JPH08227952A - Power module - Google Patents
Power moduleInfo
- Publication number
- JPH08227952A JPH08227952A JP7030603A JP3060395A JPH08227952A JP H08227952 A JPH08227952 A JP H08227952A JP 7030603 A JP7030603 A JP 7030603A JP 3060395 A JP3060395 A JP 3060395A JP H08227952 A JPH08227952 A JP H08227952A
- Authority
- JP
- Japan
- Prior art keywords
- case
- heat
- power module
- contact piece
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、パワーモジュールに係
わり、より詳細には発熱部品の発生する熱を効率的にケ
ースの外部に放出する放熱構造を備えたパワーモジュー
ルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power module, and more particularly to a power module having a heat dissipation structure for efficiently dissipating heat generated by heat-generating components to the outside of a case.
【０００２】[0002]
【従来の技術】従来、パワーモジュールとしては、第６
図に示すものが知られている。基板１には発熱部品１ａ
や通常の部品１ｂが搭載され、同基板１はケース２内に
ねじ２ａによって固定されている。上記の構成からなる
パワーモジュールにおいて、発熱部品１ａが発生する熱
は接続用リード１ｃを通して、あるいはケース２内部の
空気の対流及び伝導によってケース２に伝達され、同ケ
ース２を介して外部に放出される。しかしながら、パワ
ーモジュールの発生する熱が大きい場合、前述した構造
では放熱効果が不充分になり、パワーモジュール内部に
熱が蓄積されて温度が上昇し、部品等の信頼性を著しく
低下させるという問題を有していた。2. Description of the Related Art Conventionally, the sixth power module has been used.
The one shown in the figure is known. The heat generating component 1a is provided on the substrate 1.
Ordinary component 1b is mounted, and the substrate 1 is fixed in the case 2 by screws 2a. In the power module having the above structure, the heat generated by the heat-generating component 1a is transmitted to the case 2 through the connecting leads 1c or by the convection and conduction of air inside the case 2, and is radiated to the outside through the case 2. It However, when the heat generated by the power module is large, the heat dissipation effect is insufficient in the above-mentioned structure, heat is accumulated inside the power module, and the temperature rises, which causes a problem that the reliability of parts and the like is significantly reduced. Had.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の問題に
鑑みなされたもので、パワーモジュールの発生する熱が
大きい場合にも充分な放熱効果を得ることを可能にし、
これによって部品等の信頼性を低下させることのないパ
ワーモジュールを提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and makes it possible to obtain a sufficient heat dissipation effect even when the heat generated by the power module is large.
This is to provide a power module that does not reduce the reliability of parts and the like.
【０００４】[0004]
【課題を解決するための手段】本発明は上述の課題を解
決するため、発熱部品を搭載した基板と、同基板を収納
するケースとで構成され、前記発熱部品を基板上に熱良
導体よりなる樹脂によってモールドする一方、前記ケー
スの内面に先端を前記樹脂に接触する接触片を設け、前
記発熱部品の熱を樹脂、接触片およびケースを介して放
熱するようにしてなることを特徴とする。また前記樹脂
がシリコンゴムであることを特徴とする。さらに前記接
触片が複数設けられていることを特徴とする。さらに、
また前記接触片が前記ケースに一体に形成されているこ
とを特徴とする。また前記接触片が溶接によって前記ケ
ースに取付けられていることを特徴とする。また前記発
熱部品を搭載した基板が、前記ケースに収納された第２
の基板の一側に設けられていることを特徴とする。In order to solve the above-mentioned problems, the present invention comprises a substrate on which a heat-generating component is mounted and a case for accommodating the substrate, and the heat-generating component is made of a good heat conductor on the substrate. While being molded with resin, a contact piece whose tip contacts the resin is provided on the inner surface of the case, and the heat of the heat-generating component is radiated through the resin, the contact piece, and the case. The resin is silicon rubber. Further, a plurality of the contact pieces are provided. further,
Further, the contact piece is formed integrally with the case. The contact piece is attached to the case by welding. In addition, the board on which the heat-generating component is mounted is stored in the case,
It is provided on one side of the substrate.
【０００５】[0005]
【作用】上記のように構成したので、本発明によるパワ
ーモジュールにおいては、パワーモジュール内部で発生
した熱を接触片を介し、樹脂モールドからケースに直接
熱を伝導させて外部に放出する。With the above construction, in the power module according to the present invention, the heat generated inside the power module is directly conducted from the resin mold to the case through the contact piece and is radiated to the outside.
【０００６】[0006]
【実施例】以下図に基づいて本発明による一実施例を図
面に基づいて詳細に説明する。尚、図中従来例と同じも
のには同番号を付す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In the figure, the same parts as those in the conventional example are designated by the same reference numerals.
【０００７】図１は本発明によるパワーモジュールの構
成を示し、１は後述するケース２の底面にねじ２ａによ
って取付けられた基板である。同基板１の一側には例え
ば、トランスやパワートランジスタ等の発熱部品１ａ
が、他側には、例えば、小型の抵抗やコンデンサ等のほ
とんど発熱しない部品１ｂがリード１ｃを介して半田付
けされている。２は基板１を収納し、例えば、金属から
なり熱放散性の良好なケースである。３は前記発熱部品
１ａを基板１の上方からモールドした樹脂で、例えば、
熱伝導性の良好で、且つ発熱部品１ａにストレスがかか
らないように弾性のあるシリコンゴムからなる。４は図
２の平面図に示すようにケース２と一体に形成された接
触片で、同ケース２の上面にＨ状の切込みを入れ、同切
込みの両側を下方に折曲し、その結果ケース２の上面に
は開口５が形成される。そして、それぞれの先端を内側
に直角に折曲することによってＬ字状に形成され、樹脂
モールド３の上面に圧接されている。FIG. 1 shows the structure of a power module according to the present invention. Reference numeral 1 denotes a substrate mounted on a bottom surface of a case 2 described later with screws 2a. On one side of the substrate 1, for example, a heat-generating component 1a such as a transformer or a power transistor.
However, on the other side, for example, a component 1b such as a small resistor or a capacitor that hardly generates heat is soldered through the lead 1c. Reference numeral 2 denotes a case that accommodates the substrate 1 and is made of, for example, metal and has a good heat dissipation property. Reference numeral 3 denotes a resin obtained by molding the heat generating component 1a from above the substrate 1, for example,
It is made of silicone rubber having good thermal conductivity and elasticity so that the heat-generating component 1a is not stressed. Reference numeral 4 is a contact piece integrally formed with the case 2 as shown in the plan view of FIG. 2. An H-shaped cut is made on the upper surface of the case 2 and both sides of the cut are bent downward, and as a result, the case is cut. An opening 5 is formed on the upper surface of 2. Then, each tip is bent inward at a right angle to form an L-shape and is pressed against the upper surface of the resin mold 3.
【０００８】上記の構成によれば、発熱体１から生ずる
熱は樹脂モールド３を介して接触片４に伝わり、さら
に、ケース２の表面と開口５を通じて外気中に放散され
る。According to the above construction, the heat generated from the heating element 1 is transmitted to the contact piece 4 through the resin mold 3 and further dissipated into the outside air through the surface of the case 2 and the opening 5.
【０００９】また、図３に示す他の実施例は、ケース２
の側面の横方向にＨ状の切込みを入れ、同切込みの両側
を横方向に折曲し、同切込みの両側のそれぞれの先端を
Ｌ字状になるように直角に折曲して樹脂モールド３の側
面を圧接することによって同樹脂モールド３との接触面
積が大きくなるように形成した接触片４ａを設け、これ
によって一段と放熱効果の大きいパワーモジュールが得
られるようにした一例である。Another embodiment shown in FIG. 3 is a case 2
Make a H-shaped notch in the lateral direction of the side of the notch, bend both sides of the notch laterally, and bend the ends of both ends of the notch at right angles to form an L-shape. This is an example in which a contact piece 4a is formed so as to have a large contact area with the resin mold 3 by pressing the side surface of the contact portion 4a, so that a power module having a greater heat dissipation effect can be obtained.
【００１０】また、図４に示す他の実施例は、ケース２
とは別体に形成され、Ｌ字状に折曲した接触片４ａの上
部をケース２の上面内部の符号２ｂにて示す箇所に溶接
し、同接触片４ａを樹脂モールド３の上面に当接するよ
うにしたもので、ケース２の上面に開口を必要とせず機
密性がを要するパワーモジュールに適用した一例であ
る。Another embodiment shown in FIG. 4 is the case 2
The upper part of the contact piece 4a which is formed separately from and is bent in an L-shape is welded to a portion indicated by reference numeral 2b inside the upper surface of the case 2, and the contact piece 4a is brought into contact with the upper surface of the resin mold 3. This is an example of application to a power module that does not require an opening on the upper surface of the case 2 and requires confidentiality.
【００１１】また、図５に示す他の実施例はケース２を
上部ケース２ｃと下部ケース２ｄに分割したもので、そ
れぞれのケースの間に基板１が挟持され、下部ケース２
ｄに穿設された透孔２ｂから工具等をを用いてねじ２ａ
によって固定したもので、このような構造にすることに
よってケース２の表面積が大きくなり一段と放熱効果の
大きい構造とした一例である。In another embodiment shown in FIG. 5, the case 2 is divided into an upper case 2c and a lower case 2d, and the substrate 1 is sandwiched between the respective cases, and the lower case 2
a screw 2a from the through hole 2b formed in d using a tool or the like.
This is an example of a structure in which the surface area of the case 2 is increased and the heat dissipation effect is further enhanced by the above structure.
【００１２】[0012]
【発明の効果】以上に説明したように、本発明によるパ
ワーモジュールにおいては、同パワーモジュールの内部
で発生する熱を樹脂モールドと接触片およびケースを介
して外部に放出できるので熱放散性が良好となり部品等
の信頼性を向上させたパワーモジュールを提供すること
ができる。As described above, in the power module according to the present invention, the heat generated inside the power module can be released to the outside through the resin mold, the contact piece and the case, so that the heat dissipation is good. It is possible to provide a power module in which reliability of parts and the like is improved.
【図１】本発明によるパワーモジュールの構成を説明す
る要部断面図である。FIG. 1 is a cross-sectional view of an essential part for explaining the configuration of a power module according to the present invention.
【図２】本発明によるパワーモジュールの構成を説明す
る要部平面図である。FIG. 2 is a plan view of relevant parts for explaining the configuration of the power module according to the present invention.
【図３】本発明によるパワーモジュールの他の実施例の
構成を説明する要部断面図である。FIG. 3 is a sectional view of an essential part for explaining the configuration of another embodiment of the power module according to the present invention.
【図４】本発明によるパワーモジュールの接触片の取付
構造の他の実施例を説明する要部断面図である。FIG. 4 is a sectional view of an essential part for explaining another embodiment of the mounting structure for the contact piece of the power module according to the present invention.
【図５】本発明によるパワーモジュールのさらなる他の
実施例の構成を説明する要部断面図である。FIG. 5 is a cross-sectional view of an essential part for explaining the configuration of still another embodiment of the power module according to the present invention.
【図６】従来のパワーモジュールの構成を説明する要部
断面図である。FIG. 6 is a cross-sectional view of essential parts for explaining the configuration of a conventional power module.
１ 基板 １ａ 発熱部品 １ｂ 部品 ２ ケース ２ａ ねじ ３ 樹脂モールド ４ 接触片 ５ 開口 1 substrate 1a heat-generating component 1b component 2 case 2a screw 3 resin mold 4 contact piece 5 opening
Claims (7)
納するケースとで構成され、前記発熱部品を基板上に熱
良導体よりなる樹脂によってモールドする一方、前記ケ
ースの内面に先端を前記樹脂モールドに接触する接触片
を設け、前記発熱部品の熱を樹脂モールド、接触片およ
びケースを介して放熱するようにしてなることを特徴と
するパワーモジュール。1. A substrate having a heat-generating component mounted thereon and a case accommodating the substrate, wherein the heat-generating component is molded on the substrate with a resin made of a good heat conductor, while the tip of the resin is formed on the inner surface of the case. A power module, characterized in that a contact piece that contacts the mold is provided, and the heat of the heat-generating component is radiated through the resin mold, the contact piece and the case.
徴とする請求項１記載のパワーモジュール。2. The power module according to claim 1, wherein the resin is silicone rubber.
特徴とする請求項１、２記載のパワーモジュール。3. The power module according to claim 1, wherein a plurality of the contact pieces are provided.
れていることを特徴とする請求項１、２、３記載のパワ
ーモジュール。4. The power module according to claim 1, wherein the contact piece is formed integrally with the case.
られていることを特徴とする請求項１、２、３記載のパ
ワーモジュール。5. The power module according to claim 1, wherein the contact piece is separately attached to the case.
ースに収納された第２の基板の一側に設けられているこ
とを特徴とする請求項１、２、３、４、５記載のパワー
モジュール。6. The board according to claim 1, wherein the board on which the heat-generating component is mounted is provided on one side of a second board housed in the case. Power module.
成されていることを特徴とする請求項１、２、３、４、
５、６記載のパワーモジュール。7. The case comprises an upper case and a lower case.
The power module described in 5 and 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7030603A JPH08227952A (en) | 1995-02-20 | 1995-02-20 | Power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7030603A JPH08227952A (en) | 1995-02-20 | 1995-02-20 | Power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08227952A true JPH08227952A (en) | 1996-09-03 |
Family
ID=12308454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7030603A Pending JPH08227952A (en) | 1995-02-20 | 1995-02-20 | Power module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08227952A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005512345A (en) * | 2001-12-13 | 2005-04-28 | バレオ エレクトロニク エ システメ デ リアイソン | Power module and power module assembly |
| KR100804565B1 (en) * | 2001-12-27 | 2008-02-20 | 주식회사 만도 | Electric control system for vehicle with radiation and vibroisolating device |
| KR100886289B1 (en) * | 2001-01-11 | 2009-03-04 | 월풀 에쎄.아. | An electronic device |
| JP2013183137A (en) * | 2012-03-05 | 2013-09-12 | Denso Corp | Circuit board and method for mounting circuit component on substrate |
| KR20140131746A (en) * | 2013-05-06 | 2014-11-14 | 삼성전자주식회사 | Controller |
| WO2016067534A1 (en) * | 2014-10-30 | 2016-05-06 | 株式会社デンソー | Electronic apparatus |
| JP2016092398A (en) * | 2014-10-30 | 2016-05-23 | 株式会社デンソー | Electronic device |
| EP2747532B1 (en) * | 2005-11-22 | 2016-12-21 | Samsung Electronics Co., Ltd. | Method of cooling electronic device and electronic device with improved cooling efficiency |
| GB2544348A (en) * | 2015-11-10 | 2017-05-17 | Tridonic Gmbh & Co Kg | Low-profile LED drivers |
| DE102021100050A1 (en) | 2021-01-05 | 2022-07-07 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Device, light module, control unit, and lighting device |
-
1995
- 1995-02-20 JP JP7030603A patent/JPH08227952A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100886289B1 (en) * | 2001-01-11 | 2009-03-04 | 월풀 에쎄.아. | An electronic device |
| JP2005512345A (en) * | 2001-12-13 | 2005-04-28 | バレオ エレクトロニク エ システメ デ リアイソン | Power module and power module assembly |
| KR100804565B1 (en) * | 2001-12-27 | 2008-02-20 | 주식회사 만도 | Electric control system for vehicle with radiation and vibroisolating device |
| EP2747532B1 (en) * | 2005-11-22 | 2016-12-21 | Samsung Electronics Co., Ltd. | Method of cooling electronic device and electronic device with improved cooling efficiency |
| JP2013183137A (en) * | 2012-03-05 | 2013-09-12 | Denso Corp | Circuit board and method for mounting circuit component on substrate |
| KR20140131746A (en) * | 2013-05-06 | 2014-11-14 | 삼성전자주식회사 | Controller |
| WO2016067534A1 (en) * | 2014-10-30 | 2016-05-06 | 株式会社デンソー | Electronic apparatus |
| JP2016092398A (en) * | 2014-10-30 | 2016-05-23 | 株式会社デンソー | Electronic device |
| GB2544348A (en) * | 2015-11-10 | 2017-05-17 | Tridonic Gmbh & Co Kg | Low-profile LED drivers |
| GB2544348B (en) * | 2015-11-10 | 2021-10-13 | Tridonic Gmbh & Co Kg | Low-profile LED drivers |
| DE102021100050A1 (en) | 2021-01-05 | 2022-07-07 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Device, light module, control unit, and lighting device |
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