JPH08510273A - 部分重合した樹脂 - Google Patents
部分重合した樹脂Info
- Publication number
- JPH08510273A JPH08510273A JP6524462A JP52446294A JPH08510273A JP H08510273 A JPH08510273 A JP H08510273A JP 6524462 A JP6524462 A JP 6524462A JP 52446294 A JP52446294 A JP 52446294A JP H08510273 A JPH08510273 A JP H08510273A
- Authority
- JP
- Japan
- Prior art keywords
- dvs
- resin
- solvent
- monomer
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Formation Of Insulating Films (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Optical Integrated Circuits (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.部分重合したDVS樹脂の形成方法であって、 (a) DVS樹脂が、固体基材上の薄層に塗布し重合した場合に、ひび割れを おこさず、かつ (b) DVS樹脂が、光子照射された際に有機不溶性固体にするに十分な量の 少なくとも1種の感光性試薬の添加により光硬化性にされた際に、溶媒による現 像において少なくとも50パーセントのフィルム残率を与える ように溶媒中における当初のDVSモノマーの濃度において溶媒中でDVSモノ マーを加熱することを含む方法。 2.DVSモノマーの当初の濃度が12〜32重量パーセントである、請求項1記 載の方法。 3. (a) DVS樹脂が、固体基材上の薄層に塗布し重合した場合に、ひび 割れをおこさず、かつ (b) DVS樹脂が、光子照射された際に有機不溶性固体にするに十分な量の 少なくとも1種の感光性試薬の添加により光硬化性にされた際に、溶媒による現 像において少なくとも50パーセントのフィルム残率を与える ように12〜32重量パーセントの溶媒中の当初のDVSモノマーの濃度において溶 媒中でDVSモノマーを加熱することを含む方法により形成されたDVS樹脂。 4.160,000の絶対分子量における回転半径が、SEC/LALLSを用いて9 0オングストローム未満であるDVS樹脂。 5.溶媒を除去し、その後190℃においてさらに硬化させ、そしてゲル化を越 える剪断貯蔵弾性率G’の増加率を想定した場合に、分転化の変化に対するG’ の増加速度を示す指数が400以下である DVS樹脂。 6.(a) DVS樹脂が、固体基材上の薄層に塗布し重合した場合に、ひび割 れをおこさず、かつ (b) DVS樹脂が、光子照射された際に有機不溶性固体にするに十分な量の 少なくとも1種の感光性試薬の添加により光硬化性にされた際に、溶媒による現 像において少なくとも50パーセントのフィルム残率を与える ように12〜32重量パーセントの溶媒中における当初のDVSモノマーの濃度にお いて溶媒中でDVSモノマーを加熱することを含む方法により形成されたDVS 樹脂を含む光硬化性組成物。 7.12〜32重量パーセントの溶媒中における当初のDVSモノマーの濃度にお いて溶媒中でDVSモノマーを加熱することを含む方法により形成されたDVS 樹脂を加熱することにより形成された硬化したポリマー。 8.12〜32重量パーセントの溶媒中における当初のDVSモノマーの濃度にお いて溶媒中でDVSモノマーを加熱することを含む方法により形成されたDVS 樹脂を加熱することにより形成された硬化したポリマーの少なくとも1つのパタ ーン化された層を含む基材。 9.160,000の絶対分子量における回転半径が、SEC/LALLSを用いて9 0オングストローム未満であるDVS樹脂を加熱することにより形成された硬化 したポリマーの少なくとも1つのパターン化された層を含む基材。 10.溶媒を除去し、その後190℃においてさらに硬化させ、そしてゲル化を越 える剪断貯蔵弾性率G’の増加率を想定した場合に、分転化の変化に対するG’ の増加速度を示す指数が400以下であるDVS樹脂を加熱することにより形成さ れた硬化したポリマーの少なくとも1つのパターン化された層を含む基材。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5499993A | 1993-04-29 | 1993-04-29 | |
US08/054,999 | 1993-04-29 | ||
US08/224,203 | 1994-04-14 | ||
US08/224,203 US5854302A (en) | 1993-04-29 | 1994-04-14 | Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins |
PCT/US1994/004535 WO1994025903A1 (en) | 1993-04-29 | 1994-04-25 | Partially polymerized resins |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08510273A true JPH08510273A (ja) | 1996-10-29 |
JP3839469B2 JP3839469B2 (ja) | 2006-11-01 |
Family
ID=26733729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52446294A Expired - Lifetime JP3839469B2 (ja) | 1993-04-29 | 1994-04-25 | 部分重合した樹脂 |
Country Status (9)
Country | Link |
---|---|
US (2) | US5854302A (ja) |
EP (1) | EP0700534B1 (ja) |
JP (1) | JP3839469B2 (ja) |
KR (1) | KR100305127B1 (ja) |
CA (1) | CA2159733A1 (ja) |
DE (1) | DE69424786T2 (ja) |
MY (1) | MY131673A (ja) |
SG (1) | SG59955A1 (ja) |
WO (1) | WO1994025903A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6232398B1 (en) | 1996-12-05 | 2001-05-15 | Nec Corporation | Alkali or acid corrodible organic or composite particles in resin matrix |
JP2002265762A (ja) * | 2001-03-08 | 2002-09-18 | Nippon Kayaku Co Ltd | ベンゾシクロブテン樹脂組成物、樹脂結合型金属成型部品 |
JP2004506797A (ja) * | 2000-08-21 | 2004-03-04 | ダウ グローバル テクノロジーズ インコーポレイティド | マイクロ電子デバイス製造に使用する有機ポリマー絶縁膜用ハードマスクとしての有機シリケート樹脂 |
JP2006503167A (ja) * | 2002-10-18 | 2006-01-26 | ダウ グローバル テクノロジーズ インコーポレイティド | 高い防湿性を有する、水性現像可能な感光性ベンゾシクロブテン系オリゴマー及びポリマー |
KR100949053B1 (ko) * | 2003-07-28 | 2010-03-25 | 다우 코닝 코포레이션 | 패턴 형성된 실리콘 층의 에칭방법 |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0616701B1 (en) * | 1991-12-10 | 2002-02-13 | The Dow Chemical Company | Photocurable cyclobutarene compositions |
WO1996031805A1 (en) * | 1995-04-03 | 1996-10-10 | The Dow Chemical Company | Photodefineable compositions |
DE19543540C1 (de) * | 1995-11-22 | 1996-11-21 | Siemens Ag | Vertikal integriertes Halbleiterbauelement mit zwei miteinander verbundenen Substraten und Herstellungsverfahren dafür |
US6660875B1 (en) | 1998-06-09 | 2003-12-09 | Ppt Technologies, Llc | Ion exchange purification of dielectric condensate precursor fluids and silicate esters such as tetraethylorthosilicate (TEOS) |
US6361926B1 (en) * | 1998-10-23 | 2002-03-26 | The Dow Chemical Company | Acid functional polymers based on benzocyclobutene |
US6281115B1 (en) * | 1998-11-16 | 2001-08-28 | Industrial Technology Research Institute | Sidewall protection for a via hole formed in a photosensitive, low dielectric constant layer |
TW418475B (en) * | 1999-02-22 | 2001-01-11 | Mosel Vitelic Inc | Configuration method for thin film cracking parameters and the application using the same |
US6235544B1 (en) * | 1999-04-20 | 2001-05-22 | International Business Machines Corporation | Seed metal delete process for thin film repair solutions using direct UV laser |
US6535105B2 (en) | 2000-03-30 | 2003-03-18 | Avx Corporation | Electronic device and process of making electronic device |
US6617674B2 (en) * | 2001-02-20 | 2003-09-09 | Dow Corning Corporation | Semiconductor package and method of preparing same |
US6919164B2 (en) * | 2001-06-08 | 2005-07-19 | The Penn State Research Foundation | Patterning compositions using E-beam lithography and structures and devices made thereby |
US20040131970A1 (en) * | 2003-01-07 | 2004-07-08 | Meagley Robert P. | Photodefinable polymers for semiconductor applications |
JP2004221449A (ja) * | 2003-01-17 | 2004-08-05 | Sumitomo Metal Mining Co Ltd | 多層配線基板およびその製造方法 |
US7297460B2 (en) * | 2003-02-26 | 2007-11-20 | Agfa-Gevaert | Radiation curable ink compositions suitable for ink-jet printing |
DE602005025550D1 (de) | 2004-10-13 | 2011-02-03 | Dow Global Technologies Inc | Polymerformulierungen auf Benzocyclobutenbasis |
WO2006044338A1 (en) | 2004-10-13 | 2006-04-27 | Dow Global Technologies Inc. | Aqueous developable benzocyclobutene-based polymer composition and method of use of such compositions |
CN100374448C (zh) * | 2005-12-30 | 2008-03-12 | 四川大学 | 双烯基硅氧烷桥联双苯并环丁烯单体及预聚体的制备方法 |
DE102007038514A1 (de) * | 2007-08-16 | 2009-02-19 | Robert Bosch Gmbh | Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung |
CN101463042B (zh) * | 2007-12-21 | 2012-01-11 | 中国科学院化学研究所 | 一种含硅苯并环丁烯树脂及其中间体与它们的制备方法 |
US20120021134A1 (en) * | 2009-04-15 | 2012-01-26 | 3M Innovative Properties Company | Process and apparatus for coating with reduced defects |
CN102206229A (zh) * | 2011-04-14 | 2011-10-05 | 西南科技大学 | 含硅苯并环丁烯单体及其制备方法 |
CN102516547B (zh) * | 2011-11-18 | 2013-10-16 | 西南科技大学 | 苯并环丁烯硅油树脂及其制备方法 |
US9269623B2 (en) | 2012-10-25 | 2016-02-23 | Rohm And Haas Electronic Materials Llc | Ephemeral bonding |
US9273215B2 (en) | 2012-10-30 | 2016-03-01 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
US9315696B2 (en) | 2013-10-31 | 2016-04-19 | Dow Global Technologies Llc | Ephemeral bonding |
US9153357B1 (en) | 2014-03-27 | 2015-10-06 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
US9644118B2 (en) | 2015-03-03 | 2017-05-09 | Dow Global Technologies Llc | Method of releasably attaching a semiconductor substrate to a carrier |
US9296915B1 (en) | 2015-04-10 | 2016-03-29 | Dow Global Technologies Llc | Toughened arylcyclobutene polymers |
US9441055B1 (en) | 2015-09-18 | 2016-09-13 | Dow Global Technologies Llc | Arylcyclobutenes |
US20170174805A1 (en) | 2015-12-21 | 2017-06-22 | Dow Global Technologies Llc | Arylcyclobutenes |
US10113024B2 (en) | 2015-12-21 | 2018-10-30 | Dow Global Technologies Llc | Arylcyclobutenes |
US20190112400A1 (en) | 2017-10-12 | 2019-04-18 | Rohm And Haas Electronic Materials Llc | Polymers from bis-arylcyclobutene group containing monomers that cure through other groups and methods for making the same |
US11817316B2 (en) | 2020-05-02 | 2023-11-14 | Rohm And Haas Electronic Materials Llc | Coating compositions and methods of forming electronic devices |
CN117098824A (zh) | 2021-03-30 | 2023-11-21 | 日产化学株式会社 | 粘接剂组合物、层叠体、层叠体的制造方法以及经加工的基板的制造方法 |
EP4306609A1 (en) | 2021-03-31 | 2024-01-17 | Nissan Chemical Corporation | Laminate, release agent composition, and method for manufacturing processed semiconductor substrate |
EP4309893A1 (en) | 2021-03-31 | 2024-01-24 | Nissan Chemical Corporation | Laminate, release agent composition, and method for producing processed semiconductor substrate |
JPWO2022210241A1 (ja) | 2021-03-31 | 2022-10-06 | ||
JPWO2023074324A1 (ja) | 2021-10-29 | 2023-05-04 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2852379A (en) * | 1955-05-04 | 1958-09-16 | Eastman Kodak Co | Azide resin photolithographic composition |
US3075950A (en) * | 1960-08-04 | 1963-01-29 | Eastman Kodak Co | Cross-linked olefinic polymers |
US3625919A (en) * | 1967-02-10 | 1971-12-07 | Hiroyoshi Kamogawa | Process for the preparation of diazotized vinylphenol polymers having phototropic properties |
US3948667A (en) * | 1971-06-21 | 1976-04-06 | Japan Synthetic Rubber Company Limited | Photosensitive compositions |
US4197133A (en) * | 1977-10-14 | 1980-04-08 | Ciba-Geigy Corporation | Photo-curable compositions of matter containing bis-azidophthalimidyl derivatives |
DE2948324C2 (de) * | 1978-12-01 | 1993-01-14 | Hitachi, Ltd., Tokio/Tokyo | Lichtempfindliches Gemisch, enthaltend eine Bisazidverbindung, und Verfahren zur Bildung von Mustern |
DE2951101A1 (de) * | 1979-12-19 | 1981-06-25 | Merck Patent Gmbh, 6100 Darmstadt | Verfahren zur herstellung von azidobenzalverbindungen |
JPS5940641A (ja) * | 1982-08-31 | 1984-03-06 | Toshiba Corp | 高解像度用ネガ型フオトレジスト組成物 |
DE3463576D1 (en) * | 1983-03-03 | 1987-06-11 | Toray Industries | Radiation sensitive polymer composition |
US4571375A (en) * | 1983-10-24 | 1986-02-18 | Benedikt George M | Ring-opened polynorbornene negative photoresist with bisazide |
US4642329A (en) * | 1984-08-27 | 1987-02-10 | The Dow Chemical Company | Prepolymer processing of arylcyclobutene monomeric compositions |
US4540763A (en) * | 1984-09-14 | 1985-09-10 | The Dow Chemical Company | Polymers derived from poly(arylcyclobutenes) |
US4783514A (en) * | 1986-02-28 | 1988-11-08 | The Dow Chemical Company | Polymeric monoarylcyclobutane compositions |
US4812588A (en) * | 1987-12-14 | 1989-03-14 | The Dow Chemical Company | Polyorganosiloxane-bridged bisbenzocyclobutene monomers |
US5002808A (en) * | 1988-03-23 | 1991-03-26 | The Dow Chemical Company | Adhesion methods employing benzocyclobutene-based organosilane adhesion aids |
JP2643261B2 (ja) * | 1988-03-23 | 1997-08-20 | 株式会社日立製作所 | ネガ型感光性組成物及びパタン形成方法 |
EP0616701B1 (en) * | 1991-12-10 | 2002-02-13 | The Dow Chemical Company | Photocurable cyclobutarene compositions |
US5416233A (en) * | 1994-01-25 | 1995-05-16 | The Dow Chemical Company | Preparation of vinylsilane-benzocyclobutenes |
-
1994
- 1994-04-14 US US08/224,203 patent/US5854302A/en not_active Expired - Lifetime
- 1994-04-25 SG SG1996004807A patent/SG59955A1/en unknown
- 1994-04-25 CA CA002159733A patent/CA2159733A1/en not_active Abandoned
- 1994-04-25 EP EP94916568A patent/EP0700534B1/en not_active Expired - Lifetime
- 1994-04-25 WO PCT/US1994/004535 patent/WO1994025903A1/en active IP Right Grant
- 1994-04-25 JP JP52446294A patent/JP3839469B2/ja not_active Expired - Lifetime
- 1994-04-25 DE DE69424786T patent/DE69424786T2/de not_active Expired - Lifetime
- 1994-04-25 KR KR1019950704701A patent/KR100305127B1/ko not_active IP Right Cessation
- 1994-04-29 MY MYPI94001078A patent/MY131673A/en unknown
-
1995
- 1995-06-05 US US08/465,664 patent/US5882836A/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6232398B1 (en) | 1996-12-05 | 2001-05-15 | Nec Corporation | Alkali or acid corrodible organic or composite particles in resin matrix |
JP2004506797A (ja) * | 2000-08-21 | 2004-03-04 | ダウ グローバル テクノロジーズ インコーポレイティド | マイクロ電子デバイス製造に使用する有機ポリマー絶縁膜用ハードマスクとしての有機シリケート樹脂 |
JP2002265762A (ja) * | 2001-03-08 | 2002-09-18 | Nippon Kayaku Co Ltd | ベンゾシクロブテン樹脂組成物、樹脂結合型金属成型部品 |
JP2006503167A (ja) * | 2002-10-18 | 2006-01-26 | ダウ グローバル テクノロジーズ インコーポレイティド | 高い防湿性を有する、水性現像可能な感光性ベンゾシクロブテン系オリゴマー及びポリマー |
JP2013014774A (ja) * | 2002-10-18 | 2013-01-24 | Dow Global Technologies Llc | 高い防湿性を有する、水性現像可能な感光性ベンゾシクロブテン系オリゴマー又はポリマーの製造方法 |
KR100949053B1 (ko) * | 2003-07-28 | 2010-03-25 | 다우 코닝 코포레이션 | 패턴 형성된 실리콘 층의 에칭방법 |
Also Published As
Publication number | Publication date |
---|---|
MY131673A (en) | 2007-08-30 |
WO1994025903A1 (en) | 1994-11-10 |
JP3839469B2 (ja) | 2006-11-01 |
CA2159733A1 (en) | 1994-11-10 |
KR100305127B1 (ko) | 2001-11-22 |
EP0700534B1 (en) | 2000-05-31 |
SG59955A1 (en) | 1999-02-22 |
DE69424786T2 (de) | 2000-12-28 |
EP0700534A1 (en) | 1996-03-13 |
DE69424786D1 (de) | 2000-07-06 |
US5854302A (en) | 1998-12-29 |
KR960702119A (ko) | 1996-03-28 |
US5882836A (en) | 1999-03-16 |
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