JPH08316682A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPH08316682A JPH08316682A JP7148202A JP14820295A JPH08316682A JP H08316682 A JPH08316682 A JP H08316682A JP 7148202 A JP7148202 A JP 7148202A JP 14820295 A JP14820295 A JP 14820295A JP H08316682 A JPH08316682 A JP H08316682A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electronic device
- width direction
- notch
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線基板の外
周に板金製のシールドケースが外嵌固定されていて、そ
のケースにマザーボード等にマウントするための凸足部
が設けられてなる電子機器に係り、特に前記ケースと配
線基板を同時にディップ（浸漬）半田付けに供するよう
にされているものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device in which a shield case made of sheet metal is externally fitted and fixed to the outer periphery of a printed wiring board, and a convex foot portion for mounting on a motherboard or the like is provided in the case. In particular, the present invention relates to a case in which the case and the wiring board are simultaneously subjected to dip (immersion) soldering.
【０００２】[0002]
【従来の技術】この種の電子機器の一例を図３（Ａ）に
示す。図示例の電子機器１は、電子部品２が実装された
プリント配線基板３と、この配線基板３の外周に外嵌さ
れた筒型ないし箱型の板金製のシールドケース５と、か
らなる。前記ケース５は金属板を打抜プレス等により展
開図の状態で打ち抜くとともに折曲成形したもので、そ
の下端から前記配線基板３の下方に突出するように、ア
ース用突起部７が突設されるとともに、幅方向に少なく
とも一段階だけ細くされてなる階段形細長板状の比較的
長尺の凸足部６が複数箇所（ここでは前後二箇所）に設
けられている。2. Description of the Related Art An example of this type of electronic equipment is shown in FIG. An electronic device 1 in the illustrated example includes a printed wiring board 3 on which an electronic component 2 is mounted, and a cylindrical or box-shaped sheet metal shield case 5 that is fitted onto the outer periphery of the wiring board 3. The case 5 is formed by punching and bending a metal plate in a state of a developed view by a punching press or the like, and a grounding protrusion 7 is provided so as to project from the lower end thereof to the lower side of the wiring board 3. In addition, a plurality of relatively long convex foot portions 6 in the form of a step-shaped elongated plate, which are narrowed by at least one step in the width direction, are provided at a plurality of positions (here, two positions at the front and rear).
【０００３】このような電子機器１は、通常、配線基板
３にケース５を図のように外嵌固定した状態でそれらは
同時にディップ半田付けに供され、配線基板３の裏面側
の所要箇所全部に同時に半田付けが施される。In such an electronic device 1, usually, the case 5 is externally fitted and fixed to the wiring board 3 as shown in the figure, and they are simultaneously subjected to the dip soldering so that all the required portions on the back surface side of the wiring board 3 are provided. At the same time, soldering is applied.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記し
た如くの電子機器１においては、配線基板３とケース５
とを同時にディップ半田付けに供すると、図３（Ｂ）に
示される如くに、基板３の下方に比較的大きく突出して
いる凸足部６の先端部における前記幅方向に細くされた
コーナー部分６ａに半田８が付着したまま残ってしまう
ことが多々あった。However, in the electronic device 1 as described above, the wiring board 3 and the case 5 are used.
3 and 5 are simultaneously subjected to dip soldering, as shown in FIG. 3 (B), the corner portion 6a narrowed in the width direction at the tip of the convex leg portion 6 which projects relatively large below the substrate 3. In many cases, the solder 8 was left attached.
【０００５】このように半田がコーナー部分６ａに残留
すると、当該電子機器１をマザーボード等にマウントす
る際に、その残留半田８により凸足部６がマザーボード
に適切に挿着できず、マウント不良等の問題が生じる。If the solder remains on the corners 6a in this way, when the electronic device 1 is mounted on a mother board or the like, the protruding feet 6 cannot be properly attached to the mother board by the residual solder 8, resulting in mounting failure or the like. Problem arises.
【０００６】このような問題を回避すべく、従来におい
ては、ケース５を後付けにする（ディップ半田付け後に
基板３に取り付ける）、あるいは、ディップ半田付け後
に残留半田を吸い取る等して除去する方策がとられてい
たが、かかる方策は工数及び手間が増大して生産性が低
下し、コスト的に不利であった。In order to avoid such a problem, conventionally, there is a method of attaching the case 5 afterwards (attaching it to the substrate 3 after dip soldering) or removing the residual solder by sucking residual solder after dip soldering. However, such a measure is disadvantageous in terms of cost due to increased man-hours and labor and reduced productivity.
【０００７】かかる点に鑑み本発明は、マザーボード等
にマウントするための凸足部が設けられてなる板金製の
シールドケースがプリント配線基板の外周に外嵌された
もとで、それらを同時にディップ半田付けに供しても、
前記凸足部における先端部のコーナー部分に半田が残留
することがないようにでき、もって、マウント不良等の
不具合が生じ難くされた電子機器を提供することを目的
とする。In view of the above point, the present invention has a shield case made of sheet metal provided with convex feet for mounting on a mother board or the like fitted on the outer periphery of a printed wiring board, and simultaneously dip-soldered them. Even if
It is an object of the present invention to provide an electronic device in which solder can be prevented from remaining in a corner portion of a tip end portion of the convex foot portion, and thus a defect such as mounting failure is hard to occur.
【０００８】[0008]
【課題を解決するための手段】上述の目的を達成すべ
く、本発明に係る電子機器は、基本的には、電子部品が
実装されたプリント配線基板と、この配線基板の外周に
外嵌された筒型ないし箱型の板金製のシールドケース
と、からなり、前記ケースの下端から前記配線基板の下
方に突出するように、幅方向に少なくとも一段階だけ細
くされてなる階段形細長板状の凸足部が設けられ、この
凸足部における前記幅方向に細くされたコーナー部分に
内方に向けて切欠部が形成されてなる。In order to achieve the above object, an electronic apparatus according to the present invention is basically a printed wiring board on which electronic components are mounted, and an electronic device mounted on the outer periphery of the wiring board. A shield case made of a tubular or box-shaped sheet metal, and having a step-like elongated plate shape that is thinned by at least one step in the width direction so as to project from the lower end of the case to the lower side of the wiring board. A convex foot portion is provided, and a notch portion is formed inwardly at a corner portion of the convex foot portion which is narrowed in the width direction.
【０００９】本発明において、切欠部の大きさ及び形状
は特に限定はされず、凸足部の幅及び厚み等に応じて丸
穴状、三角穴もしくは四角穴状、スリット状等の適宜の
寸法形状に作製できる。また、その切欠部はケースを打
抜プレス等で打ち抜いて作製する際に同時に形成でき
る。In the present invention, the size and shape of the notch are not particularly limited, and appropriate dimensions such as a round hole, a triangular hole or a square hole, a slit, etc., depending on the width and thickness of the convex foot. It can be made into a shape. Further, the notch portion can be formed at the same time when the case is punched by a punching press or the like to be manufactured.
【００１０】[0010]
【作用】上述の如くの構成とされた本発明に係る電子機
器においては、シールドケースに設けられた凸足部にお
ける幅方向に細くされたコーナー部分に内方に向けて丸
穴状、三角もしくは四角穴状、スリット状等の切欠部が
形成される。In the electronic device according to the present invention having the above-described structure, the corner portion narrowed in the width direction of the convex foot portion provided in the shield case is inwardly rounded, triangular or A rectangular hole-shaped, slit-shaped notch, or the like is formed.
【００１１】このような切欠部が形成されていることに
より、配線基板とケースとを同時にディップ半田付けに
供しても、該切欠部が半田逃げとして働き、凸足部の先
端部のコーナー部分に半田が残留せず、マウント不良等
の不具合が回避される。By forming such a cutout portion, even when the wiring board and the case are simultaneously subjected to dip soldering, the cutout portion functions as a solder escape, and the corner portion of the tip portion of the convex foot portion is formed. Solder does not remain, and problems such as mounting failure can be avoided.
【００１２】[0012]
【実施例】以下、本発明の実施例を図面を参照しつつ説
明する。図１（Ａ）は本発明に係る電子機器の一実施例
を示しており、この電子機器１０は、前述した図３
（Ａ）に示されるものと同様に、電子部品１２が実装さ
れたプリント配線基板１３と、この配線基板１３の外周
に外嵌された筒型ないし箱型の板金製のシールドケース
１５と、からなる。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A shows an embodiment of an electronic device according to the present invention, and this electronic device 10 is the same as the electronic device shown in FIG.
Similar to that shown in (A), a printed wiring board 13 on which the electronic component 12 is mounted, and a cylindrical or box-shaped sheet metal shield case 15 fitted onto the outer periphery of the wiring board 13 are provided. Become.
【００１３】前記ケース１５は金属板を打抜プレス等に
より展開図の状態で打ち抜くとともに折曲成形したもの
で、その下端から前記配線基板１３の下方に突出するよ
うに、アース用突起部１７が突設されるとともに、幅方
向に少なくとも一段階だけ細くされてなる階段形細長板
状の比較的長尺の凸足部１６が複数箇所（ここでは前後
二箇所）に設けられている。The case 15 is formed by punching and bending a metal plate in a state of a developed view by a punching press or the like, and a grounding protrusion 17 is provided so as to project from the lower end thereof to the lower side of the wiring board 13. A plurality of relatively long projecting legs 16 in the form of a step-shaped elongated plate, which are projectingly provided and are thinned by at least one step in the width direction, are provided at a plurality of positions (here, two positions at the front and rear).
【００１４】そして、本例においては、図１（Ｂ）に詳
細に示される如くに、前記凸足部１６における前記幅方
向に細くされたコーナー部分に内方に向けて丸穴状の切
欠部が形成されている。Further, in this example, as shown in detail in FIG. 1B, a circular hole-shaped notch is formed inwardly at the corner portion narrowed in the width direction of the convex foot portion 16. Are formed.
【００１５】このような電子機器１０は、配線基板１３
にケース１５を図のように外嵌固定した状態でそれらは
同時にディップ半田付けに供され、配線基板１３の裏面
側の所要箇所全部に同時に半田付けを施すようにされ
る。Such an electronic device 10 includes a wiring board 13
In the state where the case 15 is externally fitted and fixed as shown in the figure, they are simultaneously subjected to dip soldering, and all the required portions on the back surface side of the wiring board 13 are simultaneously soldered.
【００１６】ここで、本例の電子機器１０においては、
ケース１５に設けられた凸足部１６における幅方向に細
くされたコーナー部分１６ａに内方に向けて丸穴状の切
欠部２０が形成されていることにより、配線基板１３と
ケース１５とを同時にディップ半田付けに供しても、該
切欠部２０が半田逃げとして働き、凸足部１６の先端部
のコーナー部分１６ａに半田が残留せず、マウント不良
等の不具合が回避される。Here, in the electronic device 10 of this example,
Since the rounded hole-shaped notch 20 is formed inward at the corner portion 16a narrowed in the width direction of the convex foot portion 16 provided on the case 15, the wiring board 13 and the case 15 are simultaneously formed. Even when the dip soldering is performed, the cutout portion 20 functions as a solder escape, the solder does not remain in the corner portion 16a of the tip end portion of the convex foot portion 16, and a defect such as mounting failure is avoided.
【００１７】なお、上述した例では、切欠部を丸穴状に
しているが、切欠部の大きさ及び形状等は特に限定はさ
れず、凸足部の幅及び厚み等に応じて、例えば図２
（Ａ），（Ｂ），（Ｃ）に示される如くのスリット状の
切欠部２１，２２，２３（形成方向が縦、横、斜め上）
にしたり、あるいは（Ｄ）に示される如くの角穴状の切
欠部２４にしてもよいことは勿論であり、また、その切
欠部２０〜２４はケース１５を打抜プレス等で打ち抜い
て作製する際に同時に形成できる。In the above-mentioned example, the notch has a round hole shape, but the size and shape of the notch are not particularly limited, and for example, depending on the width and thickness of the convex leg, for example, as shown in FIG. Two
Slit-shaped notches 21, 22, 23 as shown in (A), (B), and (C) (the forming direction is vertical, horizontal, or diagonally upward)
It is needless to say that the notch 24 may be formed into a rectangular hole or the notch 24 as shown in (D), and the notches 20 to 24 are manufactured by punching the case 15 with a punching press or the like. It can be formed at the same time.
【００１８】[0018]
【発明の効果】以上の説明から理解されるように、本発
明に係る電子機器は、マザーボード等にマウントするた
めの凸足部が設けられてなる板金製のケースをプリント
配線基板の外周に外嵌したもとで、それらを同時にディ
ップ半田付けに供しても、凸足部における幅方向に細く
されたコーナー部分に内方に向けて丸穴状、三角もしく
は四角穴状、スリット状等の切欠部が形成されているの
で、該切欠部が半田逃げとして働き、凸足部の先端部の
コーナー部分に半田が残留せず、マウント不良等の不具
合の発生を効果的に回避できるとういう優れた効果を奏
する。As can be understood from the above description, in the electronic device according to the present invention, the sheet metal case provided with the convex feet for mounting on the mother board is mounted on the outer periphery of the printed wiring board. Even if they are subjected to dip soldering at the same time after being fitted, notches such as round holes, triangles or square holes, and slits are formed inwardly at the corners narrowed in the width direction of the convex feet. Since the cutout portion is formed, the cutout portion functions as a solder relief, the solder does not remain at the corner portion of the tip of the convex foot portion, and it is possible to effectively avoid the occurrence of a defect such as mounting failure. Produce an effect.
【図１】本発明に係る電子機器の一実施例を概略的に示
し、（Ａ）は全体側面図、（Ｂ）は凸足部のコーナー部
分に形成された切欠部を示す部分拡大図。FIG. 1 schematically shows an embodiment of an electronic device according to the present invention, (A) is an overall side view, and (B) is a partially enlarged view showing a cutout portion formed in a corner portion of a convex foot portion.
【図２】図１に示される凸足部に形成される切欠部の他
の例を示し、（Ａ），（Ｂ），（Ｃ）及び（Ｄ）はそれ
ぞれ部分拡大図。FIG. 2 shows another example of the cutout portion formed in the convex foot portion shown in FIG. 1, and (A), (B), (C) and (D) are partially enlarged views.
【図３】従来の電子機器の一例を概略的に示し、（Ａ）
は全体側面図、（Ｂ）は凸足部のコーナー部分に残留し
た半田を示す部分拡大図。FIG. 3 schematically shows an example of a conventional electronic device, (A)
Is a side view of the whole, and (B) is a partially enlarged view showing the solder remaining in the corners of the convex feet.
１０ 電子機器 １２ 電子部品 １３ プリント配線基板 １５ シールドケース １６ 凸足部 １６ａ コーナー部分 ２０〜２４ 切欠部 DESCRIPTION OF SYMBOLS 10 Electronic device 12 Electronic component 13 Printed wiring board 15 Shield case 16 Convex foot 16a Corner part 20-24 Notch part
Claims (1)
と、この配線基板の外周に外嵌された板金製のシールド
ケースと、からなり、前記シールドケースの下端から前
記配線基板の下方に突出するように、幅方向に少なくと
も一段階だけ細くされてなる階段形細長板状の凸足部が
設けられ、この凸足部における前記幅方向に細くされた
コーナー部分に内方に向けて切欠部が形成されているこ
とを特徴とする電子機器。1. A printed wiring board on which electronic components are mounted, and a shield case made of sheet metal fitted on the outer periphery of the wiring board. The shield case projects downward from the lower end of the shield case. Thus, a stepped elongated plate-shaped convex foot portion which is narrowed by at least one step in the width direction is provided, and a notch portion is formed inwardly at the corner portion narrowed in the width direction of the convex foot portion. An electronic device characterized by being formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7148202A JPH08316682A (en) | 1995-05-23 | 1995-05-23 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7148202A JPH08316682A (en) | 1995-05-23 | 1995-05-23 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08316682A true JPH08316682A (en) | 1996-11-29 |
Family
ID=15447548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7148202A Pending JPH08316682A (en) | 1995-05-23 | 1995-05-23 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08316682A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10355442B2 (en) | 2017-07-26 | 2019-07-16 | Sumitomo Electric Industries, Ltd. | Semiconductor optical module providing carrier with structure for receiving excess solder |
-
1995
- 1995-05-23 JP JP7148202A patent/JPH08316682A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10355442B2 (en) | 2017-07-26 | 2019-07-16 | Sumitomo Electric Industries, Ltd. | Semiconductor optical module providing carrier with structure for receiving excess solder |
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