JPH0818255A - Apparatus for mounting power transformer on circuit board - Google Patents
Apparatus for mounting power transformer on circuit boardInfo
- Publication number
- JPH0818255A JPH0818255A JP17319494A JP17319494A JPH0818255A JP H0818255 A JPH0818255 A JP H0818255A JP 17319494 A JP17319494 A JP 17319494A JP 17319494 A JP17319494 A JP 17319494A JP H0818255 A JPH0818255 A JP H0818255A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- transformer
- power transformer
- cover
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
- H01F2005/046—Details of formers and pin terminals related to mounting on printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
- Insulating Of Coils (AREA)
- Housings And Mounting Of Transformers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路部品を実装する回
路基板に制御電源用の電源変圧器を実装する装置の改良
に係わり、その目的とするところは、回路基板に電子部
品とともに実装する電源変圧器を、特別に樹脂モールド
を施すことなく、絶縁状態を良好に維持して回路基板に
搭載実装を可能とした電源変圧器の実装装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a device for mounting a power supply transformer for a control power supply on a circuit board on which circuit parts are mounted. The present invention relates to a power transformer mounting apparatus that can be mounted and mounted on a circuit board while maintaining a good insulation state without special resin molding.
【０００２】[0002]
【従来の技術】一般に、電子機器においては、内部に回
路基板及びこの回路基板に所要の回路構成部品やコネク
タ類等の接続部品を一体的に実装した状態で、一面開口
形のケースに収容・固定して形成した例えば、機器の制
御手段（コントローラ）とか、信号検出手段等を構成す
る電子部品が種々組込まれている。そして、前記制御あ
るいは検出等の手段を構成する電子部品においては、例
えば、電気洗濯機や電気温水器等水を使用する機器に具
備される電子部品をはじめ、浴室等比較的湿気の多い場
所に設置される例えば、浴槽水の温度を制御するコント
ローラ等を構成する電子部品では、半導体素子（Ｉ
Ｃ），コンデンサ，チップ形抵抗等の回路部品及びコネ
クタ等の接続部品、更には、制御電源用の電源変圧器
（以下、電源変圧器という）を回路基板に搭載実装した
後、前記電子部品を耐湿性、耐衝撃性を付与する関係
上、シリコーン樹脂、ウレタン樹脂等により樹脂モール
ドを行って外装コートする方法が一般によく採用されて
いる。2. Description of the Related Art Generally, in an electronic device, a circuit board and required circuit components and connectors such as connectors are integrally mounted on the circuit board and housed in a one-sided opening type case. For example, various electronic components forming a device control means (controller) formed fixedly, a signal detection means, etc. are incorporated. And, in the electronic parts constituting the control or detection means, for example, in electronic parts provided in equipment using water such as an electric washing machine and an electric water heater, in a relatively humid place such as a bathroom. For example, in an electronic component that is installed, for example, a controller that controls the temperature of bath water, a semiconductor element (I
C), capacitors, circuit components such as chip resistors, connection components such as connectors, and a power transformer for control power (hereinafter referred to as power transformer) are mounted on a circuit board, and then the electronic components are mounted. From the viewpoint of imparting moisture resistance and impact resistance, a method of resin-molding a silicone resin, urethane resin or the like for exterior coating is generally well adopted.
【０００３】[0003]
【発明が解決しようとする課題】然るに、前記電子部品
を樹脂モールドによって外装コートする場合、半導体素
子，チップ形抵抗等の回路部品と電源変圧器とでは、電
源変圧器の高さ寸法が各回路部品のそれに比べて相当高
くなっているため、電子部品を収容する一面開口形のケ
ースは、電源変圧器が収容できる高さ寸法のものを使用
すると、樹脂モールドする合成樹脂の使用量が飛躍的に
多くなることはもとより、電子部品自体が必要以上に大
形化するため、前記電子部品を用いる機器は、電子部品
を設置するスペースを広く必要とすることとなり、この
結果、この種電子部品を使用する機器が大形化し、その
製造コストを高くするという問題があった。However, in the case where the electronic parts are externally coated with a resin mold, the height dimension of the power transformer is different between the circuit components such as semiconductor elements and chip resistors and the power transformer. Since it is considerably higher than that of parts, if the one-sided opening type case that houses electronic parts is of a height dimension that can accommodate a power transformer, the amount of synthetic resin used for resin molding will dramatically increase. In addition to increasing the number of electronic components, the size of the electronic components themselves becomes unnecessarily large, so that the equipment using the electronic components requires a large space for installing the electronic components, and as a result, this type of electronic components is required. There is a problem that the equipment used becomes large and the manufacturing cost thereof becomes high.
【０００４】前記の問題を解決するために、例えば、あ
らかじめ電源変圧器のみを事前に樹脂モールドし、この
樹脂モールドを行った電源変圧器を回路部品とともに回
路基板に搭載実装した後、前記回路部品のみを回路基板
とともに樹脂モールドを行って電子部品を外装コートす
る方法も考えられるが、この場合、事前に電源変圧器を
樹脂モールドした樹脂と、電子部品を樹脂モールドした
ときの樹脂とのなじみが悪く、即ち、電子部品をモール
ドした合成樹脂がその硬化時に収縮したりすると、電源
変圧器のモールド樹脂との間に亀裂（クラック）が生じ
やすく、この亀裂から水滴や湿気等が電子部品内に侵入
して半導体素子等の特性を劣化させたり、電子部品自体
の絶縁性能を低下させるという問題があった。又、電源
変圧器は前記のように、別工程で樹脂モールドの作業を
事前に行わなければならないので、電子部品を製造する
ための製造工程が増えるため、電子部品の生産性を向上
させることが難しく、しかも、製造コストが嵩むという
問題があった。In order to solve the above-mentioned problems, for example, only the power supply transformer is previously resin-molded, and the resin-molded power supply transformer is mounted and mounted on a circuit board together with the circuit component, and then the circuit component is mounted. Although it is possible to coat the electronic component with the circuit board by resin-molding only the circuit board, in this case, the compatibility between the resin in which the power transformer was resin-molded in advance and the resin when the electronic component was resin-molded If it is bad, that is, if the synthetic resin that molds the electronic parts shrinks when it cures, cracks are likely to occur between it and the molding resin of the power transformer. There is a problem that it enters and deteriorates the characteristics of the semiconductor element or the like, or deteriorates the insulating performance of the electronic component itself. Further, as described above, since the power transformer has to perform the resin molding work in advance in a separate process, the number of manufacturing processes for manufacturing the electronic component is increased, so that the productivity of the electronic component can be improved. There is a problem that it is difficult and the manufacturing cost is high.
【０００５】本発明は、前記の種々の問題に鑑み、回路
基板への電源変圧器の取付けに当たっては、その絶縁性
を損なうことなく、簡易に、かつ、低コストでの取付け
を可能とした、電源変圧器の回路基板への搭載実装装置
を提供することにある。In view of the above-mentioned various problems, the present invention enables easy and low-cost mounting of a power supply transformer on a circuit board without impairing its insulating property. An object is to provide a mounting device for mounting a power transformer on a circuit board.
【０００６】[0006]
【課題を解決するための手段】本発明は、前記の課題を
解決するために、半導体素子をはじめコンデンサ、チッ
プ形の抵抗等種々の回路部品及びコネクタ等の接続部品
を実装した回路基板に電源変圧器を取付ける場合は、所
定の導体パターンを形成した回路基板に電源変圧器を搭
載し、その引出しリードと接続した端子リードを回路基
板の所定の挿入孔に挿入して導体パターンとハンダ付等
にて結線する。このあと、前記回路基板上に搭載した電
源変圧器に、下面のみを開口して帽子状に形成した合成
樹脂製の被覆体（キャップ）を、電源変圧器の外側部分
と微少な空間を保持して被せる。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a power source on a circuit board on which various circuit components such as a semiconductor element, a capacitor, a chip type resistor and a connecting component such as a connector are mounted. When installing a transformer, mount the power transformer on the circuit board on which the specified conductor pattern is formed, and insert the terminal lead connected to the lead-out lead into the specified insertion hole of the circuit board to attach the conductor pattern and solder, etc. To connect. After that, the power transformer mounted on the circuit board is covered with a cap made of synthetic resin, which is formed in a hat shape by opening only the lower surface, to keep the outer space of the power transformer and a small space. Cover.
【０００７】そして、前記被覆体は、電源変圧器に被せ
た場合、該変圧器から抜脱するのを回避するために、回
路基板と係脱自在に掛止するフック部を先端に有して前
記被覆体と一体的に形成した板状の係止板、あるいは、
電源変圧器や被覆体側に係止突起等の係止手段を必要に
応じて形成し、この係止手段によって被覆体と電源変圧
器とを係脱自在に係止させることにより、被覆体が電源
変圧器から離脱するのを阻止する。前記被覆体を電源変
圧器に被せたあと、回路基板を所要の一面開口形のケー
スに支持突片を介して浮上させた状態で収容し、この状
態で、シリコーン樹脂等外装コート用の合成樹脂を前記
ケース内に回路部品が埋没する程度充填し、これを所定
の硬化温度で加熱・固化させて充填樹脂層を形成する。
この際、電源変圧器は合成樹脂製の被覆体により被覆さ
れているため、外装コート用の合成樹脂が被覆体内に侵
入してコイルや鉄心に付着することはなく、被覆体の開
口端と回路基板との間の隙間を良好に閉鎖し、水滴や湿
気が被覆体内に侵入するのを防ぐようにして、電源変圧
器を回路基板に搭載実装することができる。[0007] The cover has a hook portion at its tip end that is detachably engaged with the circuit board in order to prevent the cover body from being removed from the transformer when it is covered with the power transformer. A plate-like locking plate integrally formed with the cover, or
If necessary, locking means such as locking projections are formed on the power transformer or the covering body side, and the covering body and the power transformer are detachably locked by this locking means so that the covering body is a power source. Prevents you from leaving the transformer. After the power transformer is covered with the coating, the circuit board is housed in a desired one-sided opening type case while being floated via a supporting protrusion, and in this state, a synthetic resin for exterior coating such as silicone resin. Is filled to the extent that the circuit component is buried in the case, and this is heated and solidified at a predetermined curing temperature to form a filling resin layer.
At this time, since the power transformer is covered with the synthetic resin coating, the synthetic resin for the exterior coating does not enter the coating and adhere to the coil or the iron core. The power transformer can be mounted and mounted on the circuit board by properly closing the gap between the circuit board and the board and preventing water droplets and moisture from entering the inside of the covering body.
【０００８】[0008]
【作用】本発明は、前記のように、回路基板に取付けた
電源変圧器は、合成樹脂製の被覆体により完全に近い状
態で被われているので、回路基板上に充填した外装コー
ト用の合成樹脂が被覆体内に侵入するのを良好に阻止す
ることが可能となり、万一被覆体の開口端縁と回路基板
との間で微少な隙間が存在していると、この隙間から外
装コート用の合成樹脂が被覆体内に侵入しようとして
も、前記隙間が外装コート用の合成樹脂によって閉鎖さ
れる結果、被覆体内と外部とは完全に遮蔽されるため、
前記合成樹脂の被覆体内に侵入しようとする力は被覆体
内に滞留する空気圧（内圧）とによりバランスして侵入
が抑制される。この結果、被覆体内を電源変圧器を除い
ては空気のみが存在する空洞化状態に保持することがで
きる。従って、電源変圧器は特別に樹脂モールドを行う
こともなく、水滴をはじめ湿気、塵埃等の異物が侵入す
るのを確実に防止し、その絶縁性能を良好に維持するこ
とができる。As described above, according to the present invention, since the power supply transformer mounted on the circuit board is covered with the synthetic resin covering in a state close to the perfect condition, the power supply transformer for the exterior coat filled on the circuit board can be used. It is possible to prevent the synthetic resin from entering the inside of the cover well, and if there is a minute gap between the opening edge of the cover and the circuit board, use this gap for exterior coating. Even if the synthetic resin of the above attempts to enter the inside of the coated body, the gap is closed by the synthetic resin for the exterior coat, so that the inside of the coated body and the outside are completely shielded,
The force of the synthetic resin attempting to enter the coated body is balanced by the air pressure (internal pressure) staying in the coated body, and the invasion is suppressed. As a result, it is possible to keep the inside of the sheath in a hollow state in which only air exists except for the power transformer. Therefore, the power supply transformer can reliably prevent foreign matters such as moisture, dust, and the like from entering, and maintain its insulation performance well, without special resin molding.
【０００９】又、本発明は、電源変圧器を回路部品とと
もに外装コート用の合成樹脂内に埋没したり、あるい
は、あらかじめ別工程で樹脂モールドしたものを使用す
ることなく、回路基板に取付けたあと被覆体を被せるこ
とにより、容易に外部と遮蔽することができ、しかも、
回路部品の樹脂モールドを行う外装コート用合成樹脂の
使用量をも軽減することができるため、電源変圧器の製
造工程とその実装工程を確実に簡略化することができ
る。Further, according to the present invention, the power transformer is embedded in the synthetic resin for the exterior coating together with the circuit parts, or after being mounted on the circuit board without using a resin molded in advance in another step. By covering with a cover, it can be easily shielded from the outside, and
Since it is possible to reduce the amount of the outer coating synthetic resin used for resin-molding the circuit component, it is possible to surely simplify the manufacturing process and the mounting process of the power transformer.
【００１０】その上、本発明においては、合成樹脂製の
被覆体と外装コート用の合成樹脂との間で、前記外装コ
ート用合成樹脂の固化時等において万一亀裂が生じたと
しても、前記充填された外装コート用合成樹脂が被覆体
の開口端と回路基板との間の隙間を閉鎖するように充填
保持されているため、湿気等が被覆体に侵入するのを確
実に阻止することができるので、電源変圧器は絶縁性が
良好に維持でき至便である。しかも、前記被覆体には電
源変圧器、あるいは、回路基板に対して離脱防止手段が
形成されているため、外装コート用合成樹脂の充填時、
被覆体が揺動することがないので、合成樹脂の充填作業
を円滑に行うことができる利点もある。In addition, in the present invention, even if a crack is generated between the synthetic resin covering and the synthetic resin for exterior coating when the synthetic resin for exterior coating is solidified, the above Since the filled outer coating synthetic resin is filled and held so as to close the gap between the open end of the cover and the circuit board, it is possible to reliably prevent moisture and the like from entering the cover. Therefore, the power transformer can maintain good insulation and is convenient. Moreover, since the cover has a power transformer or a detachment prevention means for the circuit board, when the synthetic resin for the exterior coat is filled,
Since the covering body does not swing, there is also an advantage that the filling operation of the synthetic resin can be smoothly performed.
【００１１】[0011]
【実施例】以下、本発明の実施例を図１ないし図７によ
り説明する。最初に、図４は電源変圧器１及び種々の回
路部品２を搭載実装した回路基板３を有底函状のケース
４内に収容して電子部品５を構成した状態を示す平面図
である。そして、図４，５において、前記電子部品５を
構成する種々の回路部品２，即ち、半導体素子（ＩＣ）
６をはじめ、コンデンサ７，チップ形の抵抗８等からな
る各回路部品２は、それぞれ回路基板３の所定位置に搭
載実装され、前記回路基板３に所定の回路パターンによ
って回路結線された図示しない導体パターンによって結
線配置されている。Embodiments of the present invention will be described below with reference to FIGS. First, FIG. 4 is a plan view showing a state in which the circuit board 3 on which the power transformer 1 and various circuit components 2 are mounted is housed in a case 4 having a bottomed box shape to form an electronic component 5. 4 and 5, various circuit components 2 constituting the electronic component 5, that is, a semiconductor element (IC)
6, each of the circuit components 2 including a capacitor 7, a chip-shaped resistor 8 and the like are mounted and mounted on a predetermined position of a circuit board 3, and conductors (not shown) connected to the circuit board 3 by a predetermined circuit pattern. The wiring is arranged according to the pattern.
【００１２】図４において、９は回路基板３上の端部に
回路部品２と所要の間隔を保って複数個実装したコネク
タ等の接続端子で、回路基板３の上方に向けて取付けら
れており、図示しない接続リード等を介して外部回路と
電子部品５とを接続する。In FIG. 4, reference numeral 9 is a connecting terminal such as a connector, which is mounted on the end portion of the circuit board 3 with the circuit component 2 at a required interval, and is attached to the upper side of the circuit board 3. An external circuit is connected to the electronic component 5 via a connection lead (not shown).
【００１３】次に電源変圧器１を回路基板３に搭載実装
する場合について説明する。前記電源変圧器１は図１で
示すように、１次及び２次コイルを巻枠１０に巻回して
形成した巻線１１と、この巻線１１を囲繞するようにし
て例えば、Ｅ形あるいは短冊形の鉄心鋼板をロ字形に組
み合せて形成した鉄心１２とを備えて構成した周知の電
源変圧器であり、この変圧器１には、図１，２で示すよ
うに、その外周に下面を開口して帽子状に形成した、例
えば、ポリエステル樹脂等熱可塑性の合成樹脂からなる
被覆体（キャップ）１３が被せられている。Next, the case where the power supply transformer 1 is mounted on the circuit board 3 will be described. As shown in FIG. 1, the power supply transformer 1 includes a winding 11 formed by winding a primary coil and a secondary coil around a winding frame 10, and a winding 11 surrounding the winding 11. 1 is a well-known power supply transformer configured by including an iron core 12 formed by combining rectangular-shaped iron core steel plates into a square shape. The transformer 1 has a lower surface opened at its outer periphery as shown in FIGS. Then, a covering body (cap) 13 formed of a thermoplastic synthetic resin such as polyester resin, which is formed in a hat shape, is covered.
【００１４】そして、前記被覆体１３は図１，２で示す
ように、上部側は巻枠１０の頭部及び鉄心１２の胴回り
の形状と合致させるべく段状に形成されており、又、下
部側は開口端の周縁所定位置に、鉤形に折曲されて先端
にフック部１４を設けた板状の係止板１５が、被覆体１
３と一体となって複数形成されている。前記被覆体１３
の取付けに際しては、図１，４で示すように、最初に回
路部品２を実装した回路基板３の変圧器取付位置に電源
変圧器１を搭載し、この変圧器１の図示しない引出しリ
ードと接続した端子リード１６を、回路基板３の挿入孔
に挿入して図示しない導体パターンと接続することによ
り、前記電源変圧器１の回路基板３への実装を行う。As shown in FIGS. 1 and 2, the cover 13 is formed in a stepped shape on the upper side so as to match the shape of the head of the winding frame 10 and the circumference of the core of the iron core 12, and the lower portion. On the side, a plate-like locking plate 15 bent into a hook shape and provided with a hook portion 14 at its tip is provided at a predetermined position on the periphery of the open end, and the cover 1
3 and 3 are formed integrally with each other. The coating 13
1 and 4, the power transformer 1 is first mounted at the transformer mounting position of the circuit board 3 on which the circuit component 2 is mounted, and is connected to a lead lead (not shown) of this transformer 1. The terminal lead 16 is inserted into the insertion hole of the circuit board 3 and connected to a conductor pattern (not shown) to mount the power transformer 1 on the circuit board 3.
【００１５】つづいて前記電源変圧器１を回路基板３に
実装した状態で、被覆体１３を電源変圧器１の上部側か
ら被せる。この場合、前記回路基板３には被覆体１３の
下部開口端の周縁に形成した係止板１５と対応する位置
において、前記係止板１５の板状部を遊嵌する嵌合孔１
７が事前に穿孔されており、前記被覆体１３を被せると
同時に、係止板１５を嵌合孔１７に貫通させることによ
り、前記被覆体１３は図１に示すように、前記嵌合孔１
７に貫通した係止板１５のフック部１４が図３で示すよ
うに、回路基板３の裏面に掛止されて、被覆体１３が揺
動したり回路基板３から離脱するのを防ぐ。一方、前記
被覆体１３は図２で示すように、係止板１５を折曲して
嵌合孔１７に嵌合させることにより、下部開口端が係止
板１５の板厚分に相当する寸法分だけ回路基板３から浮
上して回路基板３との間で隙間ｈを形成した状態で取付
けられる。従って、被覆体１３は電源変圧器１との間で
微少な間隔を保って被せることができる。なお、図４に
おいて、１８は回路基板３に穿設した円形又は長円形の
透孔である。Subsequently, with the power supply transformer 1 mounted on the circuit board 3, the cover 13 is covered from the upper side of the power supply transformer 1. In this case, a fitting hole 1 for loosely fitting the plate portion of the locking plate 15 at a position corresponding to the locking plate 15 formed on the peripheral edge of the lower opening end of the cover 13 on the circuit board 3.
7 is pre-drilled, and the covering plate 13 is put on the fitting hole 17 at the same time as the covering plate 13 is covered therewith.
As shown in FIG. 3, the hook portion 14 of the locking plate 15 penetrating 7 is hooked on the back surface of the circuit board 3 to prevent the covering body 13 from swinging or coming off from the circuit board 3. On the other hand, as shown in FIG. 2, the cover 13 is formed by bending the locking plate 15 and fitting it into the fitting hole 17 so that the lower opening end corresponds to the thickness of the locking plate 15. The circuit board 3 is lifted by an amount corresponding to the distance, and the circuit board 3 is mounted with a gap h formed therebetween. Therefore, the covering body 13 can be covered with the power transformer 1 with a minute gap. In FIG. 4, reference numeral 18 denotes a circular or oval through hole formed in the circuit board 3.
【００１６】次に図５において、１９はケース４の隅角
部付近に突設した回路基板３の支持突片を示し、又、２
０は支持突片１９に近接してケース４の底面に突設した
２つ割となした支持支柱を示し、前記電源変圧器１及び
回路部品２を搭載実装した回路基板３は、図５，６で示
すように、ケース４内において、支持突片１９上に乗載
した状態で、支持支柱２０と対応する位置で穿孔した係
合孔に前記支持支柱２０を係合させると、２つ割となし
た支持支柱２０自体の弾性力によって、回路基板３は揺
動することなく、支持突片１９上に載置されてケース４
内に収容することができる。これによって電子部品５の
素体を形成するものである。Next, referring to FIG. 5, reference numeral 19 denotes a support projection of the circuit board 3 which is provided near the corner of the case 4, and 2
Reference numeral 0 indicates a support pillar formed by dividing the support pillar 19 into two pieces, which is provided on the bottom surface of the case 4 in the vicinity of the support projection piece 19. The circuit board 3 on which the power transformer 1 and the circuit component 2 are mounted is shown in FIG. As shown by 6, when the support column 20 is mounted on the support protrusion 19 in the case 4 and the support column 20 is engaged with an engagement hole formed at a position corresponding to the support column 20, the support column 20 is divided into two parts. Due to the elastic force of the supporting columns 20 themselves, the circuit board 3 is placed on the supporting projections 19 without swinging, and the case 4
Can be housed inside. With this, the element body of the electronic component 5 is formed.
【００１７】前記のようにして電子部品５の素体を形成
したら、つづいて、シリコーン樹脂、エポキシ樹脂等か
らなる外装コート用の合成樹脂（以下充填樹脂という）
を回路基板３上に、半導体素子６，コンデンサ７等の回
路部品２を包埋する程度で充填する。前記充填樹脂が回
路基板３上に充填されると、その一部は回路基板３に穿
設した透孔１８を通ってケース４の底面側に流下しなが
ら回路基板３の下側に順次充填される。前記充填樹脂を
図５，６で示すように、回路部品２が被覆できる程度充
填したら、充填作業を中止する。このあと、ケース４を
図示しない加熱炉等に入れて充填樹脂を所定の温度で加
熱・固化させることにより、回路基板３に充填樹脂層２
１を形成する。この充填樹脂層２１を形成することによ
って電子部品５の製作を完了するものである。After the element body of the electronic component 5 is formed as described above, a synthetic resin for exterior coating (hereinafter referred to as a filling resin), which is made of a silicone resin, an epoxy resin or the like.
Is filled on the circuit board 3 to such an extent as to embed the circuit components 2 such as the semiconductor element 6 and the capacitor 7. When the filling resin is filled on the circuit board 3, a part of the filling resin is sequentially filled on the lower side of the circuit board 3 while flowing down through the through hole 18 formed in the circuit board 3 to the bottom side of the case 4. It As shown in FIGS. 5 and 6, when the circuit component 2 is filled with the filling resin to a sufficient extent, the filling operation is stopped. Then, the case 4 is placed in a heating furnace (not shown) or the like to heat and solidify the filling resin at a predetermined temperature, whereby the filling resin layer 2 is applied to the circuit board 3.
1 is formed. The production of the electronic component 5 is completed by forming the filling resin layer 21.
【００１８】前記回路基板３に充填樹脂層２１を形成す
る場合、充填樹脂を回路基板３上に充填すると、充填樹
脂の一部は電源変圧器１を実装した回路基板３の表面
と、電源変圧器１を被う被覆体１３の下部開口端との間
の隙間ｈから被覆体１３内に侵入しようとする。しか
し、充填樹脂を回路基板３上に順次充填して被覆体１３
の開口端周縁の前記隙間ｈが、図７のように充填樹脂に
より形成される充填樹脂層２１にて閉鎖されると、前記
被覆体１３内には空気が残存しているため、充填樹脂が
前記閉鎖部分を押動して被覆体１３内に侵入しようとし
ても、被覆体１３内に空気が残存していることにより生
ずる内圧と、前記被覆体１３内に充填樹脂が侵入しよう
とする力が均衡して充填樹脂の侵入を確実に阻止するこ
とができる。When the filling resin layer 21 is formed on the circuit board 3, when the filling resin is filled on the circuit board 3, a part of the filling resin is on the surface of the circuit board 3 on which the power transformer 1 is mounted and the power transformer. An attempt is made to penetrate into the covering body 13 through the gap h between the lower opening end of the covering body 13 covering the container 1. However, the filling resin is sequentially filled on the circuit board 3 to cover the covering body 13.
When the gap h at the peripheral edge of the opening end of is closed by the filling resin layer 21 formed of the filling resin as shown in FIG. 7, since air remains in the covering body 13, the filling resin is Even if the closed portion is pushed to enter the cover 13, the internal pressure generated by the air remaining in the cover 13 and the force of the filling resin entering the cover 13 are It is possible to reliably prevent the ingress of the filling resin in balance.
【００１９】この結果、電源変圧器１を被覆する被覆体
１３内には、充填樹脂の一部が図７のように侵入するの
みであるため、回路基板３への充填樹脂の充填作業は、
回路部品２が埋設する程度だけ充填すればよいので、迅
速・容易に、しかも、少ない樹脂使用量により経済的に
行うことができる。その上、被覆体１３の開口端と回路
基板３との間の隙間ｈは、充填樹脂によって確実に閉鎖
することができるので、被覆体１３内に湿気等が侵入し
て電源変圧器１の絶縁性能を損なうことも全くない。更
に、被覆体１３は係止板１５によって回路基板３に揺動
不能に掛止されているため、充填樹脂の充填中に被覆体
１３が揺動して閉鎖した隙間ｈを破って充填樹脂が被覆
体１３内に侵入するのを確実に防ぐことができる。As a result, only a part of the filling resin penetrates into the cover 13 for covering the power supply transformer 1 as shown in FIG. 7, so that the work of filling the circuit board 3 with the filling resin is
Since the circuit component 2 need only be filled to the extent that it is buried, it can be performed quickly and easily and economically with a small amount of resin used. Moreover, the gap h between the open end of the cover 13 and the circuit board 3 can be reliably closed by the filling resin, so that moisture or the like enters the cover 13 to insulate the power transformer 1. There is no loss of performance. Further, since the covering body 13 is non-swingably locked to the circuit board 3 by the locking plate 15, the covering body 13 swings during the filling of the filling resin and the closed gap h is broken to prevent the filling resin from being filled. It is possible to reliably prevent the intrusion into the cover 13.
【００２０】このように、本発明の電源変圧器１を回路
基板３に実装するための装置は、電源変圧器１に合成樹
脂製の被覆体１３を被せ、この被覆体１３を回路基板３
に揺動不能に掛止して充填樹脂を回路基板３に充填する
ようにしたので、電源変圧器１は変圧器自体を樹脂モー
ルドすることなく、被覆体１３を被せることにより、樹
脂モールドした場合と同様の絶縁性能を維持することが
可能となるため、電源変圧器１の回路基板３への搭載実
装作業を迅速・確実に、かつ、経済的に行うことができ
る。As described above, in the apparatus for mounting the power transformer 1 of the present invention on the circuit board 3, the power transformer 1 is covered with the synthetic resin covering 13, and the covering 13 is covered with the circuit board 3.
When the power supply transformer 1 is resin-molded by covering the transformer 13 itself with the covering body 13 without resin-molding the transformer itself, the power-supply transformer 1 is fixed to the circuit board 3 so as not to swing. Since it is possible to maintain the same insulation performance as the above, the mounting and mounting work of the power supply transformer 1 on the circuit board 3 can be performed quickly, reliably, and economically.
【００２１】図８及び図９，１０は本発明において、被
覆体１３ａ，１３ｂを電源変圧器１に被せたとき、被覆
体１３ａ，１３ｂを揺動不能に係止する手段の第２及び
第３実施例を示すもので、第２実施例として図８に示す
被覆体１３ａの係止手段は、被覆体１３ａの内側に電源
変圧器１の鉄心１２部分の下側面と係止する係止突起２
２を形成し、前記被覆体１３ａを電源変圧器１に被せる
と、被覆体１３ａはその下部開口端が回路基板３表面の
歪み等により、回路基板３上に隙間を一部形成した状態
で載置される。この場合、前記係合突起２２と鉄心１２
とは係止状態にない。前記の状態で回路基板３上に充填
樹脂を充填すると、樹脂は前記被覆体１３ａの開口端と
回路基板３との間の隙間から被覆体１３ａに侵入しよう
とする。この場合も、前記第１実施例のところで説明し
たように、充填樹脂が前記隙間を閉鎖した時点で充填樹
脂は被覆体１３ａ内に侵入することはない。ただ、前記
充填樹脂が隙間を埋める場合、即ち、充填樹脂が被覆体
１３ａ内に侵入しようとする力によって被覆体１３自体
は揺動しようとするが、被覆体１３ａの内側に設けた係
止突起２２が鉄心１２の下側面に当接して揺動を阻止す
る。従って、充填樹脂の充填中に被覆体１３ａが揺動し
て無用に充填樹脂が被覆体１３ａ内に侵入するのを防
ぎ、被覆体１３ａの開口端と回路基板３表面との隙間を
前記充填樹脂によって円滑・良好に閉鎖することができ
る。FIGS. 8 and 9 and 10 show the second and third means for locking the cover bodies 13a and 13b so that they cannot swing when the power supply transformer 1 is covered with the cover bodies 13a and 13b. As a second embodiment, the locking means of the cover 13a shown in FIG. 8 as the second embodiment is a locking projection 2 that locks with the lower side surface of the iron core 12 portion of the power transformer 1 inside the cover 13a.
2 is formed and the power supply transformer 1 is covered with the cover 13a, the cover 13a is mounted in a state in which a gap is partially formed on the circuit board 3 due to the distortion of the surface of the circuit board 3 at its lower open end. Placed. In this case, the engagement protrusion 22 and the iron core 12
And are not locked. When the circuit board 3 is filled with the filling resin in the above state, the resin tends to enter the covering body 13a through the gap between the opening end of the covering body 13a and the circuit board 3. Also in this case, as described in the first embodiment, the filling resin does not enter the coating 13a when the filling resin closes the gap. However, when the filling resin fills the gap, that is, the filling resin tries to oscillate due to the force of the filling resin entering the coating body 13a, the locking protrusions provided inside the coating body 13a. 22 contacts the lower surface of the iron core 12 to prevent swinging. Therefore, it is possible to prevent the covering body 13a from swinging and unnecessarily entering the covering body 13a during the filling of the filling resin, and the gap between the opening end of the covering body 13a and the surface of the circuit board 3 is prevented from being filled with the filling resin. It can be closed smoothly and satisfactorily.
【００２２】図９，１０に示す第３実施例は、図１０の
ように、電源変圧器１の巻枠１０下部の端部に突設した
係合突起２３に、被覆体１３ｂの開口端内側に穿設した
係合孔２４を係止させることにより、被覆体１３ｂを回
路基板３との間に隙間ｈを有して電源変圧器１に揺動不
能に被せるようにしたもので、これにより、充填樹脂を
回路基板３に充填する際、被覆体１３ｂは電源変圧器１
に揺動不能に被冠されているので、回路基板３に充填さ
れる充填樹脂は、被覆体１３ｂと回路基板３表面の隙間
ｈを良好に閉鎖して、前記充填樹脂を被覆体１３ｂ内に
侵入させることなく回路基板３に充填することができ
る。なお、前記第２，第３実施例に使用する各被覆体１
３ａ，１３ｂは、ポリエステル樹脂やエポキシ樹脂等熱
可塑性あるいは熱硬化性の合成樹脂を用いて形成されて
いる。In the third embodiment shown in FIGS. 9 and 10, as shown in FIG. 10, the engaging projection 23 projecting from the lower end of the winding frame 10 of the power transformer 1 is provided inside the opening end of the cover 13b. By locking the engagement hole 24 formed in the power supply transformer 1, the covering body 13b is covered with a gap h between the cover body 13b and the circuit board 3 so as not to swing. When the circuit board 3 is filled with the filling resin, the cover 13b is the power transformer 1
Since it is captivated so as not to swing, the filling resin to be filled in the circuit board 3 satisfactorily closes the gap h between the covering body 13b and the surface of the circuit board 3, and the filling resin is filled in the covering body 13b. The circuit board 3 can be filled without intrusion. In addition, each coating 1 used in the second and third embodiments
3a and 13b are formed using a thermoplastic or thermosetting synthetic resin such as polyester resin or epoxy resin.
【００２３】又、本発明は、回路基板３に充填樹脂層２
１を形成する外装コート用の合成樹脂としてシリコーン
樹脂等を使用した例について説明したが、充填樹脂層２
１を形成する充填物として、常温では軟こう状態を示
し、融点が半導体素子６等回路部品２の定格保存温度内
にあり、かつ、撥水性を具備した、例えば、ペトロラタ
ム（ワセリン）を用いて回路基板３に回路部品２を包埋
する絶縁層を形成するようにしてもよい。回路基板３へ
の充填は外装コート用の合成樹脂を充填する場合と同様
に液状で充填する。この場合も、被覆体１３と回路基板
３との隙間ｈが充填物で閉鎖されれば、被覆体１３内に
は以後充填物が侵入することはない。更に、前記充填物
は温度を上げれば液化状態に戻るため、電源変圧器１や
回路部品２が故障により交換を必要とする場合、その交
換作業を容易に行うことができる。従って、本発明にお
いては、回路基板３の外装コート材として合成樹脂に代
えて、前記ペトロラタムを充填物として使用しても本発
明は成立するものである。Further, according to the present invention, the filling resin layer 2 is formed on the circuit board 3.
Although the example in which the silicone resin or the like is used as the synthetic resin for the exterior coat forming 1 has been described, the filling resin layer 2
As a filling material forming 1, a circuit using, for example, petrolatum (petroleum jelly), which exhibits a soft state at room temperature, has a melting point within the rated storage temperature of the circuit component 2 such as the semiconductor element 6 and is water repellent An insulating layer that embeds the circuit component 2 may be formed on the substrate 3. The circuit board 3 is filled in a liquid state as in the case of filling a synthetic resin for exterior coating. Also in this case, if the gap h between the cover 13 and the circuit board 3 is closed by the filler, the filler will not intrude into the cover 13 thereafter. Further, since the filling material returns to the liquefied state when the temperature is raised, when the power supply transformer 1 or the circuit component 2 needs to be replaced due to a failure, the replacement work can be easily performed. Therefore, in the present invention, the present invention can be realized even if the petrolatum is used as the filling material instead of the synthetic resin as the exterior coating material of the circuit board 3.
【００２４】[0024]
【発明の効果】本発明は、以上説明したように構成した
ので、次に示すような効果を有する。 （１）、本発明は、回路基板上に回路部品と一緒に実装
した電源変圧器に、合成樹脂製の被覆体を被せて、前記
回路部品を外装コート用の合成樹脂等からなる外装コー
ト材により包埋して電子部品を製造するように構成した
ので、前記電源変圧器は回路基板への外装コート用合成
樹脂等の充填時、被覆体内に前記合成樹脂等が侵入する
ことがないため、別工程で特別に樹脂モールドを行った
り、回路部品と同時に樹脂モールドを行う必要が全くな
いので、電源変圧器の回路基板への実装作業を迅速・容
易に、かつ、経済的に行うことができる。Since the present invention is constructed as described above, it has the following effects. (1) According to the present invention, a power supply transformer mounted on a circuit board together with a circuit component is covered with a synthetic resin coating to coat the circuit component with a synthetic resin or the like for exterior coating. Since it is configured to manufacture an electronic component by embedding by, the power supply transformer, when the synthetic resin or the like for the exterior coat to the circuit board is filled, because the synthetic resin or the like does not enter the coating body, Since there is no need to perform special resin molding in a separate process or resin molding at the same time as circuit components, the work of mounting the power transformer on the circuit board can be performed quickly, easily, and economically. .
【００２５】（２）、又、電源変圧器を被覆する被覆体
は、回路基板あるいは変圧器自体に係止される手段を具
備して揺動しないように係止保持されているので、回路
基板への外装コート材の充填時、前記被覆体は外装コー
ト材の充填作業中揺動することがないため、外装コート
材の充填作業を円滑・良好に行うことができる。(2) Further, since the covering body for covering the power supply transformer is provided with a means for being locked to the circuit board or the transformer itself and is locked and held so as not to swing, When the outer coating material is filled into the outer coating material, the coating does not rock during the filling operation of the outer coating material, so that the filling operation of the outer coating material can be performed smoothly and satisfactorily.
【００２６】（３）、更に被覆体と回路基板表面との間
には微少な隙間が形成されているので、外装コート材の
回路基板への充填時、外装コート材が前記隙間に最初に
侵入して該隙間を埋めて閉鎖するため、このあと外装コ
ート材が被覆体に侵入するおそれが全くないので、回路
基板の外装コート時、外装コート材の使用量を著しく軽
減することができるので、電子部品の製造工程が短縮化
でき、その製造コストを軽減することができる。(3) Further, since a minute gap is formed between the cover and the surface of the circuit board, when the outer coat material is filled in the circuit board, the outer coat material first enters the gap. Since the gap is filled and closed, there is no possibility that the exterior coating material will enter the coating body after that, so that the amount of the exterior coating material used during the exterior coating of the circuit board can be significantly reduced. The manufacturing process of the electronic component can be shortened and the manufacturing cost thereof can be reduced.
【図１】本発明の電源変圧器実装装置を縦断して示す正
面図である。FIG. 1 is a vertical cross-sectional view showing a power transformer mounting apparatus of the present invention.
【図２】同じく電源変圧器実装装置の要部を切欠いて示
す断面図である。FIG. 2 is a cross-sectional view showing a main part of the power transformer mounting device by cutting out the same.
【図３】同じく電源変圧器実装装置を示す底面図であ
る。FIG. 3 is a bottom view of the power transformer mounting device.
【図４】本発明の実装装置により電源変圧器を実装した
電子部品の平面図である。FIG. 4 is a plan view of an electronic component on which a power transformer is mounted by the mounting device of the present invention.
【図５】同じく電子部品の要部を縦断して示す正面図で
ある。FIG. 5 is a front view showing a vertical section of a main part of the electronic component.
【図６】同じく電子部品の縦断側面図である。FIG. 6 is a vertical side view of the same electronic component.
【図７】図６のＰ部分を拡大して示す断面図である。7 is a cross-sectional view showing an enlarged part P of FIG.
【図８】電源変圧器の他の実装装置を示す縦断面図であ
る。FIG. 8 is a vertical cross-sectional view showing another mounting device of the power transformer.
【図９】電源変圧器の更に他の実装装置の要部を切欠い
て示す正面図である。FIG. 9 is a front view showing a notch of a main part of still another mounting device of the power transformer.
【図１０】同じく縦断側面図である。FIG. 10 is likewise a vertical side view.
１ 電源変圧器 ２ 回路部品 ３ 回路基板 ４ ケース ９ 接続端子 １３，１３ａ，１３ｂ 被覆体 １４ フック部 １５ 係止板 １７ 嵌合孔 ２１ 充填樹脂層 ２２ 係止突起 ２３ 係合突起 ２４ 係合孔 ｈ 隙間 1 Power Transformer 2 Circuit Parts 3 Circuit Board 4 Case 9 Connection Terminals 13, 13a, 13b Covering Body 14 Hook Part 15 Locking Plate 17 Fitting Hole 21 Filled Resin Layer 22 Locking Protrusion 23 Engaging Protrusion 24 Engaging Hole h Gap
───────────────────────────────────────────────────── フロントページの続き (72)発明者 北島 淑光 長野県長野市川中島町原1280 長野愛知電 機株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshimitsu Kitashima 1280 Kawanakajimachohara, Nagano City, Nagano Nagano Aichi Electric Co., Ltd.
Claims (4)
と電源変圧器とを、回路基板上に回路結線された所定の
導体パターンの位置にそれぞれ搭載実装し、前記電源変
圧器には、その外周に合成樹脂製の被覆体を回路基板の
表面との間に微少な隙間を備えて被装し、前記回路基板
に外装コート用の合成樹脂を充填して回路部品を包埋し
て充填樹脂層を形成し、前記被覆体と回路基板との間の
隙間を前記充填樹脂層により閉鎖して、被覆体内に外装
コート用の合成樹脂が侵入するのを防ぐようにしたこと
を特徴とする電源変圧器の回路基板への実装装置。1. A required circuit component, a connection terminal such as a connector, and a power transformer are mounted and mounted on a circuit board at positions of predetermined conductor patterns connected to the circuit. A synthetic resin coating is provided on the outer periphery with a minute gap between the surface and the surface of the circuit board, and the circuit board is filled with a synthetic resin for exterior coating to embed the circuit components and fill the resin. A power supply characterized in that a layer is formed and the gap between the cover and the circuit board is closed by the filling resin layer to prevent the synthetic resin for exterior coating from entering the cover. A device for mounting a transformer on a circuit board.
該被覆体の開口端周縁にフック部を先端に形成した係止
板を複数個垂設し、この係止板を回路基板に穿設した嵌
合孔に係脱自在に掛止して、電源変圧器を被覆する被覆
体を回路基板に取付けるようにしたことを特徴とする請
求項１記載の電源変圧器の回路基板への実装装置。2. The cover for covering the power transformer comprises:
A plurality of locking plates each having a hook portion formed at the tip thereof are vertically provided on the periphery of the opening end of the covering body, and the locking plates are detachably engaged with a fitting hole formed in the circuit board to supply power. The mounting device for mounting a power transformer on a circuit board according to claim 1, characterized in that a cover for covering the transformer is attached to the circuit board.
被覆体の開口端内側に電源変圧器の鉄心部分と係止する
係止突起を形成し、この係止突起を電源変圧器の鉄心部
分に係止させて、前記被覆体を電源変圧器に被覆させる
ようにしたことを特徴とする請求項１記載の電源変圧器
の回路基板への実装装置。3. The cover for covering the power transformer has a locking projection inside the open end of the cover for locking the iron core portion of the power transformer, and the locking projection of the power transformer. The device for mounting a power supply transformer on a circuit board according to claim 1, wherein the power supply transformer is covered with the cover by being locked to an iron core portion.
源変圧器の巻枠側に突設した係合突起を、前記被覆体側
に穿設した係合孔に係脱自在に嵌合させて、前記被覆体
を電源変圧器に被覆させるようにしたことを特徴とする
請求項１記載の電源変圧器の回路基板への実装装置。4. The covering body for covering the power supply transformer is configured such that an engaging projection protruding on a winding frame side of the power supply transformer is disengageably fitted into an engaging hole formed on the covering body side. 2. The mounting apparatus for mounting a power transformer on a circuit board according to claim 1, wherein the power transformer is coated with the coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17319494A JP3360260B2 (en) | 1994-06-30 | 1994-06-30 | Power transformer mounting device on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17319494A JP3360260B2 (en) | 1994-06-30 | 1994-06-30 | Power transformer mounting device on circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0818255A true JPH0818255A (en) | 1996-01-19 |
| JP3360260B2 JP3360260B2 (en) | 2002-12-24 |
Family
ID=15955845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17319494A Expired - Fee Related JP3360260B2 (en) | 1994-06-30 | 1994-06-30 | Power transformer mounting device on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3360260B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1951019A1 (en) * | 2006-10-25 | 2008-07-30 | Funai Electric Co., Ltd. | Assembly structure for power supply circuit unit of electric device |
-
1994
- 1994-06-30 JP JP17319494A patent/JP3360260B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1951019A1 (en) * | 2006-10-25 | 2008-07-30 | Funai Electric Co., Ltd. | Assembly structure for power supply circuit unit of electric device |
| US7817435B2 (en) | 2006-10-25 | 2010-10-19 | Funai Electric Co., Ltd. | Assembly structure for power supply circuit unit of electric device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3360260B2 (en) | 2002-12-24 |
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