JPH08253763A - Abrasive - Google Patents
AbrasiveInfo
- Publication number
- JPH08253763A JPH08253763A JP5877595A JP5877595A JPH08253763A JP H08253763 A JPH08253763 A JP H08253763A JP 5877595 A JP5877595 A JP 5877595A JP 5877595 A JP5877595 A JP 5877595A JP H08253763 A JPH08253763 A JP H08253763A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive
- cerium oxide
- hardness
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はシリカを主成分とする物
質の研磨に用いるための、酸化セリウム粒子とその他の
砥粒とからなる研磨材に関する。シリカを主成分とする
物質にはガラス、ガラス質からなる材質、シリカを主成
分とするセラミックス等があり、ガラスは例えばレン
ズ、フォトマスク等の光学分野、液晶表示用パネル、テ
レビのブラウン管、ハードディスク等の磁気記録用基
板、建材等に用いられ、又セラミックス材料は摺動部
材、配線用基板等に用いられる。従って、より詳しくは
本発明はこれらの産業分野で利用される製品を製造する
ために用いる研磨材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an abrasive material comprising cerium oxide particles and other abrasive particles, which is used for polishing a substance containing silica as a main component. Substances containing silica as a main component include glass, glass-based materials, and ceramics containing silica as a main component. Examples of the glass include optical fields such as lenses and photomasks, liquid crystal display panels, television cathode ray tubes, and hard disks. Etc. are used for magnetic recording substrates, building materials, etc., and ceramic materials are used for sliding members, wiring substrates, etc. Therefore, more particularly, the present invention relates to abrasives used to make products utilized in these industries.
【０００２】[0002]
【従来の技術】モナザイト、バストネサイト等の天然鉱
物を出発原料として用い、焼成処理、粉砕処理を実施す
ることにより製造される酸化セリウムを主体とする研磨
材は、メカノケミカル作用を利用する研磨材としてガラ
ス及びガラス質材料の研磨加工に用いられている。これ
らの研磨材は、酸化セリウムとガラス中のシリカ成分と
の固相反応、即ちケミカル作用を利用した研磨材である
ことは、現象論的ではあるが公知である。しかしなが
ら、ケミカル作用による反応生成物を除去する作用（メ
カノ作用）については、酸化セリウム及びその反応生成
物の硬度が、ガラスの硬度と同等かそれよりも低いので
多くは期待出来ない。2. Description of the Related Art Abrasives composed mainly of cerium oxide, which are produced by using natural minerals such as monazite and bastnasite as a starting material and carrying out a firing process and a pulverizing process, are polishing products using mechanochemical action. Used as a material for polishing glass and glassy materials. It is phenomenologically known that these abrasives are abrasives utilizing a solid-state reaction between cerium oxide and a silica component in glass, that is, a chemical action. However, the effect of removing the reaction product due to the chemical action (mechano-action) cannot be expected in many cases because the hardness of cerium oxide and its reaction product is equal to or lower than the hardness of glass.
【０００３】従来、酸化セリウムを用いた研磨加工にお
いては、メカノ作用は研磨布が分担しており、従って従
来の研磨加工は被研磨物・研磨材・研磨布の組合せによ
るメカノケミカル研磨システムであると言える。ガラス
の研磨加工においては、通常、研磨布として発砲ポリウ
レタンを使用するが、その使用目的は、発砲ポリウレタ
ン自体の弾性を利用して発砲ポリウレタン研磨布と被研
磨物との密着性を保持することと、発砲ポリウレタン研
磨布の表面構造を利用して反応生成物をメカノ的に除去
することである。密着性の保持については、各研磨シス
テムにおいて必要とされる弾性量を研磨布の弾性率及び
／又は厚さを変えることによって安定的に幅広く選定す
ることができる。Conventionally, in the polishing process using cerium oxide, the polishing cloth is responsible for the mechano-action, and therefore, the conventional polishing process is a mechanochemical polishing system by a combination of an object to be polished, an abrasive and a polishing cloth. Can be said. In the glass polishing process, foamed polyurethane is usually used as a polishing cloth, and the purpose of use is to maintain the adhesion between the foamed polyurethane polishing cloth and the object to be polished by utilizing the elasticity of the foamed polyurethane itself. , Mechanically removing reaction products by utilizing the surface structure of a foamed polyurethane polishing cloth. Regarding the retention of the adhesiveness, the elastic amount required in each polishing system can be stably and widely selected by changing the elastic modulus and / or the thickness of the polishing cloth.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、反応生
成物のメカノ的な除去については、発砲ポリウレタン研
磨布の表面構造に立脚しているために、発砲ポリウレタ
ン研磨布の種々の構造が提案されているとはいえ、現在
の技術水準では研磨加工中に性能が徐々に変化すること
は避けられない。However, regarding the mechanical removal of the reaction product, various structures of the foamed polyurethane polishing cloth have been proposed because they are based on the surface structure of the foamed polyurethane polishing cloth. However, with the current state of the art, it is unavoidable that the performance gradually changes during polishing.
【０００５】メカノ作用が変化すると研磨加工速度が変
化するので、所定の研磨加工量を得るためにはメカノ作
用の変化を常にモニターして加工時間等の研磨加工条件
にフィードバックする必要がある。また、研磨加工速度
が一定しないと、モニターに手間がかかるだけではな
く、仕上がり厚さの精度も低下することになる。更に、
メカノ作用が著しく低下した場合は、研磨布の表面を刷
毛等により再生する必要が有り、再生サイクルが短くな
ると新しい研磨布に取り替えることになる。Since the polishing rate changes when the mechano-action changes, it is necessary to constantly monitor the change in the mechano-action and feed it back to the polishing conditions such as the processing time in order to obtain a predetermined amount of polishing. Further, if the polishing speed is not constant, not only is it troublesome to monitor, but the accuracy of the finished thickness is also reduced. Furthermore,
When the mechano-function is significantly reduced, it is necessary to regenerate the surface of the polishing cloth with a brush or the like, and when the regeneration cycle becomes short, a new polishing cloth is replaced.
【０００６】また、特定の被研磨物及び使用する研磨材
の組合せに対して最適のメカノ作用を達成する研磨布を
選定するためには、被研磨物、研磨材、水及び研磨布の
間の潤滑、摩耗、摩擦等の複雑なメカニズムを理解する
必要があるが、現実には、種々の研磨布を用いて実際に
研磨加工を行い、その中から最適な研磨布を選定してい
る。従って、被研磨物、研磨材を含む種々の加工条件の
何れかが変わると、その都度最適のメカノ作用を有する
研磨布の選定のためにテストを実施する必要がある。Further, in order to select a polishing cloth that achieves an optimum mechano-effect for a specific object to be polished and a combination of abrasives to be used, it is necessary to select a polishing cloth between the object to be polished, the abrasive, water and the polishing cloth. Although it is necessary to understand complicated mechanisms such as lubrication, wear, and friction, in reality, various polishing cloths are actually used for polishing, and an optimum polishing cloth is selected from them. Therefore, when any one of various processing conditions including the object to be polished and the polishing material changes, it is necessary to carry out a test each time to select a polishing cloth having an optimum mechano-action.
【０００７】また、ガラスの研磨加工において一般的に
用いられている発砲ポリウレタンは研磨抵抗が大きいの
で、大型の被研磨物の場合、研磨圧力を上げると研磨機
の許容できるトルクを越えることになり、振動が発生し
て研磨加工が不能となる。そのため、１００〜３００ｇ
／ｃｍ2 の比較的低圧力域で研磨加工を実施しており、
従ってケミカル作用を充分に加速することができない。Further, since foamed polyurethane, which is generally used in the polishing of glass, has a high polishing resistance, in the case of a large object to be polished, if the polishing pressure is increased, the torque allowable by the polishing machine will be exceeded. However, vibrations occur, making polishing impossible. Therefore, 100-300g
Polishing is performed in a relatively low pressure range of / cm 2 ,
Therefore, the chemical action cannot be accelerated sufficiently.
【０００８】研磨加工量が多い場合には、実際には、炭
化珪素、ダイヤモンド等の硬度が高くてメカノ作用の強
い研磨材、もしくは、これらを砥粒とする砥石を用いて
粗加工を行い、その後、酸化セリウムを用いた仕上げ研
磨を行っている。粗加工及び仕上げ研磨の二工程を実施
すると、粗加工で用いた砥粒等が仕上げ研磨工程に混入
し、被研磨物の表面にキズを発生させることになるの
で、その防止のためには粗加工が終了した後に充分に洗
浄を行う必要があり、そのためにプロセスが複雑にな
る。When the amount of polishing is large, in reality, roughening is performed by using an abrasive having a high hardness and a strong mechano-effect such as silicon carbide or diamond, or a grindstone using these as abrasive grains. After that, finish polishing is performed using cerium oxide. If the two steps of roughing and finish polishing are carried out, the abrasive grains used in roughing will be mixed in the finish polishing step, and scratches will be generated on the surface of the object to be polished. It is necessary to perform sufficient washing after processing is completed, which complicates the process.
【０００９】本発明の目的は、酸化セリウムを用いたケ
ミカル作用による研磨加工において、用いる研磨布の種
類に影響されることなくほぼ一定の速度で研磨加工する
ことができ且つ所望の研磨加工量を仕上げ研磨工程だけ
の一工程で達成することができる研磨材を提供すること
にある。The object of the present invention is to perform a polishing operation by a chemical action using cerium oxide, which allows polishing at a substantially constant speed without being affected by the type of polishing cloth used and a desired polishing amount. An object of the present invention is to provide an abrasive material that can be achieved by one step of only the final polishing step.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に鋭意検討の結果、研磨材として酸化セリウムとメカノ
作用を持つ砥粒とを併用することによって、研磨布にメ
カノ作用を負担させる必要が無くなり、従って研磨布の
選択の幅が広がり、研磨布の経時変化の影響をうけにく
くなるため安定した研磨加工を行うことができ、また研
磨抵抗の低い研磨布を選定して加工圧力を高くすること
によってケミカル作用を加速させ、高い研磨加工速度を
得ることができ、仕上げ研磨工程だけで加工量の多い被
研磨物にも対応できることを見出し、本発明を完成し
た。[Means for Solving the Problems] As a result of intensive studies to achieve the above object, it is necessary to load the polishing cloth with the mechano-effect by using cerium oxide and abrasive grains having the mechano-effect as an abrasive together. Therefore, the range of selection of polishing cloths is widened, and it is less susceptible to the effects of changes over time of polishing cloths, so stable polishing can be performed, and polishing cloths with low polishing resistance are selected to increase the processing pressure. As a result, they have found that the chemical action can be accelerated, a high polishing processing speed can be obtained, and that it is possible to cope with an object to be polished having a large processing amount only by the final polishing step, and the present invention has been completed.
【００１１】即ち、本発明の研磨材は、シリカを主成分
とする物質の研磨に用いるための研磨材において、酸化
セリウム粒子と砥粒とからなり、該砥粒の硬度が該シリ
カを主成分とする物質の硬度及び該物質と酸化セリウム
との反応生成物の硬度と同等以上であることを特徴とす
る。That is, the abrasive of the present invention is an abrasive for use in polishing a substance containing silica as a main component, which is composed of cerium oxide particles and abrasive grains, and the hardness of the abrasive grains is the main component of the silica. And the hardness of the reaction product of the substance and cerium oxide.
【００１２】本発明の研磨材において、酸化セリウムは
ケミカル作用をもたらし、砥粒はメカノ作用をもたら
し、従って本発明の研磨材はそれらの作用が相乗したメ
カノケミカル作用を有する。本発明の研磨材で用いる酸
化セリウム粒子はシリカを主成分とする被研磨物に対し
てケミカル作用をもたらすかぎりは特に限定されるもの
ではなく、汎用の酸化セリウム粒子もしくは酸化セリウ
ム系研磨材を用いることができる。例えば、パストネサ
イトを原料とした研磨材、三井金属鉱業製「ミレーク
（商品名）」等、いわゆる汎用的なセリウム系研磨材を
用いることができる。また、本発明の研磨材において酸
化セリウム粒子と併用する砥粒は、砥粒として一般に用
いられているものでよく、例えばアルミナ、ジルコニ
ア、シリカ等の酸化物、炭化珪素、炭化ホウ素等の炭化
物、弗化カルシウム、弗化ネオジウム等の弗化物、ダイ
ヤモンド、等の微粉末の１種もしくは２種以上を使用す
ることができる。In the abrasive of the present invention, cerium oxide has a chemical action and the abrasive grains have a mechano-action, and therefore the abrasive of the present invention has a mechano-chemical action in which those actions are synergistic. The cerium oxide particles used in the polishing material of the present invention are not particularly limited as long as they exert a chemical action on the object of polishing containing silica as a main component, and general-purpose cerium oxide particles or cerium oxide-based polishing materials are used. be able to. For example, it is possible to use a so-called general-purpose cerium-based abrasive such as an abrasive made of pastnesite as a raw material and "Mirek (trade name)" manufactured by Mitsui Mining & Smelting. Further, the abrasive grains used in combination with the cerium oxide particles in the polishing material of the present invention may be those generally used as abrasive grains, for example, alumina, zirconia, oxides such as silica, silicon carbide, carbides such as boron carbide, One or more of fine powders of fluoride such as calcium fluoride and neodymium fluoride and diamond can be used.
【００１３】本発明の研磨材において、砥粒の硬度が被
研磨物の硬度及び該被研磨物と酸化セリウムとの反応生
成物の硬度と同等以上であることが必須であり、好まし
くは砥粒の硬度と被研磨物の硬度及び該被研磨物と酸化
セリウムとの反応生成物の硬度との差が例えばモース硬
度の差として２程度以内であり、より好ましくは砥粒の
硬度が被研磨物の硬度及び該被研磨物と酸化セリウムと
の反応生成物の硬度と同等かもしくはそれらより若干高
い。In the abrasive of the present invention, it is essential that the hardness of the abrasive grains is equal to or higher than the hardness of the object to be polished and the hardness of the reaction product of the object to be polished and cerium oxide, preferably the abrasive grains. Difference between the hardness of the object to be polished and the hardness of the reaction product of the object to be polished and cerium oxide is, for example, within about 2 as the difference in Mohs hardness, and more preferably the hardness of the abrasive grains is the object to be polished. And the hardness of the reaction product of the object to be polished and cerium oxide are equal to or slightly higher than those.
【００１４】実際に使用する砥粒は、被研磨物（シリカ
を主成分とする物質）の硬度及び該被研磨物と酸化セリ
ウムとの反応生成物の硬度との硬度差を基準にして選定
することになる。例えば、被研磨物がソーダライムガラ
ス（青板ガラス）である場合には、その主成分が珪酸ソ
ーダであるので、砥粒として弗化カルシウム等の比較的
硬度の低い微粉末を選定することが好ましく、被研磨物
が石英ガラスである場合には、その主成分がシリカであ
るので、弗化物では硬度が不足であり、アルミナの微粉
末を選定することが好ましい。また、被研磨物がアルミ
ナとシリカとの合成物、例えばムライトのようなセラミ
ックスである場合には、炭化珪素、ダイヤモンド等の硬
度の高い物質を選定することが好ましい。The abrasive grains to be actually used are selected on the basis of the hardness of the object to be polished (substance whose main component is silica) and the hardness difference between the object to be polished and the reaction product of cerium oxide. It will be. For example, when the object to be polished is soda lime glass (blue plate glass), since its main component is sodium silicate, it is preferable to select fine powder having relatively low hardness such as calcium fluoride as abrasive grains. When the object to be polished is quartz glass, since the main component is silica, the hardness is insufficient with fluoride, and it is preferable to select fine alumina powder. Further, when the object to be polished is a compound of alumina and silica, for example, ceramics such as mullite, it is preferable to select a substance having high hardness such as silicon carbide or diamond.
【００１５】硬度の最も高いダイヤモンドを混合すれ
ば、全ての被研磨物に対応できるはずであるが、硬度差
が大き過ぎると被研磨物に深いキズがはいる傾向があ
り、ケミカル的に研磨を推進している酸化セリウムの研
磨能ではその深いキズの除去が困難であり、最終仕上が
り面にキズが残存することもある。また、砥粒の添加効
果を達成するためには、かなりの量の砥粒を添加する必
要があり、従って、砥粒としてダイヤモンドのような高
硬度の砥粒を用いる必要がない場合にまでダイヤモンド
のような高価な砥粒を用いることは不経済である。If the diamond having the highest hardness should be mixed, it should be possible to deal with all objects to be polished. However, if the difference in hardness is too large, the objects to be polished tend to have deep scratches, so that polishing should be performed chemically. It is difficult to remove deep scratches with the polishing ability of cerium oxide which is being promoted, and scratches may remain on the final finished surface. In addition, in order to achieve the effect of adding abrasive grains, it is necessary to add a considerable amount of abrasive grains, and therefore, even when it is not necessary to use high hardness abrasive grains such as diamond as abrasive grains It is uneconomical to use expensive abrasive grains such as.
【００１６】砥粒の粒径が酸化セリウム粒子の粒径より
も大きいと、被研磨物と酸化セリウムとの接触が充分に
取れなくなり、ケミカル作用が低下し、加工速度が低下
する。従って、砥粒の粒径が酸化セリウム粒子の粒径の
５０〜１００％程度であることが好ましく、７０〜８０
％の程度であることが更に好ましい。When the particle size of the abrasive grains is larger than the particle size of the cerium oxide particles, the object to be polished and the cerium oxide cannot be sufficiently contacted with each other, the chemical action is lowered, and the processing speed is lowered. Therefore, the grain size of the abrasive grains is preferably about 50 to 100% of the grain size of the cerium oxide particles, and 70 to 80.
% Is more preferable.
【００１７】酸化セリウム粒子と砥粒との混合比率は、
必要とする研磨加工速度及び研磨材の性能保持期間に基
づいて選択される。研磨材の性能保持期間は含有する酸
化セリウム粒子の量に比例するために酸化セリウム粒子
の濃度を低くすると、研磨材の取替え、補充サイクルが
短くなる。また酸化セリウム粒子の濃度を低くすると
（従って砥粒の濃度を高くすると）ケミカル作用が低下
するので、研磨加工速度が低下し、また研磨後の被研磨
物の表面にキズ等が残って表面性状の低下をもたらすこ
とがある。酸化セリウム粒子２０〜８５重量％と砥粒８
０〜１５重量％とからなる研磨材においては、研磨加工
速度、研磨後の表面性状に好結果が得られる。The mixing ratio of the cerium oxide particles and the abrasive particles is
It is selected based on the required polishing processing speed and the performance retention period of the abrasive. Since the performance retention period of the abrasive is proportional to the amount of the cerium oxide particles contained, if the concentration of the cerium oxide particles is lowered, the replacement and replenishment cycles of the abrasive become shorter. In addition, when the concentration of cerium oxide particles is lowered (and therefore the concentration of abrasive grains is increased), the chemical action is reduced, the polishing processing speed is reduced, and scratches and the like remain on the surface of the object to be polished after polishing, resulting in surface properties. May result in a decrease in 20-85% by weight of cerium oxide particles and 8 abrasive grains
In the case of an abrasive material containing 0 to 15% by weight, good results can be obtained in the polishing processing speed and the surface properties after polishing.
【００１８】本発明の研磨材はそれ自体がメカノ作用と
ケミカル作用を保有しているので、研磨布にはメカノ作
用を分担させる必要がなく、従ってメカノ作用は研磨布
の表面の構造に依存しなくなり、研磨加工中の研磨布の
経時変化に依存することなく安定的に研磨加工速度を維
持できるようになる。本発明の研磨材を用いる場合に
は、研磨布は研磨布と被研磨物との密着を確保できるも
のであればよく、従って、本発明の研磨材と共に使用す
る研磨布については何ら制限されないが、被研磨物に対
する研磨抵抗の小さい研磨布、具体的には不織布タイ
プ、例えば、ロデール・ニッタ社のＳＵＢＡシリーズの
研磨布を使用することにより大きな加工圧力をかけるこ
とができるようになり、このような大きな加工圧力は酸
化セリウム粒子のケミカル作用を加速し、研磨加工速度
を高めることができる。Since the abrasive of the present invention itself has a mechano-action and a chemical action, it is not necessary for the polishing cloth to share the mechano-action. Therefore, the mechano-action depends on the structure of the surface of the polishing cloth. Therefore, the polishing speed can be stably maintained without depending on the change with time of the polishing cloth during polishing. When the abrasive of the present invention is used, the abrasive cloth may be one that can ensure the adhesion between the abrasive cloth and the object to be abraded, and therefore the abrasive cloth used with the abrasive of the present invention is not limited at all. It is possible to apply a large processing pressure by using a polishing cloth having a small polishing resistance against the object to be polished, specifically, a non-woven cloth type polishing cloth, for example, SUBA series polishing cloth of Rodel Nitta. Such a large processing pressure can accelerate the chemical action of the cerium oxide particles and increase the polishing processing speed.
【００１９】[0019]
【実施例】以下の実施例において、酸化セリウム粒子と
して汎用のセリウム系研磨材である三井金属鉱業株式会
社製の商品名「ミレークＳ−０」（平均粒径１.２μ
ｍ）を用い、砥粒として弗化カルシウム（平均粒径０.
８μｍ）、アルミナ（平均粒径０.３μｍ、０.９μｍ又
は１.５μｍ）又はダイヤモンド（平均粒径１μｍ）を
用い、研磨布としてロデール・ニッタ社製の「ＭＨ」、
「ＩＣ」又は「ＳＵＢＡ」を用いた。「ＭＨ」はガラス
研磨用の研磨布として代表的な発砲ポリウレタンの研磨
布である。EXAMPLES In the following examples, a general-purpose cerium-based abrasive as cerium oxide particles, trade name "Mirek S-0" manufactured by Mitsui Mining & Smelting Co., Ltd. (average particle diameter 1.2 .mu.
m) and calcium fluoride as an abrasive grain (average grain size of
8 [mu] m), alumina (average particle size 0.3 [mu] m, 0.9 [mu] m or 1.5 [mu] m) or diamond (average particle size 1 [mu] m) as polishing cloth "MH" manufactured by Rodel Nitta.
"IC" or "SUBA" was used. “MH” is a foamed polyurethane polishing cloth that is typical as a polishing cloth for polishing glass.
【００２０】実施例１ 被研磨物としてそれぞれ１００ｍｍ×１００ｍｍ×１.
５ｍｍの青板ガラス（ソーダライムガラス）板、石英ガ
ラス板又はムライトセラミックス板を用い、研磨材スラ
リーとしてそれぞれ下記のＡ〜Ｄの何れかを用い、研磨
布としてそれぞれ「ＭＨ」、「ＩＣ」又は「ＳＵＢＡ」
を用いた。図１に示す装置を用いて下記の条件下で研磨
加工を実施した： 研磨材スラリー： 研磨材の構成成分及びスラリー濃度 Ａ： ミレーク１５０ｇ／ｌ Ｂ： ミレーク７５ｇ／ｌ＋弗化カルシウム７５ｇ／ｌ Ｃ： ミレーク７５ｇ／ｌ＋アルミナ（０.９μｍ）７５ｇ／ｌ Ｄ： ミレーク１２０ｇ／ｌ＋ダイヤモンド３０ｇ／ｌ 研磨加工圧力： １２０ｇ／ｃｍ2 研磨布回転数： ３００ｒｐｍ 研磨液循環量： ４リットル／分 研磨加工時間： １０分間 なお、図１において１は研磨布であり、２は被研磨物で
あり、３は加圧シリンダーであり、４は研磨プレートで
あり、５は研磨材（スラリ−）である。Example 1 100 mm × 100 mm × 1 as an object to be polished.
A 5 mm blue plate glass (soda lime glass) plate, a quartz glass plate or a mullite ceramics plate was used, and each of the following A to D was used as the abrasive slurry, and "MH", "IC" or " SUBA "
Was used. Polishing was carried out using the apparatus shown in FIG. 1 under the following conditions: Abrasive slurry: Constituent components and slurry concentration of abrasive A: Millake 150 g / l B: Millake 75 g / l + calcium fluoride 75 g / l C : Millake 75 g / l + Alumina (0.9 μm) 75 g / l D: Millake 120 g / l + Diamond 30 g / l Polishing processing pressure: 120 g / cm 2 Polishing cloth rotation speed: 300 rpm Polishing liquid circulation rate: 4 liters / minute Polishing processing time For 10 minutes, 1 is a polishing cloth, 2 is an object to be polished, 3 is a pressure cylinder, 4 is a polishing plate, and 5 is an abrasive (slurry).
【００２１】研磨した後の被研磨物について、その隣接
する２辺からそれぞれ５ｍｍの距離の位置にある点（全
部で４点）と中心点との合計５点で研磨量（μｍ）をマ
イクロメーターで計測し、それらの計測値を平均して求
めた平均研磨加工速度（μｍ／分）は表１〜３に示す通
りであった。また被研磨物の表面の状態を目視及び顕微
鏡で観察し、傷の有無について調べ、顕微鏡観察でも傷
が認められない場合を○とし、目視では傷が認められな
いが顕微鏡観察で微小な傷が認められる場合を△とし、
目視でも傷の認められる場合を×とした。その結果は表
１〜３に示す通りであった。With respect to the object to be polished after polishing, the polishing amount (μm) is measured at a total of 5 points, that is, a point located at a distance of 5 mm from each of the two adjacent sides (4 points in total) and a central point. The average polishing processing speed (μm / min) obtained by averaging the measured values was shown in Tables 1 to 3. In addition, the surface condition of the object to be polished is observed visually and with a microscope, and the presence or absence of scratches is examined. If accepted, mark △
The case where scratches were visually observed was marked with x. The results are shown in Tables 1 to 3.
【００２２】[0022]
【表１】 [Table 1]
【００２３】[0023]
【表２】 [Table 2]
【００２４】[0024]
【表３】 [Table 3]
【００２５】表１〜表３のデータから、研磨材として酸
化セリウム粒子のみを用いた場合には用いる研磨布の差
異によって研磨加工速度に大きな差異が生じるが、研磨
材として酸化セリウム粒子と砥粒とを併用した場合には
用いる研磨布の差異によっても研磨加工速度にほとんど
差異が生じないことは明らかである。また、被研磨物の
硬度と砥粒の硬度との差が大きい場合には研磨加工速度
は良好であるが、表面状態が低下することも明らかであ
る。From the data shown in Tables 1 to 3, when only cerium oxide particles are used as the polishing material, the polishing processing speed varies greatly depending on the difference in the polishing cloth used. It is clear that when both and are used together, there is almost no difference in the polishing processing speed due to the difference in the polishing cloth used. It is also clear that when the difference between the hardness of the object to be polished and the hardness of the abrasive grains is large, the polishing rate is good, but the surface condition deteriorates.
【００２６】実施例２ 被研磨物として石英ガラス板を用い、研磨材スラリーと
してミレークとアルミナ（０.９μｍ）との混合物（混
合比２／８、５／５、８／２又は１０／０）をミレーク
とアルミナとの合計スラリー濃度１５０ｇ／ｌで用い、
研磨布として「ＳＵＢＡ」を用いた以外は実施例１と同
様にして研磨加工し、実施例１と同様にして研磨加工速
度（μｍ／分）を求め、表面状態を観察した。それらの
結果は表４に示す通りであった。Example 2 A quartz glass plate was used as the object to be polished, and a mixture of millake and alumina (0.9 μm) was used as the abrasive slurry (mixing ratio 2/8, 5/5, 8/2 or 10/0). With a total slurry concentration of millake and alumina of 150 g / l,
Polishing was performed in the same manner as in Example 1 except that "SUBA" was used as the polishing cloth, and the polishing rate (μm / min) was obtained in the same manner as in Example 1 to observe the surface state. The results are shown in Table 4.
【００２７】[0027]
【表４】 [Table 4]
【００２８】実施例３ 被研磨物として石英ガラス板を用い、研磨材スラリーと
してミレーク７５ｇ／ｌとアルミナ（平均粒径０.３μ
ｍ、０.９μｍ又は１.５μｍ）７５ｇ／ｌとの混合物を
用い、研磨布として「ＳＵＢＡ」を用いた以外は実施例
１と同様にして研磨加工し、実施例１と同様にして研磨
加工速度（μｍ／分）を求め、表面状態を観察した。そ
れらの結果は表５に示す通りであった。Example 3 A quartz glass plate was used as the object to be polished, and Millake 75 g / l and alumina (average particle size 0.3 μm) were used as the abrasive slurry.
m, 0.9 μm or 1.5 μm) and a mixture of 75 g / l, and polishing was performed in the same manner as in Example 1 except that “SUBA” was used as the polishing cloth. The speed (μm / min) was determined and the surface condition was observed. The results are shown in Table 5.
【００２９】[0029]
【表５】 [Table 5]
【００３０】実施例４ 被研磨物として石英ガラス板を用い、研磨材スラリーと
して実施例１で用いたＡ又はＣを用い、研磨布として
「ＭＨ」又は「ＳＵＢＡ」を用い、研磨加工圧力を０.
０６、０.１２、０.２又は０.４ｋｇ／ｃｍ2 とした以
外は実施例１と同様にして研磨加工し、実施例１と同様
にして研磨加工速度（μｍ／分）を求めた。それらの結
果は表６に示す通りであった。また、表面状態は何れも
良好であった。Example 4 A quartz glass plate was used as the object to be polished, A or C used in Example 1 was used as the abrasive slurry, "MH" or "SUBA" was used as the polishing cloth, and the polishing pressure was 0. .
Polishing was performed in the same manner as in Example 1 except that the polishing rate was 0.6, 0.12, 0.2 or 0.4 kg / cm 2, and the polishing rate (μm / min) was determined in the same manner as in Example 1. The results are shown in Table 6. In addition, the surface condition was good.
【００３１】[0031]
【表６】 [Table 6]
【００３２】表中の加工不能は機械に振動が発生したこ
とによる。 実施例５ 被研磨物として石英ガラス板を用い、研磨材スラリーと
して実施例１で用いたＡ又はＣを用い、研磨布として
「ＭＨ」又は「ＳＵＢＡ」を用いた以外は実施例１と同
様にして研磨加工し、実施例１と同様にして研磨加工速
度（μｍ／分）を求めた。この１０分間の研磨加工をｎ
回繰り返して研磨加工速度の経時変化（バラツキ）を調
査した。それらの結果は表７に示す通りであった。The unworkable condition in the table is due to the occurrence of vibration in the machine. Example 5 The same as Example 1 except that a quartz glass plate was used as the object to be polished, A or C used in Example 1 was used as the abrasive slurry, and “MH” or “SUBA” was used as the polishing cloth. Polishing was performed and the polishing rate (μm / min) was obtained in the same manner as in Example 1. This polishing for 10 minutes
The polishing processing speed was examined repeatedly over time (variation). The results are shown in Table 7.
【００３３】[0033]
【表７】 [Table 7]
【００３４】[0034]
【発明の効果】本発明の研磨材を用いることにより、用
いる研磨布の種類に影響されることなくほぼ一定の速度
で研磨加工することができ且つ所望の研磨加工量を仕上
げ研磨工程だけの一工程で達成することができる。EFFECTS OF THE INVENTION By using the abrasive of the present invention, polishing can be performed at a substantially constant speed without being affected by the type of polishing cloth used, and a desired amount of polishing can be achieved only in the final polishing step. Can be achieved in the process.
【図１】実施例で用いた研磨加工装置の概略断面図であ
る。FIG. 1 is a schematic cross-sectional view of a polishing apparatus used in an example.
１ 研磨布 ２ 被研磨物 ３ 加圧シリンダー ４ 研磨プレート ５ 研磨材（スラリ−） 1 polishing cloth 2 object to be polished 3 pressure cylinder 4 polishing plate 5 polishing material (slurry)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２４Ｄ 3/00 ３３０ Ｂ２４Ｄ 3/00 ３３０Ｚ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location B24D 3/00 330 B24D 3/00 330Z
Claims (4)
るための研磨材において、酸化セリウム粒子と砥粒とか
らなり、該砥粒の硬度が該シリカを主成分とする物質の
硬度及び該物質と酸化セリウムとの反応生成物の硬度と
同等以上であることを特徴とする研磨材。1. An abrasive for use in polishing a substance containing silica as a main component, which comprises cerium oxide particles and abrasive grains, and the hardness of the abrasive grains is the hardness of the substance containing silica as a main component and the hardness of the substance containing silica. An abrasive having a hardness equal to or higher than the hardness of a reaction product of a substance and cerium oxide.
の硬度及び該物質と酸化セリウムとの反応生成物の硬度
との差がモース硬度の差として２以内であることを特徴
とする請求項１記載の研磨材。2. The difference between the hardness of the abrasive grains, the hardness of the substance containing silica as a main component, and the hardness of the reaction product of the substance and cerium oxide is less than 2 as the difference in Mohs' hardness. The abrasive according to claim 1.
５０〜１００％であることを特徴とする請求項１又は２
記載の研磨材。3. The grain size of the abrasive grains is 50 to 100% of the grain size of the cerium oxide grains, and the grain size is 1 to 2.
Abrasive described.
粒８０〜１５重量％とからなることを特徴とする請求項
１、２又は３記載の研磨材。4. The abrasive according to claim 1, which is composed of 20 to 85% by weight of cerium oxide particles and 80 to 15% by weight of abrasive grains.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5877595A JP3599816B2 (en) | 1995-03-17 | 1995-03-17 | Abrasive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5877595A JP3599816B2 (en) | 1995-03-17 | 1995-03-17 | Abrasive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08253763A true JPH08253763A (en) | 1996-10-01 |
| JP3599816B2 JP3599816B2 (en) | 2004-12-08 |
Family
ID=13093935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5877595A Expired - Fee Related JP3599816B2 (en) | 1995-03-17 | 1995-03-17 | Abrasive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3599816B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0826756A1 (en) * | 1996-09-03 | 1998-03-04 | Sumitomo Chemical Company, Limited | Abrasive composition for polishing a metal layer on a semiconductor substrate, and use of the same |
-
1995
- 1995-03-17 JP JP5877595A patent/JP3599816B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0826756A1 (en) * | 1996-09-03 | 1998-03-04 | Sumitomo Chemical Company, Limited | Abrasive composition for polishing a metal layer on a semiconductor substrate, and use of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3599816B2 (en) | 2004-12-08 |
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