JPH09104094A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH09104094A JPH09104094A JP7264199A JP26419995A JPH09104094A JP H09104094 A JPH09104094 A JP H09104094A JP 7264199 A JP7264199 A JP 7264199A JP 26419995 A JP26419995 A JP 26419995A JP H09104094 A JPH09104094 A JP H09104094A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- solvent
- resin liquid
- component
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高周波領域におけ
る誘電特性の優れた積層板の製造方法に関し、特にエポ
キシ樹脂とポリフェニレンエーテルを樹脂成分として含
有する樹脂液を使用して製造する積層板の製造方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminated board having excellent dielectric properties in a high frequency range, and particularly to a laminated board produced by using a resin liquid containing an epoxy resin and polyphenylene ether as a resin component. Regarding the method.
【０００２】[0002]
【従来の技術】いわゆる高周波領域で使用する積層板に
は、優れた高周波特性、特に誘電特性において優れてい
ることが要求される。すなわち、広い周波数範囲、温度
範囲及び湿度範囲で誘電率及び誘電損失がいずれも一定
で、かつ、望ましくは低い材料でなければならない。2. Description of the Related Art Laminates used in the so-called high frequency range are required to have excellent high frequency characteristics, particularly excellent dielectric characteristics. That is, the material should have a constant permittivity and a constant dielectric loss in a wide frequency range, temperature range, and humidity range, and preferably a low material.
【０００３】従来、このような用途で使用する積層板と
して、特公昭６４−３２２３号で開示されているよう
に、エポキシ樹脂を主成分として含み、さらにポリフェ
ニレンエーテルをも含む樹脂成分と溶媒を含有してなる
溶液を使用して得られる積層板が知られている。そし
て、その製造方法としては、エポキシ樹脂とポリフェニ
レンエーテルの共通溶媒（例えばクロロホルム）に樹脂
成分であるエポキシ樹脂とポリフェニレンエーテルを溶
解して透明な樹脂液とし、この樹脂液にガラスクロス等
の基材を浸漬し、次いで溶媒を除去してプリプレグを作
製し、このプリプレグを複数枚積層し、加熱成形して積
層板を製造するのが一般的である。Conventionally, as a laminate used for such an application, as disclosed in JP-B-64-3223, it contains an epoxy resin as a main component, and further contains a resin component also containing polyphenylene ether and a solvent. Laminates obtained by using the solution prepared as above are known. Then, as a manufacturing method thereof, the epoxy resin and the polyphenylene ether which are the resin components are dissolved in a common solvent (for example, chloroform) of the epoxy resin and the polyphenylene ether to obtain a transparent resin liquid, and the resin liquid is used as a base material such as glass cloth. It is general that the prepreg is dipped, then the solvent is removed to produce a prepreg, and a plurality of the prepregs are laminated and heat-molded to produce a laminated plate.
【０００４】しかし、上記の製造方法では透明な樹脂液
とするための溶媒の種類について、ポリフェニレンエー
テルの溶解性の点で選択の幅が限定され、具体的には環
境問題の点で好ましくないとされているクロロホルム等
の塩素系溶媒を使用せざるを得ない状況である。そのた
め、塩素系溶媒を用いずに誘電特性等の性能の優れた積
層板を製造する方法が求められている。その解決手段と
して、例えば特公昭６３−３９４０４号に記載されてい
るような、樹脂液を加熱保持してプリプレグを製造する
方法が考えられるが、樹脂液の加熱保持には複雑な設備
が必要であり、かつ、加熱保持された樹脂液は取扱性、
作業安全性、環境問題等の点で問題があるので、樹脂液
を加熱保持することを必須条件としない他の解決手段の
開発が望まれている。However, in the above-mentioned production method, the range of selection is limited in terms of the solubility of polyphenylene ether with respect to the type of solvent for forming a transparent resin liquid, and it is not preferable in view of environmental problems. It is a situation in which there is no choice but to use a chlorine-based solvent such as chloroform. Therefore, there is a demand for a method for producing a laminated plate having excellent performance such as dielectric properties without using a chlorine-based solvent. As a means for solving the problem, a method of producing a prepreg by heating and holding a resin liquid as described in, for example, JP-B-63-39404 can be considered, but heating and holding the resin liquid requires complicated equipment. Yes, and the resin liquid heated and held is easy to handle.
Since there are problems in terms of work safety, environmental problems, etc., there is a demand for the development of another solution that does not make it necessary to heat and retain the resin liquid.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上記のよう
な事情に鑑みてなされたものであり、エポキシ樹脂とポ
リフェニレンエーテルを樹脂成分として含有し、この樹
脂成分と溶媒を含有してなる樹脂液を使用して製造する
誘電特性の優れた積層板の製造方法であって、得られる
積層板の性能を低下させることなく、樹脂液とするため
の溶媒として、塩素系溶媒以外の溶媒を使用可能にする
新たな製造方法を提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and contains an epoxy resin and polyphenylene ether as a resin component, and a resin containing the resin component and a solvent. A method for producing a laminate having excellent dielectric properties, which is produced using a liquid, wherein a solvent other than a chlorine-based solvent is used as a solvent for forming a resin liquid without deteriorating the performance of the obtained laminate. It is intended to provide a new manufacturing method that enables the manufacturing.
【０００６】[0006]
【課題を解決するための手段】請求項１に係る発明の積
層板の製造方法は、エポキシ樹脂を主成分として含み、
さらにポリフェニレンエーテルをも含む樹脂成分と溶媒
を含有してなる樹脂液を調整し、次いで、この樹脂液か
ら溶媒を除去して得たシートを加熱成形して積層板を製
造する積層板の製造方法において、樹脂液として平均粒
子径が０．１〜１００μｍである前記樹脂成分の粒子が
分散している不透明な樹脂液を使用することを特徴とす
る。A method for manufacturing a laminated board of the invention according to claim 1 contains an epoxy resin as a main component,
Further, a method for producing a laminated plate, in which a resin liquid containing a resin component also containing polyphenylene ether and a solvent is prepared, and then the solvent is removed from the resin liquid to form a sheet by thermoforming the sheet In the above, as the resin liquid, an opaque resin liquid in which particles of the resin component having an average particle diameter of 0.1 to 100 μm are dispersed is used.
【０００７】請求項２に係る発明の積層板の製造方法
は、請求項１記載の製造方法において、樹脂成分の組成
が、樹脂成分の合計１００重量部に対しエポキシ樹脂が
５０〜９０重量部であり、ポリフェニレンエーテルが４
５〜９重量部であることを特徴とする。According to a second aspect of the present invention, there is provided a method for producing a laminated board according to the first aspect, wherein the composition of the resin component is 50 to 90 parts by weight of the epoxy resin based on 100 parts by weight of the total resin component. Yes, 4 of polyphenylene ether
It is characterized in that it is 5 to 9 parts by weight.
【０００８】請求項３に係る発明の積層板の製造方法
は、請求項１又は請求項２記載の製造方法において、樹
脂液中の樹脂成分の含有割合が１０重量％以上であるこ
とを特徴とする。According to a third aspect of the present invention, there is provided a method for producing a laminated plate according to the first or second aspect, wherein the content of the resin component in the resin liquid is 10% by weight or more. To do.
【０００９】請求項４に係る発明の積層板の製造方法
は、請求項１から請求項３までのいずれかに記載の製造
方法において、溶媒として、ベンゼン、トルエン、キシ
レン、ケトン類及びアルコール類からなる群の中から選
ばれた少なくとも１種の溶媒を使用することを特徴とす
る。According to a fourth aspect of the present invention, there is provided a method for producing a laminated plate according to any one of the first to third aspects, wherein the solvent is selected from benzene, toluene, xylene, ketones and alcohols. It is characterized in that at least one solvent selected from the group consisting of
【００１０】請求項５に係る発明の積層板の製造方法
は、請求項１から請求項４までのいずれかに記載の製造
方法において、溶媒として、２種類以上の溶解性の異な
る溶媒を使用することを特徴とする。According to a fifth aspect of the present invention, there is provided a method for producing a laminated plate according to any one of the first to fourth aspects, wherein two or more solvents having different solubilities are used as the solvent. It is characterized by
【００１１】請求項６に係る発明の積層板の製造方法
は、請求項１から請求項５までのいずれかに記載の製造
方法において、樹脂液を一旦加温した後、冷却すること
によって、樹脂成分の粒子が分散している不透明な樹脂
液とすることを特徴とする。According to a sixth aspect of the present invention, there is provided a method for producing a laminated plate, which is the method according to any one of the first to fifth aspects, wherein the resin liquid is heated once and then cooled to obtain a resin. It is characterized by being an opaque resin liquid in which particles of the component are dispersed.
【００１２】請求項７に係る発明の積層板の製造方法
は、請求項６記載の製造方法において、樹脂液を一旦３
５℃以上にした後、冷却することによって、樹脂成分の
粒子が分散している不透明な樹脂液とすることを特徴と
する。According to a seventh aspect of the present invention, there is provided a method for producing a laminated plate according to the sixth aspect, wherein the resin solution is once
It is characterized in that an opaque resin liquid in which particles of a resin component are dispersed is obtained by cooling after the temperature is 5 ° C. or higher.
【００１３】請求項８に係る発明の積層板の製造方法
は、請求項６又は請求項７記載の製造方法において、樹
脂液の冷却時に溶媒を樹脂液に添加することを特徴とす
る。The method for manufacturing a laminated board of the invention according to claim 8 is characterized in that, in the manufacturing method according to claim 6 or 7, a solvent is added to the resin liquid when the resin liquid is cooled.
【００１４】[0014]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。Embodiments of the present invention will be described below.
【００１５】本発明では、エポキシ樹脂を主成分として
含み、さらにポリフェニレンエーテルをも含む樹脂成分
と溶媒を含有してなる樹脂液を調整して使用する。ここ
で主成分とは、樹脂成分中での含有割合（重量で）が最
も多い成分の意味である。In the present invention, a resin liquid containing an epoxy resin as a main component and a resin component also containing a polyphenylene ether and a solvent is prepared and used. Here, the main component means a component having the largest content ratio (by weight) in the resin component.
【００１６】本発明で使用するエポキシ樹脂は、１分子
当たり平均２個以上のエポキシ基を有する化合物であれ
ばよく、２種以上のエポキシ樹脂の混合物であってもよ
く、具体例としては、ビスフェノールＡ型エポキシ樹
脂、ノボラック型エポキシ樹脂等が挙げられる。そし
て、エポキシ樹脂を硬化させるための硬化剤や硬化促進
剤をエポキシ樹脂と共に樹脂成分中に含有させることが
望ましい。硬化剤としては、第１級アミン、第２級アミ
ン、酸無水物、フェノール樹脂等が使用でき、潜在性硬
化剤であるジシアンジアミドを使用すると、プリプレグ
等の加熱成形する前のシートの保存安定性をより良好に
できるので好ましい。硬化促進剤としてはイミダゾール
類、第３級アミン等が使用できる。また、本発明では樹
脂成分の組成として、樹脂成分の合計１００重量部に対
しエポキシ樹脂が５０〜９０重量部であることが望まし
く、５０重量部未満の場合は、積層板の吸水による電気
特性の低下という問題が生じ、９０重量部を越えると、
ポリフェニレンエーテルを含有させる量が少なくなり、
積層板の誘電率及び誘電損失を小さくするという誘電特
性的な利点が少なくなる。The epoxy resin used in the present invention may be a compound having an average of two or more epoxy groups per molecule, and may be a mixture of two or more epoxy resins. Specific examples include bisphenol. A type epoxy resin, a novolac type epoxy resin, etc. are mentioned. Then, it is desirable to include a curing agent and a curing accelerator for curing the epoxy resin in the resin component together with the epoxy resin. As the curing agent, primary amine, secondary amine, acid anhydride, phenolic resin, etc. can be used. When dicyandiamide, which is a latent curing agent, is used, the storage stability of the sheet before heat molding such as prepreg Is preferable because it can be improved. As the curing accelerator, imidazoles, tertiary amines, etc. can be used. In addition, in the present invention, the composition of the resin component is preferably 50 to 90 parts by weight of the epoxy resin with respect to 100 parts by weight of the total of the resin components. The problem of decrease occurs, and when it exceeds 90 parts by weight,
The amount of polyphenylene ether contained is reduced,
The dielectric property advantage of reducing the dielectric constant and dielectric loss of the laminate is reduced.
【００１７】本発明で使用するポリフェニレンエーテル
は、例えば下記の一般式化１で表されるものである。The polyphenylene ether used in the present invention is represented by the following general formula 1, for example.
【００１８】[0018]
【化１】 Embedded image
【００１９】上記の一般式化１中、Ｒは水素又は炭素数
１〜３の炭化水素基を表し、各Ｒは同じであってもよ
く、異なっていてもよい。また、ｎは繰り返し数を示す
正数である。In the above general formula 1, R represents hydrogen or a hydrocarbon group having 1 to 3 carbon atoms, and each R may be the same or different. Further, n is a positive number indicating the number of repetitions.
【００２０】ポリフェニレンエーテルの一例としてはポ
リ（２，６−ジメチル−１，４−フェニレンオキサイ
ド）が挙げられる。このようなポリフェニレンエーテル
は、例えばＵＳＰ 4059568号明細書に開示されている方
法で合成することができる。そして、特に限定するもの
ではないが、分子量（ＭW ）が50,000、ＭW ／Ｍn ＝4.
2 のポリマーが好ましく使用される。また、本発明では
樹脂成分の組成として、樹脂成分の合計１００重量部に
対しポリフェニレンエーテルが４５〜９重量部であるこ
とが望ましく、４５重量部を越える場合は、積層板の吸
水による電気特性の低下という問題が生じ、９重量部未
満の場合は、積層板の誘電率及び誘電損失を小さくする
という誘電特性的な利点が少なくなる。An example of polyphenylene ether is poly (2,6-dimethyl-1,4-phenylene oxide). Such polyphenylene ether can be synthesized, for example, by the method disclosed in USP 4059568. The molecular weight (M W ) is 50,000 and M W / M n = 4.
Two polymers are preferably used. In the present invention, the composition of the resin component is preferably 45 to 9 parts by weight of polyphenylene ether with respect to 100 parts by weight of the total of the resin components. When the amount is less than 9 parts by weight, the advantage of the dielectric property of reducing the dielectric constant and the dielectric loss of the laminated plate decreases.
【００２１】本発明で樹脂液を調整するために使用する
溶媒は、加熱等の手段により除去できる溶媒である。具
体的には、特に限定するものではないが、ベンゼン、ト
ルエン、キシレン、ケトン類及びアルコール類からなる
群の中から選ばれた少なくとも１種の溶媒を使用するこ
とが、樹脂液の均一性の点及び塩素系溶媒に比べて環境
に対する悪影響が少ない点で望ましい。The solvent used for preparing the resin liquid in the present invention is a solvent which can be removed by means such as heating. Specifically, although not particularly limited, it is preferable to use at least one solvent selected from the group consisting of benzene, toluene, xylene, ketones and alcohols to improve the homogeneity of the resin liquid. And is less harmful to the environment than chlorine-based solvents, which is desirable.
【００２２】本発明では、樹脂成分と溶媒を含む樹脂液
として、平均粒子径が０．１〜１００μｍである樹脂成
分の粒子が分散している不透明な樹脂液を使用する。こ
の不透明な樹脂液を得る方法としては、特に限定するも
のではないが、樹脂成分と溶媒を配合した後、一旦加温
して（好ましくは３５℃以上に加温して）樹脂成分の溶
解性を増大させた後、次いで冷却して不透明な分散液を
得ることが、得られる分散液の均一性の点から好まし
い。また、この冷却操作は分散液の取扱性、作業安全性
の点からも好ましい。また、樹脂液の冷却時に溶媒の一
部を添加して分散液を得ることは、冷却スピードを速く
できるので好ましく、その際に使用する溶媒としてはベ
ンゼン、トルエン、キシレン、ケトン類又はアルコール
類を使用することも可能であるが、これらより溶解性の
劣る溶媒を冷却時に添加する溶媒として使用すると、よ
り速く樹脂成分の粒子が析出するので好ましい。樹脂液
中に分散している樹脂成分の粒子の平均粒子径は０．１
〜１００μｍであることが重要である。平均粒子径が
０．１μｍ未満の場合には、樹脂液がワックス化してし
まい、均一な組成の加熱成形する前のシートを得ること
が困難となり、また１００μｍを越えるとガラスクロス
等の基材への均一な含浸が行えず、加熱成形する前のシ
ートの平滑性が損なわれるという問題が生じる。なお、
本発明における、樹脂液中に分散している粒子の平均粒
子径は、樹脂液を顕微鏡で観察して粒子径を測定する方
法により得ることができる。なお、樹脂液中の樹脂成分
の含有割合については、特に限定するものではないが、
１０重量％以上であることが、除去する溶媒を少なくす
る点から好ましい。In the present invention, an opaque resin liquid in which particles of the resin component having an average particle diameter of 0.1 to 100 μm are dispersed is used as the resin liquid containing the resin component and the solvent. The method for obtaining the opaque resin liquid is not particularly limited, but after the resin component and the solvent are mixed, the mixture is heated once (preferably at 35 ° C. or higher) to dissolve the resin component. It is preferable from the viewpoint of homogeneity of the resulting dispersion that the dispersion is increased and then cooled to obtain an opaque dispersion. Further, this cooling operation is preferable from the viewpoints of handling of the dispersion liquid and work safety. Further, it is preferable to add a part of the solvent at the time of cooling the resin liquid to obtain a dispersion liquid because the cooling speed can be increased, and the solvent used at that time is benzene, toluene, xylene, ketones or alcohols. It is possible to use, but it is preferable to use a solvent having a solubility lower than these as a solvent to be added during cooling, because particles of the resin component are precipitated more quickly. The average particle size of the resin component particles dispersed in the resin liquid is 0.1.
It is important that the thickness is ˜100 μm. If the average particle size is less than 0.1 μm, the resin liquid becomes wax, and it becomes difficult to obtain a sheet having a uniform composition before heat molding, and if it exceeds 100 μm, it becomes a base material such as glass cloth. However, there is a problem that the smoothness of the sheet before heat molding is impaired. In addition,
The average particle diameter of the particles dispersed in the resin liquid in the present invention can be obtained by a method of observing the resin liquid with a microscope to measure the particle diameter. The content ratio of the resin component in the resin liquid is not particularly limited,
It is preferably 10% by weight or more from the viewpoint of reducing the amount of solvent to be removed.
【００２３】本発明では、樹脂液から溶媒を除去してフ
ィルム、プリプレグ等のシートを作製する。シートがフ
ィルムの場合には、例えばキャスティング法により製造
でき、プリプレグの場合には、例えば含浸法により製造
できる。In the present invention, the solvent is removed from the resin liquid to prepare a sheet such as a film or prepreg. When the sheet is a film, it can be produced, for example, by a casting method, and when the sheet is a prepreg, it can be produced, for example, by an impregnation method.
【００２４】キャスティング法では、樹脂液を例えばキ
ャスティング用フィルム上に５〜７００μｍの厚みに塗
布し、次いで加熱して、溶媒を除去して樹脂成分よりな
るシート（フィルム）を得る。キャスティング用フィル
ムとしてはポリエステルフィルム、ポリイミドフィルム
などの樹脂液中の溶媒に不溶で、かつ、離型処理されて
いるものが好ましい。このようにしてガラスクロス等の
基材を使用していない、樹脂成分の含有率が高いシート
（フィルム）を製造することができる。In the casting method, for example, a resin liquid is applied to a film for casting in a thickness of 5 to 700 μm and then heated to remove the solvent to obtain a sheet (film) made of a resin component. As the casting film, those which are insoluble in the solvent in the resin liquid such as polyester film and polyimide film and which have been subjected to the mold release treatment are preferable. In this way, a sheet (film) having a high resin component content can be produced without using a substrate such as glass cloth.
【００２５】また、含浸法では樹脂液中にガラスクロス
等の基材を浸漬して、基材に樹脂液を含浸させ、ついで
加熱して溶媒を除去して基材に樹脂成分が付着したプリ
プレグを得る。プリプレグの樹脂成分含有率は、特に限
定しないが、３０〜６０重量％とするのが良好な性能の
積層板を得るには好ましい。基材としては、ガラス繊
維、アラミド繊維、ポリエステル繊維、ナイロン繊維等
の繊維を用いたクロス、マットもしくは不織布又はクラ
フト紙、リンター紙などを使用することができる。In the impregnation method, a base material such as glass cloth is dipped in a resin liquid to impregnate the base material with the resin liquid, and then heated to remove the solvent and the resin component adheres to the base material. To get The resin component content of the prepreg is not particularly limited, but is preferably 30 to 60% by weight in order to obtain a laminate having good performance. As the base material, cloth, matte or non-woven fabric, kraft paper, linter paper, or the like using fibers such as glass fiber, aramid fiber, polyester fiber, nylon fiber and the like can be used.
【００２６】上記のようにして得られたフィルム、プリ
プレグ等のシートを所定枚数組み合せ、必要に応じて銅
箔、アルミ箔等の金属箔も組み合わせて積層し、加熱硬
化させて積層板を得る。なお、フィルムとプリプレグを
組み合わせて積層するようにしてもよい。そして、加熱
硬化させるステップでは同時に加圧して成形することが
優れた性能の積層板を得るためには好ましい。このよう
にして得られる積層板は誘電率や誘電正接等が小さく、
かつ、吸水による電気特性が低下が少ないという優れた
性質を備える。また、その製造に際しては複雑な設備を
必要とすることもない。A predetermined number of sheets such as the films and prepregs obtained as described above are combined, and if necessary, metal foils such as copper foil and aluminum foil are combined and laminated, and heat-cured to obtain a laminated plate. The film and the prepreg may be combined and laminated. In the step of heating and curing, it is preferable to pressurize and mold at the same time in order to obtain a laminate having excellent performance. The thus obtained laminated plate has a small dielectric constant, dielectric loss tangent, etc.,
In addition, it has an excellent property that the electrical characteristics are not significantly deteriorated by water absorption. In addition, no complicated equipment is required for its manufacture.
【００２７】[0027]
【実施例】以下、本発明を実施例及び比較例に基づいて
説明する。The present invention will be described below based on examples and comparative examples.
【００２８】下記の実施例及び比較例では、表１、表２
に示す種類と配合量（重量部）の原材料を使用した。表
１、表２におけるエポキシ樹脂としてはエポキシ当量５
００のビスフェノールＡ型エポキシ樹脂を用い、ポリフ
ェニレンエーテル（以下ＰＰＥと称す）としては分子量
（ＭW ）が50,000、ＭW ／Ｍn ＝4.2 のポリ（２，６−
ジメチル−１，４−フェニレンオキサイド）を用いた。
また、エポキシ樹脂の硬化剤としてはジシアンジアミド
を、硬化促進剤としては２−メチルイミダゾールを表
１、表２に示す配合量（重量部）で使用した。In the following Examples and Comparative Examples, Table 1 and Table 2
Raw materials of the types and blending amounts (parts by weight) shown in were used. Epoxy equivalent of 5 as the epoxy resin in Table 1 and Table 2
Bisphenol A type epoxy resin of 00, polyphenylene ether (hereinafter referred to as PPE) having a molecular weight (M W ) of 50,000 and M W / M n = 4.2 of poly (2,6-
Dimethyl-1,4-phenylene oxide) was used.
Further, dicyandiamide was used as the curing agent for the epoxy resin, and 2-methylimidazole was used as the curing accelerator in the compounding amounts (parts by weight) shown in Tables 1 and 2.
【００２９】（実施例１〜実施例３）表１に示す原材料
を、それぞれの配合量だけセパラブルフラスコに入れ、
オイルバスを用いて８０℃で２時間加熱、攪拌した後、
オイルバスを取り除き、攪拌しながら空冷して２５℃の
樹脂液を得た。この樹脂液は、エポキシ樹脂、ジシアン
ジアミド、２−メチルイミダゾール及びＰＰＥを含有す
る樹脂成分の粒子が析出し、分散している不透明な分散
液であった。樹脂液中に分散している粒子の平均粒子径
を、樹脂液を顕微鏡で観察する方法で測定し、得られた
結果を表１に示した。次いで得られた樹脂液を、厚さが
０．１ｍｍのＥガラスからなるガラスクロスに含浸し、
ついで１３０℃で４分間乾燥して溶剤を除去して樹脂成
分の含有率が５０重量％のプリプレグを得た。なお、プ
リプレグの外観は全て均一であった。次いで、得られた
プリプレグ４枚を積層し、さらにその外側の両面に厚み
１８μｍの銅箔を配置して重ね合わせ、次いで温度２１
０℃、圧力３０ｋｇ／ｃｍ 2 で６０分間圧締して両面銅
張り積層板を得た。(Examples 1 to 3) Raw materials shown in Table 1
Put only the amount of each in a separable flask,
After heating and stirring at 80 ° C for 2 hours using an oil bath,
Remove the oil bath, air cool with stirring and
A resin solution was obtained. This resin liquid is epoxy resin, dicyan
Contains diamide, 2-methylimidazole and PPE
Opaque dispersion in which particles of resin component
It was a liquid. Average particle size of particles dispersed in resin liquid
Was measured by a method of observing the resin liquid with a microscope, and was obtained.
The results are shown in Table 1. Then, the obtained resin liquid is
Impregnate a glass cloth made of 0.1 mm E glass,
Then, dry at 130 ° C for 4 minutes to remove the solvent,
A prepreg having a content of 50% by weight was obtained. Note that
The appearance of the prepreg was all uniform. Then obtained
Four prepregs are laminated, and the thickness on both outer sides
Place 18 μm copper foil on top of each other, then heat at 21
0 ℃, pressure 30kg / cm TwoDouble sided copper for 60 minutes
A tension laminate was obtained.
【００３０】（実施例４）表１に示す原材料を、それぞ
れの配合量だけセパラブルフラスコに入れ、オイルバス
を用いて８０℃で２時間加熱、攪拌した後、オイルバス
を取り除き、攪拌しながら２０℃の水で冷却して２５℃
の樹脂液を得た。この樹脂液は、エポキシ樹脂、ジシア
ンジアミド、２−メチルイミダゾール及びＰＰＥを含有
する樹脂成分の粒子が析出し、分散している不透明な分
散液であった。樹脂液中に分散している粒子の平均粒子
径を、樹脂液を顕微鏡で観察する方法で測定したところ
１０μｍであった。次いで得られた樹脂液を、厚さが
０．１ｍｍのＥガラスからなるガラスクロスに含浸し、
ついで１３０℃で４分間乾燥して溶剤を除去して樹脂成
分の含有率が５０重量％のプリプレグを得た。なお、プ
リプレグの外観は均一であった。次いで、得られたプリ
プレグ４枚を積層し、さらにその外側の両面に厚み１８
μｍの銅箔を配置して重ね合わせ、次いで温度２１０
℃、圧力３０ｋｇ／ｃｍ2 で６０分間圧締して両面銅張
り積層板を得た。(Example 4) The raw materials shown in Table 1 were placed in a separable flask in the respective blending amounts, heated at 80 ° C for 2 hours in an oil bath and stirred, and then the oil bath was removed and stirred. 25 ℃ by cooling with 20 ℃ water
Was obtained. This resin liquid was an opaque dispersion liquid in which particles of a resin component containing an epoxy resin, dicyandiamide, 2-methylimidazole and PPE were deposited and dispersed. The average particle size of the particles dispersed in the resin liquid was measured by a method of observing the resin liquid with a microscope and found to be 10 μm. Then, the obtained resin liquid is impregnated into a glass cloth made of E glass having a thickness of 0.1 mm,
Then, the solvent was removed by drying at 130 ° C. for 4 minutes to obtain a prepreg having a resin component content of 50% by weight. The appearance of the prepreg was uniform. Then, the four prepregs obtained were laminated, and the thickness of 18
Arrange and superimpose copper foil of μm, then temperature 210
° C., to obtain a double-sided copper-clad laminate by pressing at a pressure 30kg / cm 2 60 min.
【００３１】（実施例５）表１に示す原材料を、それぞ
れの配合量だけセパラブルフラスコに入れ、オイルバス
を用いて８０℃で２時間加熱、攪拌した後、オイルバス
を取り除き、攪拌しながら空冷して、樹脂液の温度が４
０℃となったところで、攪拌しながら２５℃の水で冷却
して２５℃の樹脂液を得た。この樹脂液は、エポキシ樹
脂、ジシアンジアミド、２−メチルイミダゾール及びＰ
ＰＥを含有する樹脂成分の粒子が析出し、分散している
不透明な分散液であった。樹脂液中に分散している粒子
の平均粒子径を、樹脂液を顕微鏡で観察する方法で測定
したところ１８μｍであった。次いで得られた樹脂液
を、厚さが０．１ｍｍのＥガラスからなるガラスクロス
に含浸し、ついで１３０℃で４分間乾燥して溶剤を除去
して樹脂成分の含有率が５０重量％のプリプレグを得
た。なお、プリプレグの外観は均一であった。次いで、
得られたプリプレグ４枚を積層し、さらにその外側の両
面に厚み１８μｍの銅箔を配置して重ね合わせ、次いで
温度２１０℃、圧力３０ｋｇ／ｃｍ2 で６０分間圧締し
て両面銅張り積層板を得た。Example 5 The raw materials shown in Table 1 were placed in a separable flask in the respective blending amounts, heated at 80 ° C. for 2 hours in an oil bath and stirred, and then the oil bath was removed and stirred. After air cooling, the temperature of the resin liquid is 4
When it reached 0 ° C., it was cooled with water at 25 ° C. with stirring to obtain a resin liquid at 25 ° C. This resin liquid contains epoxy resin, dicyandiamide, 2-methylimidazole and P
It was an opaque dispersion liquid in which particles of a resin component containing PE were deposited and dispersed. The average particle diameter of the particles dispersed in the resin liquid was measured by a method of observing the resin liquid with a microscope and found to be 18 μm. Next, a glass cloth made of E glass having a thickness of 0.1 mm was impregnated with the obtained resin liquid, and then dried at 130 ° C. for 4 minutes to remove the solvent, and the prepreg having a resin component content of 50% by weight. Got The appearance of the prepreg was uniform. Then
The obtained four prepregs are laminated, and a copper foil having a thickness of 18 μm is further arranged on both outer surfaces of the prepregs, and the prepregs are superposed on each other. Then, the prepreg is pressed at a temperature of 210 ° C. and a pressure of 30 kg / cm 2 for 60 minutes to form a double-sided copper clad laminate Got
【００３２】（実施例６）表２に示す原材料を、それぞ
れの配合量だけセパラブルフラスコに入れ、オイルバス
を用いて８０℃で２時間加熱、攪拌した後、オイルバス
を取り除き、攪拌しながら２０℃の水で冷却して２５℃
の樹脂液を得た。この樹脂液は、エポキシ樹脂、ジシア
ンジアミド、２−メチルイミダゾール及びＰＰＥを含有
する樹脂成分の粒子が析出し、分散している不透明な分
散液であった。樹脂液中に分散している粒子の平均粒子
径を、樹脂液を顕微鏡で観察する方法で測定したところ
１５μｍであった。次いで得られた樹脂液を、厚さが
０．１ｍｍのＥガラスからなるガラスクロスに含浸し、
ついで１５０℃で２分間乾燥して溶剤を除去して樹脂成
分の含有率が５０重量％のプリプレグを得た。なお、プ
リプレグの外観は均一であった。次いで、得られたプリ
プレグ４枚を積層し、さらにその外側の両面に厚み１８
μｍの銅箔を配置して重ね合わせ、次いで温度２１０
℃、圧力３０ｋｇ／ｃｍ2 で６０分間圧締して両面銅張
り積層板を得た。Example 6 The raw materials shown in Table 2 were placed in separable flasks in the respective blending amounts, and the mixture was heated and stirred at 80 ° C. for 2 hours in an oil bath, and then the oil bath was removed and stirred. 25 ℃ by cooling with 20 ℃ water
Was obtained. This resin liquid was an opaque dispersion liquid in which particles of a resin component containing an epoxy resin, dicyandiamide, 2-methylimidazole and PPE were deposited and dispersed. The average particle size of the particles dispersed in the resin liquid was measured by a method of observing the resin liquid with a microscope and found to be 15 μm. Then, the obtained resin liquid is impregnated into a glass cloth made of E glass having a thickness of 0.1 mm,
Then, it was dried at 150 ° C. for 2 minutes to remove the solvent to obtain a prepreg having a resin component content of 50% by weight. The appearance of the prepreg was uniform. Then, the four prepregs obtained were laminated, and the thickness of 18
Arrange and superimpose copper foil of μm, then temperature 210
° C., to obtain a double-sided copper-clad laminate by pressing at a pressure 30kg / cm 2 60 min.
【００３３】（実施例７）表２に示す原材料の中のメチ
ルエチルケトン（以下ＭＥＫと称す）を除く原材料を、
それぞれの配合量だけセパラブルフラスコに入れ、オイ
ルバスを用いて８０℃で２時間加熱、攪拌した後、オイ
ルバスを取り除き、３０℃に保温していたＭＥＫを加え
攪拌混合した。次いで、攪拌しながら２０℃の水で冷却
して２５℃の樹脂液を得た。この樹脂液は、エポキシ樹
脂、ジシアンジアミド、２−メチルイミダゾール及びＰ
ＰＥを含有する樹脂成分の粒子が析出し、分散している
不透明な分散液であった。樹脂液中に分散している粒子
の平均粒子径を、樹脂液を顕微鏡で観察する方法で測定
したところ２０μｍであった。次いで得られた樹脂液
を、厚さが０．１ｍｍのＥガラスからなるガラスクロス
に含浸し、ついで１５０℃で２分間乾燥して溶剤を除去
して樹脂成分の含有率が５０重量％のプリプレグを得
た。なお、プリプレグの外観は均一であった。次いで、
得られたプリプレグ４枚を積層し、さらにその外側の両
面に厚み１８μｍの銅箔を配置して重ね合わせ、次いで
温度２１０℃、圧力３０ｋｇ／ｃｍ2 で６０分間圧締し
て両面銅張り積層板を得た。Example 7 The raw materials shown in Table 2 excluding methyl ethyl ketone (hereinafter referred to as MEK) were
The respective blending amounts were put into a separable flask, heated and stirred at 80 ° C. for 2 hours using an oil bath, the oil bath was removed, and MEK kept at 30 ° C. was added and mixed by stirring. Then, it was cooled with water at 20 ° C. with stirring to obtain a resin liquid at 25 ° C. This resin liquid contains epoxy resin, dicyandiamide, 2-methylimidazole and P
It was an opaque dispersion liquid in which particles of a resin component containing PE were deposited and dispersed. The average particle size of the particles dispersed in the resin liquid was measured by a method of observing the resin liquid with a microscope and found to be 20 μm. Next, a glass cloth made of E glass having a thickness of 0.1 mm was impregnated with the obtained resin liquid, and then dried at 150 ° C. for 2 minutes to remove the solvent, and the prepreg having a resin component content of 50% by weight. Got The appearance of the prepreg was uniform. Then
The obtained four prepregs are laminated, and a copper foil having a thickness of 18 μm is further arranged on both outer surfaces of the prepregs, and the prepregs are superposed on each other. Then, the prepreg is pressed at a temperature of 210 ° C. and a pressure of 30 kg / cm 2 for 60 minutes to form a double-sided copper clad laminate Got
【００３４】（実施例８）表２に示す原材料を、それぞ
れの配合量だけセパラブルフラスコに入れ、オイルバス
を用いて８０℃で２時間加熱、攪拌した後、オイルバス
を取り除き、攪拌しながら空冷し、樹脂液の温度が４０
℃となったところで、攪拌しながら２５℃の水で冷却し
て２５℃の樹脂液を得た。この樹脂液は、エポキシ樹
脂、ジシアンジアミド、２−メチルイミダゾール及びＰ
ＰＥを含有する樹脂成分の粒子が析出し、分散している
不透明な分散液であった。樹脂液中に分散している粒子
の平均粒子径を、樹脂液を顕微鏡で観察する方法で測定
したところ１５μｍであった。次いで得られた樹脂液
を、厚さが０．１ｍｍのＥガラスからなるガラスクロス
に含浸し、ついで１３０℃で４分間乾燥して溶剤を除去
して樹脂成分の含有率が５０重量％のプリプレグを得
た。なお、プリプレグの外観は均一であった。次いで、
得られたプリプレグ４枚を積層し、さらにその外側の両
面に厚み１８μｍの銅箔を配置して重ね合わせ、次いで
温度２１０℃、圧力３０ｋｇ／ｃｍ2 で６０分間圧締し
て両面銅張り積層板を得た。(Example 8) The raw materials shown in Table 2 were placed in a separable flask in the respective blending amounts, heated at 80 ° C for 2 hours in an oil bath and stirred, and then the oil bath was removed and stirred. After air cooling, the temperature of the resin liquid is 40
When the temperature reached ℃, it was cooled with water at 25 ℃ while stirring to obtain a resin liquid at 25 ℃. This resin liquid contains epoxy resin, dicyandiamide, 2-methylimidazole and P
It was an opaque dispersion liquid in which particles of a resin component containing PE were deposited and dispersed. The average particle size of the particles dispersed in the resin liquid was measured by a method of observing the resin liquid with a microscope and found to be 15 μm. Next, a glass cloth made of E glass having a thickness of 0.1 mm was impregnated with the obtained resin liquid, and then dried at 130 ° C. for 4 minutes to remove the solvent, and the prepreg having a resin component content of 50% by weight. Got The appearance of the prepreg was uniform. Then
The obtained four prepregs are laminated, and a copper foil having a thickness of 18 μm is further arranged on both outer surfaces of the prepregs, and the prepregs are superposed on each other. Then, the prepreg is pressed at a temperature of 210 ° C. and a pressure of 30 kg / cm 2 for 60 minutes to form a double-sided copper-clad laminate. Got
【００３５】（比較例１）表２に示す原材料を、それぞ
れの配合量だけセパラブルフラスコに入れ、２５℃で２
時間攪拌して、樹脂液を得た。この樹脂液は、ジシアン
ジアミド及びＰＰＥの単独成分の粒子が分散している不
透明な樹脂液であり、エポキシ樹脂、ジシアンジアミ
ド、２−メチルイミダゾール及びＰＰＥを含有する樹脂
成分の粒子は存在しなかった。従って、樹脂液中に分散
している前記樹脂成分の粒子の平均粒子径は測定できな
っかった。また、得られた樹脂液を、厚さが０．１ｍｍ
のＥガラスからなるガラスクロスに含浸し、ついで１３
０℃で４分間乾燥して溶剤を除去して樹脂成分の含有率
が５０重量％のプリプレグを得た。このプリプレグの外
観はジシアンジアミド及びＰＰＥが不均一に分散してい
るプリプレグであり、均一な性能が期待できないので成
形して積層板とすることは行わなかった。(Comparative Example 1) The raw materials shown in Table 2 were placed in a separable flask at the respective compounding amounts, and the contents were kept at 25 ° C for 2 hours.
After stirring for a time, a resin liquid was obtained. This resin liquid was an opaque resin liquid in which particles of a single component of dicyandiamide and PPE were dispersed, and particles of a resin component containing an epoxy resin, dicyandiamide, 2-methylimidazole and PPE were not present. Therefore, the average particle size of the particles of the resin component dispersed in the resin liquid cannot be measured. The thickness of the obtained resin liquid is 0.1 mm.
Impregnate a glass cloth made of E glass of
The solvent was removed by drying at 0 ° C for 4 minutes to obtain a prepreg having a resin component content of 50% by weight. The appearance of this prepreg is a prepreg in which dicyandiamide and PPE are non-uniformly dispersed, and uniform performance cannot be expected. Therefore, it was not formed into a laminated plate.
【００３６】（参考例）市販のＧ−１０グレ−ドの両面
銅張りガラスクロス基材エポキシ樹脂積層板を参考例と
して評価した。Reference Example A commercially available G-10 grade double-sided copper-clad glass cloth-based epoxy resin laminate was evaluated as a reference example.
【００３７】上記の実施例１〜実施例８で得られた両面
銅張り積層板及び参考例の積層板について誘電率、誘電
正接及び半田耐熱性の評価を行い、得られた結果を表
１、表２に示す。各試験方法はＪＩＳ規格Ｃ６４８１に
基づいて行った。表１及び表２の結果から、本発明の実
施例では、非塩素系溶媒を使用して製造しても、半田耐
熱性及び誘電特性の優れた積層板が得られていることが
確認できる。The double-sided copper-clad laminates obtained in Examples 1 to 8 and the laminate of the reference example were evaluated for dielectric constant, dielectric loss tangent and solder heat resistance, and the obtained results are shown in Table 1. It shows in Table 2. Each test method was performed based on JIS standard C6481. From the results of Table 1 and Table 2, it can be confirmed that, in the examples of the present invention, a laminate having excellent solder heat resistance and dielectric properties was obtained even when manufactured using a chlorine-free solvent.
【００３８】[0038]
【表１】 [Table 1]
【００３９】[0039]
【表２】 [Table 2]
【００４０】[0040]
【発明の効果】請求項１〜請求項８に係る発明の積層板
の製造方法は、エポキシ樹脂を主成分として含み、さら
にポリフェニレンエーテルをも含む樹脂成分と溶媒を含
有してなる樹脂液を調整し、次いで、この樹脂液から溶
媒を除去して得たシートを加熱成形して積層板を製造す
る積層板の製造方法において、樹脂液として平均粒子径
が０．１〜１００μｍである前記樹脂成分の粒子が分散
している不透明な樹脂液を使用する製造方法であるの
で、塩素系溶媒以外の溶媒を使用しても、半田耐熱性等
の性能を低下させることなく、誘電特性の優れた積層板
を製造することが可能となる。EFFECTS OF THE INVENTION The method for manufacturing a laminated board of the invention according to claims 1 to 8 prepares a resin liquid containing an epoxy resin as a main component and a resin component also containing polyphenylene ether and a solvent. Then, in the method for producing a laminated sheet, in which a sheet obtained by removing a solvent from this resin solution is heat-formed to produce a laminated sheet, the resin component having an average particle diameter of 0.1 to 100 μm as the resin solution Since it is a manufacturing method that uses an opaque resin liquid in which particles are dispersed, even if a solvent other than a chlorine-based solvent is used, it does not deteriorate the performance such as solder heat resistance, and has excellent dielectric properties. It becomes possible to manufacture a plate.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成７年１１月９日[Submission date] November 9, 1995
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項１[Correction target item name] Claim 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００６[Correction target item name] 0006
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００６】[0006]
【課題を解決するための手段】請求項１に係る発明の積
層板の製造方法は、エポキシ樹脂を主成分として含み、
さらにポリフェニレンエーテルをも含む樹脂成分と溶媒
を含有してなる樹脂液を調製し、次いで、この樹脂液か
ら溶媒を除去して得たシートを加熱成形して積層板を製
造する積層板の製造方法において、樹脂液として平均粒
子径が０．１〜１００μｍである前記樹脂成分の粒子が
分散している不透明な樹脂液を使用することを特徴とす
る。A method for manufacturing a laminated board of the invention according to claim 1 contains an epoxy resin as a main component,
Further, a method for producing a laminated plate, in which a resin liquid containing a resin component also containing polyphenylene ether and a solvent is prepared , and then a solvent is removed from the resin liquid to obtain a laminated sheet by thermoforming the obtained sheet In the above, as the resin liquid, an opaque resin liquid in which particles of the resin component having an average particle diameter of 0.1 to 100 μm are dispersed is used.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１５[Correction target item name] 0015
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１５】本発明では、エポキシ樹脂を主成分として
含み、さらにポリフェニレンエーテルをも含む樹脂成分
と溶媒を含有してなる樹脂液を調製して使用する。ここ
で主成分とは、樹脂成分中での含有割合（重量で）が最
も多い成分の意味である。In the present invention, a resin liquid containing an epoxy resin as a main component and a resin component also containing polyphenylene ether and a solvent is prepared and used. Here, the main component means a component having the largest content ratio (by weight) in the resin component.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００４０[Correction target item name] 0040
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００４０】[0040]
【発明の効果】請求項１〜請求項８に係る発明の積層板
の製造方法は、エポキシ樹脂を主成分として含み、さら
にポリフェニレンエーテルをも含む樹脂成分と溶媒を含
有してなる樹脂液を調製し、次いで、この樹脂液から溶
媒を除去して得たシートを加熱成形して積層板を製造す
る積層板の製造方法において、樹脂液として平均粒子径
が０．１〜１００μｍである前記樹脂成分の粒子が分散
している不透明な樹脂液を使用する製造方法であるの
で、塩素系溶媒以外の溶媒を使用しても、半田耐熱性等
の性能を低下させることなく、誘電特性の優れた積層板
を製造することが可能となる。EFFECTS OF THE INVENTION In the method for manufacturing a laminated board of the invention according to claims 1 to 8, a resin liquid containing an epoxy resin as a main component and a resin component also containing polyphenylene ether and a solvent is prepared. Then, in the method for producing a laminated sheet, in which a sheet obtained by removing a solvent from this resin solution is heat-formed to produce a laminated sheet, the resin component having an average particle diameter of 0.1 to 100 μm as the resin solution Since it is a manufacturing method that uses an opaque resin liquid in which particles are dispersed, even if a solvent other than a chlorine-based solvent is used, it does not deteriorate the performance such as solder heat resistance, and has excellent dielectric properties. It becomes possible to manufacture a plate.
Claims (8)
にポリフェニレンエーテルをも含む樹脂成分と溶媒を含
有してなる樹脂液を調整し、次いで、この樹脂液から溶
媒を除去して得たシートを加熱成形して積層板を製造す
る積層板の製造方法において、樹脂液として平均粒子径
が０．１〜１００μｍである前記樹脂成分の粒子が分散
している不透明な樹脂液を使用することを特徴とする積
層板の製造方法。1. A resin liquid containing an epoxy resin as a main component and a resin component also containing polyphenylene ether and a solvent is prepared, and then the solvent is removed from the resin liquid to heat a sheet obtained. In the method for producing a laminate by molding to produce a laminate, an opaque resin liquid in which particles of the resin component having an average particle diameter of 0.1 to 100 μm are dispersed is used as the resin liquid. A method of manufacturing a laminated plate.
０重量部に対しエポキシ樹脂が５０〜９０重量部であ
り、ポリフェニレンエーテルが４５〜９重量部であるこ
とを特徴とする請求項１記載の積層板の製造方法。2. The composition of the resin components is 10 in total.
An epoxy resin is 50-90 weight part with respect to 0 weight part, and polyphenylene ether is 45-9 weight part, The manufacturing method of the laminated board of Claim 1 characterized by the above-mentioned.
量％以上であることを特徴とする請求項１又は請求項２
記載の積層板の製造方法。3. The resin composition according to claim 1, wherein the content of the resin component in the resin liquid is 10% by weight or more.
A method for producing the laminated plate described.
レン、ケトン類及びアルコール類からなる群の中から選
ばれた少なくとも１種の溶媒を使用することを特徴とす
る請求項１から請求項３までのいずれかに記載の積層板
の製造方法。4. At least one solvent selected from the group consisting of benzene, toluene, xylene, ketones, and alcohols is used as a solvent, wherein the solvent is at least one solvent. The method for manufacturing a laminated board according to any one of the claims.
る溶媒を使用することを特徴とする請求項１から請求項
４までのいずれかに記載の積層板の製造方法。5. The method for producing a laminated plate according to claim 1, wherein two or more kinds of solvents having different solubilities are used as the solvent.
によって、樹脂成分の粒子が分散している不透明な樹脂
液とすることを特徴とする請求項１から請求項５までの
いずれかに記載の積層板の製造方法。6. The opaque resin liquid in which particles of a resin component are dispersed by heating the resin liquid once and then cooling the resin liquid, according to any one of claims 1 to 5. The method for manufacturing a laminated board as described in.
することによって、樹脂成分の粒子が分散している不透
明な樹脂液とすることを特徴とする請求項６記載の積層
板の製造方法。7. The production of a laminated plate according to claim 6, wherein the resin liquid is once heated to 35 ° C. or higher and then cooled to obtain an opaque resin liquid in which particles of the resin component are dispersed. Method.
ることを特徴とする請求項６又は請求項７記載の積層板
の製造方法。8. The method for producing a laminated plate according to claim 6, wherein a solvent is added to the resin liquid when the resin liquid is cooled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7264199A JPH09104094A (en) | 1995-10-12 | 1995-10-12 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7264199A JPH09104094A (en) | 1995-10-12 | 1995-10-12 | Manufacture of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09104094A true JPH09104094A (en) | 1997-04-22 |
Family
ID=17399867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7264199A Pending JPH09104094A (en) | 1995-10-12 | 1995-10-12 | Manufacture of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09104094A (en) |
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| US7393895B2 (en) | 2001-06-28 | 2008-07-01 | Sabic Innovative Plastics Ip B.V. | Forming concentrate of poly(arylene ether), thermosetting resin and compatibilizer |
| WO2013141255A1 (en) * | 2012-03-19 | 2013-09-26 | 旭化成イーマテリアルズ株式会社 | Prepreg comprising polyphenylene ether particles |
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-
1995
- 1995-10-12 JP JP7264199A patent/JPH09104094A/en active Pending
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|---|---|---|---|---|
| US7393895B2 (en) | 2001-06-28 | 2008-07-01 | Sabic Innovative Plastics Ip B.V. | Forming concentrate of poly(arylene ether), thermosetting resin and compatibilizer |
| US9258891B2 (en) | 2012-03-19 | 2016-02-09 | Asahi Kasei E-Materials Corporation | Prepreg comprising polyphenylene ether particles |
| WO2013141255A1 (en) * | 2012-03-19 | 2013-09-26 | 旭化成イーマテリアルズ株式会社 | Prepreg comprising polyphenylene ether particles |
| JP2013194138A (en) * | 2012-03-19 | 2013-09-30 | Asahi Kasei E-Materials Corp | Dispersion liquid including polyphenylene ether particle |
| JP2013194137A (en) * | 2012-03-19 | 2013-09-30 | Asahi Kasei E-Materials Corp | Prepreg including polyphenylene ether particle |
| US9485861B2 (en) | 2012-03-19 | 2016-11-01 | Asahi Kasei E-Materials Corporation | Prepreg comprising polyphenylene ether particles |
| JP2014139022A (en) * | 2012-03-19 | 2014-07-31 | Asahi Kasei E-Materials Corp | Prepreg containing polyphenylene ether particle |
| JP5580952B2 (en) * | 2012-03-19 | 2014-08-27 | 旭化成イーマテリアルズ株式会社 | Prepreg containing polyphenylene ether particles |
| KR101505358B1 (en) * | 2012-03-19 | 2015-03-23 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | Prepreg comprising polyphenylene ether particles |
| KR101529453B1 (en) * | 2012-03-19 | 2015-06-18 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | Prepreg comprising polyphenylene ether particles |
| JP2016128589A (en) * | 2012-06-29 | 2016-07-14 | サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ | Ultrafine poly(phenylene ether) particle and composition derived therefrom |
| JP2015522087A (en) * | 2012-06-29 | 2015-08-03 | サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ | Ultrafine poly (phenylene ether) particles and compositions derived therefrom |
| JP2014070087A (en) * | 2012-09-27 | 2014-04-21 | Asahi Kasei E-Materials Corp | Resin dispersion, resin composition, resin composition composite, and laminate sheet |
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