JPH09152569A - Positioning device for rectangular substrate - Google Patents

Positioning device for rectangular substrate

Info

Publication number
JPH09152569A
JPH09152569A JP7331175A JP33117595A JPH09152569A JP H09152569 A JPH09152569 A JP H09152569A JP 7331175 A JP7331175 A JP 7331175A JP 33117595 A JP33117595 A JP 33117595A JP H09152569 A JPH09152569 A JP H09152569A
Authority
JP
Japan
Prior art keywords
rectangular substrate
substrate
rectangular
edge sensors
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7331175A
Other languages
Japanese (ja)
Inventor
Toshiyuki Kozuka
塚 敏 幸 小
Takashi Nirei
井 享 司 楡
Masayoshi Kodama
玉 正 吉 児
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP7331175A priority Critical patent/JPH09152569A/en
Publication of JPH09152569A publication Critical patent/JPH09152569A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Liquid Crystal (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily cope with a change in reference line for different positioning at a user's request. SOLUTION: This device has edge sensors 3a and 3b, and 3c and 3d, which optically detect the peripheral edges of two mutually adjacent sides of the rectangular substrate 2 held on the top surface of a substrate chuck 1, arranged two by two nearby the two mutually adjacent sides of the rectangular substrate chuck 1 at a specific distance. Further, the device is provided with position correcting means 8 and 9 which input position signals of the peripheral edges of the two orthogonal peripheral sides of the rectangular substrate 2 detected by the edge sensors 3a and 3b, and 3c and 3d, recognize their X-directional and Y-directional positions and θ-directional angles, and correct the position of the rectangular substrate 2 about its target position. Then the two edge sensors 3a and 3b, or 3c and 3d are switched and used according to which of the two orthogonal sides of the rectangular substrate 2 is employed as a reference line for recognizing the θ-directional angle of the rectangular substrate 2 to recognize and correct the θ-directional angle of the rectangular substrate 2. Consequently, the change in reference line for different positioning at a user's request can easily be coped with.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、例えばマスクに形
成された配線パターンを基板チャックの上面に保持され
た矩形基板（ガラス基板など）に焼き付ける基板露光装
置において、上記マスクと矩形基板との位置合わせに際
し上記基板チャックの上方に設けられた光学系に対して
矩形基板を所定の目標位置に位置決めする矩形基板の位
置決め装置に関し、特に大形の矩形基板を非接触状態で
位置決めするものにおいてユーザ要求により異なる位置
決めの基準ラインの変化に容易に対応することができる
矩形基板の位置決め装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate exposure apparatus for printing a wiring pattern formed on a mask onto a rectangular substrate (such as a glass substrate) held on the upper surface of a substrate chuck. A rectangular substrate positioning device for positioning a rectangular substrate at a predetermined target position with respect to an optical system provided above the substrate chuck at the time of alignment, and a user request particularly for positioning a large rectangular substrate in a non-contact state. The present invention relates to a positioning device for a rectangular substrate which can easily cope with a change in a reference line for different positioning.

【０００２】[0002]

【従来の技術】従来の矩形基板の位置決め装置は、Ｘ方
向及びＹ方向の二次元の移動とθ方向の回転が可能な移
動テーブルと、この移動テーブルの上面に固定され該移
動テーブルによってＸ，Ｙ，θ方向の移動がされると共
に上面には矩形基板を載せて保持する矩形状の基板チャ
ックとを有し、この基板チャックの上方に設けられた光
学系に対して上記矩形基板を所定の目標位置に位置決め
するようになっていた。2. Description of the Related Art A conventional positioning apparatus for a rectangular substrate is a moving table which is capable of two-dimensional movement in the X and Y directions and rotation in the θ direction, and an X, which is fixed on the upper surface of the moving table. It has a rectangular substrate chuck that is moved in the Y and θ directions and has a rectangular substrate mounted and held on the upper surface thereof. The rectangular substrate is fixed to an optical system provided above the substrate chuck. It was supposed to be positioned at the target position.

【０００３】図４は、従来の矩形基板の位置決め装置を
示す矩形基板の上面側から見た平面説明図である。図に
おいて、矩形状の基板チャック１の上面には例えば大形
（400mm×500mm以上）のガラス基板などの矩形基板２が
真空吸着等により保持され、上記基板チャック１の相隣
り合う直交二辺の各辺の近傍には合計３個のエッジセン
サ３ａ，３ｂ，３ｃが設けられていた。これらのエッジ
センサ３ａ，３ｂ，３ｃは、上記基板チャック１の上面
に保持された矩形基板２の相隣り合う直交二辺の各辺の
周縁を光学的に検出するもので、一方の辺（例えば長辺
側）の周縁に沿って第一のエッジセンサ３ａと第二のエ
ッジセンサ３ｂとが所定距離だけ離して配置され、上記
一方の辺に直交する他方の辺（例えば短辺側）の周縁の
中央部に第三のエッジセンサ３ｃが設けられている。FIG. 4 is a plan view of a conventional rectangular substrate positioning device as seen from the upper surface side of the rectangular substrate. In the figure, a rectangular substrate 2 such as a large-sized (400 mm × 500 mm or more) glass substrate is held on the upper surface of a rectangular substrate chuck 1 by vacuum suction or the like, and the substrate chuck 1 has two adjacent orthogonal sides. A total of three edge sensors 3a, 3b, 3c were provided near each side. These edge sensors 3a, 3b, 3c optically detect the peripheral edges of two mutually adjacent orthogonal sides of the rectangular substrate 2 held on the upper surface of the substrate chuck 1, and one side (for example, A first edge sensor 3a and a second edge sensor 3b are arranged along a peripheral edge of the long side) with a predetermined distance therebetween, and a peripheral edge of the other side (for example, the short side) orthogonal to the one side. A third edge sensor 3c is provided at the center of the.

【０００４】なお、上記の各エッジセンサ３ａ，３ｂ，
３ｃは、それぞれに付設されたシリンダ４ａ，４ｂ，４
ｃによって矢印Ａ，Ｂ，Ｃのように矩形基板２に接近、
退避可能とされている。また、上記の各シリンダ４ａ，
４ｂ，４ｃには、それぞれパルスモータ５ａ，５ｂ，５
ｃが付設されており、前記エッジセンサ３ａ，３ｂ，３
ｃが矢印Ｄ，Ｅ，Ｆのように矩形基板２の周縁を検出す
るためのスキャン動作が可能とされている。さらに、図
４では図示省略しているが、矩形基板２の上面の上方に
は、基板露光装置における露光光学系又は基板検査装置
における検査光学系が設けられている。The above edge sensors 3a, 3b,
3c is a cylinder 4a, 4b, 4 attached to each
By c, the rectangular substrate 2 is approached as shown by arrows A, B, and C,
It is possible to evacuate. In addition, each of the cylinders 4a,
4b and 4c include pulse motors 5a, 5b and 5 respectively.
c is attached to the edge sensors 3a, 3b, 3
As indicated by arrows c, arrows D, E, and F, a scanning operation for detecting the peripheral edge of the rectangular substrate 2 is possible. Further, although not shown in FIG. 4, an exposure optical system in the substrate exposure apparatus or an inspection optical system in the substrate inspection apparatus is provided above the upper surface of the rectangular substrate 2.

【０００５】このような位置決め装置において、矩形基
板２の位置を検出して上記の光学系に対して所定の目標
位置に位置決めするには、まず、図示省略のロボットハ
ンドによってローダ部から１枚ずつ矩形基板２を取り出
し、所定の経路で搬送して、図４に矢印Ｊで示すように
送り出して基板チャック１の上面に載置する。このと
き、上記ロボットハンドの搬送によるバラツキによっ
て、矩形基板２が所定の目標位置に対して図５に示すよ
うに位置ずれを起こすことがある。In such a positioning device, in order to detect the position of the rectangular substrate 2 and position the rectangular substrate 2 at a predetermined target position with respect to the optical system, first, the robot hand (not shown) is used to load the rectangular substrate 2 one by one. The rectangular substrate 2 is taken out, conveyed by a predetermined path, sent out as indicated by an arrow J in FIG. 4, and placed on the upper surface of the substrate chuck 1. At this time, the rectangular substrate 2 may be displaced relative to a predetermined target position as shown in FIG. 5 due to variations caused by the transportation of the robot hand.

【０００６】ここで、図４に示す各エッジセンサ３ａ，
３ｂ，３ｃは、それぞれ矢印Ａ，Ｂ，Ｃに示すように矩
形基板２に接近した状態から、さらに矢印Ｄ，Ｅ，Ｆの
ようにスキャン動作をして直交二辺の各辺の周縁を光学
的に検出する。すなわち、図５に示すように、第一のエ
ッジセンサ３ａは点Ｐ1(ｘ1，ｙ1）を検出し、第二のエ
ッジセンサ３ｂは点Ｐ2(ｘ2，ｙ2）を検出し、第三のエ
ッジセンサ３ｃは点Ｐ3(ｘ3，ｙ3）を検出する。これら
の信号検出は、図４に示す検出回路６で行われる。この
場合、上記のように検出した矩形基板２のＸ軸方向の現
在位置は点Ｐ3の座標ｘ3であり、Ｙ軸方向の現在位置は
点Ｐ1とＰ2のＹ座標から（ｙ1＋ｙ2）／２となる。ま
た、該矩形基板２の中心軸７のＸ軸方向に対する傾き角
θは同じく点Ｐ1とＰ2のＸ，Ｙ座標から、 となる。Here, each of the edge sensors 3a shown in FIG.
3b and 3c perform scanning operation as indicated by arrows D, E, and F from the state of approaching the rectangular substrate 2 as indicated by arrows A, B, and C, respectively, and opticalize the peripheral edges of the two orthogonal sides. To detect. That is, as shown in FIG. 5, the first edge sensor 3a detects the point P 1 (x 1 , y 1 ) and the second edge sensor 3b detects the point P 2 (x 2 , y 2 ). , The third edge sensor 3c detects the point P 3 (x 3 , y 3 ). Detection of these signals is performed by the detection circuit 6 shown in FIG. In this case, the current position of the X-axis direction of the detected rectangular substrate 2 as described above are the coordinates x 3 of the point P 3, Y-axis direction of the current position from the Y coordinate of the point P 1 and P 2 (y 1 + Y 2 ) / 2. In addition, the inclination angle θ of the central axis 7 of the rectangular substrate 2 with respect to the X-axis direction is calculated from the X and Y coordinates of the points P 1 and P 2 as follows. Becomes

【０００７】いま、図４において、上記矩形基板２の所
定の目標位置をＸ軸方向では座標ｘ0の原点Ｑとし、Ｙ
軸方向では座標ｙ0の原点Ｒとすると、図５に示すよう
に搬送して載置された矩形基板２については、Ｘ軸方向
のずれ量は（ｘ0−ｘ3）となり、Ｙ軸方向のずれ量は
｛ｙ0−(ｙ1＋ｙ2)／２｝となる。また、該矩形基板２
のＸ軸方向に対する傾き角θは上述の式（１）のとおり
である。これらにより、上記搬送して載置された矩形基
板２の所定の目標位置に対するずれ量がわかるので、こ
のずれ量がゼロとなるようにすればよい。Now, referring to FIG. 4, the predetermined target position of the rectangular substrate 2 is defined as the origin Q of the coordinate x 0 in the X-axis direction, and Y
When the origin R of the coordinate y 0 is set in the axial direction, the displacement amount in the X-axis direction is (x 0 −x 3 ) for the rectangular substrate 2 which is transported and placed as shown in FIG. The deviation amount of {y 0 − (y 1 + y 2 ) / 2} is. In addition, the rectangular substrate 2
The inclination angle θ of the X with respect to the X-axis direction is as in the above-described equation (1). From these, the amount of deviation of the conveyed and placed rectangular substrate 2 with respect to a predetermined target position can be known, so this amount of deviation can be made zero.

【０００８】そのため、図４に示すデータ処理制御回路
８で上記の各ずれ量を認識し、それをゼロにするための
位置補正処理を実行し、補正処理信号Ｓ1をテーブル駆
動制御回路９へ送出する。そして、このテーブル駆動制
御回路９は、前記基板チャック１を支持している移動テ
ーブル（図示省略）へ駆動制御信号Ｓ2を送出し、該移
動テーブルを上記の補正処理信号Ｓ1に対応する量だけ
Ｘ方向及びＹ方向に移動し、並びにθ方向に回転させ
る。これにより、図４において、上記矩形基板２の直交
二辺の周縁がそれぞれ原点Ｑ，Ｒに一致すると共に、傾
きもゼロとなって、所定の目標位置に合致して位置決め
される。Therefore, the data processing control circuit 8 shown in FIG. 4 recognizes each of the above-mentioned deviation amounts, executes the position correction processing for making them zero, and outputs the correction processing signal S 1 to the table drive control circuit 9. Send out. Then, the table drive control circuit 9 sends a drive control signal S 2 to a moving table (not shown) supporting the substrate chuck 1, and the moving table is moved by an amount corresponding to the correction processing signal S 1 described above. Only in the X and Y directions, and in the θ direction. As a result, in FIG. 4, the peripheral edges of the two orthogonal sides of the rectangular substrate 2 coincide with the origins Q and R, respectively, and the inclination becomes zero, so that the rectangular substrate 2 is positioned in conformity with a predetermined target position.

【０００９】上述の図４の場合は、矩形基板２の直交二
辺の長辺側をＸ軸方向に対する傾き角θを認識する基準
ラインとしてこの辺の側に２個のエッジセンサ３ａ，３
ｂを設けたものであるが、ユーザの要求によっては、上
記矩形基板２の直交二辺の短辺側をＸ軸方向に対する傾
き角θを認識する基準ラインとして指定されることがあ
る。このときは、図６に示すように、上記矩形基板２の
直交二辺の長辺側の中央部に第一のエッジセンサ３ａを
設け、該矩形基板２の直交二辺の短辺側に沿って第二の
エッジセンサ３ｂと第三のエッジセンサ３ｃとを所定距
離だけ離して配置することとなる。In the case of FIG. 4 described above, the two long sides of the rectangular substrate 2 are used as reference lines for recognizing the tilt angle θ with respect to the X-axis direction on the longer sides of the two sides of the two edge sensors 3a, 3a.
Although b is provided, depending on the user's request, the short side of the two orthogonal sides of the rectangular substrate 2 may be designated as the reference line for recognizing the inclination angle θ with respect to the X-axis direction. At this time, as shown in FIG. 6, a first edge sensor 3a is provided in the central portion of the rectangular substrate 2 on the longer side of the two orthogonal sides, and along the shorter side of the two orthogonal sides of the rectangular substrate 2. Thus, the second edge sensor 3b and the third edge sensor 3c are arranged apart from each other by a predetermined distance.

【００１０】上記異なるユーザ要求に応じて各エッジセ
ンサ３ａ，３ｂ，３ｃを配置した場合は、第一のエッジ
センサ３ａは長辺側の一点について点Ｐ1(ｘ1，ｙ1）を
検出し、第二のエッジセンサ３ｂは短辺側のある一点に
ついて点Ｐ2(ｘ2，ｙ2）を検出し、第三のエッジセンサ
３ｃは短辺側の他の一点について点Ｐ3(ｘ3，ｙ3）を検
出する。このとき、上記のように検出した矩形基板２の
Ｘ軸方向の現在位置は点Ｐ2とＰ3のＸ座標から（ｘ2＋
ｘ3）／２となり、Ｙ軸方向の現在位置は点Ｐ1の座標ｙ
1である。また、該矩形基板２の中心軸７のＸ軸方向に
対する傾き角θは、上記点Ｐ2とＰ3のＸ，Ｙ座標から、
式（１）と同様にして となる。When the respective edge sensors 3a, 3b, 3c are arranged according to the different user requests, the first edge sensor 3a detects the point P 1 (x 1 , y 1 ) at one point on the long side. , The second edge sensor 3b detects a point P 2 (x 2 , y 2 ) for one point on the short side, and the third edge sensor 3c detects a point P 3 (x 3 for another point on the short side. , Y 3 ) is detected. At this time, the current position in the X-axis direction of the rectangular substrate 2 detected as described above is calculated from the X-coordinates of the points P 2 and P 3 by (x 2 +
x 3 ) / 2, and the current position in the Y-axis direction is the coordinate y of the point P 1 .
Is one. Further, the inclination angle θ of the central axis 7 of the rectangular substrate 2 with respect to the X-axis direction is calculated from the X and Y coordinates of the points P 2 and P 3 .
In the same way as equation (1) Becomes

【００１１】この図６の場合においても、図４に示すよ
うに上記矩形基板２の所定の目標位置をＸ軸方向では座
標ｘ0の原点Ｑとし、Ｙ軸方向では座標ｙ0の原点Ｒとす
ると、図６に示すように搬送して載置された矩形基板２
については、Ｘ軸方向のずれ量は｛ｘ0−(ｘ2＋ｘ3)／
２｝となり、Ｙ軸方向のずれ量は（ｙ0−ｙ1）となる。
また、該矩形基板２のＸ軸方向に対する傾き角θは上述
の式（２）のとおりである。これらにより、上記搬送し
て載置された矩形基板２の所定の目標位置に対するずれ
量がわかるので、このずれ量がゼロとなるように前述と
同様にデータ処理回路８及びテーブル駆動制御回路９で
位置補正処理を実行する。これにより、所定の目標位置
に合致して位置決めされる。Also in the case of FIG. 6, as shown in FIG. 4, the predetermined target position of the rectangular substrate 2 is the origin Q of the coordinate x 0 in the X-axis direction and the origin R of the coordinate y 0 in the Y-axis direction. Then, as shown in FIG. 6, the rectangular substrate 2 transported and placed
For, the shift amount in the X-axis direction is {x 0 − (x 2 + x 3 ) /
2}, and the shift amount in the Y-axis direction is (y 0 −y 1 ).
Further, the tilt angle θ of the rectangular substrate 2 with respect to the X-axis direction is as shown in the above-mentioned formula (2). From these, the amount of deviation of the conveyed and placed rectangular substrate 2 with respect to a predetermined target position is known. Therefore, the data processing circuit 8 and the table drive control circuit 9 are set in the same manner as described above so that the amount of deviation becomes zero. Position correction processing is executed. As a result, positioning is performed in conformity with the predetermined target position.

【００１２】[0012]

【発明が解決しようとする課題】しかし、このような従
来の矩形基板の位置決め装置においては、図４に示すよ
うに、基板チャック１の相隣り合う直交二辺の一方の辺
の周縁に沿って２個のエッジセンサ３ａ，３ｂを所定距
離だけ離して配置し、上記一方の辺に直交する他方の辺
の周縁の中央部に１個のエッジセンサ３ｃを設けていた
ので、図５及び図６に示すように、ユーザ要求の相違に
より矩形基板２のＸ軸方向に対する傾き角θを認識する
基準ラインが一方の辺と他方の辺とで変化した場合に、
その対応が容易ではなかった。すなわち、上記矩形基板
２のＸ軸方向に対する傾き角θを認識するには、その基
準ラインの位置する側に必ず２個のエッジセンサを配置
しなければならないが、ユーザ要求の相違により傾き角
θの基準ラインが変化した場合に、その都度直交二辺の
どちらの辺側に２個のエッジセンサを配置するのか設計
変更してその取付位置を変えなければならなかった。ま
た、図４に示すデータ処理制御回路８内の位置補正処理
プログラムの計算式も変更しなければならなかった。従
って、上記ユーザ要求の相違による位置決めの基準ライ
ンの変化に対応するのが煩雑であると共に困難であり、
時間もかかり、費用もかかるものであった。また、図４
に示す短辺側に１個設けられたエッジセンサ３ｃにおい
ては、矢印Ｃ方向の接近又は退避の移動量が、矩形基板
２の一側辺から中心軸まで大きく移動しなければなら
ず、その機構が大形化するものであった。However, in such a conventional rectangular substrate positioning device, as shown in FIG. 4, the substrate chuck 1 is provided along the periphery of one of two adjacent orthogonal sides of the substrate chuck 1. Since the two edge sensors 3a and 3b are arranged apart from each other by a predetermined distance, and one edge sensor 3c is provided in the central portion of the peripheral edge of the other side orthogonal to the one side, as shown in FIGS. As shown in, when the reference line for recognizing the tilt angle θ of the rectangular substrate 2 with respect to the X-axis direction changes between one side and the other side due to a difference in user request,
The response was not easy. That is, in order to recognize the tilt angle θ of the rectangular substrate 2 with respect to the X-axis direction, it is necessary to arrange two edge sensors on the side where the reference line is located. When the reference line of No. 2 changes, the mounting position must be changed by changing the design to which side of the two orthogonal sides the two edge sensors should be arranged. Further, the calculation formula of the position correction processing program in the data processing control circuit 8 shown in FIG. 4 also had to be changed. Therefore, it is complicated and difficult to deal with the change in the positioning reference line due to the difference in the user request,
It was time consuming and costly. FIG.
In the one edge sensor 3c provided on the short side shown in FIG. 2, the amount of approach or retreat in the direction of arrow C has to largely move from one side of the rectangular substrate 2 to the central axis, and the mechanism thereof. Was a big one.

【００１３】そこで、本発明は、このような問題点に対
処し、大形の矩形基板を非接触状態で位置決めするもの
においてユーザ要求により異なる位置決めの基準ライン
の変化に容易に対応することができる矩形基板の位置決
め装置を提供することを目的とする。Therefore, the present invention can cope with such a problem and can easily cope with a change in the reference line of different positioning depending on the user's request in positioning a large rectangular substrate in a non-contact state. It is an object to provide a positioning device for a rectangular substrate.

【００１４】[0014]

【課題を解決するための手段】上記目的を達成するため
に、本発明による矩形基板の位置決め装置は、Ｘ方向及
びＹ方向の二次元の移動とθ方向の回転が可能な移動テ
ーブルと、この移動テーブルの上面に固定され該移動テ
ーブルによってＸ，Ｙ，θ方向の移動がされると共に上
面には矩形基板を載せて保持する矩形状の基板チャック
とを有し、この基板チャックの上方に設けられた光学系
に対して上記矩形基板を所定の目標位置に位置決めする
矩形基板の位置決め装置において、上記矩形状の基板チ
ャックの相隣り合う直交二辺の各辺の近傍には該基板チ
ャックの上面に保持された矩形基板の相隣り合う直交二
辺の各辺の周縁を光学的に検出するエッジセンサを所定
距離だけ離して２個ずつ配置すると共に、上記２個ずつ
のエッジセンサで検出した矩形基板の直交二辺の周縁の
位置信号を取り込んでそのＸ方向，Ｙ方向の位置及びθ
方向の角度を認識し該矩形基板の目標位置に対して位置
を補正する位置補正手段を設け、上記矩形基板のθ方向
の角度を認識する基準ラインとして該矩形基板の直交二
辺のどちらの辺をとるかによって上記２個ずつのエッジ
センサを互いに切り換えて使用し、その矩形基板のθ方
向の角度の認識及び補正をするようにしたものである。In order to achieve the above object, a positioning device for a rectangular substrate according to the present invention comprises a moving table capable of two-dimensional movement in X and Y directions and rotation in θ direction. It has a rectangular substrate chuck that is fixed to the upper surface of the moving table and is moved in the X, Y, and θ directions by the moving table, and has a rectangular substrate chuck that holds and holds a rectangular substrate on the upper surface. In a rectangular substrate positioning device for positioning the rectangular substrate at a predetermined target position with respect to a given optical system, an upper surface of the rectangular substrate chuck is located near each of two adjacent orthogonal sides of the rectangular substrate chuck. Two edge sensors that optically detect the peripheries of two adjacent orthogonal sides of the rectangular substrate held by are placed at a predetermined distance, and two edge sensors are arranged at the same time. The position signals in the X direction and the Y direction and the θ of the position signals of the peripheral edges of the two orthogonal sides of the rectangular substrate which have been output are taken in and θ.
Position correction means for recognizing the angle of the direction and correcting the position with respect to the target position of the rectangular substrate is provided, and which side of the two orthogonal sides of the rectangular substrate is used as a reference line for recognizing the angle of the rectangular substrate in the θ direction. The two edge sensors are switched each other depending on whether or not the angle is taken, and the angle of the rectangular substrate in the θ direction is recognized and corrected.

【００１５】また、上記各エッジセンサは、基板チャッ
クの上面に保持された矩形基板の対応する辺に対し、接
近又は退避可能とすると共に、その接近位置にて上記辺
の周縁を光学的に検出するためのスキャン動作が可能と
したものである。Further, each of the edge sensors is capable of approaching or retracting with respect to the corresponding side of the rectangular substrate held on the upper surface of the substrate chuck, and optically detecting the peripheral edge of the side at the approaching position. This enables the scanning operation to do so.

【００１６】さらに、上記各エッジセンサは、透過型又
は反射型の光学センサとしたものである。Further, each of the edge sensors is a transmissive or reflective optical sensor.

【００１７】[0017]

【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づいて詳細に説明する。図１は本発明による矩
形基板の位置決め装置の実施形態を示す矩形基板の上面
側から見た平面説明図であり、図２は基板チャックを正
面側から見た正面説明図である。この矩形基板の位置決
め装置は、例えばマスクに形成された配線パターンを基
板チャックの上面に保持された矩形基板（ガラス基板な
ど）に焼き付ける基板露光装置において、上記マスクと
矩形基板との位置合わせに際し上記基板チャックの上方
に設けられた光学系に対して矩形基板を所定の目標位置
に位置決めするもので、図１及び図２に示すように、移
動テーブル１０と、基板チャック１と、エッジセンサ３
ａ，３ｂ，３ｃ，３ｄと、データ処理回路７と、テーブ
ル駆動制御回路８とを有して成る。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view of a rectangular substrate positioning apparatus according to an embodiment of the present invention as seen from the top side of a rectangular substrate, and FIG. 2 is a front view of a substrate chuck as seen from the front side. This rectangular substrate positioning device is, for example, in a substrate exposure device that prints a wiring pattern formed on a mask onto a rectangular substrate (such as a glass substrate) held on the upper surface of a substrate chuck, when aligning the mask with the rectangular substrate. The rectangular substrate is positioned at a predetermined target position with respect to the optical system provided above the substrate chuck. As shown in FIGS. 1 and 2, the moving table 10, the substrate chuck 1, and the edge sensor 3 are arranged.
a, 3b, 3c, 3d, a data processing circuit 7, and a table drive control circuit 8.

【００１８】図２において、移動テーブル１０は、図示
外の駆動源により水平面内にてＸ方向及びＹ方向の二次
元の移動とθ方向の回転が可能とされ、Ｘ方向に移動す
るＸテーブルと、Ｙ方向に移動するＹテーブルと、θ方
向に回転するθテーブルとが上下に積み上げられてい
る。上記移動テーブル１０の上面には、基板チャック１
が固定されている。この基板チャック１は、上記移動テ
ーブル１０によってＸ，Ｙ，θ方向の移動がされると共
に、その上面には矩形基板２を載せて保持するもので、
図１に示すように矩形状に形成されている。なお、この
基板チャック１の上面には、図示省略したが上記矩形基
板２を吸着保持するための真空吸引孔が適宜の間隔で複
数個設けられている。また、上記矩形基板２は、例えば
400mm×500mm以上の大形のガラス基板であり、その周縁
部は、図１及び図２に示すように、基板チャック１の周
囲より外側に突出している。In FIG. 2, the moving table 10 is an X table that moves in the X direction by being capable of two-dimensional movement in the X and Y directions and rotation in the θ direction in a horizontal plane by a drive source (not shown). , A Y table that moves in the Y direction and a θ table that rotates in the θ direction are stacked vertically. On the upper surface of the moving table 10, the substrate chuck 1
Has been fixed. The substrate chuck 1 is moved in the X, Y and θ directions by the moving table 10 and holds the rectangular substrate 2 on the upper surface thereof.
As shown in FIG. 1, it is formed in a rectangular shape. Although not shown, a plurality of vacuum suction holes for sucking and holding the rectangular substrate 2 are provided on the upper surface of the substrate chuck 1 at appropriate intervals. The rectangular substrate 2 is, for example,
The glass substrate is a large glass substrate having a size of 400 mm × 500 mm or more, and its peripheral edge portion projects outward from the periphery of the substrate chuck 1, as shown in FIGS.

【００１９】上記基板チャック１の上方には、光学系１
１が設けられている。この光学系１１は、基板露光装置
においては露光光学系であり、基板検査装置においては
検査光学系であり、基板チャック１の上面に載置保持さ
れる矩形基板２の面上に焦点を結ぶように構成されてい
る。An optical system 1 is provided above the substrate chuck 1.
1 is provided. The optical system 11 is an exposure optical system in the substrate exposure apparatus and an inspection optical system in the substrate inspection apparatus, and focuses on the surface of the rectangular substrate 2 mounted and held on the upper surface of the substrate chuck 1. Is configured.

【００２０】ここで、本発明においては、上記矩形状の
基板チャック１の相隣り合う直交二辺の各辺の近傍に、
エッジセンサ３ａ，３ｂ；３ｃ，３ｄが互いに所定距離
だけ離れて２個ずつ配置されている。これらのエッジセ
ンサ３ａ〜３ｄは、上記基板チャック１の上面に保持さ
れた矩形基板２の相隣り合う直交二辺の各辺の周縁を光
学的に検出するもので、例えば上記矩形基板２の長辺側
に沿って第一のエッジセンサ３ａと第二のエッジセンサ
３ｂとがＹ軸方向の中心軸１２に対称に設けられ、該矩
形基板２の短辺側に沿って第三のエッジセンサ３ｃと第
四のエッジセンサ３ｄとがＸ軸方向の中心軸１３に対称
に設けられている。上記各エッジセンサ３ａ〜３ｄは、
図２に示すように、それぞれ投光部１４と受光部１５と
が矩形基板２の周縁部を挟むようにして上下に対向され
ており、上記投光部１４から例えばレーザ光を下向きに
照射して受光部１５で受光するようになっており、この
照射レーザ光が上記矩形基板２の周縁で遮断されること
によりその位置を検出するように動作する。Here, in the present invention, in the vicinity of each side of two adjacent orthogonal sides of the rectangular substrate chuck 1,
Two edge sensors 3a, 3b; 3c, 3d are arranged at a predetermined distance from each other. These edge sensors 3a to 3d optically detect the peripheral edges of two mutually adjacent orthogonal sides of the rectangular substrate 2 held on the upper surface of the substrate chuck 1, and, for example, the length of the rectangular substrate 2 is long. A first edge sensor 3a and a second edge sensor 3b are provided symmetrically with respect to the central axis 12 in the Y-axis direction along the side, and a third edge sensor 3c is provided along the short side of the rectangular substrate 2. And the fourth edge sensor 3d are provided symmetrically with respect to the central axis 13 in the X-axis direction. The above edge sensors 3a to 3d are
As shown in FIG. 2, a light projecting portion 14 and a light receiving portion 15 are vertically opposed to each other so as to sandwich the peripheral edge of the rectangular substrate 2, and the light projecting portion 14 emits, for example, laser light downward to receive light. The section 15 receives light, and the irradiation laser beam is cut off at the peripheral edge of the rectangular substrate 2 to operate to detect its position.

【００２１】なお、上記の各エッジセンサ３ａ，３ｂ；
３ｃ，３ｄはそれぞれに付設されたシリンダ４ａ，４
ｂ；４ｃ，４ｄによって矢印Ａ，Ｂ，Ｃ，Ｄのように矩
形基板２に接近、退避可能とされている。また、上記各
シリンダ４ａ，４ｂ；４ｃ，４ｄには、それぞれパルス
モータ５ａ，５ｂ；５ｃ，５ｄが付設されており、前記
エッジセンサ３ａ，３ｂ；３ｃ，３ｄが矢印Ｅ，Ｆ；
Ｇ，Ｈのように矩形基板２の周縁を検出するためのスキ
ャン動作が可能とされている。さらに、上記各エッジセ
ンサ３ａ，３ｂ；３ｃ，３ｄで検出した検出信号は、図
１に示す検出回路６で取り込まれるようになっている。
なお、この検出回路６は、上記各エッジセンサ３ａ〜３
ｄに対応して区分されており、１対１で検出信号を受け
渡しするようになっている。Each of the above edge sensors 3a and 3b;
3c and 3d are cylinders 4a and 4 attached to them, respectively.
b; 4c and 4d allow the rectangular substrate 2 to approach and retract as shown by arrows A, B, C, and D. Further, pulse motors 5a, 5b; 5c, 5d are attached to the cylinders 4a, 4b; 4c, 4d, respectively, and the edge sensors 3a, 3b; 3c, 3d are indicated by arrows E, F;
A scan operation for detecting the peripheral edge of the rectangular substrate 2 as in G and H is possible. Further, the detection signals detected by the respective edge sensors 3a, 3b; 3c, 3d are taken in by the detection circuit 6 shown in FIG.
It should be noted that this detection circuit 6 is configured so that each of the edge sensors 3a-3
It is divided corresponding to d, and the detection signals are delivered in a one-to-one manner.

【００２２】また、上記検出回路６の出力側には、デー
タ処理制御回路８及びテーブル駆動制御回路９が設けら
れている。上記データ処理制御回路８は、検出回路６で
取り込んだ各エッジセンサ３ａ〜３ｄの検出信号を入力
して前記矩形基板２の所定の直交二辺についてそのＸ方
向，Ｙ方向の位置及びθ方向の角度を認識し、所定の目
標位置に対するずれ量を認識すると共にそれをゼロにす
るための位置補正処理を実行するもので、その内部には
演算処理装置としてのＭＰＵとメモリなどが設けられ、
補正処理信号Ｓ1を出力するようになっている。テーブ
ル駆動制御回路９は、上記データ処理制御回路８から出
力された補正処理信号Ｓ1を入力して前記移動テーブル
１０を該補正処理信号Ｓ1に対応する量だけＸ，Ｙ，θ
方向に移動させるもので、上記移動テーブル１０に対し
駆動制御信号Ｓ2を送出するようになっている。A data processing control circuit 8 and a table drive control circuit 9 are provided on the output side of the detection circuit 6. The data processing control circuit 8 inputs the detection signals of the edge sensors 3a to 3d fetched by the detection circuit 6 and detects the predetermined two orthogonal sides of the rectangular substrate 2 in the X direction, the Y direction, and the θ direction. It recognizes the angle, recognizes the amount of deviation with respect to a predetermined target position, and executes position correction processing to make it zero. Inside, an MPU as an arithmetic processing unit and a memory are provided.
The correction processing signal S 1 is output. The table drive control circuit 9 receives the correction processing signal S 1 output from the data processing control circuit 8 and inputs the correction processing signal S 1 to the moving table 10 by an amount corresponding to the correction processing signal S 1 X, Y, θ.
In order to move in the direction, the drive control signal S 2 is sent to the moving table 10.

【００２３】そして、上記データ処理制御回路８とテー
ブル駆動制御回路９とで、上記２個ずつのエッジセンサ
３ａ，３ｂ；３ｃ，３ｄで検出した矩形基板２の直交二
辺の周縁の位置信号を取り込んでそのＸ方向、Ｙ方向の
位置及びθ方向の角度を認識し該矩形基板２の目標位置
に対して位置を補正する位置補正手段を構成している。Then, the data processing control circuit 8 and the table drive control circuit 9 send the position signals of the peripheral edges of the two orthogonal sides of the rectangular substrate 2 detected by the two edge sensors 3a, 3b; 3c, 3d. A position correcting means is provided for taking in and recognizing the position in the X and Y directions and the angle in the θ direction and correcting the position with respect to the target position of the rectangular substrate 2.

【００２４】次に、このように構成された本発明による
矩形基板の位置決め装置の動作について、図１〜図３を
参照して説明する。まず、図示省略のロボットハンドに
よってローダ部から１枚ずつ矩形基板２を取り出し、所
定の経路で搬送して、図１に矢印Ｊで示すように送り出
して基板チャック１の上面に載置する。このとき、上記
ロボットハンドの搬送によるバラツキによって、矩形基
板２が所定の目標位置に対して図３に示すように位置ず
れを起こすことがある。Next, the operation of the positioning device for a rectangular substrate according to the present invention thus constructed will be described with reference to FIGS. First, the rectangular substrates 2 are taken out one by one from the loader section by a robot hand (not shown), conveyed on a predetermined path, sent out as indicated by an arrow J in FIG. 1, and placed on the upper surface of the substrate chuck 1. At this time, the rectangular substrate 2 may be displaced from a predetermined target position as shown in FIG. 3 due to variations caused by the transportation of the robot hand.

【００２５】次に、図１に示す各エッジセンサ３ａ，３
ｂ；３ｃ，３ｄは、それぞれ矢印Ａ，Ｂ，Ｃ，Ｄに示す
ように矩形基板２に接近した状態から、さらに矢印Ｅ，
Ｆ，Ｇ，Ｈのようにスキャン動作をして直交二辺の各辺
の周縁を光学的に検出する。すなわち、図３に示すよう
に、第一のエッジセンサ３ａは点Ｐ1(ｘ1，ｙ1）を検出
し、第二のエッジセンサ３ｂは点Ｐ2(ｘ2，ｙ2）を検出
し、第三のエッジセンサ３ｃは点Ｐ3(ｘ3，ｙ3）を検出
し、第四ののエッジセンサ３ｄは点Ｐ4(ｘ4，ｙ4）を検
出する。そして、これらの信号検出は、図１に示す検出
回路６で行われる。Next, the edge sensors 3a and 3 shown in FIG.
b; 3c and 3d indicate that arrows E, B, C, and D, respectively, from the state in which they approach the rectangular substrate 2 as shown by arrows A, B, C, and D, respectively.
The scanning operation is performed as in F, G, and H, and the periphery of each of the two orthogonal sides is optically detected. That is, as shown in FIG. 3, the first edge sensor 3a detects the point P 1 (x 1 , y 1 ) and the second edge sensor 3b detects the point P 2 (x 2 , y 2 ). , The third edge sensor 3c detects the point P 3 (x 3 , y 3 ), and the fourth edge sensor 3d detects the point P 4 (x 4 , y 4 ). The detection of these signals is performed by the detection circuit 6 shown in FIG.

【００２６】いま、図１に示す矩形基板２の直交二辺の
長辺側をＸ軸方向に対する傾き角θを認識する基準ライ
ンとすると、この場合は、図３に示すように検出した矩
形基板２のＸ軸方向の現在位置は点Ｐ3とＰ4のＸ座標か
ら（ｘ3＋ｘ4）／２となり、Ｙ軸方向の現在位置は点Ｐ
1とＰ2のＹ座標から（ｙ1＋ｙ2）／２となる。また、該
矩形基板２の中心軸７のＸ軸方向（符号１３参照）に対
する傾き角θは、同じく点Ｐ1とＰ2のＸ，Ｙ座標から、 となる。なお、この式（３）は、前述の式（１）と全く
同じである。Now, assuming that the long side of the two orthogonal sides of the rectangular substrate 2 shown in FIG. 1 is the reference line for recognizing the tilt angle θ with respect to the X-axis direction, in this case, the rectangular substrate detected as shown in FIG. The current position in the X-axis direction of 2 is (x 3 + x 4 ) / 2 from the X-coordinates of the points P 3 and P 4 , and the current position in the Y-axis direction is the point P.
From the Y coordinate of 1 and P 2 , it becomes (y 1 + y 2 ) / 2. Further, the inclination angle θ of the central axis 7 of the rectangular substrate 2 with respect to the X-axis direction (see reference numeral 13) is calculated from the X and Y coordinates of the points P 1 and P 2 as well. Becomes The expression (3) is exactly the same as the above-mentioned expression (1).

【００２７】また、図１において、上記矩形基板２の所
定の目標位置をＸ軸方向では座標ｘ0の原点Ｑとし、Ｙ
軸方向では座標ｙ0の原点Ｒとすると、図３に示すよう
に搬送して載置された矩形基板２については、Ｘ軸方向
のずれ量は｛ｘ0−(ｘ3＋ｘ4)／２｝となり、Ｙ軸方向
のずれ量は｛ｙ0−(ｙ1＋ｙ2)／２｝となる。そして、
該矩形基板２のＸ軸方向に対する傾き角θは上述の式
（３）のとおりである。これらにより、上記搬送して載
置された矩形基板２の所定の目標位置に対するずれ量が
わかるので、このずれ量がゼロとなるようにすればよ
い。Further, in FIG. 1, a predetermined target position of the rectangular substrate 2 is an origin Q of a coordinate x 0 in the X-axis direction, and Y
Assuming that the origin R of the coordinate y 0 in the axial direction is the rectangular substrate 2 transported and placed as shown in FIG. 3, the shift amount in the X-axis direction is {x 0 − (x 3 + x 4 ) / 2. }, And the shift amount in the Y-axis direction is {y 0 − (y 1 + y 2 ) / 2}. And
The tilt angle θ of the rectangular substrate 2 with respect to the X-axis direction is as shown in the above-mentioned formula (3). From these, the amount of deviation of the conveyed and placed rectangular substrate 2 with respect to a predetermined target position can be known, so this amount of deviation can be made zero.

【００２８】そのため、図１に示すデータ処理制御回路
８で上記の各ずれ量を認識し、それをゼロにするための
位置補正処理を実行し、補正処理信号Ｓ1をテーブル駆
動制御回路９へ送出する。そして、このテーブル駆動制
御回路９は、前記基板チャック１を支持している移動テ
ーブル１０（図２参照）へ駆動制御信号Ｓ2を送出し、
該移動テーブルを上記の補正処理信号Ｓ1に対応する量
だけＸ方向及びＹ方向に移動し、並びにθ方向に回転さ
せる。これにより、図１において、上記矩形基板２の直
交二辺の周縁がそれぞれ原点Ｑ，Ｒに一致すると共に、
傾きもゼロとなって、所定の目標位置に合致して位置決
めされる。Therefore, the data processing control circuit 8 shown in FIG. 1 recognizes each of the above-mentioned deviation amounts, executes the position correction processing for making them zero, and sends the correction processing signal S 1 to the table drive control circuit 9. Send out. Then, the table drive control circuit 9 sends a drive control signal S 2 to the moving table 10 (see FIG. 2) supporting the substrate chuck 1,
The moving table is moved in the X and Y directions by an amount corresponding to the correction processing signal S 1 and is rotated in the θ direction. As a result, in FIG. 1, the peripheral edges of the two orthogonal sides of the rectangular substrate 2 coincide with the origins Q and R, respectively, and
The inclination is also zero, and positioning is performed in conformity with a predetermined target position.

【００２９】次に、上述の場合と異なり、ユーザの要求
により、上記矩形基板２の直交二辺の短辺側をＸ軸方向
に対する傾き角θを認識する基準ラインとして指定され
た場合について説明する。このとき、従来と異なり、図
１に示すように矩形基板２の直交二辺の長辺側にも短辺
側にも予め２個ずつのエッジセンサ３ａ，３ｂ；３ｃ，
３ｄが設けられているので、特に設計変更により配置替
えをする必要はない。従って、前回と同様にして各エッ
ジセンサ３ａ，３ｂ；３ｃ，３ｄにより矩形基板２の直
交二辺の各辺の周縁を光学的に検出する。この場合も、
図３に示すように検出した矩形基板２のＸ軸方向の現在
位置は点Ｐ3とＰ4のＸ座標から（ｘ3＋ｘ4）／２とな
り、Ｙ軸方向の現在位置は点Ｐ1とＰ2のＹ座標から（ｙ
1＋ｙ2）／２となる。また、該矩形基板２の中心軸７の
Ｘ軸方向（符号１３参照）に対する傾き角θは、今度は
上記点Ｐ3とＰ4のＸ，Ｙ座標から、 となる。すなわち、この場合は、傾き角θの検出用とし
て第三のエッジセンサ３ｃと第四のエッジセンサ３ｄと
に切り換えて使用すればよい。Next, unlike the case described above, a case where the short side of the two orthogonal sides of the rectangular substrate 2 is designated as a reference line for recognizing the inclination angle θ with respect to the X-axis direction will be described according to a user's request. . At this time, unlike the conventional case, as shown in FIG. 1, two edge sensors 3a, 3b;
Since 3d is provided, there is no need to change the layout due to a design change. Therefore, similarly to the previous time, the edge sensors 3a, 3b; 3c, 3d optically detect the peripheral edges of the two orthogonal sides of the rectangular substrate 2. Again,
As shown in FIG. 3, the detected current position of the rectangular substrate 2 in the X-axis direction is (x 3 + x 4 ) / 2 from the X coordinates of the points P 3 and P 4 , and the current position in the Y-axis direction is the point P 1 From the Y coordinate of P 2 , (y
It becomes 1 + y 2 ) / 2. Further, the tilt angle θ of the central axis 7 of the rectangular substrate 2 with respect to the X-axis direction (see reference numeral 13) is calculated from the X and Y coordinates of the points P 3 and P 4 as follows. Becomes That is, in this case, the third edge sensor 3c and the fourth edge sensor 3d may be switched and used for detecting the tilt angle θ.

【００３０】この場合においても、図１において、上記
矩形基板２の所定の目標位置をＸ軸方向では座標ｘ0の
原点Ｑとし、Ｙ軸方向では座標ｙ0の原点Ｒとすると、
図３に示すように搬送して載置された矩形基板２につい
ては、前述と同様に、Ｘ軸方向のずれ量は｛ｘ0−(ｘ3
＋ｘ4)／２｝となり、Ｙ軸方向のずれ量は｛ｙ0−(ｙ1
＋ｙ2)／２｝となる。そして、該矩形基板２のＸ軸方向
に対する傾き角θは上述の式（４）のとおりである。こ
れらにより、上記搬送して載置された矩形基板２の所定
の目標位置に対するずれ量がわかるので、このずれ量が
ゼロとなるように前述と同様にデータ処理回路８及びテ
ーブル駆動制御回路９で位置補正処理を実行する。これ
により、所定の目標位置に合致して位置決めされる。Also in this case, in FIG. 1, when the predetermined target position of the rectangular substrate 2 is the origin Q of the coordinate x 0 in the X-axis direction and the origin R of the coordinate y 0 in the Y-axis direction,
With respect to the rectangular substrate 2 that is conveyed and placed as shown in FIG. 3, the amount of deviation in the X-axis direction is {x 0 − (x 3
+ X 4 ) / 2}, and the shift amount in the Y-axis direction is {y 0 − (y 1
+ Y 2 ) / 2}. Then, the inclination angle θ of the rectangular substrate 2 with respect to the X-axis direction is as shown in the above equation (4). From these, the amount of deviation of the conveyed and placed rectangular substrate 2 with respect to a predetermined target position is known. Therefore, the data processing circuit 8 and the table drive control circuit 9 are set in the same manner as described above so that the amount of deviation becomes zero. Position correction processing is executed. As a result, positioning is performed in conformity with the predetermined target position.

【００３１】以上のように本発明による矩形基板の位置
決め装置によれば、位置決めする対象の矩形基板２のθ
方向の角度を認識する基準ラインとして該矩形基板２の
直交二辺のどちらの辺をとるかによって上記２個ずつの
エッジセンサ３ａ，３ｂ；３ｃ，３ｄの組を互いに切り
換えて使用し、その矩形基板２のθ方向の角度の認識及
び補正をすることができる。As described above, according to the rectangular substrate positioning apparatus of the present invention, θ of the rectangular substrate 2 to be positioned is determined.
Depending on which of the two orthogonal sides of the rectangular substrate 2 is taken as the reference line for recognizing the angle of the direction, the two edge sensors 3a, 3b; The angle of the substrate 2 in the θ direction can be recognized and corrected.

【００３２】なお、以上の説明においては、各エッジセ
ンサ３ａ〜３ｄは、投光部１４と受光部１５とを所定間
隔離して上下に対向させた透過型の光学センサとした
が、本発明はこれに限らず、投光部１４と受光部１５と
を矩形基板２の同一面側に隣接して設け反射光を受光す
るようにした反射型の光学センサとしてもよい。また、
図１においては、基板チャック１は大きく移動せず、各
エッジセンサ３ａ〜３ｄを矩形基板２側に移動してその
周縁を検出するようにしているが、これに限定されるこ
となく、上記各エッジセンサ３ａ〜３ｄを矩形基板２の
位置決めすべき原点位置に固定しておき、上記基板チャ
ック１を移動させて上記矩形基板２の位置を補正するよ
うにしてもよい。In the above description, each of the edge sensors 3a to 3d is a transmission type optical sensor in which the light projecting portion 14 and the light receiving portion 15 are separated by a predetermined distance and are vertically opposed to each other. The present invention is not limited to this, and may be a reflection type optical sensor in which the light projecting unit 14 and the light receiving unit 15 are provided adjacent to each other on the same surface side of the rectangular substrate 2 to receive reflected light. Also,
In FIG. 1, the substrate chuck 1 does not move largely, and the edge sensors 3a to 3d are moved to the rectangular substrate 2 side to detect the peripheral edge thereof, but the invention is not limited to this, and The edge sensors 3a to 3d may be fixed to the origin position of the rectangular substrate 2 to be positioned, and the substrate chuck 1 may be moved to correct the position of the rectangular substrate 2.

【００３３】[0033]

【発明の効果】本発明は以上のように構成されたので、
矩形状の基板チャックの相隣り合う直交二辺の各辺の近
傍には該基板チャックの上面に保持された矩形基板の相
隣り合う直交二辺の各辺の周縁を光学的に検出するエッ
ジセンサを所定距離だけ離して２個ずつ配置すると共
に、上記２個ずつのエッジセンサで検出した矩形基板の
直交二辺の周縁の位置信号を取り込んでそのＸ方向，Ｙ
方向の位置及びθ方向の角度を認識し該矩形基板の目標
位置に対して位置を補正する位置補正手段を設けたこと
により、上記矩形基板のθ方向の角度を認識する基準ラ
インとして該矩形基板の直交二辺のどちらの辺をとるか
によって上記２個ずつのエッジセンサを互いに切り換え
て使用し、その矩形基板のθ方向の角度の認識及び補正
をすることができる。従って、従来のように、ユーザ要
求の相違により傾き角θの基準ラインが変化した場合
に、その都度直交二辺のどちらの辺側に２個のエッジセ
ンサを配置するのか設計変更してその取付位置を変える
必要はない。また、図１に示すデータ処理制御回路内の
例えば位置補正処理プログラムの計算式も変更する必要
はない。このことから、本発明による矩形基板の位置決
め装置によれば、ユーザ要求により異なる位置決めの基
準ラインの変化に容易に且つ短時間で対応することがで
き、さらに費用も節減することができる。Since the present invention is constructed as described above,
An edge sensor for optically detecting a peripheral edge of each of two adjacent orthogonal sides of a rectangular substrate held on the upper surface of the substrate chuck is provided near each of two adjacent orthogonal sides of the rectangular substrate chuck. Are arranged at a predetermined distance apart from each other, and the position signals of the peripheral edges of two orthogonal sides of the rectangular substrate detected by the above-mentioned two edge sensors are taken in to obtain the X direction and the Y direction.
By providing position correction means for recognizing the position in the direction and the angle in the θ direction and correcting the position with respect to the target position of the rectangular substrate, the rectangular substrate is used as a reference line for recognizing the angle in the θ direction of the rectangular substrate. The two edge sensors can be used by switching each other depending on which side of the two orthogonal sides is taken, and the angle in the θ direction of the rectangular substrate can be recognized and corrected. Therefore, as in the conventional case, when the reference line of the inclination angle θ changes due to the difference in user's request, which side of the two orthogonal sides each time the two edge sensors are arranged is changed in design and its attachment. There is no need to change position. Further, it is not necessary to change the calculation formula of, for example, the position correction processing program in the data processing control circuit shown in FIG. Therefore, according to the rectangular substrate positioning apparatus of the present invention, it is possible to easily and quickly respond to a change in the reference line for different positioning depending on the user's request, and further it is possible to reduce the cost.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明による矩形基板の位置決め装置の実施形
態を示す矩形基板の上面側から見た平面説明図である。FIG. 1 is an explanatory plan view of a rectangular substrate positioning apparatus according to an embodiment of the present invention as seen from the top side of a rectangular substrate.

【図２】基板チャックを正面側から見た正面説明図であ
る。FIG. 2 is a front explanatory view of the substrate chuck viewed from the front side.

【図３】矩形基板の位置決め動作を示す平面説明図であ
る。FIG. 3 is an explanatory plan view showing a positioning operation of a rectangular substrate.

【図４】従来例による矩形基板の位置決め装置を示す矩
形基板の上面側から見た平面説明図である。FIG. 4 is an explanatory plan view of a rectangular substrate positioning device according to a conventional example as seen from the upper surface side of the rectangular substrate.

【図５】従来例において或るユーザ要求の基準ラインに
対応した矩形基板の位置決め動作を示す平面説明図であ
る。FIG. 5 is an explanatory plan view showing a positioning operation of a rectangular substrate corresponding to a reference line requested by a user in a conventional example.

【図６】同じく従来例において他のユーザ要求の基準ラ
インに対応した矩形基板の位置決め動作を示す平面説明
図である。FIG. 6 is a plan view illustrating a positioning operation of a rectangular substrate corresponding to another user-requested reference line in the conventional example.

【符号の説明】[Explanation of symbols]

１…基板チャック ２…矩形基板 ３ａ〜３ｄ…エッジセンサ ４ａ〜４ｄ…シリンダ ５ａ〜５ｄ…パルスモータ ６…検出回路 ８…データ処理制御回路 ９…テーブル駆動制御回路 １０…移動テーブル １１…光学系 １４…投光部 １５…受光部 DESCRIPTION OF SYMBOLS 1 ... Substrate chuck 2 ... Rectangular substrate 3a-3d ... Edge sensor 4a-4d ... Cylinder 5a-5d ... Pulse motor 6 ... Detection circuit 8 ... Data processing control circuit 9 ... Table drive control circuit 10 ... Moving table 11 ... Optical system 14 … Emitting section 15… Receiving section

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 Ｘ方向及びＹ方向の二次元の移動とθ方
向の回転が可能な移動テーブルと、この移動テーブルの
上面に固定され該移動テーブルによってＸ，Ｙ，θ方向
の移動がされると共に上面には矩形基板を載せて保持す
る矩形状の基板チャックとを有し、この基板チャックの
上方に設けられた光学系に対して上記矩形基板を所定の
目標位置に位置決めする矩形基板の位置決め装置におい
て、上記矩形状の基板チャックの相隣り合う直交二辺の
各辺の近傍には該基板チャックの上面に保持された矩形
基板の相隣り合う直交二辺の各辺の周縁を光学的に検出
するエッジセンサを所定距離だけ離して２個ずつ配置す
ると共に、上記２個ずつのエッジセンサで検出した矩形
基板の直交二辺の周縁の位置信号を取り込んでそのＸ方
向，Ｙ方向の位置及びθ方向の角度を認識し該矩形基板
の目標位置に対して位置を補正する位置補正手段を設
け、上記矩形基板のθ方向の角度を認識する基準ライン
として該矩形基板の直交二辺のどちらの辺をとるかによ
って上記２個ずつのエッジセンサを互いに切り換えて使
用し、その矩形基板のθ方向の角度の認識及び補正をす
るようにしたことを特徴とする矩形基板の位置決め装
置。1. A moving table capable of two-dimensional movement in the X and Y directions and rotation in the θ direction, and a moving table fixed on the upper surface of the moving table to move in the X, Y and θ directions. A rectangular substrate chuck for mounting and holding a rectangular substrate is also provided on the upper surface, and the rectangular substrate is positioned at a predetermined target position with respect to an optical system provided above the substrate chuck. In the apparatus, in the vicinity of each side of two adjacent orthogonal sides of the rectangular substrate chuck, the peripheral edge of each side of two adjacent orthogonal sides of the rectangular substrate held on the upper surface of the substrate chuck is optically arranged. The two edge sensors to be detected are arranged at a predetermined distance from each other, and the position signals in the X and Y directions are taken in by capturing the position signals of the edges of the two orthogonal sides of the rectangular substrate detected by the two edge sensors. Position correction means for recognizing the angle in the θ direction and correcting the position with respect to the target position of the rectangular substrate is provided, and one of two orthogonal sides of the rectangular substrate is used as a reference line for recognizing the angle in the θ direction of the rectangular substrate. A positioning device for a rectangular substrate, characterized in that the two edge sensors are switched each other depending on whether a side is taken, and the angle of the rectangular substrate in the θ direction is recognized and corrected. 【請求項２】 上記各エッジセンサは、基板チャックの
上面に保持された矩形基板の対応する辺に対し、接近又
は退避可能とすると共に、その接近位置にて上記辺の周
縁を光学的に検出するためのスキャン動作が可能とした
ことを特徴とする請求項１記載の矩形基板の位置決め装
置。2. Each of the edge sensors is capable of approaching or retracting with respect to a corresponding side of a rectangular substrate held on the upper surface of the substrate chuck, and optically detecting a peripheral edge of the side at the approaching position. The rectangular substrate positioning apparatus according to claim 1, wherein a scanning operation for performing the scanning is possible. 【請求項３】 上記各エッジセンサは、透過型又は反
射型の光学センサであることを特徴とする請求項１又は
２記載の矩形基板の位置決め装置。3. The positioning device for a rectangular substrate according to claim 1, wherein each of the edge sensors is a transmissive or reflective optical sensor.
JP7331175A 1995-11-28 1995-11-28 Positioning device for rectangular substrate Pending JPH09152569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7331175A JPH09152569A (en) 1995-11-28 1995-11-28 Positioning device for rectangular substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7331175A JPH09152569A (en) 1995-11-28 1995-11-28 Positioning device for rectangular substrate

Publications (1)

Publication Number Publication Date
JPH09152569A true JPH09152569A (en) 1997-06-10

Family

ID=18240731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7331175A Pending JPH09152569A (en) 1995-11-28 1995-11-28 Positioning device for rectangular substrate

Country Status (1)

Country Link
JP (1) JPH09152569A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000039787A (en) * 1998-12-16 2000-07-05 김영환 Apparatus for detecting alignment of alignment unit
EP1278103A1 (en) * 2001-07-20 2003-01-22 ASML Netherlands B.V. Lithographic apparatus
EP1458013A1 (en) * 2003-02-20 2004-09-15 Applied Materials, Inc. A method and an apparatus for determining a position of a substrate relative to a support stage
US6795164B2 (en) 2001-07-20 2004-09-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7104535B2 (en) 2003-02-20 2006-09-12 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
US7151981B2 (en) 2003-02-20 2006-12-19 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
JP2007057813A (en) * 2005-08-24 2007-03-08 Hitachi Kokusai Electric Inc Positioning method of substrate, and sample stage using same, and dimension measuring device or substrate processing device
US7372250B2 (en) 2003-02-20 2008-05-13 Applied Materials, Inc. Methods and apparatus for determining a position of a substrate relative to a support stage
US7499767B2 (en) 2003-02-20 2009-03-03 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
JP2012106330A (en) * 2010-10-27 2012-06-07 Takeda Kikai:Kk Measuring instrument
CN102768976A (en) * 2011-05-05 2012-11-07 上海微电子装备有限公司 Prealignment device and method for substrate
EP2284609A3 (en) * 2009-08-14 2013-05-29 E. I. du Pont de Nemours and Company Method for preparing a composite printing form
CN103293867A (en) * 2012-03-05 2013-09-11 上海微电子装备有限公司 Pre-alignment device and method of square substrates
CN105278266A (en) * 2014-07-07 2016-01-27 上海微电子装备有限公司 Deviation detection and correction method for glass substrate
CN106364875A (en) * 2015-07-23 2017-02-01 旭东机械工业股份有限公司 Alignment mechanism for base plate

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000039787A (en) * 1998-12-16 2000-07-05 김영환 Apparatus for detecting alignment of alignment unit
US6795164B2 (en) 2001-07-20 2004-09-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
EP1278103A1 (en) * 2001-07-20 2003-01-22 ASML Netherlands B.V. Lithographic apparatus
US7372250B2 (en) 2003-02-20 2008-05-13 Applied Materials, Inc. Methods and apparatus for determining a position of a substrate relative to a support stage
US7151981B2 (en) 2003-02-20 2006-12-19 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
CN100382269C (en) * 2003-02-20 2008-04-16 应用材料有限公司 Method for defining substrate position prelatively to supporting table and equipment
EP1458013A1 (en) * 2003-02-20 2004-09-15 Applied Materials, Inc. A method and an apparatus for determining a position of a substrate relative to a support stage
US7499767B2 (en) 2003-02-20 2009-03-03 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
US7104535B2 (en) 2003-02-20 2006-09-12 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
JP2007057813A (en) * 2005-08-24 2007-03-08 Hitachi Kokusai Electric Inc Positioning method of substrate, and sample stage using same, and dimension measuring device or substrate processing device
EP2284609A3 (en) * 2009-08-14 2013-05-29 E. I. du Pont de Nemours and Company Method for preparing a composite printing form
US8822135B2 (en) 2009-08-14 2014-09-02 E. I. Dupont De Nemours And Company Method for preparing a composite printing form
JP2012106330A (en) * 2010-10-27 2012-06-07 Takeda Kikai:Kk Measuring instrument
CN102768976A (en) * 2011-05-05 2012-11-07 上海微电子装备有限公司 Prealignment device and method for substrate
CN103293867A (en) * 2012-03-05 2013-09-11 上海微电子装备有限公司 Pre-alignment device and method of square substrates
CN105278266A (en) * 2014-07-07 2016-01-27 上海微电子装备有限公司 Deviation detection and correction method for glass substrate
CN105278266B (en) * 2014-07-07 2018-03-02 上海微电子装备（集团）股份有限公司 The separate-blas estimation and modification method of a kind of glass substrate
CN106364875A (en) * 2015-07-23 2017-02-01 旭东机械工业股份有限公司 Alignment mechanism for base plate

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