JPH08264946A - Ceramic multilayer board and manufacture thereof - Google Patents
Ceramic multilayer board and manufacture thereofInfo
- Publication number
- JPH08264946A JPH08264946A JP6231295A JP6231295A JPH08264946A JP H08264946 A JPH08264946 A JP H08264946A JP 6231295 A JP6231295 A JP 6231295A JP 6231295 A JP6231295 A JP 6231295A JP H08264946 A JPH08264946 A JP H08264946A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- alignment
- layer
- notches
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、焼成後の基板に印刷等
の後工程を行う際の位置合せ精度を向上したセラミック
多層基板及びその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic multilayer substrate and a method for producing the same, which has improved alignment accuracy when a post-process such as printing is performed on the substrate after firing.
【０００２】[0002]
【従来の技術】従来より、複数枚のグリーンシートを積
層・焼成して製造されるセラミック多層基板において
は、基板表面の導体パターン等をグリーンシート積層体
と同時に焼成する同時焼成タイプもあるが、グリーンシ
ート積層体の焼成後の後工程で、基板表面に導体・抵抗
体等を印刷・焼成したり、抵抗体等のトリミングやショ
ートオープン検査等の電気的品質検査を行う後付けタイ
プもある。この後付けタイプでは、基板表面に印刷等の
後工程を行う際に、基板を正確に位置合せする必要があ
り、そのために、一般に、図５に示すように、基板１の
隣接する２辺の端縁を位置合せ用の基準とし、これを位
置合せ台２上で３本の位置合せピン３に当接させること
で、基板を位置合せするようにしている。2. Description of the Related Art Conventionally, in a ceramic multilayer substrate manufactured by laminating and firing a plurality of green sheets, there is a simultaneous firing type in which a conductor pattern on the substrate surface is fired at the same time as the green sheet laminate. There is also a retrofit type in which conductors, resistors, etc. are printed and fired on the surface of the substrate in a post-process after firing the green sheet laminate, and electrical quality inspections such as trimming of resistors and a short open inspection are performed. In this post-mounting type, when performing a post-process such as printing on the surface of the substrate, it is necessary to accurately align the substrate. Therefore, as shown in FIG. 5, in general, as shown in FIG. The edge is used as a reference for alignment, and the substrates are aligned by bringing them into contact with the three alignment pins 3 on the alignment table 2.
【０００３】[0003]
【発明が解決しようとする課題】ところで、図６に示す
ように、焼成後の基板１に導体パターン４を印刷する場
合、基板１の各層（グリーンシート５）を上下に導通さ
せるビア６と導体パターン４とが（ａ）のように正確に
重なり合う必要がある。しかし、焼成前のグリーンシー
ト５は柔らかく可塑性があるので、積層時に（ｂ）に示
すように積層ずれが生じてしまったり、或は、（ｃ）に
示すように外周切断線（スナップライン）がずれてしま
まうことがある。また、スナップラインがずれていなく
ても、（ｄ）に示すように、焼成後にスナップラインで
切断する際にバリ７が出来てしまうことがある。これら
（ｂ）〜（ｄ）のいずれの場合でも、正常な場合（ａ）
と比較して、基板位置合せ時に位置合せピン３（基板端
縁）とビア６との間の距離Ｂがずれるため、位置合せピ
ン（基板端縁）を基準にしてそこから一定距離Ａの位置
に印刷する導体パターン４がビア６からずれた位置に印
刷されてしまい、接続不良品となることがある。By the way, as shown in FIG. 6, when a conductor pattern 4 is printed on a substrate 1 after firing, a via 6 and a conductor for vertically connecting each layer (green sheet 5) of the substrate 1 to each other. It is necessary to exactly overlap the pattern 4 as shown in (a). However, since the green sheet 5 before firing is soft and has plasticity, a stacking deviation may occur at the time of stacking as shown in (b), or an outer peripheral cutting line (snap line) as shown in (c). It may be left out of alignment. Even if the snap line is not displaced, as shown in (d), a burr 7 may be formed when the snap line is cut after firing. In any of these cases (b) to (d), normal case (a)
Compared with the above, since the distance B between the alignment pin 3 (substrate edge) and the via 6 shifts when the substrate is aligned, the position of a constant distance A from the alignment pin (substrate edge) is used as a reference. The conductor pattern 4 to be printed on the printed circuit board may be printed at a position displaced from the via 6, resulting in a defective connection product.
【０００４】特に、近年のように小型・高密度実装が進
むと、益々高い位置合せ精度が要求され、現在では、高
精度ＣＣＤカメラを用いて基板の位置を画像処理により
認識して位置合わせする装置も実用化されているが、こ
の装置は非常に高価であり、コストアップ要因となる欠
点がある。In particular, as miniaturization and high-density mounting have advanced in recent years, higher and higher alignment accuracy is required, and nowadays, a high-precision CCD camera is used to recognize the position of a substrate by image processing for alignment. Although the device has been put into practical use, this device is very expensive and has the drawback of increasing the cost.
【０００５】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、位置合せピンを用い
て基板の位置合せを精度良く行うことができて、品質向
上・歩留り向上を達成することができるセラミック多層
基板及びその製造方法を提供することにある。The present invention has been made in view of the above circumstances, and an object thereof is to accurately align a substrate by using alignment pins, thereby improving quality and yield. It is an object of the present invention to provide a ceramic multilayer substrate that can be achieved and a manufacturing method thereof.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明の請求項１は、複数枚のグリーンシートを積
層・焼成して成る、表面に配線を有するセラミック多層
基板において、基板端縁に複数の表面位置合せ用の切欠
部を形成し、各表面位置合せ用の切欠部を、表面層の凹
みより他の層の方が深く凹んだ段差状に形成している。In order to achieve the above object, the first aspect of the present invention provides a ceramic multi-layer substrate having wiring on the surface thereof, which is formed by laminating and firing a plurality of green sheets. A plurality of notches for surface alignment are formed on the edge, and each notch for surface alignment is formed in a step shape in which the other layer is deeper than the depression of the surface layer.
【０００７】また、本発明を両面配線のセラミック多層
基板に適用する場合には、請求項２のように、基板端縁
に複数の表面位置合せ用の切欠部と複数の裏面位置合せ
用の切欠部とを形成し、各表面位置合せ用の切欠部を、
表面層の凹みより他の層の方が深く凹んだ段差状に形成
し、各裏面位置合せ用の切欠部を、裏面層の凹みより他
の層の方が深く凹んだ段差状に形成すれば良い。When the present invention is applied to a ceramic multilayer substrate having double-sided wiring, a plurality of notches for front surface alignment and a plurality of notches for rear surface alignment are provided at the edge of the substrate. And a notch for each surface alignment,
If the other layer is formed deeper than the depression of the surface layer, and the notch for each back surface alignment is formed deeper than the depression of the back surface layer good.
【０００８】このようなセラミック多層基板を製造する
場合には、請求項３のように、前記各切欠部を形成する
ための穴を、グリーンシートにビアホール等を形成する
際に同時に形成し、且つ、表面層又は裏面層に積層され
るグリーンシートの切欠部形成用の穴を他の層に積層さ
れるグリーンシートの切欠部形成用の穴よりも切断線か
ら基板内側への奥行きが小さくなるように形成し、該グ
リーンシートの積層後又は焼成後に、該積層体を前記穴
を分割するように切断することで、前記各切欠部を形成
し、焼成された基板の複数の切欠部を複数の位置合せピ
ンに嵌合させることで、該基板を位置合せして印刷等の
後工程を行うようにすれば良い。In the case of manufacturing such a ceramic multilayer substrate, the holes for forming the notches are formed at the same time when the via holes and the like are formed in the green sheet, and , The depth of the cutout portion of the green sheet laminated on the front surface layer or the back surface layer from the cutting line to the inside of the substrate is smaller than that of the cutout portion formation hole of the green sheet laminated on another layer. To form each of the notches by cutting the laminate so as to divide the holes after the green sheets are laminated or after firing, and the plurality of notches of the fired substrate are formed into a plurality of notches. The substrate may be aligned by fitting with the alignment pin to perform a post process such as printing.
【０００９】[0009]
【作用】上述した請求項１の構成によれば、基板の位置
合せ時には、基板端縁に形成された複数の表面位置合せ
用の切欠部を位置合せピンに嵌合させることにより基板
の位置合せを行う。この際、各表面位置合せ用の切欠部
は、表面層の凹みより他の層の方が深く凹んだ段差状に
形成されているので、基板位置合せ時には基板の表面層
の切欠部内縁が位置合せピンに必ず当接した状態となっ
て、常に表面層の切欠部内縁を基準にした位置合せが可
能となり、前述した積層ずれ、外周切断線（スナップラ
イン）のずれやバリの影響を受けずに済む。更に、切欠
部を、グリーンシートにビアホール等を形成する際に同
時に形成すれば、基板焼成後の後工程の位置合せで最も
必要な位置精度である表面層のビアと位置合せピン（切
欠部）との間の位置精度を正確に確保できると共に、工
程数も増えずに済む。According to the above-mentioned structure of the first aspect, when the substrates are aligned, the plurality of surface alignment notches formed on the edge of the substrate are fitted to the alignment pins to align the substrates. I do. At this time, since the notches for each surface alignment are formed in a step shape in which the other layers are deeper than the depressions in the surface layer, the inner edge of the notch in the surface layer of the substrate is positioned when the substrate is aligned. It is always in contact with the alignment pin, and it is always possible to perform alignment based on the inner edge of the notch of the surface layer, and it is not affected by the above-mentioned stacking deviation, deviation of the outer peripheral cutting line (snap line), and burr. Complete. Furthermore, if the cutouts are formed at the same time when the via holes are formed in the green sheet, the vias and the alignment pins (cutouts) of the surface layer, which are the most necessary positional accuracy in the post-process alignment after firing the substrate. It is possible to accurately secure the positional accuracy between and, and the number of steps does not increase.
【００１０】また、請求項２のように、両面配線のセラ
ミック多層基板の場合には、基板端縁に、表面位置合せ
用の切欠部と、これとは表裏反対の関係になる裏面位置
合せ用の切欠部とを形成し、基板表面に印刷等を行う場
合には、請求項１の場合と同じく、表面位置合せ用の切
欠部を位置合せピンに嵌合し、基板裏面に印刷等を行う
場合には、裏面位置合せ用の切欠部を位置合せピンに嵌
合する。この裏面位置合せ用の切欠部は、裏面層の凹み
より他の層の方が深く凹んだ段差状になっているので、
裏面位置合せ時には基板の裏面層の切欠部の内縁が位置
合せピンに必ず当接した状態となり、常に裏面層の切欠
部を基準にした正確な位置合せが可能となる。In the case of a ceramic multilayer substrate having double-sided wiring as in claim 2, a notch for front surface alignment is provided at the edge of the substrate, and a back alignment is provided in a relationship opposite to the front and back. In the case of forming a notch portion and printing on the front surface of the substrate, the notch for front surface alignment is fitted to the alignment pin and printing is performed on the back surface of the substrate, as in the case of claim 1. In this case, the notch for rear surface alignment is fitted to the alignment pin. Since the notch for the back surface alignment has a stepped shape in which the other layers are deeper than the depressions in the back surface layer,
When the back surface is aligned, the inner edge of the cutout portion of the back surface layer of the substrate is always in contact with the alignment pin, and accurate alignment can always be performed with reference to the cutout portion of the back surface layer.
【００１１】以上のようなセラミック多層基板を製造す
る場合、請求項３の製造方法では、各切欠部を形成する
ための穴を、グリーンシートにビアホール等を形成する
際に同時に形成することで、ビアホールと切欠部形成用
の穴とを常に一定の位置関係で形成する。この際、表面
層又は裏面層に積層されるグリーンシートの切欠部形成
用の穴を他の層に積層されるグリーンシートの切欠部形
成用の穴よりも切断線から基板内側への奥行きが小さく
なるように形成し、これらのグリーンシートを積層した
ときに、表面層又は裏面層の切欠部形成用の小さな穴が
他の層の大きな穴に重なり合うようにする。そして、グ
リーンシートの積層後又は焼成後に、該積層体を前記穴
を分割するように切断することで、各切欠部を形成す
る。この際、焼成後に基板の切断を行う場合には、焼成
前にグリーンシート積層体に切欠部形成用の穴を通るス
ナップライン（切断線）をプレス成形し、焼成後にスナ
ップラインに沿って折り割れば良い。このようにして製
造されたセラミック多層基板は、前述した請求項１又は
２の構成となり、基板の切欠部を位置合せピンに嵌合さ
せることで、基板を精度良く位置合せして印刷等の後工
程を行う。When the ceramic multilayer substrate as described above is manufactured, in the manufacturing method of claim 3, the holes for forming the notches are formed at the same time when the via holes and the like are formed in the green sheet. The via hole and the hole for forming the notch are always formed in a fixed positional relationship. At this time, the depth of the notch forming hole of the green sheet laminated on the front surface layer or the back surface layer from the cutting line to the inside of the substrate is smaller than that of the notch forming hole of the green sheet laminated on another layer. When these green sheets are laminated, the small holes for forming the notches in the front surface layer or the back surface layer overlap the large holes in the other layers. Then, after the green sheets are laminated or after firing, the laminated body is cut so as to divide the holes to form each notch. At this time, when the substrate is cut after firing, snap lines (cutting lines) that pass through the holes for forming the notches are press-formed in the green sheet laminate before firing, and after firing, the snap lines are broken along the snap lines. Good. The ceramic multilayer substrate manufactured in this manner has the structure of claim 1 or 2 described above, and by fitting the notch of the substrate to the alignment pin, the substrate is accurately aligned and printed after printing. Carry out the process.
【００１２】[0012]
【実施例】以下、本発明の一実施例を図１乃至図４に基
づいて説明する。まず、図１及び図２に基づいてセラミ
ック多層基板（以下「基板」と略称する）１１の構成を
説明する。図１に示すように、基板１１の隣接する２辺
の端縁には表面位置合せ用の切欠部１２が合計３個形成
され、残りの２辺の端縁には、表面位置合せ用の切欠部
１２と表裏反対の関係になる裏面位置合せ用の切欠部１
３が合計３個形成されている。表面位置合せ用の切欠部
１２は、表面層の凹みより他の層の方が例えば０．１ｍ
ｍ以上深く凹んだ段差状に形成され、位置合せピン１４
に嵌合したときに、表面層の切欠部１２内縁が位置合せ
ピン１４に必ず当接した状態となるようになっている。
一方、裏面位置合せ用の切欠部１３は、裏面層の凹みよ
り他の層の方が例えば０．１ｍｍ以上深く凹んだ段差状
に形成され、裏面位置合せ時には裏面層の切欠部１３内
縁が位置合せピン１４に必ず当接した状態となるように
なっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. First, the structure of a ceramic multilayer substrate (hereinafter abbreviated as “substrate”) 11 will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, a total of three notches 12 for surface alignment are formed on the edges of two adjacent sides of the substrate 11, and a notch for surface alignment is formed on the other two edges. Notch 1 for rear surface alignment in which the front and back of the portion 12 are in opposite relation
3 are formed in total. The notch 12 for surface alignment is, for example, 0.1 m in the other layer than in the depression of the surface layer.
Alignment pin 14 is formed in the shape of a step recessed deeper than m.
The inner edge of the cutout portion 12 of the surface layer is always in contact with the alignment pin 14 when fitted to.
On the other hand, the notch 13 for the back surface alignment is formed in a step shape in which the other layer is deeper than the depression of the back surface layer by, for example, 0.1 mm or more, and the inner edge of the notch 13 of the back surface layer is positioned when the back surface is aligned. The mating pin 14 is always in contact with the mating pin 14.
【００１３】上記基板１１は、図２（ａ）に示すよう
に、従来同様、複数枚のグリーンシート１５を積層・焼
成して製造され、各グリーンシート１５には、多数のビ
アホール１６が打抜き型やパンチングマシーン等で打ち
抜き形成され、このビアホール１６の内部に導体材料を
充填してビア１７が形成されている。また、基板１１の
内層には、積層前にグリーンシート１５に印刷された導
体，誘電体等の内層パターン１８（図４参照）が設けら
れている。基板１１の表面層及び裏面層には、基板焼成
後に導体パターン１９（図２に表面層の導体のみ図示、
裏面層の導体は図６に符号「４」で図示）が印刷・焼成
され、その印刷時の位置合せは、位置合せ台２５上で３
箇所の切欠部１２（又は１３）を３本の位置合せピン１
４に嵌合することによって行われる。As shown in FIG. 2A, the substrate 11 is manufactured by laminating and firing a plurality of green sheets 15 as in the conventional case, and a large number of via holes 16 are punched in each green sheet 15. By punching with a punching machine or the like, the via hole 16 is filled with a conductive material to form a via 17. Further, the inner layer of the substrate 11 is provided with an inner layer pattern 18 (see FIG. 4) such as a conductor or a dielectric printed on the green sheet 15 before being laminated. On the front surface layer and the back surface layer of the substrate 11, conductor patterns 19 (only the conductors of the surface layer are shown in FIG.
The conductor of the back surface layer is printed and fired with reference numeral "4" in FIG. 6, and the alignment at the time of printing is 3 on the alignment table 25.
The notch 12 (or 13) at the location is provided with three alignment pins 1
4 by fitting.
【００１４】次に、上記構成の基板１１を低温焼成（１
０００℃以下で焼成）する場合の製造方法の一例を図３
及び図４を用いて説明する。ここで使用するグリーンシ
ート１５の作り方は、ＣａＯ−Ａｌ2 Ｏ3 −ＳｉＯ2 −
Ｂ2 Ｏ3 系のガラス粉末６０ｗｔ％とアルミナ粉末４０
ｗｔ％とを混合した粉体に、可塑剤（例えばＤＯＰ）、
バインダー（例えばアクリル樹脂）、溶剤（トルエン、
キシレン、アルコール類）を加え、十分に混練して粘度
２０００〜４００００ｃｐｓのスラリーを作成し、ドク
ターブレード法によって例えば０．３ｍｍ厚の低温焼成
用のグリーンシートを形成する。Next, the substrate 11 having the above structure is baked at low temperature (1
FIG.
And FIG. 4 will be described. How to make a green sheet 15 used here, CaO-Al 2 O 3 -SiO 2 -
B 2 O 3 based glass powder 60 wt% and alumina powder 40
powder mixed with wt%, plasticizer (eg DOP),
Binder (eg acrylic resin), solvent (toluene,
(Xylene, alcohols) are added and sufficiently kneaded to prepare a slurry having a viscosity of 2000 to 40000 cps, and a doctor blade method is used to form a green sheet for low-temperature firing having a thickness of 0.3 mm, for example.
【００１５】この後、打抜き型やパンチングマシーン等
を用いて、グリーンシート１５の所定位置に０．０５〜
１．００ｍｍφ程度の多数のビアホール１６と、４個の
ガイド穴２０及び６個の切欠部形成用の角穴２１，２２
を同時に打ち抜き形成する。ここで、ガイド穴２０は、
グリーンシート１５の四隅部にそれぞれ形成され、グリ
ーンシート１５上のパターン印刷や積層の際に、このガ
イド穴２０にガイドピン（図示せず）を挿通することで
各層のグリーンシート１５が位置決めされる。また、切
欠部形成用の角穴２１，２２は、積層後に切断される線
２３上に位置し、最終的に切欠部１２，１３となる。図
３（ａ）及び（ｄ）に示すように、表面層と裏面層とな
るグリーンシート１５には、小さな角穴２１とこれより
例えば０．１ｍｍ以上大きな角穴２２がそれぞれ対称位
置に３個ずつ形成され、表面層と裏面層とでは大小の角
穴２２，２１の位置関係が反対になっている。また、図
３（ｂ）及び（ｃ）に示すように、内層となるグリーン
シート１５には、大きな角穴２２のみが合計６個形成さ
れている。各グリーンシート１５に形成する合計６個の
角穴２１，２２は同じ位置に形成され、各グリーンシー
ト１５を積層したときに、角穴２１，２２で上下に貫通
する貫通孔を形成すると共に、表面層と裏面層ではそれ
ぞれ３個の小さな角穴２１が他の層の大きな角穴２２に
重なり合った状態となる。After that, using a punching die, a punching machine or the like, the green sheet 15 is moved to a predetermined position by 0.05 to
A large number of via holes 16 of about 1.00 mmφ, four guide holes 20 and six square holes 21 and 22 for forming notches.
Are punched and formed at the same time. Here, the guide hole 20 is
The green sheets 15 are formed at the four corners of the green sheet 15, respectively, and at the time of pattern printing or lamination on the green sheet 15, by inserting guide pins (not shown) into the guide holes 20, the green sheets 15 of each layer are positioned. . Further, the rectangular holes 21 and 22 for forming the cutout portions are located on the line 23 that is cut after the lamination, and finally become the cutout portions 12 and 13. As shown in FIGS. 3 (a) and 3 (d), the green sheet 15 serving as the front surface layer and the back surface layer has three small square holes 21 and three square holes 22 larger than this, for example, 0.1 mm or more at symmetrical positions. The front and back layers are opposite to each other in the positional relationship of the large and small square holes 22 and 21. In addition, as shown in FIGS. 3B and 3C, only six large square holes 22 are formed in the green sheet 15 as an inner layer. A total of 6 square holes 21 and 22 formed in each green sheet 15 are formed at the same position, and when each green sheet 15 is stacked, a through hole that vertically penetrates the square holes 21 and 22 is formed, and In each of the front surface layer and the back surface layer, three small square holes 21 are overlapped with large square holes 22 of the other layer.
【００１６】上述したようにして各層のグリーンシート
１５にビアホール１６、ガイド穴２０及び切欠部形成用
の角穴２１，２２を同時に打ち抜き形成した後、層間を
電気的に接続できるように、各グリーンシート１５のビ
アホール１６にＡｇ系導体材料を充填する。この後、図
４（ａ）に示すように、内層及び裏面層の各グリーンシ
ート１５上に、内層パターン１８をＡｇ、Ａｇ−Ｐｄ、
Ａｇ−Ｐｔ、Ａｇ−Ｐｄ−Ｐｔ等の導体材料ペーストを
使用してスクリーン印刷した後、各グリーンシート１５
を積層し、この積層体を、例えば８０〜１５０℃、５０
〜２５０ｋｇ／ｃｍ2 の条件で熱圧着して一体化する。
上述した内層パターン１８の印刷と積層の際のグリーン
シート１５の位置決めは、グリーンシート１５の四隅部
のガイド穴２０にガイドピン（図示せず）を挿通するこ
とで行われる。上述のようにして熱圧着された積層体を
切断線２３に沿って切断する。この切断により、各角穴
２１，２２が分割され、切欠部１２，１３となる。この
積層体を電気式連続ベルト炉を使用して、空気中で９０
０℃、２０分の保持条件で焼成し、セラミック多層基板
１１を作成する。After the via holes 16, the guide holes 20, and the rectangular holes 21 and 22 for forming the cutouts are simultaneously punched and formed in the green sheet 15 of each layer as described above, each green layer can be electrically connected to each other. The via hole 16 of the sheet 15 is filled with an Ag-based conductor material. After that, as shown in FIG. 4A, the inner layer pattern 18 is formed of Ag, Ag-Pd, on each green sheet 15 of the inner layer and the back layer.
After screen printing using a conductor material paste such as Ag-Pt or Ag-Pd-Pt, each green sheet 15
Are laminated, and this laminated body is, for example, 80 to 150 ° C., 50
It is integrated by thermocompression bonding under the condition of 250 kg / cm 2 .
The positioning of the green sheet 15 at the time of printing and stacking the inner layer pattern 18 described above is performed by inserting guide pins (not shown) into the guide holes 20 at the four corners of the green sheet 15. The laminated body thermocompression-bonded as described above is cut along the cutting line 23. By this cutting, the square holes 21 and 22 are divided into cutout portions 12 and 13. This laminate was heated in air using an electric continuous belt furnace
The ceramic multilayer substrate 11 is prepared by firing at 0 ° C. for 20 minutes.
【００１７】この後、基板１１の表面に導体パターン１
９を印刷する場合には、図１及び図２に示すように、位
置合せ台２５上で表面位置合せ用の切欠部１２を位置合
せピン１４に嵌合して基板１１を該切欠部１２を基準に
して位置合せする。この場合、表面位置合せ用の切欠部
１２は、表面層の凹みより他の層の方が例えば０．１ｍ
ｍ以上深く凹んだ段差状になっているので、位置合せピ
ン１４に嵌合したときに、表面層の切欠部１２の内縁が
位置合せピン１４に必ず当接した状態となる。仮に、積
層ずれや切断線２３のずれが生じたり、或は切断部にバ
リがあったとしても、これらは表面層の切欠部１２の内
縁と位置合せピン１４との当接状態に何ら影響を与える
ことはなく、常に表面層の切欠部１２の内縁を基準にし
た位置合せが可能となる。しかも、切欠部１２となる角
穴２１を、グリーンシート１５にビアホール１６等を形
成する際に同時に打ち抜き形成するので、表面層のビア
１７と位置合せピン１４（表面層の切欠部１２の内縁）
との間の距離Ａ（図２参照）を常に一定にできて、基板
焼成後の後工程の位置合せで最も必要な表面層のビア１
７の位置合せ精度を極めて正確に確保できる。After that, the conductor pattern 1 is formed on the surface of the substrate 11.
9 is printed, as shown in FIGS. 1 and 2, the notch 12 for surface alignment is fitted to the alignment pin 14 on the alignment table 25 so that the substrate 11 is removed. Align with reference. In this case, the notch 12 for surface alignment is, for example, 0.1 m in the other layer than in the depression of the surface layer.
Since the stepped shape is deeply recessed by m or more, the inner edge of the cutout portion 12 of the surface layer is always in contact with the alignment pin 14 when the alignment pin 14 is fitted. Even if there is a stacking deviation, a deviation of the cutting line 23, or even if there is a burr at the cut portion, these have no effect on the contact state between the inner edge of the cutout 12 of the surface layer and the alignment pin 14. It is possible to perform the alignment based on the inner edge of the cutout portion 12 of the surface layer without providing the groove. Moreover, since the square hole 21 to be the cutout 12 is formed by punching at the same time when the via hole 16 and the like are formed in the green sheet 15, the via 17 of the surface layer and the alignment pin 14 (inner edge of the cutout 12 of the surface layer).
The distance A (see FIG. 2) between and can be always constant, and the via 1 of the surface layer most necessary for the post-process alignment after firing the substrate.
The positioning accuracy of 7 can be ensured extremely accurately.
【００１８】このようにして正確に位置合せされた基板
１１の表面に、Ａｕ系導体を使用して導体パターン１９
を印刷して焼成する。一方、基板１１の裏面に導体パタ
ーン１９を印刷する場合には、基板１１を裏返して、裏
面位置合せ用の切欠部１３を位置合せピン１４に嵌合し
て位置合せを行えば良い。つまり、裏面位置合せ用の切
欠部１３は、裏面層の凹みより他の層の方が例えば０．
１ｍｍ以上深く凹んだ段差状になっているので、裏面位
置合せ時には基板１１の裏面層の切欠部１３の内縁が位
置合せピン１４に必ず当接した状態となり、常に裏面層
の切欠部１３を基準にした正確な位置合せが可能とな
る。On the surface of the substrate 11 which is accurately aligned in this way, a conductor pattern 19 is formed using an Au-based conductor.
And print. On the other hand, when the conductor pattern 19 is printed on the back surface of the substrate 11, the substrate 11 may be turned upside down and the notch 13 for back surface alignment may be fitted to the alignment pin 14 to perform alignment. That is, the notch 13 for aligning the back surface has, for example, 0.
Since it has a stepped shape that is deeply recessed by 1 mm or more, the inner edge of the notch 13 in the back surface layer of the substrate 11 is always in contact with the alignment pin 14 when the back surface is aligned, and the notch 13 in the back surface layer is always used as a reference. Accurate alignment can be achieved.
【００１９】本発明者らは以上説明した製造方法により
基板１１を作製し、その基板１１の表面に導体パターン
１９を印刷・焼成して、導体パターン１９とビア１７と
の位置ずれによる不良発生率を評価した結果、図２
（ｂ）に示すように、常に導体パターン１９とビア１７
とが完全に重なり合った状態となり、不良発生率は０％
であった。The present inventors manufactured the substrate 11 by the above-described manufacturing method, printed and fired the conductor pattern 19 on the surface of the substrate 11, and the defect occurrence rate due to the positional deviation between the conductor pattern 19 and the via 17. As a result of evaluating
As shown in (b), the conductor pattern 19 and the via 17 are always provided.
Are completely overlapped with each other, and the failure rate is 0%
Met.
【００２０】これに対し、比較例として位置合せ用の切
欠部１２，１３の無い図５の形態の基板を製造し、その
基板の表面に導体パターンを印刷・焼成して、導体パタ
ーンとビアとの位置ずれによる不良発生率を評価した結
果、導体パターンがビアからずれたものがかなり出来て
しまい、不良発生率は１６％にもなった。On the other hand, as a comparative example, a substrate of the form of FIG. 5 without the notches 12 and 13 for alignment is manufactured, and a conductor pattern is printed and fired on the surface of the substrate to form conductor patterns and vias. As a result of evaluating the defect occurrence rate due to the positional deviation, the conductor pattern was considerably displaced from the via, and the defect occurrence rate reached 16%.
【００２１】以上の試験結果から明らかなように、本実
施例によれば、基板１１の端縁に位置合せ用の切欠部１
２，１３を段差状に形成することで、基板１１の位置合
せ精度を飛躍的に向上することができ、品質向上・歩留
り向上の要求を十分に満たすことができる。しかも、位
置合せピン１４を用いて基板１１の位置合せを行うこと
ができるため、基板１１の位置合せに高精度ＣＣＤカメ
ラ等を用いた高価な位置合せ装置を必要とせず、設備コ
スト低減の要求も満たすことができる。更に、位置合せ
用の切欠部１２，１３（角穴２１，２２）を、グリーン
シート１５にビアホール１６等を形成すると同時に形成
するようにしたので、製造工数も従来と同じであり、製
造能率も低下せずに済む。As is apparent from the above test results, according to the present embodiment, the notch 1 for alignment is provided on the edge of the substrate 11.
By forming steps 2 and 13 in a stepped manner, the alignment accuracy of the substrate 11 can be dramatically improved, and the requirements for quality improvement and yield improvement can be sufficiently satisfied. Moreover, since the substrate 11 can be aligned by using the alignment pins 14, an expensive alignment device using a high-precision CCD camera or the like is not required for the alignment of the substrate 11, and a reduction in equipment cost is required. Can also be met. Further, since the notches 12 and 13 for positioning (square holes 21 and 22) are formed at the same time when the via holes 16 and the like are formed in the green sheet 15, the number of manufacturing steps is the same as the conventional one, and the manufacturing efficiency is also the same. It does not decrease.
【００２２】ところで、位置合せ用の切欠部１２，１３
に代えて、位置合せ穴を基板１１に形成した場合、上記
実施例と比較して、位置合せピンを位置合せ穴に真上か
ら挿入する作業が面倒であるばかりか、位置合せピンの
挿入時に位置合せ穴の周縁が欠けてしまうおそれがあ
り、これが歩留りを悪くする原因となる。この点、上記
実施例では、穴ではなく、外側方に開放された切欠部１
２，１３であるので、位置合せピン１４との嵌合を外側
方から容易に行うことができて、切欠部１２，１３の周
縁が欠ける可能性は穴の場合と比較して遥かに小さくて
済む。By the way, the notches 12 and 13 for alignment are provided.
In the case where the alignment hole is formed in the substrate 11 instead of the above, compared to the above-described embodiment, the work of inserting the alignment pin into the alignment hole from directly above is not only troublesome, but also when the alignment pin is inserted. There is a possibility that the peripheral edge of the alignment hole may be chipped, which causes the yield to deteriorate. In this respect, in the above-described embodiment, the notch 1 opened outward rather than the hole.
Since it is 2 and 13, the fitting with the alignment pin 14 can be easily performed from the outer side, and the possibility that the peripheral edges of the cutouts 12 and 13 are chipped is much smaller than in the case of holes. I'm done.
【００２３】尚、上記実施例では、グリーンシート１５
の積層体から基板１１を切断する工程を焼成前に行うよ
うにしたが、これに限定されず、従来同様、焼成後の積
層体から基板１１を切断するようにしても良い。具体的
には、グリーンシート１５の積層後に、その積層体の表
面にスナップライン（切断用の溝）をプレス成形し、こ
れを焼成した後、該積層体をスナップラインで折り割る
ことにより、焼成後の積層体から基板１１を切断するも
のである。In the above embodiment, the green sheet 15 is used.
Although the step of cutting the substrate 11 from the laminated body is performed before firing, the present invention is not limited to this, and the substrate 11 may be cut from the laminated body after firing as in the conventional case. Specifically, after stacking the green sheets 15, snap lines (grooves for cutting) are press-molded on the surface of the laminated body, fired, and then the laminated body is broken by the snap lines to fire. The substrate 11 is cut from the later laminated body.
【００２４】また、上記実施例は、本発明を基板両面に
導体パターン等を後付けする両面配線のセラミック多層
基板に適用したものであるが、片面のみに導体パターン
等を後付けするセラミック多層基板に適用しても良く、
この場合には、上記実施例から裏面位置合せ用の切欠部
１３を無くせば良い。Further, although the above-described embodiment is applied to the ceramic multi-layer substrate of double-sided wiring in which conductor patterns and the like are retrofitted on both sides of the substrate, it is applied to the ceramic multi-layer substrate in which the conductor patterns and the like are retrofitted on only one side. You can
In this case, the notch 13 for aligning the back surface may be eliminated from the above embodiment.
【００２５】また、上記実施例は、本発明を低温焼成の
セラミック多層基板に適用したものであるが、アルミナ
多層基板等、他のセラミック材料で形成した多層基板に
も適用可能であることは言うまでもない。その他、本発
明は、位置合せ用の切欠部１２，１３の個数や位置或は
形状を必要に応じて適宜変更しても良い等、要旨を逸脱
しない範囲内で種々変更して実施できることは言うまで
もない。Further, although the above-described embodiments are applied to the ceramic multilayer substrate which is fired at a low temperature, it is needless to say that the present invention is also applicable to a multilayer substrate formed of other ceramic materials such as an alumina multilayer substrate. Yes. In addition, it is needless to say that the present invention can be implemented by variously changing it within the scope not departing from the gist such as the number, position, or shape of the notches 12 and 13 for alignment may be appropriately changed as necessary. Yes.
【００２６】[0026]
【発明の効果】以上の説明から明らかなように、本発明
の請求項１のセラミック多層基板によれば、基板の端縁
に形成された表面位置合せ用の切欠部は、表面層の凹み
より他の層の方が深く凹んだ段差状になっているので、
基板位置合せ時には基板の表面層の切欠部内縁が位置合
せピンに必ず当接した状態となり、常に表面層の切欠部
内縁を位置合せの基準にして、積層ずれ、外周切断線の
ずれやバリの影響を受けない高精度な位置合せを行うこ
とができ、品質向上・歩留り向上の要求を満たすことが
できる。しかも、位置合せピンを用いて基板の位置合せ
を行うことができるため、基板の位置合せに高精度ＣＣ
Ｄカメラ等を用いた高価な位置合せ装置を必要とせず、
設備コスト低減の要求も満たすことができる。As is apparent from the above description, according to the ceramic multilayer substrate of claim 1 of the present invention, the notch for surface alignment formed on the edge of the substrate is formed by the recess of the surface layer. Since the other layers are deeply stepped,
When aligning the substrate, the inner edge of the notch of the surface layer of the substrate always contacts the alignment pin, and always use the inner edge of the notch of the surface layer as the reference for alignment to prevent stacking deviation, deviation of the outer cutting line, and burrs. It is possible to perform highly accurate alignment without being affected, and it is possible to meet the demands for quality improvement and yield improvement. Moreover, since the board can be aligned using the alignment pins, the board can be aligned with high precision CC.
There is no need for an expensive alignment device using a D camera,
The demand for equipment cost reduction can also be satisfied.
【００２７】また、請求項２の構成では、基板端縁に、
表面位置合せ用の切欠部と、これとは表裏反対の関係に
なる裏面位置合せ用の切欠部とを形成したので、基板の
表裏両面に対して高い位置合せ精度で印刷等の後工程を
行うことができる。According to the second aspect of the invention, the edge of the substrate is
Since the notch for front surface alignment and the notch for back surface alignment, which is in the opposite relationship to the front and back, are formed, a post-process such as printing is performed on both front and back surfaces of the substrate with high alignment accuracy. be able to.
【００２８】更に、請求項３の製造方法では、各切欠部
を形成するための穴を、グリーンシートにビアホール等
を形成する際に同時に形成するようにしたので、ビアホ
ールと切欠部形成用の穴とを常に一定の位置関係で形成
することができて、基板焼成後の後工程の位置合せで最
も必要な表面層のビアの位置合せ精度を極めて正確に確
保できると共に、製造工数が全く増加せず、製造能率も
低下せずに済む利点がある。Further, in the manufacturing method according to the third aspect, the holes for forming the notches are formed at the same time when the via holes and the like are formed in the green sheet. Therefore, the holes for forming the via holes and the notches are formed. Can always be formed in a fixed positional relationship, and the positioning accuracy of the vias of the surface layer, which is the most necessary for the post-step positioning after firing the substrate, can be ensured extremely accurately, and the number of manufacturing steps can be increased at all. In addition, there is an advantage that the manufacturing efficiency does not decrease.
【図１】本発明の一実施例を示すもので、（ａ）はセラ
ミック多層基板の平面図、（ｂ）は（ａ）のＡ−Ａ’線
に沿って示す縦断面図である。1A and 1B show an embodiment of the present invention, in which FIG. 1A is a plan view of a ceramic multilayer substrate, and FIG. 1B is a vertical cross-sectional view taken along the line AA ′ of FIG.
【図２】（ａ）は切欠部と位置合せピンとの関係を示す
主要部の拡大縦断面図、（ｂ）は同平面図である。FIG. 2A is an enlarged vertical sectional view of a main part showing a relationship between a cutout part and an alignment pin, and FIG. 2B is a plan view of the same.
【図３】各層に積層されるグリーンシートのパンチング
工程後の状態を示す平面図である。FIG. 3 is a plan view showing a state of a green sheet laminated on each layer after a punching step.
【図４】印刷工程から焼成工程までの工程を説明する工
程図である。FIG. 4 is a process diagram illustrating a process from a printing process to a firing process.
【図５】（ａ）は従来の基板の位置合せ方法を説明する
ための基板の平面図、（ｂ）は同側面図である。5A is a plan view of a substrate for explaining a conventional substrate alignment method, and FIG. 5B is a side view of the same.
【図６】ビアと導体パターンとの間の位置ずれの原因を
説明する図である。FIG. 6 is a diagram illustrating a cause of positional displacement between a via and a conductor pattern.
１１…基板、１２…表面位置合せ用の切欠部、１３…裏
面位置合せ用の切欠部、１４…位置合せピン、１５…グ
リーンシート、１６…ビアホール、１７…ビア、１９…
導体パターン、２０…ガイド穴、２１，２２…角穴、２
３…切断線。11 ... Substrate, 12 ... Notch for front surface alignment, 13 ... Notch for back surface alignment, 14 ... Alignment pin, 15 ... Green sheet, 16 ... Via hole, 17 ... Via, 19 ...
Conductor pattern, 20 ... Guide hole, 21, 22 ... Square hole, 2
3 ... Cutting line.
Claims (3)
て成る、表面に配線を有するセラミック多層基板におい
て、基板端縁に複数の表面位置合せ用の切欠部が形成さ
れ、各前記表面位置合せ用の切欠部は、表面層の凹みよ
り他の層の方が深く凹んだ段差状に形成されていること
を特徴とするセラミック多層基板。1. A ceramic multi-layer substrate having wiring on the surface thereof, which is formed by stacking and firing a plurality of green sheets, and a plurality of notches for surface alignment are formed at an edge of the substrate, and each of the surface alignments is performed. The ceramic multi-layer substrate characterized in that the notch for use is formed in a step shape in which the other layers are deeper than the depressions in the surface layer.
て成る両面配線のセラミック多層基板において、基板端
縁に複数の表面位置合せ用の切欠部と複数の裏面位置合
せ用の切欠部とが形成され、各前記表面位置合せ用の切
欠部は、表面層の凹みより他の層の方が深く凹んだ段差
状に形成され、各前記裏面位置合せ用の切欠部は、裏面
層の凹みより他の層の方が深く凹んだ段差状に形成され
ていることを特徴とするセラミック多層基板。2. A ceramic multi-layer substrate having a double-sided wiring formed by stacking and firing a plurality of green sheets, wherein a plurality of notches for front surface alignment and a plurality of notches for rear surface alignment are provided at the edge of the substrate. The notch for each front surface alignment is formed in a stepped shape in which the other layer is deeper than the recess of the surface layer, and each notch for the back surface alignment is more than the recess of the back surface layer. A ceramic multi-layer substrate, wherein the other layers are formed in a stepped shape that is deeply recessed.
製造する方法であって、前記各切欠部を形成するための
穴を、前記グリーンシートにビアホール等を形成する際
に同時に形成し、且つ、表面層又は裏面層のグリーンシ
ートの切欠部形成用の穴を他の層に積層されるグリーン
シートの切欠部形成用の穴よりも切断線から基板内側へ
の奥行きが小さくなるように形成し、該グリーンシート
の積層後又は焼成後に、該積層体を前記穴を分割するよ
うに切断することで、前記各切欠部を形成し、焼成され
た基板の複数の切欠部を複数の位置合せピンに嵌合させ
ることで、該基板を位置合せして印刷等の後工程を行う
ようにしたことを特徴とするセラミック多層基板の製造
方法。3. The method for manufacturing a ceramic multilayer substrate according to claim 1, wherein the holes for forming the notches are formed at the same time when a via hole or the like is formed in the green sheet, and The holes for forming the notches in the green sheet on the front surface layer or the back surface layer are formed so that the depth from the cutting line to the inside of the substrate is smaller than the holes for forming the notches in the green sheet laminated on other layers. After the green sheets are laminated or after firing, the laminate is cut so as to divide the holes to form each of the notches, and the plurality of notches of the fired substrate are provided with a plurality of alignment pins. A method for manufacturing a ceramic multilayer substrate, characterized in that the substrates are aligned with each other and post-processes such as printing are performed by fitting the substrates to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6231295A JP3076215B2 (en) | 1995-03-22 | 1995-03-22 | Ceramic multilayer substrate and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6231295A JP3076215B2 (en) | 1995-03-22 | 1995-03-22 | Ceramic multilayer substrate and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08264946A true JPH08264946A (en) | 1996-10-11 |
| JP3076215B2 JP3076215B2 (en) | 2000-08-14 |
Family
ID=13196499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6231295A Expired - Lifetime JP3076215B2 (en) | 1995-03-22 | 1995-03-22 | Ceramic multilayer substrate and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3076215B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6903375B1 (en) | 1999-07-13 | 2005-06-07 | Matsushita Electric Industrial Co., Ltd. | Solid-state image device, camera using the same, and method of manufacturing the same |
| JP2005159094A (en) * | 2003-11-27 | 2005-06-16 | Kyocera Corp | Wiring board |
| JP2007123786A (en) * | 2005-10-31 | 2007-05-17 | Kyocera Kinseki Corp | Sheet substrate |
| JP2011096868A (en) * | 2009-10-30 | 2011-05-12 | Ngk Insulators Ltd | Processing method for green sheet and arrangement state judging method for prints |
| JP2013004580A (en) * | 2011-06-13 | 2013-01-07 | Ngk Spark Plug Co Ltd | Ceramic multilayer substrate |
| JP2014157864A (en) * | 2013-02-14 | 2014-08-28 | Kyocera Corp | Laminated substrate |
| WO2014148162A1 (en) * | 2013-03-19 | 2014-09-25 | 日産自動車株式会社 | Positioning method and positioning device |
-
1995
- 1995-03-22 JP JP6231295A patent/JP3076215B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6903375B1 (en) | 1999-07-13 | 2005-06-07 | Matsushita Electric Industrial Co., Ltd. | Solid-state image device, camera using the same, and method of manufacturing the same |
| JP2005159094A (en) * | 2003-11-27 | 2005-06-16 | Kyocera Corp | Wiring board |
| JP2007123786A (en) * | 2005-10-31 | 2007-05-17 | Kyocera Kinseki Corp | Sheet substrate |
| JP2011096868A (en) * | 2009-10-30 | 2011-05-12 | Ngk Insulators Ltd | Processing method for green sheet and arrangement state judging method for prints |
| JP2013004580A (en) * | 2011-06-13 | 2013-01-07 | Ngk Spark Plug Co Ltd | Ceramic multilayer substrate |
| JP2014157864A (en) * | 2013-02-14 | 2014-08-28 | Kyocera Corp | Laminated substrate |
| WO2014148162A1 (en) * | 2013-03-19 | 2014-09-25 | 日産自動車株式会社 | Positioning method and positioning device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3076215B2 (en) | 2000-08-14 |
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