JPH08239774A - Formation of tin alloy film - Google Patents
Formation of tin alloy filmInfo
- Publication number
- JPH08239774A JPH08239774A JP4098295A JP4098295A JPH08239774A JP H08239774 A JPH08239774 A JP H08239774A JP 4098295 A JP4098295 A JP 4098295A JP 4098295 A JP4098295 A JP 4098295A JP H08239774 A JPH08239774 A JP H08239774A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- layer
- plating
- bath
- tin alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子産業に於けるプリ
ント基板の各種抵抗器やコンデンサーなどの回路中への
接合のために使用される錫合金被膜の形成方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a tin alloy film used for bonding printed circuits in the electronics industry to circuits such as various resistors and capacitors.
【０００２】[0002]
【従来の技術】近年、電子産業、自動車、家電、情報通
信機などの業界で、プリント基板を用いた電子回路が多
用されるが、基板への電子部品の装着後の回路への接合
には低コストで電気特性の優れた錫に鉛を添加した二元
錫合金である半田がもっぱら使用されている。2. Description of the Related Art In recent years, electronic circuits using printed circuit boards have been widely used in industries such as the electronic industry, automobiles, home appliances, and information and communication devices. However, for bonding to electronic circuits after mounting electronic components on the circuit boards. Solder, which is a binary tin alloy in which lead is added to tin at low cost and excellent in electrical characteristics, is mainly used.
【０００３】そして、該半田の部品や基板への供給や被
覆は、線材としての供給、溶融半田浴への浸漬・めっ
き、さらには、半田微粒子のペースト塗布等により行わ
れてきた。The supply and coating of the solder to the components and the board have been performed by supplying the solder as a wire material, dipping / plating in a molten solder bath, and further applying paste of solder fine particles.
【０００４】[0004]
【発明が解決しようとする課題】ところが、半田は、通
常、鉛を多量に含んでいるため、作業環境保全の見地か
ら問題視されつつあり、錫をベースとする鉛レスの低融
点合金被膜（錫合金被膜）を被処理物上に形成する簡便
な方法の出現が望まれていた。However, since solder usually contains a large amount of lead, it is becoming a problem from the standpoint of work environment conservation, and a lead-free low melting point alloy coating based on tin ( It has been desired to develop a simple method for forming a tin alloy film) on the object to be treated.
【０００５】しかし、本願本発明者らが知る限りにおい
ては、そのような鉛レスの錫合金被膜の形成方法は存在
しない。However, as far as the present inventors know, there is no method for forming such a lead-free tin alloy coating film.
【０００６】他方、本願出願人は、任意の組成でかつ厚
肉の、さらには、均質の半田被膜を容易に形成可能な下
記構成の半田被膜の形成方法を先に提案している（特開
平６−１７２６３号）。On the other hand, the applicant of the present application has previously proposed a method of forming a solder coating having the following constitution, which enables easy formation of a thick and even solder coating having an arbitrary composition (Japanese Patent Laid-Open No. Hei 10-135,091). 6-17263).
【０００７】「被処理体上に無電解錫めっきにより錫層
を析出させ、該錫層上に無電解鉛めっきにより鉛層を析
出させた後、加熱処理により合金化させて半田被膜を形
成する方法であって、錫層を不均化反応めっき又は置換
反応めっきにより８μｍ以上の厚さの多孔質層として析
出させるとともに、鉛層を置換反応めっきにより析出さ
せることを特徴とする半田被膜の形成方法。」 本発明は、上記にかんがみて、錫をベースとする鉛レス
の低融点合金被膜（錫合金被膜）を被処理物上に形成す
る簡便な錫合金被膜の形成方法を提供することを目的と
する。"A tin layer is deposited on the object to be processed by electroless tin plating, a lead layer is deposited on the tin layer by electroless lead plating, and then alloyed by heat treatment to form a solder coating. A method for forming a solder coating, comprising depositing a tin layer as a porous layer having a thickness of 8 μm or more by disproportionation reaction plating or displacement reaction plating, and depositing a lead layer by displacement reaction plating. Method.] In view of the above, the present invention provides a simple method for forming a tin-free lead-free low-melting-point alloy coating (tin alloy coating) on a workpiece. To aim.
【０００８】[0008]
【課題を解決するための手段】本願発明者らは、前記
「半田被膜の形成方法」に着目して、鋭意開発に努力を
した結果、下記構成の錫合金被膜の形成方法に想到し
た。DISCLOSURE OF THE INVENTION The inventors of the present application have paid attention to the above-mentioned “method for forming a solder coating film” and have made intensive efforts for development, and as a result have come up with a method for forming a tin alloy coating film having the following constitution.
【０００９】被処理体上に錫合金被膜を形成する方法で
あって、不均化反応めっきにより錫層を析出させ、該錫
層上に、錫合金を組成する添加金属層を１層または２層
以上析出させた後、加熱処理により合金化させる、こと
を特徴とする。A method for forming a tin alloy coating film on an object to be treated, wherein a tin layer is deposited by disproportionation reaction plating, and one or two additive metal layers forming a tin alloy are formed on the tin layer. After depositing more than one layer, it is characterized by alloying by heat treatment.
【００１０】(1) 本発明で使用する被処理体としては、
プリント回路基板、鋼板、銅合金板、又は、それらのエ
ッチングプレス成形体等を挙げることができる。なお、
被処理体は、表面を清浄化するため、一般的には、トリ
フロン、イソプロパノール等の有機溶剤またはアルカリ
洗浄剤等の水性洗浄剤を用いて油脂類の除去を行う。ま
たは、ブラッシング、ホーニング等の物理的方法によっ
て表面を清浄化して用いてもよい。(1) As the object to be used in the present invention,
Examples thereof include a printed circuit board, a steel plate, a copper alloy plate, or an etching press molded product thereof. In addition,
In order to clean the surface of the object to be treated, oils and fats are generally removed using an organic solvent such as triflon or isopropanol or an aqueous detergent such as an alkaline detergent. Alternatively, the surface may be cleaned by a physical method such as brushing or honing before use.
【００１１】(2) 被処理体上に不均化反応めっきにより
錫層を析出させる。該不均化反応めっき錫層の層厚は、
添加金属析出層を電解めっきで形成する場合は特に限定
されないが、通常、５μｍ以上とする。他方、添加金属
析出層を無電解めっきで形成する場合は、８μｍ以上
（望ましくは１３μｍ以上）の厚さの多孔質層として析
出させることが、無電解めっきの析出が迅速かつ厚肉に
行えて望ましい。(2) A tin layer is deposited on the object to be processed by disproportionation reaction plating. The layer thickness of the disproportionation reaction plated tin layer is
When the additive metal deposition layer is formed by electrolytic plating, it is not particularly limited, but usually 5 μm or more. On the other hand, when the additive metal deposition layer is formed by electroless plating, it can be deposited as a porous layer having a thickness of 8 μm or more (desirably 13 μm or more) so that the electroless plating can be deposited quickly and thickly. desirable.
【００１２】ここで、錫層の形成に、不均化反応めっき
を採用したのは、置換反応めっきに比して、より厚肉の
錫層を短時間で形成でき、さらには、置換めっきの場合
の如く、置換金属となる銅等が溶解（導電性に悪影響を
与える。）せず望ましい。不均化反応めっきで錫層を８
μｍ以上に厚付けすると多孔質層化することにより、後
述の添加金属を置換反応めっき等による添加金属層の析
出が、速やかに且つ厚肉に形成することが可能となると
ともに、加熱処理による合金化の際、合金化が迅速とな
り錫合金被膜の均質化が促進される。Here, the disproportionation reaction plating is used to form the tin layer because a thicker tin layer can be formed in a shorter time as compared with the displacement reaction plating. As in the case, the substitution metal such as copper is preferable because it does not dissolve (it adversely affects the conductivity). 8 tin layer by disproportionation reaction plating
When it is thickened to a thickness of at least μm, it becomes a porous layer, so that the deposition of the additive metal layer described later by substitution reaction plating or the like can be quickly and thickly formed, and the alloy by heat treatment can be formed. When alloying, alloying becomes rapid and homogenization of the tin alloy coating is promoted.
【００１３】不均化反応めっきのめっき条件（浴組成を
含む）は、被処理体に対して、付着性に問題が発生しな
い範囲内で可及的に多孔質（粗）な錫層を形成可能なも
のとする。The plating conditions for disproportionation reaction plating (including bath composition) form a tin layer that is as porous (coarse) as possible within the range where adhesion problems do not occur on the object to be treated. It should be possible.
【００１４】例えば、銅回路が形成された回路基板に、
不均化反応めっきにより錫層を析出させる場合は、下記
の如く行う。For example, on a circuit board on which a copper circuit is formed,
When the tin layer is deposited by the disproportionation reaction plating, the procedure is as follows.
【００１５】１０％硫酸／１０％過酸化水素混合溶液
や、過硫酸水溶液で、銅表面の酸化膜を除去しておく。The oxide film on the copper surface is removed with a 10% sulfuric acid / 10% hydrogen peroxide mixed solution or a persulfuric acid aqueous solution.
【００１６】必然的ではないが、不均化反応を促進さ
せるために、ホウフッ化第一錫１０〜５０ｇ／Ｌ、チオ
尿素５０〜１００ｇ／Ｌのホウフッ化錫置換めっき浴を
使用して０．１〜１μｍの錫被覆処理を行う。Although not inevitable, a tin borofluoride displacement plating bath containing 10 to 50 g / L of stannous borofluoride and 50 to 100 g / L of thiourea is used to accelerate the disproportionation reaction. A tin coating process of 1 to 1 μm is performed.
【００１７】そして、亜錫酸塩浴（テトラヒドロキソ
錫浴）として、 水酸化アルカリ： １００〜５００ｇ／Ｌ 強酸の第一錫塩： ５０〜２００ｇ／Ｌ を用い、８０〜１００℃×１〜５時間で浸漬することに
より、不均化反応めっき錫層を銅素材上に析出させる。As a stannous acid salt bath (tetrahydroxo tin bath), alkali hydroxide: 100 to 500 g / L, stannous salt of strong acid: 50 to 200 g / L, and 80 to 100 ° C. × 1 to 5 The disproportionation reaction plated tin layer is deposited on the copper material by immersion for a time.
【００１８】上記水酸化アルカリとしては、水酸化カリ
ウム、水酸化ナトリウム、水酸化リチウム等を挙げるこ
とができる。Examples of the alkali hydroxide include potassium hydroxide, sodium hydroxide, lithium hydroxide and the like.
【００１９】上記第一錫塩としては、塩化第一錫、臭化
第一錫、硫酸第一錫等を挙げることができる。Examples of the stannous salt include stannous chloride, stannous bromide, stannous sulfate and the like.
【００２０】また、上記錫浴には、浴安定化等のため
に、クエン酸塩、酒石酸塩、等のカルボン酸塩を添加す
ることもできる。Further, a carboxylic acid salt such as a citrate salt or a tartrate salt may be added to the tin bath for stabilizing the bath.
【００２１】(3) 次に、錫合金を組成する添加金属層を
１層または２層以上析出させる。(3) Next, one or more additive metal layers that compose the tin alloy are deposited.
【００２２】ここで、錫と組み合わされる添加金属は、
特に限定されないが、通常、アンチモン、インジウム、
ビスマス、銅／銀、亜鉛、等のいずれからか選択する。Here, the additive metal combined with tin is
Although not particularly limited, usually, antimony, indium,
Select from bismuth, copper / silver, zinc, etc.
【００２３】そして、該添加金属層の形成方法は、通
常、無電解めっき（亜鉛を除く）によるが、高密度実装
な基板（導体部分のピッチ間隔が０．５mm以下）等に適
用する場合以外は、電解めっきでも良い。The method of forming the additive metal layer is usually electroless plating (excluding zinc), except when it is applied to a high-density mounted substrate (pitch interval of conductor portions is 0.5 mm or less). May be electrolytic plating.
【００２４】なお、錫層が多孔質であるため、相対的な
表面積が大きくなり無電解めっきや電解めっきを効率良
く行うことができ、厚肉の添加金属層を形成可能とな
る。Since the tin layer is porous, the relative surface area is large, and electroless plating or electrolytic plating can be efficiently performed, and a thick additive metal layer can be formed.
【００２５】このとき、所要の錫合金組成を形成するよ
うに、錫層の付着重量に対して添加金属層の付着重量を
設定する。通常、添加金属を５〜７０重量％、望ましく
は１０〜６０重量％含むように設定する。層厚を付着重
量の比重換算値で示すと、錫：８〜５０μｍ、添加金
属：１〜５０μｍとなる。At this time, the adhesion weight of the additional metal layer is set with respect to the adhesion weight of the tin layer so as to form the required tin alloy composition. Usually, it is set so as to contain the additive metal in an amount of 5 to 70% by weight, preferably 10 to 60% by weight. When the layer thickness is shown by the specific gravity conversion value of the attached weight, tin: 8 to 50 μm and added metal: 1 to 50 μm.
【００２６】この添加金属層の形成には、無電解めっき
の場合、公知の一般的な置換反応型の無電解めっき浴、
例えば、上記添加金属に対応させると、酒石酸アンチモ
ン浴、硫酸インジウム浴、硝酸ビスマス浴、硫酸銅浴、
硝酸銀浴、等を使用でき、さらには、ジメチルアミンボ
ラン浴（銀めっき）等の還元型アルカリ浴を用いること
もできる。In the case of electroless plating, a known general substitution reaction type electroless plating bath is used for the formation of this additional metal layer.
For example, corresponding to the above added metals, antimony tartrate bath, indium sulfate bath, bismuth nitrate bath, copper sulfate bath,
A silver nitrate bath or the like can be used, and a reducing alkali bath such as a dimethylamine borane bath (silver plating) can also be used.
【００２７】また、電解めっきの場合、酒石酸アンチモ
ン浴、硫酸インジウム浴、硝酸ビスマス浴、硫酸銅浴、
塩化亜鉛浴、硝酸銀浴、等を挙げることができる。In the case of electrolytic plating, antimony tartrate bath, indium sulfate bath, bismuth nitrate bath, copper sulfate bath,
Examples thereof include a zinc chloride bath and a silver nitrate bath.
【００２８】(4) 加熱処理は、非処理体を高沸点溶剤
（ポリエチレングリコール等）に浸漬するか、または非
酸化雰囲気とした加熱炉により行う。また、加熱処理条
件は、高沸点溶剤浸漬では、１７０〜２５０℃×３秒〜
１分、望ましくは、１８０〜２２０℃×５〜３０秒で行
う。これに対して、加熱炉による溶融は、予備加熱１４
０〜１６０℃×３０秒〜２分、本加熱２００〜３２０℃
×１０〜６０秒の条件で行う。(4) The heat treatment is carried out by immersing the untreated body in a high boiling point solvent (polyethylene glycol or the like) or by using a heating furnace in a non-oxidizing atmosphere. In addition, the heat treatment condition is 170 to 250 ° C. × 3 seconds from the high boiling point solvent immersion.
It is performed at 1 minute, preferably 180 to 220 ° C. for 5 to 30 seconds. On the other hand, melting by the heating furnace is
0-160 ℃ x 30 seconds-2 minutes, main heating 200-320 ℃
It is performed under the condition of × 10 to 60 seconds.
【００２９】[0029]
【発明の作用・効果】本発明の錫合金被膜の形成方法
は、上記の如く、被処理体上に不均化反応めっきにより
錫層を析出させ、該錫層上に錫合金を組成する添加金属
層を１層または２層以上析出させた後、加熱処理により
合金化させて錫合金被膜を形成させる構成により下記の
ような作用・効果を奏する。As described above, the method for forming a tin alloy coating film of the present invention is such that a tin layer is deposited on the object to be treated by disproportionation reaction plating, and a tin alloy is added to the tin layer. After depositing one or more metal layers and then alloying them by heat treatment to form a tin alloy coating, the following actions and effects are achieved.
【００３０】(1) 任意の組成で且つ厚肉・均質な鉛レス
錫合金被覆を容易に形成可能となる。その理由は下記の
如くと推定される。(1) It is possible to easily form a thick and homogeneous leadless tin alloy coating having an arbitrary composition. The reason is presumed to be as follows.
【００３１】不均化反応めっきにより、任意の厚さの多
孔質層を容易に形成可能である。厚肉（８μｍ）以上の
多孔質の錫層上に、無電解めっきまたは電解めっきによ
り添加金属層を析出させることにより、添加金属層を任
意の厚さに形成可能である（多孔質であることにより、
特に、置換めっきの場合、置換可能な錫原子の数が緻密
である場合に比して格段に増大するものと推定され
る）。さらに、錫層が多孔質であることにより、加熱処
理により合金化させるに際して、錫層の上に形成した添
加金属層の添加金属が錫層に容易に拡散して均一な混合
状態となり、均質な錫合金層が得られると推定される。By the disproportionation reaction plating, a porous layer having an arbitrary thickness can be easily formed. The additive metal layer can be formed to an arbitrary thickness by depositing the additive metal layer by electroless plating or electrolytic plating on a porous tin layer having a thickness (8 μm) or more (being porous Due to
In particular, in the case of displacement plating, it is estimated that the number of replaceable tin atoms will be remarkably increased as compared with the case where it is dense). Furthermore, since the tin layer is porous, when alloyed by heat treatment, the additive metal of the additive metal layer formed on the tin layer easily diffuses into the tin layer, resulting in a uniform mixed state and a uniform mixture. It is estimated that a tin alloy layer is obtained.
【００３２】(2) また、添加金属析出層の形成を無電解
めっきとした場合は、添加金属層析出（電解めっき）の
ための電気接点を必要としないため、プリント基板等の
高密度実装化に対応が可能となる。(2) In addition, when electroless plating is used to form the additive metal deposition layer, an electrical contact for depositing the additive metal layer (electrolytic plating) is not required, so high-density mounting on a printed circuit board or the like is required. It becomes possible to deal with
【００３３】[0033]
【実施例】以下、本発明の効果を確認するために行った
実施例に基づいて詳細に説明をする。なお，下記におけ
る浴組成は全て純分換算値で表示をした。EXAMPLES The present invention will be described in detail below based on examples carried out to confirm the effects of the present invention. In addition, all bath compositions shown below are shown in terms of pure content.
【００３４】被処理体は、「ガラス繊維強化エポキシ銅
貼板で構成されたプリント回路基板（以下ＰＣ板と言
う）を、５％過硫酸ソーダ中でブラッシングしてＰＣ板
表面の酸化膜を除去したもの。」を使用した。The object to be treated was "a printed circuit board (hereinafter referred to as a PC board) composed of a glass fiber reinforced epoxy copper-clad board was brushed in 5% sodium persulfate to remove the oxide film on the surface of the PC board. What was done. "
【００３５】＜実施例１＞置換めっき浴（ホウフッ化
錫：３０ｇ／Ｌ、チオ尿素：７５ｇ／Ｌ、浴温：８０
℃）にＰＣ板を５秒間浸漬して触媒化処理（表面活性化
処理）を施した後、錫不均化反応めっき浴（水酸化カリ
ウム：２８０ｇ／Ｌ、塩化第一錫：９０ｇ／Ｌ、浴温：
９０℃）にＰＣ坂を３時間浸漬して不均化反応めっきを
行い、３０μｍの錫層を形成した。Example 1 Displacement plating bath (tin borofluoride: 30 g / L, thiourea: 75 g / L, bath temperature: 80)
After immersing the PC plate in (° C.) For 5 seconds to carry out a catalytic treatment (surface activation treatment), a tin disproportionation reaction plating bath (potassium hydroxide: 280 g / L, stannous chloride: 90 g / L, Bath temperature:
The PC slope was immersed in (90 ° C.) for 3 hours to carry out disproportionation reaction plating to form a tin layer of 30 μm.
【００３６】次に、このＰＣ板を、インジウム置換めっ
き浴（硫酸インジウム：２０ｇ／Ｌ、ｐＨ：２．５、浴
温：２５℃）に浸漬して５．３μｍのインジウム層（添
加金属層）を形成した。Next, this PC plate was immersed in an indium displacement plating bath (indium sulfate: 20 g / L, pH: 2.5, bath temperature: 25 ° C.) to make a 5.3 μm indium layer (added metal layer). Was formed.
【００３７】この錫・インジウムを積層被覆したＰＣ板
を、２１０℃×１５秒の条件で、グリコール系浴の中に
浸漬して加熱処理を行い、積層金属を合金化した。The PC plate laminated and coated with tin / indium was immersed in a glycol bath at 210 ° C. for 15 seconds for heat treatment to alloy the laminated metal.
【００３８】得られた錫／インジウム合金被覆層は融点
２００℃で優れた蝋剤特性を示した。The resulting tin / indium alloy coating layer exhibited excellent brazing properties at a melting point of 200 ° C.
【００３９】＜実施例２＞実施例１において、添加金属
層の形成を、ビスマス置換めっき浴（硝酸ビスマス：２
０ｇ／Ｌ、浴温：２５℃）に浸漬して５．５μｍのビス
マス層を形成して行い、かつ、加熱処理を、２２０℃×
１５秒で行った以外は、実施例１と同様にして行った。<Example 2> In Example 1, formation of the additive metal layer was performed by using a bismuth displacement plating bath (bismuth nitrate: 2).
0 g / L, bath temperature: 25 ° C.) to form a bismuth layer of 5.5 μm, and heat treatment is performed at 220 ° C.
The same procedure as in Example 1 was carried out except that it was performed for 15 seconds.
【００４０】得られた錫／ビスマス合金被覆層は融点２
００℃で優れた蝋剤特性を示した。The obtained tin / bismuth alloy coating layer has a melting point of 2
It showed excellent wax properties at 00 ° C.
【００４１】＜実施例３＞実施例１において、錫層を形
成を、４ｈ浸漬して５０μｍの錫層を形成して行い、か
つ、添加金属層の形成を、硫酸銅置換めっき浴（硫酸
銅：２５０ｇ／Ｌ、エチルアルコール：５０ｇ／Ｌ、浴
温：２５℃）に浸漬して１．８μｍの銅層を形成し、さ
らに、無電解銀めっき浴（硝酸銀：３．５ｇ／Ｌ、ロッ
シェル塩：２ｇ／Ｌ、アンモニア：３ｇ／Ｌ、ＫＯＨ：
５．６ｇ／Ｌ、浴温：２５℃）に浸漬して０．２μｍの
銀層を形成して行い、また、加熱処理を、２３０℃×１
５秒で行った以外は、実施例１と同様にして行った。<Example 3> In Example 1, a tin layer was formed by immersing for 4 h to form a 50 μm tin layer, and an additive metal layer was formed by a copper sulfate displacement plating bath (copper sulfate). : 250 g / L, ethyl alcohol: 50 g / L, bath temperature: 25 ° C.) to form a 1.8 μm copper layer, and further electroless silver plating bath (silver nitrate: 3.5 g / L, Rochelle salt) : 2 g / L, ammonia: 3 g / L, KOH:
5.6 g / L, bath temperature: 25 ° C.) to form a 0.2 μm silver layer, and heat treatment is performed at 230 ° C. × 1.
The same procedure as in Example 1 was carried out except that the procedure was carried out for 5 seconds.
【００４２】得られた錫／銅／銀合金被覆層は融点２２
０℃で優れた蝋剤特性を示した。The obtained tin / copper / silver alloy coating layer had a melting point of 22.
It showed excellent wax properties at 0 ° C.
【００４３】＜実施例４＞実施例３において、添加金属
層の形成を、アンチモン置換めっき浴（酒石酸アンチモ
ニルカリウム：５０ｇ／Ｌ、酒石酸：１５０ｇ／Ｌ、浴
温：２５℃）に浸漬して５．５μｍのビスマス層を形成
して行い、かつ、加熱処理を、２５０℃×１５秒で行っ
た以外は、実施例３と同様にして行った。<Example 4> In Example 3, the formation of the added metal layer was immersed in an antimony displacement plating bath (potassium antimonyl tartrate: 50 g / L, tartaric acid: 150 g / L, bath temperature: 25 ° C). The same procedure as in Example 3 was performed except that a bismuth layer having a thickness of 5.5 μm was formed and the heat treatment was performed at 250 ° C. for 15 seconds.
【００４４】得られた錫／アンチモン合金被覆層は融点
２４０℃で優れた蝋剤特性を示した。The resulting tin / antimony alloy coating layer exhibited excellent brazing properties at a melting point of 240 ° C.
【００４５】＜実施例５＞実施例３において、添加金属
層の形成を、無電解銀めっき浴による銀層の厚みを１．
３μｍとした以外は、実施例３と同様にして行った。<Example 5> In Example 3, formation of the additive metal layer was performed by setting the thickness of the silver layer in the electroless silver plating bath to 1.
The same procedure as in Example 3 was performed except that the thickness was 3 μm.
【００４６】得られた錫／銀合金被覆層は融点２２０℃
で優れた蝋剤特性を示した。The obtained tin / silver alloy coating layer had a melting point of 220 ° C.
Showed excellent wax properties.
【００４７】＜実施例６＞実施例３において、添加金属
層の形成を、亜鉛電解めっき浴（塩化亜鉛：１００ｇ／
Ｌ、塩化アンモニウム：１８０ｇ／Ｌ、浴温：２５℃、
電流密度：２Ａ／ｄｍ2 ）で電解めっきを行って５μｍ
の亜鉛層を形成して行った以外は、実施例３と同様にし
て行った。<Example 6> In Example 3, formation of the additive metal layer was performed by using a zinc electrolytic plating bath (zinc chloride: 100 g /
L, ammonium chloride: 180 g / L, bath temperature: 25 ° C.,
Current density: 2 A / dm 2 ) and electroplating 5 μm
Example 3 was repeated except that the zinc layer was formed.
【００４８】得られた錫／亜鉛合金被覆層は融点２００
℃で優れた蝋剤特性を示した。The obtained tin / zinc alloy coating layer had a melting point of 200.
It showed excellent wax properties at ℃.
Claims (4)
であって、 不均化反応めっきにより錫層を析出させ、 該錫層上に、錫合金を組成する添加金属層を１層または
２層以上析出させた後、加熱処理により合金化させる、 ことを特徴とする錫合金被膜の形成方法。1. A method for forming a tin alloy coating film on an object to be processed, comprising depositing a tin layer by disproportionation reaction plating, and adding one layer of an additive metal layer forming a tin alloy on the tin layer. Alternatively, a method of forming a tin alloy coating is characterized in that two or more layers are deposited and then alloyed by heat treatment.
添加金属が、アンチモン、インジウム、ビスマス、銅、
銀、亜鉛のいずれからか選択されることを特徴とする錫
合金被膜の形成方法。2. The additive metal in combination with tin according to claim 1, wherein the additive metal is antimony, indium, bismuth, copper,
A method for forming a tin alloy coating film, which is selected from silver and zinc.
される添加金属（亜鉛を除く）の供給を無電解めっきに
より行うことを特徴とする錫合金被膜の形成方法。3. The method for forming a tin alloy coating film according to claim 1, wherein the additive metal (excluding zinc) combined with tin is supplied by electroless plating.
される添加金属の供給を電解めっきにより行うことを特
徴とする錫合金被膜の形成方法。4. The method for forming a tin alloy coating film according to claim 1, wherein the additive metal combined with tin is supplied by electrolytic plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4098295A JPH08239774A (en) | 1995-02-28 | 1995-02-28 | Formation of tin alloy film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4098295A JPH08239774A (en) | 1995-02-28 | 1995-02-28 | Formation of tin alloy film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08239774A true JPH08239774A (en) | 1996-09-17 |
Family
ID=12595646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4098295A Withdrawn JPH08239774A (en) | 1995-02-28 | 1995-02-28 | Formation of tin alloy film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08239774A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109763013A (en) * | 2019-03-04 | 2019-05-17 | 东南大学 | A kind of preparation method of superfine foam tin-based material |
-
1995
- 1995-02-28 JP JP4098295A patent/JPH08239774A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109763013A (en) * | 2019-03-04 | 2019-05-17 | 东南大学 | A kind of preparation method of superfine foam tin-based material |
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