JPH0878837A - Mounting soldering technique and mounting soldered printed board - Google Patents
Mounting soldering technique and mounting soldered printed boardInfo
- Publication number
- JPH0878837A JPH0878837A JP21239594A JP21239594A JPH0878837A JP H0878837 A JPH0878837 A JP H0878837A JP 21239594 A JP21239594 A JP 21239594A JP 21239594 A JP21239594 A JP 21239594A JP H0878837 A JPH0878837 A JP H0878837A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- mounting
- solder
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面実装部品の実装ハ
ンダ付け工法及び実装ハンダ付け済みプリント基板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting soldering method for surface mounting components and a printed circuit board on which mounting soldering has been completed.
【０００２】[0002]
【従来の技術】近年、プリント基板の表面実装部品の高
密度化、高集積化はめざましいものがあり、それらを担
う半導体デバイスの狭ピッチ、多ピン化による大型パッ
ケージの出現、異形、大型コネクタの面実装化への移行
も進んできた。これらのパッケージはプリント基板小型
化の為にプリント基板の両面に配置され、実装ハンダ付
けされていた。2. Description of the Related Art In recent years, there has been a remarkable increase in the density and integration of surface-mounted components on printed circuit boards. The narrow pitch of semiconductor devices that support them, the emergence of large packages due to the increased number of pins, irregular shapes, and large connectors The transition to surface mounting has also progressed. These packages are arranged on both sides of the printed circuit board and soldered for mounting in order to miniaturize the printed circuit board.
【０００３】以下に従来のプリント基板への実装ハンダ
付け方法について説明する。図４は、両面に部品が実装
された実装ハンダ付け済みプリント基板を示すものであ
る。図４において、１はプリント基板、６はプリント基
板１のＡ面に実装ハンダ付けされた大型の半導体デバイ
ス、５は小型面実装部品、８はチップ部品である。ま
た、プリント基板１のＢ面上には、大型の半導体デバイ
ス２、７、及びチップ部品１１が実装ハンダ付けされて
いる。A conventional mounting soldering method on a printed circuit board will be described below. FIG. 4 shows a printed circuit board with components mounted on both sides and having been mounted and soldered. In FIG. 4, 1 is a printed circuit board, 6 is a large-sized semiconductor device mounted and soldered on the surface A of the printed circuit board 1, 5 is a small surface-mounted component, and 8 is a chip component. On the B side of the printed circuit board 1, large semiconductor devices 2 and 7 and a chip component 11 are mounted and soldered.
【０００４】次に、上記のように実装ハンダ付け済みプ
リント基板の完成に至る工程を図５に示す。まず、図５
のａの工程において、プリント基板１のＢ面上にある金
属箔１０上に印刷されたクリームハンダ９の上に大型半
導体デバイス２、７、及びチップ１１を装着する。次
に、ｂの工程において、リフロー炉（図示せず）で一括
して加熱、冷却してハンダ付けする。次に、ｃの工程に
おいて、プリント基板１を反転する。次に、ｄの工程に
おいて、プリント基板１のＡ面にある金属箔１０上に印
刷されたクリームハンダ９の上に大型半導体デバイス
６、小型半導体デバイス５、チップ部品８を各々装着す
る。次に、ｅの工程において、リフロー炉で一括して加
熱、冷却してハンダ付けする。Next, FIG. 5 shows a process leading to the completion of the printed circuit board on which the mounting solder is applied as described above. First, FIG.
In step a), the large-sized semiconductor devices 2 and 7 and the chip 11 are mounted on the cream solder 9 printed on the metal foil 10 on the B side of the printed circuit board 1. Next, in step b, heating and cooling are collectively performed in a reflow furnace (not shown) and soldering is performed. Next, in step c, the printed circuit board 1 is inverted. Next, in step d, the large semiconductor device 6, the small semiconductor device 5, and the chip component 8 are mounted on the cream solder 9 printed on the metal foil 10 on the A side of the printed circuit board 1. Next, in step e, heating and cooling are collectively performed in a reflow furnace and soldering is performed.
【０００５】以上の工程を経て、図４の実装ハンダ付け
済みプリント基板が完成する。しかしながら、このよう
なハンダ付け工法では、上記のｄの工程でリフロー炉で
一括して加熱、冷却によりハンダ付けする際、図６に示
すようにハンダ９が再溶融して、大型半導体デバイス７
のＺ方向へ働く力が大型半導体デバイス７のリード７ｂ
と接続されている再溶融されたハンダ９の表面張力より
大きい場合、大型半導体デバイス７がプリント基板１よ
り外れ落下するということがあった。落下は、大型の半
導体デバイス、大型異形部品等の重量の大きい部品に確
立が高くなってくることは当然のことである。Through the above steps, the printed circuit board on which the mounting solder has been applied as shown in FIG. 4 is completed. However, in such a soldering method, when soldering is performed by collectively heating and cooling in the reflow furnace in the above step d, the solder 9 is remelted as shown in FIG.
Force acting in the Z direction on the lead 7b of the large semiconductor device 7
If the surface tension of the re-melted solder 9 connected to is larger than that of the re-melted solder 9, the large semiconductor device 7 may fall off the printed board 1. It is natural that the drop is more likely to occur in heavy parts such as large-sized semiconductor devices and large-sized deformed parts.
【０００６】このため前記問題点を解決する他の従来例
として、図７に示すハンダ付け工法工法がある。Therefore, as another conventional example for solving the above problems, there is a soldering method as shown in FIG.
【０００７】図７のハンダ付け工法について以下に説明
する。図７において、まず、ａの工程において、プリン
ト基板１のＢ面上にある金属箔１０にクリームハンダ９
を印刷する。次に、ｂの工程において、大型半導体デバ
イスの底面に位置する部位に、熱硬化性接着剤を塗布す
る。次に、ｃの工程において、大型半導体デバイス２、
７を装着し、リフロー炉にて一括して加熱、冷却してハ
ンダ付けする。以後は図５のｃからｅの工程と同じであ
る。The soldering method of FIG. 7 will be described below. In FIG. 7, first, in the step a, the cream solder 9 is applied to the metal foil 10 on the B side of the printed circuit board 1.
To print. Next, in step b, a thermosetting adhesive is applied to the portion located on the bottom surface of the large-sized semiconductor device. Next, in the step c, the large semiconductor device 2,
7 is mounted, and is collectively heated in a reflow furnace, cooled, and soldered. The subsequent steps are the same as steps c to e in FIG.
【０００８】リフロー炉の温度カーブ特性は、縦軸に温
度Ｔ、横軸にリフロー炉の中にいる時間Ｓをとった相関
グラフとした場合、図３に示すようになる。図３におい
て、Ｔ１、Ｓ１は予備加熱温度及び時間、Ｔ２はクリー
ムハンダ溶融のための加熱温度である。The temperature curve characteristic of the reflow furnace is as shown in FIG. 3 when a correlation graph is plotted with the temperature T on the vertical axis and the time S in the reflow furnace on the horizontal axis. In FIG. 3, T1 and S1 are the preheating temperature and time, and T2 is the heating temperature for melting the cream solder.
【０００９】この温度カーブ特性を利用すると、熱硬化
性接着剤がＴ１の温度でＳ１時間のうちに硬化するた
め、時間が経過し温度がＴ２に上昇しハンダが溶融する
前にプリント基板１と大型半導体デバイス２、７を結合
固定できる。このため、プリント基板１を反転して再度
リフロー炉に投入した時、ハンダ９が再溶融しても大型
半導体デバイス２、７がプリント基板１から離れて落下
することはない。When this temperature curve characteristic is utilized, the thermosetting adhesive cures at the temperature of T1 within the time of S1. Therefore, after the time elapses, the temperature rises to T2 and the printed circuit board 1 and the solder are melted. The large semiconductor devices 2 and 7 can be coupled and fixed. Therefore, when the printed circuit board 1 is turned upside down and put into the reflow furnace again, even if the solder 9 is remelted, the large semiconductor devices 2 and 7 do not fall apart from the printed circuit board 1.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、上記従
来のハンダ付け工法では、リフロー炉によるハンダ付け
時に、リフロー炉の温度カーブ特性により、クリームハ
ンダ溶融より先に、熱硬化接着剤が固化するため、図８
に示すようにクリームハンダ内の溶剤分の気化に伴いク
リームハンダの高さＳ１がＳ２に変化するため、部品自
重で溶融ハンダ内に部品のリードが沈み込んでハンダと
結合すべきところが先に固化した熱硬化性接着剤４によ
って阻害され、ハンダ接続不良が発生し、ハンダ付け品
質は安定しないという問題があった。この対策として、
大型半導体デバイスのリフロー炉への一括ハンダ付けを
さけて、大型半導体デバイスのみ、別工程で局部加熱ハ
ンダ付けで行うことで実装ハンダ付け済みプリント基板
は作ることはできるが、工数の大幅アップ及びリードタ
イムが長くなるという欠点があった。However, in the above conventional soldering method, the thermosetting adhesive is solidified before the cream solder is melted due to the temperature curve characteristic of the reflow furnace during soldering by the reflow furnace. Figure 8
As shown in, the height S1 of the cream solder changes to S2 as the solvent in the cream solder evaporates, so the lead of the part sinks into the molten solder due to the weight of the part and the part that should be joined with the solder solidifies first. There was a problem that it was hindered by the thermosetting adhesive 4 and solder connection failure occurred, and the soldering quality was not stable. As a measure against this,
It is possible to make a soldered printed circuit board by soldering large semiconductor devices to the reflow furnace in a separate process, avoiding collective soldering to the reflow furnace. It had the drawback of lengthening the time.
【００１１】本発明は、上記従来の欠点に鑑み、従来の
リフロー炉で一括ハンダ付けする工法を変えることな
く、プリント基板の両面へ、部品の形状、重さに制約さ
れないで部品を配置実装できる、実装ハンダ付け工法及
び実装ハンダ付け済みプリント基板を提供することを目
的とする。In view of the above-mentioned conventional drawbacks, the present invention allows components to be arranged and mounted on both surfaces of a printed circuit board without being restricted by the shape and weight of the components, without changing the method of batch soldering in a conventional reflow furnace. An object of the present invention is to provide a mounting soldering method and a printed circuit board on which mounting soldering has been completed.
【００１２】[0012]
【課題を解決するための手段】この問題を解決する為
に、本発明の実装ハンダ付け工法及び実装ハンダ付け基
板は、プリント基板Ａ面に配置されたＡ面側表面実装部
品をリフローハンダ付けする工程と、前記Ａ面側表面実
装部品の底面にあたる位置に設けられたプリント基板の
孔に熱硬化性接着剤を注入する工程と、プリント基板Ｂ
面に配置されたＢ面側表面実装部品をリフローハンダ付
けする工程とを設け、Ｂ面側表面実装部品をリフローハ
ンダ付けする工程の際、リフロー加熱における温度カー
ブ特性を利用し、ハンダの溶融温度に到達する以前に、
前記Ａ面側表面実装部品とプリント基板を前記熱硬化性
接着剤により結合固定するように構成されている。In order to solve this problem, in the mounting soldering method and the mounting soldering board of the present invention, the A-side surface-mounted components arranged on the A side of the printed circuit board are reflow-soldered. A step of injecting a thermosetting adhesive into a hole of a printed circuit board provided at a position corresponding to the bottom surface of the surface mount component on the side A, and a printed circuit board B.
And the step of reflow soldering the B-side surface mount component placed on the surface, and in the step of reflow-soldering the B-side surface mount component, the temperature curve characteristic in reflow heating is used to determine the melting temperature of the solder. Before reaching
The surface mount component on the side A and the printed circuit board are configured to be bonded and fixed by the thermosetting adhesive.
【００１３】[0013]
【作用】実装ハンダ付けされた表面実装部品の底面に位
置するプリント基板に設けた孔に熱硬化性接着剤を注入
し、反転してリフロー炉に投入することで、ハンダ付け
の際のクリームハンダ高さの変化に伴う、部品リードの
溶融ハンダ内への沈み込みによるハンダ接続を、全く阻
害することなく、実装ハンダ付けされた表面実装部品と
プリント基板との結合固化ができ、ハンダ付け部分のハ
ンダが再溶融しても、ハンダ接続部位が変化することは
ない。Operation: The thermosetting adhesive is injected into the holes provided in the printed circuit board located on the bottom surface of the surface-mounted component to be mounted and soldered. Without hindering the solder connection due to the sinking of the component leads into the molten solder due to the change in height, the surface-mounted components mounted by soldering and the printed circuit board can be bonded and solidified. Even if the solder is re-melted, the solder connection part does not change.
【００１４】[0014]
【実施例】以下本発明の一実施例の実装ハンダ付け工法
について図を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A mounting soldering method according to an embodiment of the present invention will be described below with reference to the drawings.
【００１５】図１は本発明の一実施例による実装ハンダ
付け工法により、実装ハンダ付けを行った実装ハンダ付
け済みプリント基板を示すものである。図１において、
１はプリント基板、２、７は大型半導体デバイス、３は
大型半導体デバイス２、７の底面側に位置するプリント
基板１に設けられた孔、３ａは、孔３の側面、４は大型
半導体デバイス２、７の底面と、孔３の側面３ａとを結
合固定している熱硬化性接着剤である。FIG. 1 shows a printed circuit board on which mounting soldering has been performed by mounting soldering according to an embodiment of the present invention. In FIG.
1 is a printed circuit board, 2 and 7 are large semiconductor devices, 3 is a hole provided in the printed circuit board 1 located on the bottom side of the large semiconductor devices 2 and 7, 3a is a side surface of the hole 3, 4 is a large semiconductor device 2 , 7 and the side surface 3a of the hole 3 are bonded and fixed to each other.
【００１６】なお、図中において、５は小型半導体デバ
イス、６は大型半導体デバイス、８はチップ部品、９は
ハンダ、１０は金属箔、１１はチップ部品で、これらは
従来例の構成と同じものである。In the figure, 5 is a small semiconductor device, 6 is a large semiconductor device, 8 is a chip component, 9 is a solder, 10 is a metal foil, and 11 is a chip component, which are the same as those of the conventional example. Is.
【００１７】以上のように構成された実装ハンダ付け済
みプリント基板の実装ハンダ付け工法について、以下そ
の工程を図２を用いて説明する。With respect to the mounting soldering method for the printed circuit board having the mounting solder thus constructed, the steps will be described below with reference to FIG.
【００１８】まず、図２のａの工程において、プリント
基板１のＢ面上にある金属箔１０上に印刷されたクリー
ムハンダ９の上に大型半導体デバイス２、７、及びチッ
プ部品１１を装着し、リフロー炉で一括して加熱、冷却
してハンダ付けする。次に、ｂの工程において、プリン
ト基板１を反転し、プリント基板１に設けた孔３に熱硬
化性接着剤４を孔３の側面３ａ及び大型半導体デバイス
２、７の底面２ａ、７ａと確実に接触するまで注入す
る。次にｃの工程で、小型半導体デバイス５、大型半導
体デバイス６、チップ部品８を装着して、次にリフロー
炉に投入し、図３に示すリフロー炉の温度カーブ特性を
利用して、熱硬化性接着剤が先に硬化し、次にリフロー
ハンダ付けが行われる。First, in the step of FIG. 2A, the large semiconductor devices 2 and 7 and the chip component 11 are mounted on the cream solder 9 printed on the metal foil 10 on the B side of the printed circuit board 1. , Heat in a reflow furnace all together, cool and solder. Next, in step b, the printed circuit board 1 is turned over, and the thermosetting adhesive 4 is surely attached to the side surface 3a of the hole 3 and the bottom surfaces 2a and 7a of the large semiconductor devices 2 and 7 in the hole 3 provided in the printed circuit board 1. Inject until contact with. Next, in step c, the small semiconductor device 5, the large semiconductor device 6, and the chip component 8 are mounted and then placed in a reflow furnace, and thermosetting is performed using the temperature curve characteristics of the reflow furnace shown in FIG. The adhesive is cured first, followed by reflow soldering.
【００１９】以上のように本実施例によれば、大型半導
体デバイスを実装ハンダ付けを行い、その後、プリント
基板を反転して、実装ハンダ付けして、ハンダ付け部分
を再溶融してもハンダ接続部分が離れることはない。As described above, according to the present embodiment, the large-sized semiconductor device is mounted and soldered, and then the printed circuit board is inverted and mounted and soldered. The parts never separate.
【００２０】また、実装ハンダ付けした後に、その部分
とプリント基板を熱硬化接着剤で結合固定する方法なの
で、部品リードがクリームハンダ溶融時に沈むことでハ
ンダ接続確保という表面実装部品のハンダ付けメカニズ
ムを阻害することなく、実装ハンダ付けすることができ
る。Also, after mounting and soldering, the part and the printed circuit board are joined and fixed with a thermosetting adhesive, so that a soldering mechanism for surface mount components, which secures solder connection by sinking the component leads when the cream solder melts. Mounting soldering can be performed without hindering.
【００２１】[0021]
【発明の効果】以上のように、本発明によれば、従来の
リフロー炉での加熱、冷却による一括ハンダ付けという
効率的なハンダ付け方法を変えることなく、実装ハンダ
付けされたプリント基板を反転してリフロー炉へ投入し
た際、ハンダ溶融した時の表面張力以上の重量を有する
表面実装部品でも、プリント基板とのハンダ接続部位か
ら離れて落下することはない。また、部品のリードが沈
み込んでハンダと結合すべきところが先に固化した熱硬
化性接着剤４によって阻害され、ハンダ接続不良が発生
するということはなく、ハンダ付け品質は安定する。こ
のため、表面実装部品のプリント基板への配置の設計自
由度は大幅に向上するものである。As described above, according to the present invention, it is possible to invert the printed circuit board mounted and soldered without changing the efficient soldering method of batch soldering by heating and cooling in the conventional reflow furnace. Then, when placed in a reflow furnace, even a surface-mounted component having a weight equal to or higher than the surface tension at the time of solder melting does not fall apart from the solder connection site with the printed circuit board. Moreover, the lead of the component sinks and the place where it should be connected to the solder is not blocked by the thermosetting adhesive 4 which has been solidified first, and the solder connection failure does not occur, and the soldering quality is stable. Therefore, the degree of freedom in designing the arrangement of the surface mount components on the printed circuit board is greatly improved.
【図１】本発明の一実施例の実装ハンダ付け済みプリン
ト基板の側面図FIG. 1 is a side view of a printed circuit board on which mounting solder is applied according to an embodiment of the present invention.
【図２】本発明の一実施例の実装ハンダ付け済みプリン
ト基板の完成に至る工程図FIG. 2 is a process diagram for completing a printed circuit board with mounting solder according to an embodiment of the present invention.
【図３】リフロー炉内温度カーブ特性図[Fig.3] Reflow furnace temperature curve characteristic diagram
【図４】従来の実装ハンダ付け済みプリント基板の側面
図FIG. 4 is a side view of a conventional printed circuit board with mounting solder attached.
【図５】従来の実装ハンダ付け済みプリント基板の完成
に至る工程図FIG. 5 is a process diagram for completing a conventional printed circuit board with mounting solder.
【図６】従来例のハンダと部品リードの接続部位の拡大
図FIG. 6 is an enlarged view of a connection portion between a solder and a component lead in a conventional example.
【図７】他の従来例の実装ハンダ付けにおける部品固定
の工程図FIG. 7 is a process diagram of fixing components in mounting soldering of another conventional example.
【図８】他の従来例の部品リードの接続部位の拡大図FIG. 8 is an enlarged view of a connection part of a component lead of another conventional example.
１ プリント基板 ２、６、７ 大型半導体デバイス ３ 孔 ４ 熱硬化性接着剤 ９ ハンダ 1 Printed Circuit Board 2, 6, 7 Large Semiconductor Device 3 Hole 4 Thermosetting Adhesive 9 Solder
Claims (2)
ローハンダ付けする工法において、プリント基板Ａ面に
配置されたＡ面側表面実装部品をリフローハンダ付けす
る工程と、前記Ａ面側表面実装部品の底面にあたる位置
に設けられたプリント基板の孔に熱硬化性接着剤を注入
する工程と、プリント基板Ｂ面に配置されたＢ面側表面
実装部品をリフローハンダ付けする工程とを設け、Ｂ面
側表面実装部品をリフローハンダ付けする工程の際、リ
フロー加熱における温度カーブ特性を利用し、ハンダの
溶融温度に到達する以前に、前記Ａ面側表面実装部品と
プリント基板を前記熱硬化性接着剤により結合固定する
ことを特徴とする実装ハンダ付け工法。1. A method of reflow soldering surface mount components on both sides of a printed circuit board, the process of reflow soldering the surface A side surface mount components arranged on the surface A of the printed circuit board, and the surface A side surface mount components. The step of injecting a thermosetting adhesive into the hole of the printed circuit board provided at the position corresponding to the bottom surface of the printed circuit board, and the step of reflow soldering the surface mounting component on the side B of the printed circuit board B. In the process of reflow soldering the side surface mount component, the temperature curve characteristic in the reflow heating is used to connect the surface A side surface mount component and the printed circuit board to the thermosetting adhesive before the melting temperature of the solder is reached. Mounting soldering method, which is characterized by joining and fixing by.
にあたる位置に孔を設け、前記孔の側面と前記Ａ面側表
面実装部品の底面とを熱硬化性接着剤で結合固定して構
成されていることを特徴とする実装ハンダ付け済みプリ
ント基板。2. A printed circuit board is provided with a hole at a position corresponding to the bottom surface of the surface-A-side surface-mounted component, and the side surface of the hole and the bottom surface of the surface-A-side surface-mounted component are bonded and fixed with a thermosetting adhesive. A printed circuit board that has been mounted and soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21239594A JPH0878837A (en) | 1994-09-06 | 1994-09-06 | Mounting soldering technique and mounting soldered printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21239594A JPH0878837A (en) | 1994-09-06 | 1994-09-06 | Mounting soldering technique and mounting soldered printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0878837A true JPH0878837A (en) | 1996-03-22 |
Family
ID=16621882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21239594A Pending JPH0878837A (en) | 1994-09-06 | 1994-09-06 | Mounting soldering technique and mounting soldered printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0878837A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074133A3 (en) * | 1999-05-31 | 2001-06-28 | Siemens Ag | Method for curing thermally curable underfill material |
| JP2003037357A (en) * | 2001-07-26 | 2003-02-07 | Matsushita Electric Ind Co Ltd | Soldering method and heating unit |
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| WO2007066401A1 (en) | 2005-12-08 | 2007-06-14 | Fujitsu Limited | Process for producing electronic part, process for producing heat conducting member, and method of mounting heat conducting member for electronic part |
| FR2963533A1 (en) * | 2010-08-02 | 2012-02-03 | Magneti Marelli France | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS |
| JP2017163029A (en) * | 2016-03-10 | 2017-09-14 | オムロン株式会社 | Electronic component mounting method, board, electronic circuit, surface light source device, display device, and electronic apparatus |
| CN116669323A (en) * | 2023-07-26 | 2023-08-29 | 北京万龙精益科技有限公司 | PCBA open circuit processing method |
| CN117226331A (en) * | 2023-11-13 | 2023-12-15 | 深圳市捷汇多科技有限公司 | Welding process monitoring and analyzing method, device and system |
-
1994
- 1994-09-06 JP JP21239594A patent/JPH0878837A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074133A3 (en) * | 1999-05-31 | 2001-06-28 | Siemens Ag | Method for curing thermally curable underfill material |
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| CN100340141C (en) * | 2001-06-01 | 2007-09-26 | 日本电气株式会社 | Manufacturing method of pin structural |
| JP2003037357A (en) * | 2001-07-26 | 2003-02-07 | Matsushita Electric Ind Co Ltd | Soldering method and heating unit |
| WO2007066401A1 (en) | 2005-12-08 | 2007-06-14 | Fujitsu Limited | Process for producing electronic part, process for producing heat conducting member, and method of mounting heat conducting member for electronic part |
| US8709197B2 (en) | 2005-12-08 | 2014-04-29 | Fujitsu Limited | Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component |
| WO2012016864A1 (en) * | 2010-08-02 | 2012-02-09 | Magneti Marelli France | Process for fabricating printed circuit boards |
| FR2963533A1 (en) * | 2010-08-02 | 2012-02-03 | Magneti Marelli France | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS |
| JP2017163029A (en) * | 2016-03-10 | 2017-09-14 | オムロン株式会社 | Electronic component mounting method, board, electronic circuit, surface light source device, display device, and electronic apparatus |
| CN116669323A (en) * | 2023-07-26 | 2023-08-29 | 北京万龙精益科技有限公司 | PCBA open circuit processing method |
| CN116669323B (en) * | 2023-07-26 | 2023-09-26 | 北京万龙精益科技有限公司 | PCBA open circuit processing method |
| CN117226331A (en) * | 2023-11-13 | 2023-12-15 | 深圳市捷汇多科技有限公司 | Welding process monitoring and analyzing method, device and system |
| CN117226331B (en) * | 2023-11-13 | 2024-01-26 | 深圳市捷汇多科技有限公司 | Welding process monitoring and analyzing method, device and system |
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