JPH09100448A - Peeling method of adhesive sheet - Google Patents
Peeling method of adhesive sheetInfo
- Publication number
- JPH09100448A JPH09100448A JP12465996A JP12465996A JPH09100448A JP H09100448 A JPH09100448 A JP H09100448A JP 12465996 A JP12465996 A JP 12465996A JP 12465996 A JP12465996 A JP 12465996A JP H09100448 A JPH09100448 A JP H09100448A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adhesive sheet
- peeling
- spraying
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、接着シートの剥離
方法に関するもので、特に、マーキィングフィルム等の
接着シートの剥離に好適な接着シートの剥離方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for peeling an adhesive sheet, and more particularly to a method for peeling an adhesive sheet suitable for peeling an adhesive sheet such as a marking film.
【０００２】[0002]
【従来の技術】マーキィングフィルム等の接着シート
は、広告板、四輪車、コンテナー類、その他の分野で汎
用されている。而して、上記の如き接着シートを貼り変
える場合等においては、上記接着シートを剥離する必要
があるが、従来、この剥離は、ヘラ（スクレーパー）等
で接着シートを掻き取る方法、及び溶剤を用いてシート
を膨潤又は溶解させて剥離する方法等の方法で行われて
いる。2. Description of the Related Art Adhesive sheets such as marking films are widely used in advertising boards, automobiles, containers, and other fields. Thus, in the case of reattaching the adhesive sheet as described above, it is necessary to peel off the adhesive sheet. Conventionally, this peeling is performed by scraping off the adhesive sheet with a spatula (scraper) or the like. It is carried out by a method such as a method of swelling or dissolving the sheet and peeling the sheet.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述の
剥離方法は、何れも、接着剤を被着体に残さずに且つ短
時間で労力を要することなくシートを被着体から剥離し
難く、特に、シートが大きい場合には多大な労力を要す
る。また、溶剤を用いる方法による場合、多量の溶剤を
必要とするため、溶剤蒸気が、揮散、充満し易く、臭気
がひどく、又危険性も大きい。However, in any of the above-described peeling methods, it is difficult to peel the sheet from the adherend without leaving the adhesive on the adherend and requiring a labor in a short time. However, if the sheet is large, a lot of labor is required. Further, in the case of using the solvent, a large amount of the solvent is required, so that the solvent vapor is easily vaporized and filled, the odor is bad, and the danger is great.
【０００４】従って、本発明の目的は、接着剤層を介し
て被着体に接着された接着シートを、接着剤を被着体に
残さずに且つ短時間で労力を要することなく被着体から
剥離できる接着シートの剥離方法を提供することにあ
る。Therefore, an object of the present invention is to adhere an adhesive sheet adhered to an adherend via an adhesive layer to the adherend without leaving the adhesive on the adherend and in a short time without labor. An object of the present invention is to provide a method for peeling an adhesive sheet that can be peeled from a sheet.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、種々検討
した結果、接着剤層を介して被着体に接着された接着シ
ートに温水を高圧で吹き付けることにより、上記目的を
達成し得ることを知見した。Means for Solving the Problems As a result of various studies, the inventors of the present invention can achieve the above object by blowing hot water at high pressure onto an adhesive sheet adhered to an adherend via an adhesive layer. I found out that.
【０００６】本発明は、上記知見に基づきなされたもの
で、被着体に接着剤層を介して接着された接着シート
に、４０〜９０℃の温水を常用吐出圧力３０Kg／cm2 以
上で吹き付けることを特徴とする接着シートの剥離方法
を提供するものである。The present invention has been made on the basis of the above findings, and hot water of 40 to 90 ° C. is sprayed onto an adhesive sheet adhered to an adherend via an adhesive layer at a regular discharge pressure of 30 kg / cm 2 or more. The present invention provides a method for peeling an adhesive sheet, which is characterized by the above.
【０００７】[0007]
【発明の実施の形態】以下、本発明の接着シートの剥離
方法をその実施態様に基づいて詳述する。先ず、温水を
高圧で吹き付けて接着シートを剥離する本発明の接着シ
ートの剥離方法をその実施態様について説明すると、こ
の実施態様においては、被着体に感圧接着剤（例えば、
（メタ）アクリル系粘着剤）等からなる接着剤層を介し
て接着されたシートに、４０〜９０℃の温水を常用吐出
圧力（吹き付け作業中におけるノズルの内圧）３０Kg／
cm2 以上で吹き付ける。温水の温度が４０℃未満である
と、シートや接着剤層が軟化し難いため、温水の常用吐
出圧力が３０Kg／cm 2 以上であっても、接着シートを被
着体から剥離し難く、反対に９０℃超であると、作業に
危険を伴うため好ましくない。又、温水の常用吐出圧力
が３０Kg／cm 2 未満では、ノズルからの温水の吐出圧力
が低いため、接着シートの剥離が困難である。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, peeling of the adhesive sheet of the present invention
The method will be described in detail based on its embodiment. First, warm water
The adhesive sheet of the present invention for peeling the adhesive sheet by spraying at high pressure
The peeling method of the sheet will be described with reference to its embodiment.
In an embodiment of, the pressure sensitive adhesive (eg,
Through an adhesive layer composed of (meth) acrylic adhesive
Discharge hot water of 40-90 ° C to the adhered sheet
Pressure (inner pressure of nozzle during spraying work) 30Kg /
cmTwoSpray it over. The temperature of hot water is below 40 ° C
When the sheet or adhesive layer does not soften easily,
Output pressure is 30 kg / cm TwoEven if the above, the adhesive sheet
It is difficult to peel off from the body, and on the other hand, if it is above 90 ° C
Not desirable as it involves danger. Also, regular discharge pressure of hot water
Is 30 kg / cm TwoDischarge pressure of hot water from the nozzle is less than
Is low, it is difficult to peel off the adhesive sheet.
【０００８】また、上記温水の吹き付けには、吹き付け
られる温水の直進性の高いノズルを使用するのが好まし
い。又、この吹き付けは、接着シートの周辺部（端部）
に向けて行うのが好ましく、通常、接着シートの周辺
部、特に接着剤層（粘着剤層）に向けて１０〜７０度、
好ましくは２０〜４５度の角度で１〜１００cm程度の距
離から行うのが好ましい。又、温水の吐出量は、特に制
限されないが、通常１〜１００リットル／分、好ましく
は５〜３０リットル／分、更に好ましくは１０〜２０リ
ットル／分である。For spraying the hot water, it is preferable to use a nozzle having high straightness of the sprayed hot water. In addition, this spray is applied to the peripheral part (edge) of the adhesive sheet.
It is preferable to carry out toward the periphery of the adhesive sheet, especially 10 to 70 degrees toward the adhesive layer (adhesive layer),
It is preferable to carry out at an angle of 20 to 45 degrees from a distance of about 1 to 100 cm. The discharge rate of hot water is not particularly limited, but is usually 1 to 100 liters / minute, preferably 5 to 30 liters / minute, and more preferably 10 to 20 liters / minute.
【０００９】また、上記温水には、接着シートの剥離を
促進させるために、必要に応じ、界面活性剤を０．２〜
５重量％含有させたり、アルコール系溶剤を０〜３０重
量％含有させることができる。含有させる好ましい界面
活性剤としては、例えば、アルキルベンゼンスルホン酸
ナトリウム系、脂肪酸塩系、アルキルサルフェート系、
アルキルアミン酢酸塩系、ポリオキシエチレンアルキル
エーテル系、ソルビタンエステル系のもの等が挙げら
れ、又、含有させる好ましいアルコール系溶剤として
は、イソプロピルアルコール、エタノール、ブタノー
ル、エチレングリコール、グリセリン、ジエチレングリ
コール、メタノール等が挙げられる。In addition, in order to accelerate the peeling of the adhesive sheet, the hot water may contain a surfactant in an amount of 0.2 to 0.2, if necessary.
5% by weight or an alcoholic solvent may be contained in an amount of 0 to 30% by weight. Preferred surfactants to be contained include, for example, sodium alkylbenzene sulfonates, fatty acid salts, alkyl sulphates,
Examples thereof include alkylamine acetate-based, polyoxyethylene alkyl ether-based, sorbitan ester-based ones, and preferable alcohol-based solvents to be contained include isopropyl alcohol, ethanol, butanol, ethylene glycol, glycerin, diethylene glycol, and methanol. Is mentioned.
【００１０】尚、本発明の接着シートの剥離方法は、接
着剤層を有するマーキィングフィルム等の接着シートで
あって比較的大きな広告用ステッカ、交通標識、道路標
識、案内板、広告看板、コンテナー類等の被着体から剥
離する場合に好適なものであるが、このような場合に制
限されないことは云う迄もない。The peeling method for an adhesive sheet of the present invention is an adhesive sheet such as a marking film having an adhesive layer, which is a relatively large advertising sticker, traffic sign, road sign, guide plate, advertising signboard, container. It is suitable for peeling from an adherend such as a class, but it goes without saying that it is not limited to such a case.
【００１１】[0011]
【実施例】次に、実施例及び比較例を挙げ、本発明の接
着シートの剥離方法を更に具体的に説明するが、本発明
の方法がこの実施例に制限されるものでないことは云う
迄もない。EXAMPLES Next, the peeling method of the adhesive sheet of the present invention will be described more specifically with reference to Examples and Comparative Examples, but it goes without saying that the method of the present invention is not limited to these Examples. Nor.
【００１２】実施例１〜３及び比較例１〜３ ・テスト用試料 アクリル系の感圧粘着剤層を有するマーキングフィルム
（ハイエスカル５０１０Ｍ：日本カーバイド工業（株）
製）を５０cm×１５cmの大きさに切り、厚さ１mmのＡｌ
板に貼付の上、２年間屋外曝露したものをテスト用試料
とした。Examples 1 to 3 and Comparative Examples 1 to 3 Test Samples Marking film having an acrylic pressure-sensitive adhesive layer (HIESCAL 5010M: Nippon Carbide Industry Co., Ltd.)
Made) and cut into a size of 50 cm x 15 cm, and 1 mm thick Al
The test sample was attached to a plate and exposed outdoors for 2 years.
【００１３】・テスト方法及び結果 直進型ノズル（口径：２．３mmφ）をセットした（株）
イワキ製温水ワッシャーＨＢ−１３００Ｒを用い、それ
ぞれ下記〔表１〕に示す条件で、テスト用試料における
マーキングフィルムの端部に約４５度の角度で約３０cm
の距離から水又は温水を吐出量１３リットル／分で吹付
けた。尚、比較例３においては、この吹き付けに先立っ
て、溶剤を、テスト用試料におけるマーキングフィルム
の表面に５ｇ塗布した。Test method and result: Straight nozzle (caliber: 2.3 mmφ) was set.
Using a warm water washer HB-1300R manufactured by Iwaki, under the conditions shown in the following [Table 1], the end of the marking film in the test sample is about 30 cm at an angle of about 45 degrees.
Water or warm water was sprayed at a discharge rate of 13 liters / minute from the distance. In Comparative Example 3, 5 g of the solvent was applied to the surface of the marking film in the test sample prior to the spraying.
【００１４】評価は、フィルムが全部剥がれるまでの時
間を測定すると共に、フィルムがはがれた後の糊（接着
剤）が残っている状態等を目視で判定することにより行
った。その結果を下記〔表１〕に示す。The evaluation was carried out by measuring the time until the film was completely peeled off and visually observing the state in which the adhesive (adhesive) remained after the film was peeled off. The results are shown in Table 1 below.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【発明の効果】本発明の接着シートの剥離方法によれ
ば、接着剤を被着体に残さずに且つ短時間で労力を要す
ることなく接着シートを被着体から剥離できると云う絶
大な効果が奏される。According to the method for peeling an adhesive sheet of the present invention, it is possible to peel the adhesive sheet from an adherend without leaving the adhesive on the adherend and in a short time without labor. Is played.
Claims (4)
着シートに、４０〜９０℃の温水を常用吐出圧力３０Kg
／cm2 以上で吹き付けることを特徴とする接着シートの
剥離方法。1. Hot water at 40 to 90 ° C. is constantly discharged at a pressure of 30 kg to an adhesive sheet adhered to an adherend via an adhesive layer.
A method for peeling an adhesive sheet, characterized by spraying at a rate of at least 1 cm 2 .
吹き付ける、請求項１記載の接着シートの剥離方法。2. The peeling method for an adhesive sheet according to claim 1, wherein the hot water is sprayed toward a peripheral portion of the adhesive sheet.
求項１記載の接着シートの剥離方法。3. The method for peeling an adhesive sheet according to claim 1, wherein the adhesive layer is made of a pressure sensitive adhesive.
着剤である、請求項３記載の接着シートの剥離方法。4. The method for peeling an adhesive sheet according to claim 3, wherein the pressure-sensitive adhesive is a (meth) acrylic adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8124659A JP2859847B2 (en) | 1996-05-20 | 1996-05-20 | Adhesive sheet peeling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8124659A JP2859847B2 (en) | 1996-05-20 | 1996-05-20 | Adhesive sheet peeling method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3372787A Division JPS63199784A (en) | 1987-02-17 | 1987-02-17 | Method of peeling adhesive sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09100448A true JPH09100448A (en) | 1997-04-15 |
| JP2859847B2 JP2859847B2 (en) | 1999-02-24 |
Family
ID=14890881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8124659A Expired - Lifetime JP2859847B2 (en) | 1996-05-20 | 1996-05-20 | Adhesive sheet peeling method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2859847B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002167568A (en) * | 2000-11-30 | 2002-06-11 | Nippon Fuirin Kk | Water-based self-adhesive remover |
| KR100987917B1 (en) * | 2006-09-29 | 2010-10-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing semiconductor device |
| US8137417B2 (en) | 2006-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| JP2013235276A (en) * | 2013-06-10 | 2013-11-21 | Semiconductor Energy Lab Co Ltd | Method for manufacturing semiconductor device |
| WO2019151194A1 (en) * | 2018-02-05 | 2019-08-08 | 日東電工株式会社 | Adhesive sheet and peeling method for adhesive sheet |
| WO2019235562A1 (en) * | 2018-06-08 | 2019-12-12 | 日立化成株式会社 | Method for manufacturing adhesive sheet, method for manufacturing dicing/die-bonding tape, method for manufacturing semiconductor device, method for treating adhesive, method for immobilizing adherend, and method for peeling adherend |
| CN111670230A (en) * | 2018-02-05 | 2020-09-15 | 日东电工株式会社 | Method for peeling adhesive sheet |
| WO2021024864A1 (en) * | 2019-08-02 | 2021-02-11 | 日東電工株式会社 | Pressure-sensitive adhesive sheet |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS517693A (en) * | 1974-07-10 | 1976-01-22 | Yaichi Okada | GENTEISOCHI |
-
1996
- 1996-05-20 JP JP8124659A patent/JP2859847B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS517693A (en) * | 1974-07-10 | 1976-01-22 | Yaichi Okada | GENTEISOCHI |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002167568A (en) * | 2000-11-30 | 2002-06-11 | Nippon Fuirin Kk | Water-based self-adhesive remover |
| US9472429B2 (en) | 2006-09-29 | 2016-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8043936B2 (en) | 2006-09-29 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9570329B2 (en) | 2006-09-29 | 2017-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| US8048770B2 (en) | 2006-09-29 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US10134784B2 (en) | 2006-09-29 | 2018-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| KR101154834B1 (en) * | 2006-09-29 | 2012-06-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing semiconductor device |
| US8137417B2 (en) | 2006-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| US8889438B2 (en) | 2006-09-29 | 2014-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| US9054141B2 (en) | 2006-09-29 | 2015-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9087931B2 (en) | 2006-09-29 | 2015-07-21 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| US9397126B2 (en) | 2006-09-29 | 2016-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| KR100987917B1 (en) * | 2006-09-29 | 2010-10-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing semiconductor device |
| US8048777B2 (en) | 2006-09-29 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2013235276A (en) * | 2013-06-10 | 2013-11-21 | Semiconductor Energy Lab Co Ltd | Method for manufacturing semiconductor device |
| WO2019151194A1 (en) * | 2018-02-05 | 2019-08-08 | 日東電工株式会社 | Adhesive sheet and peeling method for adhesive sheet |
| JP2020023656A (en) * | 2018-02-05 | 2020-02-13 | 日東電工株式会社 | Adhesive sheet and method for peeling adhesive sheet |
| CN111670230A (en) * | 2018-02-05 | 2020-09-15 | 日东电工株式会社 | Method for peeling adhesive sheet |
| CN111670234A (en) * | 2018-02-05 | 2020-09-15 | 日东电工株式会社 | Adhesive sheet and method for peeling adhesive sheet |
| CN112920738A (en) * | 2018-02-05 | 2021-06-08 | 日东电工株式会社 | Adhesive sheet and method for peeling adhesive sheet |
| CN112920738B (en) * | 2018-02-05 | 2022-08-16 | 日东电工株式会社 | Adhesive sheet and method for peeling adhesive sheet |
| US11970644B2 (en) | 2018-02-05 | 2024-04-30 | Nitto Denko Corporation | Method for peeling pressure-sensitive adhesive sheet |
| WO2019235562A1 (en) * | 2018-06-08 | 2019-12-12 | 日立化成株式会社 | Method for manufacturing adhesive sheet, method for manufacturing dicing/die-bonding tape, method for manufacturing semiconductor device, method for treating adhesive, method for immobilizing adherend, and method for peeling adherend |
| JPWO2019235562A1 (en) * | 2018-06-08 | 2021-06-24 | 昭和電工マテリアルズ株式会社 | Adhesive sheet manufacturing method, dicing / die bonding integrated tape manufacturing method, semiconductor device manufacturing method, adhesive processing method, adherend immobilization method, and adherend peeling method |
| WO2021024864A1 (en) * | 2019-08-02 | 2021-02-11 | 日東電工株式会社 | Pressure-sensitive adhesive sheet |
| JP2021024939A (en) * | 2019-08-02 | 2021-02-22 | 日東電工株式会社 | Pressure sensitive adhesive sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2859847B2 (en) | 1999-02-24 |
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