JPH09162334A - Heat-radiator device of electronic component - Google Patents
Heat-radiator device of electronic componentInfo
- Publication number
- JPH09162334A JPH09162334A JP32053195A JP32053195A JPH09162334A JP H09162334 A JPH09162334 A JP H09162334A JP 32053195 A JP32053195 A JP 32053195A JP 32053195 A JP32053195 A JP 32053195A JP H09162334 A JPH09162334 A JP H09162334A
- Authority
- JP
- Japan
- Prior art keywords
- block
- heat transfer
- thin plate
- heat
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、例えばＩＣ、Ｌ
ＳＩ等の半導体電子部品で発生する熱を効率良く放熱し
て冷却を行う電子部品の放熱装置に関するものである。BACKGROUND OF THE INVENTION The present invention relates to, for example, IC, L
The present invention relates to a heat dissipation device for an electronic component that efficiently radiates heat generated by a semiconductor electronic component such as SI to cool the electronic component.
【０００２】[0002]
【従来の技術】図２３は例えば特公平３−３４２２７号
公報に示されるこの種の従来の電子部品の放熱装置の概
略構成を示す図である。図に示すように、従来の放熱装
置１は底板２およびフィン３によって構成され、例えば
アルミニウムのブロックに櫛状のフィンを形成すること
により一体に形成されており、底板２がプリント基板４
上に搭載された半導体等の電子部品５とアダプタ６を介
して接続されている。そして、稼働によって電子部品５
に発生した熱は、アダプタ６を介して接続された底板２
に伝えられ、フィン３から表面に送り込まれる空気中に
放熱される。2. Description of the Related Art FIG. 23 is a diagram showing a schematic configuration of a conventional heat dissipation device for electronic parts of this type, which is disclosed in, for example, Japanese Patent Publication No. 3-34227. As shown in the figure, the conventional heat dissipation device 1 is composed of a bottom plate 2 and fins 3 and is integrally formed by forming comb-shaped fins on, for example, an aluminum block.
It is connected to an electronic component 5 such as a semiconductor mounted on the top via an adapter 6. And the electronic parts 5 by the operation
The heat generated in the bottom plate 2 connected via the adapter 6
And is radiated to the air sent from the fins 3 to the surface.
【０００３】[0003]
【発明が解決しようとする課題】従来の放熱装置は以上
のように構成され、例えばアルミニウムのブロックに櫛
状の溝を加工して放熱面を形成するものであり、この溝
は機械加工あるいは引き抜き加工等の方法で構成され
る。又、この種放熱体の性能は放熱表面積の大きさによ
り決定されるが、上記のような加工方法でフィン３を薄
形化しフィンピッチを狭めて数を増加することにより表
面積を拡大し、放熱性能を向上させることには限界があ
る。したがって、発熱量の多いＩＣ、ＬＳＩ等の半導体
の冷却を行う場合には、放熱体のサイズを大きくして表
面積を拡大させることが必要となり、半導体の設置スペ
ースを上回る放熱体の設置スペースが必要になるという
問題点があった。The conventional heat radiating device is constructed as described above, and for example, a comb-shaped groove is formed in an aluminum block to form a heat radiating surface. This groove is machined or drawn. It is composed of methods such as processing. The performance of this type of heat radiator is determined by the size of the heat radiation surface area, but the surface area is expanded by thinning the fins 3 and narrowing the fin pitch to increase the number of heat radiation surfaces by the above-described processing method. There are limits to improving performance. Therefore, when cooling semiconductors such as ICs and LSIs that generate a large amount of heat, it is necessary to increase the size of the radiator to increase the surface area, and a space for installing the radiator that exceeds the installation space for the semiconductor is required. There was a problem that became.
【０００４】この発明は上記のような問題点を解消する
ためになされたもので、放熱体の設置スペースを拡大す
ることなく冷却効果を向上させることが可能な電子部品
の放熱装置を提供することを目的とするものである。The present invention has been made to solve the above problems, and provides a heat dissipation device for electronic parts capable of improving the cooling effect without expanding the installation space of the heat dissipation body. The purpose is.
【０００５】[0005]
【課題を解決するための手段】この発明の請求項１に係
る電子部品の放熱装置は、電子部品と熱的に接触する平
板状ブロックと、互いに所定の間隔を介して配設されそ
れぞれ対応する位置に円筒状突起が複数形成された複数
の薄板状フィンと、薄板状フィンの円筒状突起の内部を
それぞれ貫通して上記平板状ブロックに立設され拡管に
より円筒状突起の内部に当接された複数の伝熱パイプと
を備えたものである。According to another aspect of the present invention, there is provided a heat dissipating device for an electronic component, which is provided with a flat plate block which is in thermal contact with the electronic component and which is disposed at a predetermined distance from each other. A plurality of thin plate fins having a plurality of cylindrical protrusions formed at the positions, and the thin plate fins, each of which penetrates the inside of the cylindrical protrusion, is erected on the flat plate block, and is abutted to the inside of the cylindrical protrusion by the pipe expansion. And a plurality of heat transfer pipes.
【０００６】又、この発明の請求項２に係る電子部品の
放熱装置は、内部に中空部が形成され電子部品と熱的に
接触する平板状ブロックと、互いに所定の間隔を介して
配設され円筒状突起が複数形成された複数の薄板状フィ
ンと、薄板状フィンの円筒状突起の内部を貫通するとと
もに平板状ブロックの中空部と連通して上記平板状ブロ
ックに立設され拡管により円筒状突起の内部に当接され
真空封止された複数の伝熱パイプと、平板状ブロックの
中空部に封入された作動液とを備えたものである。According to a second aspect of the present invention, there is provided a heat dissipating device for electronic parts, which is provided with a flat block having a hollow portion formed therein, which is in thermal contact with the electronic part, and a predetermined space therebetween. A plurality of thin plate fins having a plurality of cylindrical projections, and penetrating the inside of the cylindrical projections of the thin plate fins and communicating with the hollow portion of the flat plate block. It is provided with a plurality of heat transfer pipes that are in contact with the inside of the protrusions and are vacuum-sealed, and a working liquid sealed in the hollow portion of the flat block.
【０００７】又、この発明の請求項３に係る電子部品の
放熱装置は、所定の大きさの複数の貫通穴が形成され電
子部品と熱的に接触する平板状ブロックと、互いに所定
の間隔を介して配設されそれぞれ平板状ブロックの貫通
穴と対応する位置に円筒状突起が形成された複数の薄板
状フィンと、平板状ブロックの貫通穴および各薄板状フ
ィンの円筒状突起の内部をそれぞれ貫通して配設され拡
管により貫通穴および円筒状突起の内部に当接された複
数の伝熱パイプとを備えたものである。According to a third aspect of the present invention, there is provided a heat dissipating device for electronic parts, wherein a plurality of through holes having a predetermined size are formed and a flat plate-shaped block which is in thermal contact with the electronic part is arranged at a predetermined distance from each other. A plurality of thin plate fins each having a cylindrical projection formed at a position corresponding to the through hole of the flat plate block, and the insides of the through holes of the flat plate block and the cylindrical projections of each thin plate fin. It is provided with a plurality of heat transfer pipes which are arranged so as to penetrate therethrough and which are brought into contact with the inside of the through holes and the cylindrical projections by expanding.
【０００８】又、この発明の請求項４に係る電子部品の
放熱装置は、それぞれ所定の貫通穴が形成された複数の
突出部を有し電子部品と熱的に接触する平板状ブロック
と、互いに所定の間隔を介して配設されそれぞれ平板状
ブロックの貫通穴と対応する位置に円筒状突起が形成さ
れた複数の薄板状フィンと、平板状ブロックの貫通穴お
よび各薄板状フィンの円筒状突起の内部をそれぞれ貫通
して配設され拡管により貫通穴および円筒状突起の内部
に当接された複数の伝熱パイプとを備えたものである。According to a fourth aspect of the present invention, there is provided a heat dissipation device for electronic parts, which has a plurality of projecting portions each having a predetermined through hole, and a flat plate-shaped block which is in thermal contact with the electronic parts. A plurality of thin plate fins having cylindrical projections formed at positions corresponding to the through holes of the flat block arranged at predetermined intervals, and the through holes of the flat block and the cylindrical projections of each thin plate fin. And a plurality of heat transfer pipes, which are disposed so as to penetrate through the inside of each of the above and abut on the inside of the through holes and the cylindrical protrusions by expanding the pipes.
【０００９】又、この発明の請求項５に係る電子部品の
放熱装置は、請求項１、３、４のいずれかにおいて、伝
熱パイプの内部に熱伝導性材料でなる部材を充填させた
ものである。According to a fifth aspect of the present invention, there is provided a heat dissipation device for electronic parts according to any one of the first to third aspects, wherein the heat transfer pipe is filled with a member made of a heat conductive material. Is.
【００１０】又、この発明の請求項６に係る電子部品の
放熱装置は、請求項５において、拡管のための拡管ピン
を部材としたものである。According to a sixth aspect of the present invention, there is provided a heat dissipation device for an electronic component according to the fifth aspect, wherein a pipe expanding pin for pipe expansion is used as a member.
【００１１】又、この発明の請求項７に係る電子部品の
放熱装置は、請求項１、３、４のいずれかにおいて、伝
熱パイプは真空封止をして作動液を封入するようにした
ものである。According to a seventh aspect of the present invention, there is provided a heat dissipation device for electronic parts according to any one of the first to third aspects, wherein the heat transfer pipe is vacuum-sealed so as to enclose the working fluid. It is a thing.
【００１２】又、この発明の請求項８に係る電子部品の
放熱装置は、請求項１、２、３、４のいずれかにおい
て、伝熱パイプとフィンとの当接部に熱伝導性部材でな
る部材を介装させたものである。According to an eighth aspect of the present invention, there is provided a heat dissipation device for electronic parts according to any one of the first, second, third, and fourth aspects, in which a contact portion between the heat transfer pipe and the fin is provided with a heat conductive member. It is the one in which the member
【００１３】又、この発明の請求項９に係る電子部品の
放熱装置は、電子部品と熱的に接触する平板状ブロック
と、互いに所定の間隔を介して配設され円筒状突起が複
数形成された複数の薄板状フィンと、平板状ブロックに
立設され薄板状フィンの円筒状突起の内部を押し込みに
より貫通して固定される複数の伝達パイプとを備えたも
のである。According to a ninth aspect of the present invention, there is provided a heat dissipating device for electronic parts, wherein a flat plate block which is in thermal contact with the electronic part and a plurality of cylindrical projections which are arranged at a predetermined interval from each other are formed. In addition, a plurality of thin plate fins and a plurality of transmission pipes that are erected on the flat plate block and are fixed by penetrating and fixing the inside of the cylindrical protrusions of the thin plate fins.
【００１４】又、この発明の請求項１０に係る電子部品
の放熱装置は、所定の大きさの複数の貫通穴が形成され
電子部品と熱的に接触する平板状ブロックと、互いに所
定の間隔を介して配設されそれぞれ平板状ブロックの貫
通穴と対応する位置に円筒状突起が形成された複数の薄
板状フィンと、平板状ブロックの貫通穴および各薄板状
フィンの円筒状突起の内部をそれぞれ押し込みにより貫
通して固定される複数の伝熱パイプとを備えたものであ
る。According to a tenth aspect of the present invention, there is provided a heat dissipating device for electronic parts, wherein a plurality of through holes having a predetermined size are formed and a flat plate-shaped block which is in thermal contact with the electronic part is arranged at a predetermined distance from each other. A plurality of thin plate fins each having a cylindrical projection formed at a position corresponding to the through hole of the flat plate block, and the insides of the through holes of the flat plate block and the cylindrical projections of each thin plate fin. It is provided with a plurality of heat transfer pipes that penetrate and are fixed by being pushed.
【００１５】又、この発明の請求項１１に係る電子部品
の放熱装置は、それぞれ所定の大きさの貫通穴が形成さ
れた複数の突出部を有し電子部品と熱的に接触する平板
状ブロックと、互いに所定の間隔を介して配設されそれ
ぞれ平板状ブロックの貫通穴と対応する位置に円筒状突
起が形成された複数の薄板状フィンと、平板状ブロック
の貫通穴および各薄板状フィンの円筒状突起の内部をそ
れぞれ押し込みにより貫通して固定される複数の伝熱パ
イプとを備えたものである。According to an eleventh aspect of the present invention, there is provided a heat dissipating device for electronic parts, which has a plurality of projecting portions each having a through hole of a predetermined size and which is in a flat plate-like block which is in thermal contact with the electronic part. A plurality of thin plate fins having cylindrical projections formed at positions corresponding to the through holes of the flat plate block, which are arranged at predetermined intervals, and the through holes of the flat plate block and the thin plate fins. And a plurality of heat transfer pipes that are fixed by penetrating the inside of each cylindrical protrusion.
【００１６】[0016]
実施の形態１．以下、この発明の実施の形態を図に基づ
いて説明する。図１はこの発明の実施の形態１における
電子部品の放熱装置の構成を示す平面図、図２は図１に
おける線ＩＩ−ＩＩに沿う断面を示す側断面図、図３は
図１における電子部品の放熱装置の製造途中における図
２に相当する断面を示す側断面図である。Embodiment 1 FIG. Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view showing the configuration of a heat dissipation device for electronic parts according to Embodiment 1 of the present invention, FIG. 2 is a side sectional view showing a section taken along line II-II in FIG. 1, and FIG. 3 is an electronic part shown in FIG. FIG. 3 is a side sectional view showing a section corresponding to FIG. 2 during manufacturing of the heat dissipation device.
【００１７】図において、７は被冷却物としての例えば
ＩＣ、ＬＳＩ等の半導体電子部品（図示せず）の一側面
に、熱的に接触して配置される平板状ブロックで、例え
ばアルミニウム、銅等のように熱伝導性の良い部材で形
成されている。８は例えばアルミニウム等の薄板で形成
された複数の薄板状フィンで、平板状ブロックの他側面
と平行に且つお互いに所定の間隔を介して配設され、そ
れぞれ対応する位置に円筒状突起８ａが形成されてい
る。In the figure, reference numeral 7 denotes a flat plate-like block which is arranged in thermal contact with one side surface of a semiconductor electronic component (not shown) such as IC or LSI as an object to be cooled, for example, aluminum or copper. It is formed of a member having good thermal conductivity such as. Reference numeral 8 denotes a plurality of thin plate fins formed of, for example, a thin plate of aluminum or the like, which are arranged parallel to the other side surface of the flat plate block and at a predetermined interval from each other, and cylindrical protrusions 8a are provided at corresponding positions. Has been formed.
【００１８】９は図３に示すように各薄板状フィンの円
筒状突起８ａの内部をそれぞれ貫通し、一端が例えばロ
ウ付け、ハンダ付け等により平板状ブロックの他側面に
立設される複数の伝熱パイプで、平板状ブロック７と同
様に熱伝導性の良い部材で形成されている。そして、こ
れらの伝熱パイプ９は拡管装置（図示せず）により内部
が拡管され、図２に示すように外周が薄板状フィン８の
各円筒状突起８ａの内部にそれぞれ当接し固定される。As shown in FIG. 3, each of the plurality of thin plate fins 9 penetrates the inside of the cylindrical protrusion 8a, and one end thereof is erected on the other side surface of the flat plate block by, for example, brazing or soldering. The heat transfer pipe is made of a material having a good thermal conductivity like the flat block 7. Then, the inside of these heat transfer pipes 9 is expanded by a pipe expanding device (not shown), and the outer periphery of the heat transfer pipes 9 is abutted and fixed to the inside of each cylindrical projection 8a of the thin plate fin 8 as shown in FIG.
【００１９】上記のように構成された実施の形態１にお
ける放熱装置においては、電子部品で発生した熱は平板
状ブロック７から伝熱パイプ９に伝わり、さらに伝熱パ
イプ９から各円筒状突起８ａを経由して薄板状フィン８
へと伝導され、薄板状フィン８へ送風される周囲の空気
に放熱され、この動作が繰り返されることにより電子部
品は冷却される。In the heat dissipation device of the first embodiment configured as described above, the heat generated in the electronic component is transferred from the flat block 7 to the heat transfer pipe 9, and further from the heat transfer pipe 9 to each cylindrical projection 8a. Thin plate fin 8 via
To the surrounding air blown to the thin plate-shaped fins 8, and the electronic components are cooled by repeating this operation.
【００２０】このように上記実施の形態１によれば、伝
熱パイプ９を介して積層された薄板状フィン８により放
熱するようにしているので、薄形化が可能となり、設置
スペースを拡大することなく表面積を増大し冷却効果を
向上させることが容易となる。As described above, according to the first embodiment, since heat is radiated by the thin plate-shaped fins 8 laminated via the heat transfer pipe 9, it is possible to reduce the thickness and expand the installation space. It becomes easy to increase the surface area and improve the cooling effect without the need.
【００２１】実施の形態２．図４はこの発明の実施の形
態２における電子部品の放熱装置の構成を示す側断面図
である。図において、上記実施の形態１における図２に
示すものと同様な部分は同一符号を付して説明を省略す
る。１０は伝熱パイプ９の内部に充填される部材で、例
えばハンダ等の溶融金属あるいは伝熱セメント等の熱伝
導性材料が適用される。Embodiment 2 FIG. 4 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a second embodiment of the present invention. In the figure, the same parts as those shown in FIG. 2 in the above-described first embodiment are designated by the same reference numerals and the description thereof will be omitted. Reference numeral 10 denotes a member filled inside the heat transfer pipe 9, and for example, a molten metal such as solder or a heat conductive material such as heat transfer cement is applied.
【００２２】このように上記実施の形態２によれば、熱
伝導性材料でなる部材１０が充填された伝熱パイプ９を
介して、積層された薄板状フィン８により放熱するよう
にしているので、薄形化が可能であることは勿論のこ
と、伝熱パイプ９の熱伝導性が向上し上部側の薄板状フ
ィン８からの放熱量を増加させることができ、冷却効果
をさらに向上させることが容易となる。As described above, according to the second embodiment, heat is radiated by the laminated thin plate fins 8 via the heat transfer pipe 9 filled with the member 10 made of a heat conductive material. Of course, it is possible to reduce the thickness, and the heat conductivity of the heat transfer pipe 9 is improved so that the amount of heat radiated from the thin plate-shaped fin 8 on the upper side can be increased and the cooling effect can be further improved. Will be easier.
【００２３】実施の形態３．図５はこの発明の実施の形
態３における電子部品の放熱装置の構成を示す側断面
図、図６は図５における電子部品の放熱装置の製造工程
を示す断面図である。図において、上記各実施の形態に
おけるものと同様な部分は同一符号を付して説明を省略
する。Embodiment 3 FIG. 5 is a side sectional view showing a structure of a heat dissipation device for an electronic component according to a third embodiment of the present invention, and FIG. 6 is a cross sectional view showing a manufacturing process of the heat dissipation device for an electronic component shown in FIG. In the figure, the same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof will be omitted.
【００２４】尚、上記実施の形態２では、伝熱パイプ９
の内部を拡大させて薄板状フィン８との接合を行い、伝
熱パイプ９の内部に熱伝導性部材でなる部材を充填させ
る場合について説明したが、本実施の形態３では図６に
示すように熱伝導性材料で拡管ピン１１を形成し、この
拡管ピン１１を伝熱パイプ９の内部に押し込んで拡管を
行うことにより薄板状フィン８との接合を行い、図５に
示すように拡管ピン１１を伝熱パイプ９内にそのまま残
留させるようにしたものである。In the second embodiment, the heat transfer pipe 9
The case where the inside of the heat transfer pipe 9 is enlarged and joined to the thin plate fins 8 and the inside of the heat transfer pipe 9 is filled with a member made of a heat conductive member has been described, but in the third embodiment, as shown in FIG. The heat-conducting material is used to form the tube-expanding pin 11, and the tube-expanding pin 11 is pushed into the heat transfer pipe 9 to expand the tube, thereby joining the thin plate-shaped fins 8 to each other, and as shown in FIG. 11 is made to remain in the heat transfer pipe 9 as it is.
【００２５】このように上記実施の形態３によれば、熱
伝導性材料でなる拡管ピン１１を伝熱パイプ９の内部に
押し込んで拡管を行い、拡管ピン１１をそのまま内部に
残留させるようにしているので、拡管ピン１１の熱伝導
性により、上記実施の形態２と同様に伝熱パイプ９の熱
伝導性が向上し、上部側の薄板状フィン８からの放熱量
を増加させることができるのは勿論のこと、拡管工程と
熱伝導性部材の充填工程とを同時に行うことができ、作
業工程の削減が可能になる。As described above, according to the third embodiment, the pipe expanding pin 11 made of a heat conductive material is pushed into the heat transfer pipe 9 to expand the pipe, and the pipe expanding pin 11 is left inside as it is. Therefore, the thermal conductivity of the pipe expanding pin 11 improves the thermal conductivity of the heat transfer pipe 9 as in the second embodiment, and the amount of heat radiated from the thin plate-shaped fin 8 on the upper side can be increased. Needless to say, the pipe expanding step and the heat conductive member filling step can be performed at the same time, and the work steps can be reduced.
【００２６】実施の形態４．図７はこの発明の実施の形
態４における電子部品の放熱装置の構成を示す側断面図
である。図において、上記各実施の形態におけるものと
同様な部分は同一符号を付して説明を省略する。１２は
拡管後の伝熱パイプ９の上端を閉塞する閉塞板、１３は
この閉塞板１２を貫通して設けられるチップ管、１４は
このチップ管１３を介して伝熱パイプ９内を排気した
後、内部に充填される作動液で、この作動液が充填され
るとチップ管１３の先端は封止される。Embodiment 4 7 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a fourth embodiment of the present invention. In the figure, the same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof will be omitted. Reference numeral 12 is a closing plate that closes the upper end of the heat transfer pipe 9 after pipe expansion, 13 is a chip tube that penetrates through the closing plate 12, and 14 is after exhausting the heat transfer pipe 9 through the chip tube 13. With the working fluid filled inside, the tip of the tip tube 13 is sealed.
【００２７】上記のように構成された実施の形態４にお
ける放熱装置においては、電子部品で発生した熱により
平板状ブロック７が加熱されると、伝熱パイプ９内の下
部に停留している作動液１４が加熱され、蒸発して蒸気
１４ａとなり伝熱パイプ９内の低温側、すなわち上方に
移動する。そして、ここで薄板状フィン８により周囲空
気で冷却されると、蒸気１４ａは凝縮液化して液体１４
ｂとなり下部に戻る。以下、このような動作を繰り返し
ながら、電子部品で発生した熱は平板状ブロック７、作
動液１４を介して薄板状フィン８から周囲空気中に放出
されて、電子部品は冷却される。In the heat dissipation device of the fourth embodiment configured as described above, when the flat block 7 is heated by the heat generated by the electronic component, the operation is stopped at the lower part of the heat transfer pipe 9. The liquid 14 is heated and evaporated to become vapor 14a, which moves to the low temperature side in the heat transfer pipe 9, that is, upward. When the thin plate-shaped fins 8 cool the ambient air, the vapor 14a is condensed and liquefied.
It becomes b and returns to the bottom. Hereinafter, while repeating such operations, the heat generated in the electronic component is released from the thin plate fin 8 into the ambient air through the flat block 7 and the hydraulic fluid 14, and the electronic component is cooled.
【００２８】このように上記実施の形態４によれば伝熱
パイプ９の熱伝導だけでなく伝熱パイプ９内に充填され
た作動液１４の蒸発、凝縮作用を利用して伝熱を行うよ
うにしているので、伝熱パイプ９の軸方向全域にわたっ
て一様な伝熱を行うことができ、周囲空気への放熱の効
率向上が可能となり、特に伝熱パイプ９の高さが大の場
合に効果が増大される。As described above, according to the fourth embodiment, not only the heat conduction of the heat transfer pipe 9 but also the vaporization and condensation of the working fluid 14 filled in the heat transfer pipe 9 are used to perform the heat transfer. Therefore, uniform heat transfer can be performed over the entire area of the heat transfer pipe 9 in the axial direction, and the efficiency of heat radiation to the ambient air can be improved. Particularly, when the height of the heat transfer pipe 9 is large. The effect is increased.
【００２９】実施の形態５．図８はこの発明の実施の形
態５における電子部品の放熱装置の構成を示す側断面
図、図９は図８における電子部品の放熱装置の製造工程
を示す断面図である。図において、上記各実施の形態に
おけるものと同様な部分は同一符号を付して説明を省略
する。１５は内部に中空部１５ａが形成された平板状ブ
ロックであり、各伝熱パイプ９は図９に示すように内部
が中空部１５ａと連通するように立設され、その後、図
８に示すように拡管により薄板状フィン８との接合が行
われる。そして、チップ管１３を介して中空部１５ａお
よび伝熱パイプ９の内部を排気し、中空部１５ａ内に作
動液１４が充填されるとチップ管１３の先端は封止され
る。Embodiment 5 8 is a side sectional view showing a structure of a heat dissipation device for an electronic component according to a fifth embodiment of the present invention, and FIG. 9 is a cross sectional view showing a manufacturing process of the heat dissipation device for an electronic component shown in FIG. In the figure, the same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof will be omitted. Reference numeral 15 denotes a flat plate-shaped block having a hollow portion 15a formed therein. Each heat transfer pipe 9 is erected so that the inside communicates with the hollow portion 15a as shown in FIG. 9, and then as shown in FIG. Then, the tube-shaped fins 8 are joined to each other by expanding the pipe. Then, when the inside of the hollow portion 15a and the heat transfer pipe 9 is exhausted through the tip tube 13 and the working liquid 14 is filled in the hollow portion 15a, the tip of the tip tube 13 is sealed.
【００３０】尚、平板状ブロック１５の中空部１５ａ内
に充填された作動液１４の動作については上記実施の形
態４の場合と同様なので説明を省略するが、上記実施の
形態５によれば、作動液１４を平板状ブロック１５の中
空部１５ａ内に充填するようにしているので、伝熱パイ
プ９の内部は全て蒸気１４ａの凝縮部となり、伝熱パイ
プの長さに関係なく全ての薄板状フィン８との間で一様
な放熱ができるため、より一層周囲空気への放熱の効率
の向上を図ることが可能になる。The operation of the hydraulic fluid 14 filled in the hollow portion 15a of the flat block 15 is the same as in the case of the above-mentioned fourth embodiment, and therefore its explanation is omitted. However, according to the fifth embodiment, Since the working fluid 14 is filled in the hollow portion 15a of the flat plate-shaped block 15, the inside of the heat transfer pipe 9 serves as a condensing part for the steam 14a, so that all the thin plate shapes are formed regardless of the length of the heat transfer pipe. Since the heat can be uniformly radiated to the fins 8, the efficiency of heat radiation to the ambient air can be further improved.
【００３１】実施の形態６．図１０はこの発明の実施の
形態６における電子部品の放熱装置の構成を示す側断面
図、図１１は図１０における電子部品の放熱装置の製造
工程を示す断面図である。図において、上記各実施の形
態におけるものと同様な部分は同一符号を付して説明を
省略する。１６は伝熱パイプ９を挿入するための貫通穴
１６ａが設けられた平板状ブロックである。Embodiment 6 FIG. 10 is a side sectional view showing a structure of a heat dissipation device for an electronic component according to a sixth embodiment of the present invention, and FIG. 11 is a cross sectional view showing a manufacturing process of the heat dissipation device for an electronic component shown in FIG. In the figure, the same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof will be omitted. Reference numeral 16 is a plate-shaped block provided with a through hole 16a for inserting the heat transfer pipe 9.
【００３２】このように上記実施の形態６によれば、上
記各実施の形態では伝熱パイプを平板状ブロック上に立
設して接合するようにしているのに対して、平板状ブロ
ック１６に設けられた貫通穴１６ａ内に伝熱パイプ９を
挿入し、拡管により薄板状フィン８および平板状ブロッ
ク１６との接合を同時に行うようにしているので、接合
作業が容易となり製作コストの低減が可能になる。As described above, according to the sixth embodiment, the heat transfer pipe is erected on and joined to the flat block in each of the above embodiments, whereas the heat transfer pipe is joined to the flat block 16 according to the sixth embodiment. The heat transfer pipe 9 is inserted into the provided through hole 16a, and the thin plate fin 8 and the flat plate block 16 are joined at the same time by expanding the pipe, so that the joining work is facilitated and the manufacturing cost can be reduced. become.
【００３３】実施の形態７．本実施の形態７は、図１２
に示すように上記実施の形態６における伝熱パイプ９の
内部に、上記実施の形態２の場合と同様に、例えばハン
ダ等の溶融金属あるいは伝熱セメント等の熱伝導性材料
でなる部材１７を充填させたものであり、部材１７によ
り伝熱パイプ９の熱伝導性が向上するため、放熱効率を
高め冷却効果をさらに向上させることができる。Embodiment 7 The seventh embodiment is shown in FIG.
As in the case of the second embodiment, a member 17 made of a molten metal such as solder or a heat conductive material such as heat transfer cement is provided inside the heat transfer pipe 9 in the sixth embodiment as shown in FIG. Since the member 17 improves the thermal conductivity of the heat transfer pipe 9, the heat dissipation efficiency can be improved and the cooling effect can be further improved.
【００３４】実施の形態８．尚、上記実施の形態７で
は、図１２に示すように拡管された伝熱パイプ９内に熱
伝導性材料でなる部材１７を充填するようにしている
が、上記実施の形態３の場合と同様、図１４に示すよう
に熱伝導性材料で拡管ピン１８を形成し、この拡管ピン
１８を伝熱パイプ９の内部に押し込んで拡管を行うこと
により、薄板状フィン８および平板状ブロック１６との
接合を行い、拡管ピン１８を伝熱パイプ９の内部にその
まま残留させて図１３に示すような構成としても良く、
上記実施の形態７の場合と同様の効果を発揮し得ること
は勿論のこと、拡管と充填の作業が同時にできるので作
業性の向上が可能となる。Embodiment 8 FIG. In the seventh embodiment, as shown in FIG. 12, the expanded heat transfer pipe 9 is filled with the member 17 made of a heat conductive material, but the same as in the third embodiment. As shown in FIG. 14, the pipe expanding pin 18 is formed of a heat conductive material, and the pipe expanding pin 18 is pushed into the heat transfer pipe 9 to expand the pipe. The structure may be such that the expansion pin 18 is left as it is inside the heat transfer pipe 9 by joining and the structure as shown in FIG.
Of course, the same effects as in the case of the above-described seventh embodiment can be exhibited, and since the work of expanding the pipe and the work of filling can be performed at the same time, the workability can be improved.
【００３５】実施の形態９．図１５はこの発明の実施の
形態９における電子部品の放熱装置の構成を示す側断面
図である。図において、上記各実施の形態におけるもの
と同様の部分は同一符号を付して説明を省略する。１９
は伝熱パイプ９の下部を閉塞する栓である。Ninth Embodiment 15 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a ninth embodiment of the present invention. In the figure, the same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof is omitted. 19
Is a plug that closes the lower part of the heat transfer pipe 9.
【００３６】実施の形態９によれば、上記実施の形態６
で得られる放熱装置の伝熱パイプ９の下部を栓１９で閉
塞するとともに、上記各実施の形態４、５と同様に伝熱
パイプ９の上部を閉塞板１２で閉塞し、この閉塞板１２
を貫通して設けられるチップ管１３を介して伝熱パイプ
９内を排気した後、作業液を充填してチップ管１３の先
端を封止し、作動液１４の蒸発、凝縮の繰り返しによ
り、電子部品で発生した熱を薄板状フィン８を介して周
囲空気へ放熱するようにしているので、上記各実施の形
態６、７、８の場合と同様に作業性の向上を図ることが
可能であることは勿論のこと、放熱効率を上げて冷却効
果の向上を図ることができる。According to the ninth embodiment, the sixth embodiment is described.
The lower part of the heat transfer pipe 9 of the heat dissipation device obtained in step 1 is closed by the plug 19, and the upper part of the heat transfer pipe 9 is closed by the closing plate 12 as in the above fourth and fifth embodiments.
After exhausting the inside of the heat transfer pipe 9 through a tip tube 13 that penetrates through, the tip of the tip tube 13 is sealed by filling with a working liquid, and the evaporation and condensation of the working liquid 14 are repeated to generate electrons. Since the heat generated in the components is radiated to the ambient air through the thin plate-shaped fins 8, it is possible to improve the workability as in the case of each of the sixth, seventh and eighth embodiments. Of course, it is possible to improve the heat dissipation efficiency and the cooling effect.
【００３７】実施の形態１０．図１６はこの発明の実施
の形態１０における電子部品の放熱装置の構成を示す側
断面図、図１７は図１６における電子部品の放熱装置の
製造工程を示す断面図である。図において、上記各実施
の形態におけるものと同様な部分は同一符号を付して説
明を省略する。２０は伝熱パイプ９が配設される位置
に、伝熱パイプ９が貫通可能な円筒状突起２０ａが形成
される平板状ブロックである。Embodiment 10 FIG. 16 is a side sectional view showing a structure of a heat dissipation device for an electronic component according to a tenth embodiment of the present invention, and FIG. 17 is a cross sectional view showing a manufacturing process of the heat dissipation device for an electronic component shown in FIG. In the figure, the same parts as those in the above-mentioned respective embodiments are designated by the same reference numerals, and the description thereof will be omitted. Reference numeral 20 is a flat plate-shaped block in which a cylindrical protrusion 20a through which the heat transfer pipe 9 can pass is formed at a position where the heat transfer pipe 9 is arranged.
【００３８】実施の形態１０によれば、図１７に示すよ
うに各伝熱パイプ９の下部を平板状ブロック２０の円筒
状突起２０ａ内に挿入した後、図１６に示すように拡管
により薄板状フィン８および平板状ブロック２０の円筒
状突起２０ａとの間の接合を行っているので、円筒状突
起２０ａにより接合作業が容易になるとともに、平板状
ブロック２０の薄形化が可能となり装置としての軽量化
を達成することができる。According to the tenth embodiment, as shown in FIG. 17, the lower portion of each heat transfer pipe 9 is inserted into the cylindrical protrusion 20a of the flat block 20 and then expanded into a thin plate shape as shown in FIG. Since the fins 8 and the cylindrical projections 20a of the flat block 20 are joined together, the cylindrical projections 20a facilitate the joining work, and the flat block 20 can be made thinner, and the device can be used as a device. Weight reduction can be achieved.
【００３９】実施の形態１１．本実施の形態１１は、図
１８に示すように上記実施の形態１０における伝熱パイ
プ９の内部に、上記実施の形態２の場合と同様に、例え
ばハンダ等の溶融金属あるいは伝熱セメント等の熱伝導
性材料でなる部材２１を充填させたものであり、部材２
１により伝熱パイプ９の熱伝導性が向上するため、放熱
効率を高め冷却効果をさらに向上させることができる。Eleventh Embodiment In the eleventh embodiment, as shown in FIG. 18, inside the heat transfer pipe 9 in the tenth embodiment, as in the case of the second embodiment, for example, molten metal such as solder or heat transfer cement or the like is used. The member 21 made of a heat conductive material is filled, and the member 2
1, the heat conductivity of the heat transfer pipe 9 is improved, so that the heat dissipation efficiency can be improved and the cooling effect can be further improved.
【００４０】実施の形態１２．本実施の形態１２は、図
２０に示すように熱伝導性材料で拡管ピン２２を形成
し、この拡管ピン２２を伝熱パイプ９の内部に押し込ん
で拡管を行うことにより、平板状ブロック２０の円筒状
突起２０ａおよび薄板状フィン８との接合を行い、図１
９に示すように拡管ピン２２を伝熱パイプ９の内部にそ
のまま残留させるような構成としても良く、上記実施の
形態１１の場合と同様の効果を発揮し得ることは勿論の
こと、拡管および充填作業が同時にできるので作業性の
向上を図ることが可能になる。Twelfth Embodiment In the twelfth embodiment, as shown in FIG. 20, a tube expansion pin 22 is formed of a heat conductive material, and the tube expansion pin 22 is pushed into the heat transfer pipe 9 to expand the tube. The cylindrical projection 20a and the thin plate-shaped fin 8 are joined together, and
As shown in FIG. 9, the pipe expanding pin 22 may be left inside the heat transfer pipe 9 as it is, and the same effects as in the case of the eleventh embodiment can be obtained, and the pipe expanding and filling can be performed. Since work can be performed at the same time, workability can be improved.
【００４１】実施の形態１３．本実施の形態１３は、図
２１に示すように上記実施の形態１０で得られる放熱装
置の伝熱パイプ９の下部を栓１９で閉塞するとともに、
伝熱パイプ９の上部を閉塞板１２で閉塞し、この閉塞板
１２を貫通して設けられるチップ管１３を介して伝熱パ
イプ９内を排気した後、作業液を充填してチップ管１３
の先端を封止し、作業液１４の蒸発、凝縮の繰り返しに
より、電子部品で発生した熱を薄板状フィン８を介して
周囲空気へ放熱するようにしているので、上記実施の形
態１０の場合と同様に作業性の向上を図ることが可能で
あることは勿論のこと、放熱効率を上げて冷却効果の向
上を図ることができる。Thirteenth Embodiment In the thirteenth embodiment, as shown in FIG. 21, the lower portion of the heat transfer pipe 9 of the heat dissipation device obtained in the tenth embodiment is closed with a plug 19, and
The upper portion of the heat transfer pipe 9 is closed by a closing plate 12, and the inside of the heat transfer pipe 9 is evacuated through a tip pipe 13 that penetrates through the closing plate 12, and then a working liquid is charged to fill the tip pipe 13.
In the case of the tenth embodiment, the heat generated in the electronic component is radiated to the ambient air through the thin plate fins 8 by sealing the tip of each of the working liquids 14 and repeating evaporation and condensation of the working liquid 14. The workability can be improved similarly to the above, and the heat dissipation efficiency can be improved to improve the cooling effect.
【００４２】実施の形態１４．本実施の形態１４は、例
えば図２２に示すように上記実施の形態１における拡管
を行う前の状態の伝熱パイプ９の外周面と薄板状フィン
８の円筒状突起８ａの内周面との間に、例えば熱伝導性
材料でなるハンダ等の溶融金属、すなわち部材２３を流
し込み、凝固させることにより、伝熱パイプ９と薄板状
フィン８の円筒状突起８ａとの間を固定させる構造とし
ても良く、放熱効率を上げて冷却効果の向上を図ること
ができることは勿論のこと、拡管が不要となるため拡管
装置が必要なくなる。Fourteenth Embodiment In the fourteenth embodiment, for example, as shown in FIG. 22, the outer peripheral surface of the heat transfer pipe 9 and the inner peripheral surface of the cylindrical protrusion 8a of the thin plate fin 8 are in a state before the pipe expansion in the first embodiment. For example, a molten metal such as solder made of a heat conductive material, that is, the member 23 is poured into the space and solidified to fix the space between the heat transfer pipe 9 and the cylindrical projection 8a of the thin plate fin 8. It goes without saying that the heat dissipation efficiency can be increased and the cooling effect can be improved. In addition, since the pipe expansion is unnecessary, the pipe expansion device is not required.
【００４３】実施の形態１５．尚、上記各実施の形態１
ないし１３では、伝熱パイプ９を拡管させることにより
薄板状フィン８との間の接合を行う場合について説明し
たが、伝熱パイプ９の外径を薄板状フィン８の円筒状突
起８ａの内径より若干大きな径とし、伝熱パイプ９を円
筒状突起８ａ内に押し込むようにして接合を行うように
しても良く、上記実施の形態１４の場合と同様の効果を
発揮することができる。Fifteenth Embodiment Incidentally, each of the above-mentioned first embodiment
Although the case where the heat transfer pipe 9 is joined to the thin plate fins 8 by expanding the heat transfer pipe 9 has been described, the outer diameter of the heat transfer pipe 9 is larger than the inner diameter of the cylindrical protrusion 8a of the thin plate fins 8. The diameter may be set to be slightly larger and the heat transfer pipe 9 may be pushed into the cylindrical projection 8a to perform the joining, and the same effect as in the case of the fourteenth embodiment can be exhibited.
【００４４】[0044]
【発明の効果】以上のように、この発明の請求項１によ
れば、電子部品と熱的に接触する平板状ブロックと、互
いに所定の間隔を介して配設されそれぞれ対応する位置
に円筒状突起が複数形成された複数の薄板状フィンと、
薄板状フィンの円筒状突起の内部をそれぞれ貫通して上
記平板状ブロックに立設され拡管により円筒状突起の内
部に当接された複数の伝熱パイプとを備えたので、設置
スペースを拡大することなく表面積を増大し冷却効果を
向上させることが可能な電子部品の放熱装置を提供する
ことができる。As described above, according to the first aspect of the present invention, the flat plate-shaped blocks that are in thermal contact with the electronic component and the cylindrical blocks that are arranged at a predetermined distance from each other are provided at corresponding positions. A plurality of thin plate fins formed with a plurality of protrusions,
The plurality of heat transfer pipes penetrating the inside of the cylindrical protrusions of the thin plate fins and provided upright on the flat plate-shaped block and abutting against the insides of the cylindrical protrusions by the expansion pipe are provided, thus expanding the installation space. It is possible to provide a heat dissipation device for an electronic component that can increase the surface area and improve the cooling effect without the need.
【００４５】又、この発明の請求項２によれば、内部に
中空部が形成され電子部品と熱的に接触する平板状ブロ
ックと、互いに所定の間隔を介して配設され円筒状突起
が複数形成された複数の薄板状フィンと、薄板状フィン
の円筒状突起の内部を貫通するとともに平板状ブロック
の中空部と連通して上記平板状ブロックに立設され拡管
により円筒状突起の内部に当接され真空封止された複数
の伝熱パイプと、平板状ブロックの中空部に封入された
作動液とを備えたので、より一層冷却効果を向上させる
ことが可能な電子部品の放熱装置を提供することができ
る。According to a second aspect of the present invention, a flat plate-shaped block having a hollow portion formed therein and in thermal contact with an electronic component, and a plurality of cylindrical protrusions disposed at a predetermined interval from each other. The plurality of thin plate fins formed and the cylindrical projections of the thin plate fins are penetrated and communicated with the hollow part of the flat plate block. Since a plurality of heat transfer pipes that are in contact with each other and are vacuum-sealed and a working fluid that is sealed in the hollow portion of the flat plate-shaped block are provided, a heat dissipation device for electronic components that can further improve the cooling effect is provided. can do.
【００４６】又、この発明の請求項３によれば、所定の
大きさの複数の貫通穴が形成され電子部品と熱的に接触
する平板状ブロックと、互いに所定の間隔を介して配設
されそれぞれ平板状ブロックの貫通穴と対応する位置に
円筒状突起が形成された複数の薄板状フィンと、平板状
ブロックの貫通穴及び各薄板状フィンの円筒状突起の内
部をそれぞれ貫通して配設され拡管により貫通穴および
円筒状突起の内部に当接された複数の伝熱パイプとを備
えたので、冷却効果を向上させることが可能であること
は勿論のこと、製作コストの低減が可能な電子部品の放
熱装置を提供することができる。According to the third aspect of the present invention, a plurality of through holes having a predetermined size are formed and a flat plate-shaped block which is in thermal contact with an electronic component is arranged with a predetermined space therebetween. A plurality of thin plate fins each having a cylindrical projection formed at a position corresponding to the through hole of the flat plate block, and the through holes of the flat plate block and the cylindrical projections of each thin plate fin are arranged to penetrate through the fins. Since it has a plurality of heat transfer pipes that are brought into contact with the inside of the through hole and the cylindrical protrusion by the expanded pipe, the cooling effect can be improved and the manufacturing cost can be reduced. A heat dissipation device for electronic components can be provided.
【００４７】又、この発明の請求項４によれば、それぞ
れ所定の大きさの貫通穴が形成された複数の突出部を有
し電子部品と熱的に接触する平板状ブロックと、互いに
所定の間隔を介して配設されそれぞれ平板状ブロックの
貫通穴と対応する位置に円筒状突起が形成された複数の
薄板状フィンと、平板状ブロックの貫通穴および各薄板
状フィンの円筒状突起の内部をそれぞれ貫通して配設さ
れ拡管により貫通穴および円筒状突起の内部に当接され
た複数の伝熱パイプとを備えたので、冷却効果を向上さ
せることが可能であることは勿論のこと、軽量化が可能
な電子部品の放熱装置を提供することができる。According to a fourth aspect of the present invention, a flat plate block having a plurality of projections each having a through hole of a predetermined size and being in thermal contact with an electronic component, and a predetermined block are mutually provided. A plurality of thin plate fins having cylindrical protrusions formed at positions corresponding to the through holes of the flat plate block arranged at intervals, and inside of the through holes of the flat plate block and the cylindrical protrusions of each thin plate fin. Since it is provided with a plurality of heat transfer pipes which are respectively disposed through each of the through holes and abutted inside the cylindrical projections by expanding the pipe, the cooling effect can be improved, as a matter of course. It is possible to provide a heat dissipation device for electronic components, which can be reduced in weight.
【００４８】又、この発明の請求項５によれば、請求項
１、３、４のいずれかにおいて、伝熱パイプの内部に熱
伝導性材料でなる部材を充填させたので、軽量化が可能
であることは勿論のこと、冷却効果をより向上させるこ
とが可能な電子部品の放熱装置を提供することができ
る。Further, according to claim 5 of the present invention, in any one of claims 1, 3 and 4, the inside of the heat transfer pipe is filled with a member made of a heat conductive material, so that the weight can be reduced. Not to mention, it is possible to provide a heat dissipation device for electronic parts capable of further improving the cooling effect.
【００４９】又、この発明の請求項６によれば、請求項
５において、拡管のための拡管ピンを部材としたので、
軽量化および冷却効果の向上を図ることが可能であるこ
とは勿論のこと、作業性の向上を図ることが可能な電子
部品の放熱装置を提供することができる。According to the sixth aspect of the present invention, in the fifth aspect, since the pipe expanding pin for pipe expanding is used as the member,
It is of course possible to provide a heat dissipation device for an electronic component, which is capable of achieving not only weight reduction and improvement of cooling effect but also improvement of workability.
【００５０】又、この発明の請求項７によれば、請求項
１、３、４のいずれかにおいて、伝熱パイプは真空封止
をして作動液を封入するようにしたので、作業性の向上
を図ることが可能であることは勿論のこと、冷却効果を
さらに向上させることが可能な電子部品の放熱装置を提
供することができる。According to a seventh aspect of the present invention, in any one of the first, third, and fourth aspects, the heat transfer pipe is vacuum-sealed so as to enclose the working liquid. It is of course possible to provide a heat dissipation device for electronic parts, which can improve the cooling effect as well as the improvement.
【００５１】又、この発明の請求項８によれば、請求項
１、２、３、４のいずれかにおいて、伝熱パイプとフィ
ンとの当接部に熱伝導性部材でなる部材を介装させたの
で、冷却効果の向上を図ることが可能であることは勿論
のこと、拡管装置が不要な電子部品の放熱装置を提供す
ることができる。According to an eighth aspect of the present invention, in any one of the first, second, third, and fourth aspects, a member made of a heat conductive member is interposed in the contact portion between the heat transfer pipe and the fin. Since it is possible to improve the cooling effect, it is possible to provide a heat dissipation device for electronic components that does not require a tube expansion device.
【００５２】又、この発明の請求項９によれば、電子部
品と熱的に接触する平板状ブロックと、互いに所定の間
隔を介して配設され円筒状突起が複数形成された複数の
薄板状フィンと、平板状ブロックに立設され薄板状フィ
ンの円筒状突起の内部を押し込みにより貫通して固定さ
れる複数の伝達パイプとを備えたので、冷却効果の向上
を図ることが可能であることは勿論のこと、拡管装置が
不要な電子部品の放熱装置を提供することができる。Further, according to claim 9 of the present invention, a flat plate block which is in thermal contact with the electronic component, and a plurality of thin plate-like blocks which are arranged at a predetermined interval from each other and in which a plurality of cylindrical projections are formed. Since the fins and the plurality of transmission pipes that are erected on the flat plate-shaped block and are fixed by penetrating the inside of the cylindrical protrusions of the thin plate-shaped fins by pressing are provided, it is possible to improve the cooling effect. Of course, it is possible to provide a heat dissipation device for electronic components that does not require a tube expansion device.
【００５３】又、この発明の請求項１０によれば、所定
の大きさの複数の貫通穴が形成され電子部品と熱的に接
触する平板状ブロックと、互いに所定の間隔を介して配
設されそれぞれ平板状ブロックの貫通穴と対応する位置
に円筒状突起が形成された複数の薄板状フィンと、平板
状ブロックの貫通穴および薄板状フィンの円筒状突起の
内部をそれぞれ押し込みにより貫通して固定される複数
の伝熱パイプとを備えたので、冷却効果の向上を図るこ
とが可能であることは勿論のこと、拡管装置が不要な電
子部品の放熱装置を提供することができる。According to a tenth aspect of the present invention, a plurality of through holes each having a predetermined size are formed, and a flat plate-shaped block which is in thermal contact with an electronic component is arranged with a predetermined space therebetween. Plural thin plate fins with cylindrical projections formed at the positions corresponding to the through holes of the flat plate block, and the through holes of the flat plate block and the cylindrical projections of the thin plate fins are inserted and fixed by pressing. Since a plurality of heat transfer pipes are provided, it is possible to improve the cooling effect, and it is possible to provide a heat dissipation device for electronic components that does not require a tube expanding device.
【００５４】又、この発明の請求項１１によれば、それ
ぞれ所定の大きさの貫通穴が形成された複数の突出部を
有し電子部品と熱的に接触する平板状ブロックと、互い
に所定の間隔を介して配設されそれぞれ平板状ブロック
の貫通穴と対応する位置に円筒状突起が形成された複数
の薄板状フィンと、平板状ブロックの貫通穴および各薄
板状フィンの円筒状突起の内部をそれぞれ押し込みによ
り貫通して固定される複数の伝熱パイプとを備えたの
で、冷却効果の向上を図ることが可能であることは勿論
のこと、拡管装置が不要な電子部品の放熱装置を提供す
ることができる。According to the eleventh aspect of the present invention, a flat plate block having a plurality of protrusions each having a through hole of a predetermined size and being in thermal contact with the electronic component, and a predetermined block are mutually provided. A plurality of thin plate fins having cylindrical protrusions formed at positions corresponding to the through holes of the flat plate block arranged at intervals, and inside of the through holes of the flat plate block and the cylindrical protrusions of each thin plate fin. Since it is provided with a plurality of heat transfer pipes that are fixed by penetrating each of them by pushing, it is possible to improve the cooling effect and to provide a heat dissipation device for electronic components that does not require a tube expansion device. can do.
【図１】 この発明の実施の形態１における電子部品の
放熱装置の構成を示す平面図である。FIG. 1 is a plan view showing a configuration of a heat dissipation device for electronic parts according to a first embodiment of the present invention.
【図２】 図１における線ＩＩ−ＩＩに沿う断面を示す
側断面図である。FIG. 2 is a side sectional view showing a section taken along line II-II in FIG.
【図３】 図１における電子部品の放熱装置の製造途中
における図２に相当する断面を示す側断面図である。FIG. 3 is a side sectional view showing a section corresponding to FIG. 2 in the process of manufacturing the heat dissipation device for the electronic component in FIG. 1.
【図４】 この発明の実施の形態２における電子部品の
放熱装置の構成を示す側断面図である。FIG. 4 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a second embodiment of the present invention.
【図５】 この発明の実施の形態３における電子部品の
放熱装置の構成を示す側断面図である。FIG. 5 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a third embodiment of the present invention.
【図６】 図５における電子部品の放熱装置の製造工程
を示す断面図である。6 is a cross-sectional view showing a manufacturing process of the heat dissipation device for the electronic component in FIG.
【図７】 この発明の実施の形態４における電子部品の
放熱装置の構成を示す側断面図である。FIG. 7 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a fourth embodiment of the present invention.
【図８】 この発明の実施の形態５における電子部品の
放熱装置の構成を示す側断面図である。FIG. 8 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a fifth embodiment of the present invention.
【図９】 図８における電子部品の放熱装置の製造工程
を示す断面図である。9 is a cross-sectional view showing a manufacturing process of the heat dissipation device for the electronic component in FIG.
【図１０】 この発明の実施の形態６における電子部品
の放熱装置の構成を示す側断面図である。FIG. 10 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a sixth embodiment of the present invention.
【図１１】 図１０における電子部品の放熱装置の製造
工程を示す断面図である。11 is a cross-sectional view showing a manufacturing process of the heat dissipation device for the electronic component in FIG.
【図１２】 この発明の実施の形態７における電子部品
の放熱装置の構成を示す側断面図である。FIG. 12 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a seventh embodiment of the present invention.
【図１３】 この発明の実施の形態８における電子部品
の放熱装置の構成を示す側断面図である。FIG. 13 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to an eighth embodiment of the present invention.
【図１４】 図１３における電子部品の放熱装置の製造
工程を示す断面図である。14 is a cross-sectional view showing a manufacturing process of the heat dissipation device for the electronic component in FIG.
【図１５】 この発明の実施の形態９における電子部品
の放熱装置の構成を示す側断面図である。FIG. 15 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a ninth embodiment of the present invention.
【図１６】 この発明の実施の形態１０における電子部
品の放熱装置の構成を示す側断面図である。FIG. 16 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a tenth embodiment of the present invention.
【図１７】 図１６における電子部品の放熱装置の製造
工程を示す断面図である。FIG. 17 is a cross-sectional view showing the manufacturing process of the heat dissipation device for the electronic component in FIG. 16.
【図１８】 この発明の実施の形態１１における電子部
品の放熱装置の構成を示す側断面図である。FIG. 18 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to an eleventh embodiment of the present invention.
【図１９】 この発明の実施の形態１２における電子部
品の放熱装置の構成を示す側断面図である。FIG. 19 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a twelfth embodiment of the present invention.
【図２０】 図１９における電子部品の放熱装置の製造
工程を示す断面図である。FIG. 20 is a cross-sectional view showing the manufacturing process of the heat dissipation device for the electronic component in FIG. 19.
【図２１】 この発明の実施の形態１３における電子部
品の放熱装置の構成を示す側断面図である。FIG. 21 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a thirteenth embodiment of the present invention.
【図２２】 この発明の実施の形態１４における電子部
品の放熱装置の構成を示す側断面図である。FIG. 22 is a side sectional view showing a structure of a heat dissipation device for electronic parts according to a fourteenth embodiment of the present invention.
【図２３】 従来の電子部品の放熱装置の概略構成を示
す図である。FIG. 23 is a diagram showing a schematic configuration of a conventional heat dissipation device for electronic parts.
７，１５，１６，２０ 平板状ブロック、８ 薄板状フ
ィン、８ａ，２０ａ 円筒状突起、９ 伝熱パイプ、１
０，２１，２３ 部材、１１，１８，２２ 拡管ピン、
１２ 閉塞板、１３ チップ管、１４ 作動液、１４ａ
蒸気、１４ｂ 液体、１５ａ 中空部、１６ａ 貫通
穴、１９ 栓。7, 15, 16, 20 Flat plate block, 8 Thin plate fins, 8a, 20a Cylindrical projections, 9 Heat transfer pipe, 1
0,21,23 member, 11,18,22 pipe expanding pin,
12 blocking plate, 13 tip tube, 14 hydraulic fluid, 14a
Vapor, 14b liquid, 15a hollow part, 16a through hole, 19 stopper.
Claims (11)
クと、互いに所定の間隔を介して配設され円筒状突起が
複数形成された複数の薄板状フィンと、上記薄板状フィ
ンの円筒状突起の内部をそれぞれ貫通して上記平板状ブ
ロックに立設され拡管により上記円筒状突起の内部に当
接された複数の伝熱パイプとを備えたことを特徴とする
電子部品の放熱装置。1. A flat plate-shaped block that is in thermal contact with an electronic component, a plurality of thin plate-shaped fins that are arranged at a predetermined interval from each other and formed with a plurality of cylindrical projections, and a cylindrical shape of the thin plate-shaped fin. A heat dissipating device for electronic parts, comprising: a plurality of heat transfer pipes penetrating the inside of each of the protrusions and standing on the flat plate-shaped block and abutting the inside of the cylindrical protrusions by expanding the pipes.
に接触する平板状ブロックと、互いに所定の間隔を介し
て配設され円筒状突起が複数形成された複数の薄板状フ
ィンと、上記薄板状フィンの円筒状突起の内部を貫通す
るとともに上記平板状ブロックの中空部と連通して上記
平板状ブロックに立設され拡管により上記円筒状突起の
内部に当接され真空封止された複数の伝熱パイプと、上
記平板状ブロックの中空部に封入された作動液とを備え
たことを特徴とする電子部品の放熱装置。2. A flat plate-shaped block having a hollow portion formed therein and being in thermal contact with an electronic component, and a plurality of thin plate-shaped fins having a plurality of cylindrical protrusions arranged at a predetermined interval from each other, The thin plate fin penetrates the inside of the cylindrical protrusion and communicates with the hollow portion of the flat plate block, and is erected on the flat plate block. A heat dissipation device for an electronic component, comprising: a plurality of heat transfer pipes; and a working fluid sealed in a hollow portion of the flat block.
電子部品と熱的に接触する平板状ブロックと、互いに所
定の間隔を介して配設されそれぞれ上記平板状ブロック
の貫通穴と対応する位置に円筒状突起が形成された複数
の薄板状フィンと、上記平板状ブロックの貫通穴および
上記各薄板状フィンの円筒状突起の内部をそれぞれ貫通
して配設され拡管により上記貫通穴および円筒状突起の
内部に当接された複数の伝熱パイプとを備えたことを特
徴とする電子部品の放熱装置。3. A flat plate-shaped block having a plurality of through-holes of a predetermined size and being in thermal contact with an electronic component, and a through-hole of the flat plate-shaped block which is arranged at a predetermined interval from each other. A plurality of thin plate fins having cylindrical projections formed at the positions, through holes of the flat plate block and the cylindrical projections of the respective thin plate fins, and the through holes provided by penetrating the through holes and A heat dissipation device for an electronic component, comprising: a plurality of heat transfer pipes that are in contact with the inside of a cylindrical protrusion.
れた複数の突出部を有し電子部品と熱的に接触する平板
状ブロックと、互いに所定の間隔を介して配設されそれ
ぞれ上記平板状ブロックの貫通穴と対応する位置に円筒
状突起が形成された複数の薄板状フィンと、上記平板状
ブロックの貫通穴および上記各薄板状フィンの円筒状突
起の内部をそれぞれ貫通して配設され拡管により上記貫
通穴および円筒状突起の内部に当接された複数の伝熱パ
イプとを備えたことを特徴とする電子部品の放熱装置。4. A flat plate block having a plurality of projections each having a through hole of a predetermined size and being in thermal contact with an electronic component, and the flat plates arranged at a predetermined interval from each other. A plurality of thin plate fins having cylindrical projections formed at positions corresponding to the through holes of the block, and through the through holes of the flat block and the cylindrical projections of the thin plate fins. And a plurality of heat transfer pipes which are brought into contact with the inside of the through hole and the cylindrical protrusion by expanding the pipe.
る部材が充填されていることを特徴とする請求項１、
３、４のいずれかに記載の電子部品の放熱装置。5. A member made of a heat conductive material is filled inside the heat transfer pipe.
The heat dissipation device for an electronic component according to any one of 3 and 4.
を特徴とする請求項５記載の電子部品の放熱装置。6. The heat dissipation device for an electronic component according to claim 5, wherein the member is a pipe expanding pin for pipe expansion.
されていることを特徴とする請求項１、３、４のいずれ
かに記載の電子部品の放熱装置。7. The heat dissipation device for electronic parts according to claim 1, wherein the heat transfer pipe is vacuum-sealed and a working liquid is sealed.
導性材料でなる部材が介装されていることを特徴とする
請求項１、２、３、４のいずれかに記載の電子部品の放
熱装置。8. The member according to claim 1, wherein a member made of a heat conductive material is interposed at a contact portion between the heat transfer pipe and the fin. Heat dissipation device for electronic parts.
クと、互いに所定の間隔を介して配設され円筒状突起が
複数形成された複数の薄板状フィンと、上記平板状ブロ
ックに立設され上記薄板状フィンの円筒状突起の内部を
押し込みにより貫通して固定される複数の伝熱パイプと
を備えたことを特徴とする電子部品の放熱装置。9. A flat plate block that is in thermal contact with an electronic component, a plurality of thin plate fins having a plurality of cylindrical projections that are arranged at a predetermined distance from each other, and are erected on the flat plate block. And a plurality of heat transfer pipes that are fixed by penetrating the inside of the cylindrical protrusion of the thin plate fin by pressing.
れ電子部品と熱的に接触する平板状ブロックと、互いに
所定の間隔を介して配設されそれぞれ上記平板状ブロッ
クの貫通穴と対応する位置に円筒状突起が形成された複
数の薄板状フィンと、上記平板状ブロックの貫通穴およ
び上記各薄板状フィンの円筒状突起の内部をそれぞれ押
し込みにより貫通して固定される複数の伝熱パイプとを
備えたことを特徴とする電子部品の放熱装置。10. A flat plate-shaped block having a plurality of through-holes of a predetermined size and being in thermal contact with an electronic component, and a through-hole of the flat plate-shaped block which is arranged at a predetermined interval from each other. A plurality of thin plate-shaped fins having cylindrical projections formed at the positions, and a plurality of heat transfer members that are fixed by penetrating through the through holes of the flat plate block and the cylindrical projections of the thin plate fins, respectively. A heat dissipating device for electronic parts, comprising: a pipe.
された複数の突出部を有し電子部品と熱的に接触する平
板状ブロックと、互いに所定の間隔を介して配設されそ
れぞれ上記平板状ブロックの貫通穴と対応する位置に円
筒状突起が形成された複数の薄板状フィンと、上記平板
状ブロックの貫通穴および上記各薄板状フィンの円筒状
突起の内部をそれぞれ押し込みにより貫通して固定され
る複数の伝熱パイプとを備えたことを特徴とする電子部
品の放熱装置。11. A flat plate block having a plurality of protrusions each having a through hole of a predetermined size and being in thermal contact with an electronic component, and the flat plates arranged at a predetermined interval from each other. A plurality of thin plate fins in which cylindrical projections are formed at positions corresponding to the through holes of the block, and the through holes of the flat block and the insides of the cylindrical projections of the thin plate fins are inserted by being pushed through. A heat dissipation device for an electronic component, comprising: a plurality of heat transfer pipes fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32053195A JP3177921B2 (en) | 1995-12-08 | 1995-12-08 | Heat dissipation device for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32053195A JP3177921B2 (en) | 1995-12-08 | 1995-12-08 | Heat dissipation device for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09162334A true JPH09162334A (en) | 1997-06-20 |
| JP3177921B2 JP3177921B2 (en) | 2001-06-18 |
Family
ID=18122482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32053195A Expired - Fee Related JP3177921B2 (en) | 1995-12-08 | 1995-12-08 | Heat dissipation device for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3177921B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19806978A1 (en) * | 1998-02-19 | 1999-08-26 | Behr Gmbh & Co | Convection cooled heat sink for electronic components |
| JP2016219575A (en) * | 2015-05-19 | 2016-12-22 | Ａｐｓジャパン株式会社 | Heat sink |
-
1995
- 1995-12-08 JP JP32053195A patent/JP3177921B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19806978A1 (en) * | 1998-02-19 | 1999-08-26 | Behr Gmbh & Co | Convection cooled heat sink for electronic components |
| DE19806978B4 (en) * | 1998-02-19 | 2008-08-21 | Behr Gmbh & Co. Kg | Cooling device for cooling by convection |
| JP2016219575A (en) * | 2015-05-19 | 2016-12-22 | Ａｐｓジャパン株式会社 | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3177921B2 (en) | 2001-06-18 |
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