JPH08274489A - Conductive adhesive sheet - Google Patents
Conductive adhesive sheetInfo
- Publication number
- JPH08274489A JPH08274489A JP7075953A JP7595395A JPH08274489A JP H08274489 A JPH08274489 A JP H08274489A JP 7075953 A JP7075953 A JP 7075953A JP 7595395 A JP7595395 A JP 7595395A JP H08274489 A JPH08274489 A JP H08274489A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- adhesive sheet
- sensitive adhesive
- pressure
- electric wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、主として自動車の電気
配線に用いられるシールド電線の端末部、あるいはジョ
イント部を電磁波シールドするために使用する導電性粘
着シートに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive pressure-sensitive adhesive sheet mainly used for electromagnetic wave shielding of a terminal portion or a joint portion of a shielded electric wire used for electric wiring of an automobile.
【０００２】[0002]
【従来の技術】従来、自動車のワイヤハーネス等に用い
られるシールド電線の端末部は、図６に示すように、シ
ールド電線ａのシールド線ｂを剥離して芯線ｃを露出さ
せて端子ｄを接続している。ｄ′はシールド線ｂ用の端
子である。また、図７に示すように、シールド電線ａか
らの分岐電線ｆを接続するジョイント部ｅにおいても、
シールド線ｂを除去して芯線ｃの接続を行った後、電磁
波に対する遮蔽効果のない絶縁テープなどで被覆してい
た。そのため、シールド線ｂで被覆されていない部分に
おいては、電磁波シールドが不十分となる欠点があっ
た。2. Description of the Related Art Conventionally, as shown in FIG. 6, in a terminal portion of a shielded electric wire used for a wire harness of an automobile, a shield wire b of a shielded electric wire a is peeled off to expose a core wire c and a terminal d is connected. are doing. d'is a terminal for the shield wire b. Further, as shown in FIG. 7, in the joint portion e that connects the branch electric wire f from the shield electric wire a,
After removing the shield wire b and connecting the core wire c, the shield wire b was covered with an insulating tape or the like having no effect of shielding electromagnetic waves. Therefore, there is a drawback that the electromagnetic wave shield becomes insufficient in the portion not covered with the shield wire b.
【０００３】そこで、電磁波シールドを確保するため、
実開昭６２−４１９４号公報には、図８に示すように、
導電性皮膜を形成した収縮性チューブｇでシールド電線
ａの端末部を覆うようにすることが提案されている。し
かしながら、収縮性チューブｇで端末部を覆うようにし
ただけでは、収縮性チューブｇの密着性が乏しいため、
使用中に収縮性チューブｇが移動してシールド電線ａの
非シールド部が露出することがあるなど、電磁波シール
ドの信頼性が乏しい問題点を有している。Therefore, in order to secure the electromagnetic wave shield,
In Japanese Utility Model Publication No. 62-4194, as shown in FIG.
It has been proposed to cover the end portion of the shielded electric wire a with a shrinkable tube g having a conductive film formed thereon. However, if only the end portion is covered with the shrinkable tube g, the shrinkage tube g has poor adhesion.
There is a problem that the reliability of the electromagnetic wave shield is poor, such that the shrinkable tube g may move during use to expose the non-shielded portion of the shielded electric wire a.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の問題
点に着目してなされたもので、施工が簡単で電磁波の遮
蔽効果が優れ、シールド電線の端末部あるいはジョイン
ト部等の電磁波シールドに好適な導電性粘着シートを提
供することを課題とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is easy to install and has an excellent electromagnetic wave shielding effect, and is suitable for an electromagnetic wave shield such as a terminal portion or a joint portion of a shielded wire. An object is to provide a suitable conductive adhesive sheet.
【０００５】[0005]
【課題を解決するための手段】前記の課題を達成するた
め、本発明の導電性粘着シートは、基材フィルムの片面
に、合成樹脂系またはゴム系の粘着剤組成物中に導電性
フィラーを１０〜９０重量％分散含有する導電性粘着剤
層を形成してなることを特徴とする。基材フィルムとし
ては、合成樹脂フィルムが好適である。導電性フィラー
を含む量は、１０重量％より少なくなると導電性粘着剤
層の導電性がかなり低下し、９０重量％を超えると粘着
力が著しく低下する。好ましくは、導電性フィラーの含
有量は３０〜８０重量％である。In order to achieve the above-mentioned object, the conductive pressure-sensitive adhesive sheet of the present invention has a conductive film on one surface of which a conductive filler is added in a synthetic resin-based or rubber-based pressure-sensitive adhesive composition. It is characterized in that a conductive pressure-sensitive adhesive layer containing 10 to 90% by weight of dispersed content is formed. A synthetic resin film is suitable as the substrate film. When the content of the conductive filler is less than 10% by weight, the conductivity of the conductive pressure-sensitive adhesive layer is considerably reduced, and when it exceeds 90% by weight, the adhesive strength is significantly reduced. Preferably, the content of the conductive filler is 30 to 80% by weight.
【０００６】請求項２に記載したように、導電性フィラ
ーの形状は、直径５μｍ以下、長さ５０μｍ以下の微細
な繊維状であることが好ましい。As described in claim 2, the shape of the conductive filler is preferably a fine fibrous shape having a diameter of 5 μm or less and a length of 50 μm or less.
【０００７】請求項３に記載したように、導電性フィラ
ーが、銅、ステンレス鋼、アルミニウム、ニッケル、銀
より選択された少なくとも１種からなる繊維、粒子、バ
ルクであることが好適である。As described in claim 3, it is preferable that the conductive filler is a fiber, particles or bulk made of at least one selected from copper, stainless steel, aluminum, nickel and silver.
【０００８】請求項４に記載したように、導電性フィラ
ーが、カーボンブラック、炭素繊維、黒鉛粉末より選択
された少なくとも１種であることが有効である。As described in claim 4, it is effective that the conductive filler is at least one selected from carbon black, carbon fiber and graphite powder.
【０００９】[0009]
【作用】導電性粘着テープの導電性と粘着力は、導電性
フィラーの均一分散性と、接着面において樹脂剤が均一
に被着体に接触していることが重要であるが、一般に、
導電性フィラーとして炭素系フィラーは、低比重でマト
リックス樹脂との比重差が少ないため分散性に優れてい
るが高導電性が得難い。また、金属系の導電性フィラー
は、導電性に優れるが、高比重であるため長時間放置す
るとフィラーが重力方向へ偏る現象が発生する。したが
って、炭素系フィラーにおいては、高度に黒鉛化したフ
ィラーが好ましく、また、炭素系フィラーおよび金属系
フィラーの形状は、直径５μｍ以下、長さ５０μｍ以下
の微細な繊維状とすることが好ましい。[Function] Regarding the conductivity and adhesive strength of the conductive adhesive tape, it is important that the conductive filler is uniformly dispersed and that the resin agent is uniformly in contact with the adherend on the adhesive surface.
The carbon-based filler as the conductive filler has a low specific gravity and a small difference in specific gravity from the matrix resin, and thus has excellent dispersibility, but it is difficult to obtain high conductivity. Further, the metal-based conductive filler has excellent conductivity, but since it has a high specific gravity, if left for a long time, the filler is biased in the direction of gravity. Therefore, the carbon-based filler is preferably a highly graphitized filler, and the shape of the carbon-based filler and the metal-based filler is preferably a fine fibrous shape having a diameter of 5 μm or less and a length of 50 μm or less.
【００１０】本発明の導電性粘着テープは、粘着剤組成
物中に導電性フィラーを分散含有しているため、電気抵
抗率が低くかつ粘着力が優れている。そのため、シール
ド電線の非シールド部等を被覆することにより、確実な
電磁波シールドを行うことができると共に、被覆作業が
容易であり作業性および電気的信頼性が著しく向上す
る。Since the conductive pressure-sensitive adhesive tape of the present invention contains the conductive filler dispersed in the pressure-sensitive adhesive composition, it has a low electric resistivity and an excellent adhesive force. Therefore, by covering the non-shielded portion of the shielded electric wire and the like, reliable electromagnetic wave shielding can be performed, and the covering work is easy and workability and electrical reliability are significantly improved.
【００１１】[0011]
（第１実施例）アクリル系粘着剤（東亜合成株式会社
製、アロンＳ−１５１１）１００重量部に、架橋剤（日
本ポリウレタン工業株式会社製、コロネートＬ）２重量
部を加え、繊維径０．４〜０．７μｍ、繊維長さ１０〜
２０μｍの銀コートチタン酸カリウムウイスカー（大塚
化学株式会社製、ＳＤ−１００）を８０重量％の添加量
でニーダーを用いて混入し、トルエンにて溶解して固形
分３０重量％の粘着剤組成物を作成した。(First Example) To 100 parts by weight of an acrylic adhesive (Aaron S-1511 manufactured by Toagosei Co., Ltd.), 2 parts by weight of a cross-linking agent (Coronate L manufactured by Nippon Polyurethane Industry Co., Ltd.) was added to give a fiber diameter of 0. 4-0.7 μm, fiber length 10
A 20 μm silver-coated potassium titanate whisker (SD-100, manufactured by Otsuka Chemical Co., Ltd.) was mixed in with a kneader at an addition amount of 80% by weight, and dissolved in toluene to give an adhesive composition having a solid content of 30% by weight. It was created.
【００１２】上記の粘着剤組成物を、基材フィルムとし
て縮合形シリコン剥離剤を付着させたポリエチレンテレ
フタレートフィルムに塗布し、１２０℃で３分間乾燥を
繰り返して、図１に示すような、粘着剤層１を含む厚さ
２ｍｍの導電性粘着シートＡを得た。２は上記の基材フ
ィルムである。導電性粘着シートＡの室温電気抵抗率
は、５×１０-3Ω・ｃｍであった。また、短冊状の塩化
ビニル製プレート（１０ｍｍ×５０ｍｍ×２ｍｍ）２枚
を、導電性粘着シートＡにより１０ｍｍ×１０ｍｍの面
で張り合わせ、せん断接着力σを測定した結果、σ＝４
５０ｋＰａであった。The above-mentioned pressure-sensitive adhesive composition is applied to a polyethylene terephthalate film to which a condensation type silicone release agent is adhered as a base film, and the drying is repeated at 120 ° C. for 3 minutes to repeat the pressure-sensitive adhesive as shown in FIG. A 2 mm-thick conductive adhesive sheet A containing the layer 1 was obtained. 2 is the above-mentioned base film. The room temperature electrical resistivity of the conductive adhesive sheet A was 5 × 10 −3 Ω · cm. Further, two strip-shaped vinyl chloride plates (10 mm × 50 mm × 2 mm) were stuck together with the conductive adhesive sheet A on the surface of 10 mm × 10 mm, and the shear adhesive strength σ was measured. As a result, σ = 4
It was 50 kPa.
【００１３】図２ないし図４は、シールド電線の末端部
およびジョイント部に対し、導電性粘着シートＡを被覆
する工程を示す説明図である。すなわち、図２は、芯線
４を露出させたシールド電線３の端末部に、導電性粘着
シートＡの粘着剤層１を当てた状態を示している。５は
端子である。この状態で芯線４およびシールド線６を包
み込むように導電性粘着シートＡを巻き付けることによ
り、粘着剤層１が芯線４を完全に被包するので確実に電
磁波をシールドすることができる。2 to 4 are explanatory views showing a process of coating the conductive adhesive sheet A on the end portion and the joint portion of the shielded electric wire. That is, FIG. 2 shows a state in which the pressure-sensitive adhesive layer 1 of the conductive pressure-sensitive adhesive sheet A is applied to the end portion of the shielded electric wire 3 with the core wire 4 exposed. 5 is a terminal. By winding the conductive pressure-sensitive adhesive sheet A so as to wrap the core wire 4 and the shield wire 6 in this state, the core layer 4 is completely encapsulated by the pressure-sensitive adhesive layer 1, so that electromagnetic waves can be reliably shielded.
【００１４】図３は、シールド電線３のジョイント部を
示し、シールド線６を剥離して芯線４を露出させた後、
芯線４の絶縁被覆４ａを除去した部分に分岐電線７を接
続し、接続部に絶縁テープ８を巻付けている。シールド
線６を剥離した部分の芯線４の周囲に導電性粘着シート
Ａの粘着剤層１を当て、シールド電線３および分岐電線
７を包み込むように導電性粘着シートＡを巻き付ける。FIG. 3 shows a joint portion of the shielded electric wire 3. After peeling off the shielded wire 6 to expose the core wire 4,
A branch electric wire 7 is connected to a portion of the core wire 4 from which the insulating coating 4a is removed, and an insulating tape 8 is wound around the connecting portion. The pressure-sensitive adhesive layer 1 of the conductive pressure-sensitive adhesive sheet A is applied to the periphery of the core wire 4 where the shield wire 6 is peeled off, and the conductive pressure-sensitive adhesive sheet A is wrapped so as to wrap the shielded electric wire 3 and the branch electric wire 7.
【００１５】図４は、シールド電線３と分岐電線７との
接続部の前後において、シールド線６を切断除去し、芯
線４の導体４ａと分岐電線７の導体７ａとを接続した状
態を示している。この接続部に絶縁テープ８を巻付けた
後、図５に示すように、接続部の周囲に導電性粘着シー
トＡの粘着剤層１を当ててシールド電線３および分岐電
線７を包み込むように巻き込む。導電性粘着シートＡの
シールド効果が優れているため、導電性粘着シートＡで
被覆する部分においては、シールド線５が不要となり、
接続部が小径化する利点がある。上記の図２ないし図５
に示したシールド電線に対する導電性粘着シートＡの適
用例においては、いずれも優れた電磁波シールド効果が
得られた。FIG. 4 shows a state in which the shield wire 6 is cut and removed before and after the connecting portion between the shielded electric wire 3 and the branched electric wire 7, and the conductor 4a of the core wire 4 and the conductor 7a of the branched electric wire 7 are connected. There is. After winding the insulating tape 8 around this connecting portion, as shown in FIG. 5, the adhesive layer 1 of the conductive pressure-sensitive adhesive sheet A is applied to the periphery of the connecting portion and the shielded electric wire 3 and the branch electric wire 7 are wrapped so as to wrap. . Since the conductive adhesive sheet A has excellent shielding effect, the shield wire 5 is not required in the portion covered with the conductive adhesive sheet A,
There is an advantage that the diameter of the connecting portion is reduced. 2 to 5 above
In each of the application examples of the electrically conductive pressure-sensitive adhesive sheet A for the shielded electric wire shown in (4), an excellent electromagnetic wave shielding effect was obtained.
【００１６】（第２実施例）第１実施例と同様の粘着剤
組成物に導電性フィラーとして、鱗片状銀粉末（福田金
属箔粉工業株式会社製、シルコートＡｇ−Ｌ）を８０重
量％添加し、第１実施例と同様のポリエチレンテレフタ
レートフィルムに同条件で塗布して厚さ２ｍｍで室温電
気抵抗率８×１０-4Ω・ｃｍの導電性粘着シートＢを得
た。導電性粘着シートＢのせん断接着力σは、σ＝３６
０ｋＰａであった。前記導電性粘着シートＡと同様に、
シールド電線の端末部やジョイント部に対して導電性粘
着シートＢを適用したところ、いずれも優れた電磁波シ
ールド効果が得られた。(Second Example) 80% by weight of scaly silver powder (Silcoat Ag-L manufactured by Fukuda Metal Foil & Powder Co., Ltd.) was added to the same adhesive composition as in the first example as a conductive filler. Then, the same polyethylene terephthalate film as in Example 1 was applied under the same conditions to obtain a conductive adhesive sheet B having a thickness of 2 mm and a room temperature electric resistivity of 8 × 10 −4 Ω · cm. The shear adhesive strength σ of the conductive adhesive sheet B is σ = 36
It was 0 kPa. Similar to the conductive adhesive sheet A,
When the conductive pressure-sensitive adhesive sheet B was applied to the terminal portion and the joint portion of the shielded electric wire, excellent electromagnetic wave shielding effects were obtained in all cases.
【００１７】（第３実施例）第１実施例と同様の粘着剤
に導電性フィラーとして、カーボンブラック（ライオン
アクゾ株式会社製、Ｋｅｔｊｅｎｂｌａｃｋ ＥＣ、粒
径４０ｎｍ以下）を３０重量％添加し、第１実施例と同
様のポリエチレンテレフタレートフィルムに同条件で塗
布して厚さ２ｍｍの導電性シートＣを得た。導電性シー
トＣの室温電気抵抗率は、１×１０0 Ω・ｃｍであり、
せん断接着力σは、σ＝１３０ｋＰａであった。(Third Embodiment) Carbon black (Ketjenblack EC, particle size 40 nm or less, manufactured by Lion Akzo Co., Ltd.) was added as an electrically conductive filler to the same adhesive as in the first embodiment in an amount of 30% by weight. A polyethylene terephthalate film similar to that of the example was applied under the same conditions to obtain a conductive sheet C having a thickness of 2 mm. The room temperature electrical resistivity of the conductive sheet C is 1 × 10 0 Ω · cm,
The shear adhesive force σ was σ = 130 kPa.
【００１８】（第４実施例）第１実施例と同様の粘着剤
に導電性フィラーとして、気相成長炭素繊維（昭和電工
株式会社製、ＶＧＣＦ、直径０．５μｍ以下、長さ５０
μｍ以下）を６０重量％添加し、第１実施例と同様のポ
リエチレンテレフタレートフィルムに同条件で塗布して
厚さ２ｍｍの導電性シートＤを得た。導電性シートＤの
室温電気抵抗率は、７×１０-2Ω・ｃｍであり、せん断
接着力σは、σ＝４７０ｋＰａであった。(Fourth Embodiment) A vapor-grown carbon fiber (VGCF, manufactured by Showa Denko KK, diameter 0.5 μm or less, length 50) was used as a conductive filler in the same adhesive as in the first embodiment.
60 μ%) was added to the same polyethylene terephthalate film as in Example 1 under the same conditions to obtain a conductive sheet D having a thickness of 2 mm. The room temperature electrical resistivity of the conductive sheet D was 7 × 10 −2 Ω · cm, and the shear adhesive strength σ was σ = 470 kPa.
【００１９】（第５実施例）第１実施例と同様の粘着剤
に導電性フィラーとして、天然黒鉛粉末（日本坩堝株式
会社製、ＳＧＰ４０、平均粒径４０μｍ）を６０重量％
添加し、第１実施例と同様のポリエチレンテレフタレー
トフィルムに同条件で塗布して厚さ２ｍｍの導電性シー
トＥを得た。導電性シートＥの室温電気抵抗率は、７×
１０-1Ω・ｃｍであり、せん断接着力σは、σ＝１８０
ｋＰａであった。(Fifth Embodiment) 60 wt% of natural graphite powder (SGP40, manufactured by Nippon Crucible Co., Ltd., average particle diameter 40 μm) is used as an electrically conductive filler in the same adhesive as in the first embodiment.
It was added and applied to the same polyethylene terephthalate film as in Example 1 under the same conditions to obtain a conductive sheet E having a thickness of 2 mm. The room temperature electric resistivity of the conductive sheet E is 7 ×.
10 −1 Ω · cm, and the shear adhesive force σ is σ = 180
It was kPa.
【００２０】一般に、電磁遮蔽材として使用する場合
は、１×１０0 Ω・ｃｍ以下、せん断接着力σは、σ＝
１００ｋＰａ以上が必要であるが、上記の実施例におい
て得られた各導電性シートＡ、Ｂ、Ｃ、Ｄ、Ｅは、いず
れも優れた電磁遮蔽材としての性能を有している。Generally, when it is used as an electromagnetic shielding material, it is 1 × 10 0 Ω · cm or less, and the shear adhesive force σ is σ =
Although 100 kPa or more is required, each of the conductive sheets A, B, C, D and E obtained in the above examples has excellent performance as an electromagnetic shielding material.
【００２１】（第１比較例）第１実施例と同様の粘着剤
を用い、フィラーとしての銀コートチタン酸カリウムウ
イスカー（大塚化学株式会社製、ＳＤ−１００）の添加
量を２５重量％とした以外は、第１実施例と同様のポリ
エチレンテレフタレートフィルムおよび同条件で粘着シ
ートＸを作成した。粘着シートＸの室温電気抵抗率は、
３×１０-1Ω・ｃｍであり、せん断接着力σは、σ＝５
２０ｋＰａであった。粘着シートＸは粘着力は優れてい
るが、室温電気抵抗率が高く導電性が悪いため、電磁波
シールド効果がなく電磁波シールド用には使用不能であ
った。(First Comparative Example) The same adhesive as in the first example was used, and the addition amount of silver-coated potassium titanate whiskers (SD-100, manufactured by Otsuka Chemical Co., Ltd.) as a filler was set to 25% by weight. Except for the above, a polyethylene terephthalate film similar to that of the first example and an adhesive sheet X were prepared under the same conditions. The room temperature electric resistivity of the adhesive sheet X is
3 × 10 −1 Ω · cm, and the shear adhesive force σ is σ = 5
It was 20 kPa. Although the pressure-sensitive adhesive sheet X has excellent adhesive strength, it has a high room temperature electric resistivity and poor conductivity, and therefore has no electromagnetic wave shielding effect and cannot be used for electromagnetic wave shielding.
【００２２】（第２比較例）フィラーとしての銀コート
チタン酸カリウムウイスカー（大塚化学株式会社製、Ｓ
Ｄ−１００）の添加量を８５重量％とした以外は、第１
比較例と同条件で粘着シートＹを作成した。粘着シート
Ｙの室温電気抵抗率は、４×１０-3Ω・ｃｍであり、せ
ん断接着力σは、σ＝８０ｋＰａであった。粘着シート
Ｙは、導電性は向上したが、粘着性が著しく劣るためシ
ールド電線を包み込んで保持することができず、使用不
能であった。(Comparative Example 2) Silver-coated potassium titanate whiskers as filler (Otsuka Chemical Co., S
D-100) except that the amount added was 85% by weight.
Adhesive sheet Y was prepared under the same conditions as in the comparative example. The room temperature electric resistivity of the adhesive sheet Y was 4 × 10 −3 Ω · cm, and the shear adhesive strength σ was σ = 80 kPa. The pressure-sensitive adhesive sheet Y had improved conductivity, but its adhesiveness was remarkably inferior, so that it was not possible to wrap and hold the shielded electric wire and it was unusable.
【００２３】（第３比較例）第１実施例と同様の粘着剤
を用い、フィラーとしてＰＡＮ系炭素繊維のミルド品
（東レ株式会社製、トレカＴ−３００ ＭＬＤ３００、
直径７μｍ、長さ３００μｍ）を６０重量％添加して、
第１比較例と同条件で粘着シートＺを作成した。粘着シ
ートＺの室温電気抵抗率は、７×１０-1Ω・ｃｍであ
り、せん断接着力σは、σ＝７０ｋＰａであった。粘着
シートＺは粘着力が劣るため使用不能であった。(Third Comparative Example) The same adhesive as in the first example was used, and a PAN-based carbon fiber milled product (Toray Industries, Inc., Torayca T-300 MLD300,
(Diameter 7 μm, length 300 μm) 60% by weight,
Adhesive sheet Z was prepared under the same conditions as in the first comparative example. The room temperature electric resistivity of the pressure-sensitive adhesive sheet Z was 7 × 10 −1 Ω · cm, and the shear adhesive strength σ was σ = 70 kPa. The pressure-sensitive adhesive sheet Z could not be used because of its poor adhesion.
【００２４】（第４比較例）第１実施例と同様の粘着剤
を用い、導電性フィラーとしてカーボンブラック（ライ
オンアクゾ株式会社製、Ｋｅｔｊｅｎｂｌａｃｋ Ｅ
Ｃ、粒径４０ｎｍ以下）を４０重量％添加して、導電性
粘着シートの製造を試みたが、粘着剤組成物の年度が高
くなり、シートの製造は不可能であった。(Fourth Comparative Example) Carbon black (Ketjenblack E manufactured by Lion Akzo Co., Ltd.) was used as a conductive filler using the same adhesive as in the first example.
C, a particle size of 40 nm or less) was added in an amount of 40% by weight, and an attempt was made to produce a conductive pressure-sensitive adhesive sheet.
【００２５】[0025]
【発明の効果】本発明の導電性粘着テープは、粘着剤組
成物中に導電性フィラーを分散含有しているため、電気
抵抗率が低くかつ粘着力が優れている。そのため、シー
ルド電線の非シールド部等を被覆することにより、確実
な電磁波シールドを行うことができると共に、被覆作業
が容易であり作業性および電気的信頼性が著しく向上す
るなどの多大な利点を有する。The conductive pressure-sensitive adhesive tape of the present invention has a low electric resistivity and an excellent adhesive force because the conductive filler is dispersed and contained in the pressure-sensitive adhesive composition. Therefore, by covering the non-shielded portion of the shielded electric wire, etc., it is possible to perform a reliable electromagnetic wave shield, and there are great advantages that the covering work is easy and workability and electrical reliability are significantly improved. .
【図１】本発明の実施例に係わる導電性粘着シートを示
す断面図である。FIG. 1 is a cross-sectional view showing a conductive pressure-sensitive adhesive sheet according to an example of the present invention.
【図２】図１の導電性粘着シートを用いてシールド電線
の端末部を被覆する工程を示す説明図である。FIG. 2 is an explanatory view showing a process of covering the end portion of the shielded electric wire with the conductive adhesive sheet of FIG.
【図３】図１の導電性粘着シートを用いてシールド電線
のジョイント部を被覆する工程を示す説明図である。FIG. 3 is an explanatory view showing a process of covering a joint portion of a shielded electric wire using the conductive adhesive sheet of FIG.
【図４】シールド電線のジョイント部の接続状態を示す
説明図である。FIG. 4 is an explanatory diagram showing a connection state of a joint portion of a shielded electric wire.
【図５】図４のシールド電線のジョイント部を図１の導
電性粘着シートで被覆する工程を示す説明図である。5 is an explanatory view showing a step of covering the joint portion of the shielded electric wire of FIG. 4 with the conductive adhesive sheet of FIG.
【図６】従来のシールド電線の端末部を示す説明図であ
る。FIG. 6 is an explanatory view showing a terminal portion of a conventional shielded electric wire.
【図７】従来のシールド電線のジョイント部を示す説明
図である。FIG. 7 is an explanatory diagram showing a joint portion of a conventional shielded electric wire.
【図８】従来のシールド電線の端末部に導電性の収縮チ
ューブを被覆した例を示す説明図である。FIG. 8 is an explanatory view showing an example in which a terminal portion of a conventional shielded wire is covered with a conductive shrinkable tube.
Ａ 導電性粘着シート １ 導電性粘着剤層 ２ 基材フィルム A conductive adhesive sheet 1 conductive adhesive layer 2 base film
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０９Ｊ 7/02 ＪＫＫ Ｃ０９Ｊ 7/02 ＪＫＫ ＪＬＨ ＪＬＨ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C09J 7/02 JKK C09J 7/02 JKK JLH JLH
Claims (4)
はゴム系の粘着剤組成物中に導電性フィラーを１０〜９
０重量％分散含有する導電性粘着剤層を形成してなるこ
とを特徴とする導電性粘着シート。1. A conductive resin-containing adhesive composition containing 10 to 9 conductive fillers on one surface of a base film.
A conductive pressure-sensitive adhesive sheet comprising a conductive pressure-sensitive adhesive layer containing 0% by weight dispersed therein.
下、長さ５０μｍ以下の微細な繊維状である請求項１記
載の導電性粘着シート。2. The conductive pressure-sensitive adhesive sheet according to claim 1, wherein the shape of the conductive filler is a fine fiber having a diameter of 5 μm or less and a length of 50 μm or less.
アルミニウム、ニッケル、銀より選択された少なくとも
１種からなる繊維、粒子、バルクである請求項１または
請求項２記載の導電性粘着シート。3. The conductive filler is copper, stainless steel,
The conductive pressure-sensitive adhesive sheet according to claim 1 or 2, which is a fiber, particles, or a bulk made of at least one selected from aluminum, nickel, and silver.
炭素繊維、黒鉛粉末より選択された少なくとも１種であ
る請求項１または請求項２記載の導電性粘着シート。4. The conductive filler is carbon black,
The conductive pressure-sensitive adhesive sheet according to claim 1 or 2, which is at least one selected from carbon fiber and graphite powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7075953A JPH08274489A (en) | 1995-03-31 | 1995-03-31 | Conductive adhesive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7075953A JPH08274489A (en) | 1995-03-31 | 1995-03-31 | Conductive adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08274489A true JPH08274489A (en) | 1996-10-18 |
Family
ID=13591105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7075953A Withdrawn JPH08274489A (en) | 1995-03-31 | 1995-03-31 | Conductive adhesive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08274489A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11195892A (en) * | 1997-12-26 | 1999-07-21 | Suzutora:Kk | Electromagnetic wave shielding screen |
| JP2006348236A (en) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | Substrate-less double sided adhesive tape |
| JP2006348234A (en) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | Pressure-sensitive adhesive tape |
| WO2013034005A1 (en) * | 2011-09-07 | 2013-03-14 | 港易有限公司 | Anti-radiation laminated plate for electronic device and method for embedding laminated plate into housing |
| CN102984929A (en) * | 2011-09-07 | 2013-03-20 | 港易有限公司 | Radiation-proof laminate for electronic devices and method for embedding the same into a case |
| JP2013173852A (en) * | 2012-02-24 | 2013-09-05 | Denki Kagaku Kogyo Kk | Conductive adhesive sheet, and method of manufacturing electronic component |
| CN103305185A (en) * | 2013-06-08 | 2013-09-18 | 西北工业大学 | Method for preparing reduced-oxidized graphene/Fe3O4/Ag nano composite wave-absorbing material |
| CN103305184A (en) * | 2013-06-08 | 2013-09-18 | 西北工业大学 | Method for preparing reduced-oxidized graphene/Cu2O/Cu quantum dot ternary wave-absorbing material |
| JP2017082146A (en) * | 2015-10-30 | 2017-05-18 | 東洋インキＳｃホールディングス株式会社 | Conductive adhesive and method for producing the same |
| JP2018134779A (en) * | 2017-02-21 | 2018-08-30 | 日立化成株式会社 | Multilayer resin sheet, method for producing multilayer resin sheet, multilayer resin sheet cured product, multilayer resin sheet laminate, and multilayer resin sheet laminate cured product |
| CN114736620A (en) * | 2022-06-15 | 2022-07-12 | 深圳市卓汉材料技术有限公司 | Shielding adhesive tape, preparation method thereof and shielding structure |
-
1995
- 1995-03-31 JP JP7075953A patent/JPH08274489A/en not_active Withdrawn
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11195892A (en) * | 1997-12-26 | 1999-07-21 | Suzutora:Kk | Electromagnetic wave shielding screen |
| JP2006348236A (en) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | Substrate-less double sided adhesive tape |
| JP2006348234A (en) * | 2005-06-20 | 2006-12-28 | Fujicopian Co Ltd | Pressure-sensitive adhesive tape |
| JP4505583B2 (en) * | 2005-06-20 | 2010-07-21 | フジコピアン株式会社 | Substrate-less double-sided adhesive tape used for die-cutting |
| JP4505582B2 (en) * | 2005-06-20 | 2010-07-21 | フジコピアン株式会社 | Pressure sensitive adhesive tape for punching |
| CN102984929B (en) * | 2011-09-07 | 2015-07-08 | 港易有限公司 | Radiation-proof laminate for electronic devices and method for embedding the same into a case |
| CN102984929A (en) * | 2011-09-07 | 2013-03-20 | 港易有限公司 | Radiation-proof laminate for electronic devices and method for embedding the same into a case |
| WO2013034005A1 (en) * | 2011-09-07 | 2013-03-14 | 港易有限公司 | Anti-radiation laminated plate for electronic device and method for embedding laminated plate into housing |
| JP2013173852A (en) * | 2012-02-24 | 2013-09-05 | Denki Kagaku Kogyo Kk | Conductive adhesive sheet, and method of manufacturing electronic component |
| CN103305185A (en) * | 2013-06-08 | 2013-09-18 | 西北工业大学 | Method for preparing reduced-oxidized graphene/Fe3O4/Ag nano composite wave-absorbing material |
| CN103305184A (en) * | 2013-06-08 | 2013-09-18 | 西北工业大学 | Method for preparing reduced-oxidized graphene/Cu2O/Cu quantum dot ternary wave-absorbing material |
| CN103305185B (en) * | 2013-06-08 | 2014-07-02 | 西北工业大学 | Method for preparing reduced-oxidized graphene/Fe3O4/Ag nano composite wave-absorbing material |
| CN103305184B (en) * | 2013-06-08 | 2014-07-02 | 西北工业大学 | Method for preparing reduced-oxidized graphene/Cu2O/Cu quantum dot ternary wave-absorbing material |
| JP2017082146A (en) * | 2015-10-30 | 2017-05-18 | 東洋インキＳｃホールディングス株式会社 | Conductive adhesive and method for producing the same |
| JP2018134779A (en) * | 2017-02-21 | 2018-08-30 | 日立化成株式会社 | Multilayer resin sheet, method for producing multilayer resin sheet, multilayer resin sheet cured product, multilayer resin sheet laminate, and multilayer resin sheet laminate cured product |
| CN114736620A (en) * | 2022-06-15 | 2022-07-12 | 深圳市卓汉材料技术有限公司 | Shielding adhesive tape, preparation method thereof and shielding structure |
| CN114736620B (en) * | 2022-06-15 | 2022-11-15 | 深圳市卓汉材料技术有限公司 | Shielding adhesive tape, preparation method thereof and shielding structure |
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