JPH08311223A - Method for improving conductivity of resin molding and method for electrostatically coating resin molding - Google Patents
Method for improving conductivity of resin molding and method for electrostatically coating resin moldingInfo
- Publication number
- JPH08311223A JPH08311223A JP12517895A JP12517895A JPH08311223A JP H08311223 A JPH08311223 A JP H08311223A JP 12517895 A JP12517895 A JP 12517895A JP 12517895 A JP12517895 A JP 12517895A JP H08311223 A JPH08311223 A JP H08311223A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- resin
- resin molding
- corona discharge
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 48
- 239000011347 resin Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000000465 moulding Methods 0.000 title claims abstract description 21
- 239000011248 coating agent Substances 0.000 title claims description 11
- 238000000576 coating method Methods 0.000 title claims description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 238000003851 corona treatment Methods 0.000 claims abstract description 11
- 238000004898 kneading Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims description 11
- 238000007610 electrostatic coating method Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 208000028659 discharge Diseases 0.000 abstract description 2
- 239000002344 surface layer Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000051 modifying effect Effects 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 description 13
- 239000011734 sodium Substances 0.000 description 13
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 9
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 229910052700 potassium Inorganic materials 0.000 description 6
- 239000011591 potassium Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 238000009503 electrostatic coating Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 150000007942 carboxylates Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CMCBDXRRFKYBDG-UHFFFAOYSA-N 1-dodecoxydodecane Chemical compound CCCCCCCCCCCCOCCCCCCCCCCCC CMCBDXRRFKYBDG-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-M hexadecanoate Chemical compound CCCCCCCCCCCCCCCC([O-])=O IPCSVZSSVZVIGE-UHFFFAOYSA-M 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- NKJOXAZJBOMXID-UHFFFAOYSA-N 1,1'-Oxybisoctane Chemical compound CCCCCCCCOCCCCCCCC NKJOXAZJBOMXID-UHFFFAOYSA-N 0.000 description 1
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 description 1
- OMMMUWNDGQFGDV-UHFFFAOYSA-N 1,4-didodecoxy-1,4-dioxobutane-2-sulfonic acid Chemical compound CCCCCCCCCCCCOC(=O)CC(S(O)(=O)=O)C(=O)OCCCCCCCCCCCC OMMMUWNDGQFGDV-UHFFFAOYSA-N 0.000 description 1
- SOSQXPIKTBUEKF-UHFFFAOYSA-N 1,4-dihexoxy-1,4-dioxobutane-2-sulfonic acid Chemical compound CCCCCCOC(=O)CC(S(O)(=O)=O)C(=O)OCCCCCC SOSQXPIKTBUEKF-UHFFFAOYSA-N 0.000 description 1
- LTSWUFKUZPPYEG-UHFFFAOYSA-N 1-decoxydecane Chemical compound CCCCCCCCCCOCCCCCCCCCC LTSWUFKUZPPYEG-UHFFFAOYSA-N 0.000 description 1
- FDCJDKXCCYFOCV-UHFFFAOYSA-N 1-hexadecoxyhexadecane Chemical compound CCCCCCCCCCCCCCCCOCCCCCCCCCCCCCCCC FDCJDKXCCYFOCV-UHFFFAOYSA-N 0.000 description 1
- HBXWUCXDUUJDRB-UHFFFAOYSA-N 1-octadecoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOCCCCCCCCCCCCCCCCCC HBXWUCXDUUJDRB-UHFFFAOYSA-N 0.000 description 1
- HANWHVWXFQSQGJ-UHFFFAOYSA-N 1-tetradecoxytetradecane Chemical compound CCCCCCCCCCCCCCOCCCCCCCCCCCCCC HANWHVWXFQSQGJ-UHFFFAOYSA-N 0.000 description 1
- WHNBDXQTMPYBAT-UHFFFAOYSA-N 2-butyloxirane Chemical compound CCCCC1CO1 WHNBDXQTMPYBAT-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- GCQVNVAYGOFTCL-UHFFFAOYSA-N CCCCCCCCCCCCCC[Na] Chemical compound CCCCCCCCCCCCCC[Na] GCQVNVAYGOFTCL-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- SHGOCGFNBOFPIN-UHFFFAOYSA-N [Na].COS(=O)(=O)CC Chemical compound [Na].COS(=O)(=O)CC SHGOCGFNBOFPIN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 1
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- BTLQPZNAVKPOSY-UHFFFAOYSA-N potassium decan-1-olate Chemical compound [K+].CCCCCCCCCC[O-] BTLQPZNAVKPOSY-UHFFFAOYSA-N 0.000 description 1
- RLEFZEWKMQQZOA-UHFFFAOYSA-M potassium;octanoate Chemical compound [K+].CCCCCCCC([O-])=O RLEFZEWKMQQZOA-UHFFFAOYSA-M 0.000 description 1
- NFFKRJOYWMTDBM-UHFFFAOYSA-M potassium;undecanoate Chemical compound [K+].CCCCCCCCCCC([O-])=O NFFKRJOYWMTDBM-UHFFFAOYSA-M 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- JDBNUMXMGTYDDY-UHFFFAOYSA-N sodium;decan-1-olate Chemical compound [Na+].CCCCCCCCCC[O-] JDBNUMXMGTYDDY-UHFFFAOYSA-N 0.000 description 1
- USFNELLLQLCMSH-UHFFFAOYSA-N sodium;dodecan-1-olate Chemical compound [Na+].CCCCCCCCCCCC[O-] USFNELLLQLCMSH-UHFFFAOYSA-N 0.000 description 1
- SBEDULGUSDGGHS-UHFFFAOYSA-N sodium;octadecan-1-olate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC[O-] SBEDULGUSDGGHS-UHFFFAOYSA-N 0.000 description 1
- KRZQYDMOEZDDGE-UHFFFAOYSA-N sodium;octan-1-olate Chemical compound [Na+].CCCCCCCC[O-] KRZQYDMOEZDDGE-UHFFFAOYSA-N 0.000 description 1
- ZOOPHYLANWVUDY-UHFFFAOYSA-M sodium;undecanoate Chemical compound [Na+].CCCCCCCCCCC([O-])=O ZOOPHYLANWVUDY-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、樹脂成形体の導電性改
良方法および静電塗装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for improving electrical conductivity of a resin molding and an electrostatic coating method.
【0002】[0002]
【従来の技術と発明が解決しようとする課題】従来、樹
脂成形体の導電性を改良した後に静電塗装する方法とし
ては、例えば特開昭50−66538号公報記載のよう
に、樹脂成形体表面に、導電性金属粉末を含有した導電
塗料を塗布する等して導電性のプライマー層を形成し、
導電性をもたせてから静電塗装を行なう方法、または、
カーボンブラック、カーボンファイバー、導電性マイカ
等の無機質系導電物質を樹脂成形体原料に練り込んだ後
に成形し、これに静電塗装を行なう方法等がある。2. Description of the Related Art Conventionally, as a method of electrostatically coating a resin molded body after improving its conductivity, a resin molded body is disclosed, for example, in JP-A-50-66538. Form a conductive primer layer on the surface by applying a conductive paint containing conductive metal powder,
Method of applying electrostatic coating after giving conductivity, or
There is a method in which an inorganic conductive material such as carbon black, carbon fiber or conductive mica is kneaded into a raw material for a resin molded body, molded, and then electrostatically coated.
【0003】しかしながら、特開昭50−66538号
公報記載のように、樹脂成形体表面に導電性プライマー
層を形成する場合には、樹脂成形体表面と導電性プライ
マーとの密着性が悪く、これを改良するためには多種類
の導電性プライマー層を多層にわたって形成せざるを得
ない。このことから、導電性や生産性に問題を生ずるだ
けでなく、多種類の導電性プライマーを使用することに
よる塗布の際のロスやコストの面にも問題があった。However, when a conductive primer layer is formed on the surface of a resin molding as described in JP-A-50-66538, the adhesion between the surface of the resin molding and the conductive primer is poor and In order to improve the above, it is inevitable to form many kinds of conductive primer layers in multiple layers. For this reason, there is a problem not only in terms of conductivity and productivity, but also in terms of loss and cost during coating due to the use of various kinds of conductive primers.
【0004】さらに、カーボンブラック、カーボンファ
イバー、導電性マイカ等の無機質系導電物質を練り込ん
だ成形体に静電塗装する場合には、これらの物質を樹脂
成形体原料に多量に練り込まざるを得ないため、樹脂成
形体の物質劣化が起こりやすく、また、樹脂成形体の着
色により静電塗装表面の色相に影響する等の問題があっ
た。Furthermore, when electrostatically coating a molded body in which an inorganic conductive material such as carbon black, carbon fiber or conductive mica is kneaded, a large amount of these materials must be kneaded into the raw material of the resin molded body. Since it is not obtained, there is a problem that the material deterioration of the resin molded product is likely to occur, and the coloring of the resin molded product affects the hue of the electrostatic coating surface.
【0005】また最近、特開平3−101875号公報
記載のポリオキシアルキレンポリオールと可溶性電解質
塩との錯体を、樹脂成形体原料に練り込み、その混練物
を成形し、得られた成形体の表面をプラズマ処理した
後、静電塗装する方法が開示されたが、この方法はプラ
ズマ処理がバッチ式のために生産性に劣り、しかも減圧
下で成形品を処理しなければならないという問題があっ
た。Recently, a complex of a polyoxyalkylene polyol and a soluble electrolyte salt described in JP-A-3-101875 was kneaded into a raw material for a resin molded body, and the kneaded product was molded, and the surface of the molded body obtained. Although a method of electrostatically coating after plasma treatment was disclosed, this method had a problem that the plasma treatment was inferior in productivity due to the batch type and the molded product had to be treated under reduced pressure. .
【0006】本発明は、このような従来法の欠点を解消
し、樹脂成形体の物性および色相に問題を生ずることな
く、生産性に優れた樹脂成形体の導電性改良方法を提供
すること、さらに、塗着性、付着性、生産性に優れた樹
脂成形体の静電塗装方法を提供することを課題とする。The present invention solves the drawbacks of the conventional method and provides a method for improving the electrical conductivity of a resin molded article which is excellent in productivity without causing problems in the physical properties and hue of the resin molded article. Further, it is an object to provide an electrostatic coating method for a resin molded body which is excellent in coatability, adhesiveness and productivity.
【0007】[0007]
【課題を解決するための手段】本発明では、特定の化合
物を、樹脂成形体原料に練り込み、成形した後に、成形
体表面をコロナ放電処理することにより、導電性が改良
されること、および、これにより、成形体表面を静電塗
装特性に適したものに改質し得ることを見出し、上記課
題を解決した。In the present invention, conductivity is improved by kneading a specific compound into a raw material for a resin molded product, molding the product, and subjecting the surface of the molded product to corona discharge treatment, and As a result, they have found that the surface of the molded product can be modified to have a property suitable for electrostatic coating characteristics, and have solved the above problems.
【0008】すなわち、本発明は、樹脂成形体原料に、
下記一般式(1)で表わされる化合物を練り込み、その
混練物を成形し、得られた成形体の表面をコロナ放電処
理することを特徴とする樹脂成形体の導電性改良方法で
ある。さらに、本発明は、コロナ放電処理後の該成形体
に荷電を有する塗料を噴霧して付着させることを特徴と
する樹脂成形体の静電塗装方法である。That is, the present invention provides a resin molding material as
A method for improving the electrical conductivity of a resin molded product, comprising kneading a compound represented by the following general formula (1), molding the kneaded product, and subjecting the surface of the resulting molded product to corona discharge treatment. Furthermore, the present invention is an electrostatic coating method for a resin molded body, which comprises spraying and attaching a paint having a charge to the molded body after the corona discharge treatment.
【0009】[0009]
【化2】 本発明の方法では、成形後、樹脂成形体の表面層に存在
する一般式(1)で表わされる化合物が、コロナ放電処
理によってより活性化され、樹脂成形体表面に存在しや
すくなることにより、成形体の表面抵抗値が低下し、従
来になく著しく導電性の改良された品質のよい樹脂成形
体を生産性よく得ることができる。さらに、コロナ放電
処理による表面改質効果も加わって、塗着性に優れた静
電塗装が可能となる。Embedded image In the method of the present invention, after molding, the compound represented by the general formula (1) present in the surface layer of the resin molded article is more activated by the corona discharge treatment and easily exists on the resin molded article surface, The surface resistance value of the molded product is lowered, and a resin molded product of high quality with significantly improved conductivity, which is unprecedented, can be obtained with high productivity. Furthermore, the effect of surface modification by corona discharge treatment is added, and electrostatic coating with excellent coatability becomes possible.
【0010】一般式(1)において、R1は、炭素数5
〜22のアルキル基またはアルケニル基で、好ましくは
炭素数8〜18のアルキル基またはアルケニル基であ
り、特に好ましくは炭素数12〜16のアルキル基また
はアルケニル基である。In the general formula (1), R 1 has 5 carbon atoms.
Is an alkyl group or alkenyl group having 22 to 22 carbon atoms, preferably an alkyl group or alkenyl group having 8 to 18 carbon atoms, and particularly preferably an alkyl group or alkenyl group having 12 to 16 carbon atoms.
【0011】本発明では、樹脂成形体原料として、ポリ
エチレン、ポリプロピレン、ゴム入りポリプロピレン
(エチレン−プロピレン系共重合ゴム含有)等のポリオ
レフィン樹脂、ABS樹脂、アクリル樹脂、ポリアミド
樹脂、ポリ塩化ビニル樹脂、ポリカーボネート樹脂、ポ
リアセタール樹脂、フェノール樹脂等の表面抵抗値の高
い樹脂がいずれも使用できる。In the present invention, as a raw material for the resin molded body, a polyolefin resin such as polyethylene, polypropylene, rubber-containing polypropylene (containing ethylene-propylene copolymer rubber), ABS resin, acrylic resin, polyamide resin, polyvinyl chloride resin, polycarbonate is used. Any resin having a high surface resistance value such as resin, polyacetal resin, and phenol resin can be used.
【0012】一般式(1)で表わされる化合物として
は、例えば、ヘキシル酸ナトリウム、ヘキシル酸カリウ
ム、ジヘキシルスルホコハク酸エステルナトリウム塩、
オクチル酸ナトリウム、オクチル酸カリウム、ジ−2−
エチルヘキシルスルホコハク酸エステルナトリウム塩、
オクチルエーテル(プロピレンオキサイド7モル付加
物)カルボン酸ナトリウム、デシル酸ナトリウム、デシ
ル酸カリウム、デシルエーテル(エチレンオキサイド1
5モル、プロピレンオキサイド2モル付加物)カルボン
酸ナトリウム、ウンデシル酸ナトリウム、ウンデシル酸
カリウム、ドデシル酸ナトリウム、ドデシル酸カリウ
ム、直鎖ドデシルベンゼンスルホン酸ナトリウム、直鎖
ドデシルベンゼンスルホン酸カリウム、N−ラウロイル
−N−メチルエタンスルホン酸ナトリウム、ジドデシル
スルホコハク酸エステルナトリウム塩、ドデシルエーテ
ル(エチレンオキサイド5モル付加物)カルボン酸ナト
リウム、ドデシルエーテル(プロピレンオキサイド6モ
ル、エチレンオキサイド2モル付加物)カルボン酸ナト
リウム、テトラデシル酸ナトリウム、テトラデシル酸カ
リウム、N−ミリストイル−N−メチルエタンスルホン
酸ナトリウム、テトラデシルエーテル(エチレンオキサ
イド3モル付加物)カルボン酸ナトリウム、ヘキサデシ
ル酸ナトリウム、ヘキサデシル酸カリウム、N−パルミ
トイル−N−メチルエタンスルホン酸ナトリウム、ヘキ
サデシルエーテル(1,2−ブチレンオキサイド2モル
付加物)カルボン酸ナトリウム、オクタデシル酸ナトリ
ウム、オクタデシル酸カリウム、N−ステアロイル−N
−メチルエタンスルホン酸ナトリウム、オクタデシルエ
ーテル(1,2−ヘキセンオキサイド1モル付加物)カ
ルボン酸ナトリウム、ドコシル酸ナトリウム等のアニオ
ン界面活性剤が挙げられる。Examples of the compound represented by the general formula (1) include sodium hexylate, potassium hexylate, sodium salt of dihexylsulfosuccinate,
Sodium octylate, potassium octylate, di-2-
Ethylhexyl sulfosuccinate sodium salt,
Octyl ether (7 mol propylene oxide adduct) sodium carboxylate, sodium decylate, potassium decylate, decyl ether (ethylene oxide 1
5 mol, propylene oxide 2 mol adduct) Sodium carboxylate, sodium undecylate, potassium undecylate, sodium dodecylate, potassium dodecylate, linear sodium dodecylbenzenesulfonate, potassium linear dodecylbenzenesulfonate, N-lauroyl- Sodium N-methylethanesulfonate, sodium salt of didodecyl sulfosuccinate, sodium dodecyl ether (ethylene oxide 5 mol adduct) carboxylate, dodecyl ether (propylene oxide 6 mol, ethylene oxide 2 mol adduct) sodium carboxylate, tetradecyl Sodium acid salt, potassium tetradecylate, sodium N-myristoyl-N-methylethanesulfonate, tetradecyl ether (ethylene oxide 3 mol adduct) Sodium rubonate, sodium hexadecylate, potassium hexadecylate, sodium N-palmitoyl-N-methylethanesulfonate, sodium hexadecyl ether (1,2-butylene oxide 2 mol adduct) carboxylate, sodium octadecylate, potassium octadecylate , N-stearoyl-N
-Anionic surfactants such as sodium methylethanesulfonate, sodium octadecyl ether (1,2-hexene oxide 1 mol adduct) carboxylate, and sodium docosylate.
【0013】前記アニオン界面活性剤は、一般に市販さ
れているか、公知の方法にて製造されるものである。ア
ルキレンオキサイドを付加する場合は、炭素数2〜6の
アルキレンオキサイドを使用するのが好ましい。該アル
キレンオキサイドは、単独で使用しても、2種以上使用
してもかまわない。The anionic surfactant is generally commercially available or is produced by a known method. When adding an alkylene oxide, it is preferable to use an alkylene oxide having 2 to 6 carbon atoms. The alkylene oxides may be used alone or in combination of two or more.
【0014】上記一般式(1)で表わされる化合物の使
用量は、樹脂成形体原料100重量部に対して0.01
〜10重量部、好ましくは0.05〜5重量部、特に好
ましくは0.1〜3重量部である。0.01重量部未満
だと、できあがった樹脂成形体の導電性が充分でない。
また、10重量部を超える添加は、導電性の向上には好
ましいが、樹脂との相溶性の点で物性劣化および表面ブ
リードを生じるので、大きな利点はない。The amount of the compound represented by the general formula (1) used is 0.01 with respect to 100 parts by weight of the raw material for resin molding.
10 to 10 parts by weight, preferably 0.05 to 5 parts by weight, particularly preferably 0.1 to 3 parts by weight. If it is less than 0.01 part by weight, the electrical conductivity of the resulting resin molded article will be insufficient.
Further, the addition of more than 10 parts by weight is preferable for improving the electroconductivity, but there is no great advantage because it causes physical property deterioration and surface bleeding in terms of compatibility with the resin.
【0015】なお、一般式(1)で表わされる化合物を
樹脂成形体原料に練り込んで添加する際には、本発明の
効果を本質的に変えない限りにおいて、他の帯電防止剤
や加工安定剤等を併用することができる。When the compound represented by the general formula (1) is kneaded and added to the raw material for the resin molded product, other antistatic agents and process stabilizers are added unless the effects of the present invention are essentially changed. Agents and the like can be used in combination.
【0016】一般式(1)で表わされる化合物を樹脂成
形体原料に練り込む方法としては、二軸式押出し機式、
熱ロール式等の一般的に用いられる方法がいずれも使用
でき、樹脂成形体の成形方法としても、射出成形、カレ
ンダー加工、圧縮成形、SMC法等がいずれも使用でき
る。As a method of kneading the compound represented by the general formula (1) into the raw material for the resin molded body, a twin-screw extruder type,
Any commonly used method such as a heat roll method can be used, and as a method for molding a resin molded body, any of injection molding, calendering, compression molding, SMC method and the like can be used.
【0017】また、コロナ放電処理としては、常圧にお
いて、2つの導体間に高電圧を印加すると発生するコロ
ナを、被処理物(成形体)の表面に接触させる方法を用
いる。その処理条件は、コロナ放電が発生する条件であ
ればよく、例えば、印加電圧が10〜100KV程度
で、処理時間が100秒以下程度でよい。As the corona discharge treatment, a method is used in which a corona generated when a high voltage is applied between two conductors is brought into contact with the surface of an object to be treated (molded body) at normal pressure. The treatment conditions may be such that corona discharge occurs, for example, the applied voltage is about 10 to 100 KV, and the treatment time is about 100 seconds or less.
【0018】次に、静電塗装方法としては、電気遠心力
エア、エアレス霧化式塗装機等による方法がいずれも使
用でき、印加電圧は−30KV〜−120KV程度であ
る。また、塗料の種類は、ウレタン系、アクリル系、ア
ルキッド系、メラミン系等の通常用いられている塗料が
いずれも使用できる。Next, as the electrostatic coating method, a method using electric centrifugal air, an airless atomizing type coating machine or the like can be used, and the applied voltage is about -30 KV to -120 KV. As for the type of paint, any of commonly used paints such as urethane, acrylic, alkyd, and melamine can be used.
【0019】[0019]
【実施例】実施例1〜18 表1に示すように、一般式(1)で表わされる化合物の
所定量を、樹脂成形体原料1kgに添加し、二軸押出し
機を用いて180℃で10分間混練してペレットを得
た。このペレットを射出成形機(新潟鉄工所製、ハイパ
ーショット)を用いて成形し、230mm×230mm
×3mmの成形体を得た。この成形体の表面を、印加電
圧30KVで、20秒間コロナ放電処理(高周波電源;
春日電機社製、高周波電源装置HFS−203)し、テ
ストピースを作成した。直ちに、このテストピースの表
面抵抗と引張強さを測定した。表面抵抗は、YHP(横
河ヒューレットパッカード)社製の超絶縁抵抗計432
9A型を用いて、印加電圧500Vで、電圧をかけてか
ら30秒後に測定した(湿度65%、気温20℃)。引
張強さは、JIS K 7113に従って測定した。EXAMPLES Examples 1 to 18 As shown in Table 1, a predetermined amount of the compound represented by the general formula (1) was added to 1 kg of a raw material for a resin molded body, and the mixture was heated at 180 ° C. for 10 hours using a twin-screw extruder. Kneading was carried out for a minute to obtain pellets. This pellet is molded using an injection molding machine (Hyper Shot, manufactured by Niigata Iron Works), 230 mm x 230 mm
A molded product of × 3 mm was obtained. The surface of this molded body was subjected to corona discharge treatment (high frequency power supply;
A high frequency power supply HFS-203 manufactured by Kasuga Denki KK was used to prepare a test piece. Immediately, the surface resistance and tensile strength of this test piece were measured. Surface resistance is a super insulation resistance meter 432 made by YHP (Yokogawa Hewlett-Packard).
It was measured with a 9A type at an applied voltage of 500 V and 30 seconds after the voltage was applied (humidity 65%, temperature 20 ° C.). The tensile strength was measured according to JIS K7113.
【0020】次に、上記で得たテストピースをアース
し、静電圧−40KV、レシプロストローク400m
m、吹きつけ距離300mm、コンベア速度2.2m/
分の塗装機(ランズバーグ・ゲマ社製、μμBEL30
φ)で、ウレタン系塗料(日本ビーケミカル社製、R−
315)を静電塗装し、120℃で30分間乾燥後、膜
厚と塗着効率を測定した。Next, the test piece obtained above was grounded, static voltage -40 KV, reciprocating stroke 400 m.
m, spraying distance 300 mm, conveyor speed 2.2 m /
Minute coating machine (manufactured by Ransburg Gemma, μμBEL30
φ), urethane-based paint (R-
315) was electrostatically coated and dried at 120 ° C. for 30 minutes, and then the film thickness and coating efficiency were measured.
【0021】各測定結果を表1に示す。Table 1 shows each measurement result.
【0022】比較例1〜6 化合物とコロナ放電処理を表2に示すようにした以外
は、実施例1〜18と同様にして行なった。 Comparative Examples 1 to 6 The same processes as in Examples 1 to 18 were carried out except that the compounds and the corona discharge treatment were as shown in Table 2.
【0023】各測定結果を表2に示す。Table 2 shows the results of each measurement.
【0024】表1、2から明らかなように、本発明にお
ける成形体の樹脂物性、導電性、および塗装物の塗着効
率等は優れている。As is clear from Tables 1 and 2, the molded article of the present invention is excellent in resin physical properties, conductivity, and coating efficiency of a coated article.
【0025】[0025]
【表1】 [Table 1]
【表2】 [Table 2]
【0026】[0026]
【発明の効果】本発明によれば、導電性の低い樹脂を使
用して、その樹脂物性および色相を実質的に害すること
なく、著しく導電性を改良した樹脂成形体を得ることが
でき、さらに、塗着効率、表面外観、生産性等に優れた
静電塗装が可能である。According to the present invention, it is possible to obtain a resin molded product having a remarkably improved conductivity by using a resin having a low conductivity, without substantially impairing the physical properties and hue of the resin. It enables electrostatic coating with excellent coating efficiency, surface appearance, and productivity.
Claims (3)
表わされる化合物を練り込み、その混練物を成形し、得
られた成形体の表面をコロナ放電処理することを特徴と
する樹脂成形体の導電性改良方法。 【化1】 1. A resin characterized by kneading a compound represented by the following general formula (1) into a raw material for a resin molded product, molding the kneaded product, and subjecting the surface of the resulting molded product to corona discharge treatment. Method for improving conductivity of molded article. Embedded image
量が、樹脂成形体原料100重量部に対して0.01〜
10重量部であることを特徴とする請求項1記載の樹脂
成形体の導電性改良方法。2. The amount of the compound represented by the general formula (1) used is 0.01 to 100 parts by weight of the raw material for resin molding.
The method for improving the electrical conductivity of a resin molded body according to claim 1, wherein the amount is 10 parts by weight.
た樹脂成形体に荷電を有する塗料を噴霧して付着させる
ことを特徴とする樹脂成形体の静電塗装方法。3. An electrostatic coating method for a resin molded body, which comprises spraying and attaching a charged coating material to the resin molded body obtained by the method according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12517895A JPH08311223A (en) | 1995-05-24 | 1995-05-24 | Method for improving conductivity of resin molding and method for electrostatically coating resin molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12517895A JPH08311223A (en) | 1995-05-24 | 1995-05-24 | Method for improving conductivity of resin molding and method for electrostatically coating resin molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08311223A true JPH08311223A (en) | 1996-11-26 |
Family
ID=14903833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12517895A Pending JPH08311223A (en) | 1995-05-24 | 1995-05-24 | Method for improving conductivity of resin molding and method for electrostatically coating resin molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08311223A (en) |
-
1995
- 1995-05-24 JP JP12517895A patent/JPH08311223A/en active Pending
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