JPH08186345A - Paste for filling through-hole provided to ceramic green sheet - Google Patents
Paste for filling through-hole provided to ceramic green sheetInfo
- Publication number
- JPH08186345A JPH08186345A JP33754594A JP33754594A JPH08186345A JP H08186345 A JPH08186345 A JP H08186345A JP 33754594 A JP33754594 A JP 33754594A JP 33754594 A JP33754594 A JP 33754594A JP H08186345 A JPH08186345 A JP H08186345A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- green sheet
- filling
- ceramic green
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばハイブリッドＩ
Ｃ、マルチチップモジュール等に用いる低温焼成ガラス
セラミック多層回路基板を形成するセラミックグリーン
シートのスルーホールを充填するのに好適な銀を導体材
料としたペーストに関する。BACKGROUND OF THE INVENTION The present invention is a hybrid I
C, a paste using silver as a conductor material suitable for filling through holes of a ceramic green sheet forming a low temperature fired glass ceramic multilayer circuit board used for a multi-chip module or the like.
【０００２】[0002]
【従来の技術】ガラス粉末とセラミックフィラーの混合
物から作製したセラミックグリーンシートのスルーホー
ルにＡｇペースト等を充填し、さらに所定の導電パター
ンを形成し、このセラミックグリーンシートを複数枚積
層した後、８００〜１０００℃で焼成して得られる低温
焼成ガラスセラミック多層回路基板が知られている。こ
のスルーホールの直径は、１００〜３００μｍ程度のも
のが多用されている。スルーホールにＡｇペーストを充
填するには、スクリーン印刷によりスクリーン上からセ
ラミックグリーンシート上へ転写されたＡｇペーストを
スルーホールを通して吸引して導くという方法が採られ
る。充填されたペースト中の溶剤は乾燥して除去され
る。2. Description of the Related Art After a through hole of a ceramic green sheet made of a mixture of glass powder and a ceramic filler is filled with Ag paste or the like, a predetermined conductive pattern is formed and a plurality of the ceramic green sheets are laminated, and then 800 Low temperature fired glass-ceramic multilayer circuit boards obtained by firing at ~ 1000 ° C are known. The diameter of the through hole is often 100 to 300 μm. To fill the through-hole with the Ag paste, a method is adopted in which the Ag paste transferred from the screen to the ceramic green sheet by screen printing is sucked and guided through the through-hole. The solvent in the filled paste is dried and removed.
【０００３】しかし、上記従来のＡｇペーストは、ビヒ
クルを固形分１００重量部に対し１６〜２５重量部含
み、粘度が１５０〜２５０Ｐａ・ｓであり、乾燥により
著しい体積収縮があるので、（ａ）層間の配線接続が不
良であったり、（ｂ）隣り合うスルーホールの間隔が狭
い場合に回路が短絡する不良が多く、多層回路基板の歩
留りを低下させていた。上記（ａ）と（ｂ）には、上記
（ａ）のペーストの充填不足には、印刷による充填作業
を繰返すことによって対処しているが、工数が増える上
に、充填量がばらつき、スルーホールの周辺にペースト
が付着する等により、上記（ｂ）の回路の短絡を引き起
こすという関係もあった。However, the above-mentioned conventional Ag paste contains 16 to 25 parts by weight of a vehicle based on 100 parts by weight of solid content, has a viscosity of 150 to 250 Pa · s, and has a remarkable volume shrinkage upon drying. In many cases, the wiring connection between the layers is poor, or (b) the circuit is short-circuited when the space between adjacent through holes is narrow, which lowers the yield of the multilayer circuit board. In (a) and (b), the insufficient filling of the paste of (a) is dealt with by repeating the filling work by printing. However, the number of man-hours increases, the filling amount varies, and the through hole is increased. There is also a relationship that causes a short circuit in the circuit in (b) above due to adhesion of the paste around the periphery of the.
【０００４】[0004]
【発明が解決しようとする課題】そこで本発明の目的
は、上記問題点を解消し、セラミックグリーンシートの
スルーホールへ一回の印刷で十分にペースト充填がで
き、多層回路基板の歩留りを向上させるペーストを提供
することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problems and to sufficiently fill a through hole of a ceramic green sheet with paste by one printing, thereby improving the yield of a multilayer circuit board. To provide the paste.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
の本発明は、低温焼成ガラスセラミック多層回路基板を
形成するセラミックグリーンシートのスルーホールを充
填するために用いられ、銀を導体材料としたペーストに
おいて、該ペーストは、（１）比表面積が０．０７〜
０．２ｍ2 ／ｇである球状銀粉１００重量部を７〜１２
重量部のビヒクルに分散させてなり、（２）１０ｒｐｍ
における回転粘度計による粘度が３００〜５００Ｐａ・
ｓであり、かつ、（３）５ｒｐｍにおける回転粘度計に
よる粘度を２０ｒｐｍにおける回転粘度計による粘度で
割った商としてのチクソ性が１．４〜１．７であること
を特徴とするセラミックグリーンシートのスルーホール
充填用ペーストである。上記球状銀粉の平均粒径は、電
子顕微鏡で測定して２〜５μｍが好ましい。本発明のセ
ラミックグリーンシートのスルーホール充填用ペースト
によれば、充填欠点数（充填量がスルーホール体積の８
割未満のスルーホールの数）をスルーホール１０万個当
り０個に、かつ、短絡数（スルーホール間がペーストで
連結しているスルーホールの数）をスルーホール１０万
個当り０個にすることができる。The present invention for solving the above problems is used for filling through holes of a ceramic green sheet forming a low temperature fired glass ceramic multilayer circuit board, and silver is used as a conductive material. In the paste, the paste has (1) a specific surface area of 0.07 to
100 parts by weight of spherical silver powder of 0.2 m 2 / g is added to 7 to 12
Dispersed in parts by weight of vehicle, (2) 10 rpm
Viscosity of 300 to 500 Pa
and (3) the thixotropy as a quotient obtained by dividing the viscosity measured by the rotational viscometer at 5 rpm by the viscosity measured by the rotational viscometer at 20 rpm is 1.4 to 1.7. This is a through hole filling paste. The average particle size of the spherical silver powder is preferably 2 to 5 μm as measured by an electron microscope. According to the paste for filling the through holes of the ceramic green sheet of the present invention, the number of filling defects (the filling amount is 8% of the through hole volume).
The number of through holes is less than 0 per 100,000 through holes, and the number of short circuits (the number of through holes connected by paste between the through holes) is 0 per 100,000 through holes. be able to.
【０００６】[0006]
【作用】本発明の、セラミックグリーンシートのスルー
ホール充填用ペーストに用いる銀粉は、市販のものでよ
いが、比表面積が０．０７〜０．２ｍ2 ／ｇの球状粉で
あることが必要である。比表面積が０．０７ｍ2 ／ｇよ
りも小さいとペーストの流動性が低下して、スクリーン
印刷の際にペーストがスクリーンを通過しにくくなり、
スルーホールにペーストが十分充填されない問題（これ
を充填欠点という）が増える。また、０．２ｍ2 ／ｇよ
りも大きいとビヒクルの含油量が増えて、スルーホール
に充填したペーストの乾燥収縮が大きくなり導通不良が
発生しやすくなる。上記銀粉を球状とすることにより、
ペーストの流動性が高くなり、充填欠点が減少する。球
状銀粉とは、必ずしも完全球である必要はなく、通常球
状といわれる形状のものが使用できる。The silver powder used in the paste for filling the through holes of the ceramic green sheet of the present invention may be a commercially available one, but it is required to be spherical powder having a specific surface area of 0.07 to 0.2 m 2 / g. is there. If the specific surface area is less than 0.07 m 2 / g, the fluidity of the paste will decrease, and it will be difficult for the paste to pass through the screen during screen printing.
The problem that the paste is not sufficiently filled in the through holes (this is called filling defect) increases. On the other hand, if it is more than 0.2 m 2 / g, the oil content of the vehicle is increased, the drying shrinkage of the paste filled in the through holes is increased, and conduction failure is likely to occur. By making the silver powder spherical,
The fluidity of the paste is increased and the filling defects are reduced. The spherical silver powder does not necessarily have to be a perfect sphere, and a shape generally called a sphere can be used.
【０００７】ビヒクルの成分は特に限定されないが、エ
チルセルロース、ポリビニルブチラール等の樹脂を単独
あるいは混合して、ターピネオール、ブチルカルビトー
ル等の溶剤やフタル酸ブチル等の可塑剤に溶解して作製
する。ビヒクル量は、銀粉１００重量部に対して７〜１
２重量部とする。７重量部よりも少ないとペースト状態
にするのが困難になり、１２重量部よりも多いとスルー
ホールに充填したペーストの乾燥収縮が大きくなり導通
不良が発生しやすくなる。ペーストの粘度は３００〜５
００Ｐａ・ｓとする。ペーストの粘度が３００Ｐａ・ｓ
よりも柔らかいと充填の際にペーストがスルーホール周
辺まで流出して配線の短絡を引き起こす。また、５００
Ｐａ・ｓよりも硬いとペーストがスクリーンを通過し難
くなって、充填欠点が増える。Although the components of the vehicle are not particularly limited, resins such as ethyl cellulose and polyvinyl butyral are used alone or in combination, and dissolved in a solvent such as terpineol or butyl carbitol or a plasticizer such as butyl phthalate. The amount of vehicle is 7-1 for 100 parts by weight of silver powder.
2 parts by weight. If it is less than 7 parts by weight, it becomes difficult to make it into a paste state, and if it is more than 12 parts by weight, the drying shrinkage of the paste filled in the through-holes becomes large and the conduction failure easily occurs. The viscosity of the paste is 300-5
00 Pa · s. Paste viscosity is 300 Pa · s
If it is softer than that, the paste will flow out to the periphery of the through hole during filling, causing a short circuit of the wiring. Also, 500
If it is harder than Pa · s, it becomes difficult for the paste to pass through the screen, and filling defects increase.
【０００８】ペーストのチクソ性は１．４〜１．７の範
囲とする。１．４よりも小さいとペーストがスクリーン
を通過し難くなって、充填欠点が増え、１．７よりも大
きくなるとペーストがスルーホールに入り難くなる。本
発明において、粘度およびチクソ性は回転粘度計により
測定されるもので、粘度は１０ｒｐｍにおける測定値、
チクソ性は５ｒｐｍにおける粘度を２０ｒｐｍにおける
粘度で割った商と定義される。The thixotropy of the paste is in the range of 1.4 to 1.7. When it is less than 1.4, the paste is hard to pass through the screen, and the filling defect increases, and when it is more than 1.7, the paste is hard to enter the through hole. In the present invention, the viscosity and thixotropy are those measured by a rotational viscometer, and the viscosity is a measured value at 10 rpm,
Thixotropy is defined as the quotient of the viscosity at 5 rpm divided by the viscosity at 20 rpm.
【０００９】[0009]
【実施例】厚さ２１８μｍのセラミックグリーンシート
１枚当たりに直径１５０μｍのスルーホールを２５０μ
ｍピッチで格子状に２５００穴形成した。このグリーン
シート４０枚に下記の実施例および従来例で作製したペ
ーストを一回のスクリーン印刷で充填して、１５０℃、
１５分間乾燥した後、全スルーホール（１０万穴）につ
いて以下の検査をおこなった。スクリーン印刷は、エマ
ルジョン厚４０μｍ、２００メッシュのスクリーンを用
いて、スキージ速度１００ｍｍ／秒で行った。[Embodiment] A through hole having a diameter of 150 μm is 250 μm per one ceramic green sheet having a thickness of 218 μm.
2500 holes were formed in a grid pattern at m pitches. 40 sheets of this green sheet were filled with the paste prepared in the following examples and conventional examples by screen printing once,
After drying for 15 minutes, the following inspection was performed on all through holes (100,000 holes). Screen printing was performed at a squeegee speed of 100 mm / sec using a 200 mesh screen having an emulsion thickness of 40 μm.
【００１０】（検査項目） 充填欠点数；４０倍の顕微鏡で観察してペーストの充填
量を測定した。そして、この量がスルーホール体積の８
割未満のスルーホールの数（充填欠点数）を数え、その
数が０であれば合格とした。 短絡数；４０倍の顕微鏡によりスルーホール間がペース
トで連結しているかいないかを観察した。そして、連結
しているスルーホールの数（短絡数）が１個もなければ
合格とした。(Inspection item) Number of filling defects: The filling amount of the paste was measured by observing with a 40 × microscope. And this amount is 8 of the through hole volume.
The number of through-holes (the number of filling defects) of less than 100% was counted, and if the number was 0, it was determined to be acceptable. The number of short-circuits: It was observed with a microscope of 40 times whether or not the through holes were connected by a paste. If the number of through holes (the number of short circuits) connected to each other was not one, it was determined to be acceptable.
【００１１】（実施例１、２、比較例１〜５）比表面積
が０．０１（平均粒径７．１μｍ、比較例１）、０．０
５（平均粒径５．７μｍ、比較例２）、０．１１（平均
粒径４．１μｍ、実施例１）、０．１５（平均粒径３．
４μｍ、実施例２）、０．２３（平均粒径１．７μｍ、
比較例３）、０．３０（平均粒径１．２μｍ、比較例
４）および０．５０ｍ2 ／ｇ（平均粒径０．５μｍ、比
較例５）の球状銀粉１００重量部とビヒクル１０重量部
をスリーロールで混合してペーストを作製した。ビヒク
ルは、エチルセルロースとポリビニルブチラールをター
ピネオール８０ｗｔ％とフタル酸ブチル２０ｗｔ％の溶
液に溶かして作製した。粘度は樹脂量を加減して３５０
〜４５０Ｐａ・ｓの範囲に調整した。また、チクソ性は
エチルセルロースとポリビニルブチラールの比率を調整
して１．４〜１．７とした。なお、これらの粘度および
チクソ性の測定は、Brookfield社製の回転粘度計（ＨＢ
Ｔ型）によった（以下に記載の例においても同じ）。銀
粉の比表面積と充填欠点数の関係および銀粉の比表面積
と短絡数の関係を図１に示す。(Examples 1 and 2, Comparative Examples 1 to 5) The specific surface area is 0.01 (average particle size 7.1 μm, Comparative Example 1), 0.0.
5 (average particle size 5.7 μm, Comparative Example 2), 0.11 (average particle size 4.1 μm, Example 1), 0.15 (average particle size 3.
4 μm, Example 2), 0.23 (average particle size 1.7 μm,
100 parts by weight of spherical silver powder of Comparative Example 3), 0.30 (average particle size 1.2 μm, Comparative Example 4) and 0.50 m 2 / g (average particle size 0.5 μm, Comparative Example 5) and 10 parts by weight of vehicle. Was mixed with three rolls to prepare a paste. The vehicle was prepared by dissolving ethyl cellulose and polyvinyl butyral in a solution of 80 wt% terpineol and 20 wt% butyl phthalate. Viscosity is 350
It was adjusted to the range of up to 450 Pa · s. The thixotropy was adjusted to 1.4 to 1.7 by adjusting the ratio of ethyl cellulose and polyvinyl butyral. The viscosity and thixotropy are measured by a Brookfield rotational viscometer (HB
T type) (the same applies to the examples described below). FIG. 1 shows the relationship between the specific surface area of silver powder and the number of filling defects and the relationship between the specific surface area of silver powder and the number of short circuits.
【００１２】（実施例１、３、４、比較例６〜９）比表
面積０．１１ｍ2 ／ｇの球状銀粉１００重量部とビヒク
ル１０重量部をスリーロールで混合して粘度が１３０
（比較例６）、２１０（比較例７）、３２０（実施例
３）、４００（実施例１）、４９０（実施例４）、５６
０（比較例８）および６２０（比較例９）のペーストを
作製した。ビヒクルは、エチルセルロースとポリビニル
ブチラールをターピネオール８０ｗｔ％とフタル酸ブチ
ル２０ｗｔ％の溶液に溶かして作製した。粘度は樹脂量
を加減して変化させた。また、チクソ性はエチルセルロ
ースとポリビニルブチラールの比率を調整して１．４〜
１．７とした。ペーストの粘度と充填欠点数の関係およ
びペーストの粘度と短絡数を図２に示す。(Examples 1, 3, 4 and Comparative Examples 6 to 9) 100 parts by weight of spherical silver powder having a specific surface area of 0.11 m 2 / g and 10 parts by weight of a vehicle were mixed with a three roll to have a viscosity of 130.
(Comparative Example 6), 210 (Comparative Example 7), 320 (Example 3), 400 (Example 1), 490 (Example 4), 56
Pastes of 0 (Comparative Example 8) and 620 (Comparative Example 9) were prepared. The vehicle was prepared by dissolving ethyl cellulose and polyvinyl butyral in a solution of 80 wt% terpineol and 20 wt% butyl phthalate. The viscosity was changed by adjusting the amount of resin. Moreover, the thixotropy is 1.4-by adjusting the ratio of ethyl cellulose and polyvinyl butyral.
It was 1.7. FIG. 2 shows the relationship between the viscosity of the paste and the number of filling defects, and the viscosity of the paste and the number of short circuits.
【００１３】（実施例１、５、比較例１０〜１４）比表
面積０．１１ｍ2 ／ｇの球状銀粉１００重量部とビヒク
ル１０重量部をスリーロールで混合してチクソ性が０．
３（比較例１０）、１．１（比較例１１）、１．６（実
施例５）、１．７（実施例１）、２．５（比較例１
２）、３．７（比較例１３）および５．５（比較例１
４）のペーストを作製した。ビヒクルは、エチルセルロ
ースとポリビニルブチラールをターピネオール８０ｗｔ
％とフタル酸ブチル２０ｗｔ％の溶液に溶かして作製し
た。粘度は樹脂量を加減して３５０〜４５０Ｐａ・ｓの
範囲に調整した。また、チクソ性はエチルセルロースと
ポリビニルブチラールの比率を調整して変化させた。ペ
ーストのチクソ性と充填欠点数の関係およびペーストの
チクソ性と短絡数の関係を図３に示す。(Examples 1 and 5, Comparative Examples 10 to 14) 100 parts by weight of spherical silver powder having a specific surface area of 0.11 m 2 / g and 10 parts by weight of a vehicle were mixed with a three roll to obtain a thixotropic property of 0.
3 (Comparative Example 10), 1.1 (Comparative Example 11), 1.6 (Example 5), 1.7 (Example 1), 2.5 (Comparative Example 1)
2) 3.7 (Comparative Example 13) and 5.5 (Comparative Example 1)
A paste of 4) was prepared. Vehicle is ethyl cellulose and polyvinyl butyral 80 wt terpineol
% And butyl phthalate 20 wt%. The viscosity was adjusted within the range of 350 to 450 Pa · s by adjusting the amount of resin. The thixotropy was changed by adjusting the ratio of ethyl cellulose and polyvinyl butyral. The relationship between the thixotropy of the paste and the number of filling defects and the relationship between the thixotropy of the paste and the number of short circuits are shown in FIG.
【００１４】（実施例１、６、８、比較例１５〜１７）
比表面積０．１１ｍ2 ／ｇの球状銀粉１００重量部と該
銀粉１００重量部に対する配合量が８（実施例６）、１
０（実施例１）、１１（実施例８）、１３（比較例１
５）、１４（比較例１６）および１５（比較例１７）重
量部のビヒクルをスリーロールで混合してペーストを作
製した。ビヒクルは、エチルセルロースとポリビニルブ
チラールをターピネオール８０ｗｔ％とフタル酸ブチル
２０ｗｔ％の溶液に溶かして作製した。粘度は樹脂量を
加減して３５０〜４５０Ｐａ・ｓの範囲に調整した。ま
た、チクソ性はエチルセルロースとポリビニルブチラー
ルの比率を調整して１．４〜１．７とした。６重量部以
下のビヒクル量では、ビヒクルと銀粉を混合することが
できなかった。ビヒクル量と充填欠点数の関係およびビ
ヒクル量と短絡数の関係を図４に示す。(Examples 1, 6, 8 and Comparative Examples 15 to 17)
100 parts by weight of spherical silver powder having a specific surface area of 0.11 m 2 / g and the compounding amount with respect to 100 parts by weight of the silver powder were 8 (Example 6), 1
0 (Example 1), 11 (Example 8), 13 (Comparative Example 1)
5), 14 (Comparative Example 16) and 15 (Comparative Example 17) parts by weight of the vehicle were mixed with a three roll to prepare a paste. The vehicle was prepared by dissolving ethyl cellulose and polyvinyl butyral in a solution of 80 wt% terpineol and 20 wt% butyl phthalate. The viscosity was adjusted within the range of 350 to 450 Pa · s by adjusting the amount of resin. The thixotropy was adjusted to 1.4 to 1.7 by adjusting the ratio of ethyl cellulose and polyvinyl butyral. When the vehicle amount was 6 parts by weight or less, the vehicle and the silver powder could not be mixed. The relationship between the vehicle quantity and the number of filling defects and the relationship between the vehicle quantity and the number of short circuits are shown in FIG.
【００１５】（従来例）球状銀粉１００重量部とビヒク
ル１８重量部を混合して、粘度が２１０Ｐａ・ｓ、チク
ソ性が２．４のペーストを作製した以外は、比較例４と
同様に試験した。その結果、充填欠点数は０、短絡数は
６０００であった。(Conventional Example) The same test as in Comparative Example 4 was carried out except that 100 parts by weight of spherical silver powder and 18 parts by weight of vehicle were mixed to prepare a paste having a viscosity of 210 Pa · s and a thixotropy of 2.4. . As a result, the number of filling defects was 0 and the number of short circuits was 6000.
【００１６】[0016]
【発明の効果】以上から明らかなように、本発明は、セ
ラミックグリーンシートのスルーホールへ一回の印刷で
欠点の無い充填ができるので多層回路基板の歩留りを向
上させることができる。As is apparent from the above, according to the present invention, since the through holes of the ceramic green sheet can be filled without defects by one printing, the yield of the multilayer circuit board can be improved.
【図１】銀粉と比表面積と充填欠点数の関係および銀粉
の比表面積と短絡数の関係を示すグラフである。FIG. 1 is a graph showing the relationship between silver powder, the specific surface area and the number of filling defects, and the relationship between the specific surface area of silver powder and the number of short circuits.
【図２】ペーストの粘度と充填欠点数の関係およびペー
ストの粘度と短絡数の関係を示すグラフである。FIG. 2 is a graph showing the relationship between the viscosity of the paste and the number of filling defects, and the relationship between the viscosity of the paste and the number of short circuits.
【図３】ペーストのチクソ性と充填欠点数の関係および
ペーストのチクソ性と短絡数の関係を示すグラフであ
る。FIG. 3 is a graph showing the relationship between the thixotropy of the paste and the number of filling defects, and the relationship between the thixotropy of the paste and the number of short circuits.
【図４】ビヒクル量と充填欠点数の関係およびビヒクル
量と短絡数の関係を示すグラフである。FIG. 4 is a graph showing the relationship between the vehicle amount and the number of filling defects, and the relationship between the vehicle amount and the number of short circuits.
Claims (4)
を形成するセラミックグリーンシートのスルーホールを
充填するために用いられ、銀を導体材料としたペースト
において、 該ペーストは、（１）比表面積が０．０７〜０．２ｍ2
／ｇである球状銀粉１００重量部を７〜１２重量部のビ
ヒクルに分散させてなり、（２）１０ｒｐｍにおける回
転粘度計による粘度が３００〜５００Ｐａ・ｓであり、
かつ（３）５ｒｐｍにおける回転粘度計による粘度を２
０ｒｐｍにおける回転粘度計による粘度で割った商とし
てのチクソ性が１．４〜１．７であることを特徴とする
セラミックグリーンシートのスルーホール充填用ペース
ト。1. A paste, which is used to fill a through hole of a ceramic green sheet forming a low temperature fired glass-ceramic multilayer circuit board and uses silver as a conductive material, wherein the paste has a specific surface area of (1). 07-0.2m 2
/ G of spherical silver powder 100 parts by weight is dispersed in a vehicle of 7 to 12 parts by weight, and (2) the viscosity by a rotational viscometer at 10 rpm is 300 to 500 Pa · s,
And (3) the viscosity measured by a rotational viscometer at 5 rpm is 2
A paste for through-hole filling of a ceramic green sheet, which has a thixotropy of 1.4 to 1.7 as a quotient divided by a viscosity measured by a rotational viscometer at 0 rpm.
リビニルブチラールの内から選ばれた少なくとも１種を
ターピネオール、ブチルカルビトールおよびフタル酸ブ
チルの内から選ばれた少なくとも１種に溶解して作製さ
れた請求項１に記載のセラミックグリーンシートのスル
ーホール充填用ペースト。2. The vehicle is prepared by dissolving at least one selected from ethyl cellulose and polyvinyl butyral in at least one selected from terpineol, butyl carbitol and butyl phthalate. The paste for through-hole filling of the ceramic green sheet described in.
測定して２〜５μｍである請求項１または２に記載のセ
ラミックグリーンシートのスルーホール充填用ペース
ト。3. The paste for filling through holes in a ceramic green sheet according to claim 1, wherein the spherical silver powder has an average particle size of 2 to 5 μm as measured by an electron microscope.
数が０個で、かつスルーホール１０万穴当りの短絡数が
０個である請求項１〜３のいずれかに記載のセラミック
グリーンシートのスルーホール充填用ペースト。4. The ceramic green sheet according to claim 1, wherein the number of filling defects per 100,000 through holes is 0, and the number of short circuits per 100,000 through holes is 0. Through-hole filling paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33754594A JPH08186345A (en) | 1994-12-28 | 1994-12-28 | Paste for filling through-hole provided to ceramic green sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33754594A JPH08186345A (en) | 1994-12-28 | 1994-12-28 | Paste for filling through-hole provided to ceramic green sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08186345A true JPH08186345A (en) | 1996-07-16 |
Family
ID=18309666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33754594A Pending JPH08186345A (en) | 1994-12-28 | 1994-12-28 | Paste for filling through-hole provided to ceramic green sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08186345A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1083578A1 (en) * | 1999-03-30 | 2001-03-14 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| JP2005113133A (en) * | 2003-09-19 | 2005-04-28 | Sekisui Chem Co Ltd | Paste for screen printing |
| JPWO2007083811A1 (en) * | 2006-01-23 | 2009-06-18 | 日立金属株式会社 | Conductive paste, multilayer ceramic substrate, and method for producing multilayer ceramic substrate |
-
1994
- 1994-12-28 JP JP33754594A patent/JPH08186345A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1083578A1 (en) * | 1999-03-30 | 2001-03-14 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| EP1083578A4 (en) * | 1999-03-30 | 2007-01-10 | Matsushita Electric Ind Co Ltd | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| JP2005113133A (en) * | 2003-09-19 | 2005-04-28 | Sekisui Chem Co Ltd | Paste for screen printing |
| JP4669685B2 (en) * | 2003-09-19 | 2011-04-13 | 積水化学工業株式会社 | Screen printing paste |
| JPWO2007083811A1 (en) * | 2006-01-23 | 2009-06-18 | 日立金属株式会社 | Conductive paste, multilayer ceramic substrate, and method for producing multilayer ceramic substrate |
| JP4507012B2 (en) * | 2006-01-23 | 2010-07-21 | 日立金属株式会社 | Multilayer ceramic substrate |
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