JPH08309799A - Mold for molding resin - Google Patents

Mold for molding resin

Info

Publication number
JPH08309799A
JPH08309799A JP12334395A JP12334395A JPH08309799A JP H08309799 A JPH08309799 A JP H08309799A JP 12334395 A JP12334395 A JP 12334395A JP 12334395 A JP12334395 A JP 12334395A JP H08309799 A JPH08309799 A JP H08309799A
Authority
JP
Japan
Prior art keywords
resin material
flow path
mold
resin
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12334395A
Other languages
Japanese (ja)
Inventor
Yoshitaka Hirose
吉孝 広瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TSUKUBA SEIKO KK
Original Assignee
TSUKUBA SEIKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TSUKUBA SEIKO KK filed Critical TSUKUBA SEIKO KK
Priority to JP12334395A priority Critical patent/JPH08309799A/en
Publication of JPH08309799A publication Critical patent/JPH08309799A/en
Pending legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To provide a mold molding a resin without remodeling an apparatus and reducing the generation of voids caused by the involution of air. CONSTITUTION: In a mold 21 for molding a resin by melting the resin material supplied into a pot 22 under heating and pressure to fill a cavity with the molten resin material from the pot 22 through a cull part 23 and a runner part 24, at least one passage converting surface 26 against which the flow of the filler resin material impinges at an almost right angle is formed to the runner part 24.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、半導体素子の樹脂封
止成形の改良に係り、ボイドを形成させないようにする
いわゆる、ボイドレス樹脂成形用金型に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in resin encapsulation and molding of semiconductor elements, and more particularly to a so-called voidless resin molding die for preventing the formation of voids.

【0002】[0002]

【従来の技術】従来この種のものとしては、例えば図3
及び図4に示すようなものがある。これは、特開平6ー
45379号公報に記載され開示されたものである。
2. Description of the Related Art A conventional device of this type is shown in FIG.
And as shown in FIG. This is described and disclosed in JP-A-6-45379.

【0003】この樹脂成形用金型1においては、図3及
び図4に示すように、ポット2内で加熱・加圧溶融さ
れ、プランジャ(図示省略)でカル部3を経てランナ部
4に押し出されゲート口4aを通して注入される溶融樹
脂材料の注入スピードを、溶融樹脂材料がゲート口4a
付近に完全に充填される範囲及び時間(T1)とワイヤ
7付近に充填される範囲及び時間(T2)とにおいては
比較的に遅くなるように注入し、逆に、これらの範囲
(T1、T2)以外となる範囲及び時間(T3、T4)にお
いては通常の注入スピード(前者と較べて早いスピー
ド)で注入すると言った多段注入法が開示されている。
In this resin molding die 1, as shown in FIGS. 3 and 4, the resin is heated and pressurized and melted in a pot 2 and is extruded by a plunger (not shown) through a cull portion 3 and a runner portion 4. The injection speed of the molten resin material injected through the gate port 4a depends on the molten resin material
In the range and time (T1) that is completely filled in the vicinity and in the range and time (T2) that is filled in the vicinity of the wire 7, injection is performed relatively slowly, and conversely, these ranges (T1, T2) are injected. In the range and time (T3, T4) other than the above), a multi-step injection method is disclosed in which injection is performed at a normal injection speed (speed faster than the former).

【0004】これにより、溶融樹脂材料中にキャビティ
5a、6a内の残留エアーが巻き込まれて樹脂成形体に
ボイドが形成されるのを防止すると共に、溶融樹脂材料
が半導体素子と外部リードとを結ぶ細いワイヤ7を変形
・断線するのを防止する。
This prevents the residual air in the cavities 5a and 6a from being caught in the molten resin material to form voids in the resin molded body, and the molten resin material connects the semiconductor element and the external lead. It prevents the thin wire 7 from being deformed or broken.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、前記樹
脂成形用金型1による成形時、ポット2から押し出され
た成形樹脂材料の流れに巻き込まれたりキャビティ5
a、6a内の残留エアーを樹脂の充填スピードでボイド
にならないように制御するには、樹脂成形体の大きさや
形状に合わせて最良の条件をその都度試行錯誤で見いだ
す必要がいるとともに、成形装置には成形スピードに見
合ったスピード制御装置を設けなければならず、従来の
成形装置に制御機能を組み込めない場合には実行不可能
であった。即ち、成形装置そのものを改造しなければな
らないという問題があった。
However, at the time of molding by the resin molding die 1, the resin is caught in the flow of the molding resin material extruded from the pot 2 or the cavity 5 is formed.
In order to control the residual air in a and 6a so as not to form voids at the filling speed of the resin, it is necessary to find the best condition in each case according to the size and shape of the resin molding by trial and error, and at the same time, the molding device Had to be equipped with a speed control device corresponding to the molding speed, which was not possible if the conventional molding device could not be equipped with a control function. That is, there was a problem that the molding apparatus itself had to be modified.

【0006】そこで、この発明は、従来の樹脂成形装置
を改造することなく、ボイド発生による成形不良の削減
が図れる樹脂成形用金型を提供することを目的にしてい
る。
[0006] Therefore, an object of the present invention is to provide a resin molding die capable of reducing defective molding due to void generation without modifying a conventional resin molding apparatus.

【0007】[0007]

【課題を解決するための手段】この目的を達成するた
め、請求項1に記載の発明は、ポット内に供給した樹脂
材料を加熱・加圧溶融し、カル部及びランナ部を介して
ポットからキャビティ内に充填させる樹脂成形用金型に
おいて、前記ランナ部に少なくとも一つの充填樹脂材料
の流れが略直角に突き当たる流路変換面を形成したこと
を特徴としている。
To achieve this object, the invention according to claim 1 heats and pressurizes and melts the resin material supplied into the pot, and then removes the resin material from the pot through the cull portion and the runner portion. In the resin molding die to be filled in the cavity, the runner portion is characterized in that a flow path conversion surface on which at least one flow of the filled resin material abuts at a substantially right angle is formed.

【0008】請求項2に記載の発明は、請求項1に記載
の樹脂成形用金型において、前記カル部の出口には、該
カル部の周縁面からゲート方向と略直角になる接線方向
に形成されたランナ部を有していることを特徴としてい
る。
According to a second aspect of the present invention, in the resin molding die according to the first aspect, the outlet of the cull portion is in a tangential direction substantially perpendicular to the gate direction from the peripheral surface of the cull portion. It is characterized by having a formed runner portion.

【0009】請求項3に記載の発明は、請求項1又は2
に記載の樹脂成形用金型において、前記ランナ部の途中
で金型のパーティング面と垂直の流路変換面を設けると
ともに、充填樹脂材料の流れを金型のパーティング面に
垂直の方向に向けさせるランナ部を形成させたことを特
徴としている。
The invention according to claim 3 is the invention according to claim 1 or 2.
In the resin molding die according to, in the middle of the runner portion with a flow path conversion surface perpendicular to the parting surface of the mold, the flow of the filling resin material in the direction perpendicular to the parting surface of the mold. The feature is that a runner portion to be directed is formed.

【0010】[0010]

【作用】請求項1の発明によれば、ランナ部に少なくと
も一つの充填樹脂材料の流れが略直角に突き当たる流路
変換面を形成したことにより、エアーとともにポット内
で加熱・加圧溶融された充填樹脂材料はランナ部をエア
ーとともに流動し流路変換面に突き当たって比重の小さ
いエアーは飛び散り細かく分散される。
According to the first aspect of the present invention, since the flow passage converting surface on which the flow of the at least one filling resin material abuts at a substantially right angle is formed in the runner portion, it is heated and pressurized and melted in the pot together with the air. The filled resin material flows in the runner portion together with the air, hits the flow path conversion surface, and the air having a small specific gravity is scattered and finely dispersed.

【0011】請求項2の発明によれば、カル部の出口に
は、このカル部の周縁面からゲート方向と略直角になる
接線方向に形成されたランナ部を有していることによ
り、充填樹脂材料は流路変換面に突き当りエアーを細か
く分散させながら略直角に流れ方向を変えるので、エア
ーが細かく分散されるのを助長させる。また、分散され
たエアーは激しい流動で集結することはない。
According to the invention of claim 2, the outlet of the cull portion is provided with a runner portion formed in a tangential direction which is substantially perpendicular to the gate direction from the peripheral surface of the cull portion. Since the resin material collides with the flow path conversion surface and finely disperses the air while changing the flow direction at a substantially right angle, the air is encouraged to be finely dispersed. Moreover, the dispersed air does not aggregate due to the violent flow.

【0012】請求項3の発明によれば、ランナ部の途中
で金型パーティング面に垂直の流路変換面を設けるとと
もに、充填樹脂材料の流れを金型パーティング面に垂直
の方向に転換させるランナ部を形成させたことにより、
垂直面でも流路変換面に突き当りエアーを分散させなが
ら縦方向に流れ更に、水平面の流路変換面に突き当り流
れ方向を変えることにより、急激に水平・垂直・水平と
方向変換をするのでエアーが細かく分散されるのをより
助長させる。そして、充填樹脂材料に含まれたエアーが
微細化された状態でゲート部よりキャビティ内に入る。
According to the third aspect of the present invention, a flow path conversion surface perpendicular to the mold parting surface is provided in the middle of the runner portion, and the flow of the filling resin material is changed to a direction perpendicular to the mold parting surface. By forming the runner part to
Even on a vertical surface, it collides with the flow passage conversion surface and flows in the vertical direction while dispersing the air. Furthermore, by colliding with the flow passage conversion surface on the horizontal plane and changing the flow direction, the direction is rapidly changed to horizontal / vertical / horizontal. Helps to be finely dispersed. Then, the air contained in the filling resin material enters the cavity from the gate portion in a finely divided state.

【0013】[0013]

【実施例】以下、この発明を実施例に基づいて説明す
る。
EXAMPLES The present invention will be described below based on examples.

【0014】図1及び図2はこの発明の実施例を示すも
ので、図1は樹脂成形後型開きした状態を下型の平面図
で示したものであり、図2は樹脂成形時の状態を樹脂成
形用金型の断面図で示したものである。
1 and 2 show an embodiment of the present invention. FIG. 1 is a plan view of a lower mold showing a state where a mold is opened after resin molding, and FIG. 2 is a state at the time of resin molding. FIG. 3 is a sectional view of a resin molding die.

【0015】まず、構成を説明すると、図1の符号21
は樹脂成形用金型であり中央部に複数個のポット22を
設け、このポット22内にはプランジャ32を設けてい
る。そして、このポット22からキャビティ25間にカ
ル部23及びランナ部24を設けている。
First, the structure will be described. Reference numeral 21 in FIG.
Is a resin molding die, and a plurality of pots 22 are provided in the central portion, and a plunger 32 is provided in the pots 22. A cull portion 23 and a runner portion 24 are provided between the pot 22 and the cavity 25.

【0016】このカル部23はポット22よりも多少大
きいポット22と同芯円の円板状をしており、ポット2
2から押し出された充填樹脂材料を円周状に広げランナ
部24へ流出させる作用をしている。
The cull portion 23 has a disk shape concentric with the pot 22 which is slightly larger than the pot 22.
The filler resin material extruded from 2 is circumferentially spread and flows into the runner portion 24.

【0017】そして、このランナ部24には充填樹脂材
料の流れが略直角に突き当たる流路変換面26aを設け
ている。また、カル部23の出口には、このカル部23
の周縁面27からゲート28方向と略直角になる接線方
向にランナ部24を形成させ、このランナ部24の途中
で樹脂成形用金型21のパーティング面29と垂直の方
向に流路変換面26bを設け、更に、ランナ部24を樹
脂成形用金型21のパーティング面29に垂直の方向に
向けた後、水平の流路変換面26cを設けている。
The runner portion 24 is provided with a flow path conversion surface 26a on which the flow of the filling resin material abuts at a substantially right angle. At the exit of the cull part 23, the cull part 23
A runner portion 24 is formed in a tangential direction that is substantially perpendicular to the direction of the gate 28 from the peripheral edge surface 27, and a flow path conversion surface is formed in the direction perpendicular to the parting surface 29 of the resin molding die 21 in the middle of the runner portion 24. 26b is provided, and after the runner portion 24 is oriented in the direction perpendicular to the parting surface 29 of the resin molding die 21, a horizontal flow path conversion surface 26c is provided.

【0018】この様に水平・垂直・水平の流路変換面2
6を設けたランナ部24はキャビティ入口で絞ったゲー
ト28としてキャビティ25につなげている。また、こ
のキャビティ25内には半導体素子が設置されており、
このゲート28から充填された樹脂材料は半導体素子の
外部リード31を残して包み込み樹脂成形体30とな
る。
In this way, the horizontal / vertical / horizontal flow path conversion surface 2
The runner portion 24 provided with 6 is connected to the cavity 25 as a gate 28 narrowed at the cavity inlet. A semiconductor element is installed in the cavity 25,
The resin material filled from the gate 28 becomes a resin molded body 30 that encloses the semiconductor element, leaving the external leads 31.

【0019】図2は樹脂成形用金型21の断面図であ
り、プランジャ32が最上昇し充填樹脂材料がキャビテ
ィ25内に注入された状態を示している。
FIG. 2 is a cross-sectional view of the resin molding die 21, showing a state in which the plunger 32 is moved up to the maximum and the filling resin material is injected into the cavity 25.

【0020】すなわち、中央部にはカル部23を有し、
このカル部23から水平の流路変換面26a(図1参
照)を経て、ランナ部24に入った所に垂直の流路変換
面26bを設け、ランナ部24が垂直になると続いて略
直角に突き当たるように水平の流路変換面26cを設け
ている。
That is, the cull portion 23 is provided at the center,
A vertical flow path conversion surface 26b is provided from the cull portion 23 through the horizontal flow path conversion surface 26a (see FIG. 1) and into the runner portion 24, and when the runner portion 24 becomes vertical, the vertical flow path conversion surface 26b continues to form a substantially right angle. A horizontal flow path conversion surface 26c is provided so as to abut.

【0021】このランナ部24が水平に成ったところで
キャビティ25に向けて断面が三角状になるように絞っ
たゲート28を設けキャビティ25へつなげている。
When the runner portion 24 is horizontal, a gate 28 is provided which is narrowed toward the cavity 25 so that its cross section becomes triangular, and is connected to the cavity 25.

【0022】次に、この構成よりなる作用について説明
する。
Next, the operation of this structure will be described.

【0023】まず、ポット22内で加熱加圧されプラン
ジャ32により押し出された充填樹脂材料はまず、カル
部23の周縁面27からゲート28方向と水平面で略直
角になる一つ目の流路変換面26aに突き当たる。この
流路変換面26aに当り略直角に流れを変えると、続い
て垂直である二つ目の流路変換面26bに当り略直角に
流れを変える。更に続いて水平の三つ目の流路変換面2
6cに当たり略直角に流れを変えてゲート部に向い、ゲ
ート入口で絞られて発熱しながらキャビティ25に充填
される。
First, the filling resin material heated and pressurized in the pot 22 and extruded by the plunger 32 is first converted from the peripheral surface 27 of the cull portion 23 into the first flow path which is substantially perpendicular to the gate 28 direction in the horizontal plane. It hits the surface 26a. When the flow is changed substantially at a right angle upon hitting the flow path converting surface 26a, the flow is then changed at a substantially right angle after hitting the second vertical flow path converting surface 26b. Then, the third horizontal flow path conversion surface 2
It hits 6c and changes the flow at a substantially right angle to face the gate portion, and is filled in the cavity 25 while being squeezed at the gate inlet and generating heat.

【0024】これら流路変換面26(26a、26b、
26c)にエアーを巻き込んだ充填樹脂材料が突き当た
ると、比重の小さいエアーは飛び散り微細化される。そ
して、この微細化されたエアーは充填樹脂材料とともに
激しく方向を変えながら流動して行くため集結できず、
ボイドには成長せず微細化された状態で樹脂の中にエア
ーが均質に介在するようになる。
These flow path conversion surfaces 26 (26a, 26b,
When the filled resin material entrained with air hits 26c), the air having a small specific gravity scatters and is miniaturized. And, since this finely divided air flows while changing the direction violently with the filling resin material, it cannot be collected,
Air does not grow in the voids and air is uniformly present in the resin in a finely divided state.

【0025】この樹脂成形用金型21による成形試作時
には流路変換面26の効果確認をするため、ランナ部2
4に設けた流路変換面26をなだらかにして、充填樹脂
材料が突き当たらない状態にして成形試作したところ、
キャビティ25内のゲート28近傍にボイドが樹脂成形
毎に発生して良品は得られなかった。この事により流路
変換面26を略直角にし、充填樹脂材料の流れの突き当
りを起させることにより、巻き込まれたエアーの微細化
効果が発揮されることが確認できた。
In order to confirm the effect of the flow path conversion surface 26 at the time of trial molding using this resin molding die 21, the runner portion 2 is used.
When the flow path conversion surface 26 provided in 4 was made gentle and the filling resin material did not hit, a molding trial was made.
A void was generated in the vicinity of the gate 28 in the cavity 25 each time the resin was molded, and a good product was not obtained. From this, it was confirmed that the flow path conversion surface 26 is formed substantially at a right angle to cause the flow of the filling resin material to abut, and the effect of refining the entrained air is exhibited.

【0026】この流路変換面26を有するランナ部24
の水平なパーティング面29での幅(a)は、 a=4m
m 程度が良好であり、続く垂直の流路変換面を有するラ
ンナ幅(b)は、b=1mm、1.5mm、2mm の三種類
で成形試作を繰り返し行なったところ、 1mm 幅がこの
実施例では最も良好な結果をもたらした。
A runner portion 24 having this flow path conversion surface 26
The width (a) of the horizontal parting surface 29 is a = 4m
About m, the runner width (b) having the following vertical flow path conversion surface was three kinds of b = 1 mm, 1.5 mm, and 2 mm. Gave the best results.

【0027】また、このランナ幅(b)が 1mm 以下で
は、樹脂材料の流れが急に悪くなり欠肉等の成形不良が
出ることも確認できた。
It has also been confirmed that when the runner width (b) is 1 mm or less, the flow of the resin material suddenly deteriorates and molding defects such as lack of thickness occur.

【0028】そして、上記のランナ部24寸法の樹脂成
形用金型21による成形試作で、巻き込まれたエアーが
絶縁性等に悪影響を与えない規定値以下の均質に微細化
された気泡状態となって半導体素子を包み込むため、ボ
イド発生による成形不良の低減が図れることが確認でき
た。
Then, in the trial molding using the resin molding die 21 having the above-mentioned dimension of the runner portion 24, the entrapped air becomes a state of uniformly finely pulverized air below a specified value that does not adversely affect the insulation property and the like. It has been confirmed that since the semiconductor element is wrapped around the semiconductor element, it is possible to reduce defective molding due to the occurrence of voids.

【0029】[0029]

【発明の効果】この発明は、以上説明してきたように、
ランナ部に充填樹脂材料の流れが略直角に突き当たる流
路変換面を形成したことにより、エアーを巻き込んだ充
填樹脂材料はランナ部を流動し、連続して水平・垂直・
水平な流路変換面に突き当り急激な方向変換をするの
で、比重の小さいエアーは飛び散り細かく微細化され
る。また、このランナ部での急激な方向変換が連続的に
繰り返されるので、分散されたエアーが集結しボイドに
戻るのを阻止することができる。
As described above, the present invention has the following advantages.
By forming a flow path conversion surface where the flow of the filling resin material hits the runner portion at a substantially right angle, the filling resin material containing air flows through the runner portion and continuously
The air having a small specific gravity scatters and is finely divided because it abruptly changes the direction by hitting the horizontal flow passage conversion surface. Further, since the rapid direction change in the runner portion is continuously repeated, it is possible to prevent the dispersed air from collecting and returning to the void.

【0030】従って、絶縁性等に悪影響を与えない規格
値以下の微細な気泡径となり、ボイド発生による不良率
の大幅な低減を図ることができる。
Therefore, the fine bubble diameter is equal to or less than the standard value that does not adversely affect the insulation property, and the defective rate due to the occurrence of voids can be greatly reduced.

【0031】このように、樹脂成形用金型においてボイ
ド発生が抑えられるので、特殊な成形装置を準備する必
要はない。
As described above, since the generation of voids is suppressed in the resin molding die, it is not necessary to prepare a special molding device.

【0032】従って、設備償却等製造費が安価になる。Therefore, manufacturing costs such as equipment depreciation are low.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例を示す樹脂成形用金型の平
面図である。
FIG. 1 is a plan view of a resin molding die showing an embodiment of the present invention.

【図2】同実施例を示す図1のA−A線に沿う断面図で
ある。
FIG. 2 is a sectional view taken along the line AA of FIG. 1 showing the same embodiment.

【図3】従来技術の樹脂成形用金型の平面図である。FIG. 3 is a plan view of a conventional resin molding die.

【図4】従来技術の図3のB−B線に沿う部分断面図で
ある。
FIG. 4 is a partial cross-sectional view taken along the line BB of FIG. 3 of the related art.

【符号の説明】[Explanation of symbols]

21…樹脂成形用金型 22…ポット 23…カル部 24…ランナ部 25…キャビティ 26…流路変換面 27…周縁面 28…ゲート 29…パーティング面 21 ... Mold for resin molding 22 ... Pot 23 ... Cull part 24 ... Runner part 25 ... Cavity 26 ... Flow path conversion surface 27 ... Peripheral surface 28 ... Gate 29 ... Parting surface

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ポット内に供給した樹脂材料を加熱・加
圧溶融し、カル部及びランナ部を介してポットからキャ
ビティ内に充填させる樹脂成形用金型において、 前記ランナ部に少なくとも一つの充填樹脂材料の流れが
略直角に突き当たる流路変換面を形成したことを特徴と
する樹脂成形用金型。
1. A resin molding die for heating and pressurizing and melting a resin material supplied into a pot and filling the cavity from the pot through a cull portion and a runner portion, wherein at least one filling is provided in the runner portion. A resin molding die having a flow path conversion surface on which a flow of a resin material abuts at a substantially right angle.
【請求項2】 前記カル部の出口には、該カル部の周縁
面からゲート方向と略直角になる接線方向に形成された
ランナ部を有していることを特徴とする請求項1に記載
の樹脂成形用金型。
2. The outlet of the cull part has a runner part formed in a tangential direction which is substantially perpendicular to the gate direction from the peripheral surface of the cull part. Mold for resin molding.
【請求項3】 前記ランナ部の途中で金型のパーティン
グ面と垂直の流路変換面を設けるとともに、金型パーテ
ィング面に平行な流路変換面を有するランナ部を形成さ
せたことを特徴とする請求項1又は2に記載の樹脂成形
用金型。
3. A runner part having a flow path converting surface parallel to the mold parting surface is formed while providing a flow path converting surface perpendicular to the parting surface of the mold in the middle of the runner part. The mold for resin molding according to claim 1 or 2, which is characterized.
JP12334395A 1995-05-23 1995-05-23 Mold for molding resin Pending JPH08309799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12334395A JPH08309799A (en) 1995-05-23 1995-05-23 Mold for molding resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12334395A JPH08309799A (en) 1995-05-23 1995-05-23 Mold for molding resin

Publications (1)

Publication Number Publication Date
JPH08309799A true JPH08309799A (en) 1996-11-26

Family

ID=14858223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12334395A Pending JPH08309799A (en) 1995-05-23 1995-05-23 Mold for molding resin

Country Status (1)

Country Link
JP (1) JPH08309799A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112620604A (en) * 2020-12-18 2021-04-09 苏州广型模具有限公司 Core-pulling parting structure of lightweight valve body die-casting die

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112620604A (en) * 2020-12-18 2021-04-09 苏州广型模具有限公司 Core-pulling parting structure of lightweight valve body die-casting die
CN112620604B (en) * 2020-12-18 2022-02-18 苏州广型模具有限公司 Core-pulling parting structure of lightweight valve body die-casting die

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