JPH0911694A - Device for repairing defect in printed-circuit board - Google Patents
Device for repairing defect in printed-circuit boardInfo
- Publication number
- JPH0911694A JPH0911694A JP7188529A JP18852995A JPH0911694A JP H0911694 A JPH0911694 A JP H0911694A JP 7188529 A JP7188529 A JP 7188529A JP 18852995 A JP18852995 A JP 18852995A JP H0911694 A JPH0911694 A JP H0911694A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive ink
- pattern
- repair
- defect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 title claims description 25
- 230000002950 deficient Effects 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 abstract description 19
- 238000006073 displacement reaction Methods 0.000 abstract description 17
- 230000008263 repair mechanism Effects 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 101000579646 Penaeus vannamei Penaeidin-1 Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路基板の配線パター
ンに断線部または傷等の欠陥部が生じた場合の回路基板
欠陥補修装置に関するもので、特に導電性インク描画手
段を用いて当該欠陥配線部をこの導電性インクで描画す
ることにより当該欠陥部を補修するようにしたものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board defect repairing apparatus when a wiring pattern of a circuit board has a defective portion such as a disconnection portion or a scratch. By drawing the wiring portion with this conductive ink, the defective portion is repaired.
【０００２】[0002]
【従来の技術】回路基板としては、エポキシ基板上にプ
リント配線を施したプリント基板、ポリイミドシート上
にプリント配線を施した柔軟なフレキシブルプリント基
板等がある。これらの基板は、いずれも印刷工程やエッ
チング工程など多くの工程を経て製作される。2. Description of the Related Art As circuit boards, there are a printed circuit board having a printed wiring on an epoxy substrate, a flexible flexible printed circuit board having a printed wiring on a polyimide sheet, and the like. All of these substrates are manufactured through many processes such as a printing process and an etching process.
【０００３】[0003]
【発明が解決しようとする課題】このような回路基板に
おいて、その配線パターンに断線あるいは傷等が生じた
場合これを補修する装置は、一般になかった。通常は、
断線等が発生した配線パターンを接続するためジャンパ
ー線等を用いていた。このようなジャンパー線等を用い
る補修方式ではジャンパー線を半田付けするものである
が、補修部分の信頼性が欠ける欠点があった。この発明
は、この点に鑑みて成されたもので、簡易な装置構成で
回路基板の補修を可能にするものである。In such a circuit board, there is generally no apparatus for repairing a disconnection or a scratch in the wiring pattern of the circuit board. Normally,
A jumper wire or the like is used to connect the wiring pattern in which the disconnection or the like has occurred. In the repair method using such a jumper wire or the like, the jumper wire is soldered, but there is a drawback in that the repaired portion lacks reliability. The present invention has been made in view of this point, and makes it possible to repair a circuit board with a simple device configuration.
【０００４】[0004]
【課題を解決するための手段】このため、この発明で
は、回路基板を所定の位置に保持する回路基板保持手段
と、この回路基板保持手段に保持された回路基板の配線
パターンの欠陥の有無を検出するパターン欠陥検出手段
と、上記回路基板保持手段に保持された回路基板面上を
相対的に移動可能に支持されるとともに導電性インクを
用いて所定のパターンを描く導電性インク描画手段と、
上記パターン欠陥検出手段からの欠陥信号を受け、この
回路基板の配線パターンの当該欠陥部分の始点と終点を
決定する始終点決定手段と、上記始終点決定手段により
決定された始点と終点を結ぶ経路を決定する経路決定手
段とを設け、該経路決定手段によって決定された経路に
したがって上記導電性インク描画手段を上記回路基板保
持手段に保持された回路基板に対して相対的に移動させ
ながら該回路基板の欠陥部分を上記導電性インクにより
描画して該回路基板の欠陥部を補修するよう構成した。Therefore, according to the present invention, the circuit board holding means for holding the circuit board at a predetermined position and the presence or absence of a defect in the wiring pattern of the circuit board held by the circuit board holding means are determined. A pattern defect detecting means for detecting, and a conductive ink drawing means for drawing a predetermined pattern using conductive ink while being supported so as to be relatively movable on the circuit board surface held by the circuit board holding means,
A route connecting the start and end point determining means for receiving the defect signal from the pattern defect detecting means and determining the start point and the end point of the defective portion of the wiring pattern of the circuit board, and the start point and the end point determined by the start and end point determining means. And a circuit for deciding the circuit while moving the conductive ink drawing means relative to the circuit board held by the circuit board holding means according to the path decided by the path deciding means. The defective portion of the circuit board was drawn with the conductive ink to repair the defective portion of the circuit board.
【０００５】[0005]
【作用】配線パターンの欠陥部を導電性インク描画手段
で描くことにより確実な欠陥の補修が可能となる。The defect can be surely repaired by drawing the defective portion of the wiring pattern with the conductive ink drawing means.
【０００６】[0006]
【実施例】以下、本発明を図面の１実施例を参照して説
明する。図１はこの発明の欠陥補修装置の要部の構成を
示す構成説明図、図２は図１の欠陥補修装置の欠陥部走
査状態を示す説明図、図３は図２の欠陥部走査により得
られたデータ、図４は図３のデータに基づく欠陥部の補
修動作を示す説明図、図５は図１の欠陥補修装置の補修
部機構の詳細な構成図である。図において、１０は配線
欠陥補修装置、１１は基板補修面、１２はＸ移動機構、
１３は補修機構、１４はこの補修機構１３の上下移動
部、１５はＣＣＤを有する距離センサとしての変位セン
サ、１６は導電性インク描画手段、１７は加熱機構、１
８は高さ調整ブロック、１９は制御部である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment of the drawings. FIG. 1 is an explanatory diagram showing a configuration of a main part of a defect repairing apparatus of the present invention, FIG. 2 is an explanatory view showing a defective portion scanning state of the defect repairing apparatus of FIG. 1, and FIG. 3 is obtained by scanning the defective portion of FIG. FIG. 4 is an explanatory diagram showing the repair operation of the defective part based on the data obtained, and FIG. 5 is a detailed configuration diagram of the repair part mechanism of the defect repair device of FIG. In the figure, 10 is a wiring defect repair device, 11 is a substrate repair surface, 12 is an X movement mechanism,
Reference numeral 13 is a repair mechanism, 14 is a vertically moving portion of the repair mechanism 13, 15 is a displacement sensor as a distance sensor having a CCD, 16 is conductive ink drawing means, 17 is a heating mechanism, 1
Reference numeral 8 is a height adjustment block, and 19 is a control unit.
【０００７】まず、図１を参照して本発明に係る欠陥補
修装置を説明する。この欠陥補修装置１０は、補修面１
１上に補修すべき回路基板１１１を載置する。この補修
基板１１１としては、エポキシ樹脂を基板とする硬質プ
リント基板またはポリイミド樹脂を基板とするフレキシ
ブル配線基板などがある。さて、この欠陥補修装置１０
は、Ｘ移動機構１２を有している。このＸ移動機構１２
は制御手段１９１からのＸ移動モータＭＸへの信号に応
じてＸ軸方向に移動するものである。また、このＸ移動
機構１２には、制御手段１９１からのＹ移動モータＭＹ
への信号に応じてこのＸ移動機構１２に沿ってＹ軸方向
に移動する補修機構１３が備えられている。First, the defect repairing apparatus according to the present invention will be described with reference to FIG. This defect repairing device 10 has a repair surface 1
The circuit board 111 to be repaired is placed on the substrate 1. Examples of the repair substrate 111 include a hard printed circuit board made of epoxy resin and a flexible wiring board made of polyimide resin. Now, this defect repair device 10
Has an X moving mechanism 12. This X movement mechanism 12
Is to move in the X-axis direction in response to a signal from the control means 191 to the X-moving motor MX. Further, the X moving mechanism 12 has a Y moving motor MY from the control means 191.
A repair mechanism 13 is provided which moves in the Y-axis direction along the X movement mechanism 12 in response to a signal to the.
【０００８】補修機構１３には、制御手段１９１からの
上下移動モータＭＶへの信号に応じて上下動する上下移
動部１４が備えられている。そして、この上下移動部１
４には、補修面１１上に載置された補修基板１１１との
距離を測定するためのＣＣＤを有する変位センサ１５と
導電性インクを用いて欠陥部１１３を補修するパターン
補修手段１６及び被補修部を加熱する加熱機構２０とが
設けられている。なお、ここで、ＥＸ、ＥＹはそれぞれ
Ｘ移動モータＭＸ、Ｙ移動モータＭＹの回転数を検出す
るＸエンコーダ、Ｙエンコーダであり、それぞれ公知の
サーボ機構を形成するものであり、また上下移動モータ
ＭＶは変位センサ１５の出力ＳＶにより制御される。The repair mechanism 13 is provided with a vertical moving section 14 which moves up and down in response to a signal from the control means 191 to the vertical moving motor MV. Then, the vertical movement unit 1
Reference numeral 4 denotes a displacement sensor 15 having a CCD for measuring the distance from the repair substrate 111 placed on the repair surface 11, a pattern repairing means 16 for repairing the defective portion 113 using conductive ink, and a repair target. A heating mechanism 20 for heating the unit is provided. Here, EX and EY are an X encoder and a Y encoder that detect the rotation speeds of the X moving motor MX and the Y moving motor MY, respectively, which form a known servo mechanism, and the vertical moving motor MV. Is controlled by the output SV of the displacement sensor 15.
【０００９】パターン補修機構１６は、図５に示されて
いるように導電インク供給管１６２を介して導電性イン
クが補充され所定のタイミングでこのインクを噴射して
配線パターンを描く導電インク噴射ペン１６１を有して
いる。この導電インク噴射ペン１６１はこの上下移動部
１４にホルダ１６３を介して取り付けられ、また上下調
整つまみ１６４により上下方向の位置調整が可能に構成
されている。このような導電性インクを噴射して配線パ
ターンの欠陥を補修する場合、補修基板１１１の欠陥部
と補修されるべき導電パターンとの間の距離を測定し、
補修に関わる導電パターンの厚みなどを同等なものとす
ることが望ましい。従って、この装置では、まずパター
ン補修手段１６の上下移動部１４と導電インク噴射ペン
の保持高さの調整を行なう。この保持高さの調整は、図
１の高さ調整ブロック１８に補修機構１３の上下移動部
１４を位置づけることにより行なわれる。As shown in FIG. 5, the pattern repairing mechanism 16 is replenished with conductive ink through a conductive ink supply pipe 162, and the conductive ink ejecting pen draws a wiring pattern by ejecting this ink at a predetermined timing. 161 is included. The conductive ink ejecting pen 161 is attached to the vertical moving portion 14 via a holder 163, and the vertical adjustment knob 164 is capable of adjusting the vertical position. When such a conductive ink is ejected to repair a defect in the wiring pattern, the distance between the defective portion of the repair substrate 111 and the conductive pattern to be repaired is measured,
It is desirable that the thickness of the conductive pattern involved in repair be equal. Therefore, in this apparatus, first, the holding height of the vertical moving portion 14 of the pattern repairing means 16 and the conductive ink ejecting pen is adjusted. The holding height is adjusted by positioning the vertical movement portion 14 of the repair mechanism 13 on the height adjustment block 18 shown in FIG.
【００１０】図５は、制御手段１９１の指令に基づくＸ
移動モータＭＸ及びＹ移動モータＭＹの動作により補修
機構１３の上下移動部１４を高さ調整ブロック１８に位
置づけた状態を示したものである。高さ調整ブロック１
８は第１基準高さ１８１及び第２基準高さ１８２を有し
ており、段差ｈが導電インク補修ペン１６１の適正保持
高さに一致している。変位センサ１５により上下移動部
１４を所定の高さＨに維持する。FIG. 5 shows X based on a command from the control means 191.
The figure shows a state in which the vertical movement unit 14 of the repair mechanism 13 is positioned on the height adjustment block 18 by the operations of the movement motors MX and Y movement motors MY. Height adjustment block 1
Reference numeral 8 has a first reference height 181 and a second reference height 182, and the step h corresponds to the proper holding height of the conductive ink repair pen 161. The vertical movement unit 14 is maintained at a predetermined height H by the displacement sensor 15.
【００１１】変位センサ１５は、この実施例装置ではキ
ーエンス社ＬＴ−８０００を用いており、そのセンサ中
心（ＳＣ）からレーザー光を発射し目標物に対する焦点
距離に基づき目標物までの距離を測定するものである。
そして、この変位センサ１５からの測定距離信号ＳＶが
制御手段１９１（図１）に入力され、上下移動部１４の
上下動作を行なう上下移動モータＭＶの制御に利用され
る。このようにして、この装置の上下移動部１４は一定
の高さＨに維持される。As the displacement sensor 15, LT-8000 manufactured by Keyence Corporation is used in this embodiment, and a laser beam is emitted from the sensor center (SC) to measure the distance to the target object based on the focal length to the target object. It is a thing.
Then, the measured distance signal SV from the displacement sensor 15 is input to the control means 191 (FIG. 1) and used for controlling the vertical movement motor MV that performs the vertical movement of the vertical movement unit 14. In this way, the vertical movement part 14 of this device is maintained at a constant height H.
【００１２】さて、このようにして上下移動部１４が一
定の高さＨに位置づけられると、オペレータはこの上下
移動部１４のパターン補修手段１６の位置調整を行な
う。この位置調整はパターン補修手段１６の上下調整つ
まみ１６４を操作することにより行なわれる。上下調整
つまみ１６４をゆるめることにより、ホルダ１６３をフ
リーな状態とすることができ、パターン作成機構１６の
導電インク噴射ペン１６１を上下に移動することができ
る。上下調整つまみ１６４をゆるめホルダ１６３ととも
に導電インク噴射ペン１６１を下降させてこのペン１６
１の先端を第２基準高さ１８２に当接させる。そして、
上下調整つまみ１６４を逆に回しホルダ１６３を固定す
る。これにより、導電インク噴射ペン１６１の先端を適
正高さｈ１に調整することができる。変位センサ１５を
用い、上下移動部１４を一定の高さＨに位置づけている
限り、導電インク噴射ペン１６１を適正高さ距離に維持
することができ、したがって常に一定の幅及び厚みの導
電インクを噴射することができる。When the vertical moving section 14 is positioned at the constant height H in this way, the operator adjusts the position of the pattern repairing means 16 of the vertical moving section 14. This position adjustment is performed by operating the vertical adjustment knob 164 of the pattern repairing means 16. By loosening the vertical adjustment knob 164, the holder 163 can be brought into a free state, and the conductive ink ejecting pen 161 of the pattern forming mechanism 16 can be moved up and down. Loosen the vertical adjustment knob 164 and lower the conductive ink ejecting pen 161 together with the holder 163 to lower the pen 16
The tip of No. 1 is brought into contact with the second reference height 182. And
The holder 163 is fixed by turning the up-down adjustment knob 164 in the opposite direction. Thereby, the tip of the conductive ink ejecting pen 161 can be adjusted to the proper height h1. As long as the displacement sensor 15 is used to position the up-and-down moving portion 14 at a constant height H, the conductive ink ejecting pen 161 can be maintained at an appropriate height distance. Can be jetted.
【００１３】加熱機構２０は、上下移動部１４にその送
風口２１を導電インク噴射ペン１６１の描画部に向けて
取り付けられている。この加熱機構２０の内部には、図
示しない電熱線とファンモータが備えられており、パタ
ーン補修手段１６が補修した部分を乾燥定着させる。The heating mechanism 20 is attached to the up-and-down moving section 14 with its blower opening 21 facing the drawing section of the conductive ink ejecting pen 161. Inside the heating mechanism 20, a heating wire and a fan motor (not shown) are provided, and the portion repaired by the pattern repairing means 16 is dried and fixed.
【００１４】次に、この欠陥補修装置の動作を説明す
る。まず、この実施例装置では、補修基板１１１上の欠
陥パターン部の位置情報を取得する。この欠陥部位置情
報の取得としては、装置の補修面１１をカバーする態様
でテレビカメラを取り付け、このテレビカメラにより得
られた画像を処理して欠陥部の特定及び位置情報を得る
ようにすることもできるが、ここでは、補修基板１１１
の欠陥部の概略位置を、あらかじめ装置の使用者が測定
しておく場合を説明する。Next, the operation of this defect repairing device will be described. First, in this embodiment, the position information of the defective pattern portion on the repair substrate 111 is acquired. As acquisition of this defective portion position information, a TV camera is attached in a manner to cover the repair surface 11 of the apparatus, and the image obtained by this TV camera is processed so as to identify the defective portion and obtain position information. However, here, the repair substrate 111
A case will be described in which the user of the apparatus measures in advance the approximate position of the defective portion.
【００１５】今、図１に示す点Ａから点Ｂまでの導電パ
ターンの欠陥部１１３を補修する場合を考える。この欠
陥部１１３の概略位置は装置使用者に認識されているの
で、装置使用者は、この装置に、この欠陥部１１３が含
まれる比較的広い領域（図１四角囲み部分）について、
走査動作を行なわせる。この走査動作は、装置を走査モ
ードに設定するとともに該四角形領域の２つの対角点を
指定することにより行なわれる。Now, consider the case of repairing the defective portion 113 of the conductive pattern from point A to point B shown in FIG. Since the approximate position of the defective portion 113 is recognized by the user of the apparatus, the apparatus user knows that the apparatus has a relatively large area (the portion surrounded by a square in FIG. 1) in which the defective portion 113 is included.
The scanning operation is performed. This scanning operation is performed by setting the device in the scanning mode and designating two diagonal points of the rectangular area.
【００１６】これにより、この欠陥補修装置１０の補修
機構１３は、その上下移動部１４を高さＨに位置づけた
状態でその変位センサ１５を上記四角形領域の一方の対
角点に位置づける。そして、この四角形領域の端から端
まで走査していく。この走査は、Ｘ移動モータＭＸ及び
Ｙ移動モータＭＹを駆動することにより行なわれる。ま
た、この走査状態においては、それぞれのエンコーダ出
力ＥＸ、ＥＹから出力を取り出し上記変位センサ１５の
移動ステップ毎にそのＸＹ座標位置を、またセンサ出力
ＳＶからその時の補修基板１１１との距離が取り出せる
よう構成されている。また、この変位センサには、図５
に示すように、ＣＣＤが設けられ、その移動にともなっ
て当該四角形領域の画像が取り出せるよう構成されてい
る。As a result, the repair mechanism 13 of the defect repairing apparatus 10 positions the displacement sensor 15 at one of the diagonal points of the quadrangular area with the vertical moving portion 14 positioned at the height H. Then, scanning is performed from one end of this rectangular area to the other. This scanning is performed by driving the X moving motor MX and the Y moving motor MY. In this scanning state, the output from each of the encoder outputs EX and EY is taken out so that the XY coordinate position can be taken out at each moving step of the displacement sensor 15 and the distance from the sensor output SV to the repair substrate 111 at that time can be taken out. It is configured. In addition, this displacement sensor is shown in FIG.
As shown in FIG. 5, a CCD is provided, and the image of the quadrangle region can be taken out as the CCD moves.
【００１７】以上の構成による実際の補修動作は次の通
りである。 始終点および移動経路認識動作 変位センサ１５のＣＣＤからの信号は、制御手段１９１
を介して画像モニタ１９５に出力され、この補修機構１
３の走査動作にともなう四角形領域の状態を写し出す。
使用者は、この画像モニタ１９５の画像を観察して、欠
陥部１１３を含んだ導電パターン特定する。この導電パ
ターンの特定は、画像モニタ１９５の画面上のカーソル
を用いて、図２に示すように、始点ａ及び終点ｂを指定
することにより行なう。画像モニタ１９５のこれらの指
定データは、制御手段１９１によりそれぞれ始点ＸＹ座
標及び終点ＸＹ座標に変換されて図示しないメモリに格
納される。この場合において、欠陥部を含んだ導電パタ
ーンが曲線であるような場合には、画像モニタ１９５上
のカーソルを始点ａから終点ｂまで当該導電パターンに
沿って移動することで、当該始終点間の移動経路をメモ
リに格納することができる。The actual repair operation with the above configuration is as follows. Start / End Point and Movement Path Recognition Operation The signal from the CCD of the displacement sensor 15 is controlled by the control means 191.
Is output to the image monitor 195 via the repair mechanism 1
The state of the quadrangle region associated with the scanning operation of 3 is displayed.
The user observes the image on the image monitor 195 and specifies the conductive pattern including the defective portion 113. This conductive pattern is specified by using the cursor on the screen of the image monitor 195 and designating the start point a and the end point b as shown in FIG. These designated data of the image monitor 195 are converted into a start point XY coordinate and an end point XY coordinate by the control means 191 and stored in a memory (not shown). In this case, when the conductive pattern including the defective portion is a curve, the cursor on the image monitor 195 is moved along the conductive pattern from the start point a to the end point b so that the distance between the start and end points is increased. The travel route can be stored in memory.
【００１８】経路状態認識動作 欠陥部を有する導体パターン１１２の補修に係る始終点
及び移動経路が認識されると、装置は当該導体パターン
１１２の経路状態を測定する。図２に示すように、変位
センサ１５を始点ａに位置づけたのちその高さ測定状態
を維持したまま終点ｂまで当該導体パターン１２に沿っ
て移動させる。これによって、補修すべき導体パターン
１１２の高さを測定することができる。図３は、始終点
ａｂ間の変位センサ１５の測定結果をプロットしたもの
である。中央の落ち込んでいる部分が欠陥部１１３に一
致する。装置は、この高さデータから落ち込み開始位置
と落ち込み終了位置のそれぞれのＸＹ座標を後述する補
修データとするため認識格納する。Path State Recognition Operation When the start and end points and the moving path relating to the repair of the conductor pattern 112 having a defective portion are recognized, the apparatus measures the path state of the conductor pattern 112. As shown in FIG. 2, after the displacement sensor 15 is positioned at the starting point a, it is moved along the conductor pattern 12 to the end point b while maintaining its height measurement state. Thereby, the height of the conductor pattern 112 to be repaired can be measured. FIG. 3 is a plot of the measurement results of the displacement sensor 15 between the start and end points ab. The depressed portion at the center coincides with the defective portion 113. The apparatus recognizes and stores the respective XY coordinates of the depression start position and the depression end position from this height data, as repair data described later.
【００１９】導体パターン補修動作 次いで、パターン補修手段１６の導電インク噴射ペン１
６１を上記で求めた落ち込み開始位置に位置づける。そ
して、補修機構１３を落ち込み終了位置まで１ステップ
づつ移動させながら当該移動ステップ間の停止時間中
に、図４に示すように、導電インク噴射ペン１６１を作
用させて導体パターン１１２の補修を行なう。この場合
において、導電インクの噴射量は、図３の測定データの
欠陥部１１３の落ち込み量に比例したものとすることが
望ましい。これにより、補修部分の導体パターンの厚み
量を補修に関わらない導体パターン１２のそれと同等と
することができる。なお、この場合の噴射量の調整は、
この実施例においては、ステップ間停止時間あたりの噴
射回数の増減により行なっている。さらに、この場合に
おいて、この補修動作が完了した時点で、変位センサ１
５を走査させて欠陥部１３の高さデータを再度取得し、
補修が同等な厚みまで行なわれたか確認するようにして
もよい。Conductor pattern repairing operation Next, the conductive ink jet pen 1 of the pattern repairing means 16
Position 61 at the depression start position determined above. Then, as shown in FIG. 4, the conductive ink jet pen 161 is actuated to repair the conductor pattern 112 during the stop time between the moving steps while moving the repair mechanism 13 step by step to the depression end position. In this case, it is desirable that the ejection amount of the conductive ink be proportional to the amount of depression of the defective portion 113 in the measurement data of FIG. As a result, the thickness of the conductor pattern in the repaired portion can be made equal to that of the conductor pattern 12 not involved in repairing. In addition, adjustment of the injection amount in this case,
In this embodiment, the number of injections per step stop time is increased or decreased. Further, in this case, when the repair operation is completed, the displacement sensor 1
5 is scanned to obtain height data of the defective portion 13 again,
It may be possible to confirm whether the repair has been performed to the same thickness.
【００２０】さらに、この時には、加熱機構２０が動作
し、噴射された導電インクの乾燥を行なう。この加熱機
構２０はこのパターン補修動作期間中一定の熱量をその
送風口２１から与えるよう構成されている。Further, at this time, the heating mechanism 20 operates to dry the ejected conductive ink. The heating mechanism 20 is configured to provide a constant amount of heat from the blower port 21 during the pattern repair operation.
【００２１】[0021]
【発明の効果】以上、この発明によれば、比較的簡単な
構成で回路基板の欠陥導体パターンを補修することがで
きる。As described above, according to the present invention, the defective conductor pattern on the circuit board can be repaired with a relatively simple structure.
【図１】図１は、本発明に係る回路基板欠陥補修装置の
構成説明図である。FIG. 1 is a configuration explanatory view of a circuit board defect repairing apparatus according to the present invention.
【図２】図２は、補修機構１３の走査動作を示す説明図
である。FIG. 2 is an explanatory diagram showing a scanning operation of a repair mechanism 13.
【図３】図３は、欠陥部を有する導体パターンの高さ測
定図である。FIG. 3 is a height measurement diagram of a conductor pattern having a defective portion.
【図４】図４は、欠陥部の補修動作を示す説明図であ
る。FIG. 4 is an explanatory diagram showing a repairing operation of a defective portion.
【図５】図５は、補修機構１３の要部構成図である。5 is a configuration diagram of a main part of a repair mechanism 13. FIG.
１０：欠陥補修装置 １２：Ｘ移動機構 １３：補修機
構 １４：上下移動部 １５：変位センサ １６：パターン
補修手段 １８：高さ調整ブロック ２０：加熱機構10: Defect repairing device 12: X moving mechanism 13: Repairing mechanism 14: Vertical moving part 15: Displacement sensor 16: Pattern repairing means 18: Height adjusting block 20: Heating mechanism
Claims (2)
保持手段と、 この回路基板保持手段に保持された回路基板の配線パタ
ーンの欠陥の有無を検出するパターン欠陥検出手段と、 上記回路基板保持手段に保持された回路基板面上を相対
的に移動可能に支持されるとともに導電性インクを用い
て所定のパターンを描く導電性インク描画手段と、 上記パターン欠陥検出手段からの欠陥信号を受け、この
回路基板の配線パターンの当該欠陥部分の始点と終点を
決定する始終点決定手段と、 上記始終点決定手段により決定された始点と終点を結ぶ
経路を決定する経路決定手段と、 を有し、 該経路決定手段によって決定された経路にしたがって上
記導電性インク描画手段を上記回路基板保持手段に保持
された回路基板に対して相対的に移動させながら該回路
基板の欠陥部分を上記導電性インクにより描画して該回
路基板の欠陥部を補修することを特徴とする回路基板欠
陥補修装置。1. A circuit board holding means for holding a circuit board at a predetermined position, a pattern defect detecting means for detecting the presence or absence of a defect in a wiring pattern of the circuit board held by the circuit board holding means, and the circuit board. A conductive ink drawing means which is supported by the holding means so as to be relatively movable on the surface of the circuit board and draws a predetermined pattern using conductive ink, and a defect signal from the pattern defect detecting means. A start point and end point determining means for determining a start point and an end point of the defective portion of the wiring pattern of the circuit board, and a route determining means for determining a route connecting the start point and the end point determined by the start and end point determining means. , Do not move the conductive ink drawing means relative to the circuit board held by the circuit board holding means according to the path decided by the path decision means. Luo the circuit circuit board defect repairing apparatus characterized by repairing the defective portion of the circuit board by drawing a defective portion of the substrate by the conductive ink.
所定の位置に保持する回路基板保持手段と、 上記回路基板保持手段に保持された回路基板面上を相対
的に移動可能に支持されるとともに導電性インクを用い
て所定のパターンを描く導電性インク描画手段と、 上記回路基板保持手段に保持された回路基板の欠陥配線
部の始点と終点及び経路を指定する経路指定手段と、 を有し、 該経路指定手段によって指定された経路にしたがって上
記導電性インク描画手段を上記回路基板保持手段に保持
された回路基板に対して相対的に移動させながら該回路
基板の欠陥配線部分を上記導電性インクにより描画して
該回路基板の欠陥配線部を補修することを特徴とする回
路基板欠陥補修装置。2. A circuit board holding means for holding a circuit board having a defective portion in a wiring pattern at a predetermined position, and a circuit board surface held by the circuit board holding means so as to be relatively movable. And a conductive ink drawing means for drawing a predetermined pattern using conductive ink, and a routing means for designating a start point, an end point and a route of the defective wiring portion of the circuit board held by the circuit board holding means. The conductive ink drawing means is moved relative to the circuit board held by the circuit board holding means in accordance with the path designated by the route designating means, and the defective wiring portion of the circuit board is made conductive. A circuit board defect repairing device, characterized in that a defective wiring portion of the circuit board is repaired by drawing with a conductive ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7188529A JPH0911694A (en) | 1995-06-30 | 1995-06-30 | Device for repairing defect in printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7188529A JPH0911694A (en) | 1995-06-30 | 1995-06-30 | Device for repairing defect in printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0911694A true JPH0911694A (en) | 1997-01-14 |
Family
ID=16225309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7188529A Pending JPH0911694A (en) | 1995-06-30 | 1995-06-30 | Device for repairing defect in printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0911694A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005084092A3 (en) * | 2004-02-25 | 2005-11-24 | Nanoink Inc | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| US8071168B2 (en) | 2002-08-26 | 2011-12-06 | Nanoink, Inc. | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| US9581351B2 (en) | 2009-09-28 | 2017-02-28 | Daikin Industries, Ltd. | Air conditioning apparatus with control device for varying the angle of air conditioning discharge flaps |
-
1995
- 1995-06-30 JP JP7188529A patent/JPH0911694A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8071168B2 (en) | 2002-08-26 | 2011-12-06 | Nanoink, Inc. | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| WO2005084092A3 (en) * | 2004-02-25 | 2005-11-24 | Nanoink Inc | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| US9581351B2 (en) | 2009-09-28 | 2017-02-28 | Daikin Industries, Ltd. | Air conditioning apparatus with control device for varying the angle of air conditioning discharge flaps |
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