
【００１０】また本発明は、前記ウェーハ搬送部と、前
記ウェーハ保持部と、前記傾斜抑制部材に代えて棒状の
押さえ部材を備えたウェーハ傾斜抑制部と、を有し、該
押さえ部材を該ウェーハの周端部に当接した状態で該ウ
ェーハを支持部材に載置して搬送することを特徴とする
ウェーハ移載装置としている。Further, the present invention has the wafer transfer section, the wafer holding section, and a wafer inclination suppressing section provided with a rod-shaped pressing member instead of the inclination suppressing member. The wafer transfer device is characterized in that the wafer is placed on a support member and conveyed in a state of being in contact with the peripheral end portion of the wafer transfer device.
【００１１】また本発明は、第一のキャリアに所定のピ
ッチで直立収納された複数のウェーハを該ピッチを変え
ることなく一括して第二のキャリアに移載する方法にお
いて、上記のいずれかのウェーハ移載装置を使用し、前
記傾斜抑制部材の案内溝に該ウェーハの周端部を挿入し
た状態、若しくは、前記押さえ部材を該ウェーハの周端
部に当接した状態で、該ウェーハを支持部材に載置して
搬送することを特徴とするウェーハ移載方法としてい
る。Further, the present invention is a method for transferring a plurality of wafers, which are vertically stored in a first carrier at a predetermined pitch, to a second carrier in a lump without changing the pitch. Using a wafer transfer device, supporting the wafer with the peripheral edge of the wafer inserted in the guide groove of the tilt suppressing member or with the pressing member in contact with the peripheral edge of the wafer The wafer transfer method is characterized in that the wafer is transferred by being placed on a member.
【００１２】即ち、ウェーハ搬送部がウェーハを下から
突き上げる直前にウェーハの姿勢を矯正するか若しくは
上方で押さえるから、突き上げた時にウェーハが傾斜す
ることが抑制若しくは防止され、ウェーハの周縁部がキ
ャリアの案内溝側壁に触れながらウェーハが搬送される
ことがなくなる。その結果、ウェーハに擦り傷が付いた
り発塵することがなくなる。That is, since the wafer transfer unit corrects the posture of the wafer or presses the wafer from above immediately before pushing up the wafer from below, tilting of the wafer when pushing up is suppressed or prevented, and the peripheral edge of the wafer is The wafer is not transported while touching the side wall of the guide groove. As a result, the wafer is not scratched or dust is generated.
【００１３】[0013]
【発明の実施の形態】本発明の第一の実施の形態を図１
及び図２を参照しながら説明する。図１は本発明の第一
の実施形態を示す装置概略図であり、（Ａ）は側面図、
（Ｂ）は正面図である。図２は本発明の第一の実施形態
の説明図である。両図において、１はウェーハ、２Ａは
第一のキャリア、２Ｂは第二のキャリア、１１は往復テ
ーブル、１２はウェーハ搬送部、１４はウェーハ保持
部、１６はウェーハ傾斜抑制部である。FIG. 1 shows a first embodiment of the present invention.
This will be described with reference to FIG. FIG. 1 is a schematic view of an apparatus showing a first embodiment of the present invention, (A) is a side view,
(B) is a front view. FIG. 2 is an explanatory diagram of the first embodiment of the present invention. In both figures, 1 is a wafer, 2A is a first carrier, 2B is a second carrier, 11 is a reciprocating table, 12 is a wafer transfer section, 14 is a wafer holding section, and 16 is a wafer inclination suppressing section.
【００１４】第一および第二のキャリア２Ａ，２Ｂは用
途により形状や材質が異なるが（搬送用はポリプロピレ
ン樹脂、処理用は石英ガラスや弗素樹脂が多い）、いず
れも多数（例えば２５枚）のウェーハ１を所定のピッチ
で平行に直立支持するためのＹ字状断面の案内溝２ｇ
（図２参照）を有し、案内溝２ｇのピッチ（ウェーハ収
納ピッチ）は同じである。又、収納するウェーハ１の下
方にはウェーハ搬送部１２が通過可能な開口を有してい
る。The first and second carriers 2A and 2B are different in shape and material depending on the application (there are many polypropylene resins for transportation and quartz glass or fluorine resin for processing), but there are many (for example, 25). A guide groove 2g having a Y-shaped cross section for vertically supporting the wafer 1 in parallel at a predetermined pitch.
(See FIG. 2), and the pitch of the guide grooves 2g (wafer storage pitch) is the same. Further, below the wafer 1 to be stored, there is an opening through which the wafer transfer section 12 can pass.
【００１５】往復テーブル１１は二個のキャリア（２
Ａ，２Ｂ）をそれぞれ定位置に搭載することが出来、水
平移動機構（図示は省略）により水平方向に移動可能で
ある。キャリア搭載位置にはウェーハ搬送部１２が通過
可能な開口を有している。The shuttle table 11 includes two carriers (2
A, 2B) can be mounted at fixed positions, respectively, and can be moved in the horizontal direction by a horizontal movement mechanism (not shown). The carrier mounting position has an opening through which the wafer transfer unit 12 can pass.
【００１６】ウェーハ搬送部１２は上端にウェーハ支持
部材１３を備えており、昇降機構（図示は省略）により
上下に移動する。ウェーハ支持部材１３は上面に多数の
Ｙ字状断面の案内溝１３ａを有し、その案内溝１３ａの
数とピッチは上記のキャリア２Ａ，２Ｂの案内溝２ｇの
それと同じである。ホームホジションではウェーハ支持
部材１３が往復テーブル１１より下位となる。The wafer transfer section 12 has a wafer support member 13 at the upper end, and is moved up and down by an elevating mechanism (not shown). The wafer support member 13 has a large number of guide grooves 13a having a Y-shaped cross section on the upper surface, and the number and pitch of the guide grooves 13a are the same as those of the guide grooves 2g of the carriers 2A and 2B. In the home position, the wafer support member 13 is located below the reciprocating table 11.
【００１７】ウェーハ保持部１４はウェーハ搬送部１２
の上方に位置し、一対のウェーハ保持部材１５を備えて
いる。この一対のウェーハ保持部材１５は回動手段（図
示は省略）により接近および離隔する。各ウェーハ保持
部材１５は多数のＹ字状断面の案内溝（図示は省略）を
有し、この案内溝の数とピッチは上記のキャリア２Ａ，
２Ｂの案内溝２ｇのそれと同じである。The wafer holding unit 14 is the wafer transfer unit 12.
And a pair of wafer holding members 15 are provided. The pair of wafer holding members 15 are moved toward and away from each other by a rotating means (not shown). Each wafer holding member 15 has a large number of guide grooves (not shown) having a Y-shaped cross section, and the number and pitch of these guide grooves are the same as those of the carrier 2A,
It is the same as that of the guide groove 2g of 2B.
【００１８】ウェーハ傾斜抑制部１６はウェーハ傾斜抑
制部材１７を備えており、昇降機構（図示は省略）によ
り上下に移動する。ウェーハ傾斜抑制部材１７は下面に
多数のＶ字状またはＹ字状断面の案内溝１７ａを有し、
その案内溝１７ａの数とピッチは上記のキャリア２Ａ，
２Ｂの案内溝２ｇのそれと同じである。ウェーハ傾斜抑
制部材１７のホームポジションはキャリア２Ａまたは２
Ｂに収納したウェーハ１の上端より上位且つウェーハ保
持部材１５より下位である。The wafer inclination suppressing section 16 is provided with a wafer inclination suppressing member 17 and is moved up and down by an elevating mechanism (not shown). The wafer inclination suppressing member 17 has a large number of guide grooves 17a having a V-shaped or Y-shaped cross section on its lower surface.
The number and pitch of the guide grooves 17a are the same as those of the carrier 2A,
It is the same as that of the guide groove 2g of 2B. The home position of the wafer tilt suppressing member 17 is the carrier 2A or 2
It is above the upper end of the wafer 1 stored in B and below the wafer holding member 15.
【００１９】この装置の動作およびこの装置によるウェ
ーハ移載方法は次の通りである。先ず、多数のウェーハ
１が収納されている移載元キャリア（第一のキャリア２
Ａ）と空の移載先キャリア（第二のキャリア２Ｂ）とを
それぞれ往復テーブル１１の所定の位置に搭載し、第一
のキャリア２Ａがウェーハ支持部材１３の直上となる位
置にしておく。The operation of this apparatus and the wafer transfer method by this apparatus are as follows. First, a transfer source carrier (first carrier 2) in which a large number of wafers 1 are stored.
A) and an empty transfer destination carrier (second carrier 2B) are mounted at predetermined positions on the reciprocating table 11, respectively, and the first carrier 2A is positioned directly above the wafer support member 13.
【００２０】次にウェーハ傾斜抑制部材１７が下降して
第一のキャリア２Ａ内のウェーハ１の上部周端部が案内
溝１７ａ内に深く挿入される。この時、傾斜しているウ
ェーハ１の姿勢が矯正される。その後、ウェーハ支持部
材１３がホームポジションから上昇し、案内溝１３ａに
ウェーハ１の下部周端部を挿入する形で総てのウェーハ
１を直立状態のまま持ち上げ、ウェーハ保持部１４まで
搬送して停止する。ウェーハ支持部材１３がウェーハ１
を持ち上げる時点からウェーハ傾斜抑制部材１７もウェ
ーハ１の上部周端部を案内溝１７ａ内に挿入したままウ
ェーハ支持部材１３と等速で上昇し、ウェーハ支持部材
１３と同時に停止する。Next, the wafer inclination suppressing member 17 descends and the upper peripheral end portion of the wafer 1 in the first carrier 2A is deeply inserted into the guide groove 17a. At this time, the tilted posture of the wafer 1 is corrected. After that, the wafer supporting member 13 rises from the home position, and all the wafers 1 are lifted in an upright state by inserting the lower peripheral end portion of the wafer 1 into the guide groove 13a, conveyed to the wafer holding portion 14, and stopped. To do. Wafer support member 13 is wafer 1.
The wafer inclination suppressing member 17 also rises at the same speed as the wafer supporting member 13 while the upper peripheral end portion of the wafer 1 is inserted into the guide groove 17a from the time of lifting, and stops at the same time as the wafer supporting member 13.
【００２１】次に一対のウェーハ保持部材１５がウェー
ハ１の両側から下側に回り込み、各々の案内溝にウェー
ハ１の下部周端部を挿入する形で総てのウェーハ１を直
立状態のま保持すると、ウェーハ支持部材１３は一旦下
降してホームポジションに戻る。ウェーハ傾斜抑制部材
１７はウェーハ１の上部周端部を案内溝１７ａ内に挿入
したまま留まる。Next, a pair of wafer holding members 15 wrap around from both sides of the wafer 1 to the lower side, and hold all the wafers 1 in an upright state by inserting the lower peripheral ends of the wafers 1 into the respective guide grooves. Then, the wafer supporting member 13 once descends and returns to the home position. The wafer inclination suppressing member 17 remains with the upper peripheral end portion of the wafer 1 inserted in the guide groove 17a.
【００２２】次に往復テーブル１１が移動して第一のキ
ャリア２Ａがあった位置に第二のキャリア２Ｂが移動す
ると、再びウェーハ搬送部材１３が上昇し、ウェーハ保
持部１４のウェーハ１に接する位置で停止する。その
後、ウェーハ保持部材１５がウェーハ１の下から両側に
退避すると総てのウェーハ１は直立状態のままウェーハ
支持部材１３に移る。ウェーハ傾斜抑制部材１７は引き
続きウェーハ１の上部周端部を案内溝１７ａ内に挿入し
ている。Next, when the reciprocating table 11 moves and the second carrier 2B moves to the position where the first carrier 2A was located, the wafer transfer member 13 rises again and the position where the wafer holding unit 14 contacts the wafer 1. Stop at. After that, when the wafer holding member 15 is retracted from the bottom of the wafer 1 to both sides, all the wafers 1 are moved to the wafer supporting member 13 in the upright state. The wafer inclination suppressing member 17 continues to insert the upper peripheral end portion of the wafer 1 into the guide groove 17a.
【００２３】この状態でウェーハ支持部材１３がウェー
ハ傾斜抑制部材１７と共に下降する。先ずウェーハ傾斜
抑制部材１７がそのホームポジションで停止し、次にウ
ェーハ１が第二のキャリア２Ｂに収納され、最後にウェ
ーハ支持部材１３がホームポジションで停止して、ウェ
ーハ１の移載を終了する。In this state, the wafer supporting member 13 descends together with the wafer inclination suppressing member 17. First, the wafer tilt suppressing member 17 stops at its home position, then the wafer 1 is stored in the second carrier 2B, and finally the wafer supporting member 13 stops at the home position, thus ending the transfer of the wafer 1. .
【００２４】この方式では、ウェーハ１の周縁部がキャ
リア２Ａの案内溝２ｇ側壁に触れていても、ウェーハ支
持部材１３がそのウェーハ１を突き上げる前にウェーハ
傾斜抑制部材１７のＶ字状またはＹ字状の案内溝１７ａ
がウェーハ１の姿勢を矯正して案内溝２ｇ側壁から離す
から、ウェーハ１の表面に擦り傷が付くことはない。
尚、このウェーハ姿勢矯正は図２のように完全なもので
なくても良く、僅かでも矯正されれば効果を生じる。According to this method, even if the peripheral edge of the wafer 1 is in contact with the side wall of the guide groove 2g of the carrier 2A, the wafer inclination suppressing member 17 is V-shaped or Y-shaped before the wafer supporting member 13 pushes up the wafer 1. -Shaped guide groove 17a
Will correct the posture of the wafer 1 and separate it from the side wall of the guide groove 2g, so that the surface of the wafer 1 will not be scratched.
Incidentally, this wafer posture correction does not have to be perfect as shown in FIG. 2, and even a slight correction is effective.
【００２５】本発明の第二の実施の形態を図３及び図４
を参照しながら説明する。図３は本発明の第二の実施形
態を示す装置概略図であり、（Ａ）は側面図、（Ｂ）は
正面図である。図４は本発明の第二の実施形態の説明図
である。両図において、図１及び図２と同じものには同
一の符号を付与した。１８はウェーハ押さえ部材であ
る。FIGS. 3 and 4 show a second embodiment of the present invention.
This will be described with reference to FIG. FIG. 3 is a schematic view of an apparatus showing a second embodiment of the present invention, (A) is a side view and (B) is a front view. FIG. 4 is an explanatory diagram of the second embodiment of the present invention. In both figures, the same components as those in FIGS. 1 and 2 are designated by the same reference numerals. Reference numeral 18 is a wafer pressing member.
【００２６】第二の実施形態では、ウェーハ傾斜抑制部
１６の下端に第一の実施形態におけるウェーハ傾斜抑制
部材１７に代えてウェーハ押さえ部材１８を備えてい
る。ウェーハ押さえ部材１８には案内溝はなく、棒状
（例えば丸棒）であり、少なくとも表層は比較的軟質の
材料（例えばポリプロピレン樹脂）からなっている。装
置の動作はウェーハ１搬送時にウェーハ押さえ部材１８
をウェーハ１上部周端部に軽く接触させること以外は第
一の実施形態と変わらない。In the second embodiment, a wafer pressing member 18 is provided at the lower end of the wafer tilt suppressing portion 16 instead of the wafer tilt suppressing member 17 in the first embodiment. The wafer pressing member 18 has no guide groove and has a rod shape (for example, a round bar), and at least the surface layer is made of a relatively soft material (for example, polypropylene resin). The operation of the apparatus is such that the wafer pressing member 18 is used when the wafer 1 is transferred.
Is the same as that of the first embodiment except that it is lightly contacted with the upper peripheral edge of the wafer 1.
【００２７】図４のようにウェーハ１が収納時にキャリ
ア２Ａの案内溝２ｇ側壁に触れていても、ウェーハ１の
上部をウェーハ押さえ部材１８で押さえることによりそ
れ以上傾くことがなくなるから、ウェーハ支持部材１３
がウェーハ１をキャリア２Ａから持ち上げた時点で案内
溝２ｇ側壁から離れ、従ってウェーハ１の表面に擦り傷
が付くことはない。Even when the wafer 1 is in contact with the side wall of the guide groove 2g of the carrier 2A during storage as shown in FIG. 4, the upper portion of the wafer 1 is held by the wafer holding member 18 so that the wafer 1 is not tilted any more. Thirteen
When the wafer 1 is lifted from the carrier 2A, the wafer 1 is separated from the side wall of the guide groove 2g, so that the surface of the wafer 1 is not scratched.
【００２８】[0028]
【発明の効果】以上説明したように、本発明によれば、
ウェーハ移載装置のウェーハ搬送部がウェーハを下から
突き上げる直前にウェーハの姿勢を矯正するか若しくは
上方で押さえるから、突き上げた時にウェーハが傾斜す
ることが抑制若しくは防止され、ウェーハの周縁部がキ
ャリアの案内溝側壁に触れながらウェーハが搬送される
ことがなくなる。その結果、ウェーハ搬送時にウェーハ
に擦り傷が付いたり発塵することがないウェーハ移載装
置およびウェーハ移載方法を提供することが出来、半導
体装置等の製造歩留り向上に寄与する。As described above, according to the present invention,
Since the wafer transfer unit of the wafer transfer device corrects the posture of the wafer immediately before pushing up the wafer from below or presses it upward, tilting of the wafer when pushing up is suppressed or prevented, and the peripheral edge of the wafer is The wafer is not transported while touching the side wall of the guide groove. As a result, it is possible to provide a wafer transfer device and a wafer transfer method in which the wafer is not scratched or dust is generated when the wafer is transferred, which contributes to improvement in manufacturing yield of semiconductor devices and the like.
【図１】 本発明の第一の実施形態を示す装置概略図で
ある。FIG. 1 is a schematic view of an apparatus showing a first embodiment of the present invention.
【図２】 本発明の第一の実施形態の説明図である。FIG. 2 is an explanatory diagram of the first embodiment of the present invention.
【図３】 本発明の第二の実施形態を示す装置概略図で
ある。FIG. 3 is a schematic view of an apparatus showing a second embodiment of the present invention.
【図４】 本発明の第二の実施形態の説明図である。FIG. 4 is an explanatory diagram of a second embodiment of the present invention.
【図５】 従来のウェーハ移載装置の概略図である。FIG. 5 is a schematic view of a conventional wafer transfer device.
１ ウェーハ ２Ａ 第一のキャリア ２Ｂ 第二のキャリア ２ｇ，１３ａ，１７ａ 案内溝 １１ 往復テーブル １２ ウェーハ搬送部 １３ ウェーハ支持部材 １４ ウェーハ保持部 １５ ウェーハ保持部材 １６ ウェーハ傾斜抑制部 １７ ウェーハ傾斜抑制部材 １８ ウェーハ押さえ部材 DESCRIPTION OF SYMBOLS 1 Wafer 2A 1st carrier 2B 2nd carrier 2g, 13a, 17a Guide groove 11 Reciprocating table 12 Wafer transfer part 13 Wafer support member 14 Wafer holding part 15 Wafer holding member 16 Wafer tilt suppressing part 17 Wafer tilt suppressing member 18 Wafer Holding member
Claims (4)
納された複数のウェーハを該ピッチを変えることなく一
括して第二のキャリアに移載する装置において、 該第一および第二のキャリアのウェーハ収納ピッチに等
しいピッチで案内溝を設けた支持部材を備え、該複数の
ウェーハを支持して上方および下方に搬送するウェーハ
搬送部と、 該ウェーハ搬送部が該第一のキャリアから上方に搬送し
た複数のウェーハを一時的に保持するウェーハ保持部
と、 該ウェーハ収納ピッチに等しいピッチで複数の案内溝を
設けた傾斜抑制部材を備え、該ウェーハ搬送部が該ウェ
ーハを搬送する間、該ウェーハの周端部を該案内溝内に
拘束して該ウェーハの傾斜を抑制し続けるウェーハ傾斜
抑制部と、を有することを特徴とするウェーハ移載装
置。1. An apparatus for collectively transferring a plurality of wafers, which are vertically stored in a first carrier at a predetermined pitch, to a second carrier without changing the pitch, wherein the first and second carriers are provided. A wafer transfer unit for supporting the plurality of wafers and transferring the wafers upward and downward, and a wafer transfer unit that moves the wafers upwards from the first carrier. A wafer holding unit for temporarily holding a plurality of conveyed wafers, and an inclination suppressing member provided with a plurality of guide grooves at a pitch equal to the wafer storage pitch, are provided while the wafer conveying unit conveys the wafers. A wafer transfer device, comprising: a wafer inclination suppressing portion that keeps the peripheral edge portion of the wafer in the guide groove to suppress the inclination of the wafer.
納された複数のウェーハを該ピッチを変えることなく一
括して第二のキャリアに移載する装置において、 前記ウェーハ搬送部と、前記ウェーハ保持部と、 前記傾斜抑制部材に代えて棒状の押さえ部材を備え、該
ウェーハ搬送部が該ウェーハを搬送する間、該押さえ部
材が該ウェーハの周端部に当接して該ウェーハの傾斜を
抑制し続けるウェーハ傾斜抑制部と、を有することを特
徴とするウェーハ移載装置。2. An apparatus for collectively transferring a plurality of wafers uprightly stored in a first carrier at a predetermined pitch to a second carrier without changing the pitch, wherein the wafer transfer section and the wafer A holding portion and a rod-shaped pressing member instead of the tilt suppressing member are provided, and while the wafer transfer unit transfers the wafer, the pressing member abuts a peripheral end portion of the wafer to suppress the inclination of the wafer. A wafer transfer device, comprising:
納された複数のウェーハを該ピッチを変えることなく一
括して第二のキャリアに移載する方法において、 請求項１記載のウェーハ移載装置を使用し、前記傾斜抑
制部材の案内溝に該ウェーハの周端部を挿入した状態で
該ウェーハを該支持部材に載置して搬送することを特徴
とするウェーハ移載方法。3. A wafer transfer method according to claim 1, wherein a plurality of wafers uprightly housed at a predetermined pitch in the first carrier are collectively transferred to the second carrier without changing the pitch. A wafer transfer method, characterized in that an apparatus is used and the wafer is placed on the support member and conveyed while the peripheral end portion of the wafer is inserted in the guide groove of the tilt suppressing member.
納された複数のウェーハを該ピッチを変えることなく一
括して第二のキャリアに移載する方法において、 請求項２記載のウェーハ移載装置を使用し、前記押さえ
部材を該ウェーハの周端部に当接した状態で該ウェーハ
を該支持部材に載置して搬送することを特徴とするウェ
ーハ移載方法。4. The wafer transfer method according to claim 2, wherein a plurality of wafers uprightly stored at a predetermined pitch in the first carrier are collectively transferred to the second carrier without changing the pitch. A wafer transfer method, wherein an apparatus is used, and the wafer is placed on the support member and conveyed while the pressing member is in contact with the peripheral end portion of the wafer.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33051495A JPH09172052A (en) | 1995-12-19 | 1995-12-19 | Apparatus and method for transferring wafer |
| US08/711,002 US5743699A (en) | 1995-12-19 | 1996-09-11 | Apparatus and method for transferring wafers |
| TW085111467A TW434177B (en) | 1995-12-19 | 1996-09-19 | Apparatus and method for transferring wafers |
| KR1019960042830A KR100256568B1 (en) | 1995-12-19 | 1996-09-30 | Wafer conveying apparatus and its method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33051495A JPH09172052A (en) | 1995-12-19 | 1995-12-19 | Apparatus and method for transferring wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09172052A true JPH09172052A (en) | 1997-06-30 |
Family
ID=18233487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33051495A Withdrawn JPH09172052A (en) | 1995-12-19 | 1995-12-19 | Apparatus and method for transferring wafer |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5743699A (en) |
| JP (1) | JPH09172052A (en) |
| KR (1) | KR100256568B1 (en) |
| TW (1) | TW434177B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144038A (en) * | 1999-11-16 | 2001-05-25 | Tokyo Electron Ltd | Substrate treatment apparatus and substrate treatment method |
| JP2008282996A (en) * | 2007-05-10 | 2008-11-20 | Apprecia Manufacturing Inc | Apparatus and method of transferring workpiece between cassettes |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100230987B1 (en) * | 1996-10-04 | 1999-11-15 | 윤종용 | Wafer inspection system having optical character reader |
| JP3510463B2 (en) * | 1997-11-10 | 2004-03-29 | 東京エレクトロン株式会社 | Substrate alignment apparatus and alignment method |
| US6092981A (en) * | 1999-03-11 | 2000-07-25 | Applied Materials, Inc. | Modular substrate cassette |
| KR100673063B1 (en) * | 2000-01-18 | 2007-01-22 | 삼성전자주식회사 | Equipment for sealing a seal for a liquid crystal pannel |
| DE10017010C2 (en) * | 2000-04-05 | 2002-02-07 | Steag Micro Tech Gmbh | Process for loading and unloading a treatment basin |
| CN101830351B (en) * | 2010-05-10 | 2012-07-04 | 友达光电股份有限公司 | Clamping assembly, positioning equipment using same and method for moving object from positioning equipment |
| JP5574177B2 (en) * | 2010-09-16 | 2014-08-20 | 株式会社ダイフク | Transport device |
| CN104810313B (en) * | 2015-05-06 | 2017-06-27 | 常州银河电器有限公司 | Semiconductor component potting process week rotating tooling |
| EP3196614B1 (en) * | 2016-01-22 | 2023-07-12 | Excelitas Technologies Singapore Pte. Ltd. | Motion and presence detector |
| CN107658258B (en) * | 2016-07-25 | 2019-08-30 | 上海新昇半导体科技有限公司 | A kind of pick-and-place sheet devices of wafer holder |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719827B2 (en) * | 1985-12-23 | 1995-03-06 | 株式会社東芝 | Wafer transfer device |
| US5125784A (en) * | 1988-03-11 | 1992-06-30 | Tel Sagami Limited | Wafers transfer device |
| US4840530A (en) * | 1988-05-23 | 1989-06-20 | Nguyen Loc H | Transfer apparatus for semiconductor wafers |
| JPH01295435A (en) * | 1988-05-24 | 1989-11-29 | Hitachi Ltd | Wafer transfer apparatus |
| JPH0639802B2 (en) * | 1988-08-02 | 1994-05-25 | 鹿島建設株式会社 | Variable stiffness frame |
| US4902186A (en) * | 1988-12-09 | 1990-02-20 | Intelmatec Corporation | Disk guide for a disk handling system |
| JPH0370154A (en) * | 1989-08-09 | 1991-03-26 | Tokyo Erekutoron Yamanashi Kk | Transfer method |
| JPH03209845A (en) * | 1990-01-12 | 1991-09-12 | Hitachi Ltd | Pitch converter for wafer transfer device |
| JP2796169B2 (en) * | 1990-03-23 | 1998-09-10 | 株式会社タカトリハイテック | Wafer transfer equipment |
| JP2919054B2 (en) * | 1990-11-17 | 1999-07-12 | 東京エレクトロン株式会社 | Transfer device and transfer method |
| US5188499A (en) * | 1990-12-14 | 1993-02-23 | Mactronix | Method and apparatus for varying wafer spacing |
| US5299901A (en) * | 1992-04-16 | 1994-04-05 | Texas Instruments Incorporated | Wafer transfer machine |
-
1995
- 1995-12-19 JP JP33051495A patent/JPH09172052A/en not_active Withdrawn
-
1996
- 1996-09-11 US US08/711,002 patent/US5743699A/en not_active Expired - Fee Related
- 1996-09-19 TW TW085111467A patent/TW434177B/en not_active IP Right Cessation
- 1996-09-30 KR KR1019960042830A patent/KR100256568B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144038A (en) * | 1999-11-16 | 2001-05-25 | Tokyo Electron Ltd | Substrate treatment apparatus and substrate treatment method |
| JP2008282996A (en) * | 2007-05-10 | 2008-11-20 | Apprecia Manufacturing Inc | Apparatus and method of transferring workpiece between cassettes |
Also Published As
| Publication number | Publication date |
|---|---|
| US5743699A (en) | 1998-04-28 |
| TW434177B (en) | 2001-05-16 |
| KR100256568B1 (en) | 2000-05-15 |
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