JPH0832197A - Multilayer copper-clad laminated board with built-in capacitor, and copper-clad laminated board - Google Patents
Multilayer copper-clad laminated board with built-in capacitor, and copper-clad laminated boardInfo
- Publication number
- JPH0832197A JPH0832197A JP6186774A JP18677494A JPH0832197A JP H0832197 A JPH0832197 A JP H0832197A JP 6186774 A JP6186774 A JP 6186774A JP 18677494 A JP18677494 A JP 18677494A JP H0832197 A JPH0832197 A JP H0832197A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- copper
- built
- prepreg
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高周波特性、高密度実
装に優れた、コンデンサー内蔵の多層銅張積層板及び銅
張積層板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer copper clad laminate having a built-in capacitor and a copper clad laminate excellent in high frequency characteristics and high density mounting.
【０００２】[0002]
【従来の技術】電子機器の小形化指向によりプリント配
線板は、配線密度が高密度化するとともに実装部品も小
形化・高集積化の傾向にあり、そのため近接した信号線
の影響が無視できなくなってきた。さらに、素子の信号
処理速度の高速化により電源アース間にはパルス状の大
電流が流れ、共通インピーダンスノイズによる素子相互
間の干渉を原因とする回路の誤動作や放射ノイズの発生
等が問題にされてきた。2. Description of the Related Art Due to the trend toward miniaturization of electronic equipment, printed wiring boards have a higher wiring density and mounting components tend to be smaller and highly integrated. Therefore, the influence of adjacent signal lines cannot be ignored. Came. Furthermore, due to the faster signal processing speed of the elements, a large pulsed current flows between the power supply grounds, causing problems such as circuit malfunction and radiation noise caused by interference between elements due to common impedance noise. Came.
【０００３】これらのノイズ対策のため、内層に電源ア
ース層を用いた多層プリント配線板が採用され、さらに
デカップリングコンデンサーの選択によって共通インピ
ーダンスノイズ対策がとられている。ここで使用されて
いるコンデンサーには、表面実装部品を使用して電源ル
ープ面積をなるべく小さくしたり、周波数特性のよいも
のが採用されている。As a countermeasure against these noises, a multilayer printed wiring board using a power source ground layer as an inner layer is adopted, and a common impedance noise countermeasure is taken by selecting a decoupling capacitor. As the capacitor used here, a surface mount component is used to reduce the power supply loop area as much as possible, or a capacitor having good frequency characteristics is adopted.
【０００４】[0004]
【発明が解決しようとする課題】ところが、さらに小形
化が進み超高密度実装の段階になると、実装のコスト面
から部品サイズや点数の制約の問題が出てきた。However, when the miniaturization is further advanced and the stage of ultra-high density mounting is reached, the problem of restriction of component size and the number of points has arisen from the viewpoint of mounting cost.
【０００５】本発明は、上記の問題を解決するためにな
されたもので、高周波特性に優れ、デカップリングコン
デンサーが不要となり、そして表面に実装する部品点数
を減少することが可能となるという、いわば高密度実装
に優れたコンデンサー内蔵多層銅張積層板とコンデンサ
ー内蔵銅張積層板とを提供しようとするものである。The present invention has been made in order to solve the above-mentioned problems, is excellent in high frequency characteristics, does not require a decoupling capacitor, and can reduce the number of parts to be mounted on the surface. It is intended to provide a multilayer copper clad laminate with a built-in capacitor and a copper clad laminate with a built-in capacitor which are excellent in high-density mounting.
【０００６】[0006]
【課題を解決するための手段】本発明者らは、上記の目
的を達成しようと鋭意研究を重ね、銅張積層板の電源層
とグランド層との間にコンデンサー機能を内蔵すること
によって、上記の目的を達成できることを見いだし、本
発明を完成したものである。DISCLOSURE OF THE INVENTION The inventors of the present invention have conducted extensive studies to achieve the above object, and by incorporating a capacitor function between a power supply layer and a ground layer of a copper clad laminate, The present invention has been completed by discovering that the above object can be achieved.
【０００７】即ち、本発明は、穴を明けた第一プリプレ
グに高誘電体セラミックスを嵌め込み、予備加熱をして
該高誘電体セラミックスを融着させた第一プリプレグの
両面に、銅箔を重ね加熱加圧一体に成形してなるコンデ
ンサー内蔵銅張積層板を加工して内層回路が形成された
内層板に対し、第二プリプレグ、外層銅箔を重ね合わせ
加熱加圧一体に成形してなるコンデンサー内蔵多層銅張
積層板である。また、その多層銅張積層板の製造に用い
るコンデンサー内蔵銅張積層板である。That is, according to the present invention, a high dielectric ceramic is fitted into a first prepreg having a hole, and preheated so that copper foil is superposed on both surfaces of the first prepreg fused with the high dielectric ceramic. Capacitor formed by heating and pressurizing integrally. Capacitor formed by processing the copper clad laminate with built-in capacitor and stacking the second prepreg and outer layer copper foil on the inner layer plate on which the internal circuit is formed. Built-in multilayer copper clad laminate. Further, it is a copper clad laminate with a built-in capacitor used for manufacturing the multilayer copper clad laminate.
【０００８】以下、本発明を詳細に説明する。The present invention will be described in detail below.
【０００９】本発明に使用する高誘電体セラミックスと
しては、二酸化チタン系セラミックス、チタン酸バリウ
ム系セラミックス、チタン酸鉛系セラミックス、チタン
酸ストロンチウム系セラミックス、チタン酸カルシウム
系セラミックス、チタン酸ビスマス系セラミックス、チ
タン酸マグネシウム系セラミックス、ジルコン酸鉛系セ
ラミックス等が挙げられ、これらは単独のセラミック又
は少なくとも2 種を混合し若しくは焼結したセラミック
として使用することができる。The high dielectric ceramics used in the present invention include titanium dioxide ceramics, barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics, calcium titanate ceramics, bismuth titanate ceramics, Examples thereof include magnesium titanate-based ceramics and lead zirconate-based ceramics, which can be used as a single ceramic or as a ceramic obtained by mixing or sintering at least two kinds.
【００１０】本発明に使用する第一プリプレグとして
は、ガラスエポキシ、ガラスポリイミド等一般にプリン
ト配線板に用いられるプリプレグを使用することができ
る。As the first prepreg used in the present invention, prepreg generally used for printed wiring boards such as glass epoxy and glass polyimide can be used.
【００１１】本発明に使用する銅箔としては、プリント
基板用として通常使用されているものを使用することが
できる。As the copper foil used in the present invention, those usually used for printed circuit boards can be used.
【００１２】次にコンデンサー内蔵多層銅張積層板の製
造方法について説明する。Next, a method of manufacturing a multilayer copper clad laminate with a built-in capacitor will be described.
【００１３】まず、第一プリプレグのコンデンサー内蔵
設置部分となる位置に、パンチング、ドリル等で穴をあ
ける。この穴明き第一プリプレグを銅箔上に載せて、穴
部分に高誘電体セラミックスを嵌め込み、熱反射体とし
てアルミニウム蒸着フィルムを重ね合わせ熱プレス熱板
上で高誘電体セラミックスを融着させる。その後アルミ
ニウム蒸着フィルムを除去し、第一プリプレグの上面に
も銅箔を重ねて加熱加圧一体に成形して、コンデンサー
内蔵銅張積層板を製造することができる。First, a hole is punched or punched at a position of the first prepreg where the capacitor is installed. This perforated first prepreg is placed on a copper foil, a high dielectric ceramic is fitted in the hole portion, an aluminum vapor deposition film is superposed as a heat reflector, and the high dielectric ceramic is fused on a hot press hot plate. After that, the aluminum vapor deposition film is removed, and a copper foil is also laminated on the upper surface of the first prepreg and integrally molded by heating and pressurization, whereby a copper clad laminate with a built-in capacitor can be manufactured.
【００１４】また、前記のようにして製造したコンデン
サー内蔵銅張積層板の銅箔に、常法により内層回路を形
成して内層板を作る。この内層板に表面処理を施した
後、第二プリプレグおよび外層銅箔を重ね合わせ加熱加
圧一体に成形して、コンデンサー内蔵多層銅張積層板を
製造することができる。このコンデンサー内蔵多層銅張
積層板には、常法によりスルーホール穴、外層回路パタ
ーン等を形成して、コンデンサー内蔵多層プリント配線
板を製造することができる。コンデンサー内蔵多層銅張
積層板は、電子機器の小型軽量化に対応した高密度実装
基板として、電子機器全般に使用することができる。Further, an inner layer circuit is formed in the copper foil of the copper clad laminate with a built-in capacitor manufactured as described above by a conventional method to form an inner layer plate. After subjecting the inner layer plate to the surface treatment, the second prepreg and the outer layer copper foil are laminated and integrally molded by heating and pressing, whereby a multilayer copper clad laminate with a built-in capacitor can be manufactured. Through-holes, outer layer circuit patterns, and the like are formed in the multilayer copper clad laminate with a built-in capacitor by a conventional method to manufacture a multilayer printed wiring board with a built-in capacitor. The multilayer copper clad laminate with a built-in capacitor can be used in a wide range of electronic equipment as a high-density mounting board that can be made smaller and lighter.
【００１５】[0015]
【作用】本発明のコンデンサー内蔵多層銅張積層板は、
基板内部にコンデンサーを内蔵したことによって表面に
実装される部品点数を減少させることができ、また、電
源層とグランド層との間に高誘電体を形成させることに
よって、高周波ノイズに対する良好な特性を得ることが
できるものである。[Function] The multilayer copper clad laminate with a built-in capacitor of the present invention is
By incorporating a capacitor inside the board, the number of parts mounted on the surface can be reduced, and by forming a high dielectric between the power supply layer and the ground layer, good characteristics against high frequency noise can be obtained. Is what you can get.
【００１６】[0016]
【実施例】次に本発明を実施例よって図面を用いて説明
する。The present invention will be described below with reference to the accompanying drawings.
【００１７】実施例 図１（a ）〜（g ）は、本発明のコンデンサー内蔵銅張
積層板およびコンデンサー内蔵多層銅張積層板の製造方
法を説明するための概略断面図である。EXAMPLE FIGS. 1 (a) to 1 (g) are schematic cross-sectional views for explaining a method of manufacturing a capacitor-embedded copper-clad laminate and a capacitor-embedded multilayer copper-clad laminate of the present invention.
【００１８】まず、ガラスエポキシやガラスポリイミド
のようなプリプレグを用意し、コンデンサー内蔵設計位
置にパンチングやドリル等で図１（a ）に示したように
穴明けを行って穴明き第一プリプレグ１をつくる。次に
図１（b ）に示したように銅箔２上に、前記のようにし
て作った第一プリプレグ１を載せ、第一プリプレグ１の
穴３に高誘電体セラミックス４を嵌め込む。この上にア
ルミニウム蒸着フィルム、セパニウム（サンアルミ社
製、商品名）を重ね合わせ熱プレス上で高誘電体セラミ
ックス４を融着させた。こうして得た高誘電体セラミッ
クス４を嵌め込んだ第一プリプレグの両側に銅箔２を重
ね合わせて、加熱加圧一体に成形してコンデンサー内蔵
の銅張積層板５を製造した。これを図１（c ）に示し
た。First, a prepreg such as glass epoxy or glass polyimide is prepared, and the first prepreg 1 is punched by punching or drilling at the designed position where the capacitor is built in as shown in FIG. 1 (a). To make. Next, as shown in FIG. 1B, the first prepreg 1 made as described above is placed on the copper foil 2, and the high dielectric ceramics 4 is fitted into the hole 3 of the first prepreg 1. An aluminum vapor-deposited film, cepanium (manufactured by Sun Aluminum Co., Ltd., trade name) were superposed on this, and the high dielectric ceramics 4 was fused on a hot press. The copper foil 2 was superposed on both sides of the first prepreg in which the high-dielectric ceramics 4 thus obtained was fitted and integrally molded by heating and pressuring to manufacture a copper clad laminate 5 with a built-in capacitor. This is shown in FIG. 1 (c).
【００１９】次にこのコンデンサー内蔵の銅張積層板５
に所定の回路６を形成して図１（d）に示したように内
層板７を製造した。この内層板７に表面処理を施してそ
の両側にプリプレグ８および外層銅箔９を配置した。こ
の積層配置を示したのが図１（e ）である。図１（e ）
に示した構成で加熱加圧一体に成形して図１（f ）のよ
うなコンデンサー内蔵多層銅張積層板１０を製造した。
この多層銅張積層板１０に穴明けメッキを施してスルー
ホール１１を形成し、さらに外層回路１２を形成してコ
ンデンサー内蔵の多層プリント配線板１３を製造した。
この配線板１３は高周波ノイズ特性に優れており、かつ
表面に高密度実装が可能であった。Next, this copper-clad laminate 5 with built-in capacitor
A predetermined circuit 6 is formed on the inner layer plate 7 as shown in FIG. 1 (d). The inner layer plate 7 was subjected to a surface treatment, and the prepreg 8 and the outer layer copper foil 9 were arranged on both sides thereof. This stacking arrangement is shown in FIG. 1 (e). Figure 1 (e)
A multilayer copper clad laminate 10 with a built-in capacitor as shown in FIG. 1 (f) was manufactured by heating and pressurizing integrally with the structure shown in FIG.
This multilayer copper clad laminate 10 was subjected to perforation plating to form through holes 11, and then an outer layer circuit 12 was formed to manufacture a multilayer printed wiring board 13 with a built-in capacitor.
This wiring board 13 was excellent in high frequency noise characteristics and could be mounted on the surface with high density.
【００２０】[0020]
【発明の効果】以上の説明から明らかなように、本発明
のコンデンサー内蔵銅張積層板およびコンデンサー内蔵
多層銅張積層板は、高周波ノイズ対策に優れ、より高密
度実装が可能で、電子機器の小型軽量化に好適なもので
ある。As is clear from the above description, the capacitor-embedded copper clad laminate and the capacitor-embedded multilayer copper clad laminate of the present invention are excellent in high frequency noise countermeasures, can be mounted at a higher density, and can be used in electronic devices. It is suitable for reduction in size and weight.
【図１】図１（a ）〜（g ）は、本発明のコンデンサー
内蔵銅張積層板およびコンデンサー内蔵多層銅張積層板
の製造方法を説明するための概略断面図である。1 (a) to 1 (g) are schematic cross-sectional views for explaining a method of manufacturing a capacitor-embedded copper-clad laminate and a capacitor-embedded multilayer copper-clad laminate of the present invention.
１ 穴明き第一プリプレグ ２ 銅箔 ３ 穴 ４ 高誘電体セラミックス ５ コンデンサー内蔵銅張積層板 ６ 内層回路 ７ 内層板 ８ 第二プリプレグ ９ 外層銅箔 １０ コンデンサー内蔵多層銅張積層板 １１ スルーホール １２ 外層回路 １３ コンデンサー内蔵多層プリント配線板 1 Hole 1st prepreg 2 Copper foil 3 Hole 4 High dielectric ceramics 5 Copper clad laminate with built-in capacitor 6 Inner layer circuit 7 Inner layer board 8 Second prepreg 9 Outer layer copper foil 10 Multilayer copper clad laminate 11 with built-in capacitor 11 Through hole 12 Outer layer circuit 13 Multilayer printed wiring board with built-in capacitor
Claims (2)
ラミックスを嵌め込み、予備加熱をして該高誘電体セラ
ミックスを融着させた第一プリプレグの両面に、銅箔を
重ね加熱加圧一体に成形してなるコンデンサー内蔵銅張
積層板を加工して内層回路が形成された内層板に対し、
第二プリプレグ、外層銅箔を重ね合わせ加熱加圧一体に
成形してなるコンデンサー内蔵多層銅張積層板。1. A copper foil is superposed on both surfaces of a first prepreg in which a high dielectric ceramic is fitted into a first prepreg having a hole and preheated to fuse the high dielectric ceramic. For the inner layer board on which the inner layer circuit is formed by processing the capacitor built copper clad laminate formed by
A multilayer copper clad laminate with a built-in capacitor, which is formed by stacking a second prepreg and an outer layer copper foil and integrally molding them under heating and pressure.
ラミックスを嵌め込み、予備加熱をして該高誘電体セラ
ミックスを融着させた第一プリプレグの両面に、銅箔を
重ね加熱加圧一体に成形してなることを特徴とするコン
デンサー内蔵銅張積層板。2. A high dielectric ceramic is fitted into a perforated first prepreg, preheated and copper foil is superposed on both surfaces of the first prepreg fused with the high dielectric ceramic by heating and pressing. A copper clad laminate with a built-in capacitor, which is formed by molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18677494A JP3710835B2 (en) | 1994-07-15 | 1994-07-15 | Multilayer copper clad laminate with built-in capacitor and method for producing copper clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18677494A JP3710835B2 (en) | 1994-07-15 | 1994-07-15 | Multilayer copper clad laminate with built-in capacitor and method for producing copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0832197A true JPH0832197A (en) | 1996-02-02 |
| JP3710835B2 JP3710835B2 (en) | 2005-10-26 |
Family
ID=16194392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18677494A Expired - Fee Related JP3710835B2 (en) | 1994-07-15 | 1994-07-15 | Multilayer copper clad laminate with built-in capacitor and method for producing copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3710835B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015928A (en) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | Multilayer printed wiring board and its manufacture |
| JP2001189541A (en) * | 1999-09-23 | 2001-07-10 | Morton Internatl Inc | Method for forming of electric circuitry |
| JP2005302854A (en) * | 2004-04-08 | 2005-10-27 | Fujikura Ltd | Double-sided board with built-in components, double-sided wiring board with built-in components, and its manufacturing method |
| WO2006134914A1 (en) * | 2005-06-13 | 2006-12-21 | Ibiden Co., Ltd. | Printed wiring board |
| WO2006134977A1 (en) * | 2005-06-15 | 2006-12-21 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| JP2007049096A (en) * | 2005-08-12 | 2007-02-22 | Nec Corp | Printed circuit board, semiconductor package, semiconductor device, and electronic apparatus |
| KR100861618B1 (en) * | 2007-03-02 | 2008-10-07 | 삼성전기주식회사 | Printed circuit board for improving tolerance of embedded capacitors, and process for manufacturing the same |
-
1994
- 1994-07-15 JP JP18677494A patent/JP3710835B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015928A (en) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | Multilayer printed wiring board and its manufacture |
| JP2001189541A (en) * | 1999-09-23 | 2001-07-10 | Morton Internatl Inc | Method for forming of electric circuitry |
| JP2005302854A (en) * | 2004-04-08 | 2005-10-27 | Fujikura Ltd | Double-sided board with built-in components, double-sided wiring board with built-in components, and its manufacturing method |
| WO2006134914A1 (en) * | 2005-06-13 | 2006-12-21 | Ibiden Co., Ltd. | Printed wiring board |
| US8164920B2 (en) | 2005-06-13 | 2012-04-24 | Ibiden Co., Ltd. | Printed wiring board |
| WO2006134977A1 (en) * | 2005-06-15 | 2006-12-21 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| US7649748B2 (en) | 2005-06-15 | 2010-01-19 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| US7817440B2 (en) | 2005-06-15 | 2010-10-19 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| JP5095398B2 (en) * | 2005-06-15 | 2012-12-12 | イビデン株式会社 | Multilayer printed wiring board |
| JP2007049096A (en) * | 2005-08-12 | 2007-02-22 | Nec Corp | Printed circuit board, semiconductor package, semiconductor device, and electronic apparatus |
| KR100861618B1 (en) * | 2007-03-02 | 2008-10-07 | 삼성전기주식회사 | Printed circuit board for improving tolerance of embedded capacitors, and process for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3710835B2 (en) | 2005-10-26 |
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