JPH0842983A - Heat pipe - Google Patents
Heat pipeInfo
- Publication number
- JPH0842983A JPH0842983A JP6197265A JP19726594A JPH0842983A JP H0842983 A JPH0842983 A JP H0842983A JP 6197265 A JP6197265 A JP 6197265A JP 19726594 A JP19726594 A JP 19726594A JP H0842983 A JPH0842983 A JP H0842983A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- main body
- container
- receiving plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
- F28F21/067—Details
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気、電子機器の放熱
装置に使用されるヒートパイプに関し、特に熱放散プレ
ートと受熱プレートとが熱輸送用の媒体を介して接続さ
れているヒートパイプに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe used in a heat dissipation device for electric and electronic equipment, and more particularly to a heat pipe in which a heat dissipation plate and a heat receiving plate are connected via a medium for heat transportation. .
【０００２】[0002]
【従来の技術】近年の情報通信等の電子機器の発展はめ
ざましく、特にパーソナルコンピュータやワークステー
ション等のコンピュータの高機能化が進む一方、これら
電子機器には小型軽量化が求められ、従来携帯型の主流
であったラップトップ型のコンピュータは、さらに小型
化されたノート型へと変化している。2. Description of the Related Art In recent years, electronic devices such as information communication have been remarkably developed. In particular, while computers such as personal computers and workstations have been highly functionalized, these electronic devices have been required to be small and lightweight. The mainstream laptop computer has been transformed into a more compact notebook computer.
【０００３】しかしながら、従来のラップトップ型の筺
体内容積が約１５リットルあるのに対して、現在主流に
なっているノート型の筺体内容積は５リットル程度にす
ぎないことから、小型化と同時に内部で発生する熱問題
の解決が重要になってきている。However, while the conventional laptop-type enclosure has a volume of about 15 liters, the currently mainstream notebook-type enclosure has a volume of only about 5 liters. It is becoming important to solve internal heat problems.
【０００４】一般的に、ノート型の構造は、外形寸法が
Ａ４ノートサイズで厚さ６センチメートル弱のものであ
って、キーボードを含む本体部と蓋体構造の液晶表示部
を有し、蝶番等によって液晶表示部が本体から自由開閉
できるものであり、このノート型の総消費電力が２５ワ
ットであれば、このうち１５ワット程度が本体部で消費
され、残りの１０ワット程度が液晶表示部で消化されて
いる。Generally, a notebook type structure has an outer size of A4 notebook size and a thickness of less than 6 cm, has a main body part including a keyboard and a liquid crystal display part of a lid structure, and has a hinge. The liquid crystal display can be freely opened and closed from the main body by means of the above, and if the total power consumption of this notebook type is 25 watts, then about 15 watts will be consumed by the main body and the remaining 10 watts will be the liquid crystal display. Has been digested by.
【０００５】上記ノート型コンピュータにおいて、本体
部内の演算素子等の半導体素子の熱放散を行うために種
々のヒートシンク、もしくはマイクロヒートパイプ等が
使用されているが、特にヒートパイプでは構造上の問題
から本体部内に受熱プレートと熱放散プレートの両方を
搭載するか、熱放散プレートのみを本体部の外気に開放
される部分に配置しているものが殆どであり、この多く
は本体部底面に放熱手段を備えるものとなっている。In the above notebook computer, various heat sinks or micro heat pipes are used to dissipate heat from semiconductor elements such as arithmetic elements in the main body. Especially, heat pipes have structural problems. In most cases, both the heat-receiving plate and the heat-dissipating plate are mounted inside the main body, or only the heat-dissipating plate is placed in the part of the main body that is open to the outside air, and most of these are radiating means on the bottom of the main body. It is equipped with.
【０００６】[0006]
【発明が解決しようとする課題】上記ノート型のコンピ
ュータの放熱手段として、液晶表示表示部の１０ワット
から発生する熱は、外気に直接開放されて比較的有効に
熱放散ができる前記液晶表示板の表裏で行われるが、こ
れに対し、本体部の１５ワットから発生する熱は、前記
の如く、主に本体部底面からのみしか熱放散されないた
めに、効果的な熱放散には限界があり、充分な熱放散効
果が得られない。また、上記本体部の底面は一般に机表
面に接して使用され、この上面はキーボードとなってい
るために、本体内部で熱の放散があると指や手のひらに
汗をかき、不快感を招くことになり好ましくない。As the heat dissipation means of the notebook computer, the heat generated from 10 watts of the liquid crystal display unit is directly released to the outside air and can relatively effectively dissipate the heat. On the other hand, the heat generated from 15 watts of the main body is mainly dissipated only from the bottom surface of the main body as described above, so there is a limit to effective heat dissipation. , Not enough heat dissipation effect can be obtained. In addition, the bottom surface of the main body is generally used in contact with the desk surface, and since the top surface is a keyboard, if heat is dissipated inside the main body, it may cause discomfort by sweating on the fingers and palms. Is not preferable.
【０００７】また、従来のヒートパイプは外形形状が固
定されており、熱放散効果を向上させるには大型の形状
としなくてはならず、前記ノート型コンピュータの小型
化を妨げることになる。Further, the conventional heat pipe has a fixed outer shape, and in order to improve the heat dissipation effect, the heat pipe has to have a large shape, which hinders the miniaturization of the notebook computer.
【０００８】本発明は上記課題を解決するために、上記
本体部の熱を電子部品等の発熱源の配置変更することな
く、液晶表示部へ移動するための手段を提供するもので
ある。In order to solve the above problems, the present invention provides a means for moving the heat of the main body to the liquid crystal display without changing the arrangement of heat sources such as electronic parts.
【０００９】[0009]
【課題を解決するための手段】上記課題を解決するため
に本発明では、良熱伝導体からなる受熱プレートと、熱
放散プレートとを有し、上記受熱プレートと、熱放散プ
レートの各々の内部を貫通するフレキシブルチューブか
らなる密閉容器であって、前記密閉容器内に配置される
ウイックが弾性を有する編組線からなるヒートパイプと
する。In order to solve the above problems, the present invention has a heat receiving plate made of a good heat conductor and a heat dissipation plate, and the inside of each of the heat receiving plate and the heat dissipation plate. A heat-sealed container made of a flexible tube penetrating the container, wherein the wick arranged in the air-sealed container is a heat pipe made of an elastic braided wire.
【００１０】前記受熱プレートの一部または全部に集熱
のためのフィンを構成たり、前記フレキシブルチューブ
全長の一部または全部に補強材を巻き付けたり、細管状
の第２のフレキシブルチューブによってループ上の帰還
路を形成してもよい。A fin for collecting heat may be formed on a part or all of the heat receiving plate, a reinforcing material may be wound on a part or all of the entire length of the flexible tube, or a second thin flexible tube may be provided on the loop. A return path may be formed.
【００１１】また、本体部と表示部からなる情報機器
で、上記本体部演算素子の発生熱を直接あるいは間接に
受熱プレートによって受熱し、上記表示部に配置されて
いる不要電波拡散防止または光反射用の金属パネルに熱
放散プレートを接合したヒートパイプとしてもよい。Further, in an information device comprising a main body and a display unit, the heat generated by the arithmetic unit of the main body is directly or indirectly received by a heat receiving plate to prevent unnecessary radio wave diffusion or light reflection arranged on the display unit. A heat pipe in which a heat dissipation plate is joined to a metal panel for use as a heat pipe may be used.
【００１２】[0012]
【作用】上記構成のヒートパイプではコンテナ部がフレ
キシブルチューブで構成されるために、任意の形状状態
で使用してもヒートパイプ機能を損なうことがない。特
にこのヒートパイプをノート型コンピュータに搭載すれ
ば、表示部の開閉に従ってコンテナ部が変形する。近年
のノート型コンピュータでは、液晶表示部の面積をでき
るだけ多く確保するために、本体部と表示部を接続する
蝶番部の構造を小さくしているが、本発明のヒートパイ
プは、このような小さな蝶番部であっても埋設でき、ヒ
ートパイプ効果が有効に利用できる。In the heat pipe having the above structure, since the container portion is composed of the flexible tube, the heat pipe function is not impaired even when used in an arbitrary shape. In particular, if this heat pipe is mounted on a notebook computer, the container portion will deform as the display portion opens and closes. In recent notebook computers, the structure of the hinge portion connecting the main body portion and the display portion is made small in order to secure the area of the liquid crystal display portion as much as possible, but the heat pipe of the present invention has such a small size. Even the hinge part can be buried and the heat pipe effect can be effectively used.
【００１３】[0013]
【実施例】本発明の第１の実施例とするヒートパイプの
上面図を図１に、この側面図を図２に示し、このヒート
パイプを搭載するノート型コンピュータの側面断面図を
図３に、またこのヒートパイプを実際にノート型コンピ
ュータに搭載した図を図４に示す。1 is a top view of a heat pipe according to a first embodiment of the present invention, FIG. 2 is a side view of the heat pipe, and FIG. 3 is a side sectional view of a notebook computer equipped with the heat pipe. FIG. 4 shows a diagram in which this heat pipe is actually installed in a notebook computer.
【００１４】図１と２において、ヒートパイプ１００
は、受熱プレート１１０と熱放散プレート１３０を備
え、この両プレート１１０と１３０が内部を熱輸送媒体
で構成するコンテナ１２０を介して一体化されている。
前記受熱プレート１１０と熱放散プレート１３０はアル
ミニウム、銅等の良熱伝導体を成形し、内部に空間を持
つ形状としたものである。前記コンテナ１２０は筒状で
内部に空間を有し、この空間と前記両プレート１１０と
１３０内の空間がヒートパイプ１００内の空間を形成
し、前記受熱プレート１１０と熱放散プレート１３０、
コンテナ１２０の接続によって内部を真空状態に保って
いる。1 and 2, heat pipe 100
Includes a heat-receiving plate 110 and a heat-dissipating plate 130, and the plates 110 and 130 are integrated via a container 120 having a heat-transporting medium inside.
The heat-receiving plate 110 and the heat-dissipating plate 130 are formed by molding a good heat conductor such as aluminum or copper and have a space inside. The container 120 is cylindrical and has a space inside, and this space and the spaces inside the plates 110 and 130 form a space inside the heat pipe 100, and the heat receiving plate 110 and the heat dissipation plate 130,
The inside of the container is kept in a vacuum state by connecting the container 120.
【００１５】前記においてコンテナ１２０は、シリコー
ンゴムやテフロン等の可とう管（フレキシブルチュー
ブ）で構成され、内部空間にはウイック１４０となるナ
イロンやガラス、銅等の編組線が設けられている。また
両プレート１１０と１３０とコンテナ１２０との接続部
分は、１例として図２の拡大部が示す如くカシメ材１５
０を使用して補強し、さらにこの両プレート１１０と１
３０とコンテナ１２０との接続部分内にＯリング等の密
封材１５２を配置すればヒートパイプ内部の気密性が向
上する。In the above description, the container 120 is made of a flexible tube (flexible tube) such as silicone rubber or Teflon, and a braided wire of nylon, glass, copper or the like serving as the wick 140 is provided in the internal space. The connecting portion between the plates 110 and 130 and the container 120 is, as an example, the caulking material 15 as shown in the enlarged portion of FIG.
Reinforce with 0 and add both plates 110 and 1
By arranging the sealing material 152 such as an O-ring in the connecting portion between the container 30 and the container 120, the airtightness inside the heat pipe is improved.
【００１６】周知の如くノート型コンピュータ２００は
図３に示すような形状をしており、キーボードを含む本
体部２１０と蓋体構造の液晶表示部２２０が蝶番構造の
接続部２３０を介して接続され、本体部２１０内には、
発熱体となるＣＰＵ等の演算素子２１１が配置され、ま
た液晶表示部２２０には液晶板２２１と不要電波または
光反射用の金属パネル２２２が設けられている。前記ヒ
ートパイプ１００をこのコンピュータ２００に搭載した
図を図４に示す。図４において演算素子２１１の上面に
受熱プレート１１０が配置され、コンテナ１２０を介し
て設けられている熱放散プレート１３０が前記金属パネ
ル２２２に接着配置されている。コンテナ１２０は前記
の如くフレキシブルチューブで構成されるために、周知
の上記本体部２１０と表示部２２０とを接続するコード
類と同様に接続部２３０の蝶番部に収納され、コンピュ
ータ未使用時に表示部２２０が本体部２１０に折り曲げ
られるときには、これに従って折り曲げ可能になってい
る。As is well known, the notebook computer 200 has a shape as shown in FIG. 3, and a main body 210 including a keyboard and a liquid crystal display 220 having a lid structure are connected via a connecting part 230 having a hinge structure. In the main body 210,
An arithmetic element 211 such as a CPU serving as a heating element is arranged, and a liquid crystal display section 220 is provided with a liquid crystal plate 221 and a metal panel 222 for reflecting unnecessary radio waves or light. FIG. 4 shows a diagram in which the heat pipe 100 is mounted on the computer 200. In FIG. 4, the heat receiving plate 110 is arranged on the upper surface of the arithmetic element 211, and the heat dissipating plate 130 provided via the container 120 is bonded and arranged to the metal panel 222. Since the container 120 is composed of the flexible tube as described above, it is housed in the hinge part of the connection part 230 like the well-known cords connecting the main body part 210 and the display part 220, and the display part when the computer is not used. When 220 is bent to the main body 210, it can be bent accordingly.
【００１７】上記実施例において、フレキシブルチュー
ブを薄いもの、あるいは柔らかい材料としたとき、コン
テナ１２０内が高温度になる場合、構成材料に熱膨張が
生じ、コンテナ１２０内の真空状態が維持できない場合
が生じるが、図５に示す如く、ピアノ線やナイロン線、
糸、スプリング等を補強材１５５としてコンテナ１２０
の周囲に巻いておくことにより上記問題は解決できる。
また受熱プレート１１０の一部または全面をフィン状の
波板形状に成形すれば、集熱効果が向上する。In the above embodiment, when the flexible tube is made of a thin material or a soft material and the inside of the container 120 has a high temperature, the constituent materials may be thermally expanded and the vacuum state inside the container 120 may not be maintained. Although it occurs, as shown in Fig. 5, piano wire, nylon wire,
The container 120 using the thread, the spring, etc. as the reinforcing material 155.
The above problem can be solved by wrapping it around the.
Further, if a part or the whole surface of the heat receiving plate 110 is formed into a fin-like corrugated plate shape, the heat collecting effect is improved.
【００１８】前記第１の実施例では、受熱プレート１１
０と熱放散プレート１３０は、固形化された良導体で構
成されているが、前述のノート型コンピュータの筺体内
部は小型化促進のために、発熱体となる演算素子２１１
の上面に前記第１の実施例に示すようなヒートパイプを
配置できるスペースを確保することが困難な場合があ
る。このような場合には、以下の本発明の第２の実施例
とするヒートパイプを使用する。この側面図を図６に示
す。このヒートパイプ１００において、コンテナ１２０
は前記第１の実施例のコンテナ１２０と同一にフレキシ
ブルチューブで構成され、この両端に設けられる受熱部
１１５と熱放散部１３５とが第２のフレキシブルチュー
ブで構成されている。これにより演算素子２１１への取
り付け形状が任意に形成でき、例えばコンピュータ内に
配置される種々の電子素子の間を縫うように配置でき
る。また前記コンテナ１２０と受熱部１１５もしくは熱
放散部１３５との接続は、第１の実施例と同一であるた
めに説明は省略する。本第２の実施例のヒートパイプ１
００の演算素子への取り付け位置は、例えば第１の実施
例の如く、この上面に接着固定させなくとも、取り付け
スペースが確保できる部分を任意に選択して配置でき
る。In the first embodiment, the heat receiving plate 11
0 and the heat-dissipating plate 130 are made of solidified good conductors, but the inside of the housing of the above-mentioned notebook computer is a computing element 211 which becomes a heating element in order to promote miniaturization.
It may be difficult to secure a space on the upper surface of which the heat pipe as shown in the first embodiment can be arranged. In such a case, the heat pipe according to the second embodiment of the present invention described below is used. This side view is shown in FIG. In this heat pipe 100, a container 120
Like the container 120 of the first embodiment, is composed of a flexible tube, and the heat receiving portion 115 and the heat dissipation portion 135 provided at both ends thereof are composed of a second flexible tube. Thereby, the attachment shape to the arithmetic element 211 can be arbitrarily formed, and for example, it can be arranged so as to sew between various electronic elements arranged in the computer. Further, the connection between the container 120 and the heat receiving portion 115 or the heat dissipation portion 135 is the same as that of the first embodiment, and therefore the description thereof will be omitted. Heat pipe 1 of the second embodiment
As for the mounting position of "00" to the arithmetic element, for example, as in the first embodiment, it is possible to arbitrarily select and arrange a portion where a mounting space can be secured without adhering and fixing to the upper surface.
【００１９】前記第１と第２の実施例において、図７に
示す如く受熱プレート１１０（受熱部１１５）と熱放散
プレート１３０（熱放散部１３５）の間をコンテナ１２
０とは別に設ける帰還路１７０で結べば、ヒートパイプ
１００内の熱移動がスムーズに行え、ヒートパイプ効果
が向上できる。なお帰還路１７０を有するヒートパイプ
では、コンテナ１２０中にウイックが必要であるが、前
記帰還路１７０中には必ずしもウイックを設ける必要は
ない。In the first and second embodiments, as shown in FIG. 7, the container 12 is provided between the heat receiving plate 110 (heat receiving portion 115) and the heat radiating plate 130 (heat radiating portion 135).
If they are connected by a return path 170 provided separately from 0, heat transfer in the heat pipe 100 can be performed smoothly, and the heat pipe effect can be improved. In the heat pipe having the return path 170, the wick is required in the container 120, but the wick is not necessarily provided in the return path 170.
【００２０】また前記それぞれの実施例において、In each of the above embodiments,
【００２１】[0021]
【発明の効果】上記構成のヒートパイプを使用すること
により、従来のノート型コンピュータの本体部、液晶表
示部の筺体形状、及び構成素子の配置等を変更すること
なく有効な熱放散効果が得られる。即ち、従来の機器構
成、形状をそのまま利用して熱放散効果が得られるの
で、上記電子機器において大幅な設計変更を行う必要が
ない。By using the heat pipe having the above structure, an effective heat dissipation effect can be obtained without changing the main body of the conventional notebook computer, the housing shape of the liquid crystal display, and the arrangement of the constituent elements. To be That is, since the heat dissipation effect can be obtained by using the conventional device configuration and shape as they are, it is not necessary to make a large design change in the electronic device.
【００２２】また、受熱プレート１１０と熱放散プレー
ト１３０を第２のフレキシブルチューブとすれば発熱体
となる演算素子等のあらゆる位置、角度に取り付け可能
となり、またコンテナ部１２０を含めて本体部２１０、
もしくは表示部２２０内の隙間を縫って配置ができるの
で、小型化が促進できる。If the heat receiving plate 110 and the heat dissipating plate 130 are the second flexible tubes, they can be attached at any position and at any angle such as an arithmetic element as a heating element, and the main body 210, including the container 120,
Alternatively, since the gap in the display unit 220 can be sewn and arranged, miniaturization can be promoted.
【図１】 本発明の第１の実施例とするヒートパイプの
上面図を示す。FIG. 1 shows a top view of a heat pipe as a first embodiment of the present invention.
【図２】 図２の側面図を示す。2 shows a side view of FIG.
【図３】 ノート型コンピュータの側面判断面図であ
る。FIG. 3 is a side view of a notebook computer.
【図４】 ノート型コンピュータに本発明のヒートパイ
プを搭載した側面図であるFIG. 4 is a side view showing the heat pipe of the present invention mounted on a notebook computer.
【図５】 コンテナ部に補強材を付加したヒートパイプ
を示す。FIG. 5 shows a heat pipe in which a reinforcing material is added to the container part.
【図６】 本発明の第２の実施例とするヒートパイプで
ある。FIG. 6 is a heat pipe as a second embodiment of the present invention.
【図７】 帰還路を備えるヒートパイプである。FIG. 7 is a heat pipe provided with a return path.
図において同一符号は同一、または相当部分を示す。 １００ ヒートパイプ １１０ 受熱部 １２０ コンテナ １３０ 熱放散プレート １４０ ウイック １５５ 補強材 ２１０ 本体部 ２１１ 演算素子 ２２０ 液晶表示部 ２２２ 金属パネル In the drawings, the same reference numerals indicate the same or corresponding parts. 100 heat pipe 110 heat receiving part 120 container 130 heat dissipation plate 140 wick 155 reinforcing material 210 main body part 211 arithmetic element 220 liquid crystal display part 222 metal panel
Claims (5)
放散プレートを有し、上記受熱プレートと、熱放散プレ
ートの各々の内部を貫通するフレキシブルチューブから
なる密閉容器であって、前記密閉容器内に配置されるウ
イックが弾性を有する編組線からなるヒートパイプ。1. A hermetically sealed container comprising a heat receiving plate made of a good heat conductor and a heat dissipating plate, the heat receiving plate and a flexible tube penetrating the inside of each of the heat dissipating plates. A heat pipe whose inner wick is made of an elastic braided wire.
ためのフィンを構成した請求項１記載のヒートパイプ。2. The heat pipe according to claim 1, wherein a fin for collecting heat is formed on a part or all of the heat receiving plate.
全部に補強材を巻き付けた請求項１または請求項２記載
のヒートパイプ。3. The heat pipe according to claim 1 or 2, wherein a reinforcing material is wound around a part or all of the entire length of the flexible tube.
よってループ上の帰還路を形成した請求項１または請求
項２または請求項３記載のヒートパイプ。4. The heat pipe according to claim 1, wherein the second flexible tube having a thin tubular shape forms a return path on the loop.
本体部演算素子の発生熱を直接あるいは間接に受熱プレ
ートによって受熱し、上記表示部に配置されている金属
パネルに熱放散プレートを接合した請求項１または請求
項２または請求項３または請求項４記載のヒートパイプ
を有するノート型情報機器。5. An information device including a main body and a display unit, and directly or indirectly receives heat generated by the arithmetic element of the main body by a heat receiving plate, and joins a heat dissipation plate to a metal panel arranged on the display unit. A notebook information device having the heat pipe according to claim 1, claim 2, claim 3, or claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6197265A JPH0842983A (en) | 1994-07-28 | 1994-07-28 | Heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6197265A JPH0842983A (en) | 1994-07-28 | 1994-07-28 | Heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0842983A true JPH0842983A (en) | 1996-02-16 |
Family
ID=16371603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6197265A Pending JPH0842983A (en) | 1994-07-28 | 1994-07-28 | Heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0842983A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144479A (en) * | 2000-10-02 | 2001-05-25 | Pfu Ltd | Cooling structure of heat generating element |
| US6250378B1 (en) | 1998-05-29 | 2001-06-26 | Mitsubishi Denki Kabushiki Kaisha | Information processing apparatus and its heat spreading method |
| JP2004088048A (en) * | 2002-07-05 | 2004-03-18 | Sony Corp | Cooling device, electronic equipment, acoustic equipment, and method of manufacturing cooling device |
| JP2004085186A (en) * | 2002-07-05 | 2004-03-18 | Sony Corp | Cooling device, electronic equipment, acoustic device, and method of manufacturing cooling device |
| WO2006047910A1 (en) * | 2004-11-08 | 2006-05-11 | Chunfu Liu | A repeatablely bending heat-conducting and heat-dissipating module with a flexible hinge |
| EP1956318A3 (en) * | 2007-02-09 | 2009-06-03 | Juan Jose Rojo Sastre | Heat dissipator for solar collectors |
| ES2349991A1 (en) * | 2008-02-04 | 2011-01-14 | Juan Jose Rojo Sastre | Heat dissipator perfected for solar collectors. (Machine-translation by Google Translate, not legally binding) |
| JP2023060600A (en) * | 2021-10-18 | 2023-04-28 | レノボ・シンガポール・プライベート・リミテッド | Electronic apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52108549A (en) * | 1976-03-09 | 1977-09-12 | Shii Ii Shii Kk | Irreversible heat transmission material |
| JPH0221478B2 (en) * | 1982-07-30 | 1990-05-15 | Koyo Seiko Co |
-
1994
- 1994-07-28 JP JP6197265A patent/JPH0842983A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52108549A (en) * | 1976-03-09 | 1977-09-12 | Shii Ii Shii Kk | Irreversible heat transmission material |
| JPH0221478B2 (en) * | 1982-07-30 | 1990-05-15 | Koyo Seiko Co |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6250378B1 (en) | 1998-05-29 | 2001-06-26 | Mitsubishi Denki Kabushiki Kaisha | Information processing apparatus and its heat spreading method |
| JP2001144479A (en) * | 2000-10-02 | 2001-05-25 | Pfu Ltd | Cooling structure of heat generating element |
| JP2004088048A (en) * | 2002-07-05 | 2004-03-18 | Sony Corp | Cooling device, electronic equipment, acoustic equipment, and method of manufacturing cooling device |
| JP2004085186A (en) * | 2002-07-05 | 2004-03-18 | Sony Corp | Cooling device, electronic equipment, acoustic device, and method of manufacturing cooling device |
| WO2006047910A1 (en) * | 2004-11-08 | 2006-05-11 | Chunfu Liu | A repeatablely bending heat-conducting and heat-dissipating module with a flexible hinge |
| EP1956318A3 (en) * | 2007-02-09 | 2009-06-03 | Juan Jose Rojo Sastre | Heat dissipator for solar collectors |
| ES2349991A1 (en) * | 2008-02-04 | 2011-01-14 | Juan Jose Rojo Sastre | Heat dissipator perfected for solar collectors. (Machine-translation by Google Translate, not legally binding) |
| JP2023060600A (en) * | 2021-10-18 | 2023-04-28 | レノボ・シンガポール・プライベート・リミテッド | Electronic apparatus |
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