JPH0884278A - Solid-state image pickup device - Google Patents
Solid-state image pickup deviceInfo
- Publication number
- JPH0884278A JPH0884278A JP6217657A JP21765794A JPH0884278A JP H0884278 A JPH0884278 A JP H0884278A JP 6217657 A JP6217657 A JP 6217657A JP 21765794 A JP21765794 A JP 21765794A JP H0884278 A JPH0884278 A JP H0884278A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state image
- image pickup
- substrate
- pickup device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子内視鏡の先端部等
に配設される固体撮像装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device arranged at the tip of an electronic endoscope.
【０００２】[0002]
【従来の技術】近年、ＣＣＤ等の固体撮像素子を備えた
固体撮像装置がビデオカメラとか内視鏡などに広く用い
られている。例えば、内視鏡の挿入部先端部に小型の固
体撮像装置を配設して観察部位の画像を撮像し、得られ
た画像信号をビデオプロセッサ等で電気信号処理して内
視鏡観察画像をモニタ等に表示するようにした電子内視
鏡が種々用いられるようになった。2. Description of the Related Art In recent years, a solid-state image pickup device having a solid-state image pickup device such as a CCD has been widely used in video cameras, endoscopes and the like. For example, a small solid-state imaging device is provided at the tip of the insertion portion of an endoscope to capture an image of an observation site, and the resulting image signal is processed by an electrical signal with a video processor or the like to generate an endoscope observation image. Various electronic endoscopes that are designed to be displayed on a monitor have come to be used.
【０００３】このような内視鏡の先端部等に配設される
固体撮像装置としては、種々の構成のものが提案されて
いる。例えば、小型化のために固体撮像素子のベアチッ
プを撮像エリア側を基板に向けてフリップチップによっ
てフェイスダウン方式で基板に実装し、この基板と対物
光学系のレンズ枠とを結合して撮像ユニットを構成した
ものが提案されている。このような構成の固体撮像装置
の一例を図８に示す。Various types of solid-state image pickup devices have been proposed as such solid-state image pickup devices arranged at the distal end of the endoscope. For example, for downsizing, a bare chip of a solid-state image sensor is mounted on a substrate by a flip chip with the imaging area side facing the substrate by a face-down method, and the substrate and the lens frame of the objective optical system are coupled to form an imaging unit. A composition is proposed. FIG. 8 shows an example of the solid-state imaging device having such a configuration.
【０００４】固体撮像素子５１は、フリップチップ５２
によって基板５３の一方の面に実装されている。この固
体撮像素子５１は撮像エリアを基板５３側に向けたいわ
ゆるフェイスダウン方式で取り付けられ、固体撮像素子
５１の電極パッドと基板５３上に設けられたパッド部と
が電気的に接続されて固定されている。基板５３の中央
部には窓５４が形成され、固体撮像素子５１の撮像エリ
アに対向して開口している。基板５３の他方の面には、
対物レンズ５５を収納したレンズ枠５６が接着剤等によ
り接着固定されている。この対物レンズ５５を通過した
光束が固体撮像素子５１の撮像エリアに結像され、固体
撮像素子５１により撮像されて電気信号の画像信号に変
換されるようになっている。The solid-state image pickup device 51 is a flip chip 52.
Is mounted on one surface of the substrate 53. The solid-state imaging device 51 is attached by a so-called face-down method with the imaging area facing the substrate 53 side, and the electrode pads of the solid-state imaging device 51 and the pad portion provided on the substrate 53 are electrically connected and fixed. ing. A window 54 is formed in the center of the substrate 53, and the window 54 faces the image pickup area of the solid-state image pickup element 51 and opens. On the other surface of the substrate 53,
A lens frame 56 accommodating the objective lens 55 is adhesively fixed with an adhesive or the like. The light flux passing through the objective lens 55 is focused on the image pickup area of the solid-state image pickup device 51, picked up by the solid-state image pickup device 51, and converted into an image signal of an electric signal.
【０００５】[0005]
【発明が解決しようとする課題】図８に示した構成で
は、固体撮像素子５１を実装した基板５３と、対物レン
ズ５５を設けたレンズ枠５６とを、それぞれの光学中心
を合わせて結合し固定する必要がある。しかしながら、
組立工程において、対物レンズの光軸と固体撮像素子の
光学中心とが一致するよう調整して基板とレンズ枠とを
固定するのは容易でなく、調整作業に手間がかかるとい
う問題点がある。In the configuration shown in FIG. 8, the substrate 53 on which the solid-state image pickup device 51 is mounted and the lens frame 56 on which the objective lens 55 is provided are fixed by combining them with their optical centers aligned. There is a need to. However,
In the assembly process, it is not easy to adjust the optical axis of the objective lens and the optical center of the solid-state image sensor so that the substrate and the lens frame are fixed to each other, and there is a problem that the adjustment work takes time.
【０００６】本発明は、これらの事情に鑑みてなされた
もので、組立時の作業を簡略化でき、作業性が良好で容
易に組立を行うことが可能な固体撮像装置を提供するこ
とを目的としている。The present invention has been made in view of these circumstances, and an object of the present invention is to provide a solid-state image pickup device capable of simplifying the assembling work, having good workability, and capable of being easily assembled. I am trying.
【０００７】[0007]
【課題を解決するための手段】本発明による固体撮像装
置は、固体撮像素子をフリップチップによってフェイス
ダウン方式で基板に実装した撮像ユニットを備えた固体
撮像装置において、前記基板を略円形状に形成し、中央
部に対物光学系からの光を通す窓を設けると共に、前記
固体撮像素子を、前記窓に撮像エリアが対向し前記基板
の中心と該固体撮像素子の光学中心とが一致するように
前記基板の中央部に配置し、前記基板と対物光学系とを
収納する略円筒状のレンズ枠を設け、このレンズ枠内に
前記基板と対物光学系とを嵌入したものである。A solid-state image pickup device according to the present invention is a solid-state image pickup device including an image pickup unit in which a solid-state image pickup element is mounted on a substrate by a flip chip in a face-down manner, and the substrate is formed into a substantially circular shape. Then, a window that allows light from the objective optical system to pass through is provided in the central portion, and the solid-state imaging device is arranged so that the imaging area faces the window and the center of the substrate coincides with the optical center of the solid-state imaging device. A substantially cylindrical lens frame which is arranged in the central portion of the substrate and accommodates the substrate and the objective optical system is provided, and the substrate and the objective optical system are fitted in the lens frame.
【０００８】[0008]
【作用】略円形状の基板の中心と固体撮像素子の光学中
心とが一致するように固体撮像素子を基板の中央部に配
置し、この基板と対物光学系とを略円筒状のレンズ枠内
に嵌入することにより、前記基板の中心、前記固体撮像
素子の光学中心、及び前記対物光学系の光軸が一致す
る。The solid-state image pickup device is arranged in the central portion of the substrate so that the center of the substantially circular substrate and the optical center of the solid-state image pickup device coincide with each other, and the substrate and the objective optical system are arranged in a substantially cylindrical lens frame. The optical axis of the objective optical system and the optical center of the solid-state image sensor coincide with each other.
【０００９】[0009]
【実施例】以下、図面を参照して本発明の実施例を説明
する。図１は本発明の第１実施例に係る固体撮像装置の
主要部の構成を示す長手軸方向断面図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal axis direction sectional view showing the configuration of the main part of the solid-state imaging device according to the first embodiment of the present invention.
【００１０】本実施例の固体撮像装置は、ＣＣＤ，ＣＭ
Ｄ等からなる固体撮像素子１のベアチップを搭載するた
めの基板２を備えている。この基板２は、ガラスエポキ
シ樹脂等で形成されたプリント基板で構成され、略円形
状の形状をなし、中央部に対物光学系からの入射光を取
り入れる窓３が設けられている。The solid-state image pickup device of this embodiment is composed of CCD, CM.
A substrate 2 for mounting a bare chip of a solid-state imaging device 1 made of D or the like is provided. The substrate 2 is composed of a printed circuit board made of glass epoxy resin or the like, has a substantially circular shape, and has a window 3 at the center for taking in incident light from the objective optical system.
【００１１】固体撮像素子１は、撮像エリアを基板２側
に向けてフリップチップ４によってフェイスダウン方式
で基板２の中央部に実装されており、固体撮像素子１の
各端子と基板２上に設けられた電極部とが電気的に接続
されて固定されている。固体撮像素子１の撮像エリア
は、前記基板２の窓３に対向して配置され、窓３の開口
部より露呈している。基板２における固体撮像素子１と
反対側の面の窓３の部分には、カバーガラス５が接着剤
等により封止固定されている。このカバーガラス５を設
けることにより、撮像エリアへのゴミの付着を防止で
き、固体撮像素子を気密に保つ防湿構造とすることがで
きる。The solid-state image pickup device 1 is mounted in a central portion of the substrate 2 by a flip chip 4 with its image pickup area facing the substrate 2 side, and is provided on each terminal of the solid-state image pickup device 1 and the substrate 2. The fixed electrode part is electrically connected and fixed. The imaging area of the solid-state imaging device 1 is arranged so as to face the window 3 of the substrate 2 and is exposed from the opening of the window 3. A cover glass 5 is sealed and fixed by an adhesive or the like to the portion of the window 3 on the surface of the substrate 2 opposite to the solid-state image sensor 1. By providing this cover glass 5, it is possible to prevent dust from adhering to the image pickup area and to provide a moisture-proof structure that keeps the solid-state image pickup element airtight.
【００１２】前記固体撮像素子１と基板２とは、基板２
の中心と固体撮像素子１の撮像エリアの光学中心とが一
致するように取り付けられている。この固体撮像素子１
と基板２との位置出し・固定作業は、例えばパターン認
識により容易に自動で行うことができる。The solid-state image pickup device 1 and the substrate 2 are the substrate 2
Of the solid-state image sensor 1 and the optical center of the imaging area of the solid-state image sensor 1 are aligned. This solid-state image sensor 1
Positioning and fixing of the substrate 2 and the substrate 2 can be easily and automatically performed by pattern recognition, for example.
【００１３】固体撮像素子１及びカバーガラス５が実装
された基板２は、金属等の導電部材からなる円筒状に形
成されたレンズ枠６に基板２ごと挿入されてレンズ枠６
内に嵌合固定されている。このレンズ枠６は、後端側の
内径が絞られて断面がカギ状となった段部が形成されて
おり、レンズ枠６の内周面に円盤状の基板２の側面外周
部がほぼ一致して当接し、前記段部に基板２の固体撮像
素子１が設けられた後面が当接することで、基板２がレ
ンズ枠６内に位置決めされている。The substrate 2 on which the solid-state image pickup device 1 and the cover glass 5 are mounted is inserted together with the substrate 2 into a cylindrical lens frame 6 made of a conductive member such as metal to form the lens frame 6.
It is fitted and fixed inside. The lens frame 6 has a stepped portion whose inner diameter is narrowed on the rear end side and has a key-shaped cross section, and the inner peripheral surface of the lens frame 6 has a substantially outer peripheral side surface portion of the disk-shaped substrate 2. Then, the substrate 2 is positioned in the lens frame 6 by contacting the rear surface of the substrate 2 on which the solid-state imaging device 1 is provided on the stepped portion.
【００１４】また、レンズ枠６には、基板２の前方に固
体撮像素子１と対物光学系との所定の間隔を保持する間
隔管７が挿入され、間隔管７の後端面が基板２のカバー
ガラス５が設けられた前面と当接している。さらに、レ
ンズ枠６には間隔管７の前方に対物レンズ８が嵌入され
て対物レンズ８の後面が間隔管７の前端面に当接してお
り、この対物レンズ８は前面周縁部を接着剤で接着固定
されている。Further, in the lens frame 6, a space tube 7 for holding a predetermined space between the solid-state image pickup device 1 and the objective optical system is inserted in front of the substrate 2, and the rear end surface of the space tube 7 covers the substrate 2. It is in contact with the front surface provided with the glass 5. Further, an objective lens 8 is fitted in front of the spacing tube 7 in the lens frame 6, and a rear surface of the objective lens 8 is in contact with a front end surface of the spacing tube 7. The objective lens 8 has a front edge portion made of an adhesive. Adhesive fixed.
【００１５】本実施例では、レンズ枠６内において、基
板２と対物レンズ８とはレンズ枠６の内周面に嵌合して
おり、この嵌合によってそれぞれの中心が一致するよう
な構成になっているため、レンズ枠６内に組み付けるだ
けで特に調整しなくとも対物レンズ８の光軸と基板２に
固定された固体撮像素子１の光学中心とが一致する。In this embodiment, in the lens frame 6, the substrate 2 and the objective lens 8 are fitted to the inner peripheral surface of the lens frame 6, and the fitting makes the centers thereof coincide with each other. Therefore, the optical axis of the objective lens 8 and the optical center of the solid-state image pickup device 1 fixed to the substrate 2 coincide with each other only by assembling them in the lens frame 6 without any special adjustment.
【００１６】このように対物光学系の光軸と固体撮像素
子の光学中心とを一致させることによって、像の明るさ
が不均一になる、像がぼけたりゆがんだりする、像の一
部がケラレる、などの不具合を防止できる。By thus aligning the optical axis of the objective optical system with the optical center of the solid-state image sensor, the brightness of the image becomes uneven, the image becomes blurred or distorted, and part of the image is vignetted. You can prevent problems such as
【００１７】前記レンズ枠６及び間隔管７は、内面のレ
ンズ収容部に黒色処理が施されて不要な光線の乱反射を
防止している。The lens frame 6 and the interval tube 7 have their inner surfaces accommodated in a black color to prevent unnecessary diffuse reflection of light rays.
【００１８】前記基板２の後面には、固体撮像素子１と
電気的に接続された接続ピン９が延出しており、この接
続ピン９の端部に第２の基板としての接続基板１０が接
続されて基板２と略平行に配置されている。接続基板１
０は、ガラスエポキシ樹脂等で形成された信号伝送用の
回路パターンを有するプリント基板で構成され、固体撮
像素子１への駆動信号や固体撮像素子１からの出力信号
を伝送する信号ケーブル１１の芯線１１ａがハンダ付け
等により接続されている。なお、図示しないが、固体撮
像素子１の出力信号のインピーダンスを変換するインピ
ーダンス変換回路が設けられ、基板２あるいは接続基板
１０のいずれかに配置されている。A connection pin 9 electrically connected to the solid-state image pickup device 1 extends on the rear surface of the substrate 2, and a connection substrate 10 as a second substrate is connected to an end of the connection pin 9. And is arranged substantially parallel to the substrate 2. Connection board 1
Reference numeral 0 is a printed circuit board having a circuit pattern for signal transmission formed of glass epoxy resin or the like, and a core wire of a signal cable 11 for transmitting a drive signal to the solid-state image sensor 1 and an output signal from the solid-state image sensor 1. 11a are connected by soldering or the like. Although not shown, an impedance conversion circuit that converts the impedance of the output signal of the solid-state imaging device 1 is provided and is arranged on either the substrate 2 or the connection substrate 10.
【００１９】そして、信号ケーブル１１の総合シールド
１２がレンズ枠６の端部に電気的に接続され、この接続
部には軟銅線等の導線１３が巻き付けられて総合シール
ド１２の端部が固定されている。これにより、図１の撮
像ユニット全体がシールドされる。前記総合シールド１
２は、信号ケーブル１１の各芯線１１ａのシールドとも
導通している。総合シールド１２の内側の固体撮像素子
１、接続基板１０、及び芯線１１ａを含む部分は、軟性
樹脂または接着剤等の封止部材１４により封止されてい
る。封止部材１４を軟性のものとすることで、信号ケー
ブル１１の端部に多少の自由度を与えてケーブルに加わ
る応力を分散させるようにしている。信号ケーブル１１
の手元側端部には図示しないコネクタ部が設けられ、こ
のコネクタ部を介してカメラコントロールユニットと接
続されるようになっている。The overall shield 12 of the signal cable 11 is electrically connected to the end of the lens frame 6, and a conductor 13 such as annealed copper wire is wound around this connection to fix the end of the overall shield 12. ing. This shields the entire imaging unit of FIG. Comprehensive shield 1
2 is also electrically connected to the shield of each core wire 11a of the signal cable 11. A portion including the solid-state image sensor 1, the connection substrate 10, and the core wire 11a inside the general shield 12 is sealed by a sealing member 14 such as a soft resin or an adhesive. By making the sealing member 14 flexible, the end portion of the signal cable 11 is provided with some degree of freedom to disperse the stress applied to the cable. Signal cable 11
A connector portion (not shown) is provided at the end portion on the proximal side, and is connected to the camera control unit via this connector portion.
【００２０】レンズ枠６から総合シールド１２を含む信
号ケーブル１１の前端部にかけての外周部は、熱収縮チ
ューブ等からなる絶縁性部材の被覆チューブ１５で覆わ
れており、外部との絶縁が保たれている。The outer peripheral portion from the lens frame 6 to the front end portion of the signal cable 11 including the total shield 12 is covered with a coating tube 15 of an insulating member made of a heat shrink tube or the like to maintain insulation from the outside. ing.
【００２１】このような構成の撮像ユニットを組立てる
際には、まず、基板２の中心と固体撮像素子１の撮像エ
リアの光学中心とをパターン認識等により一致させた状
態で固体撮像素子１を基板２の一方の面にフェイスダウ
ン方式で取り付け、基板２の他方の面の中央部における
固体撮像素子１の撮像エリアが露呈した窓３の部分にカ
バーガラス５を封止固定する。そして、この固体撮像素
子１を実装した基板２を、カバーガラス５側を外側（前
側）に向けてレンズ枠６内に嵌入し、その後レンズ枠６
内に間隔管７，対物レンズ８を嵌入して対物レンズ８の
前面周縁部を接着固定する。When assembling the image pickup unit having such a structure, first, the solid-state image pickup device 1 is mounted on the substrate with the center of the substrate 2 and the optical center of the image pickup area of the solid-state image pickup device 1 being matched by pattern recognition or the like. The cover glass 5 is attached to one surface of the substrate 2 by a face-down method, and the cover glass 5 is sealed and fixed to a portion of the window 3 where the imaging area of the solid-state imaging device 1 is exposed in the central portion of the other surface of the substrate 2. Then, the substrate 2 on which the solid-state imaging device 1 is mounted is fitted into the lens frame 6 with the cover glass 5 side facing outward (front side), and then the lens frame 6 is inserted.
The interval tube 7 and the objective lens 8 are fitted inside and the front peripheral portion of the objective lens 8 is adhesively fixed.
【００２２】一方、基板２の固体撮像素子１が実装され
た後面側には接続ピン９を介して接続基板１０を配設
し、接続基板１０に信号ケーブル１１の芯線１１ａを接
続する。そして、信号ケーブル１１の総合シールド１２
と各芯線１１ａのシールドとを導通させ、総合シールド
１２をレンズ枠６の端部に接続し、この接続部に導線１
３を巻き付けることによって締め付け固定すると共に、
総合シールド１２の内側の固体撮像素子１，接続基板１
０，芯線１１ａを含む部分を封止部材１４で封止する。
その後、レンズ枠６から信号ケーブル１１の前端部にか
けての外周部を被覆チューブ１５で覆う。On the other hand, on the rear surface side of the board 2 on which the solid-state image pickup device 1 is mounted, a connection board 10 is arranged via connection pins 9, and the core wire 11a of the signal cable 11 is connected to the connection board 10. And the general shield 12 of the signal cable 11
And the shield of each core wire 11a are electrically connected to each other, the total shield 12 is connected to the end portion of the lens frame 6, and the conductor 1 is connected to this connection portion.
While tightening and fixing by winding 3
Solid-state image sensor 1 inside the integrated shield 12, connection board 1
A portion including 0 and the core wire 11 a is sealed with the sealing member 14.
After that, the outer peripheral portion from the lens frame 6 to the front end portion of the signal cable 11 is covered with the covering tube 15.
【００２３】本実施例の構成によれば、レンズ枠６内に
固体撮像素子１を実装した基板２と対物レンズ８とを組
み付けるだけで、対物レンズ８の光軸と基板２に固定さ
れた固体撮像素子１の光学中心とを容易に一致させるこ
とができ、光軸の調整作業を不要にすることが可能とな
る。よって、組立時の作業を簡略化でき、作業性が良好
で容易に組立を行うことができる。According to the structure of this embodiment, the optical axis of the objective lens 8 and the solid state fixed to the substrate 2 are simply assembled by assembling the substrate 2 on which the solid-state image pickup device 1 is mounted and the objective lens 8 in the lens frame 6. The optical center of the image sensor 1 can be easily aligned with each other, and the work of adjusting the optical axis can be eliminated. Therefore, the work at the time of assembling can be simplified, the workability is good, and the assembling can be easily performed.
【００２４】図２及び図３は本発明の第２実施例に係
り、図２は固体撮像素子を実装する基板の構成を示す斜
視図、図３は固体撮像装置の主要部の構成を示す長手軸
方向断面図である。2 and 3 relate to a second embodiment of the present invention. FIG. 2 is a perspective view showing a structure of a substrate on which a solid-state image pickup device is mounted, and FIG. 3 is a longitudinal view showing a structure of a main part of the solid-state image pickup device. It is an axial sectional view.
【００２５】第２実施例は固体撮像素子を実装する基板
の形状を変更した例である。本実施例において用いられ
る基板２１は、第１実施例のような円盤状の基板におけ
る外周部の一部を切り欠いた形状に形成されている。図
２の例では、基板の外周部の２ヶ所が平行した直線で切
り欠かれ、正面から見た形状が円弧と平行直線とを結ん
で形成された略長円状の外形形状となっている。The second embodiment is an example in which the shape of the substrate on which the solid-state image sensor is mounted is changed. The substrate 21 used in this embodiment is formed in a disk-shaped substrate as in the first embodiment by cutting out a part of the outer peripheral portion. In the example of FIG. 2, two portions on the outer peripheral portion of the substrate are cut out by parallel straight lines, and the shape viewed from the front has a substantially elliptical outer shape formed by connecting an arc and a parallel straight line. .
【００２６】基板２１は、第１実施例と同様に中央部に
設けられた窓に対向して固体撮像素子１がフェイスダウ
ン方式で取り付けられ、外周部の切り欠き部の側平面２
１ａには接続端子用の電極２２が設けられている。この
電極２２は固体撮像素子１の実装面の電極部と電気的に
接続され、固体撮像素子１の各端子と導通するようにな
っている。なお、電極２２を設ける側平面２１ａは、２
ヶ所対向して配設したものに限らず、基板の側面部に１
ヶ所または３ヶ所以上設けるようにしても良い。Similar to the first embodiment, the substrate 21 is mounted with the solid-state image pickup device 1 in a face-down manner so as to face the window provided in the central portion thereof, and the side flat surface 2 of the cutout portion of the outer peripheral portion.
An electrode 22 for a connection terminal is provided on 1a. The electrode 22 is electrically connected to the electrode portion of the mounting surface of the solid-state image sensor 1 and is electrically connected to each terminal of the solid-state image sensor 1. The side surface 21a on which the electrode 22 is provided is 2
It is not limited to those placed facing each other, but 1 on the side surface of the substrate.
It may be provided in three or more places.
【００２７】本実施例の固体撮像装置の主要部の構成を
図３に示す。固体撮像素子１及びカバーガラス５を実装
した基板２１，間隔管７，及び対物レンズ８は、第１実
施例と同様にレンズ枠６内に嵌入されて配設され、対物
レンズ８の光軸と基板２１の中心及び固体撮像素子１の
光学中心とが一致して組み付けられている。FIG. 3 shows the configuration of the main part of the solid-state image pickup device of this embodiment. The substrate 21, on which the solid-state imaging device 1 and the cover glass 5 are mounted, the interval tube 7, and the objective lens 8 are fitted and disposed in the lens frame 6 as in the first embodiment, and are arranged as an optical axis of the objective lens 8. The center of the substrate 21 and the optical center of the solid-state image sensor 1 are aligned and assembled.
【００２８】前記基板２１の後側には、第２の基板とし
てのフレキシブルプリント基板からなる接続基板２３
ａ，２３ｂが配設され、基板２１の側平面２１ａの電極
２２に接続基板２３ａ，２３ｂの端部の接点部がそれぞ
れハンダ付け等により接続されている。接続基板２３
ａ，２３ｂには信号伝送用の回路パターンが設けられ、
固体撮像素子１と電気的に接続されて固体撮像素子１へ
の駆動信号や固体撮像素子１からの出力信号を伝送する
ようになっている。これらの接続基板２３ａ，２３ｂ
は、細長に形成されて後方の図示しないコネクタ部まで
延設されており、複数箇所で折り曲げられて後側の面が
互いに近接して並行するように配置されている。すなわ
ち、本実施例では第１実施例の信号ケーブルの代わりに
接続基板２３ａ，２３ｂによって信号を伝送するような
構成となっており、接続基板２３ａ，２３ｂの手元側端
部がコネクタ部を介してカメラコントロールユニットと
接続されるようになっている。On the rear side of the board 21, a connection board 23 made of a flexible printed board as a second board.
a and 23b are provided, and the contact portions at the end portions of the connection substrates 23a and 23b are connected to the electrodes 22 on the side flat surface 21a of the substrate 21 by soldering or the like. Connection board 23
a and 23b are provided with circuit patterns for signal transmission,
It is configured to be electrically connected to the solid-state image sensor 1 to transmit a drive signal to the solid-state image sensor 1 and an output signal from the solid-state image sensor 1. These connection boards 23a, 23b
Are elongated and extend to a rear unillustrated connector portion, and are bent at a plurality of positions so that their rear surfaces are close to and parallel to each other. That is, in this embodiment, the connection boards 23a and 23b are used to transmit signals instead of the signal cables of the first embodiment, and the proximal ends of the connection boards 23a and 23b are connected via the connector section. It is designed to be connected to the camera control unit.
【００２９】基板２１の側平面２１ａを２ヶ所以上設け
る場合は、基板２１の電極２２を入力部と出力部とに分
けてそれぞれ別の面に配設し、接続基板２３ａ，２３ｂ
を入力側と出力側とに分けるようにする。図３の例で
は、接続基板２３ａを入力側、接続基板２３ｂを出力側
としている。出力側の接続基板２３ｂには、固体撮像素
子１の出力信号のインピーダンスを変換するインピーダ
ンス変換回路２４が配設されている。なお入力側と出力
側とを分離する場合、入力側については接続基板に限ら
ず、接続基板、信号ケーブルのいずれを設けるようにし
ても良い。When two or more side planes 21a of the substrate 21 are provided, the electrodes 22 of the substrate 21 are divided into an input portion and an output portion and are arranged on different surfaces, and the connection substrates 23a and 23b are provided.
Is divided into an input side and an output side. In the example of FIG. 3, the connection board 23a is the input side and the connection board 23b is the output side. An impedance conversion circuit 24 that converts the impedance of the output signal of the solid-state image sensor 1 is provided on the output-side connection board 23b. When the input side and the output side are separated, the input side is not limited to the connection board, and either the connection board or the signal cable may be provided.
【００３０】そして、レンズ枠６から接続基板２３ａ，
２３ｂの前端部にかけての外周部は、熱収縮チューブ等
からなる絶縁性部材の被覆チューブ１５で覆われてお
り、基板２１の後側で被覆チューブ１５の内側の固体撮
像素子１及び接続基板２３ａ，２３ｂの前端部を含む部
分は、軟性樹脂または接着剤等の封止部材１４により封
止されている。Then, from the lens frame 6 to the connection board 23a,
The outer periphery of the front end of 23b is covered with a coating tube 15 of an insulating member such as a heat-shrinkable tube, and the solid-state image sensor 1 and the connection substrate 23a inside the coating tube 15 on the rear side of the substrate 21. A portion including a front end portion of 23b is sealed by a sealing member 14 such as a soft resin or an adhesive.
【００３１】このような構成においても、第１実施例と
同様に、レンズ枠６内に固体撮像素子１を実装した基板
２１と対物レンズ８とを組み付けるだけで、略円形の基
板２１と対物レンズ８とがレンズ枠６内周面に嵌合する
ことによって対物レンズ８の光軸と基板２１に固定され
た固体撮像素子１の光学中心とを容易に一致させること
ができ、組立時の作業を簡略化して容易に組立を行うこ
とができる。また、本実施例では、フレキシブルプリン
ト基板により信号を伝送する構成としたため、構成の簡
略化によりコストを低減でき、また、信号ケーブルと接
続基板とのハンダ付け作業が不要となるため組立作業性
をより向上させることができる。Also in such a structure, as in the first embodiment, by only assembling the objective lens 8 and the substrate 21 on which the solid-state image pickup device 1 is mounted in the lens frame 6, the substantially circular substrate 21 and objective lens are assembled. The optical axis of the objective lens 8 and the optical center of the solid-state imaging device 1 fixed to the substrate 21 can be easily coincided with each other by fitting 8 and 8 to the inner peripheral surface of the lens frame 6, and the work at the time of assembly can be performed. It can be simplified and easily assembled. Further, in the present embodiment, since the signal is transmitted by the flexible printed circuit board, the cost can be reduced by the simplification of the configuration, and the work of assembling the signal cable and the connection substrate becomes unnecessary, so that the assembling workability is improved. It can be further improved.
【００３２】図４に第２実施例の変形例の構成を示す。
この変形例は、第２実施例のフレキシブルプリント基板
からなる接続基板を設けた構成と第１実施例の信号ケー
ブルを設けた構成とを合わせたものであり、接続基板の
後端側に信号ケーブルを接続してコネクタ部との間を中
継するように構成した例である。FIG. 4 shows the configuration of a modification of the second embodiment.
This modification is a combination of the configuration of the flexible printed circuit board of the second embodiment provided with the connection board and the configuration of the first embodiment provided with the signal cable. The signal cable is provided at the rear end side of the connection board. Is an example in which is connected to connect with the connector section.
【００３３】固体撮像素子１を実装した第２実施例と同
様の基板２１と接続されるフレキシブルプリント基板か
らなる接続基板２５ａ，２５ｂは、基板２１より後方へ
所定量延出するよう所定の長さに形成されて設けられて
いる。出力側の接続基板２５ｂには、固体撮像素子１の
出力信号のインピーダンスを変換するインピーダンス変
換回路２４が配設されている。The connection boards 25a and 25b, which are flexible printed boards and are connected to the same board 21 as that of the second embodiment, on which the solid-state image pickup device 1 is mounted, have a predetermined length so as to extend rearward from the board 21 by a predetermined amount. Is formed and provided. An impedance conversion circuit 24 that converts the impedance of the output signal of the solid-state imaging device 1 is provided on the connection board 25b on the output side.
【００３４】接続基板２５ａ，２５ｂの後端部には、信
号ケーブル２６の芯線２６ａがハンダ２７により接続さ
れている。信号ケーブル２６の手元側は図示しないコネ
クタ部と接続されている。信号ケーブル２６の芯線２６
ａのシールド２８は、接続基板との接続部より後側で露
呈するように成形され、信号ケーブル２６の総合シール
ド２９と接触して導通するようになっている。この芯線
のシールド２８と総合シールド２９との導通部には、軟
銅線等の導線３０が巻き付けられて総合シールド２９の
端部が固定されている。The core wire 26a of the signal cable 26 is connected to the rear ends of the connection boards 25a and 25b by solder 27. The proximal side of the signal cable 26 is connected to a connector portion (not shown). Core wire 26 of the signal cable 26
The shield 28 of a is formed so as to be exposed on the rear side of the connection portion with the connection board, and is brought into contact with the general shield 29 of the signal cable 26 to be electrically connected. A conductor wire 30 such as annealed copper wire is wound around the conducting portion between the shield 28 of the core wire and the general shield 29, and the end portion of the general shield 29 is fixed.
【００３５】なお、この変形例の構成では、接続基板２
５ａ，２５ｂはフレキシブルプリント基板に限らず、ガ
ラスエポキシ樹脂のプリント基板でも良い。In the structure of this modification, the connection board 2
5a and 25b are not limited to flexible printed boards, but may be printed boards of glass epoxy resin.
【００３６】信号ケーブルはフレキシブルプリント基板
よりも信号の伝送特性が良好であるため、本変形例によ
れば、第２実施例の構成の固体撮像装置について信頼性
及び性能をより向上させることができる。Since the signal cable has better signal transmission characteristics than the flexible printed circuit board, this modification can further improve the reliability and performance of the solid-state image pickup device having the configuration of the second embodiment. .
【００３７】ところで、固体撮像装置において、固体撮
像素子のベアチップを基板やパッケージ等のベース部材
に実装する場合に、固体撮像素子の各端子とベース部材
の電極とをボンディングワイヤで接続するいわゆるワイ
ヤボンディングを用いた構成のものがある。固体撮像素
子の実装にワイヤボンディングを用いた構成例を図５に
示す。固体撮像素子３１のベアチップは、パッケージ３
２の収納用凹部に配置され、固体撮像素子３１の両側端
部に設けられたボンディングパッド３１ａとこれらに対
応して設けられたパッケージ３２のボンディングパッド
３２ａとがボンディングワイヤ３３によって接続されて
いる。By the way, in a solid-state imaging device, when a bare chip of a solid-state imaging device is mounted on a base member such as a substrate or a package, so-called wire bonding is used to connect each terminal of the solid-state imaging device and an electrode of the base member with a bonding wire. There is a configuration using. FIG. 5 shows a configuration example using wire bonding for mounting the solid-state imaging device. The bare chip of the solid-state imaging device 31 is the package 3
Bonding pads 31a provided on both side ends of the solid-state imaging device 31 and bonding pads 32a of a package 32 provided corresponding to these are connected by bonding wires 33, which are arranged in the recesses for storage of two.
【００３８】通常、対物光学系の結像エリア３５は、固
体撮像素子３１の撮像有効エリア３４の対角を直径とす
る円と同じかそれよりも大きくなっている。図５の構成
のように、結像エリア３５内にボンディングワイヤ３３
が存在する場合は、図５の右側に示すように入射光３６
がボンディングワイヤ３３に当たって乱反射し、フレア
の原因となるなどの問題点が生じる。そこで、従来はワ
イヤボンディングの部分の光学系側にマスク等の遮光部
材を設ける必要があった。Usually, the image forming area 35 of the objective optical system is the same as or larger than a circle whose diameter is the diagonal of the image pickup effective area 34 of the solid-state image pickup device 31. As shown in the configuration of FIG. 5, the bonding wire 33 is formed in the imaging area 35.
Is present, the incident light 36 as shown on the right side of FIG.
Will hit the bonding wire 33 and will be irregularly reflected, causing problems such as flare. Therefore, conventionally, it is necessary to provide a light shielding member such as a mask on the optical system side of the wire bonding portion.
【００３９】固体撮像素子の実装にワイヤボンディング
を用いた固体撮像装置において、遮光部材を設ける必要
なくフレアの発生を防止できるようにした第１の構成例
を図６に示す。FIG. 6 shows a first configuration example in which the occurrence of flare can be prevented in a solid-state image pickup device using wire bonding for mounting the solid-state image pickup device without providing a light shielding member.
【００４０】第１の構成例における固体撮像素子４１
は、図５の例と同様にベアチップの両側端部にボンディ
ングパッド４１ａが設けられ、ボンディングワイヤ３３
によってパッケージのボンディングパッドと接続される
構成となっているが、これらのボンディングパッド４１
ａは撮像有効エリア３４の対角を直径とする円（すなわ
ち対物光学系の結像エリア３５）よりも外側に配設され
ている。Solid-state image sensor 41 in the first configuration example
In the same manner as in the example of FIG. 5, the bonding pads 41a are provided on both side ends of the bare chip, and the bonding wire 33
Are connected to the bonding pads of the package by these.
The symbol “a” is arranged outside the circle whose diameter is the diagonal of the effective imaging area 34 (that is, the imaging area 35 of the objective optical system).
【００４１】このように撮像有効エリア３４の対角を直
径とする円よりも外側にボンディングパッドを設けるこ
とにより、対物光学系からの入射光の乱反射を防ぐこと
ができ、遮光部材を設ける必要なくフレアの発生を防止
できる。By providing the bonding pad outside the circle whose diameter is the diagonal of the effective imaging area 34 in this way, it is possible to prevent irregular reflection of incident light from the objective optical system, and it is not necessary to provide a light shielding member. It is possible to prevent flare from occurring.
【００４２】続いて、図７に固体撮像素子の実装にワイ
ヤボンディングを用いた固体撮像装置において、遮光部
材を設ける必要なくフレアの発生を防止できるようにし
た第２の構成例を示す。Next, FIG. 7 shows a second configuration example in which the occurrence of flare can be prevented in a solid-state image pickup device using wire bonding for mounting the solid-state image pickup element without providing a light shielding member.
【００４３】第２の構成例は、固体撮像素子４５のベア
チップの裏面（撮像エリア４７と反対側の面）にボンデ
ィングパッド４５ａを設けた例であり、固体撮像素子４
５は基板４６の窓に撮像エリア４７を対向させて取り付
けられて接着剤等により接着固定されている。基板４６
の固体撮像素子４５が実装された面には、固体撮像素子
４５のボンディングパッド４５ａに対応して各パッドの
近傍にボンディングパッド４６ａが設けられ、固体撮像
素子のボンディングパッド４５ａと基板のボンディング
パッド４６ａとがボンディングワイヤ３３によってワイ
ヤボンディングされている。The second configuration example is an example in which a bonding pad 45a is provided on the back surface of the bare chip of the solid-state image pickup element 45 (the surface opposite to the image pickup area 47).
Reference numeral 5 is attached to the window of the substrate 46 so that the imaging area 47 faces it, and is fixedly adhered by an adhesive or the like. Board 46
On the surface on which the solid-state image sensor 45 is mounted, bonding pads 46a are provided in the vicinity of the pads corresponding to the bonding pads 45a of the solid-state image sensor 45. The bonding pad 45a of the solid-state image sensor and the bonding pad 46a of the substrate And are bonded by the bonding wire 33.
【００４４】このように固体撮像素子の裏面にボンディ
ングパッドを設けて構成することにより、対物光学系か
らの入射光３６はそのまま固体撮像素子４５の撮像エリ
ア４７に入射し、ボンディングワイヤ３３により散乱さ
れることがないため、入射光の乱反射の発生を防ぐこと
ができる。よって、遮光部材を設ける必要なくフレアの
発生を防止できる。Since the bonding pad is provided on the back surface of the solid-state image sensor in this way, the incident light 36 from the objective optical system enters the image-pickup area 47 of the solid-state image sensor 45 as it is and is scattered by the bonding wire 33. Therefore, it is possible to prevent irregular reflection of incident light. Therefore, it is possible to prevent flare from occurring without providing a light shielding member.
【００４５】［付記］以上詳述したように本発明の実施
態様によれば、以下のような構成を得ることができる。
すなわち、 （１） 固体撮像素子をフリップチップによってフェイ
スダウン方式で基板に実装した撮像ユニットを備えた固
体撮像装置において、前記基板を略円形状に形成し、中
央部に対物光学系からの光を通す窓を設けると共に、前
記固体撮像素子を、前記窓に撮像エリアが対向し前記基
板の中心と該固体撮像素子の光学中心とが一致するよう
に前記基板の中央部に配置し、前記基板と対物光学系と
を収納する略円筒状のレンズ枠を設け、このレンズ枠内
に前記基板と対物光学系とを嵌入したことを特徴とする
固体撮像装置。[Appendix] As described in detail above, according to the embodiment of the present invention, the following configuration can be obtained.
That is, (1) In a solid-state imaging device including an imaging unit in which a solid-state imaging device is mounted on a substrate by a flip chip in a face-down method, the substrate is formed in a substantially circular shape, and light from an objective optical system is provided in a central portion. A window through which the solid-state imaging device is provided is disposed in the central portion of the substrate so that the imaging area faces the window and the center of the substrate coincides with the optical center of the solid-state imaging device. A solid-state imaging device comprising: a substantially cylindrical lens frame that houses an objective optical system; and the substrate and the objective optical system fitted in the lens frame.
【００４６】（２） 前記基板の窓にカバーガラスを設
け、前記カバーガラス、前記基板、及び前記固体撮像素
子を樹脂または接着剤で封止した前記付記（１）に記載
の固体撮像装置。(2) The solid-state image pickup device according to the above (1), wherein a cover glass is provided in the window of the substrate, and the cover glass, the substrate, and the solid-state image pickup element are sealed with a resin or an adhesive.
【００４７】（３） 前記固体撮像素子はＣＣＤ（Char
ge Coupled Device ）からなる前記付記（１）に記載の
固体撮像装置。(3) The solid-state image sensor is a CCD (Char
ge Coupled Device).
【００４８】（４） 前記固体撮像素子はＣＭＤ（Char
ge Modulation Device）からなる前記付記（１）に記載
の固体撮像装置。(4) The solid-state image sensor is a CMD (Char
ge Modulation Device).
【００４９】（５） 前記基板はガラスエポキシ樹脂の
プリント基板からなる前記付記（１）に記載の固体撮像
装置。(5) The solid-state image pickup device as set forth in (1) above, wherein the substrate is a printed circuit board made of glass epoxy resin.
【００５０】（６） 前記基板はガラス基板からなる前
記付記（１）に記載の固体撮像装置。(6) The solid-state image pickup device according to the above item (1), wherein the substrate is a glass substrate.
【００５１】（７） 前記レンズ枠は、導電性の部材か
らなり、内面に黒色処理を施された前記付記（１）に記
載の固体撮像装置。(7) The solid-state image pickup device according to the above-mentioned item (1), wherein the lens frame is made of a conductive member and has an inner surface subjected to black treatment.
【００５２】（８） 前記レンズ枠と、前記固体撮像素
子に接続される信号ケーブルの総合シールドとを電気的
に接続した前記付記（１）に記載の固体撮像装置。(8) The solid-state image pickup device according to the above (1), wherein the lens frame and a general shield of a signal cable connected to the solid-state image pickup element are electrically connected.
【００５３】（９） 前記基板と前記固体撮像素子に接
続した信号ケーブルとの接続部を軟性の樹脂によって封
止した前記付記（１）に記載の固体撮像装置。(9) The solid-state image pickup device according to the above (1), wherein a connection portion between the substrate and the signal cable connected to the solid-state image pickup element is sealed with a soft resin.
【００５４】（１０） 前記レンズ枠から前記固体撮像
素子に接続した信号ケーブルの外皮までの外周部を絶縁
性部材で覆った前記付記（１）に記載の固体撮像装置。(10) The solid-state image pickup device according to the above (1), wherein an outer peripheral portion from the lens frame to the outer skin of the signal cable connected to the solid-state image pickup element is covered with an insulating member.
【００５５】（１１） 前記絶縁性部材は熱収縮チュー
ブからなる前記付記（１０）に記載の固体撮像装置。(11) The solid-state image pickup device according to item (10), wherein the insulating member is a heat-shrinkable tube.
【００５６】（１２） 前記基板の後方に該基板または
前記固体撮像素子に接続した接続用の第２の基板を設け
た前記付記（１）に記載の固体撮像装置。(12) The solid-state image pickup device according to the above (1), wherein a second substrate for connection, which is connected to the substrate or the solid-state image pickup device, is provided behind the substrate.
【００５７】（１３） 前記第２の基板上に前記固体撮
像素子の出力のインピーダンスを変換するインピーダン
ス変換回路を設けた前記付記（１２）に記載の固体撮像
装置。(13) The solid-state image pickup device according to the above (12), wherein an impedance conversion circuit for converting the impedance of the output of the solid-state image pickup device is provided on the second substrate.
【００５８】（１４） 前記固体撮像素子を設けた基板
を、外形の一部を切り欠いた切り欠き部を有する形状と
し、この基板の切り欠き部の側面に、前記第２の基板を
接続する接続端子を設けた前記付記（１２）に記載の固
体撮像装置。(14) The substrate provided with the solid-state image pickup device is formed into a shape having a cutout portion in which a part of the outer shape is cut out, and the second substrate is connected to the side surface of the cutout portion of the substrate. The solid-state imaging device according to the supplementary note (12), which is provided with a connection terminal.
【００５９】（１５） 前記接続端子を入力側と出力側
とで分離してそれぞれ前記基板の別の側面に設けた前記
付記（１４）に記載の固体撮像装置。(15) The solid-state image pickup device according to the above (14), wherein the connection terminals are separated on the input side and the output side and respectively provided on different side surfaces of the substrate.
【００６０】（１６） 前記第２の基板はフレキシブル
プリント基板からなる前記付記（１４）に記載の固体撮
像装置。(16) The solid-state image pickup device as set forth in (14), wherein the second substrate is a flexible printed circuit board.
【００６１】（１７） 前記第２の基板はガラスエポキ
シ樹脂のプリント基板からなる前記付記（１４）に記載
の固体撮像装置。(17) The solid-state image pickup device according to the above (14), wherein the second substrate is a printed circuit board made of glass epoxy resin.
【００６２】（１８） 前記第２の基板は、複数の面に
折り曲げられて配設されている前記付記（１６）に記載
の固体撮像装置。(18) The solid-state image pickup device according to item (16), wherein the second substrate is arranged by being bent into a plurality of surfaces.
【００６３】（１９） 前記第２の基板の他端は、コネ
クタ部まで延設されてコネクタ端子に接続されている前
記付記（１６）に記載の固体撮像装置。(19) The solid-state image pickup device according to appendix (16), wherein the other end of the second substrate is extended to a connector portion and connected to a connector terminal.
【００６４】（２０） 前記第２の基板の他端は、コネ
クタ部まで延設された信号ケーブルに接続されている前
記付記（１６）または（１７）に記載の固体撮像装置。(20) The solid-state image pickup device according to the above (16) or (17), wherein the other end of the second substrate is connected to a signal cable extending to a connector section.
【００６５】（２１） 前記第２の基板と前記信号ケー
ブルとの接続部において、該信号ケーブルの総合シール
ドと各芯線のシールドとを電気的に導通させた前記付記
（２０）に記載の固体撮像装置。(21) The solid-state imaging device according to the above (20), wherein the general shield of the signal cable and the shield of each core are electrically connected to each other at the connection portion between the second substrate and the signal cable. apparatus.
【００６６】（２２） 固体撮像素子を基板またはパッ
ケージからなるベース部材に実装し、ワイヤボンディン
グにより前記固体撮像素子とベース部材とを接続した撮
像ユニットを備えた固体撮像装置において、前記固体撮
像素子におけるボンディングワイヤを接続するボンディ
ングパッドを、該固体撮像素子の撮像有効エリアの対角
を直径とする円よりも外側に配設したことを特徴とする
固体撮像装置。(22) A solid-state image pickup device comprising an image pickup unit in which the solid-state image pickup device is mounted on a base member made of a substrate or a package, and the solid-state image pickup device and the base member are connected by wire bonding. A solid-state imaging device, wherein a bonding pad for connecting a bonding wire is arranged outside a circle whose diameter is a diagonal of an effective imaging area of the solid-state imaging device.
【００６７】（２３） 固体撮像素子を基板に実装し、
ワイヤボンディングにより前記固体撮像素子と基板とを
接続した撮像ユニットを備えた固体撮像装置において、
前記固体撮像素子におけるボンディングワイヤを接続す
るボンディングパッドを、該固体撮像素子の撮像有効エ
リアとは反対側の裏面に配設したことを特徴とする固体
撮像装置。(23) A solid-state image sensor is mounted on a substrate,
In a solid-state imaging device including an imaging unit in which the solid-state imaging device and the substrate are connected by wire bonding,
A solid-state imaging device, wherein a bonding pad for connecting a bonding wire in the solid-state imaging device is arranged on a back surface of the solid-state imaging device opposite to an imaging effective area.
【００６８】[0068]
【発明の効果】以上説明したように本発明によれば、組
立時の作業を簡略化でき、作業性が良好で容易に組立を
行うことが可能な固体撮像装置を提供できる効果があ
る。As described above, according to the present invention, it is possible to provide a solid-state image pickup device which can simplify the assembling work, has good workability, and can be easily assembled.
【図１】本発明の第１実施例に係る固体撮像装置の主要
部の構成を示す長手軸方向断面図FIG. 1 is a sectional view in a longitudinal axis direction showing a configuration of a main part of a solid-state imaging device according to a first embodiment of the present invention.
【図２】図２及び図３は本発明の第２実施例に係り、図
２は固体撮像素子を実装する基板の構成を示す斜視図2 and 3 relate to a second embodiment of the present invention, and FIG. 2 is a perspective view showing a configuration of a substrate on which a solid-state image sensor is mounted.
【図３】固体撮像装置の主要部の構成を示す長手軸方向
断面図FIG. 3 is a longitudinal cross-sectional view showing the configuration of the main part of the solid-state imaging device.
【図４】第２実施例の変形例に係る固体撮像装置の固体
撮像素子より後側の構成を示す長手軸方向断面図FIG. 4 is a cross-sectional view in the longitudinal axis direction showing a configuration of a solid-state imaging device according to a modified example of the second embodiment, which is behind the solid-state imaging device.
【図５】固体撮像素子の実装にワイヤボンディングを用
いて構成した従来の固体撮像装置の構成例を示す説明図FIG. 5 is an explanatory diagram showing a configuration example of a conventional solid-state imaging device configured by using wire bonding for mounting a solid-state imaging device.
【図６】固体撮像素子の実装にワイヤボンディングを用
いた固体撮像装置において、遮光部材を設ける必要なく
フレアの発生を防止できるようにした第１の構成例を示
す正面図FIG. 6 is a front view showing a first configuration example capable of preventing the occurrence of flare in a solid-state imaging device using wire bonding for mounting a solid-state imaging device without the need to provide a light-shielding member.
【図７】固体撮像素子の実装にワイヤボンディングを用
いた固体撮像装置において、遮光部材を設ける必要なく
フレアの発生を防止できるようにした第２の構成例を示
す側断面図FIG. 7 is a side sectional view showing a second configuration example capable of preventing flare from occurring in a solid-state image pickup device using wire bonding for mounting a solid-state image pickup element without providing a light shielding member.
【図８】固体撮像素子をフェイスダウン方式で基板に実
装して構成した従来技術である撮像ユニットの構成例を
示す長手軸方向断面図FIG. 8 is a cross-sectional view in the longitudinal axis direction showing a configuration example of an imaging unit which is a conventional technique in which a solid-state imaging device is mounted on a substrate by a face-down method.
１…固体撮像素子 ２…基板 ４…フリップチップ ５…カバーガラス ６…レンズ枠 ７…間隔管 ８…対物レンズ １０…接続基板 １１…信号ケーブル １２…総合シールド １４…封止部材 １５…被覆チューブ DESCRIPTION OF SYMBOLS 1 ... Solid-state image sensor 2 ... Substrate 4 ... Flip chip 5 ... Cover glass 6 ... Lens frame 7 ... Space tube 8 ... Objective lens 10 ... Connection board 11 ... Signal cable 12 ... General shield 14 ... Sealing member 15 ... Coated tube
フロントページの続き (72)発明者 大野 渉 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 山下 真司 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 斉藤 克行 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 舩橋 一郎 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 上原 政夫 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 小柳 秀樹 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内Front page continued (72) Inventor Wataru Ono 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Shinji Yamashita 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Kogyo Co., Ltd. (72) Inventor Katsuyuki Saito 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Inventor Ichiro Funabashi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optics Kogyo Co., Ltd. (72) Masao Uehara 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Hideki Koyanagi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optics Industry Co., Ltd.
Claims (1)
フェイスダウン方式で基板に実装した撮像ユニットを備
えた固体撮像装置において、 前記基板を略円形状に形成し、中央部に対物光学系から
の光を通す窓を設けると共に、前記固体撮像素子を、前
記窓に撮像エリアが対向し前記基板の中心と該固体撮像
素子の光学中心とが一致するように前記基板の中央部に
配置し、 前記基板と対物光学系とを収納する略円筒状のレンズ枠
を設け、このレンズ枠内に前記基板と対物光学系とを嵌
入したことを特徴とする固体撮像装置。1. A solid-state image pickup device comprising an image pickup unit in which a solid-state image pickup element is mounted on a substrate by a flip chip in a face-down manner, wherein the substrate is formed into a substantially circular shape, and light from an objective optical system is provided in a central portion. A window through which the solid-state image sensor is provided is arranged in the central part of the substrate so that the image pickup area faces the window and the center of the substrate coincides with the optical center of the solid-state image sensor. A solid-state imaging device comprising: a substantially cylindrical lens frame that houses an objective optical system; and the substrate and the objective optical system fitted in the lens frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6217657A JPH0884278A (en) | 1994-09-12 | 1994-09-12 | Solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6217657A JPH0884278A (en) | 1994-09-12 | 1994-09-12 | Solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0884278A true JPH0884278A (en) | 1996-03-26 |
Family
ID=16707684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6217657A Withdrawn JPH0884278A (en) | 1994-09-12 | 1994-09-12 | Solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0884278A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004007499A (en) * | 2002-04-26 | 2004-01-08 | Fuji Photo Film Co Ltd | Imaging device chip module and mounting method for imaging device chip |
| US6734419B1 (en) * | 2001-06-28 | 2004-05-11 | Amkor Technology, Inc. | Method for forming an image sensor package with vision die in lens housing |
| US6984866B1 (en) * | 2003-03-17 | 2006-01-10 | National Semiconductor Corporation | Flip chip optical semiconductor on a PCB |
| JP2007121854A (en) * | 2005-10-31 | 2007-05-17 | Konica Minolta Opto Inc | Imaging apparatus |
| JP2007194271A (en) * | 2006-01-17 | 2007-08-02 | Olympus Imaging Corp | Structure of mounting imaging element |
| JP2009153178A (en) * | 2002-09-17 | 2009-07-09 | Anteryon Bv | Camera device and method for manufacturing camera device and wafer scale package |
| JP2009302102A (en) * | 2008-06-10 | 2009-12-24 | Sony Corp | Solid-state imaging device and its manufacturing method |
-
1994
- 1994-09-12 JP JP6217657A patent/JPH0884278A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6734419B1 (en) * | 2001-06-28 | 2004-05-11 | Amkor Technology, Inc. | Method for forming an image sensor package with vision die in lens housing |
| JP2004007499A (en) * | 2002-04-26 | 2004-01-08 | Fuji Photo Film Co Ltd | Imaging device chip module and mounting method for imaging device chip |
| JP2009153178A (en) * | 2002-09-17 | 2009-07-09 | Anteryon Bv | Camera device and method for manufacturing camera device and wafer scale package |
| US6984866B1 (en) * | 2003-03-17 | 2006-01-10 | National Semiconductor Corporation | Flip chip optical semiconductor on a PCB |
| JP2007121854A (en) * | 2005-10-31 | 2007-05-17 | Konica Minolta Opto Inc | Imaging apparatus |
| JP2007194271A (en) * | 2006-01-17 | 2007-08-02 | Olympus Imaging Corp | Structure of mounting imaging element |
| JP2009302102A (en) * | 2008-06-10 | 2009-12-24 | Sony Corp | Solid-state imaging device and its manufacturing method |
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