JPH08297869A - Substrate holder holding device - Google Patents
Substrate holder holding deviceInfo
- Publication number
- JPH08297869A JPH08297869A JP9841995A JP9841995A JPH08297869A JP H08297869 A JPH08297869 A JP H08297869A JP 9841995 A JP9841995 A JP 9841995A JP 9841995 A JP9841995 A JP 9841995A JP H08297869 A JPH08297869 A JP H08297869A
- Authority
- JP
- Japan
- Prior art keywords
- substrate holder
- substrate
- mask
- carrier
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、真空中で光ディスク等
の基板上に薄膜を成膜する真空成膜処理装置に関するも
のであり、特に成膜処理前の基板ホルダー保持装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum film forming apparatus for forming a thin film on a substrate such as an optical disk in vacuum, and more particularly to a substrate holder holding apparatus before film forming processing.
【０００２】[0002]
【従来の技術】従来の真空成膜処理装置における基板・
マスクの基板ホルダーへの固定方法は大きく分けて二つ
の方法があった。第一の方法は大気中と真空下とを移動
可能とした搬送台と前記搬送台にネジ止めで強固に固定
された基板ホルダーを用いる方法で、発塵量は微量であ
り、主に光磁気ディスク等の製造装置に用いられている
高価なものであった。第二の方法は基板ホルダーのみ大
気中と真空下とを移動可能とし、搬送台は真空中に置か
れ、基板ホルダーと搬送台の固定は磁力あるいは双方に
設けた機械的凹凸の勘合によってなされる方法で、コン
パクトディスク等の製造装置に用いられており、比較的
安価なものであった。これら従来の方法ではどちらの方
法で行うにしても、成膜後の基板を取り出し、新しい基
板を基板ホルダーに取り付けるためには、成膜毎に基板
ホルダー及びマスクを大気中に取り出す必要があった。
このためマスクに堆積した膜が大気中と真空との圧力変
動により剥離し易くなった。剥離塵が基板上に付着する
と基板の不良を引き起こす原因となるため、基板のクリ
ーン度を維持確保し、かつ連続繰り返し動作を行うロボ
ットを用いていた。また、基板及びマスクの着脱操作を
真空中で行うための実用的なクリーンロボットはまだ開
発されておらず、更に大気中では、ロボットの動作によ
る発塵を抑制するために、高価なクリーン対策ロボット
を使用する必要もあった。このため、真空排気時間を短
くし、かつ、マスクに堆積した膜が大気中と真空との圧
力差により剥離することを抑制するには、大気中での作
業を短時間とし、真空中でも容易にクリーン動作が可能
な、回転及び前後移動の組み合わせによって基板及びマ
スクの着脱操作をする必要があった。2. Description of the Related Art Substrates in conventional vacuum film-forming processing equipment
There are roughly two methods of fixing the mask to the substrate holder. The first method is to use a carrier that can be moved in the atmosphere and under vacuum and a substrate holder that is firmly fixed to the carrier with screws. It was an expensive one used in a manufacturing apparatus for disks and the like. In the second method, only the substrate holder can be moved in the atmosphere and under vacuum, the carrier is placed in vacuum, and the substrate holder and carrier are fixed by magnetic force or by fitting mechanical unevenness on both sides. The method has been used in a manufacturing apparatus for compact discs and the like, and was relatively inexpensive. Whichever of these conventional methods is used, in order to take out the substrate after film formation and attach a new substrate to the substrate holder, it is necessary to take out the substrate holder and the mask into the atmosphere for each film formation. .
For this reason, the film deposited on the mask was easily peeled off due to pressure fluctuations in the atmosphere and vacuum. When peeling dust adheres to the substrate, it causes a defect in the substrate. Therefore, a robot that keeps the cleanliness of the substrate and continuously repeats the operation is used. In addition, a practical clean robot has not yet been developed for performing the attachment / detachment operation of the substrate and the mask in a vacuum. Furthermore, in the atmosphere, an expensive clean countermeasure robot is used to suppress dust generation due to the operation of the robot. I also had to use. Therefore, in order to shorten the vacuum evacuation time and to prevent the film deposited on the mask from peeling due to the pressure difference between the atmosphere and the vacuum, work in the atmosphere for a short time and easily in vacuum It was necessary to perform the attachment / detachment operation of the substrate and the mask by a combination of rotation and forward / backward movement capable of performing a clean operation.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このような回
転及び前後移動のみで構成された操作構造では微妙なず
れを補正することができず、機械的な位置調整を行った
当初は低発塵でかつ正常な動作であっても、搬送台や基
板ホルダーの位置が成膜時の熱や振動等で経時的に変化
し、微妙にずれてしまい、摺動部の摩擦による発塵や機
械的トラブルの原因となっていた。例えばコンパクトデ
ィスクの製造において従来用いられたスパッタ処理装置
では、基板及びマスクの着脱操作は、基板ホルダーに設
けた穴にマスクの突起部を勘合させるために、ロボット
は画像認識装置により基板ホルダーの位置を正確に認識
して位置決めを行う必要があった。However, with the operation structure constituted only by such rotation and forward / backward movement, it is not possible to correct a slight deviation, and at the beginning of mechanical position adjustment, there is low dust generation. Even during normal and normal operation, the positions of the carrier and substrate holder change over time due to heat and vibration during film formation, causing a slight shift, and dust and mechanical damage due to friction in the sliding parts. It was causing trouble. For example, in a sputtering processing device that has been conventionally used in the manufacture of compact discs, when the substrate and mask are attached and detached, the protrusions of the mask are fitted into the holes provided in the substrate holder. It was necessary to accurately recognize and position.
【０００４】図９に示す従来のスパッタ装置により、従
来の基板ホルダー保持装置を説明する。マスク搬送台１
を真空チャンバー２に密着させた状態でゲート弁３を開
けることで、真空チャンバー２内を真空に維持した状態
で、ゲート弁３に対向したマスク搬送台１を大気に曝し
た状態で、マスク搬送台１にリング状のマスクａ４と円
盤状のマスクｂ５を電磁石（図示せず）により吸着固定
し、更にマスクｂ５の突起部に基板６の中心の穴を勘合
させ、基板６を掛止させる。次にゲート弁を閉じた後、
基板６がセットされたマスク搬送台を後退、回転させ、
基板ホルダー７と対向させる。その後、マスク搬送台１
を前進させると共に搬送台９をマスク搬送台１に接する
よう前進させ、基板ホルダー７と両マスク４、５の突起
とを摺動して勘合させ、マスクと共に基板を基板ホルダ
ー上に保持する。この後、搬送台９を回転させ、基板６
のスパッタ成膜を行う。ここでマスク先端と基板ホルダ
ーの位置は、装置の運転開始時に機械的に調整した位置
であり、運転中は補正されない。これにより摺動部の摩
擦が増大し、剥離塵が成膜前の基板上に付着すると、製
品不良の原因となっていた。A conventional substrate holder holding device will be described with reference to the conventional sputtering device shown in FIG. Mask carrier 1
The mask transfer is performed by opening the gate valve 3 in a state where the mask is brought into close contact with the vacuum chamber 2 and keeping the inside of the vacuum chamber 2 at a vacuum and exposing the mask transfer table 1 facing the gate valve 3 to the atmosphere. A ring-shaped mask a4 and a disk-shaped mask b5 are attracted and fixed to the table 1 by an electromagnet (not shown), and the projection of the mask b5 is fitted into the central hole of the substrate 6 so that the substrate 6 is locked. Then after closing the gate valve,
The mask carrier on which the substrate 6 is set is retracted and rotated,
Face the substrate holder 7. Then, the mask carrier 1
And the carrier base 9 is moved forward so as to contact the mask carrier 1, and the substrate holder 7 and the projections of both masks 4 and 5 are slidably engaged with each other to hold the substrate together with the mask on the substrate holder. After that, the carrier 9 is rotated to move the substrate 6
The sputtering film formation is performed. Here, the positions of the mask tip and the substrate holder are positions mechanically adjusted at the start of operation of the apparatus, and are not corrected during operation. As a result, the friction of the sliding portion is increased, and if peeling dust adheres to the substrate before film formation, it causes a product defect.
【０００５】[0005]
【課題を解決するための手段】本発明者等は鋭意研究の
結果、基板面と垂直な方向にスライド移動可能な突き出
しバネを基板ホルダーの背面に設け、前記突き出しバネ
によって、搬送台を貫通する穴を介して基板ホルダーを
搬送台より浮かせることに着目し、上記課題を解決し
た。As a result of earnest studies, the inventors of the present invention have provided a protrusion spring slidably movable in a direction perpendicular to the substrate surface on the back surface of a substrate holder, and the protrusion spring penetrates a carrier. The above problem was solved by focusing on lifting the substrate holder from the carrier through the hole.
【０００６】すなわち本発明は、真空下で円盤状の基板
に成膜を行うにあたり、基板ホルダーと成膜領域を遮断
するマスクとにより該基板を挟み込んで固定するための
基板ホルダーを備え、基板ホルダーへ基板とマスクの着
脱操作を基板中心の軸方向の前後移動だけで行なうこと
よりなる基板ホルダー保持装置において、前記基板ホル
ダーは回転移動を行う搬送台に複数の引っ張りバネのみ
により掛止され、かつ、該搬送台の貫通孔を介して前記
基板ホルダーに密着し得る前後移動可能な突き出しバネ
を設けたことを特徴とする基板ホルダー保持装置を要旨
とするものである。That is, the present invention is provided with a substrate holder for sandwiching and fixing the substrate by a substrate holder and a mask for blocking a film formation region when forming a film on a disk-shaped substrate under vacuum. In a substrate holder holding device, which comprises attaching and detaching a substrate and a mask only by moving back and forth in the axial direction about the substrate center, the substrate holder is hooked on a carrier table which rotates by a plurality of tension springs, and The gist of a substrate holder holding device is characterized in that a projecting spring that can move back and forth so as to be in close contact with the substrate holder via a through hole of the carrier is provided.
【０００７】以下に本発明の実施態様の一例を示す。図
１は、本発明の基板ホルダー保持装置であり、図２から
図３は、図１の作動を順に示すものである。また図４
に、基板を装着したマスクとマスク搬送台を示す。本発
明で用いる突き出しバネ８は、細い棒状のものであり、
搬送台９の背面のバネ台８１上の、搬送台９を貫通する
穴９１と対向した位置にそれぞれ一端を保持されて配置
されている（図１）。このバネ台８１は基板６面と垂直
な方向にスライド移動できる。またこの突き出しバネ８
は、先端にバネの軸方向と垂直な方向に外力が加わった
時、加えられた荷重に応じて容易に曲がるように予め調
整してある。また基板ホルダー７は平行移動もしくは回
転移動を行う搬送台９に引っ張りバネ８２により掛止さ
れている。図４に示される基板６を装着したマスク４、
５を基板ホルダーに取り付けるには、マスクの中心と基
板ホルダーの中心座標を正確に合わせる必要があった
が、本発明ではスライド移動可能な突き出しバネ８を搬
送台の穴９１を介して基板ホルダー７に押し当てること
で、基板ホルダーを搬送台９から浮上させ、さらに、棒
状の突き出しバネ８の先端と複数の引っ張りバネ８２で
支えることで、基板ホルダーの位置を基板面と平行な面
で外部からの力に対して容易に変位可能な状態としてお
くことができる（図２）。更に、マスクと基板ホルダー
に若干の位置ずれが生じていても、前記マスクの先端を
基板ホルダーに押し込もうとした時にマスク先端に設け
たテーパー（図示せず）または曲率半径Ｒによって基板
ホルダーには基板面と平行な方向に変位しようとする力
が働く。このことにより容易にマスクの中心軸と基板ホ
ルダーの中心軸が一致し、スムーズにマスクが基板ホル
ダ−に勘合され、マスクと基板ホルダーにより基板が固
定される（図３）。An example of an embodiment of the present invention will be shown below. FIG. 1 shows a substrate holder holding device of the present invention, and FIGS. 2 to 3 show the operation of FIG. 1 in order. FIG. 4
The mask on which the substrate is mounted and the mask carrier are shown in FIG. The protrusion spring 8 used in the present invention has a thin rod shape,
One end is held and arranged on the spring base 81 on the back surface of the carrier 9 at a position facing the hole 91 penetrating the carrier 9 (FIG. 1). This spring base 81 can slide in a direction perpendicular to the surface of the substrate 6. Also this protruding spring 8
Is adjusted in advance so that when an external force is applied to the tip in a direction perpendicular to the axial direction of the spring, the tip easily bends according to the applied load. The substrate holder 7 is hooked by a tension spring 82 on the carrier table 9 that moves in parallel or rotates. A mask 4 having the substrate 6 shown in FIG.
In order to attach 5 to the substrate holder, it was necessary to accurately align the center of the mask with the center of the substrate holder. In the present invention, however, the slidable protrusion spring 8 is used to mount the substrate holder 7 through the hole 91 of the carrier. The substrate holder is levitated from the carrier table 9 by pressing it against and is further supported by the tip of the stick-shaped protrusion spring 8 and the plurality of tension springs 82, so that the position of the substrate holder can be adjusted from the outside in a plane parallel to the substrate surface. It can be easily displaced by the force of (Fig. 2). Further, even if there is a slight misalignment between the mask and the substrate holder, when the tip of the mask is pushed into the substrate holder, the taper (not shown) or the radius of curvature R provided at the tip of the mask causes the substrate holder to move. Has a force to displace in a direction parallel to the substrate surface. As a result, the central axis of the mask and the central axis of the substrate holder are easily aligned, the mask is smoothly fitted into the substrate holder, and the substrate is fixed by the mask and the substrate holder (FIG. 3).
【０００８】ここで摺動部である搬送台、マスク、基板
ホルダーは、表面粗さRa＝0.2 〜0.4 であることが望ま
しい。また材質は、例えばSUS304、SUS316等が例示され
る。また、例えば基板がφ＝86 mm の場合、搬送台の穴
の内径φ＝10〜12mm、穴の個数＝２〜６個、基板中心軸
から穴までの距離ｒ＝25〜30mm、搬送台の厚さｄ＝８〜
10mmが望ましく、突き出しバネは先端のＲ＝３〜４mm、
長さＬ＝50〜70mmが望ましい。Here, it is desirable that the carrier, the mask, and the substrate holder, which are the sliding parts, have a surface roughness Ra = 0.2 to 0.4. Examples of the material include SUS304 and SUS316. For example, when the substrate is φ = 86 mm, the inner diameter of the hole of the carrier is φ = 10 to 12 mm, the number of holes is 2 to 6, the distance r from the center axis of the substrate to the hole is r = 25 to 30 mm, Thickness d = 8 ~
10mm is preferable, and the protrusion spring has a tip radius R = 3-4mm,
Length L = 50-70 mm is desirable.
【０００９】また、摺動面に自己潤滑性を有する樹脂を
用いると、真空での摩擦をさらに軽減し、接触面の摺動
をスムースに行うことができる。この自己潤滑性樹脂に
は、例えばベスペルSP-3（デュポン社製）、ナイロンMC
-801（日本プリペコン社製）、テフロン（ＧＥ社製）、
ナイロン６（デュポン社製）などが例示される。Further, when a resin having a self-lubricating property is used for the sliding surface, it is possible to further reduce the friction in a vacuum and to smoothly slide the contact surface. This self-lubricating resin includes, for example, Vespel SP-3 (Dupont), nylon MC
-801 (manufactured by Japan Prepecon), Teflon (manufactured by GE),
Nylon 6 (manufactured by DuPont) is exemplified.
【００１０】[0010]
【作用】本発明では、外部からの力に対して基板ホルダ
ーの位置を基板面と平行な面で容易に変位可能な状態と
できるため、マスクと基板ホルダーに若干の位置ずれが
生じていても、前記マスクの先端を基板ホルダーに押し
込もうとすると基板ホルダーは容易に変位し、マスクの
中心軸と基板ホルダーの中心軸が一致する。このことに
より、基板ホルダーへ基板及びマスクの着脱を基板の中
心軸方向の前後移動のみで行う装置において、装置使用
による経時変化により生じた基板ホルダーの中心とマス
クの中心とのずれを吸収して、スムースに勘合すること
ができる。According to the present invention, since the position of the substrate holder can be easily displaced by a surface parallel to the substrate surface against an external force, even if the mask and the substrate holder are slightly displaced. When the tip of the mask is pushed into the substrate holder, the substrate holder is easily displaced, and the central axis of the mask and the central axis of the substrate holder coincide with each other. As a result, in a device in which the substrate and the mask are attached to and detached from the substrate holder only by moving the substrate back and forth in the direction of the central axis, the deviation between the center of the substrate holder and the center of the mask caused by the change over time due to the use of the device is absorbed. , Can fit smoothly.
【００１１】[0011]
【実施例】次に本発明の実施例、比較例について述べ
る。 実施例１ 図１〜４に示した本発明の基板ホルダー保持装置を用い
たスパッタ装置の構造を図５に示す。摺動部である搬送
台９、マスクａ４・ｂ５、基板ホルダー７、突き出しバ
ネ８は、表面粗さ 0.3のSUS304を用いた。搬送台９は穴
９１の内径φ＝10mm、穴の個数＝３個、基板中心軸から
穴までの距離ｒ＝25mm、厚さｄ＝４mmとした。マスクａ
４は突起の長さＬ＝1.8 mm、Ｒ＝0.5 mm、外周φ＝102
mm、内周φ＝84mm、マスクｂ５の突起の長さＬ＝4.6 m
m、Ｒ＝４mm、φ＝15mmとした。基板ホルダー７はマス
クａ４との勘合部のＲ＝５mm、マスクｂ５との勘合部の
Ｒ＝１mmとした。突き出しバネは先端のＲ＝２mm、長さ
Ｌ＝50mmとした。また、基板ホルダーとマスクとの摺動
部の下方25cmの位置にφ＝４″の鏡面研磨したシリコン
ウエハーを置いた。マスク搬送台１をチャンバー２に密
着させた状態でゲート弁３を開けることでチャンバー内
を１mTorr にしたまま、ゲート弁に対向したマスク搬送
台を大気に曝した状態でマスク搬送台にリング状のマス
クａ４と円盤状のマスクｂ５を電磁石（図示せず）によ
り吸着固定し、さらにマスクｂの突起部にφ86mm基板６
の中心の穴を勘合させて、マスク搬送台１に基板６を掛
止した（図４）。EXAMPLES Next, examples and comparative examples of the present invention will be described. Example 1 FIG. 5 shows the structure of a sputtering apparatus using the substrate holder holding apparatus of the present invention shown in FIGS. As the carrier table 9, the masks a4 and b5, the substrate holder 7, and the protrusion spring 8 which are sliding parts, SUS304 having a surface roughness of 0.3 was used. The carrier table 9 had an inner diameter φ of the hole 91 = 10 mm, the number of holes = 3, a distance r from the substrate central axis to the hole r = 25 mm, and a thickness d = 4 mm. Mask a
4 is the protrusion length L = 1.8 mm, R = 0.5 mm, outer circumference φ = 102
mm, inner circumference φ = 84 mm, length of protrusion of mask b5 L = 4.6 m
m, R = 4 mm, and φ = 15 mm. The substrate holder 7 has R = 5 mm at the fitting portion with the mask a4 and R = 1 mm at the fitting portion with the mask b5. The protrusion spring had a tip R = 2 mm and a length L = 50 mm. Further, a φ = 4 ″ mirror-polished silicon wafer was placed at a position 25 cm below the sliding portion between the substrate holder and the mask. The gate valve 3 was opened while the mask carrier 1 was in close contact with the chamber 2. With the inside of the chamber kept at 1 mTorr, the ring-shaped mask a4 and the disc-shaped mask b5 are attracted and fixed to the mask carrier by an electromagnet (not shown) with the mask carrier facing the gate valve exposed to the atmosphere. In addition, φ86mm substrate 6 on the protrusion of mask b
The substrate 6 was hooked on the mask carrier 1 by fitting the center hole of the substrate (FIG. 4).
【００１２】ゲート弁を閉じ、マスク搬送台を後退させ
た後、基板ホルダーと対向する位置までマスク搬送台を
回転させ、さらにマスク搬送台を前進させた（図１）。
突き出しバネ８を搬送台の穴９１から貫通させ、引っ張
りバネ８２で搬送台９と掛止されている基板ホルダー７
に密着させ、搬送台から基板ホルダーを浮き上がらせた
（図２）。さらにマスク搬送台を基板ホルダーに接近さ
せ、マスクｂの先端が基板ホルダーの中心に設けられた
穴に勘合するまで、バネ台８１のスライドにより押し込
んだ。この時、基板ホルダーが突き出しバネにより搬送
台から浮き上がった状態では、基板ホルダーとマスク先
端とに位置ずれがあっても、マスクｂの挿入に伴い基板
ホルダーがマスクｂから受ける横方向の力により、基板
ホルダーを支える突き出しバネに弾性曲げ変形が生じる
ため、基板ホルダーはマスクｂが受け入れ可能な位置ま
で容易に移動することができた。更に、マスク搬送台を
押し込み、マスクａ及びマスクｂを確実に基板ホルダー
に勘合した。マスク、基板と基板ホルダーを基板ホルダ
ーの内部に設けられた永久磁石により固定した。マスク
搬送台の電磁石の電源を切り、マスク搬送台をスライド
後退させた。同時に突き出しバネをスライド後退させて
搬送台の穴より抜き出し、搬送台の回転の障害にならな
い位置まで退避させた（図３）。以上の作動を1100回繰
り返した。基板ホルダーとマスクとの摺動部の下に置い
ていた鏡面シリコンウエハー上に落ちた塵に集光ランプ
を当てて目視観察し、発塵量を評価した。1100回繰り返
し作動時における発塵量を示したグラフを図８に示す。After closing the gate valve and retracting the mask carrier, the mask carrier was rotated to a position facing the substrate holder, and the mask carrier was further advanced (FIG. 1).
The substrate holder 7 in which the protrusion spring 8 penetrates through the hole 91 of the carrier and is hooked to the carrier 9 by the tension spring 82.
The substrate holder was lifted from the carrier (Fig. 2). Further, the mask carrier was moved closer to the substrate holder and pushed by sliding the spring base 81 until the tip of the mask b was fitted into the hole provided in the center of the substrate holder. At this time, in the state where the substrate holder is lifted from the carrier by the protrusion spring, even if the substrate holder and the mask tip are misaligned, the lateral force that the substrate holder receives from the mask b as the mask b is inserted causes Since the protrusion spring supporting the substrate holder is elastically bent and deformed, the substrate holder could be easily moved to a position where the mask b could be received. Further, the mask carrier was pushed in, and the mask a and the mask b were securely fitted into the substrate holder. The mask, the substrate and the substrate holder were fixed by a permanent magnet provided inside the substrate holder. The power of the electromagnet of the mask carrier was turned off, and the mask carrier was slid back. At the same time, the ejection spring was slid back and pulled out from the hole of the carrier, and was retracted to a position where it did not hinder the rotation of the carrier (Fig. 3). The above operation was repeated 1100 times. The amount of dust generated was evaluated by visually observing the dust falling on the mirror surface silicon wafer placed under the sliding portion between the substrate holder and the mask with a condenser lamp. Fig. 8 shows a graph showing the amount of dust generated after 1100 repeated operations.
【００１３】実施例２ 図６に示すように、基板ホルダー７の、搬送台・マスク
・突き出しバネ先端との接触面の材質を自己潤滑性樹脂
７１であるベスペルSP-3（デュポン社製）とした以外
は、実施例１と同様に行った。発塵量を示したグラフを
図８に併記する。Embodiment 2 As shown in FIG. 6, the material of the contact surface of the substrate holder 7 with the carrier, the mask and the tip of the protruding spring is Vespel SP-3 (manufactured by DuPont) which is self-lubricating resin 71. The same procedure as in Example 1 was carried out except that the above was carried out. A graph showing the dust generation amount is also shown in FIG.
【００１４】実施例３ 図７に示すように、基板ホルダー７の、マスクａ外径と
の接触面の曲率半径を５mmとし、さらに基板ホルダー全
体の材質を自己潤滑性樹脂７１であるナイロンMC-801
（日本プリペコン社製）とした以外は、実施例１と同様
に行った。発塵量を示したグラフを図８に併記する。Embodiment 3 As shown in FIG. 7, the curvature radius of the contact surface of the substrate holder 7 with the outer diameter of the mask a is 5 mm, and the material of the entire substrate holder is nylon MC- which is self-lubricating resin 71. 801
The same procedure as in Example 1 was carried out except that it was manufactured by Nippon Pre-Pecon Co. A graph showing the dust generation amount is also shown in FIG.
【００１５】比較例 比較のために、図９に示す従来の基板ホルダー保持装置
を用いた以外は、実施例１と同様に行った。発塵量を示
したグラフを図８に併記する。Comparative Example For comparison, the same procedure as in Example 1 was performed except that the conventional substrate holder holding device shown in FIG. 9 was used. A graph showing the dust generation amount is also shown in FIG.
【００１６】図８において、○印は実施例１（SUS30
4）、▽印は実施例２（ベスペルSP-3）、△印は実施例
３（ナイロンMC-801）、●印は比較例（SUS304・従来装
置）の発塵量を示す。図８から、本発明の基板ホルダー
保持装置によって、基板ホルダーとマスクとの摺動によ
る発塵量が低減し、自己潤滑性樹脂を使用すると発塵量
が更に減少することがわかる。なお、本実施例ではスパ
ッタ装置における基板ホルダー保持装置について述べた
が、本発明はスパッタ装置に限るものではないことは言
うまでもない。In FIG. 8, the mark ○ indicates the first embodiment (SUS30
4), ∇ indicates the amount of dust generated in Example 2 (Vespel SP-3), Δ indicates Example 3 (nylon MC-801), and ● indicates the amount of dust generated in Comparative Example (SUS304 / conventional device). From FIG. 8, it can be seen that the substrate holder holding device of the present invention reduces the amount of dust generated by the sliding of the substrate holder and the mask, and further reduces the amount of dust generated when the self-lubricating resin is used. Although the substrate holder holding device in the sputtering apparatus has been described in the present embodiment, it goes without saying that the present invention is not limited to the sputtering apparatus.
【００１７】[0017]
【発明の効果】本発明によれば、真空中で基板ホルダー
保持装置を繰り返し作動しても容易に位置ずれが補正さ
れ、かつ発塵が少ないため、成膜処理前の基板に塵が付
着することによる製品不良が軽減され、製品の信頼性が
向上する。また、成膜工程における真空排気時間を短縮
することができる。さらに、本発明による基板ホルダー
保持装置は比較的安価なスパッタ装置に取り付けること
ができるため、従来発塵を防ぐために精密で高価な製造
装置を用いていた光磁気ディスク等の製造工程にも使用
することができ、製造設備のコスト低減が可能となる。According to the present invention, even if the substrate holder holding device is repeatedly operated in a vacuum, the positional deviation is easily corrected, and the amount of dust generated is small, so that the dust adheres to the substrate before the film forming process. As a result, defective products are reduced and product reliability is improved. Further, the vacuum exhaust time in the film forming process can be shortened. Further, since the substrate holder holding device according to the present invention can be attached to a relatively inexpensive sputtering device, it is also used in a manufacturing process of a magneto-optical disk or the like which has conventionally used a precise and expensive manufacturing device to prevent dust generation. Therefore, the cost of manufacturing equipment can be reduced.
【図１】本発明における基板ホルダー保持装置の実施例
を示す断面模式図。FIG. 1 is a schematic sectional view showing an embodiment of a substrate holder holding device according to the present invention.
【図２】図１に示す基板ホルダー保持装置の図１に続く
作動過程を示す断面模式図。FIG. 2 is a schematic sectional view showing an operation process of the substrate holder holding device shown in FIG. 1 following FIG.
【図３】図１に示す基板ホルダー保持装置の図２に続く
作動過程を示す断面模式図。3 is a schematic sectional view showing an operation process of the substrate holder holding device shown in FIG. 1 following FIG. 2;
【図４】本実施例に用いる基板を装着したマスクとマス
ク搬送台の断面模式図。FIG. 4 is a schematic sectional view of a mask on which a substrate used in this embodiment is mounted and a mask carrier.
【図５】本発明における基板ホルダー保持装置を用いた
スパッタ成膜装置の断面模式図。FIG. 5 is a schematic sectional view of a sputtering film forming apparatus using the substrate holder holding device according to the present invention.
【図６】本発明における自己潤滑性樹脂を用いた基板ホ
ルダーの一実施例を示す断面模式図。FIG. 6 is a schematic sectional view showing an embodiment of a substrate holder using a self-lubricating resin according to the present invention.
【図７】本発明における自己潤滑性樹脂を用いた基板ホ
ルダーの、別の実施例を示す断面模式図。FIG. 7 is a schematic cross-sectional view showing another embodiment of the substrate holder using the self-lubricating resin in the present invention.
【図８】実施例及び比較例における基板ホルダー保持装
置の、摺動部材質による発塵量の比較を示すグラフ。FIG. 8 is a graph showing a comparison of the amount of dust generated depending on the sliding member quality of the substrate holder holding device in the example and the comparative example.
【図９】比較例における従来の基板ホルダー保持装置を
用いたスパッタ成膜装置の断面模式図。FIG. 9 is a schematic sectional view of a sputtering film forming apparatus using a conventional substrate holder holding device in a comparative example.
１ マスク搬送台 ２ 真空チャンバー ３ ゲート弁 ４ マスクａ ５ マスクｂ ６ 基板 ７ 基板ホルダー ７１ 自己潤滑性樹脂 ８ 突き出しバネ ８１ バネ台 ８２ 引っ張りバネ ９ 搬送台 ９１ 搬送台の穴 1 Mask Transfer Platform 2 Vacuum Chamber 3 Gate Valve 4 Mask a 5 Mask b 6 Substrate 7 Substrate Holder 71 Self-Lubricating Resin 8 Ejection Spring 81 Spring Base 82 Tension Spring 9 Transport Base 91 Transport Base Hole
───────────────────────────────────────────────────── フロントページの続き (72)発明者 江島 正毅 群馬県安中市磯部２丁目13番１号 信越化 学工業株式会社精密機能材料研究所内 (72)発明者 吉田 郁男 群馬県安中市磯部２丁目13番１号 信越化 学工業株式会社精密機能材料研究所内 (72)発明者 清水 佳昌 群馬県安中市磯部２丁目13番１号 信越化 学工業株式会社精密機能材料研究所内 (72)発明者 小林 利美 群馬県安中市磯部２丁目13番１号 信越化 学工業株式会社精密機能材料研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masaaki Ejima, Masaki Ejima 2-13-1, Isobe, Annaka City, Gunma Prefecture Shin-Etsu Chemical Co., Ltd., Precision Materials Research Laboratory (72) Ikuo Yoshida Isobe, Annaka City, Gunma Prefecture 2-13-1 Shinetsu Kagaku Kogyo Co., Ltd. Precision Materials Research Laboratory (72) Inventor Yoshimasa Shimizu 2-13-1 Isobe, Annaka-shi, Gunma Shin-Etsu Kagaku Kogyo Co. Ltd. Precision Materials Research Lab (72) Inventor Tomi Kobayashi 2-13-1, Isobe, Annaka-shi, Gunma Shin-Etsu Chemical Co., Ltd. Precision Materials Research Laboratory
Claims (1)
たり、基板ホルダーと成膜領域を遮断するマスクとによ
り該基板を挟み込んで固定するための基板ホルダーを備
え、基板ホルダーへ基板とマスクの着脱操作を基板中心
の軸方向の前後移動だけで行なうことよりなる基板ホル
ダー保持装置において、前記基板ホルダーは回転移動を
行う搬送台に複数の引っ張りバネのみにより掛止され、
かつ、該搬送台の貫通孔を介して前記基板ホルダーに密
着し得る前後移動可能な突き出しバネを設けたことを特
徴とする基板ホルダー保持装置。1. When forming a film on a disk-shaped substrate under vacuum, a substrate holder is provided for sandwiching and fixing the substrate with a substrate holder and a mask for blocking a film formation region. In a substrate holder holding device, which comprises performing a mask attaching / detaching operation only by an axial forward / backward movement of a substrate center, the substrate holder is hooked on a rotary carriage by a plurality of tension springs only.
Further, the substrate holder holding device is provided with a projecting spring that can move back and forth so as to be in close contact with the substrate holder through a through hole of the carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9841995A JPH08297869A (en) | 1995-04-24 | 1995-04-24 | Substrate holder holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9841995A JPH08297869A (en) | 1995-04-24 | 1995-04-24 | Substrate holder holding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08297869A true JPH08297869A (en) | 1996-11-12 |
Family
ID=14219309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9841995A Pending JPH08297869A (en) | 1995-04-24 | 1995-04-24 | Substrate holder holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08297869A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007051762A (en) * | 2005-07-22 | 2007-03-01 | Yokogawa Electric Corp | Connecting shaft and angle sensor using the same |
| US7695596B2 (en) | 2002-05-31 | 2010-04-13 | Samsung Mobile Display Co., Ltd. | Device for fixing substrate for thin film sputter and method of fixing substrate using the same |
| JP4763040B2 (en) * | 2006-03-28 | 2011-08-31 | 東北精機工業株式会社 | Sputtering apparatus and thin film forming method |
-
1995
- 1995-04-24 JP JP9841995A patent/JPH08297869A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7695596B2 (en) | 2002-05-31 | 2010-04-13 | Samsung Mobile Display Co., Ltd. | Device for fixing substrate for thin film sputter and method of fixing substrate using the same |
| JP2007051762A (en) * | 2005-07-22 | 2007-03-01 | Yokogawa Electric Corp | Connecting shaft and angle sensor using the same |
| JP4763040B2 (en) * | 2006-03-28 | 2011-08-31 | 東北精機工業株式会社 | Sputtering apparatus and thin film forming method |
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