JPH08279592A - Assembly structure of switching power source rectifier - Google Patents
Assembly structure of switching power source rectifierInfo
- Publication number
- JPH08279592A JPH08279592A JP8095695A JP8095695A JPH08279592A JP H08279592 A JPH08279592 A JP H08279592A JP 8095695 A JP8095695 A JP 8095695A JP 8095695 A JP8095695 A JP 8095695A JP H08279592 A JPH08279592 A JP H08279592A
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- base printed
- switching power
- power supply
- assembly structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Dc-Dc Converters (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、大電流容量のスイッチ
ング電源に組み込んで使用する整流部（ダイオードモジ
ュール）の組立構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling structure of a rectifying section (diode module) which is used by incorporating it into a switching power supply having a large current capacity.
【０００２】[0002]
【従来の技術】周知のように、スイッチング電源は入力
側の整流部，ＩＧＢＴなどのスイッチング素子，トラン
ス，およびトランスの二次側（出力側）に接続した整流
部，平滑回路などから構成されている。図３はかかるス
イッチング電源の二次側回路を示すものであり、図にお
いて、１は整流部（点線で囲まれた部分）、２はトラン
ス、３は平滑用チョークコイル，４は平滑用コンデンサ
であり、整流部１はダイオード５，６、ダイオード５，
６に並列接続したノイズ低減用のコンデンサ７，８、お
よびダイオード５，６と直列に介装したノイズ低減用の
ビーズコア９などから構成されている。2. Description of the Related Art As is well known, a switching power supply is composed of an input side rectifying section, a switching element such as an IGBT, a transformer, a rectifying section connected to the secondary side (output side) of the transformer, a smoothing circuit and the like. There is. FIG. 3 shows a secondary side circuit of such a switching power supply. In the figure, 1 is a rectifying unit (a part surrounded by a dotted line), 2 is a transformer, 3 is a smoothing choke coil, and 4 is a smoothing capacitor. Yes, the rectification unit 1 includes diodes 5, 6, diodes 5,
6, noise reduction capacitors 7 and 8 connected in parallel, and a noise reduction bead core 9 interposed in series with the diodes 5 and 6 and the like.
【０００３】また、大容量（例えば電流容量１００Ａク
ラス）のパワー用スイッチング電源では、前記整流部１
は複数個のダイオードを並列に接続して組み込んだダイ
オードモジュールとして構成するとともに、ダイオード
は通電に伴い大きな損失が生じることから、その発生熱
を除熱するためにダイオードモジュールを放熱体（例え
ば放熱フィン）と組合わせて組立て、さらに大電流を流
すためにダイオードモジュールをブスバーに直接配線し
て使用するようにしている。In a large capacity (eg, current capacity 100 A class) power switching power supply, the rectifying unit 1 is used.
Is configured as a diode module in which a plurality of diodes are connected in parallel, and a large loss occurs when the diode is energized. ), The diode module is directly wired to the bus bar and used in order to carry a larger current.
【０００４】ここで、従来のパワー用スイッチング電源
に採用するダイオードモジュールの組立構造例を図４に
示す。図において、１０はアルミ製放熱体であり、該放
熱体１０の上に絶縁シート１１を介してブスバー（銅の
平板）１２，およびダイオード５，６をそのカソード電
極面を下に向けて重ね合わせ、ねじ１３で放熱体１０に
固定する。また、リード付きコンデンサ７，８は、リー
ド配線長を短くして配線インダクタンスをできるだけ低
めるようにダイオード５，６のパッケージ上面を跨ぐよ
うに配置してダイオードのアノード，カソード電極間に
半田付けしており、さらにダイオード５，６のアノード
電極に接続して引出したリード線１４の途中にビーズコ
ア９を挿入した上で、該リード線１４の先端をダイオー
ドの上方に配したブスバー１５，１６に半田付けしてい
る。Here, FIG. 4 shows an example of the assembly structure of a diode module used in a conventional power switching power supply. In the figure, 10 is a heat radiator made of aluminum, and a bus bar (copper flat plate) 12 and diodes 5, 6 are superposed on the heat radiator 10 with an insulating sheet 11 in such a manner that the cathode electrode surface thereof faces downward. , The screw 13 is fixed to the radiator 10. The capacitors 7 and 8 with leads are arranged so as to straddle the upper surfaces of the packages of the diodes 5 and 6 so as to shorten the lead wiring length and reduce the wiring inductance as much as possible, and are soldered between the anode and cathode electrodes of the diodes. In addition, the bead core 9 is inserted in the middle of the lead wire 14 connected to the anode electrodes of the diodes 5 and 6 and then the tip of the lead wire 14 is soldered to the bus bars 15 and 16 arranged above the diodes. are doing.
【０００５】[0005]
【発明が解決しようとする課題】ところで先記した従来
のダイオードモジュールの組立構造では次記のような問
題点がある。すなわち、図４において、ダイオード５，
６の損失による発生熱は、パッケージ表面からの放熱分
もあるが、大半はアノード，カソード電極から外部の金
属部分に伝熱する。この場合に、カソード電極面側から
の熱は放熱体１０との間の伝熱経路にブスバー１２が介
在しているために、熱の一部はこのブスバー１２に伝熱
する。一方、アノード電極からの熱はリード線１４を伝
わってブスバー１５，１６に伝熱し、その途中でビーズ
コア９を局部的に加熱する。このために、 １）ブスバー１２，１５，１６の先方に接続されている
トランス２，チョークコイル３（図２参照）がダイオー
ド５，６からの伝熱する熱の影響を受けて温度上昇が大
きくなる。However, the conventional diode module assembly structure described above has the following problems. That is, in FIG.
Most of the heat generated by the loss of 6 is transferred from the anode and cathode electrodes to the external metal part, although there is also the amount of heat released from the package surface. In this case, the heat from the cathode electrode surface side is intervened in the heat transfer path with the radiator 10 by the bus bar 12, so that part of the heat is transferred to the bus bar 12. On the other hand, the heat from the anode electrode is transmitted to the bus bars 15 and 16 through the lead wire 14, and locally heats the bead core 9 in the middle thereof. Therefore, 1) the transformer 2 and the choke coil 3 (see FIG. 2) connected to the end of the bus bars 12, 15, and 16 are affected by the heat transferred from the diodes 5 and 6, and the temperature rises significantly. Become.
【０００６】２）スイッチング電源の起動／停止，ある
いは大きな負荷変動に伴ってダイオード５，６の発熱が
急激に変化するために、リード線１４とブスバー１５，
１６との半田付け部で半田剥がれが生じたり、またリー
ド線１４に挿入したビーズコア（フェライト製）に熱的
ストレスが加わって割れたりするトラブルの生じること
がある。2) Since the heat generation of the diodes 5 and 6 drastically changes with the start / stop of the switching power supply or a large load change, the lead wire 14 and the bus bar 15,
There is a problem that solder peeling may occur at the soldered portion with 16, or the bead core (made of ferrite) inserted into the lead wire 14 may be cracked due to thermal stress.
【０００７】３）特に、リード付きコンデンサ７，８は
配線インダクタンスを低く抑えるようにダイオード５，
６に殆ど密着させて半田付けを行う必要があるために、
組立時の作業性がすこぶる悪くなる。本発明は上記の点
にかんがみなされたものであり、その目的は前記課題を
解決して、整流素子の放熱性，並びに組立性に優れた効
果を発揮するスイッチング電源用整流部の組立構造を提
供することにある。3) In particular, the capacitors 7 and 8 with leads have diodes 5 and 5 to keep the wiring inductance low.
Since it is necessary to closely attach it to 6 and perform soldering,
Workability at the time of assembly becomes extremely poor. The present invention has been made in view of the above points, and an object thereof is to solve the above problems and provide an assembly structure of a rectification unit for a switching power supply, which exhibits excellent effects of heat dissipation and assembling of a rectification element. To do.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の組立構造においては、表面実装型の整流素
子，ノイズ低減用のコンデンサ、およびブスバーに接続
する外部端子をヒートシンクとしての金属ベースプリン
ト配線板上に配列してその導体パターンに半田付け実装
し、かつ該金属ベースプリント配線板に放熱体を直接取
付けて構成するもるとする。In order to achieve the above object, in the assembly structure of the present invention, a surface mount type rectifying element, a noise reducing capacitor, and a metal as a heat sink for external terminals connected to the bus bar. It is assumed that the heat sink is arranged on the base printed wiring board, soldered and mounted on the conductor pattern, and the heat radiator is directly attached to the metal base printed wiring board.
【０００９】また、前記構成においては、整流素子の相
互接続リードを兼ねた外部接続端子を自立形に成形した
端子板で構成し、かつ端子板の脚部を金属ベースプリン
ト配線板に半田接合するのがよく、さらに該外部接続端
子の端子板に対して個々の整流素子と対応する箇所から
上方に起立してブスバーと接続し合う突起状のリード片
部を形成して、ここにノイズ低減用ビーズコアを挿入セ
ットした構成もある。Further, in the above-mentioned structure, the external connection terminal which also serves as the interconnection lead of the rectifying element is composed of a self-standing terminal plate, and the legs of the terminal plate are soldered to the metal base printed wiring board. It is also preferable to form a projecting lead piece that stands up from the position corresponding to each rectifying element to the terminal plate of the external connection terminal and connects with the bus bar, and is used for noise reduction here. There is also a configuration in which a bead core is inserted and set.
【００１０】[0010]
【作用】前記の構成において、金属ベースプリント配線
板はアルミニウムなどの金属基板をベースとし、その上
に薄い絶縁層を介して導体パターンが形成されたもので
あり、その導体パターン上に表面実装型の整流素子（ダ
イオード），コンデンサチップ、および外部端子の脚部
が半田付けされる。In the above structure, the metal base printed wiring board is based on a metal substrate such as aluminum, on which a conductor pattern is formed via a thin insulating layer, and the surface mounting type is formed on the conductor pattern. The rectifying element (diode), the capacitor chip, and the legs of the external terminals are soldered.
【００１１】したがって、この伝熱性の高い金属ベース
プリント配線板がヒートシンクとしての機能し、整流素
子の発生熱，並びに整流素子から外部端子に伝熱した熱
がブスバーへ伝熱する手前で金属ベースプリント配線板
を通じて放熱体に効率よく伝熱しここから系外に放熱さ
れるようになる。これにより、整流部の発生熱がブスバ
ーを介してスイッチング電源のトランス，チョークコイ
ルなどに伝わり難くなる。Therefore, the metal base printed wiring board having a high heat transfer function as a heat sink, and the heat generated by the rectifying element and the heat transferred from the rectifying element to the external terminal are transferred to the bus bar before the metal base print. The heat is efficiently transferred to the radiator through the wiring board, and is radiated to the outside of the system from here. This makes it difficult for the heat generated by the rectifying unit to be transferred to the transformer, choke coil, etc. of the switching power supply via the bus bar.
【００１２】また、金属ベースプリント配線板の導体パ
ターンは高周波電流を流した場合のインダクタンス成分
がリード線などに比べて格段に小さく、したがって整流
素子に並列接続するノイズ低減用のコンデンサは整流素
子から多少離れた位置に半田付けしても配線インダクタ
ンスの影響は小さく、かつ整流素子とコンデンサの間を
離して配置することにより、半田付けを含む部品の組立
作業が容易になるとともに、外部端子の配線板を自立形
に成形しておくことで、押え治具などを用いずにリフロ
ー半田付けなどが行えて組立作業性が大幅に改善され
る。Further, the conductor pattern of the metal-based printed wiring board has a remarkably smaller inductance component when a high-frequency current is passed than that of a lead wire or the like. Therefore, a noise reducing capacitor connected in parallel with the rectifying element is connected to the rectifying element. The effect of wiring inductance is small even if it is soldered at a slightly distant position, and by arranging the rectifying element and the capacitor away from each other, the assembly work of parts including soldering becomes easy and the wiring of external terminals By forming the plate in a self-supporting form, reflow soldering etc. can be performed without using a holding jig and the assembly workability is greatly improved.
【００１３】さらに、前記の端子板自身が伝熱性の高い
金属ベースプリント配線板に半田付けされているので、
この端子板にビーズコアを取付けておけば、スイッチン
グ電源の起動／停止，大きな負荷変動の際にビーズコア
に加わる熱的ストレスが小さくなってクラック割れなど
のトラブルが安全に回避される。Furthermore, since the terminal board itself is soldered to the metal base printed wiring board having high heat conductivity,
If a bead core is attached to this terminal board, the thermal stress applied to the bead core during start / stop of the switching power supply and large load fluctuations will be small, and problems such as crack cracks can be safely avoided.
【００１４】[0014]
【実施例】以下、本発明実施例の構成を図１（ａ),
（ｂ）および図２に基づいて説明する。なお、実施例の
図中で図３，図４に対応する同一部品には同じ符号が付
してある。まず、図１（ａ),（ｂ）において、１７は金
属ベースプリント配線板であり、その上面に形成されて
いる導体パターン（図示せず）にはダイオード（整流素
子）とノイズ低減用コンデンサを対にして、表面実装型
のダイオード５，６およびコンデンサ７，８がそれぞれ
４個ずつグループ分けして半田付け実装されている。ま
た、金属ベースプリント配線板１７の一端には各ダイオ
ード５，６のカソード電極に共通な外部端子１８が、さ
らに４個ずつに分けて配置したダイオード５，６の周囲
をそれぞれ取り囲むようにアノード側の外部端子となる
２枚の端子板１９が半田付け実装されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of an embodiment of the present invention is shown in FIG.
A description will be given based on (b) and FIG. In the drawings of the embodiment, the same parts corresponding to those in FIGS. 3 and 4 are designated by the same reference numerals. First, in FIGS. 1 (a) and 1 (b), 17 is a metal base printed wiring board, and a conductor pattern (not shown) formed on the upper surface thereof is provided with a diode (rectifying element) and a noise reducing capacitor. Surface-mount type diodes 5 and 6 and capacitors 7 and 8 are grouped into groups of four and soldered in pairs. In addition, an external terminal 18 common to the cathode electrodes of the diodes 5 and 6 is provided at one end of the metal base printed wiring board 17, and the anode side is provided so as to surround the respective diodes 5 and 6 which are arranged in groups of four. Two terminal plates 19 which are external terminals are soldered and mounted.
【００１５】この端子板１９は銅板をＵ字形に成形した
もので、金属ベースプリント配線板１７の上に自立させ
た状態でその下縁側に形成したＬ字形の脚部１９ａを導
体パターンに重ね合わせて半田付けされており、さらに
個々のダイオード５，６の配置に対応して端子板１９の
上縁から上方に突出し形成したリード片部１９ｂにはビ
ーズコア９を１個ずつ挿入セットし、これらで図２に示
した整流部１（ダイオードモジュール）の回路を構成し
ている。なお、端子板１９を５，６を取り巻くようにＵ
字形に成形しておくことで配線スペースも少なくて済
み、金属ベースプリント配線板１７の外形サイズが小形
化できる。The terminal plate 19 is a copper plate formed in a U shape, and the L-shaped leg portion 19a formed on the lower edge side of the metal base printed wiring board 17 in a self-supporting state is superposed on the conductor pattern. The bead cores 9 are inserted and set one by one in the lead piece portion 19b formed by projecting upward from the upper edge of the terminal plate 19 in correspondence with the arrangement of the individual diodes 5 and 6. The circuit of the rectification unit 1 (diode module) shown in FIG. 2 is configured. In addition, the terminal board 19 is surrounded by U
By forming it in a V shape, the wiring space can be reduced and the outer size of the metal base printed wiring board 17 can be reduced.
【００１６】そして、金属ベースプリント配線板１７の
金属ベース側に放熱体１０を伝熱的に直接取付けるとと
もに、前記した外部端子１８にブスバー１２をねじ締結
し、さらに２枚の端子板１９から上方に突出したリード
片部１９ｂにはそれぞれブスバー１５，１６を半田付け
し、これで図２で示すようにスイッチング電源のトラン
ス（二次側コイル）２，およびチョークコイル３との間
を相互接続している。The heat dissipating body 10 is directly attached to the metal base side of the metal base printed wiring board 17 in a heat conductive manner, and the bus bar 12 is screwed to the above-mentioned external terminal 18, and the two terminal boards 19 are moved upward. Bus bars 15 and 16 are soldered to the protruding lead pieces 19b, respectively, to interconnect the transformer (secondary coil) 2 and the choke coil 3 of the switching power supply, as shown in FIG. ing.
【００１７】[0017]
【発明の効果】本発明の構成により次記の効果を奏す
る。 １）請求項１の構成により、整流素子（ダイオード）の
発生熱は伝熱性の高い金属ベースプリント配線板を通じ
て放熱体へ効率よく伝熱し熱放散されるので、コンデン
サ，ビーズコアなどの周辺部品，およびブスバーを介し
て接続するスイッチング電源のトランス，チョークコイ
ルなどに与える熱的影響を軽減できるとともに、コンデ
ンサの実装作業が容易で、しかもその配線インダクタン
スを低く抑えてノイズ抑制効果が十分に発揮できる。The following effects are achieved by the constitution of the present invention. 1) According to the configuration of claim 1, the heat generated by the rectifying element (diode) is efficiently transferred to the radiator through the metal base printed wiring board having high heat conductivity and is dissipated. Therefore, peripheral components such as a capacitor and a bead core, and It is possible to reduce the thermal effect on the transformer, choke coil, etc. of the switching power supply connected via the bus bar, to facilitate the work of mounting the capacitor, and to suppress the wiring inductance to a sufficient level to suppress noise.
【００１８】２）また、請求項２の構成を採用すること
により、端子板を金属ベースプリント配線板に実装する
際に押え治具などの必要なしに半田付けが行える。 ３）さらに、請求項３の構成を採用することで、熱的ス
トレスに弱いフェライト製のビーズコアを安全に保護で
きる。2) By adopting the configuration of claim 2, soldering can be performed without the need for a holding jig when mounting the terminal board on the metal base printed wiring board. 3) Furthermore, by adopting the configuration of claim 3, it is possible to safely protect the ferrite bead core, which is weak against thermal stress.
【図１】本発明の実施例によるダイオードモジュールの
組立構成図であり、（ａ）は平面図、（ｂ）は側面図FIG. 1 is an assembly configuration diagram of a diode module according to an embodiment of the present invention, in which (a) is a plan view and (b) is a side view.
【図２】図１のダイオードモジュールとスイッチング電
源のトランス，チョークコイルとの接続状態を表す平面
図FIG. 2 is a plan view showing a connection state of the diode module of FIG. 1, a transformer of a switching power supply, and a choke coil.
【図３】本発明の実施対象となるスイッチング電源のト
ランス二次側の回路構成図FIG. 3 is a circuit configuration diagram of a transformer secondary side of a switching power supply to which the present invention is applied.
【図４】従来におけるダイオードモジュールの組立構成
図FIG. 4 is an assembly configuration diagram of a conventional diode module.
１ 整流部（ダイオードモジュール） ２ トランス ３ チョークコイル ５，６ ダイオード ７，８ コンデンサ ９ ビーズコア １０ 放熱体 １２，１５，１６ ブスバー １７ 金属ベースプリント配線板 １８ 外部端子 １９ 端子板 １９ａ 脚ブスバー １９ｂ リード片部 1 Rectifier (diode module) 2 Transformer 3 Choke coil 5,6 Diode 7,8 Capacitor 9 Bead core 10 Radiator 12,15,16 Busbar 17 Metal base printed wiring board 18 External terminal 19 Terminal board 19a Leg busbar 19b Lead piece part
Claims (3)
接続する整流部の組立構造であって、表面実装型の整流
素子，ノイズ低減用のコンデンサ、およびブスバーに接
続する外部端子をヒートシンクとしての金属ベースプリ
ント配線板上に配列してその導体パターンに半田付け実
装し、かつ該金属ベースプリント配線板に放熱体を直接
取付けて構成したことを特徴とするスイッチング電源用
整流部の組立構造。1. A structure for assembling a rectifying unit connected to a secondary side of a transformer of a switching power supply circuit, wherein a surface mount type rectifying element, a noise reducing capacitor, and a metal as a heat sink for external terminals connected to a bus bar. An assembling structure of a rectifying unit for a switching power supply, characterized in that it is arranged on a base printed wiring board, soldered and mounted on its conductor pattern, and a radiator is directly attached to the metal base printed wiring board.
子の相互接続リードを兼ねた外部接続端子を自立形に成
形した端子板で構成し、かつ端子板の脚部を金属ベース
プリント配線板に半田接合したことを特徴とするスイッ
チング電源用整流部の組立構造。2. The assembly structure according to claim 1, wherein the external connection terminal, which also serves as an interconnecting lead of the rectifying element, is composed of a self-standing terminal plate, and the legs of the terminal plate are metal base printed wiring boards. An assembly structure of a rectifying unit for a switching power supply, characterized in that it is soldered to the.
続端子の端子板に対して個々の整流素子と対応する箇所
から上方に起立してブスバーと接続し合う突起状のリー
ド片部を形成し、ここにノイズ低減用ビーズコアを挿入
セットしたことを特徴とするスイッチング電源用整流部
の組立構造。3. The assembly structure according to claim 2, wherein a protruding lead piece portion is formed to stand up from a position corresponding to each rectifying element with respect to the terminal plate of the external connection terminal and connect with the bus bar. Then, the assembly structure of the rectifier for the switching power supply is characterized in that a bead core for noise reduction is inserted and set here.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8095695A JP3259576B2 (en) | 1995-04-06 | 1995-04-06 | Assembly structure of rectifier for switching power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8095695A JP3259576B2 (en) | 1995-04-06 | 1995-04-06 | Assembly structure of rectifier for switching power supply |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08279592A true JPH08279592A (en) | 1996-10-22 |
| JP3259576B2 JP3259576B2 (en) | 2002-02-25 |
Family
ID=13732967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8095695A Expired - Fee Related JP3259576B2 (en) | 1995-04-06 | 1995-04-06 | Assembly structure of rectifier for switching power supply |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3259576B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11346480A (en) * | 1998-06-02 | 1999-12-14 | Hitachi Ltd | Inverter device |
| CN100464414C (en) * | 2003-02-24 | 2009-02-25 | 三菱电机株式会社 | Soft soldering method for semiconductor components and semiconductor device |
| WO2014122829A1 (en) * | 2013-02-06 | 2014-08-14 | 株式会社村田製作所 | Transformer module, electricity reception device, and electricity transmission device |
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| CN107538154A (en) * | 2016-06-29 | 2018-01-05 | 上海沪工焊接集团股份有限公司 | IGBT protection devices and IGBT module |
| CN109937478A (en) * | 2016-09-19 | 2019-06-25 | 通用电气公司 | Electronic module assembly with low loop inductance |
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| US10128625B2 (en) | 2014-11-18 | 2018-11-13 | General Electric Company | Bus bar and power electronic device with current shaping terminal connector and method of making a terminal connector |
-
1995
- 1995-04-06 JP JP8095695A patent/JP3259576B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11346480A (en) * | 1998-06-02 | 1999-12-14 | Hitachi Ltd | Inverter device |
| CN100464414C (en) * | 2003-02-24 | 2009-02-25 | 三菱电机株式会社 | Soft soldering method for semiconductor components and semiconductor device |
| WO2014122829A1 (en) * | 2013-02-06 | 2014-08-14 | 株式会社村田製作所 | Transformer module, electricity reception device, and electricity transmission device |
| JPWO2014122829A1 (en) * | 2013-02-06 | 2017-01-26 | 株式会社村田製作所 | Transformer module, power receiving device and power transmitting device |
| US9948202B2 (en) | 2013-02-06 | 2018-04-17 | Murata Manufacturing Co., Ltd. | Transformer module, power reception device and power transmission device |
| CN104952859A (en) * | 2014-03-27 | 2015-09-30 | 联合汽车电子有限公司 | IGBT module packaging structure of inverter |
| KR20150134498A (en) * | 2014-05-21 | 2015-12-02 | 주식회사 포스코 | Apparatus for providing wireless power for sensor attached to surface of rotating object |
| CN107538154A (en) * | 2016-06-29 | 2018-01-05 | 上海沪工焊接集团股份有限公司 | IGBT protection devices and IGBT module |
| CN109937478A (en) * | 2016-09-19 | 2019-06-25 | 通用电气公司 | Electronic module assembly with low loop inductance |
| CN112840421A (en) * | 2018-12-05 | 2021-05-25 | 松下知识产权经营株式会社 | Vehicle-mounted power supply device |
| CN112840421B (en) * | 2018-12-05 | 2022-07-22 | 松下知识产权经营株式会社 | Vehicle-mounted power supply device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3259576B2 (en) | 2002-02-25 |
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