JPH09115703A - Conductive composite material composition and conductive composite obtained by molding it - Google Patents
Conductive composite material composition and conductive composite obtained by molding itInfo
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- JPH09115703A JPH09115703A JP27516495A JP27516495A JPH09115703A JP H09115703 A JPH09115703 A JP H09115703A JP 27516495 A JP27516495 A JP 27516495A JP 27516495 A JP27516495 A JP 27516495A JP H09115703 A JPH09115703 A JP H09115703A
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- conductive composite
- conductive
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電性複合材料組
成物と該組成物を成形して得られる導電性複合体に関す
る。TECHNICAL FIELD The present invention relates to a conductive composite material composition and a conductive composite obtained by molding the composition.
【０００２】[0002]
【従来の技術】従来、重合体と導電性材料からなる導電
性複合体としてのスイッチング素子は、ポリエチレン等
のポリオレフィン系樹脂とカーボンブラック等の導電性
粒子とからなる複合体が用いられている（米国特許第
２，９７８，６６５号明細書、特開昭５４−１６６９７
号公報、特開昭５５−７８４０６号公報参照）。2. Description of the Related Art Conventionally, as a switching element as a conductive composite composed of a polymer and a conductive material, a composite composed of a polyolefin resin such as polyethylene and conductive particles such as carbon black has been used ( U.S. Pat. No. 2,978,665, JP-A-54-16697
Japanese Patent Laid-Open No. 55-78406).
【０００３】[0003]
【発明が解決しようとする課題】ポリエチレン樹脂とカ
ーボンブラック粒子との導電性複合体からなるスイッチ
ング素子は８０〜１４０℃にスイッチング温度（以下Ｔ
ｓという）をもち（特開昭５５−７８４０６号公報参
照）、電子部品分野で実用化されている。しかし、１０
０℃以下、特に室温以下の温度域にＴｓを持つスイッチ
ング素子についての提案は、下記に示すもの以外ほとん
どなされていない。A switching element composed of a conductive composite of polyethylene resin and carbon black particles has a switching temperature (hereinafter referred to as T
s) (see Japanese Patent Application Laid-Open No. 55-78406) and has been put to practical use in the field of electronic parts. However, 10
Little proposals have been made regarding switching elements having Ts in the temperature range of 0 ° C. or lower, particularly room temperature or lower, except for those shown below.
【０００４】すなわち、特開昭６２−４２４０１号公報
では、アクリル系オリゴマーを基本材料として使用し、
炭素粉末を混合後、電子線及び／または加熱により硬化
し、０〜３００℃の範囲でＰＴＣ（Positive Temperatu
re Coefficient）特性を呈する材料が提案されている
が、急峻で大きな導通抵抗値変化が得られないといった
問題点がある。That is, in JP-A-62-42401, an acrylic oligomer is used as a basic material,
After mixing the carbon powder, it is cured by electron beam and / or heating, and PTC (Positive Temperatu
A material exhibiting a re-coefficient characteristic has been proposed, but there is a problem in that it is abrupt and a large change in conduction resistance cannot be obtained.
【０００５】また、特公平３−５０４１号公報では、天
然ゴム，ポリブタジエン等のゴムにカーボンブラックや
短繊維を混合して室温付近でＰＴＣ特性を示す材料が提
案されているが、導通抵抗値の変化が少ないことの他
に、室温以下、特に０℃以下でＴｓを持つ材料が得られ
ていないといった問題点がある。Further, Japanese Patent Publication No. 3-5041 proposes a material which exhibits PTC characteristics near room temperature by mixing carbon black or short fibers with a rubber such as natural rubber or polybutadiene. In addition to the small change, there is a problem that a material having Ts is not obtained at room temperature or lower, particularly 0 ° C. or lower.
【０００６】本発明の目的は、上記の問題点を改良し、
１００℃以下、特に室温以下で急峻で大きな導通抵抗値
変化を示し再現性に優れるスイッチング素子等の導電性
複合材料組成物と、これを成形して得られる導電性複合
体を提供することにある。The object of the present invention is to improve the above-mentioned problems,
(EN) It is intended to provide a conductive composite material composition such as a switching element which exhibits a sharp and large change in conduction resistance value at 100 ° C or lower, particularly room temperature or lower and is excellent in reproducibility, and a conductive composite obtained by molding the same. .
【０００７】[0007]
【課題を解決するための手段】本発明は、少なくとも側
鎖結晶性重合体を含む樹脂と導電性材料とからなる導電
性複合材料組成物において、該樹脂１００重量部に対し
て導電性材料が２０〜１０００重量部含まれることを特
徴とする。The present invention provides a conductive composite material composition comprising a resin containing at least a side chain crystalline polymer and a conductive material, wherein the conductive material is added to 100 parts by weight of the resin. 20 to 1000 parts by weight are included.
【０００８】さらに、本発明は、上記組成物を成形して
得られる導電性複合体であることを特徴とする。Further, the present invention is characterized by being a conductive composite obtained by molding the above composition.
【０００９】ここで、側鎖結晶性重合体としては、ポリ
（α−オレフィン），ポリ（アルキルアクリレート），
ポリ（アルキルメタアクリレート），ポリ（ビニルアル
キルエーテル），ポリ（ビニルアルキルエステル），ポ
リ（アルキルスチレン）等が挙げられる。この中で、ア
クリル酸誘導体又はメタクリル酸誘導体のポリマーが好
ましく、これらポリマーを構成するモノマーの５０重量
％以上が、炭素数８以上、好ましくは炭素数１２以上の
アルキルエステルである。これらの量は、６０重量％以
上であれば更に好ましい。エステル炭素数が８以上で側
鎖結晶性を有するようになり、一次転移点（融点）が観
測されるようになるためである。Here, as the side chain crystalline polymer, poly (α-olefin), poly (alkyl acrylate),
Examples thereof include poly (alkyl methacrylate), poly (vinyl alkyl ether), poly (vinyl alkyl ester), and poly (alkyl styrene). Among these, polymers of acrylic acid derivatives or methacrylic acid derivatives are preferable, and 50% by weight or more of the monomers constituting these polymers are alkyl esters having 8 or more carbon atoms, preferably 12 or more carbon atoms. More preferably, these amounts are 60% by weight or more. This is because when the ester carbon number is 8 or more, the side chain crystallinity comes to be exhibited, and the first-order transition point (melting point) comes to be observed.
【００１０】これらのモノマーを例示すると、アクリル
酸ドデシル，アクリル酸テトラデシル，アクリル酸ペン
タデシル，アクリル酸ヘキサデシル，アクリル酸オクタ
デシル，アクリル酸ドコサン，メタクリル酸ドデシル，
メタクリル酸ペンタデシル，メタクリル酸ヘキサデシ
ル，メタクリル酸オクタデシル，メタクリル酸ドコサン
等が挙げられる。アルキルエステルは、直鎖でも枝分れ
していても構わない。Examples of these monomers include dodecyl acrylate, tetradecyl acrylate, pentadecyl acrylate, hexadecyl acrylate, octadecyl acrylate, docosane acrylate, dodecyl methacrylate,
Examples thereof include pentadecyl methacrylate, hexadecyl methacrylate, octadecyl methacrylate, docosane methacrylate and the like. The alkyl ester may be linear or branched.
【００１１】また、電極材料との接着性を高める等の目
的のために、汎用のアクリル酸又はメタクリル酸誘導体
を用いることもできる。これらモノマーを例示すると、
アクリル酸，アクリル酸−２−エチルヘキシル，アクリ
ル酸−２−ヒドロキシエチル，アクリル酸アミド，アク
リル酸グリシジル，アクリル酸−２−ヒドロキシプロピ
ル，アクリル酸−２−シアノエチル，アクリロニトリ
ル，アクリル酸メチル，アクリル酸エチル，アクリル酸
−ｎ−ブチル，アクリル酸イソブチル等が挙げられる。
メタクリル酸誘導体についても同様である。本発明の目
的を失わない範囲で２種類以上のホモポリマーをブレン
ドしたり共重合してもかまわない。むしろ所望の特性を
満足させるために変性するほうが好ましい。Further, a general-purpose acrylic acid or methacrylic acid derivative may be used for the purpose of enhancing the adhesiveness with the electrode material. To illustrate these monomers,
Acrylic acid, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, acrylic acid amide, glycidyl acrylate, 2-hydroxypropyl acrylate, 2-cyanoethyl acrylate, acrylonitrile, methyl acrylate, ethyl acrylate , N-butyl acrylate, isobutyl acrylate and the like.
The same applies to the methacrylic acid derivative. Two or more kinds of homopolymers may be blended or copolymerized within a range that does not impair the object of the present invention. Rather, it is preferable to modify it in order to satisfy the desired properties.
【００１２】本発明に用いるアクリル酸又はメタクリル
酸誘導体のポリマーは、従来の方法で重合され、重合方
法、溶媒、重合開始剤等に限定はない。The acrylic acid or methacrylic acid derivative polymer used in the present invention is polymerized by a conventional method, and there is no limitation on the polymerization method, solvent, polymerization initiator and the like.
【００１３】本発明においては、上記側鎖結晶性重合体
に他の重合体等を混合することができる。例えば、ポリ
エチレン（ＬＤＰＥ，ＭＤＰＥ，ＨＤＰＥ，ＬＬＤＰ
Ｅ）、α−オレフィンと極性モノマーとの共重合体（Ｅ
ＶＡ，ＥＡ，ＥＥＡ）や熱可塑性エラストマーなどを挙
げることができるが、これらに限定されるものではな
い。In the present invention, the side chain crystalline polymer may be mixed with another polymer. For example, polyethylene (LDPE, MDPE, HDPE, LLDP
E), a copolymer of α-olefin and a polar monomer (E
VA, EA, EEA), a thermoplastic elastomer, and the like, but not limited thereto.
【００１４】本発明における側鎖結晶性重合体と他の重
合体の混合比は、特に限定するものではないが、側鎖結
晶性重合体が、１００〜１０重量部で、他の重合体が、
０〜９０重量部である。以上の重合体を用いることによ
り、本発明では、導通抵抗値が大きく変わる温度（スイ
ッチング温度，Ｔｓ）が、組成物中の重合体の融点近傍
で認められる。The mixing ratio of the side chain crystalline polymer and the other polymer in the present invention is not particularly limited, but the side chain crystalline polymer is 100 to 10 parts by weight, and the other polymer is mixed. ,
0 to 90 parts by weight. By using the above polymer, in the present invention, the temperature (switching temperature, Ts) at which the conduction resistance value greatly changes is observed near the melting point of the polymer in the composition.
【００１５】本発明における導電性材料は、ファーネス
ブラック，ケッチェンブラックなどのカーボンブラッ
ク、これらの極性モノマーによるグラフト物，金属メッ
キカーボンブラック，グラファイトなどを挙げることが
できるが、更にニッケル，コバルト，銀，銅などの金属
やこれらに代表される金属の合金を用いることができ
る。以上の材料の形態は、特に限定するものではない
が、一般的には粒状体が用いられ、例えばカーボンブラ
ックの場合には、１０〜１００ｎｍ径の粒状物が用いら
れる。Examples of the conductive material in the present invention include carbon black such as furnace black and Ketjen black, graft products of these polar monomers, metal plated carbon black, graphite and the like, and further nickel, cobalt and silver. , A metal such as copper, or an alloy of metals represented by these can be used. The form of the above material is not particularly limited, but a granular material is generally used, and in the case of carbon black, for example, a granular material having a diameter of 10 to 100 nm is used.
【００１６】本発明における導電性材料の重合体に対す
る添加量は、導電性材料の種類にもよるが、一般的に
は、２０〜１０００重量部であり、好ましくは、１００
〜８００重量部である。The amount of the conductive material added to the polymer in the present invention depends on the kind of the conductive material, but is generally 20 to 1000 parts by weight, and preferably 100.
~ 800 parts by weight.
【００１７】本発明においては、導電性材料の他に、他
の添加剤、例えば無機充填材，酸化防止剤，帯電防止
剤，シランカップリング剤等を添加することができる。In the present invention, in addition to the conductive material, other additives such as an inorganic filler, an antioxidant, an antistatic agent, a silane coupling agent and the like can be added.
【００１８】本発明における樹脂，導電性材料等の組成
物の混合は、ロール，バンバリミキサー，ヘンシェルミ
キサー，ブラベンダープラストグラフ，押出機（単軸，
多軸）等の混練装置を用いて行うことができる。更に、
本発明においては、通常、圧縮成形，押出成形，射出成
形等の成形法を用いてプレート，シート，フィルム状の
導電性複合体を作製することができる。The composition of the resin, conductive material and the like in the present invention is mixed by roll, Banbury mixer, Henschel mixer, Brabender plastograph, extruder (single screw,
It can be carried out using a kneading device such as a multi-screw. Furthermore,
In the present invention, a plate, sheet, or film-shaped conductive composite can be usually produced by using a molding method such as compression molding, extrusion molding, or injection molding.
【００１９】本発明における側鎖結晶性重合体は、一般
的な方法で架橋される。これらを例示すると、電子線等
の放射線，紫外線などによる架橋や、過酸化物による化
学架橋の他にイソシアネート，エポキシ，アミン，イミ
ド，メラミン等、及びその触媒による架橋が挙げられる
がこれらに限定されるものではない。The side chain crystalline polymer in the present invention is crosslinked by a general method. Examples of these include, but are not limited to, crosslinking by radiation such as electron beam, ultraviolet rays, etc., chemical crosslinking by peroxide, and crosslinking by isocyanate, epoxy, amine, imide, melamine, etc., and their catalysts. Not something.
【００２０】また、本発明で用いられるポリエチレン，
エチレン−酢酸ビニル共重合体等の重合体も一般的に
は、架橋されるが、その方法としてはｔ−ブチルクミル
パーオキサイド，２，５ジメチルージ（ｔ−ブチルパー
オキシ）ヘキサン，２，５ジメチルージ（ｔ−ブチルパ
ーオキシ）ヘキシン−３等の有機過酸化物を用いる化学
架橋法，さらには、電子線などを用いる放射線架橋法な
どの方法を用いることができる。Further, polyethylene used in the present invention,
Polymers such as ethylene-vinyl acetate copolymers are generally cross-linked, and the method is t-butylcumyl peroxide, 2,5 dimethyldi (t-butylperoxy) hexane, 2,5 dimethyldioxide. A method such as a chemical crosslinking method using an organic peroxide such as (t-butylperoxy) hexyne-3 and a radiation crosslinking method using an electron beam can be used.
【００２１】本発明において、導電性複合体はニッケ
ル，銅等の電極材と直接、もしくは異方導電性フィルム
等も導電材を用いて熱圧着等の方法により接続される
が、さらに、成形歪の緩和，内部構造の安定化の目的の
ために熱処理を施すのが一般的である。In the present invention, the conductive composite is directly connected to an electrode material such as nickel or copper, or an anisotropic conductive film or the like is connected by a method such as thermocompression bonding using a conductive material. In general, heat treatment is performed for the purpose of relaxation of heat and stabilization of internal structure.
【００２２】なお、この熱処理は、導電性複合体と電極
材の接続前、接続中又は接続後に行っても良い。The heat treatment may be performed before, during or after the connection between the conductive composite and the electrode material.
【００２３】以上の構成から明らかなように、本発明
は、樹脂と導電性材料とからなる導電性複合材料組成物
において、樹脂が少なくとも側鎖結晶性重合体を含む架
橋物を主体とするために、これを成形して得られる導電
性複合体のＴｓは、１００℃以下の低い温度で、急峻で
大きな導通抵抗値変化を示し、かつこの導通抵抗値変化
の再現性に優れた導電性複合体を得ることができる。As is apparent from the above constitution, the present invention is mainly composed of a crosslinked product containing at least a side chain crystalline polymer in a conductive composite material composition comprising a resin and a conductive material. In addition, the Ts of the conductive composite obtained by molding this shows a steep and large change in the conductive resistance value at a low temperature of 100 ° C. or less, and the conductive composite excellent in reproducibility of the change in the conductive resistance value. You can get the body.
【００２４】すなわち、１００℃以下でのＰＴＣ特性の
発現は、側鎖結晶性重合体の融点に対応して生じてお
り、側鎖結晶部の分子の長さを変えることにより１００
℃以下でも任意のＴｓ温度を設定することができる。That is, the expression of the PTC characteristic at 100 ° C. or lower occurs in correspondence with the melting point of the side chain crystalline polymer, and it is possible to obtain the PTC characteristics by changing the molecular length of the side chain crystal part.
An arbitrary Ts temperature can be set even at a temperature equal to or lower than ° C.
【００２５】また、導通抵抗値の急峻な変化は該側鎖結
晶性重合体分子量を調整することにより、調節が可能と
考えられる。更に、導通抵抗値の変化の再現性は、側鎖
結晶性重合体の架橋化によるもので、融点以上の温度で
該側鎖結晶性重合体の流動が抑制された結果と考えられ
る。Further, it is considered that the steep change of the conduction resistance value can be adjusted by adjusting the molecular weight of the side chain crystalline polymer. Further, the reproducibility of the change in the conduction resistance value is due to the crosslinking of the side chain crystalline polymer, and it is considered that the flow of the side chain crystalline polymer was suppressed at a temperature equal to or higher than the melting point.
【００２６】[0026]
【発明の実施の形態】以下、本発明の実施形態につい
て、《実施例１》〜《実施例３》を基に詳細に説明す
る。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to << Example 1 >> to << Example 3 >>.
【００２７】《実施例１》表１に示す配合組成物をプラ
ストミルを用いて６０℃で混合した。次いで、１２０
℃、８分間プレスし（１２０ｋｇ／ｃｍ2 ）、厚み約１
ｍｍのシート（５ｃｍ×５ｃｍ）を成形した。Example 1 The compounding compositions shown in Table 1 were mixed at 60 ° C. using a plastomill. Then 120
° C., was pressed for 8 minutes (120kg / cm 2), thickness of about 1
mm sheet (5 cm x 5 cm) was formed.
【００２８】[0028]
【表１】 [Table 1]
【００２９】該方法により得られた導電性複合体を５ｍ
ｍ×１０ｍｍの大きさに切り出し、両面に金属電極（ニ
ッケル箔，厚み；３００ｎｍ）を１５０℃、１５０ｋｇ
／ｃｍ2 で熱圧着し、該電極からリード線を半田接続し
て取り出し、−２０〜６０℃で温度と導通抵抗の関係を
測定した。The conductive composite obtained by the method is 5 m
Cut out into a size of mx 10 mm, and have metal electrodes (nickel foil, thickness: 300 nm) on both sides at 150 ° C and 150 kg.
/ Thermocompression bonding in cm 2, taken out by solder connection of the leads from the electrodes, to measure the relationship between conduction resistance temperature at -20 to 60 ° C..
【００３０】また、降温後の復帰性を確認するために、
−２０℃での導通抵抗を再測定した。結果を表２に示
す。In order to confirm the recoverability after cooling,
The conduction resistance at -20 ° C was measured again. Table 2 shows the results.
【００３１】[0031]
【表２】 [Table 2]
【００３２】《実施例２》側鎖結晶性重合体として、Ｃ
１６Ａ／ＥＡ／ＨＥＡ（８０／２０／２）（融点；２０
℃）を用いた以外実施例１と同様にして、温度−導通抵
抗の関係を測定した。結果を表２に併記した。Example 2 As a side chain crystalline polymer, C was used.
16A / EA / HEA (80/20/2) (melting point; 20
The temperature-conduction resistance relationship was measured in the same manner as in Example 1 except that (° C.) Was used. The results are also shown in Table 2.
【００３３】《実施例３》側鎖型重合体として、Ｃ１２
Ａ／ＥＡ／ＨＥＡ（９０／１０／２）（融点；０℃）を
用いた以外、実施例１と同様にして、温度−導通抵抗の
関係を測定した。結果を表２に併記した。Example 3 As a side chain type polymer, C12 was used.
The relationship between temperature and conduction resistance was measured in the same manner as in Example 1 except that A / EA / HEA (90/10/2) (melting point; 0 ° C.) was used. The results are also shown in Table 2.
【００３４】[0034]
【発明の効果】以上説明した通り、本発明によれば、樹
脂と導電性材料とからなる導電性複合材料組成物におい
て、樹脂が、少なくとも１００℃以下に融点を有する側
鎖結晶性重合体を含む架橋物を主体とするために、これ
を成形して得られる導電性複合体のＴｓは、１００℃以
下の低い温度で急峻で大きな導通抵抗値変化を示し、か
つこの導通抵抗値変化の再現性に優れた導電性複合体を
得ることができ、工業的メリットは大である。As described above, according to the present invention, in a conductive composite material composition comprising a resin and a conductive material, the resin is a side chain crystalline polymer having a melting point of at least 100 ° C. or lower. Since the main component is the cross-linked product containing Ts, the Ts of the conductive composite obtained by molding this shows a sharp and large change in the conduction resistance value at a low temperature of 100 ° C. or lower, and the reproduction of the change in the conduction resistance value. A conductive composite having excellent properties can be obtained, which has great industrial merit.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｌ 101/00 Ｃ０８Ｌ 101/00 Ｈ０１Ｂ 1/20 Ｈ０１Ｂ 1/20 Ｚ (72)発明者 加藤 松生 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮工場内 (72)発明者 山田 三男 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 (72)発明者 上原 寿茂 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C08L 101/00 C08L 101/00 H01B 1/20 H01B 1/20 Z (72) Inventor Matsuo Kato Ibaraki 1150 Goshomiya, Shimodate, Shiga Prefecture, Japan Gotomiya Plant, Hitachi Chemical Co., Ltd. (72) Inventor, Mitsuo Yamada, 1500 Ogawa, Shimodate City, Ibaraki, Shimodate Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor, Hisashige Uehara Ibaraki Shimodate City, Oita 1500 Ogawa, Hitachi Chemical Co., Ltd. Shimodate Research Center
Claims (4)
と導電性材料とからなる導電性複合材料組成物におい
て、該樹脂１００重量部に対して導電性材料が２０〜１
０００重量部含まれることを特徴とする導電性複合材料
組成物。1. A conductive composite material composition comprising a resin containing at least a side chain crystalline polymer and a conductive material, wherein the conductive material is 20 to 1 with respect to 100 parts by weight of the resin.
The conductive composite material composition is contained in an amount of 000 parts by weight.
系共重合体であることを特徴とする請求項１記載の導電
性複合材料組成物。2. The conductive composite material composition according to claim 1, wherein the side chain crystalline polymer is a (meth) acrylic copolymer.
成形したことを特徴とする導電性複合体。3. A conductive composite material obtained by molding the conductive composite material composition according to claim 1.
グ温度（Ｔｓ）を有することを特徴とする請求項３記載
の導電性複合体。4. The conductive composite according to claim 3, wherein the conductive composite has a switching temperature (Ts) of room temperature or lower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27516495A JPH09115703A (en) | 1995-10-24 | 1995-10-24 | Conductive composite material composition and conductive composite obtained by molding it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27516495A JPH09115703A (en) | 1995-10-24 | 1995-10-24 | Conductive composite material composition and conductive composite obtained by molding it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09115703A true JPH09115703A (en) | 1997-05-02 |
Family
ID=17551571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27516495A Pending JPH09115703A (en) | 1995-10-24 | 1995-10-24 | Conductive composite material composition and conductive composite obtained by molding it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09115703A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100453681B1 (en) * | 2002-01-16 | 2004-10-20 | 한국원자력연구소 | Method for preparing conductive polymer for overcurrent protection |
| WO2006098283A1 (en) * | 2005-03-16 | 2006-09-21 | Idemitsu Kosan Co., Ltd. | Resin composition, process for producing the same and molding of the resin composition |
| CN102850543A (en) * | 2012-09-28 | 2013-01-02 | 中国科学院宁波材料技术与工程研究所 | Graphene/conductive polymer composite material and preparation method thereof |
| CN103194059A (en) * | 2013-04-07 | 2013-07-10 | 常州大学 | Low-cost and low-additive-quantity conductive nylon 6 composite material and preparation method thereof |
| CN103971870A (en) * | 2014-02-19 | 2014-08-06 | 贵州凯里经济开发区中昊电子有限公司 | Polymer thermosensitive resistor core material and product preparation method thereof |
| CN113881229A (en) * | 2021-10-27 | 2022-01-04 | 华中科技大学 | Stretchable conductive composite material and preparation method and application thereof |
-
1995
- 1995-10-24 JP JP27516495A patent/JPH09115703A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100453681B1 (en) * | 2002-01-16 | 2004-10-20 | 한국원자력연구소 | Method for preparing conductive polymer for overcurrent protection |
| WO2006098283A1 (en) * | 2005-03-16 | 2006-09-21 | Idemitsu Kosan Co., Ltd. | Resin composition, process for producing the same and molding of the resin composition |
| JP2006257242A (en) * | 2005-03-16 | 2006-09-28 | Idemitsu Kosan Co Ltd | Resin composition, method for producing the same and moldings thereof |
| US7981959B2 (en) | 2005-03-16 | 2011-07-19 | Idemitsu Kosan Co., Ltd. | Resin composition, process for producing the same and molding of the resin composition |
| CN102850543A (en) * | 2012-09-28 | 2013-01-02 | 中国科学院宁波材料技术与工程研究所 | Graphene/conductive polymer composite material and preparation method thereof |
| CN103194059A (en) * | 2013-04-07 | 2013-07-10 | 常州大学 | Low-cost and low-additive-quantity conductive nylon 6 composite material and preparation method thereof |
| CN103971870A (en) * | 2014-02-19 | 2014-08-06 | 贵州凯里经济开发区中昊电子有限公司 | Polymer thermosensitive resistor core material and product preparation method thereof |
| CN113881229A (en) * | 2021-10-27 | 2022-01-04 | 华中科技大学 | Stretchable conductive composite material and preparation method and application thereof |
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