JPH08277495A - Device for electroplating metallic strip - Google Patents

Device for electroplating metallic strip

Info

Publication number
JPH08277495A
JPH08277495A JP7918595A JP7918595A JPH08277495A JP H08277495 A JPH08277495 A JP H08277495A JP 7918595 A JP7918595 A JP 7918595A JP 7918595 A JP7918595 A JP 7918595A JP H08277495 A JPH08277495 A JP H08277495A
Authority
JP
Japan
Prior art keywords
strip
anode
seal plate
plating
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP7918595A
Other languages
Japanese (ja)
Inventor
Osamu Togawa
修 外川
Mutsuo Shiragami
睦雄 白神
Masanori Hoshino
正則 星野
Junichi Morikawa
淳一 森川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP7918595A priority Critical patent/JPH08277495A/en
Publication of JPH08277495A publication Critical patent/JPH08277495A/en
Withdrawn legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To provide the electroplating device capable of minimizing the flapping of a strip in electroplating and stably traveling the strip through even a narrow space between the anodes. CONSTITUTION: This electroplating device is provided with voltmeters 12 and 13 for detecting the voltage between the anode 2 and conductor roll 10. The detection signal of the voltmeters 12 and 13 is inputted to a seal plate position controller 14, and the position of an outlet seal plate 9 is controlled by a seal plate position adjuster 15 vertically to the face of the strip 1 so that the ratio of the voltage detected by the voltmeter 12 to that detected by the voltmeter 13 is controlled within a specified range.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、金属ストリップの電気
めっき装置に関し、特に高い速度で走行するストリップ
に高い電流密度でめっきするのに適した電気めっき装置
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplating apparatus for metal strips, and more particularly to an electroplating apparatus suitable for plating a strip running at a high speed with a high current density.

【0002】[0002]

【従来の技術】近年、ストリップの電気めっきに対し
て、高速化及び高電流密度化の要求がますます高くなっ
ている。図3は従来の電気めっき装置の一例を示す。め
っき槽3内において、その中を水平に走行するストリッ
プ1の上下方向に1対の陽極2が対向して配置され、ス
トリップ1の表面とその両面の陽極2との間に、給液ヘ
ッダー5からめっき液が供給され、電気めっきが施され
る。図中6,7はダムロール、10は通電ロール、11
はバックアップロールである。
2. Description of the Related Art In recent years, there has been an increasing demand for high speed and high current density for electroplating strips. FIG. 3 shows an example of a conventional electroplating apparatus. In the plating tank 3, a pair of anodes 2 are arranged so as to face each other in the vertical direction of a strip 1 that runs horizontally therein, and a supply header 5 is provided between the surface of the strip 1 and the anodes 2 on both sides thereof. A plating solution is supplied from the above to perform electroplating. In the figure, 6 and 7 are dam rolls, 10 are energizing rolls, 11
Is a backup roll.

【0003】このような装置で高速に電気めっきを行う
場合、液抵抗によるストリップ1のバタツキが大きいた
め、ストリップ1と陽極2との間隔を大きくする必要が
ある。このため、めっき液での電力ロスが大きくなり、
電力コスト的に不利となる。また、電力コストを考える
と電流密度を高くすることはできないため、設備が大型
化するという欠点がある。これらの問題点の改善策とし
て、陽極とストリップの間にのみめっき液を保持させる
装置が、例えば、特開平5−331687号公報に開示
されている。
When electroplating is performed at high speed with such an apparatus, the fluttering of the strip 1 due to the liquid resistance is large, so that it is necessary to increase the distance between the strip 1 and the anode 2. For this reason, the power loss in the plating solution increases,
It is disadvantageous in terms of power cost. Further, considering the power cost, it is not possible to increase the current density, so that there is a drawback that the equipment becomes large. As a solution to these problems, an apparatus for holding the plating solution only between the anode and the strip is disclosed in, for example, Japanese Patent Application Laid-Open No. 5-331687.

【0004】[0004]

【発明が解決しようとする課題】しかし、特開平5−3
31687号公報の装置では、給液ヘッダーにめっき液
を送るポンプに圧力変動が生じた場合、その変動の影響
を受けてストリップのバタツキが発生することになる。
However, Japanese Unexamined Patent Publication No. 5-3.
In the apparatus of Japanese Patent No. 31687, when pressure fluctuation occurs in the pump that feeds the plating solution to the liquid supply header, strip fluctuation occurs due to the effect of the fluctuation.

【0005】このような圧力変動を原因とするストリッ
プのバタツキが発生すると、ストリップと陽極の間隔を
大きくする必要があり、電力コスト的に不利となる。ま
た、電力コストを考えると電流密度を高くすることはで
きないため、設備が大型化するという欠点がある。本発
明は、上記問題点の解決のため、ストリップのバタツキ
を最小限に抑えるように制御可能な電気めっき装置を提
供することを目的としている。
When flapping of the strip due to such pressure fluctuation occurs, it is necessary to increase the distance between the strip and the anode, which is disadvantageous in terms of power cost. Further, considering the power cost, it is not possible to increase the current density, so that there is a drawback that the equipment becomes large. In order to solve the above problems, it is an object of the present invention to provide an electroplating apparatus that can be controlled so as to minimize flapping of the strip.

【0006】[0006]

【課題を解決するための手段】本発明によれば、通過す
るストリップの両面に対向して配置された1対の陽極
と、ストリップ進行方向に対し両側面に設置した側面シ
ールで構成された断面筒状のめっき槽に、前記めっき槽
の一端側から他端側に向けてめっき液を供給するための
給液ノズルを有し、前記給液ノズル及び前記めっき槽の
下流端から延長されそれぞれストリップの両面に設置さ
れるシール板を有する電気めっき装置において、前記陽
極対の一方と通電ロール間の電圧及び前記陽極対の他方
と前記通電ロール間の電圧をそれぞれ検出する検出装置
を備え、前記電圧の比が所定範囲内となるように前記め
っき槽の下流端に配置される前記シール板の位置をスト
リップ面の垂直方向に制御する制御装置を備えたことを
特徴とする電気めっき装置が提供される。
According to the present invention, a cross section composed of a pair of anodes arranged opposite to each other on both sides of a passing strip and side seals installed on both sides with respect to the traveling direction of the strip. A cylindrical plating tank has a liquid supply nozzle for supplying a plating liquid from one end side to the other end side of the plating tank, and strips are respectively extended from the liquid supply nozzle and the downstream end of the plating tank. In an electroplating apparatus having seal plates installed on both surfaces of the anode plate, a detection device for detecting a voltage between one of the anode pair and an energizing roll and a voltage between the other of the anode pair and the energizing roll, respectively, the voltage Is provided within a predetermined range so that the position of the seal plate arranged at the downstream end of the plating tank is controlled in the direction perpendicular to the strip surface. Apparatus is provided.

【0007】[0007]

【作用】陽極と通電ロール間の電圧は、ストリップと陽
極間の距離により変化する。従って、陽極対の一方と通
電ロール間の電圧と、陽極対の他方と通電ロール間の電
圧を検出して、めっき槽の下流端に配置されるシール板
の位置を制御しストリップ両面間の差圧を変え電圧の比
を所定範囲内とするので、ストリップのバタツキを最小
限に抑えることができる。
The voltage between the anode and the energizing roll changes depending on the distance between the strip and the anode. Therefore, by detecting the voltage between one of the anode pair and the energizing roll and the voltage between the other of the anode pair and the energizing roll, the position of the seal plate placed at the downstream end of the plating bath is controlled to control the difference between the strip surfaces. Since the pressure is changed so that the voltage ratio is within a predetermined range, the flapping of the strip can be minimized.

【0008】[0008]

【実施例】本発明の実施例について詳細に説明する。図
1及び図2は本発明の一実施例を示す電気めっき装置の
断面側面図及び平面図である。陽極2は通過するストリ
ップ1の上下両面に対向するよう断面筒状のめっき槽3
内に設けられている。側面シール4は、ストリップ進行
方向側面の上下各陽極2間に設けられ、前記1対の陽極
2とでめっき空間を構成し、ストリップ1の幅方向両サ
イドからめっき液が流出しないよう設けられている。給
液ヘッダー5は、ストリップ1の走行方向と同じ方向に
めっき槽3のストリップ1の出側に向けて、めっき液を
供給するためのもので、1対の陽極2のストリップ1の
入側端部に接触して設けられている。
EXAMPLES Examples of the present invention will be described in detail. 1 and 2 are a sectional side view and a plan view of an electroplating apparatus showing an embodiment of the present invention. The anode 2 is a plating tank 3 having a tubular cross-section so that the anode 2 faces the upper and lower surfaces of the passing strip 1.
It is provided inside. The side surface seal 4 is provided between the upper and lower anodes 2 on the side surface in the strip advancing direction, forms a plating space with the pair of anodes 2, and is provided so that the plating solution does not flow out from both sides in the width direction of the strip 1. There is. The liquid supply header 5 is for supplying the plating liquid toward the outlet side of the strip 1 of the plating tank 3 in the same direction as the running direction of the strip 1, and is a pair of anodes 2 on the inlet side end of the strip 1. It is provided in contact with the section.

【0009】6,7はダムロールである。また、10は
通電ロール、11はバックアップロールである。入側シ
ール板8は、給液ヘッダー5から延長されストリップ1
の両面に設置される。また、出側シール板9は、めっき
槽3のストリップ1の出側端から延長されストリップ1
の両面に設置される。従来は給液ヘッダー5にめっき液
を送るポンプに圧力変動が生じた場合、その変動の影響
を受けてストリップ1のバタツキが発生していた。
Reference numerals 6 and 7 are dam rolls. Further, 10 is an energizing roll, and 11 is a backup roll. The inlet seal plate 8 is extended from the liquid supply header 5 and is a strip 1
It is installed on both sides of. Further, the outlet side seal plate 9 is extended from the outlet side end of the strip 1 of the plating tank 3 to form the strip 1
It is installed on both sides of. Conventionally, when a pressure fluctuation occurs in a pump that feeds the plating solution to the liquid supply header 5, the fluctuation of the strip 1 is affected by the fluctuation.

【0010】実施例では、陽極2と通電ロール10間の
電圧を検出する電圧計12,13を備えている。電圧計
12,13の検出信号はシール板位置制御装置14に入
力され、電圧計12と電圧計13で検出される電圧の比
が所定範囲内となるように、シール板位置調節装置15
でストリップ1面の垂直方向に出側シール板9の位置を
制御する。これにより、ポンプに圧力変動が生じた場合
でもストリップ1のバタツキを最小限を抑えることが可
能となる。本発明の電気めっき装置は、亜鉛めっき、錫
めっきなどあらゆる電気めっきに利用可能であり、板
厚、板幅にも制限はない。
The embodiment is provided with voltmeters 12 and 13 for detecting the voltage between the anode 2 and the energizing roll 10. The detection signals of the voltmeters 12 and 13 are input to the seal plate position control device 14 so that the ratio of the voltages detected by the voltmeter 12 and the voltmeter 13 is within a predetermined range.
The position of the outlet seal plate 9 is controlled in the direction perpendicular to the strip 1 surface by. This makes it possible to minimize the fluttering of the strip 1 even when pressure fluctuations occur in the pump. INDUSTRIAL APPLICABILITY The electroplating apparatus of the present invention can be used for all kinds of electroplating such as zinc plating and tin plating, and there is no limitation in plate thickness and plate width.

【0011】(実施例1)このような装置構成で錫めっ
き液を用いて、厚さ0.24mm、幅860mmのストリッ
プに下記条件でめっきを行った。 陽極長 :全長2000mm、有効長1800mm 陽極幅 :1200mm 陽極−ストリップ間距離:10mm 通板速度:500m/分 ストリップ入側ダムロール軸心−ストリップ入側陽極端
間:100mm ストリップ出側陽極端−ストリップ出側ダムロール軸心
間:100mm その結果を表1に示す。
(Example 1) Using the tin plating solution having such an apparatus structure, a strip having a thickness of 0.24 mm and a width of 860 mm was plated under the following conditions. Anode length: Total length 2000 mm, effective length 1800 mm Anode width: 1200 mm Anode-strip distance: 10 mm Plate passing speed: 500 m / min Strip entry side dam roll axis center-strip entry side anode end: 100 mm Strip exit side anode end-strip exit Side dam roll axis center: 100 mm The results are shown in Table 1.

【0012】(比較例)実施例1と同じストリップを用
い、出側シール板9の位置を制御せず固定する他は実施
例1と同じ条件でめっきを行った。その結果を表1に示
す。本発明の電気めっき装置を用いることにより、スト
リップのバタツキを最小限に抑えることができ、狭い陽
極間でも安定に通板できた。
(Comparative Example) The same strip as in Example 1 was used, and plating was performed under the same conditions as in Example 1 except that the position of the outlet side sealing plate 9 was fixed without controlling. Table 1 shows the results. By using the electroplating apparatus of the present invention, the flapping of the strip can be minimized, and the strip can be stably passed even between narrow anodes.

【0013】[0013]

【表1】 [Table 1]

【0014】[0014]

【発明の効果】本発明方法により、ストリップのバタツ
キを最小限に抑え、狭い陽極間でも安定に通板が可能と
なり、経済的効果は大きい。
According to the method of the present invention, fluttering of the strip can be suppressed to a minimum and stable striping can be performed even between narrow anodes, which is economically effective.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す電気めっき装置の断面側
面図。
FIG. 1 is a sectional side view of an electroplating apparatus showing an embodiment of the present invention.

【図2】本発明の実施例を示す電気めっき装置の平面
図。
FIG. 2 is a plan view of an electroplating apparatus showing an embodiment of the present invention.

【図3】従来技術を示す説明図。FIG. 3 is an explanatory view showing a conventional technique.

【符号の説明】[Explanation of symbols]

1 ストリップ 2 陽極 3 めっき槽 4 側面シール 5 給液ヘッダー 6,7 ダムロール 8 入側シール板 9 出側シール板 10 通電ロール 11 バックアップロール 12,13 電圧計 14 シール板位置制御装置 15 シール板位置調節装置 1 Strip 2 Anode 3 Plating Tank 4 Side Seal 5 Liquid Supply Header 6, 7 Dam Roll 8 Inlet Seal Plate 9 Outlet Seal Plate 10 Energizing Roll 11 Backup Roll 12, 13 Voltmeter 14 Seal Plate Position Controller 15 Seal Plate Position Adjustment apparatus

───────────────────────────────────────────────────── フロントページの続き (72)発明者 森川 淳一 富津市新富20−1 新日本製鐵株式会社技 術開発本部内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junichi Morikawa 20-1 Shintomi, Futtsu City Nippon Steel Corporation Technical Development Division

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 通過するストリップの両面に対向して配
置された1対の陽極と、前記両陽極と側面シールで構成
された断面筒状のめっき槽に、前記めっき槽の一端側か
ら他端側に向けてめっき液を供給するための供給ノズル
を有し、前記給液ノズル及び前記めっき槽の下流端から
延長されそれぞれストリップの両面に設置されるシール
板を有する電気めっき装置において、前記陽極対の一方
の通電ロール間の電圧及び前記陽極対の他方と前記通電
ロール間の電圧をそれぞれ検出する検出装置を備え、前
記電圧の比が所定範囲内となるように前記めっき槽の下
流端に配置される前記シール板の位置をストリップ面の
垂直方向に制御する制御装置を備えたことを特徴とする
電気めっき装置。
1. A plating tank having a cylindrical cross-section composed of a pair of anodes facing each other on both sides of a passing strip, and both anodes and side seals, from one end side to the other end of the plating tank. In the electroplating apparatus having a supply nozzle for supplying a plating solution toward the side, and having a seal plate extending from the supply solution nozzle and the downstream end of the plating tank and installed on both surfaces of the strip, the anode A detection device for detecting the voltage between one energizing roll of the pair and the voltage between the other of the anode pair and the energizing roll is provided, and at the downstream end of the plating tank so that the ratio of the voltages is within a predetermined range. An electroplating apparatus comprising a control device for controlling the position of the seal plate to be arranged in the direction perpendicular to the strip surface.
JP7918595A 1995-04-04 1995-04-04 Device for electroplating metallic strip Withdrawn JPH08277495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7918595A JPH08277495A (en) 1995-04-04 1995-04-04 Device for electroplating metallic strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7918595A JPH08277495A (en) 1995-04-04 1995-04-04 Device for electroplating metallic strip

Publications (1)

Publication Number Publication Date
JPH08277495A true JPH08277495A (en) 1996-10-22

Family

ID=13682927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7918595A Withdrawn JPH08277495A (en) 1995-04-04 1995-04-04 Device for electroplating metallic strip

Country Status (1)

Country Link
JP (1) JPH08277495A (en)

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Effective date: 20020604