JPH08203706A - Manufacture of electronic component - Google Patents
Manufacture of electronic componentInfo
- Publication number
- JPH08203706A JPH08203706A JP740695A JP740695A JPH08203706A JP H08203706 A JPH08203706 A JP H08203706A JP 740695 A JP740695 A JP 740695A JP 740695 A JP740695 A JP 740695A JP H08203706 A JPH08203706 A JP H08203706A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- shrinkable tube
- electronic component
- tube
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば水温、油温等の
変化により抵抗値を変えるセンサーとして使用されるサ
ーミスタ素子などの電子部品の製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component such as a thermistor element used as a sensor for changing a resistance value according to a change in water temperature, oil temperature or the like.
【０００２】[0002]
【従来の技術】従来のこの種のサーミスタ素子は、図３
にその構造図を示すようになっていた。すなわちリード
端子部２を備えた素子１とリード線３は、接続材料４に
よって接続後、樹脂材料１５で塗装され、絶縁被覆され
ている。素子１自身の絶縁被覆と合わせると二重被覆と
なっていた。2. Description of the Related Art A conventional thermistor element of this type is shown in FIG.
It was supposed to show the structural drawing. That is, the element 1 provided with the lead terminal portion 2 and the lead wire 3 are connected with the connection material 4 and then coated with the resin material 15 to be insulation-coated. When combined with the insulating coating of the element 1 itself, a double coating was formed.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
従来の製造方法では、樹脂材料への浸漬、硬化が必要で
あるため、作業上の工数、人件費及び治工具等の設備費
によるコストアップが問題となっていた。However, in the above-mentioned conventional manufacturing method, since it is necessary to immerse the resin material in the resin material and to cure the resin material, it is possible to increase the cost due to the man-hours required for the work, the labor cost, and the equipment cost such as jigs and tools. It was a problem.
【０００４】本発明は、上記従来の問題を解決するもの
で、工数削減及び間接材料費削減により、コストダウン
する電子部品の製造方法を提供するものである。The present invention solves the above-mentioned conventional problems, and provides a method of manufacturing an electronic component which reduces costs by reducing man-hours and indirect material costs.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
に本発明は、リード端子部を備えた素子とリード線を接
続後、熱収縮チューブによって絶縁被覆を行うものであ
る。In order to achieve this object, the present invention is to provide insulation coating with a heat-shrinkable tube after connecting an element having a lead terminal and a lead wire.
【０００６】[0006]
【作用】このような製造方法によって、熱収縮チューブ
を加熱するだけで絶縁被覆が可能であり、作業工数、設
備費等が削減され、コストダウンを図ることができる。According to such a manufacturing method, the insulation coating can be performed only by heating the heat-shrinkable tube, and the work man-hours, the equipment cost, etc. can be reduced and the cost can be reduced.
【０００７】[0007]
（実施例１）以下、本発明の一実施例について、図面を
参照しながら説明する。図１の構造図において、１は素
子であり、この場合サーミスタである。２はラジアル型
に伸びた一対のリード端子、３はリード線、４は接続部
ではんだ、６は熱収縮チューブである。熱収縮チューブ
６はズボンのように二股に分かれており、その各々にリ
ード線３を一本ずつ入れてから熱収縮させる。(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. In the structural diagram of FIG. 1, 1 is an element, in this case a thermistor. Reference numeral 2 is a pair of lead terminals extending in a radial type, 3 is a lead wire, 4 is a connecting portion of solder, and 6 is a heat-shrinkable tube. The heat-shrinkable tube 6 is bifurcated like a pair of pants, and one lead wire 3 is inserted into each of them and heat-shrinked.
【０００８】また熱収縮チューブ６は素子１を略半分だ
け覆っており、素子には熱収縮チューブから露出する部
分１ａと被覆される部分１ｂとがある。露出する部分１
ａがあるので、サーミスタは応答性良く外部の温度が検
出できる。一方、被覆される部分１ｂがあるので、接続
部分４は素子ともども固定されて丈夫なものになる。The heat-shrinkable tube 6 covers the element 1 by almost half, and the element has a portion 1a exposed from the heat-shrinkable tube and a portion 1b covered. Exposed part 1
Since there is a, the thermistor can detect the external temperature with good responsiveness. On the other hand, since there is the covered portion 1b, the connecting portion 4 is fixed together with the element, which makes it durable.
【０００９】（実施例２）図２は本発明の第２の実施例
の構造図であり、図１と同じ要素は同じ符号で表わす。
本実施例では、熱収縮チューブ７は単純な円筒形のもの
である。熱収縮チューブ７を覆せた後、２ヶ所の接続部
分４の中間でホッチキスによる金具止め８を熱収縮チュ
ーブ７の表裏面間に行う。熱収縮チューブ７は９の部分
で表裏面が接し、接続部分４どうしは電気的に絶縁され
る。この後熱を加えて熱収縮チューブを収縮させて完成
品とする。(Embodiment 2) FIG. 2 is a structural diagram of a second embodiment of the present invention, and the same elements as those in FIG. 1 are represented by the same reference numerals.
In this embodiment, the heat shrink tube 7 has a simple cylindrical shape. After the heat-shrinkable tube 7 is covered, a metal fitting 8 by a stapler is provided between the front and back surfaces of the heat-shrinkable tube 7 in the middle of the two connecting portions 4. The heat-shrinkable tube 7 is in contact with the front and back surfaces at 9 and the connecting portions 4 are electrically insulated from each other. After that, heat is applied to shrink the heat shrink tube to obtain a finished product.
【００１０】[0010]
【発明の効果】以上のように本発明による製造方法によ
ると、リード部を備えた素子とリード線の接続部分に熱
収縮チューブを用いることによって、作業工数及び設備
費等を削減でき、コストダウンを図ることができるた
め、原価力向上につながる。As described above, according to the manufacturing method of the present invention, by using the heat shrinkable tube at the connecting portion between the element having the lead portion and the lead wire, it is possible to reduce the work man-hours, the equipment cost, etc. Since this can be achieved, it will lead to an improvement in cost efficiency.
【図１】本発明の第１の実施例におけるサーミスタ素子
の平面図FIG. 1 is a plan view of a thermistor element according to a first embodiment of the present invention.
【図２】本発明の第２の実施例におけるサーミスタ素子
の平面図FIG. 2 is a plan view of a thermistor element according to a second embodiment of the present invention.
【図３】従来のサーミスタ素子の平面図FIG. 3 is a plan view of a conventional thermistor element.
１ 素子 ２ リード端子部 ３ リード線 ４ 接続部 ６ 熱収縮チューブ 1 element 2 lead terminal part 3 lead wire 4 connection part 6 heat shrink tube
Claims (4)
接続させた後、接続部分を熱収縮チューブで覆い、熱収
縮チューブを収縮させることにより絶縁被覆する電子部
品の製造方法。1. A method of manufacturing an electronic component, comprising: connecting an element having a lead terminal portion to a lead wire; then covering the connection portion with a heat-shrinkable tube;
た素子と一対のリード線を接続させた後、前記素子とリ
ード線とを熱収縮チューブ内に挿入し、前記リード線間
の表裏の前記熱収縮チューブを接着固定することにより
前記リード線間の電気絶縁性を保ち、前記熱収縮チュー
ブを収縮させることにより絶縁被覆する電子部品の製造
方法。2. A device having a pair of radial type lead terminal portions and a pair of lead wires are connected to each other, and then the device and the lead wires are inserted into a heat-shrinkable tube, and the front and back surfaces between the lead wires are connected. A method of manufacturing an electronic component, wherein the heat-shrinkable tube is adhered and fixed to maintain electrical insulation between the lead wires, and the heat-shrinkable tube is contracted to insulate.
着を金具にて行う請求項２記載の電子部品の製造方法。3. The method of manufacturing an electronic component according to claim 2, wherein the heat-shrinkable tubes on the front and back sides of the lead wires are bonded with a metal fitting.
素子がサーミスタ素子である請求項１記載の電子部品の
製造方法。4. A heat shrink tube covers approximately half of the element,
The method of manufacturing an electronic component according to claim 1, wherein the element is a thermistor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740695A JPH08203706A (en) | 1995-01-20 | 1995-01-20 | Manufacture of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740695A JPH08203706A (en) | 1995-01-20 | 1995-01-20 | Manufacture of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08203706A true JPH08203706A (en) | 1996-08-09 |
Family
ID=11665001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP740695A Pending JPH08203706A (en) | 1995-01-20 | 1995-01-20 | Manufacture of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08203706A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007018271A1 (en) * | 2005-08-11 | 2007-02-15 | Kurabe Industrial Co., Ltd. | Heating device for seat |
| CN106218947A (en) * | 2016-08-29 | 2016-12-14 | 昆山法博特瑞电子机械有限公司 | Pyrocondensation glued membrane jacketing machine |
-
1995
- 1995-01-20 JP JP740695A patent/JPH08203706A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007018271A1 (en) * | 2005-08-11 | 2007-02-15 | Kurabe Industrial Co., Ltd. | Heating device for seat |
| JP5116470B2 (en) * | 2005-08-11 | 2013-01-09 | 株式会社クラベ | Seat heating system |
| US8492680B2 (en) | 2005-08-11 | 2013-07-23 | Kurabe Industrial Co., Ltd. | Heating device for seat |
| CN106218947A (en) * | 2016-08-29 | 2016-12-14 | 昆山法博特瑞电子机械有限公司 | Pyrocondensation glued membrane jacketing machine |
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