JPH08236895A - Printed board - Google Patents

Printed board

Info

Publication number
JPH08236895A
JPH08236895A JP3633295A JP3633295A JPH08236895A JP H08236895 A JPH08236895 A JP H08236895A JP 3633295 A JP3633295 A JP 3633295A JP 3633295 A JP3633295 A JP 3633295A JP H08236895 A JPH08236895 A JP H08236895A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
conductor
board
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3633295A
Other languages
Japanese (ja)
Inventor
Toshiharu Sawa
俊治 佐波
Yoshiki Hayashi
由樹 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba IT and Control Systems Corp
Original Assignee
Toshiba Corp
Toshiba MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba MEC Co Ltd filed Critical Toshiba Corp
Priority to JP3633295A priority Critical patent/JPH08236895A/en
Publication of JPH08236895A publication Critical patent/JPH08236895A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE: To improve the storage efficiency of a board and reduce the number of processes at low cost by combining a plurality of printed boards by connecting them by a conductor which electrically connects the boards and also operates as a hinge. CONSTITUTION: A flexible conductor 11 is inserted into each conductor mounting hole of a printed board 21 and a separate board 25. Then, an electronic component 8 and the conductor 11 is soldered at one time, the temporary junction part 10 of the separate board 25 is separated by cutting at the inserting port 15 by nippers. The separate board 25 is bent at the conductor 11 vertically to the printed board 21, and the separate board forms three-dimensional body with the plurality of printed boards 2 which form a flat body. Thus, the separate board 25 is erected by bending the conductor 11. Since the conductor 11 also electrically connects the printed board 21 and the separate board 25, the conventional connecting operation is eliminated. Therefore, the storage efficiency of the board is improved and the number of processes is reduced at low cost.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は多数枚取り実装の印刷配
線板の接合固定及び電気的接続の構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for joining and fixing and electrical connection of a printed wiring board which is mounted on a plurality of sheets.

【0002】[0002]

【従来の技術】図7は従来の印刷配線板と別の印刷配線
板との接続方法を示す斜視図であり、図8は印刷配線板
が別の印刷配線板と接続された状態を示す接合部の断面
図である。
2. Description of the Related Art FIG. 7 is a perspective view showing a method of connecting a conventional printed wiring board to another printed wiring board, and FIG. 8 is a joint showing a state in which the printed wiring board is connected to another printed wiring board. It is sectional drawing of a part.

【0003】1は平面状の印刷配線板、2はこの印刷配
線板上において平行に両端面近くまで延設された導体パ
ターン、3はこの導体パターン2に対応し印刷配線板1
の両端面にほぼ1列状に設けられたL字状の端子、4は
導体パターン2と端子3とを接続する半田である。
Reference numeral 1 is a flat printed wiring board, 2 is a conductor pattern extending in parallel to both end surfaces of the printed wiring board, and 3 is a printed wiring board 1 corresponding to the conductor pattern 2.
L-shaped terminals, which are provided on both end surfaces in a substantially single line, are solders for connecting the conductor patterns 2 and the terminals 3.

【0004】一方、5は平板状の別の印刷配線板で、6
は上記端子3に対応して2列に印刷配線板5に開けた半
田付用穴、7は印刷配線板5上において穴6に個々延設
された導体パターン、8は電子部品である。印刷配線板
5は半田9により接続されることにより、印刷配線板
1,5どうしが接続固定され電気的接続されたものであ
る。
On the other hand, 5 is another flat printed wiring board, and 6
Are soldering holes formed in the printed wiring board 5 in two rows corresponding to the terminals 3, 7 are conductor patterns individually extended in the holes 6 on the printed wiring board 5, and 8 is an electronic component. The printed wiring board 5 is connected by solder 9 so that the printed wiring boards 1 and 5 are connected and fixed and electrically connected.

【0005】また第2の従来例として、特公昭63−2
73391号公報に示されるように、金属ベース基板材
料からなる断面逆U字状の印刷配線板を端面付近まで延
設された導体パターンを設け、もう一方の平方の印刷基
板に穴を設け、その穴に延設された導体パターンを設け
たものに挿入することにより、金属ベース基板と印刷配
線板が機械的接続、電気的接続されたものもある。
As a second conventional example, Japanese Patent Publication No. 63-2.
As shown in Japanese Patent No. 73391, a printed wiring board having an inverted U-shaped cross section made of a metal base substrate material is provided with a conductor pattern extending to the vicinity of an end face, and a hole is provided in the other square printed board. There is also one in which a metal base substrate and a printed wiring board are mechanically and electrically connected by being inserted into a conductor pattern extending in a hole.

【0006】また、図9に示す第3の従来例として、印
刷配線板1と別の印刷配線板5の接続をフレキシブル基
板17で接続し、フレキシブル基板17自身で折曲げて
別の印刷配線板5に設けた取付け治具18により、印刷
配線板1,5どうしの機械的接続,電気的接続されたも
のもある。
Further, as a third conventional example shown in FIG. 9, the printed wiring board 1 and another printed wiring board 5 are connected by a flexible board 17, and the flexible board 17 itself is bent to form another printed wiring board. There is also one in which the printed wiring boards 1 and 5 are mechanically and electrically connected to each other by a mounting jig 18 provided on the printed wiring board 1.

【0007】[0007]

【発明が解決しようとする課題】このような最初に示し
た従来の方法では、印刷配線板1,5どうしの接続をす
るためには、夫々の印刷配線板1,5を予め電子部品8
に半田付けし、組立てた後にL字状の端子3を一本一本
後付けする必要があるため、後工程で半田付け工程が増
えて工数がかかる。
In the first conventional method as described above, in order to connect the printed wiring boards 1 and 5 to each other, the printed wiring boards 1 and 5 are preliminarily connected to the electronic component 8 respectively.
Since it is necessary to solder each of the L-shaped terminals 3 after assembling and to assemble them, the number of man-hours is increased due to an increase in the soldering process in the post process.

【0008】また、断面逆U字状の金属ベース基板を挿
入する第2の従来例においても、上記のように電子部品
を印刷配線板に半田付けし組立てた後に、後付け工程で
半田付けするので工程が増え、工数がかかると共に金属
ベース基板自体が高価になるという問題点があった。
Also, in the second conventional example in which a metal base substrate having an inverted U-shaped cross section is inserted, after the electronic components are soldered and assembled to the printed wiring board as described above, they are soldered in the post-mounting step. There are problems that the number of processes is increased, the number of steps is increased, and the metal base substrate itself is expensive.

【0009】また、第3の従来例において、フレキシブ
ル基板17を用いた従来例においても、フレキシブル基
板17自体が高価であること。またフレキシブル基板1
7単体では、印刷配線板1,5を固定することが出来ず
取付け治具18が必要となる為、組立費と取付け治具費
がかかるという問題があった。
Also, in the third conventional example, even in the conventional example using the flexible substrate 17, the flexible substrate 17 itself is expensive. Flexible substrate 1
In the case of 7 alone, the printed wiring boards 1 and 5 cannot be fixed and the mounting jig 18 is required, so that there is a problem that the assembly cost and the mounting jig cost are required.

【0010】本発明は、上記のような問題点を解決する
ためのもので、基板の収納効率を向上させると共に、安
価で工数を低減する複数枚の組合わせ印刷配線板を提供
することを目的とする。
SUMMARY OF THE INVENTION The present invention is intended to solve the above problems, and an object thereof is to provide a plurality of combined printed wiring boards which improve the storage efficiency of substrates and are inexpensive and reduce the number of steps. And

【0011】[0011]

【課題を解決するための手段】この問題を解決するため
に本発明は、請求項1では電子部品を搭載した多数枚の
印刷配線板を組合わせて回路を構成する印刷配線板にお
いて、前記多数枚の印刷配線板を電気的接続とヒンジ構
成を兼備する導体で接続して組合わせ形成した印刷配線
板である。
In order to solve this problem, the present invention provides a printed wiring board in which a plurality of printed wiring boards carrying electronic components are combined to form a circuit. The printed wiring board is formed by combining a plurality of printed wiring boards with a conductor having both electrical connection and hinge structure.

【0012】そして、前記導体は可撓性を有し、折曲げ
て使用するものである。また、前記導体の中心部には切
欠部を設けてある。さらには、導体で折曲げた印刷配線
板を支持部で支持している。そして、折曲げる印刷配線
板は基盤となる印刷配線板と仮接合部で連結された状態
である。
The conductor is flexible and is used by bending. Further, a cutout is provided in the center of the conductor. Further, the printed wiring board bent by the conductor is supported by the supporting portion. The printed wiring board to be bent is in a state of being connected to the printed wiring board to be a base at a temporary joining portion.

【0013】[0013]

【作用】本発明では、可撓性を有する導体で多数枚取り
印刷配線板を接続することにより、多数枚組合わせ実装
する印刷配線板において、同時に電子部品を搭載でき、
印刷配線板どうしの接続工程が削除され作業性が向上す
る。
According to the present invention, by connecting a multi-wiring printed wiring board with a flexible conductor, it is possible to simultaneously mount electronic components on a printed wiring board that is mounted in combination with a large number of printed wiring boards.
The workability is improved by eliminating the step of connecting printed wiring boards.

【0014】また、可撓性を有する導体なので、電気的
接続がえられなおかつ可撓性を有する胴体そのものに機
械的強度があるので、折曲げた際に可撓性を有する導体
で支えることが可能となり折曲げた角度が自由にでき
る。また可撓性を有する導体の折曲げ部に切り欠きを設
けることにより、可撓性を有する導体の折曲げ時に基板
に作用する力を極力小さくする。また取付けをそれより
強固にする場合は、折曲げた基板を固定ピンで接続可能
とした構造とすることによりスペースを有効に活用でき
る。
Further, since it is a flexible conductor, the flexible body itself can be electrically connected and has a mechanical strength. Therefore, it can be supported by a flexible conductor when bent. It becomes possible and the bending angle can be freely set. Further, by providing a cutout in the bent portion of the flexible conductor, the force acting on the substrate during bending of the flexible conductor is minimized. When the mounting is made stronger than that, the space can be effectively utilized by providing a structure in which the bent substrate can be connected by the fixing pin.

【0015】[0015]

【実施例】以下本発明の一実施例について図1乃至図3
を参照して説明する。図1において、21は1枚の分割
可能な印刷配線板21で、この印刷配線板21の例えば
四隅の一角を分離可能な印刷配線板である分割印刷配線
板25(以下分割板という)を形成しておく。この分割
板25の一辺は基盤となる元の印刷配線板21と切断さ
れた切断面21a,25aがあり、この一辺と直角方向
にある他辺には分割板25と印刷配線板21を基板ミシ
ン目或いはVカット等で接合された仮接合部10が形成
されている。そして、前記切断面21a,25aの近傍
で印刷配線板21,分割板25の夫々に導体取付穴16
が穿孔されている。11は銅やアルミニウム等の導電材
で可撓性を有し、平板をコの字状に曲げて形成した導体
である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to. In FIG. 1, reference numeral 21 is a single dividable printed wiring board 21, and a divided printed wiring board 25 (hereinafter referred to as a divisor) is formed, for example, a printed wiring board capable of separating one corner of the printed wiring board 21. I'll do it. One side of the dividing plate 25 has cut surfaces 21a and 25a that are cut from the original printed wiring board 21 serving as a base, and the other side which is perpendicular to the one side has the dividing plate 25 and the printed wiring board 21 on the substrate sewing machine. A temporary joining portion 10 joined by eyes or V-cut is formed. Then, in the vicinity of the cut surfaces 21a and 25a, the conductor mounting holes 16 are formed in the printed wiring board 21 and the division plate 25, respectively.
Is perforated. Reference numeral 11 denotes a conductor made of a conductive material such as copper or aluminum, which is flexible and is formed by bending a flat plate into a U-shape.

【0016】次に印刷配線板21から分割板25の分離
形成について説明する。まず、この分割板25上と印刷
配線板21上に実装機,部品搭載機等で電子部品8を搭
載する。続いて、図2に示すように印刷配線板21と分
割板25の夫々の導体取付穴16に可撓性を有する導体
11を挿入実装する。そして電子部品8と導体11を一
括で半田付けを行い、分割板25の仮接合部10を挿入
口15でニッパーにより切り離す。その後は導体11部
分で折曲げ、例えば図3に示すように印刷配線板21に
対し分割板25の角度が直角になる様形成し、平面体で
あった多数枚の印刷配線板21に対し分割板25を立体
にする(図6参照)。
Next, separation and formation of the division plate 25 from the printed wiring board 21 will be described. First, the electronic component 8 is mounted on the division plate 25 and the printed wiring board 21 by a mounting machine, a component mounting machine, or the like. Subsequently, as shown in FIG. 2, the flexible conductor 11 is inserted and mounted in the conductor mounting holes 16 of the printed wiring board 21 and the division plate 25. Then, the electronic component 8 and the conductor 11 are collectively soldered, and the temporary joint portion 10 of the division plate 25 is separated at the insertion port 15 by a nipper. After that, the conductor 11 is bent and formed, for example, as shown in FIG. 3, so that the division plate 25 is at a right angle to the printed wiring board 21 and divided into a large number of flat printed wiring boards 21. The plate 25 is made three-dimensional (see FIG. 6).

【0017】ここで、もし可撓性を有する導体11が、
フレキシブル基板17ならば容易に折曲げることができ
るが、柔らかいため機械的強度の面で不十分であるの
で、印刷配線板21に対し分割板25を立設することが
できないが、本実施例では導体11が可撓性を有するの
でこれが可能となる。また、印刷配線板21,25の材
料がガラスエポキシや紙フェノールのような固い印刷配
線板であると折曲げることができないが、導体11の折
曲げによって分割板25の立設が可能となる。
Here, if the flexible conductor 11 is
The flexible board 17 can be easily bent, but since it is soft and insufficient in terms of mechanical strength, the division plate 25 cannot be erected on the printed wiring board 21, but in the present embodiment. This is possible because the conductor 11 is flexible. Further, if the material of the printed wiring boards 21 and 25 is a hard printed wiring board such as glass epoxy or paper phenol, it cannot be bent, but by bending the conductor 11, the division plate 25 can be erected.

【0018】また、従来の例で示した印刷配線板1,5
をL字形状の端子3で接続する方法や、金属ベース基板
を折曲げて接続する方法では、それぞれの印刷配線板
1,5を別々に組立てた後に、印刷配線板1,5どうし
の接続を余分に行う必要があった。しかし、本実施例で
は導体11で印刷配線板21と分割板25が電気的な接
続の役目もするので従来の様な接続作業が不要となっ
た。
Also, the printed wiring boards 1 and 5 shown in the conventional example.
In the method of connecting with the L-shaped terminal 3 or the method of bending and connecting the metal base substrate, the printed wiring boards 1 and 5 are assembled separately, and then the printed wiring boards 1 and 5 are connected to each other. I had to do extra. However, in the present embodiment, the printed wiring board 21 and the dividing plate 25 also serve as an electrical connection in the conductor 11, so that the conventional connection work is unnecessary.

【0019】(他の実施例)図4に示すように、印刷配
線板25を折曲げた際に発生する応力を、印刷配線板2
5に搭載した電子部品8や半田付け部に影響を及ぼさな
くする為に、可撓性を有する導体11の中心部に切欠部
12を設け、折曲げ時の荷重を集中させ、印刷配線板2
5の信頼性を向上させる。
(Other Embodiments) As shown in FIG. 4, the stress generated when the printed wiring board 25 is bent is reduced by the printed wiring board 2.
In order to prevent the electronic parts 8 and the soldering parts mounted on the printed circuit board 5 from being affected, a cutout 12 is provided at the center of the flexible conductor 11 to concentrate the load at the time of bending, and the printed wiring board 2
Improve the reliability of 5.

【0020】また、図5に示すように可撓性を有する導
体11部分で折曲げた印刷配線板25に支持部16を設
け、印刷配線板25に固定ピン13を1個又は複数個設
け折曲げた後に、支持部16,固定ピン13で印刷配線
板21と印刷配線板25を固定することにより強固な固
定にしてもよい。
As shown in FIG. 5, the printed wiring board 25 bent at the flexible conductor 11 is provided with the support portion 16, and the printed wiring board 25 is provided with one or more fixing pins 13. After bending, the printed wiring board 21 and the printed wiring board 25 may be firmly fixed by fixing the printed wiring board 21 and the fixing pin 13 with the support portion 16.

【0021】更に前記導体11は平板をコの字状に折曲
げて形成したが、この平板の表面に絶縁被膜を形成して
他の部品に対して電気絶縁性を保持する。また、平板に
変えて絶縁電線を集合結束状態で導体を形成する。この
場合、印刷配線板21と分割板26との電気部品8の個
々に対しての電気的接続を可能とする効果が追加され
る。
Further, the conductor 11 is formed by bending a flat plate into a U-shape, and an insulating coating is formed on the surface of the flat plate to maintain electric insulation with respect to other parts. In addition, instead of a flat plate, the conductors are formed in a bundled state of the insulated electric wires. In this case, the effect that the printed wiring board 21 and the division plate 26 can be electrically connected to each of the electric components 8 is added.

【0022】更に分割板26に第2分割板を導体11を
介して取付け、この第2分割板を印刷配線板21と平行
配設か、或いは分割板26と平行配設によっても空間を
有効活用できる。
Further, a second dividing plate is attached to the dividing plate 26 via the conductor 11, and the second dividing plate is arranged in parallel with the printed wiring board 21 or is arranged in parallel with the dividing plate 26 to effectively utilize the space. it can.

【0023】以上の様に、印刷配線板21と分割板25
に電子部品8を搭載し、且つ夫々の導体取付穴16に導
体11を挿入接続した後、半田付工程で一括半田付けを
行うので印刷配線板21と分割板25間の接続に要する
後付け工程が削除でき、工数を大幅に低減できるという
効果がある。
As described above, the printed wiring board 21 and the dividing plate 25
After mounting the electronic component 8 on each of them and inserting and connecting the conductors 11 into the respective conductor mounting holes 16, batch soldering is performed in the soldering process, so that the post-mounting process required for connection between the printed wiring board 21 and the dividing plate 25 There is an effect that it can be deleted and the man-hour can be significantly reduced.

【0024】また、可撓性を有する導体11に切欠部を
設けることにより、折曲げ時に印刷配線板1,5に曲げ
のストレスが作用しなくなり曲げ時の品質が向上する。
或いは、平面体であった多数枚の印刷配線板を立体にで
きるため、製品の中に多数枚の印刷配線板をセットする
ことができ、スペースが有効に活用できる。また、立設
後に印刷配線板に固定ピン、印刷配線板に支持部を設け
印刷配線板をより強固に固定できる。導体は、導電材料
で且つ可撓性を有しているので、電気的接続を印刷配線
板を強固に支持し、ヒンジ機構を兼備する効果がある。
Further, by providing the notch in the flexible conductor 11, the bending stress does not act on the printed wiring boards 1 and 5 at the time of bending, and the quality at the time of bending is improved.
Alternatively, since a large number of printed wiring boards, which were planar bodies, can be made into three-dimensional bodies, a large number of printed wiring boards can be set in a product, and space can be effectively utilized. Further, after the standing, the printed wiring board can be fixed more firmly by providing the printed wiring board with the fixing pin and the printed wiring board with the supporting portion. Since the conductor is a conductive material and has flexibility, it has the effect of firmly supporting the printed wiring board for electrical connection and also serving as a hinge mechanism.

【0025】[0025]

【発明の効果】以上のように本発明によれば、多数枚の
実装印刷配線板どうしの接続を可撓性を有する導体を用
いることで、1度の工程で接続できる為、工数が大幅に
低減できる。また、可撓性を有する導体部分で任意の角
度で折曲げて立方形状をとることができるため、製品の
小型化,省スペース化に寄与する。
As described above, according to the present invention, since a large number of mounting printed wiring boards can be connected to each other by using a flexible conductor in one step, the number of steps can be significantly increased. It can be reduced. Further, since the flexible conductor portion can be bent at an arbitrary angle to form a cubic shape, it contributes to downsizing of the product and space saving.

【0026】或いは、可撓性を有する導体に切欠部を設
けることにより折曲げ時に印刷配線板にストレスをかけ
ることがなくなって品質の向上が図れ、且つ折曲げた後
に固定ピンで印刷配線板を固定することにより強固な固
定が可能となり、振動等で強固な固定が必要とされる所
も保持が可能となる。
Alternatively, by providing the notch in the flexible conductor, stress is not applied to the printed wiring board at the time of bending so that the quality can be improved, and after the bending, the printed wiring board is fixed with the fixing pin. By fixing it, it becomes possible to firmly fix it, and it becomes possible to hold it at a place where strong fixing is required due to vibration or the like.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例による印刷配線板の斜視図、FIG. 1 is a perspective view of a printed wiring board according to an embodiment of the present invention,

【図2】図1の接合部の断面図、2 is a cross-sectional view of the joint portion of FIG. 1,

【図3】印刷配線板を曲げた時の断面図、FIG. 3 is a sectional view of the printed wiring board when it is bent,

【図4】導体の切欠部説明図、FIG. 4 is an explanatory view of a notch portion of a conductor,

【図5】分割印刷配線板の取付状態図、FIG. 5 is a diagram showing how the printed wiring board is attached,

【図6】分割印刷配線板の立設状態図、FIG. 6 is a view showing a state where the divided printed wiring board is erected,

【図7】従来の図1相当図、FIG. 7 is a view equivalent to FIG. 1 of the related art,

【図8】従来の印刷配線基板の接合方法を示す断面図、FIG. 8 is a cross-sectional view showing a conventional method for joining printed wiring boards,

【図9】従来の印刷配線板のフレキシブル接合を示す斜
視図。
FIG. 9 is a perspective view showing flexible joining of a conventional printed wiring board.

【符号の説明】[Explanation of symbols]

1,5,21…印刷配線板、 2,7…導体パター
ン、8…電気部品、 10…仮接合
部、11…導体、 12…切欠部、
13…固定ピン、 26…分割印刷配線
板。
1, 5, 21 ... Printed wiring board, 2, 7 ... Conductor pattern, 8 ... Electrical component, 10 ... Temporary joint part, 11 ... Conductor, 12 ... Notch part,
13 ... Fixed pin, 26 ... Split printed wiring board.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 電子部品を搭載した多数枚の印刷配線板
を組合わせて回路を構成する印刷配線板において、前記
多数枚の印刷配線板を電気的接続とヒンジ構成を兼備す
る導体で接続して組合わせ形成したことを特徴とする印
刷配線板。
1. A printed wiring board in which a circuit is formed by combining a large number of printed wiring boards on which electronic parts are mounted, and the plurality of printed wiring boards are connected by a conductor having both electrical connection and hinge configuration. A printed wiring board characterized by being formed in combination with each other.
【請求項2】 前記導体は可撓性を有し、折曲げて使用
する請求項1記載の印刷配線板。
2. The printed wiring board according to claim 1, wherein the conductor has flexibility and is used by bending.
【請求項3】 前記導体の中心部に切欠部を設けた請求
項2記載の印刷配線板。
3. The printed wiring board according to claim 2, wherein a notch is provided in the center of the conductor.
【請求項4】 導体で折曲げた印刷配線板を支持部で支
持された請求項1記載の印刷配線板。
4. The printed wiring board according to claim 1, wherein the printed wiring board bent by a conductor is supported by a supporting portion.
【請求項5】 折曲げる印刷配線板は基盤となる印刷配
線板と仮接合部で連結された請求項1記載の印刷配線
板。
5. The printed wiring board according to claim 1, wherein the bent printed wiring board is connected to the printed wiring board as a base at a temporary joint portion.
JP3633295A 1995-02-24 1995-02-24 Printed board Pending JPH08236895A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3633295A JPH08236895A (en) 1995-02-24 1995-02-24 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3633295A JPH08236895A (en) 1995-02-24 1995-02-24 Printed board

Publications (1)

Publication Number Publication Date
JPH08236895A true JPH08236895A (en) 1996-09-13

Family

ID=12466882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3633295A Pending JPH08236895A (en) 1995-02-24 1995-02-24 Printed board

Country Status (1)

Country Link
JP (1) JPH08236895A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912519A1 (en) * 1999-03-19 2000-11-16 Siemens Ag Method of electrically connecting circuit boards
WO2001026434A1 (en) * 1999-10-01 2001-04-12 Rohm Co., Ltd. Wiring board having connector and method of manufacturing the same
GB2394121A (en) * 2002-10-09 2004-04-14 Hewlett Packard Development Co Circuit board support arrangement
GB2403602A (en) * 2003-06-30 2005-01-05 Hewlett Packard Development Co Pivoted circuit board arrangement
KR100884881B1 (en) * 2007-10-11 2009-02-23 조동철 Circuit board assembly
CN108174511A (en) * 2018-02-08 2018-06-15 广州视源电子科技股份有限公司 PCB structure, processing method thereof and electronic product
WO2018164206A1 (en) * 2017-03-07 2018-09-13 Ngkエレクトロデバイス株式会社 Insulation circuit board terminal, insulation circuit board composite body, and semiconductor device composite body
US11503721B2 (en) 2018-08-28 2022-11-15 Lg Energy Solution, Ltd. PCB assembly and manufacturing method thereof

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912519C2 (en) * 1999-03-19 2001-05-31 Siemens Ag Process for the electrical connection of printed circuit boards
DE19912519A1 (en) * 1999-03-19 2000-11-16 Siemens Ag Method of electrically connecting circuit boards
KR100735351B1 (en) * 1999-10-01 2007-07-04 로무 가부시키가이샤 Wiring board having connector and method of manufacturing the same
US6663400B1 (en) 1999-10-01 2003-12-16 Rohn Co., Ltd. Wiring board having connector and method of manufacturing the same
WO2001026434A1 (en) * 1999-10-01 2001-04-12 Rohm Co., Ltd. Wiring board having connector and method of manufacturing the same
GB2394121A (en) * 2002-10-09 2004-04-14 Hewlett Packard Development Co Circuit board support arrangement
US6822878B2 (en) 2002-10-09 2004-11-23 Hewlett-Packard Development Company, L.P. Circuit board support arrangement, method, and method for using the same
GB2394121B (en) * 2002-10-09 2005-12-07 Hewlett Packard Development Co Circuit board support arrangement,method,and method for using the same
GB2403602A (en) * 2003-06-30 2005-01-05 Hewlett Packard Development Co Pivoted circuit board arrangement
GB2403602B (en) * 2003-06-30 2007-01-10 Hewlett Packard Development Co Pivoted circuit board arrangement
KR100884881B1 (en) * 2007-10-11 2009-02-23 조동철 Circuit board assembly
WO2018164206A1 (en) * 2017-03-07 2018-09-13 Ngkエレクトロデバイス株式会社 Insulation circuit board terminal, insulation circuit board composite body, and semiconductor device composite body
CN108174511A (en) * 2018-02-08 2018-06-15 广州视源电子科技股份有限公司 PCB structure, processing method thereof and electronic product
US11503721B2 (en) 2018-08-28 2022-11-15 Lg Energy Solution, Ltd. PCB assembly and manufacturing method thereof

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