JPH09133474A - Instrument for loading ceramic molded body - Google Patents
Instrument for loading ceramic molded bodyInfo
- Publication number
- JPH09133474A JPH09133474A JP7314794A JP31479495A JPH09133474A JP H09133474 A JPH09133474 A JP H09133474A JP 7314794 A JP7314794 A JP 7314794A JP 31479495 A JP31479495 A JP 31479495A JP H09133474 A JPH09133474 A JP H09133474A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic molded
- molded body
- binder
- loading device
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Furnace Charging Or Discharging (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、セラミック成形体
の積載用器具に関し、特にセラミック成形体中のバイン
ダーを除去する際に用いるセラミック成形体の積載用器
具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for loading a ceramic molded body, and more particularly to a device for loading a ceramic molded body used when removing a binder in the ceramic molded body.
【０００２】[0002]
【従来の技術】従来、積層セラミックコンデンサなどの
セラミック成形体は次の通りに製造している。すなわ
ち、先ず、セラミック誘電体材料と有機バインダーとを
混合し、シート状に成形する。次に、このシートの表面
に銀パラジウムと有機バインダーとからなる内部用電極
の材料を印刷する。そしてこのシートを複数枚積層し、
圧着し、所定の大きさに切断してコンデンサ素子を形成
する。切断後、バレル研磨してコンデンサ素子の角部を
削り取る。さらに、バレル研磨後のコンデンサ素子２０
を平板状や、図６に示す通りみぞ形の断面をした、アル
ミナ製等の積載用器具２１に載せ、加熱してバインダー
を除去する。バインダーを除去後、再度、仕上げとして
のバレル研磨を行い、焼成し、端子用電極を形成する。2. Description of the Related Art Conventionally, a ceramic molded body such as a monolithic ceramic capacitor is manufactured as follows. That is, first, a ceramic dielectric material and an organic binder are mixed and molded into a sheet. Next, a material for an internal electrode composed of silver palladium and an organic binder is printed on the surface of this sheet. And stacking multiple sheets of this sheet,
It is crimped and cut into a predetermined size to form a capacitor element. After cutting, barrel polishing is performed to scrape off the corners of the capacitor element. Furthermore, the capacitor element 20 after barrel polishing
Is placed on a loading tool 21 made of alumina or the like having a flat plate shape or a groove-shaped cross section as shown in FIG. 6 and heated to remove the binder. After removing the binder, barrel polishing as a finish is performed again and firing is performed to form a terminal electrode.
【０００３】[0003]
【発明が解決しようとする課題】ところで、バレル研磨
後のコンデンサ素子を加熱してバインダーを除去するに
は十分な酸素を供給する必要がある。しかし、従来の積
載用器具は、コンデンサ素子を載せる面が平坦であり、
通気性が良くない。そのため、一度に多くのコンデンサ
素子を処理できず、コンデンサ素子からバインダーを除
去するのに時間がかかる問題点がある。By the way, it is necessary to supply sufficient oxygen to heat the capacitor element after barrel polishing to remove the binder. However, in the conventional loading device, the surface on which the capacitor element is placed is flat,
Breathability is not good. Therefore, many capacitor elements cannot be processed at one time, and it takes time to remove the binder from the capacitor elements.
【０００４】本発明は、以上の問題点を改良でき、セラ
ミック成形体のバインダーの除去処理を容易に行え、そ
の処理時間を短縮できるセラミック成形体の積載用器具
を提供することを課題とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus for loading a ceramic molded body, which can solve the above problems, can easily remove the binder from the ceramic molded body, and can shorten the processing time.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記の課題を
達成するために、セラミック成形体の積載用器具におい
て、少なくともセラミック成形体を載せる面に貫通孔ま
たは凹凸の少なくともどちらか一方を設けることを特徴
とするセラミック成形体の積載用器具を提供するもので
ある。In order to achieve the above-mentioned object, the present invention provides at least one of a through hole and unevenness on a surface on which a ceramic molded body is placed, in a ceramic molded body loading device. The present invention provides a device for loading a ceramic molded body characterized by the above.
【０００６】本発明によれば、セラミック成形体を載せ
る面に設けた貫通孔から空気が送られ、また凹部にも空
気が入りやすく、セラミック成形体中のバインダーが、
空気中の酸素と速やかに化合して熱分解反応し、除去さ
れる。According to the present invention, air is sent from the through holes provided on the surface on which the ceramic molded body is placed, and the air easily enters the recesses, so that the binder in the ceramic molded body is
It is quickly combined with oxygen in the air to undergo a thermal decomposition reaction and is removed.
【０００７】[0007]
【発明の実施の形態】本発明の積載用器具は、平板状や
みぞ形の断面状等の形状であり、少なくともセラミック
成形体を載せる面に貫通孔を設けるか、その面を凹凸状
にするか、あるいは貫通孔を設けかつ凹凸状にする。平
板状の積載用器具では、セラミック成形体を載せる面だ
けではなく、反対側の面をも凹凸状にする方が好まし
い。また、みぞ形の断面形状の積載用器具の場合には、
貫通孔をセラミック成形体を載せる平板部だけにではな
く、両端に形成した突起部にも設ける方が好ましい。さ
らに、貫通孔と凹凸とは併用する方が好ましい。BEST MODE FOR CARRYING OUT THE INVENTION The loading device of the present invention has a shape such as a flat plate shape or a groove shape in cross section, and at least a through hole is provided on the surface on which the ceramic molded body is placed or the surface is made uneven. Alternatively, a through hole is provided and the surface is made uneven. In a flat loading device, it is preferable that not only the surface on which the ceramic molded body is placed but also the opposite surface is made uneven. Also, in the case of loading equipment with a groove-shaped cross-section,
It is preferable to provide the through holes not only in the flat plate portion on which the ceramic molded body is placed, but also in the protruding portions formed at both ends. Further, it is preferable to use the through holes and the unevenness together.
【０００８】[0008]
【実施例】以下、本発明を図示の実施例に基づいて説明
する。図１において、１は、アルミナ製のみぞ形の断面
をした、セラミック成形体の積載用器具である。この積
載用器具１は、底部の平板部２が厚さ５mm、幅１００m
m、長さ１５０mmで、両端の突起部３が厚さ５mm、平板
部２からの高さ５mm、長さ１５０mmの大きさになってい
る。４はこの積載用器具１の平板部２及び突起部３に５
mm間隔で設けた孔径１mmの貫通孔である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. In FIG. 1, reference numeral 1 is a ceramic molded article loading device having a groove-shaped cross section made of alumina. In this loading device 1, the flat plate portion 2 at the bottom has a thickness of 5 mm and a width of 100 m.
The size is m, the length is 150 mm, the protrusions 3 at both ends have a thickness of 5 mm, the height from the flat plate portion 2 is 5 mm, and the length is 150 mm. 4 is attached to the flat plate portion 2 and the protruding portion 3 of the loading device 1
It is a through hole with a hole diameter of 1 mm provided at mm intervals.
【０００９】この実施例では、平板部２と突起部３の両
方に設けた貫通孔４から空気が流入するため、図２に示
す通り、積載用器具１にチップ状のセラミック成形体５
を載せた場合、各セラミック成形体５間に流入する空気
量が多くなる。そのため、熱分解反応を起こしやすくな
り、バインダーを速く除去できる。In this embodiment, since air flows in through the through holes 4 provided in both the flat plate portion 2 and the projection portion 3, as shown in FIG.
, The amount of air flowing between the ceramic molded bodies 5 increases. Therefore, the thermal decomposition reaction is likely to occur, and the binder can be removed quickly.
【００１０】また、図３は本発明の他の実施例の積載用
器具６を示し、図１の実施例と同様にみぞ形の断面にな
っていて、特に、平板部７のセラミック成形体を載せる
面を凹凸状に成形している。この積載用器具６において
も、凹凸部８に空気が流入しやすく、バインダーを速く
除去できる。FIG. 3 shows a loading device 6 according to another embodiment of the present invention, which has a groove-shaped cross section as in the embodiment of FIG. The surface on which it is placed is shaped to be uneven. Also in this loading device 6, air easily flows into the uneven portion 8 and the binder can be quickly removed.
【００１１】図４も本発明の他の実施例の積載用器具９
を示す。この積載用器具９は、みぞ形の断面になってい
て、特に、平板部１０と突起部１１とに貫通孔１２を設
けるとともに、平板部１０のセラミック成形体を載せる
面を凹凸状にしている。従って、貫通孔１２だけを設け
た場合または凹凸状だけにした場合に比較して、より一
層空気が流入しやすく、バインダーを速く除去できる。FIG. 4 also shows a loading device 9 according to another embodiment of the present invention.
Is shown. This loading device 9 has a groove-shaped cross section, and in particular, the through hole 12 is provided in the flat plate portion 10 and the projection portion 11, and the surface of the flat plate portion 10 on which the ceramic molded body is placed is made uneven. . Therefore, as compared with the case where only the through holes 12 are provided or the case where only the through holes 12 are provided, the air is more likely to flow in, and the binder can be removed faster.
【００１２】図５も本発明の他の実施例の積載用器具１
３を示す。この積載用器具１３も、みぞ形の断面になっ
ていて、平板部１４と突起部１５とに貫通孔１６を設け
るとともに、平板部１４の両面を凹凸状にしている。こ
の積載用器具１３は、これを載せる面が平坦であって
も、貫通孔１６に空気を流入しやすくできる。FIG. 5 also shows a loading device 1 according to another embodiment of the present invention.
3 is shown. The loading device 13 also has a groove-shaped cross section, and the flat plate portion 14 and the protruding portion 15 are provided with through holes 16 and the flat plate portion 14 has both sides of an uneven shape. Even if the surface on which the loading device 13 is placed is flat, air can easily flow into the through hole 16.
【００１３】次に、図１の実施例の積載用器具１と、図
６の従来の積載用器具２１とを用いて、３．２ mm×
２．５mm×２tmmの大きさのバレル研磨後の積層セラミ
ックのコンデンサ素子について、温度３００℃まで加熱
し、つづけてその温度のまま１０時間放置して加熱し、
放置後冷却した場合において、バインダーを同様に除去
できる条件を求めた。なお、従来の積載用器具２１の大
きさは実施例の積載用器具１と同一とする。その結果、
実施例の積載用器具１を用いた場合には、昇温速度１５
℃／ｈにしたとき、１回の処理でバインダーを除去でき
るコンデンサ素子の量は６００ｇであった。これに対し
て、従来の積載用器具２１を用いた場合には、昇温速度
５℃／ｈにしたとき、コンデンサ素子の量は２００ｇで
あった。すなわち、実施例は、従来例に比較して、温度
２０℃から昇温した場合、加熱時間が１／２未満にな
り、１回で処理できる量が３倍になる。Next, using the loading device 1 of the embodiment of FIG. 1 and the conventional loading device 21 of FIG. 6, 3.2 mm ×
A 2.5 mm × 2 t mm size laminated ceramic capacitor element after barrel polishing was heated to a temperature of 300 ° C. and then left at that temperature for 10 hours to be heated.
The conditions under which the binder can be similarly removed in the case of cooling after standing was determined. The size of the conventional loading device 21 is the same as that of the loading device 1 of the embodiment. as a result,
When the loading device 1 of the embodiment is used, the temperature rising rate is 15
The amount of the capacitor element capable of removing the binder in one treatment at 600 ° C./h was 600 g. On the other hand, when the conventional loading device 21 was used, the amount of the capacitor element was 200 g when the temperature rising rate was 5 ° C./h. That is, in the example, as compared with the conventional example, when the temperature is raised from 20 ° C., the heating time is less than 1/2, and the amount that can be processed at one time is tripled.
【００１４】[0014]
【発明の効果】以上の通り、本発明によれば、少なくと
もセラミック成形体を載せる面に貫通孔や凹凸を設けて
いるため、セラミック成形体からバインダーを除去する
処理に要する時間を短縮できるセラミック成形体の積載
用器具が得られる。As described above, according to the present invention, since at least the surface on which the ceramic molded body is mounted has through holes and irregularities, the time required for the process of removing the binder from the ceramic molded body can be shortened. A body loading device is obtained.
【図１】本発明の実施例の断面図を示す。FIG. 1 shows a sectional view of an embodiment of the present invention.
【図２】本発明の実施例にセラミック成形体を載せた状
態の断面図を示す。FIG. 2 is a sectional view showing a state in which a ceramic molded body is placed on the embodiment of the present invention.
【図３】本発明の他の実施例の断面図を示す。FIG. 3 shows a cross-sectional view of another embodiment of the present invention.
【図４】本発明の他の実施例の断面図を示す。FIG. 4 shows a cross-sectional view of another embodiment of the present invention.
【図５】本発明の他の実施例の断面図を示す。FIG. 5 shows a cross-sectional view of another embodiment of the present invention.
【図６】従来の積載用器具の断面図を示す。FIG. 6 shows a cross-sectional view of a conventional loading device.
１，６，９，１３…積載用器具、 ４，１２，１６…貫
通孔、 ８…凹凸部。1, 6, 9, 13 ... Loading device, 4, 12, 16 ... Through hole, 8 ... Uneven portion.
Claims (1)
少なくともセラミック成形体を載せる面に貫通孔または
凹凸の少なくともどちらか一方を設けることを特徴とす
るセラミック成形体の積載用器具。1. A device for loading a ceramic molded body, comprising:
At least one of a through hole and an unevenness is provided on at least a surface on which the ceramic molded body is placed, and a ceramic molded body loading device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7314794A JPH09133474A (en) | 1995-11-08 | 1995-11-08 | Instrument for loading ceramic molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7314794A JPH09133474A (en) | 1995-11-08 | 1995-11-08 | Instrument for loading ceramic molded body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09133474A true JPH09133474A (en) | 1997-05-20 |
Family
ID=18057684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7314794A Pending JPH09133474A (en) | 1995-11-08 | 1995-11-08 | Instrument for loading ceramic molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09133474A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000182900A (en) * | 1998-12-16 | 2000-06-30 | Nec Corp | Sintering vessel for solid electrolytic capacitor |
| JP2009152476A (en) * | 2007-12-21 | 2009-07-09 | Tdk Corp | Heat-treating jig for chip-like electronic component |
| CN104422288A (en) * | 2013-09-04 | 2015-03-18 | 株式会社村田制作所 | Hot processing clamp |
| CN105518815A (en) * | 2013-09-04 | 2016-04-20 | 株式会社村田制作所 | Heat treatment jig |
| TWI567356B (en) * | 2013-09-04 | 2017-01-21 | Murata Manufacturing Co | Heat treatment with a rule |
-
1995
- 1995-11-08 JP JP7314794A patent/JPH09133474A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000182900A (en) * | 1998-12-16 | 2000-06-30 | Nec Corp | Sintering vessel for solid electrolytic capacitor |
| JP2009152476A (en) * | 2007-12-21 | 2009-07-09 | Tdk Corp | Heat-treating jig for chip-like electronic component |
| CN104422288A (en) * | 2013-09-04 | 2015-03-18 | 株式会社村田制作所 | Hot processing clamp |
| CN105518815A (en) * | 2013-09-04 | 2016-04-20 | 株式会社村田制作所 | Heat treatment jig |
| TWI567356B (en) * | 2013-09-04 | 2017-01-21 | Murata Manufacturing Co | Heat treatment with a rule |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |