JPH08323791A - Production of laminated sheet - Google Patents

Production of laminated sheet

Info

Publication number
JPH08323791A
JPH08323791A JP13321095A JP13321095A JPH08323791A JP H08323791 A JPH08323791 A JP H08323791A JP 13321095 A JP13321095 A JP 13321095A JP 13321095 A JP13321095 A JP 13321095A JP H08323791 A JPH08323791 A JP H08323791A
Authority
JP
Japan
Prior art keywords
base material
varnish
coated
thermosetting resin
prepregs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13321095A
Other languages
Japanese (ja)
Other versions
JP3354346B2 (en
Inventor
Yasushi Takimoto
恭史 瀧本
Takahisa Iida
隆久 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP13321095A priority Critical patent/JP3354346B2/en
Publication of JPH08323791A publication Critical patent/JPH08323791A/en
Application granted granted Critical
Publication of JP3354346B2 publication Critical patent/JP3354346B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To enhance punching processability and the level of dimensional change/warpage without lowering electric capacity characteristics and other various characteristics by superposing two prepregs so that the coating surfaces of them become inside and arranging metal foil on at least the single surface thereof and molding the whole under heating and pressure. CONSTITUTION: Both surfaces of a long base material are coated with thermosetting resin varnish by respectively using a coater 3 and a roll coater 4. Thereafter, the coated base material is passed through a dryer 5 to be heated and dried to obtain a thermosetting resin impregnated prepreg which is, in turn, cut into predetermined length by a cutter 6. Two prepregs thus obtained are superposed one upon another so that the surfaces coated with the inorg. filler- containing varnish of them become inside to be molded under heating and pressure. By this constitution, a laminated sheet lowered in warpage characteristics, dimensional change and bidirectional thermal expansion and not generating the lowering of moisture absorbing insulating properties and excellent in punching processability and cost reduction is obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、特に電気通信、電子機
器、通信機器等に使用される印刷回路板用として好適な
積層板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminated board suitable for a printed circuit board used in telecommunications, electronic equipment, communication equipment and the like.

【０００２】[0002]

【従来の技術】民生用電子機器の小型化、高機能化が進
み、それに用いられる印刷回路基板として、ガラス不織
布を中間層基材とし、ガラス織布を表面層基材とした構
成で、エポキシ樹脂を含浸させ加熱加圧成形した積層板
（以下、コンポジット積層板という）が使用されてい
る。最近このようなコンポジット積層板に対し、従来こ
の分野で使用されている紙基材フェノール樹脂積層板と
同等の打抜加工性、低コスト化が要求されるようになっ
てきた。2. Description of the Related Art Consumer electronic devices have become smaller and more sophisticated, and as a printed circuit board used for them, glass nonwoven fabric is used as an intermediate layer base material and glass woven fabric is used as a surface layer base material. A laminate (hereinafter referred to as a composite laminate) impregnated with a resin and heat-pressed is used. Recently, such composite laminates have been required to have punching workability and cost reduction equivalent to those of the paper-based phenolic resin laminates conventionally used in this field.

【０００３】また産業用電子機器分野においても、低コ
スト化の必要性から紙基材フェノール樹脂積層板、特に
銀スルーホール用積層板が使用されるようになったきた
が、性能上コンポジット積層板より種々の点で劣り、特
にこれと同等の寸法変化、反りが小さいことが要求され
るようになってきた。Also in the field of industrial electronic equipment, paper-based phenol resin laminates, especially silver through-hole laminates, have come to be used because of the need for cost reduction. It has become more inferior in various points, and in particular, dimensional changes and warpage equivalent to this are required to be small.

【０００４】[0004]

【発明が解決しようとする課題】本発明は、上記のよう
な問題点を解決するため種々検討の結果なされたもの
で、その目的とするところは、電気性能特性及び他の諸
特性を低下させることなく、打抜加工性、寸法変化、反
りのレベルを向上させ、かつ低コストである印刷回路用
積層板を提供することにある。The present invention has been made as a result of various studies in order to solve the above problems, and its purpose is to reduce electric performance characteristics and other characteristics. It is an object of the present invention to provide a laminated board for a printed circuit, which has improved punching workability, dimensional change, and warp level, and is low in cost.

【０００５】[0005]

【課題を解決するための手段】本発明は、長尺の紙基材
の片面側から無機充填材とを含有する熱硬化性樹脂ワニ
スを塗工含浸し乾燥してプリプレグを得、これを塗工面
を内側にして２枚重ね合わせ、さらに必要によりその少
なくとも片面に金属箔を配し、加熱加圧成形することを
特徴とする積層板の製造方法、に関するものである。According to the present invention, a thermosetting resin varnish containing an inorganic filler is coated and impregnated from one side of a long paper base material and dried to obtain a prepreg. The present invention relates to a method for producing a laminated plate, which comprises stacking two sheets with the work surface facing inward, further arranging a metal foil on at least one surface of the sheet as necessary, and heat-pressing.

【０００６】巻き出し装置から巻き出された長尺基材
（１）の上面に熱硬化性樹脂ワニス（２）をコーター
（３）により所定の膜厚になるように塗布する。この長
尺基材としては、低コスト化、打ち抜き性の面から紙基
材が適用される。この紙基材としてはクラフト紙、リン
ター紙等が使用されるが、湿潤強度を上げるため、予め
紙基材をフェノール樹脂、メラミン樹脂等で処理するこ
とが好ましい。また吸湿絶縁性を向上させるため、下塗
り処理を施したものが好ましく使用される。この下塗り
樹脂は、フェノール樹脂、メラミン樹脂等が用いられ、
付着樹脂量としては、５〜２５重量％が好ましい。A thermosetting resin varnish (2) is applied to the upper surface of the long base material (1) unwound from the unwinding device by a coater (3) so as to have a predetermined film thickness. As the long base material, a paper base material is applied from the viewpoints of cost reduction and punchability. Kraft paper, linter paper and the like are used as the paper base material, but it is preferable to pretreat the paper base material with a phenol resin, a melamine resin or the like in order to increase the wet strength. Further, in order to improve the moisture absorption insulating property, an undercoated one is preferably used. As the undercoat resin, a phenol resin, a melamine resin or the like is used,
The amount of the attached resin is preferably 5 to 25% by weight.

【０００７】本発明で用いられる熱硬化性樹脂ワニスに
おける熱硬化性樹脂はエポキシ樹脂が望ましいが、この
ほか、ポリイミド樹脂、ポリエステル樹脂、フェノール
樹脂などを用いる事ができる。かかる熱硬化性樹脂ワニ
スはそのままでも使用することが出来るが、無機充填材
を配合することが好ましい。無機充填材を加えると、打
抜加工性や寸法安定性を維持・向上させるとともに、Ｚ
方向の熱膨張率が小さくなるのでスルーホール信頼性を
向上させることが可能である。かかる無機充填材として
は、水酸化アルミニウム、炭酸カルシウム、クレー、タ
ルク、シリカ等であり、樹脂に対する配合割合は１０〜
２００重量％が好ましい。１０重量％以下では、スルー
ホール信頼性の向上効果が小さく、２００重量％を越え
ると無機充填材の配合が困難となる。The thermosetting resin in the thermosetting resin varnish used in the present invention is preferably an epoxy resin, but in addition to this, a polyimide resin, a polyester resin, a phenol resin or the like can be used. Although such a thermosetting resin varnish can be used as it is, it is preferable to add an inorganic filler. Adding an inorganic filler maintains and improves punching workability and dimensional stability, and
Since the coefficient of thermal expansion in the direction becomes small, it is possible to improve the reliability of the through hole. Such inorganic fillers include aluminum hydroxide, calcium carbonate, clay, talc, silica and the like, and the compounding ratio with respect to the resin is 10 to 10.
200% by weight is preferred. If it is 10% by weight or less, the effect of improving the reliability of the through hole is small, and if it exceeds 200% by weight, it becomes difficult to mix the inorganic filler.

【０００８】熱硬化性樹脂ワニスの固形分は、通常、無
機充填材を配合しない場合は６０〜８０重量％、無機充
填材を配合する場合は６５〜９０重量％（無機充填材も
固形分として計算）である。熱硬化性樹脂ワニスの塗布
量は、通常長尺基材１ あたり、ワニス固形分６００〜
１４００ｇ程度であり、塗布厚み（乾燥前）は０．２〜
１．０ｍｍ程度である。The solid content of the thermosetting resin varnish is usually 60 to 80% by weight when the inorganic filler is not blended, and 65 to 90% by weight when the inorganic filler is blended (the inorganic filler is also a solid content. Calculation). The coating amount of the thermosetting resin varnish is usually 600 to varnish solid content per long substrate 1.
It is about 1400 g, and the coating thickness (before drying) is 0.2 to
It is about 1.0 mm.

【０００９】コーター３としては、コンマロールコータ
ー、ナイフコーター、ダイスコーター、リバースコータ
ー等があるが、塗工厚みが０．２〜１．０ｍｍと厚いた
め、ワニス粘度を高粘度にする必要がある。このため高
粘度ワニスを塗工できる方式、例えばコンマロールコー
ター、ナイフコーターが好ましい。As the coater 3, there are a comma roll coater, a knife coater, a die coater, a reverse coater, etc., but since the coating thickness is as thick as 0.2 to 1.0 mm, it is necessary to make the varnish viscosity high. . Therefore, a method capable of applying a high-viscosity varnish, for example, a comma roll coater or a knife coater is preferable.

【００１０】長尺基材に前記熱硬化性樹脂ワニスを塗工
した後、裏面からは以下に説明するように熱硬化性樹脂
ワニスを塗工する。この塗工は通常ロールコーター
（４）により行われるが、これに限定されるものではな
い。裏面から長尺基材に塗工される熱硬化性樹脂ワニス
は、はじめに塗工された熱硬化性樹脂ワニスが長尺基材
に十分含浸されないものを補うためのもので、塗工・含
浸される樹脂量は少なくて良く、均一に含浸させるため
には樹脂固形分１０〜３０重量％のものが使用される。After the thermosetting resin varnish is applied to the long base material, the thermosetting resin varnish is applied from the back surface as described below. This coating is usually performed by a roll coater (4), but is not limited to this. The thermosetting resin varnish applied to the long base material from the back side is to compensate for the thermosetting resin varnish that was initially applied not being sufficiently impregnated into the long base material. The amount of resin used may be small, and a resin having a solid content of 10 to 30% by weight is used for uniform impregnation.

【００１１】その後、乾燥装置（５）を通して加熱乾燥
することにより、熱硬化性樹脂含浸プリプレグを得る。
加熱乾燥条件は、基材の全厚さが厚いので、通常よりや
や強い条件とし、１２０〜１８０℃、１〜５分間程度で
ある。その後、プリプレグをカッター（６）により所定
長さに切断する。あるいは、切断しないで連続成形に供
することも可能である。After that, a thermosetting resin-impregnated prepreg is obtained by heating and drying through a drying device (5).
Since the total thickness of the base material is thick, the heating and drying conditions are slightly stronger than usual, and are 120 to 180 ° C. and about 1 to 5 minutes. Then, the prepreg is cut into a predetermined length by a cutter (6). Alternatively, it may be subjected to continuous molding without cutting.

【００１２】このようにして得られたプリプレグは、無
機充填材含有ワニの塗工面を内側にして２枚重ね合わせ
加熱加圧成形する。この成形条件は、含浸された樹脂の
流動性にもよるが、通常は従来のコンポジット積層板の
場合と同様に、温度１５０〜１８０℃、圧力２０〜７０
ｋｇ／ｃｍ2、時間６０〜１２０分間が適当である。The prepreg thus obtained is heat-pressed by stacking two prepregs with the coated surface of the crocodile containing an inorganic filler facing inward. Although this molding condition depends on the fluidity of the impregnated resin, usually, the temperature is 150 to 180 ° C. and the pressure is 20 to 70 as in the case of the conventional composite laminate.
It is suitable to use kg / cm 2 for 60 to 120 minutes.

【００１３】以上のような工程で、紙基材熱硬化性樹脂
積層板を得ることができるが、本発明においては、長尺
の紙基材に熱硬化性樹脂ワニスを塗布するので、後の裏
面から樹脂ワニスを塗工する場合を含めても塗布・含浸
工程が簡単であり、コストの高いガラス布基材を全く使
用しないので、低コスト化を達成することができる。A paper-base thermosetting resin laminate can be obtained by the above-mentioned steps. In the present invention, however, the thermosetting resin varnish is applied to a long paper base, so that Even if the resin varnish is applied from the back side, the application / impregnation process is simple, and no costly glass cloth base material is used, so that cost reduction can be achieved.

【００１４】[0014]

【実施例】次に本発明の実施例を比較例とともに具体的
に説明する。EXAMPLES Next, examples of the present invention will be specifically described together with comparative examples.

【００１５】《実施例１》長尺基材である、水溶性フェ
ノール樹脂を樹脂付着量２５〜３０％となるように一次
処理したクラフト紙を巻きだし、続いてこれに次の配合
からなる無機充填材含有ワニスＡをナイフコーターによ
り厚さ０．９ｍｍ（乾燥前）になるように塗工した。 （ワニスＡ配合） エポキシ樹脂 １００重量部 （硬化剤ジシアンジアミドと硬化促進剤を含む） 無機充填材（水酸化アルミニウム） ８０重量部 超微粒子シリカ ２０重量部 溶剤（メチルセロソルブ） ５０重量部 次に、裏面に次の配合のワニスＢをロールコーターによ
り塗布した。 （ワニスＢ配合） エポキシ樹脂（上記と同じ） ３０重量部 溶剤（メチルセロソルブ） ７０重量部Example 1 A kraft paper, which is a long-sized base material, which is primarily treated with a water-soluble phenolic resin so as to have a resin adhesion amount of 25 to 30%, is unwound, and subsequently, an inorganic material having the following composition is added. The filler-containing varnish A was applied with a knife coater to a thickness of 0.9 mm (before drying). (Compounding varnish A) Epoxy resin 100 parts by weight (including curing agent dicyandiamide and curing accelerator) Inorganic filler (aluminum hydroxide) 80 parts by weight Ultrafine particle silica 20 parts by weight Solvent (methyl cellosolve) 50 parts by weight Next, back surface A varnish B having the following composition was applied to a roll coater. (Combining varnish B) Epoxy resin (same as above) 30 parts by weight Solvent (methyl cellosolve) 70 parts by weight

【００１６】続いて、上記のワニスＡ及びＢが塗工され
た基材を、乾燥装置により１４０℃で３分間加熱乾燥し
プリプレグを得た。次にこのプリプレグ２枚をワニスＡ
の塗工面を内側にして重ね合わせ、更にその両面に１８
μｍ厚の銅箔を重ね、成形温度１６５℃、圧力６０ｋｇ
／ｃｍ2 で９０分間積層成形して、厚さ１．６ｍｍの銅
張り積層板を得た。Subsequently, the base material coated with the above varnishes A and B was heated and dried at 140 ° C. for 3 minutes by a drying device to obtain a prepreg. Next, varnish A with 2 pieces of this prepreg.
Put the coated side of the inside on top of each other, and then add 18
Layered with copper foil of μm thickness, molding temperature 165 ℃, pressure 60kg
/ Cm 2 and laminated for 90 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.

【００１７】《実施例２》長尺基材である未処理のクラ
フト紙を巻きだし、以下実施例１と同様にして、これに
ワニスＡ及びＢを塗工してプリプレグを得、このプリプ
レグと銅箔とを積層成形し、厚さ１．６ｍｍの銅張り積
層板を得た。 《比較例１》実施例１において得られた無機充填材配合
ワニスＡをガラス不織布（日本バイリーン製 ＥＰ４０
７５）に含浸乾燥して、中間層用プリプレグを作製し
た。次に、実施例１において得られたワニスＢをガラス
織布（日東紡績製ＷＥ−１８ＫＲＢ−８４）に樹脂含有
量が３０〜４０％になるように含浸、乾燥し表面層用プ
リプレグを作製した。次いで、中間層用プリプレグを所
定枚数重ね、その上下に表面層用プリプレグを重ね、さ
らにその両面に１８μｍ厚の銅箔を重ね合わせ加熱加圧
成形して厚さ１．６ｍｍの銅張り積層板を作製した。 《比較例２》未処理のクラフト紙に桐油変性率３５％の
レゾール樹脂を含浸させプリプレグを作製し、このプリ
プレグ８枚とその両表面の接着剤付き銅箔とを１組とし
て加熱加圧成形して厚さ１．６ｍｍの銅張り積層板を作
製した。Example 2 Untreated kraft paper, which is a long base material, is unwound, and varnishes A and B are applied to it in the same manner as in Example 1 to obtain a prepreg. A copper foil and a copper foil were laminated and molded to obtain a copper-clad laminate having a thickness of 1.6 mm. << Comparative Example 1 >> The inorganic filler-containing varnish A obtained in Example 1 was used as a glass non-woven fabric (EP40 manufactured by Nippon Vilene).
75) and impregnated and dried to prepare an intermediate layer prepreg. Next, the varnish B obtained in Example 1 was impregnated into a glass woven fabric (WE-18KRB-84 manufactured by Nitto Boseki) so that the resin content was 30 to 40%, and dried to prepare a prepreg for a surface layer. . Next, a predetermined number of the intermediate layer prepregs are stacked, the surface layer prepregs are stacked on the upper and lower sides thereof, and a copper foil of 18 μm thickness is further stacked on both surfaces of the prepreg to heat-press and form a 1.6 mm-thick copper clad laminate. It was made. << Comparative Example 2 >> Untreated kraft paper is impregnated with a resole resin having a tung oil modification rate of 35% to prepare a prepreg, and 8 pieces of this prepreg and copper foil with adhesive on both surfaces thereof are combined as a set under heat and pressure. Then, a copper-clad laminate having a thickness of 1.6 mm was produced.

【００１８】以上の実施例及び比較例で得られた銅張り
積層板について、打抜き加工性、反り、寸法変化率、Ｚ
軸方向熱膨張率、吸湿絶縁を測定した。その結果を表１
に示す。測定方法は、打抜き加工性はＡＳＴＭ法で、そ
れ以外は JIS C 6481 により測定した。With respect to the copper-clad laminates obtained in the above Examples and Comparative Examples, punching workability, warpage, dimensional change rate, Z
Axial thermal expansion coefficient and hygroscopic insulation were measured. The results are shown in Table 1.
Shown in As for the measuring method, the punching workability was measured by the ASTM method, and the other methods were measured by JIS C 6481.

【００１９】[0019]

【表１】 [Table 1]

【００２０】なお、製造コストについては、実施例の方
法は工程が単純であり、コストの高いガラス織布・不織
布を使用していないので、実施例で得られた積層板は比
較例で得られたものに比べ１０〜３０％程度低コスト化
することができた。Regarding the manufacturing cost, the method of the embodiment has a simple process and does not use a high cost glass woven fabric / nonwoven fabric. Therefore, the laminated plate obtained in the embodiment is obtained in the comparative example. It was possible to reduce the cost by about 10 to 30% compared to the above.

【００２１】[0021]

【発明の効果】本発明の積層板は、反り特性、寸法変化
率、Ｚ方向熱膨張率、吸湿絶縁の低下が無く、打ち抜き
加工性、低コスト化に優れており、製造工程も簡単であ
るので、工業的な積層板の製造方法として好適である。EFFECTS OF THE INVENTION The laminated sheet of the present invention is excellent in punching workability and cost reduction without warpage characteristics, dimensional change rate, Z-direction thermal expansion coefficient and moisture absorption insulation reduction, and has a simple manufacturing process. Therefore, it is suitable as an industrial laminated plate manufacturing method.

【図面の簡単な説明】[Brief description of drawings]

【図１】 本発明の製造工程において、プリプレグを作
製するまでの工程を示す概略断面図。FIG. 1 is a schematic cross-sectional view showing the steps until a prepreg is manufactured in the manufacturing process of the present invention.

【符号の説明】[Explanation of symbols]

１ 長尺基材 ２ ワニス ３ コーター ４ ロールコーター ５ 乾燥装置 ６ カッター ７ プリプレグ 1 Long base material 2 Varnish 3 Coater 4 Roll coater 5 Dryer 6 Cutter 7 Prepreg

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｋ 101:10 105:16 105:20 Ｂ２９Ｌ 9:00 31:34 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location B29K 101: 10 105: 16 105: 20 B29L 9:00 31:34

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 長尺の紙基材の片面側から無機充填材を
含有する熱硬化性樹脂ワニスを塗工含浸し乾燥してプリ
プレグを得、これを塗工面を内側にして２枚重ね合わ
せ、更にその少なくとも片面に金属箔を配し、加熱加圧
成形することを特徴とする積層板の製造方法。1. A long paper base material is coated and impregnated with a thermosetting resin varnish containing an inorganic filler from one side to obtain a prepreg, and two prepregs are laminated with the coated surface inside. A method for producing a laminated plate, further comprising arranging a metal foil on at least one surface of the metal foil, and heat-pressing. 【請求項２】 前述の長尺基材として、下塗り処理を施
した紙基材を用いることを特徴とする積層板の製造方
法。2. A method for producing a laminated board, wherein a paper base material subjected to an undercoating treatment is used as the long base material.
JP13321095A 1995-05-31 1995-05-31 Manufacturing method of laminated board Expired - Fee Related JP3354346B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13321095A JP3354346B2 (en) 1995-05-31 1995-05-31 Manufacturing method of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13321095A JP3354346B2 (en) 1995-05-31 1995-05-31 Manufacturing method of laminated board

Publications (2)

Publication Number Publication Date
JPH08323791A true JPH08323791A (en) 1996-12-10
JP3354346B2 JP3354346B2 (en) 2002-12-09

Family

ID=15099311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13321095A Expired - Fee Related JP3354346B2 (en) 1995-05-31 1995-05-31 Manufacturing method of laminated board

Country Status (1)

Country Link
JP (1) JP3354346B2 (en)

Also Published As

Publication number Publication date
JP3354346B2 (en) 2002-12-09

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