JPH0819544B2 - Lead steel wire for electronic parts and manufacturing method thereof - Google Patents
Lead steel wire for electronic parts and manufacturing method thereofInfo
- Publication number
- JPH0819544B2 JPH0819544B2 JP5042220A JP4222093A JPH0819544B2 JP H0819544 B2 JPH0819544 B2 JP H0819544B2 JP 5042220 A JP5042220 A JP 5042220A JP 4222093 A JP4222093 A JP 4222093A JP H0819544 B2 JPH0819544 B2 JP H0819544B2
- Authority
- JP
- Japan
- Prior art keywords
- steel wire
- lead
- tin
- solder
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、比較的安価な鋼線に安
価なめっき法である溶融めっきを施し、めっき後に長時
間経過しても半田付け性などが良好で膜厚が均一な電子
部品用リード鋼線及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is an electronic device having a relatively inexpensive steel wire, which is an inexpensive plating method for hot dipping, and which has good solderability even after a long time has elapsed and has a uniform film thickness. The present invention relates to a lead steel wire for parts and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】銅素線に溶融半田（錫−鉛合金）めっき
を直接施すことは、特開昭６２−１８４８号や特開昭６
２−７８４０号などから公知であるけれども、安価な鋼
素線に溶融錫又は半田（錫−鉛合金）めっきを直接施す
ことは、該鋼素線の伸線や圧延の仕上げ加工時にその表
面に生じたスケールにより、該鋼素線と溶融めっきとの
なじみが非常に悪くて困難である。また、鋼素線に溶融
めっきを無理に施しても、該めっきの密着性及び半田付
け性が低く、電子部品用のリード鋼線としては使用不可
能である。2. Description of the Related Art Directly applying molten solder (tin-lead alloy) plating to a copper wire is disclosed in JP-A-62-1848 and JP-A-6-1848.
Although it is known from No. 2-7840 and the like, direct application of molten tin or solder (tin-lead alloy) plating to an inexpensive steel wire is performed on the surface of the steel wire at the time of drawing or rolling finish processing. Due to the resulting scale, the steel wire and the hot-dip galvanization are very poor and difficult. Further, even if the steel wire is forcibly subjected to hot dip plating, the adhesion and solderability of the plating are low, and it cannot be used as a lead steel wire for electronic parts.
【０００３】 このため、リード鋼線において、鋼素線
上に溶融錫又は半田めっきを形成するには、まず下地銅
めっきを施すことが必要である。この下地銅めっきとし
て、銅覆鋼線（以下、ＣＰ線という）を使用するか、又
は該当寸法の鋼素線に銅めっきを施している。Therefore, in the lead steel wire, in order to form the molten tin or the solder plating on the steel element wire, it is necessary to first perform the base copper plating. As the base copper plating, a copper-covered steel wire (hereinafter referred to as a CP wire) is used, or a steel element wire of a corresponding dimension is copper-plated.
【０００４】 このＣＰ線を製造するには、直径５〜７
ｍｍの太物鋼線に電気銅めっきの厚づけを施し、この後
に直径２.０ｍｍ又は１.６ｍｍまで伸線して焼鈍しし、
さらに直径０.５ｍｍなどの該当寸法まで伸線する。ま
た、細物の該当寸法の鋼素線では、鋼線は銅で置換され
やすいので、シアン浴で銅ストライクめっきした後に、
シアン浴で銅の厚づけめっきを施している。In order to manufacture this CP wire, the diameter is 5 to 7
mm thick steel wire is thickened by electrolytic copper plating, and then drawn to a diameter of 2.0 mm or 1.6 mm and annealed.
In addition, wire drawing is performed to the relevant dimensions such as a diameter of 0.5 mm. Also, in the case of steel strands with the corresponding dimensions of fine products, the steel strands are easily replaced by copper, so after copper strike plating in a cyan bath,
Thick copper is plated in a cyan bath.
【０００５】[0005]
【発明が解決しようとする課題】一般にＣＰ線の製造に
は、大規模の電気めっき設備が必要となって設備経費が
掛り、しかも太物鋼素線の浸漬のためにめっき液（シア
ン）のくみ出し量も多く、公害防止の処理費用が高くな
る。ＣＰ線は、中央部が鋼素線であるから、銅であれば
２００〜３００℃でよい焼鈍し温度が約５５０℃も要し
て銅表面を荒らし、しかも伸線時のスケールが表面に多
く残留して前処理に手間が掛る。Generally, the production of CP wire requires a large-scale electroplating equipment, which requires equipment cost, and the immersion of the thick steel wire causes the plating solution (cyan) to be used. The amount of pumped out is large and the treatment cost for pollution prevention is high. The CP wire has a steel wire in the central portion, so if it is copper, it may be annealed at 200 to 300 ° C., and it takes about 550 ° C. to roughen the copper surface, and moreover, the scale during wire drawing is large on the surface. It remains and takes time for pretreatment.
【０００６】 一方、細物の該当寸法の鋼素線の場合
は、２段階のシアン浴での銅めっきが必要であり、シア
ンのために公害防止の処理が問題になる。ＣＰ線や銅の
厚づけめっき鋼線は、比較的高価な銅をベースにして価
格を設定するために銅相場に応じてリード線の価格が変
動し、銅ベースが上昇するとリード線の価格も上昇する
という問題もある。On the other hand, in the case of a steel wire having a corresponding size of a fine product, copper plating in a two-stage cyan bath is necessary, and the pollution prevention process becomes a problem because of cyan. CP wire and thick copper plated steel wire set the price based on relatively expensive copper, so the price of the lead wire fluctuates according to the copper market price, and if the copper base rises, the price of the lead wire also increases. There is also the problem of rising.
【０００７】 本発明は、溶融めっきリード鋼線の製造
に関する前記の問題点を改善するために提案されたもの
であり、加速劣化試験などにおいて半田付け性及び半田
濡れ性が良好である溶融めっきのリード鋼線を提供する
ことを目的としている。本発明の他の目的は、めっき前
処理をより改善することにより、溶融めっき法で錫又は
半田めっきをリード鋼素線に容易に施せる電子部品用リ
ード鋼線の製造方法を提供することである。The present invention has been proposed in order to improve the above-mentioned problems associated with the production of hot-dip lead steel wire, and the hot-dip of hot-dip plating having good solderability and solder wettability in an accelerated deterioration test and the like. The purpose is to provide lead steel wire. Another object of the present invention is to provide a method for producing a lead steel wire for electronic parts, which can easily apply tin or solder plating to a lead steel element wire by a hot dip plating method by further improving a plating pretreatment. .
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る電子部品用リード鋼線１は、図１に示
すように、電気めっき法によって鋼素線２に厚さ０.５
〜３μｍの下地錫又は半田めっき層３を直接形成し、つ
いで溶融めっき法で厚さ１〜３０μｍの錫又は半田めっ
き層４を形成する。下地めっき層３において、下地とし
て有効な最低厚さは０.５μｍであり、３μｍを超える
めっき厚さは経済的に不利である。In order to achieve the above object, a lead steel wire 1 for electronic parts according to the present invention has a thickness of a steel element wire 2 of 0.1 mm by an electroplating method as shown in FIG. 5
A base tin or solder plating layer 3 having a thickness of ˜3 μm is directly formed, and then a tin or solder plating layer 4 having a thickness of 1 to 30 μm is formed by hot dipping. In the base plating layer 3, the minimum thickness effective as a base is 0.5 μm, and a plating thickness exceeding 3 μm is economically disadvantageous.
【０００９】 電気めっき法の下地めっき層３の組成は
錫１００〜１０％，鉛０〜９０％であり、溶融めっき法
の錫又は半田めっき層４の組成も錫１００〜１０％，鉛
０〜９０％である。鋼素線２の素材には、鉄又はその合
金例えば炭素鋼，ステンレス鋼などを包含する。The composition of the base plating layer 3 in the electroplating method is 100 to 10% tin and 0 to 90% lead, and the composition of the tin or solder plating layer 4 in the hot dipping method is 100 to 10% tin and 0 to lead. 90%. The material of the steel wire 2 includes iron or its alloys such as carbon steel and stainless steel.
【００１０】 電子部品用リード鋼線１を製造するに
は、鋼素材２の前処理が必要であり、少なくとも鋼素線
２を陽極としてアルカリ電解脱脂洗浄と酸電解洗浄とを
行ない、さらに該鋼素線を陰極としてアルカリ電解脱脂
洗浄した後に酸浸漬洗浄する。各洗浄工程の終了後にそ
の都度水洗することを要する。鋼素線２を陰極とするア
ルカリ電解脱脂洗浄は、該鋼素材を陽極とするアルカリ
電解脱脂又は酸電解洗浄と工程順を入替えてもよい。In order to manufacture the lead steel wire 1 for electronic parts, a pretreatment of the steel material 2 is necessary, and at least the steel element wire 2 is used as an anode for alkaline electrolytic degreasing cleaning and acid electrolytic cleaning. The wire is used as a cathode for alkaline electrolytic degreasing cleaning and then acid immersion cleaning. It is necessary to wash with water after each washing step. The alkaline electrolytic degreasing cleaning using the steel wire 2 as a cathode may be replaced with the alkaline electrolytic degreasing or acid electrolytic cleaning using the steel material as an anode.
【００１１】 本発明方法では、前記の前処理の後に、
まず電気めっき法によって鋼素線２の表面に下地の錫又
は半田めっきを直接施し、このめっき浴には一般にアル
カノールスルホン酸浴を使用すると好ましい。下地めっ
きの厚さは、溶融めっき速度が４０〜５０ｍ／分のよう
に比較的早い場合に０.５〜１μｍとし、２０〜３０ｍ
／分のように遅い場合に１.５〜３μｍとすることが好
ましい。In the method of the present invention, after the above pretreatment,
First, it is preferable to directly apply an underlying tin or solder plating to the surface of the steel wire 2 by an electroplating method, and generally use an alkanol sulfonic acid bath for this plating bath. The thickness of the undercoat is 0.5 to 1 μm when the hot dipping speed is relatively fast such as 40 to 50 m / min, and 20 to 30 m.
If it is as slow as / minute, it is preferable to set it to 1.5 to 3 μm.
【００１２】 次に、溶融めっき浴１０（図３）に浸漬
し、図３に示すような縦引きによって錫又は半田めっき
を比較的厚く付着させる。溶融めっき法における縦引き
法は、高速の横引き法に比べてめっき速度が約４０〜６
０ｍ／分と遅いけれども、膜厚の均一性を保持し、めっ
き厚さも約１５〜２０μｍは十分可能であるので好まし
い。Next, it is immersed in the hot-dip plating bath 10 (FIG. 3), and tin or solder plating is applied relatively thickly by vertical drawing as shown in FIG. The vertical drawing method in the hot dip plating method has a plating speed of about 40 to 6 as compared with the high speed horizontal drawing method.
Although as slow as 0 m / min, the uniformity of the film thickness is maintained and the plating thickness of about 15 to 20 μm is sufficiently possible, which is preferable.
【００１３】 溶融めっき浴１０において、水平可動ダ
イス１１を通し、窒素などの不活性ガスの雰囲気中で冷
却する。水平可動ダイス１１（図４参照）は、膜厚の均
一性を保ち且つ錫又は半田かすの付着を避けるために使
用する。図３に例示するように、通常２〜３段階で冷却
して錫又は半田めっき層４の表面を円滑にし、不活性ガ
スの雰囲気により、錫又は半田めっき層４及びめっき浴
１０の表面酸化を防止する。In the hot-dip galvanizing bath 10, it is passed through a horizontally movable die 11 and cooled in an atmosphere of an inert gas such as nitrogen. The horizontally movable die 11 (see FIG. 4) is used to keep the film thickness uniform and to prevent the adhesion of tin or solder residue. As illustrated in FIG. 3, usually, the surface of the tin or solder plating layer 4 is smoothed by cooling in two or three stages, and the surface oxidation of the tin or solder plating layer 4 and the plating bath 10 is performed by the atmosphere of the inert gas. To prevent.
【００１４】[0014]
【作用】本発明方法では、前処理において、鋼素線２を
陽極とするアルカリ電解脱脂洗浄と酸電解洗浄により、
該鋼素線の表面から油脂分などを電気的にはぎ取る。こ
の工程において、鋼素線２は酸素ガスに覆われ、表面に
酸化皮膜ができて不導体化する。このため、鋼素線２を
陰極としてアルカリ電解脱脂洗浄を行なって還元し、さ
らに酸浸漬洗浄によって酸化皮膜を除去する。In the method of the present invention, in the pretreatment, by the alkaline electrolytic degreasing cleaning using the steel wire 2 as an anode and the acid electrolytic cleaning,
Oils and fats are electrically stripped from the surface of the steel wire. In this step, the steel wire 2 is covered with oxygen gas and an oxide film is formed on the surface to make it non-conductive. For this reason, alkaline electrolytic degreasing cleaning is performed by using the steel wire 2 as a cathode for reduction, and the oxide film is removed by acid immersion cleaning.
【００１５】 本発明方法では、無公害のめっき浴１０
において鋼素線２に電気めっきの錫又は半田めっきを施
し、その厚みを溶融めっき速度に応じて０.５〜１μｍ
又は１.５〜３μｍと定める。次に、鋼素線２を溶融め
っき浴１０に浸漬し、縦引きによって錫又は半田めっき
の膜厚の均一性を保持しながら、該めっきを比較的厚く
約１５〜２０μｍ付着させる。In the method of the present invention, a pollution-free plating bath 10
The steel wire 2 is electroplated with tin or solder and the thickness is adjusted to 0.5-1 μm according to the hot-dip plating rate.
Alternatively, it is set to 1.5 to 3 μm. Next, the steel wire 2 is dipped in the hot-dip plating bath 10, and the thickness of the tin or solder plating is relatively thickly applied by about 15 to 20 μm while maintaining the uniformity of the thickness of the tin or solder plating.
【００１６】[0016]
【実施例】次に、本発明を実施例に基づいて説明する。 実施例１ 直径０.５ｍｍのリード鋼素線２を、図２に例示する工
程にしたがって前処理する。この前処理における洗浄液
と洗浄条件は下記の通りである。EXAMPLES Next, the present invention will be explained based on examples. Example 1 A lead steel strand 2 having a diameter of 0.5 mm is pretreated according to the process illustrated in FIG. The cleaning liquid and cleaning conditions in this pretreatment are as follows.
【００１７】１．アルカリ浸漬脱脂洗浄 水酸化ナトリウム １５％ 界面活性剤 １０％ 液温 ４０〜５０℃1. Alkali immersion degreasing cleaning Sodium hydroxide 15% Surfactant 10% Liquid temperature 40-50 ° C
【００１８】２．アルカリ電解脱脂洗浄（＋） 水酸化ナトリウム １５〜２０％ 界面活性剤 ２〜５％ 陽極 リード鋼素線２ 陰極 鉄板2. Alkaline electrolytic degreasing cleaning (+) Sodium hydroxide 15-20% Surfactant 2-5% Anode lead Steel element wire 2 Cathode Iron plate
【００１９】３．酸電解洗浄 塩酸 １５〜２０％ 陽極 リード鋼素線２ 陰極 鉄板3. Acid electrolysis cleaning Hydrochloric acid 15-20% Anode lead Steel element wire 2 Cathode Iron plate
【００２０】４．アルカリ電解脱脂洗浄（−） 水酸化ナトリウム １５〜２０％ 界面活性剤 ２〜５％ 陽極 鉄板 陰極 リード鋼素線２4. Alkaline electrolytic degreasing cleaning (-) Sodium hydroxide 15-20% Surfactant 2-5% Anode iron plate Cathode Lead steel element wire 2
【００２１】５．酸浸漬洗浄 塩酸 ２０〜３０％5. Acid immersion cleaning hydrochloric acid 20-30%
【００２２】 前処理したリード鋼素線２を下記の浴組
成の電気めっき浴に浸漬し、鉛３％，錫９７％を有する
厚さ１.５〜３μｍの下地半田めっき層３を形成する。 アルカノールスルホン酸第一錫 ３５０ｇ／ｌ アルカノールスルホン酸鉛 １５ｇ／ｌ 遊離酸 １７０ｇ／ｌ 光沢剤及び分散剤 ６０ｍｌ／ｌThe pretreated lead steel wire 2 is immersed in an electroplating bath having the following bath composition to form a base solder plating layer 3 having a thickness of 1.5 to 3 μm and containing 3% lead and 97% tin. Stannous alkanol sulfonate 350g / l Lead alkanol sulfonate 15g / l Free acid 170g / l Brightener and dispersant 60ml / l
【００２３】 次に、溶融めっき浴１０（図３）に浸漬
し、縦引きによって鉛３％，錫９７％を有する厚さ１０
〜１２μｍの半田めっき層４を形成する。溶融めっき浴
１０において、半田めっき鋼線１は水平可動ダイス１１
を通して冷却する。めっき鋼線１は、冷却窒素ガスの雰
囲気中で３段階で冷却することで半田めっき層４の表面
を円滑にし、該半田めっき層４及びめっき浴１０の表面
酸化を防止する。Next, it is dipped in a hot dip plating bath 10 (FIG. 3) and longitudinally drawn to obtain a thickness 10 having 3% lead and 97% tin.
A solder plating layer 4 having a thickness of 12 μm is formed. In the hot-dip plating bath 10, the solder-plated steel wire 1 is a horizontally movable die 11
To cool through. The plated steel wire 1 smoothes the surface of the solder plating layer 4 by cooling in three stages in an atmosphere of cooling nitrogen gas, and prevents the surface oxidation of the solder plating layer 4 and the plating bath 10.
【００２４】 水平可動ダイス１１は、図４に示すよう
にスライスベアリング１２の上に取付け、固定せずに自
由に動くように設置することにより、めっき鋼線１の膜
厚の均一性を保ち且つ半田かすの付着を避ける。この際
に、ダイスを固定しているならば、めっき鋼線が走行時
に振動すると、大きい偏心が発生して膜厚の均一性を阻
害することになる。The horizontally movable die 11 is mounted on the slice bearing 12 as shown in FIG. 4, and is installed so as to move freely without being fixed, so that the film thickness of the plated steel wire 1 can be kept uniform. Avoid adhesion of solder residue. At this time, if the die is fixed, if the plated steel wire vibrates during running, a large eccentricity will occur and the uniformity of the film thickness will be impaired.
【００２５】実施例２ 実施例１と同様に前処理したリード鋼素線２を下記の浴
組成の電気めっき浴に浸漬し、厚さ１.５〜３μｍの錫
めっき層３を形成する。 アルカノールスルホン酸第一錫 ３２０ｇ／ｌ 遊離酸 １５０ｇ／ｌ 光沢剤及び分散剤 ５０ｍｌ／ｌExample 2 A lead steel wire 2 pretreated in the same manner as in Example 1 is immersed in an electroplating bath having the following bath composition to form a tin plating layer 3 having a thickness of 1.5 to 3 μm. Stannous alkanol sulfonate 320 g / l Free acid 150 g / l Brightener and dispersant 50 ml / l
【００２６】 以下、実施例１と同様に溶融めっき浴１
０に浸漬し、縦引きによって厚さ１０〜１２μｍの錫め
っき層４を形成する。溶融めっき浴１０において、錫め
っき鋼線１を水平可動ダイス１１を通してから冷却す
る。Thereafter, the hot dip plating bath 1 was prepared in the same manner as in Example 1.
Then, the tin-plated layer 4 having a thickness of 10 to 12 μm is formed by dipping in 0. In the hot-dip galvanizing bath 10, the tin-plated steel wire 1 is passed through a horizontal movable die 11 and then cooled.
【００２７】実施例３ 実施例１と同様に前処理したリード鋼素線２を下記の浴
組成の電気めっき浴に浸漬し、鉛３％，錫９７％を有す
る厚さ０.５〜１μｍの半田めっき層３を形成する。 アルカノールスルホン酸第一錫 １８０ｇ／ｌ アルカノールスルホン酸鉛 １０ｇ／ｌ 遊離酸 １２０ｇ／ｌ 光沢剤及び分散剤 ３０ｍｌ／ｌExample 3 Lead steel element wire 2 pretreated in the same manner as in Example 1 was immersed in an electroplating bath having the following bath composition, and had a lead content of 3% and tin content of 97% and a thickness of 0.5 to 1 μm. The solder plating layer 3 is formed. Stannous alkanol sulfonate 180 g / l Lead alkanol sulfonate 10 g / l Free acid 120 g / l Brightener and dispersant 30 ml / l
【００２８】 以下、実施例１と同様に溶融めっき浴１
０に浸漬し、縦引きによって鉛３％，錫９７％を有する
厚さ１０〜１２μｍの半田めっき層４を形成する。溶融
めっき浴１０において、半田めっき鋼線１を水平可動ダ
イス１１を通してから冷却する。Thereafter, the hot dip bath 1 was prepared in the same manner as in Example 1.
Then, the solder plating layer 4 having a thickness of 10 to 12 μm and containing 3% lead and 97% tin is formed by vertical dipping. In the hot-dip plating bath 10, the solder-plated steel wire 1 is passed through a horizontally movable die 11 and then cooled.
【００２９】実施例４ 実施例１と同様に前処理したリード鋼素線２を下記の浴
組成の電気めっき浴に浸漬し、厚さ０.５〜１μｍの錫
めっき層３を形成する。 アルカノールスルホン酸第一錫 １８０ｇ／ｌ 遊離酸 １００ｇ／ｌ 光沢剤及び分散剤 ２５ｍｌ／ｌExample 4 Lead steel wire 2 pretreated in the same manner as in Example 1 is immersed in an electroplating bath having the following bath composition to form a tin plating layer 3 having a thickness of 0.5 to 1 μm. Stannous alkanol sulfonate 180 g / l Free acid 100 g / l Brightener and dispersant 25 ml / l
【００３０】 以下、実施例１と同様に溶融めっき浴１
０に浸漬し、縦引きによって厚さ１０〜１２μｍの錫め
っき層４を形成する。溶融めっき浴１０において、錫め
っき鋼線１を水平可動ダイス１１を通してから冷却す
る。Thereafter, the hot dip bath 1 was prepared in the same manner as in Example 1.
Then, the tin-plated layer 4 having a thickness of 10 to 12 μm is formed by dipping in 0. In the hot-dip galvanizing bath 10, the tin-plated steel wire 1 is passed through a horizontal movable die 11 and then cooled.
【００３１】比較例 実施例１で用いたリード鋼素線を、従来と同様にアルカ
リ浸漬脱脂，アルカリ電解脱脂（−）さらに酸浸漬によ
って洗浄する。前処理したリード鋼素線にクリームペー
ストを塗布してから、実施例１と同様の溶融めっき浴に
浸漬し、鉛３％，錫９７％を有する平均厚さ１０〜２５
μｍの半田めっき層を形成する。Comparative Example The lead steel wire used in Example 1 is cleaned by alkaline immersion degreasing, alkaline electrolytic degreasing (-) and acid immersion as in the conventional case. The pre-treated lead steel wire is coated with the cream paste and then immersed in the same hot dip bath as in Example 1 to obtain an average thickness of 10-25 with 3% lead and 97% tin.
A μm solder plating layer is formed.
【００３２】実施例１及び比較例で得た半田めっきリー
ド鋼線に関し、半田付け性を評価する。この半田付け性
は、両リード鋼線をロジン２５重量％，１ＰＡ７５重量
％のフラックス中に５秒間浸漬後、２３５℃の温度に保
持した錫６２％，鉛３８％の共晶半田浴中に５秒間浸漬
し、半田で濡れた面積を百分率（％）で表わす。The solderability of the solder-plated lead steel wires obtained in Example 1 and Comparative Example is evaluated. This solderability was measured by immersing both lead steel wires in a flux of 25% by weight of rosin and 75% by weight of 1PA for 5 seconds and then immersing them in a eutectic solder bath of 62% tin and 38% lead held at a temperature of 235 ° C. The area dipped in solder for 2 seconds and wetted with solder is expressed as a percentage (%).
【００３３】 下記の表１には、リード鋼線の常態及び
１７０℃の恒温槽中で２４，４８，７２時間放置した後
の半田付け性を各５本の平均値で示す。Table 1 below shows the normal state of the lead steel wire and the solderability after standing for 24, 48, and 72 hours in a constant temperature bath of 170 ° C. as an average value of 5 pieces each.
【００３４】[0034]
【表１】 [Table 1]
【００３５】 また、８５℃，８５％ＲＨの恒温恒湿試
験における両リード鋼線の半田付け性も開示する。下記
の表２は、恒温恒湿試験済みリード鋼線の常態及び２５
０，５００時間放置した後の半田付け性を示す各５本の
平均値である。Also, the solderability of both lead steel wires in a constant temperature and humidity test at 85 ° C. and 85% RH is disclosed. Table 2 below shows the normal state and 25
It is an average value of 5 pieces each showing solderability after being left for 0,500 hours.
【００３６】[0036]
【表２】 [Table 2]
【００３７】 また、１０５℃，１００％ＲＨ，１.２
気圧のプレッシャークッカー試験（以下、ＰＣＴと称
す）において、半田付け性を開示する。下記の表３に
は、リード鋼線の常態及びＰＣＴ後に１６時間放置した
後の半田付け性を各５本の平均値で示す。Also, 105 ° C., 100% RH, 1.2
The solderability is disclosed in a pressure cooker test of atmospheric pressure (hereinafter referred to as PCT). In Table 3 below, the normal state of the lead steel wire and the solderability after standing for 16 hours after PCT are shown by an average value of 5 wires each.
【００３８】[0038]
【表３】 [Table 3]
【００３９】次に、両リード鋼線の半田濡れ性を評価す
る。この半田濡れ性は、長さ２ｍｍのリード鋼線を前記
と同じフラックス中に５秒間浸漬した後、２３５℃に保
持した共晶半田浴中に７秒間浸漬し、半田液面が平行と
なる時間（ゼロクロスタイム）をソルダーグラフで測定
し、これを秒単位で表わす。Next, the solder wettability of both lead steel wires is evaluated. This solder wettability is determined by immersing a lead steel wire with a length of 2 mm in the same flux as above for 5 seconds and then in a eutectic solder bath maintained at 235 ° C for 7 seconds, until the solder liquid surface becomes parallel. (Zero cross time) is measured with a solder graph and expressed in seconds.
【００４０】 半田濡れ性は、ＰＣＴにおいて開示す
る。下記の表４には、リード鋼線の常態及びＰＣＴ後に
１６時間放置した後の半田濡れ性を各５本の平均値で示
す。Solder wettability is disclosed in the PCT. In Table 4 below, the normal state of the lead steel wire and the solder wettability after standing for 16 hours after PCT are shown as an average value of 5 pieces each.
【００４１】[0041]
【表４】 [Table 4]
【００４２】 表１〜４から明らかなように、実施例１
のリード鋼線１は、比較例のリード鋼線に比べて、加熱
及び恒温恒湿試験後並びにＰＣＴの加速劣化試験後の半
田付け性が良好であり、ＰＣＴの加速劣化試験後の半田
濡れ性も優れている。したがって、実施例１から４のリ
ード鋼線１は、電子部品として保存が可能であって電子
部品用として十分に使用できる。As is clear from Tables 1 to 4, Example 1
The lead steel wire 1 of No. 1 has good solderability after the heating and constant temperature and humidity test and after the accelerated deterioration test of PCT, as compared with the lead steel wire of Comparative Example, and the solder wettability after the accelerated deterioration test of PCT. Is also excellent. Therefore, the lead steel wires 1 of Examples 1 to 4 can be stored as electronic parts and can be sufficiently used for electronic parts.
【００４３】[0043]
【発明の効果】本発明に係る電子部品用リード鋼線は、
高価で公害が心配な銅の下地めっきを施さなくても、溶
融錫又は半田めっきによって従来と同等の密着性及び半
田付け性を有し、電子部品用として使用可能である。本
発明のリード鋼線は、安価な鋼材及び溶融めっき法を利
用し、高価な銅を全く使用しなくてもよいから、電子部
品業界において安価なリード鋼線として画期的な製品で
ある。The lead steel wire for electronic parts according to the present invention is
Even if copper undercoating, which is expensive and is less likely to cause pollution, is not applied, it has the same adhesion and solderability as before by molten tin or solder plating, and can be used for electronic parts. The lead steel wire of the present invention is an epoch-making product as an inexpensive lead steel wire in the electronic component industry because it uses an inexpensive steel material and a hot dip plating method and does not need to use expensive copper at all.
【００４４】 本発明方法は、軽視できない公害の処理
が比較的容易であり、めっき設備も小規模で設備費や取
付費用も少なくて済む。本発明方法におけるめっき設備
は、比較的小さい設置面積で実施可能であるから、設備
全体を考慮してもリード鋼線を安価に提供することがで
きる。According to the method of the present invention, it is relatively easy to treat pollution that cannot be neglected, the plating facility is small, and the equipment cost and installation cost are low. Since the plating equipment in the method of the present invention can be implemented in a relatively small installation area, the lead steel wire can be provided at low cost even when the entire equipment is taken into consideration.
【００４５】 また、本発明方法では、前処理において
最後に酸浸漬洗浄によって酸化皮膜を除去するととも
に、通常、酸浸漬洗浄に塩酸を使用して電気めっきの初
期電着を助けている。本発明方法は、溶融錫又は半田め
っきを施すリード鋼線の製造において、全体としてめっ
き工程数が比較的少なく、リード鋼線がリード銅線や銅
覆鋼線に比べて安価である利点を維持している。Further, in the method of the present invention, the oxide film is finally removed by the acid immersion cleaning in the pretreatment, and usually hydrochloric acid is used for the acid immersion cleaning to assist the initial electrodeposition of electroplating. INDUSTRIAL APPLICABILITY The method of the present invention maintains the advantages that the number of plating steps is relatively small as a whole in the production of lead steel wire subjected to molten tin or solder plating, and that the lead steel wire is less expensive than the lead copper wire or the copper-clad steel wire are doing.
【図１】 本発明に係る電子部品用リード鋼線を示す拡
大断面図である。FIG. 1 is an enlarged sectional view showing a lead steel wire for an electronic component according to the present invention.
【図２】 本発明方法の前処理工程を例示するフローチ
ャートである。FIG. 2 is a flowchart illustrating a pretreatment process of the method of the present invention.
【図３】 本発明方法における溶融めっき装置を示す概
略側面図である。FIG. 3 is a schematic side view showing a hot dipping apparatus in the method of the present invention.
【図４】 図３の要部を拡大して示す横断面図である。FIG. 4 is a cross-sectional view showing an enlarged main part of FIG.
１ 電子部品用リード鋼線 ２ 鋼素線 ３ 電気錫又は半田めっき層 ４ 溶融錫又は半田めっき層 １０ 溶融めっき浴 1 Lead Steel Wire for Electronic Parts 2 Steel Element Wire 3 Electric Tin or Solder Plating Layer 4 Hot Tin or Solder Plating Layer 10 Hot Dip Bath
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ２５Ｄ 7/00 Ｇ Ｈ０１Ｌ 23/50 Ｄ Ｅ // Ｃ２３Ｃ 28/02 Ｈ０１Ｂ 5/02 Ａ 13/00 ５０１ Ｅ Ｈ０１Ｇ 4/228 Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI Technical display location C25D 7/00 G H01L 23/50 D E // C23C 28/02 H01B 5/02 A 13/00 501 E H01G 4/228
Claims (2)
μｍの下地錫又は半田めっき層を直接形成し、ついで溶
融めっき法で厚さ１〜３０μｍの錫又は半田めっき層を
形成している電子部品用リード鋼線。1. The thickness of the steel wire is 0.5 to 3 by the electroplating method.
A lead steel wire for an electronic component, wherein a base tin or solder plating layer having a thickness of 1 μm is directly formed, and then a tin or solder plating layer having a thickness of 1 to 30 μm is formed by a hot dipping method.
浄と酸電解洗浄とを行ない、さらに該鋼素線を陰極とし
てアルカリ電解脱脂洗浄した後に酸浸漬で洗浄してか
ら、電気めっき法によって鋼素線の表面に下地の錫又は
半田めっきを施し、ついで溶融めっき浴に浸漬し、縦引
きによって錫又は半田めっきを比較的厚く付着させ、水
平可動ダイスを通して不活性ガスの雰囲気中で冷却する
電子部品用リード鋼線の製造方法。2. A steel wire is used as an anode for alkaline electrolytic degreasing cleaning and an acid electrolytic cleaning. Further, the steel wire is used as a cathode for alkaline electrolytic degreasing cleaning, followed by acid immersion cleaning, and then electroplating. An electron that applies tin or solder plating as a base to the surface of the wire, then immerses it in a hot dip plating bath, deposits tin or solder plating relatively thickly by vertical drawing, and cools it in an atmosphere of inert gas through a horizontal movable die. Manufacturing method of lead steel wire for parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5042220A JPH0819544B2 (en) | 1993-02-05 | 1993-02-05 | Lead steel wire for electronic parts and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5042220A JPH0819544B2 (en) | 1993-02-05 | 1993-02-05 | Lead steel wire for electronic parts and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06235086A JPH06235086A (en) | 1994-08-23 |
| JPH0819544B2 true JPH0819544B2 (en) | 1996-02-28 |
Family
ID=12629960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5042220A Expired - Fee Related JPH0819544B2 (en) | 1993-02-05 | 1993-02-05 | Lead steel wire for electronic parts and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0819544B2 (en) |
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|---|---|---|---|---|
| US8974484B2 (en) | 2001-09-11 | 2015-03-10 | Spiration, Inc. | Removable lung reduction devices, systems, and methods |
| US8986336B2 (en) | 2001-10-25 | 2015-03-24 | Spiration, Inc. | Apparatus and method for deployment of a bronchial obstruction device |
| US8603127B2 (en) | 2002-03-20 | 2013-12-10 | Spiration, Inc. | Removable anchored lung volume reduction devices and methods |
| US8926647B2 (en) | 2002-03-20 | 2015-01-06 | Spiration, Inc. | Removable anchored lung volume reduction devices and methods |
| US8956319B2 (en) | 2002-05-17 | 2015-02-17 | Spiration, Inc. | One-way valve devices for anchored implantation in a lung |
| US8974527B2 (en) | 2003-08-08 | 2015-03-10 | Spiration, Inc. | Bronchoscopic repair of air leaks in a lung |
| US9198669B2 (en) | 2006-03-31 | 2015-12-01 | Spiration, Inc. | Articulable anchor |
| US8795241B2 (en) | 2011-05-13 | 2014-08-05 | Spiration, Inc. | Deployment catheter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06235086A (en) | 1994-08-23 |
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