JPH0817105B2 - Vertical striped heat seal connector member and its manufacturing method - Google Patents

Vertical striped heat seal connector member and its manufacturing method

Info

Publication number
JPH0817105B2
JPH0817105B2 JP1309173A JP30917389A JPH0817105B2 JP H0817105 B2 JPH0817105 B2 JP H0817105B2 JP 1309173 A JP1309173 A JP 1309173A JP 30917389 A JP30917389 A JP 30917389A JP H0817105 B2 JPH0817105 B2 JP H0817105B2
Authority
JP
Japan
Prior art keywords
film
weight
copper
photoresist
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1309173A
Other languages
Japanese (ja)
Other versions
JPH03173086A (en
Inventor
光正 芝田
勝弘 村田
忠昭 磯野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Graphite Industries Ltd
Original Assignee
Nippon Graphite Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Graphite Industries Ltd filed Critical Nippon Graphite Industries Ltd
Priority to JP1309173A priority Critical patent/JPH0817105B2/en
Priority to GB9025959A priority patent/GB2239720B/en
Publication of JPH03173086A publication Critical patent/JPH03173086A/en
Priority to US08/020,902 priority patent/US5306602A/en
Publication of JPH0817105B2 publication Critical patent/JPH0817105B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、液晶表示管、エレクトロクロミックディス
プレイ（ECD）、太陽電池等の電子素子の電極部分又は
プリント基板端子部分を、対向するプリント回路基板の
各端子部分に、機械的及び電気的に接続するための縦縞
細条形ヒートシールコネクタ部材とその製造法に関する
ものである。さらに又、本発明は、導電性を持たせた特
別のフォトレジストインクを用い、エッチング工程の一
部を省略し、しかも信頼性に優れた縦縞細条形のヒート
シールコネクタ部材とその製造法に関するものである。The present invention relates to a printed circuit board in which an electrode part or a printed circuit board terminal part of an electronic element such as a liquid crystal display tube, an electrochromic display (ECD), a solar cell or the like faces each other. The present invention relates to a striped heat seal connector member having vertical stripes for mechanically and electrically connecting to each terminal portion of and a manufacturing method thereof. Furthermore, the present invention relates to a vertical striped heat seal connector member which uses a special photoresist ink having conductivity, omits a part of the etching step, and is excellent in reliability, and a manufacturing method thereof. It is a thing.

（従来の技術） 普通、この種の、従来のフォトレジストインクを使用
して、縦縞細条形のヒートシールコネクタ部材を製造す
る場合には、ネガマスクを使用して所望の導電回路パタ
ーンを露光し焼付けてから、エッチングにより、光硬化
しなかったパターンの周囲の不用の余分のフォトレジス
トと、その下の銅層とを全部溶解除去し、次いで導電回
路パターンの銅箔上に付着した光硬化したフォトレジス
ト残渣を、アルカリ等の薬品によって除去し回路パター
ンの裸の銅表面を露出させる。そこで２つの方法に分か
れるのであるが、 （イ）一方では、この裸の銅表面だけに（すなわち回路
パターンのみに）、導電性の、すなわち、例えば、金属
や黒鉛等の微粒子を含む熱圧着剤層を形成し、次いで銅
回路パターン以外の周囲表面には、導電性微粒子を含ま
ない絶縁性熱圧着剤層を別工程において被着形成する。
すなわち導電性のものと、絶縁性のものと、２つに分け
て２工程で熱圧着剤層を作る。(Prior Art) Normally, when a vertical striped heat seal connector member is manufactured using this kind of conventional photoresist ink, a desired conductive circuit pattern is exposed using a negative mask. After baking, by etching, unnecessary extra photoresist around the pattern that was not photocured and the copper layer underneath were completely dissolved and removed, and then photocured on the copper foil of the conductive circuit pattern. The photoresist residue is removed by a chemical such as alkali to expose the bare copper surface of the circuit pattern. Therefore, it is divided into two methods. (A) On the other hand, a thermocompression bonding agent which is conductive only on the bare copper surface (that is, only on the circuit pattern), that is, contains fine particles such as metal or graphite. A layer is formed, and then an insulating thermocompression-bonding agent layer containing no conductive fine particles is deposited on the peripheral surface other than the copper circuit pattern in a separate step.
That is, the thermocompression bonding agent layer is formed in two steps by dividing it into a conductive material and an insulating material.

（ロ）他方では、前記の裸の銅表面と、その周囲の銅の
ない表面とを含む全体の表面上に、いわゆる「導電異方
性」のヒートシール層を形成する。つまり、その組成物
自体を一定条件下に熱圧着した場合に形成される接着層
において、横方向（ｘ方向）と上下縦方向（ｙ方向）と
の導電性の程度を異にし、縦方向（ｙ方向）には一定範
囲の導電性を保って電気的に接続する反面、横方向（ｘ
方向）には導電性が極めて小さく、むしろ相対的に、実
質的に絶縁性を呈するような熱圧着層を塗布被着する。(B) On the other hand, a so-called "conductive anisotropic" heat seal layer is formed on the entire surface including the bare copper surface and the surrounding copper-free surface. That is, in the adhesive layer formed when the composition itself is thermocompression bonded under a certain condition, the horizontal direction (x direction) and the vertical direction (y direction) have different degrees of conductivity, and the vertical direction ( In the y direction), electrical connection is made while maintaining a certain range of conductivity, but in the lateral direction (x
In the direction), a thermocompression-bonding layer having a very small electric conductivity, but rather a relatively substantially insulating property is applied and deposited.

（発明が解決しようとする課題） しかしながら、これらの従来のものには、それぞれ長
所もあるが短所もあった。すなわち、大きな欠点として
は、前記の（イ）の方法では、導電、絶縁、熱圧着の点
では、それぞれ信頼性が得やすく比較的うまくいくが、
工程が長くかかり、熱圧着層形成に２重の手間と材料と
がかかるほか、前提となる導電回路パターンの銅表面を
直に露出させるために、工程の長いエッチングを要し、
使用する強いアルカリ等の薬品類に対する充分な水洗
と、公害対策の煩わしさとがあった。(Problems to be Solved by the Invention) However, each of these conventional devices has advantages and disadvantages. That is, as a major drawback, in the above method (a), in terms of conductivity, insulation, and thermocompression bonding, reliability is easy to obtain and relatively good results are obtained.
The process takes a long time, double labor and material are required for forming the thermocompression bonding layer, and in order to directly expose the copper surface of the underlying conductive circuit pattern, a long process etching is required.
There was sufficient washing with chemicals such as strong alkalis to be used and troublesome pollution countermeasures.

次に、前記の（ロ）の方法では、熱圧着剤層は、
（イ）におけるように２種類を用いる必要がなく１種類
ですますことができて、その点は優れているが、用いる
組成物の内容と使用条件とが難しく限定され、形成され
る層の特性にバラツキが見られ、導通と絶縁とにおける
信頼性及び安定性に問題点が残っている。さらに前述の
（イ）におけるエッチングに関連する大きな欠点は免れ
ない。Next, in the above method (b), the thermocompression bonding agent layer is
It is not necessary to use two types as in (a), but one type can be used, which is excellent, but the content of the composition to be used and the use conditions are difficultly limited, and the characteristics of the layer to be formed There is a problem in reliability and stability in conduction and insulation. Furthermore, the above-mentioned major drawback associated with etching in (a) is inevitable.

（課題を解決するための手段） 本発明は、従来のこのような欠点を解消し、エッチン
グにおいても、熱圧着剤層形成においても、比較的簡略
な製造工程であり、アルカリ等のエッチング薬品の一部
も不用であり、しかも熱圧着剤層の上下縦方向の導通
と、横方向の絶縁との信頼性に優れた縦縞細条形ヒート
シールコネクタ部材の製造法を提供しようとするもので
ある。(Means for Solving the Problem) The present invention eliminates such drawbacks of the related art, and is a relatively simple manufacturing process both in etching and in forming a thermocompression bonding agent layer. It is an object of the present invention to provide a method of manufacturing a striped heat seal connector member having vertical stripes, which is partially unnecessary and has excellent reliability in vertical and vertical conduction of a thermocompression bonding agent layer and horizontal insulation. .

本発明者等は鋭意研究の結果、予め特別に導電性を持
たせたフォトレジストインクを開発し、これにより導電
回路パターン上に光硬化した導電性のフォトレジスト層
を残したまま、その上に、周辺と同じく、比較的薄い熱
圧着剤層を形成することによって、本発明を完成するに
到った。As a result of diligent research, the inventors of the present invention developed a photoresist ink having a special conductivity in advance, thereby leaving a photocured conductive photoresist layer on the conductive circuit pattern and leaving it on the conductive circuit pattern. The present invention has been completed by forming a relatively thin thermocompression-bonding agent layer as in the periphery.

本発明は、その実施例の説明が図面にもみられるよう
に、可撓性絶縁フィルムに銅箔を貼り合せた銅箔フィル
ム又は可撓性絶縁フィルムに銅を蒸着させた銅蒸着フィ
ルムと、 前記銅箔フィルム又は銅蒸着フィルムの銅表面に設け
た所望のパターンの導電性フォトレジスト塗膜と、 前記所望のパターンの導電性フォトレジスト塗膜を有
しない前記銅箔フィルム又は銅蒸着フィルムの露出銅表
面と前記所望のパターンの導電性フォトレジスト塗膜と
の双方の表面上に設けた絶縁性熱圧着層と、 を有することを特徴とする縦縞細条形ヒートシールコネ
クタ部材である。また、本発明は液晶表示管、ECD、太
陽電池等の電子素子の電極部分又はプリント回路基板端
子部分を、対向するプリント回路基板の各端子部分に、
機械的及び電気的にそれぞれ接続するための、所望の長
さ横幅と各導電路間隔幅とを有する縦縞細条形ヒートシ
ールコネクタ部材の製造法において、（ａ）粒度1.0〜5
0μｍの導電性微粉末１〜40重量％を、（ｂ）フォトレ
ジスタとして用いられる感光性のアクリル系ポリマー樹
脂（重合度50,000〜5,000）又は感光性のエポキシ系ポ
リマー樹脂及び（ｃ）アクリルエステルを主成分とする
フォトレジストインク99〜60重量％と混合し、均一に分
散せしめた見掛比重0.9〜2.0、粘度0.1〜1000ポイズの
導電性フォトレジスト塗料を調製する工程（Ａ）と、可
撓性絶縁フィルムに銅箔を貼り合せた銅箔フィルム又は
可撓性絶縁フィルムに銅を蒸着させた銅蒸着フィルムの
銅表面に、前記フォトレジスト導電性塗料を、厚さ５〜
30μｍにコーティングし、20゜〜70℃の温度にて10分〜
12時間乾燥を行なう塗布・乾燥工程（Ｂ）と、該塗布・
乾燥工程（Ｂ）を終えた塗布面に、所望寸法の縦縞細条
形パターンを描いてあるネガフィルムを載置し、紫外線
露光を行ない、パターンの部分を硬化させる紫外線露光
工程（Ｃ）と、該紫外線露光工程（Ｃ）を終えた導電性
フォトレジスト塗膜の硬化されていない部分を弱アルカ
リ水溶液にて洗い流して除去し、30゜〜120℃の温度に
て乾燥させ、硬化させたフォトレジスト塗膜を被着した
所望部分のパターンを形成する工程（Ｄ）と、該工程
（Ｄ）にてフィルムの銅が直ちに露出した部分をすべて
エッチング除去し、その後水洗にてエンチング液を良く
洗い落とし、フィルムを40゜〜100℃の温度で乾燥させ
る工程（Ｅ）と、前記工程（Ａ＋Ｂ＋Ｃ＋Ｄ＋Ｅ）にて
形成され、前記の光硬化させたフォトレジスト層を銅表
面に被着したまま残した所望のパターンとその周囲の残
余の露出したフィルム部分との全体にわたって、見掛比
重0.8〜1.4、粘度150〜5000ポイズの絶縁性熱圧着懸濁
液塗料を用いて、スクリーン印刷にて全面塗布し、加熱
乾燥して熱圧着層を最上層に形成する工程（Ｆ）と、前
記工程（Ａ＋Ｂ＋Ｃ＋Ｄ＋Ｅ＋Ｆ）にて形成され最上層
に熱圧着層を有しその下層に所望の導電回路パターンを
有する銅基板フィルムを、所望の長さ及び幅寸法に切断
する工程（Ｇ）と、の結合（Ａ＋Ｂ＋Ｃ＋Ｄ＋Ｅ＋Ｆ＋
Ｇ）から成る。The present invention, as the description of the examples can be seen in the drawings, a copper foil film obtained by laminating copper foil on a flexible insulating film or a copper foil film on a flexible insulating film, and A conductive photoresist coating film of a desired pattern provided on the copper surface of a copper foil film or a copper vapor deposition film, and an exposed copper of the copper foil film or a copper vapor deposition film having no conductive photoresist coating film of the desired pattern An insulating thermocompression-bonding layer provided on both surfaces of the surface and the conductive photoresist coating film having the desired pattern, and a striped heat seal connector member having vertical stripes. Further, the present invention is a liquid crystal display tube, an ECD, an electrode portion of an electronic element such as a solar cell or a printed circuit board terminal portion, in each terminal portion of the printed circuit board facing,
In a method for producing a vertical striped heat seal connector member having a desired length and width and a width of each conductive path for mechanically and electrically connecting, (a) grain size 1.0 to 5
1 to 40% by weight of conductive fine powder of 0 μm is added to (b) a photosensitive acrylic polymer resin (polymerization degree 50,000 to 5,000) used as a photoresistor or a photosensitive epoxy polymer resin and (c) an acrylic ester. The step (A) of preparing a conductive photoresist paint having an apparent specific gravity of 0.9 to 2.0 and a viscosity of 0.1 to 1000 poise, which is mixed with 99 to 60% by weight of a photoresist ink as a main component and uniformly dispersed, Of the photoresist conductive paint on the copper surface of a copper foil film obtained by laminating a copper foil on a conductive insulating film or a copper film on which a flexible insulating film is vapor-deposited with copper.
Coated to 30μm, at a temperature of 20 ° ~ 70 ° C for 10 minutes ~
The coating / drying step (B) for drying for 12 hours and the coating / drying step
An ultraviolet exposure step (C) in which a negative film on which a vertical striped strip pattern having a desired size is drawn is placed on the coated surface after the drying step (B), and ultraviolet exposure is performed to cure the pattern portion, The uncured portion of the conductive photoresist coating film that has undergone the ultraviolet exposure step (C) is washed away with a weak alkaline aqueous solution to remove it, and dried at a temperature of 30 ° to 120 ° C. to cure the photoresist. In the step (D) of forming a pattern of a desired portion on which a coating film is deposited, and in the step (D), all the portions of the film where copper is immediately exposed are removed by etching, and then the enchanting liquid is thoroughly washed off with water, A step (E) of drying the film at a temperature of 40 ° to 100 ° C. and a step of forming the photo-cured photoresist layer formed in the step (A + B + C + D + E) and left the copper surface deposited on the copper surface. Over the entire desired pattern and the remaining exposed film portion around it, using an insulating thermocompression suspension coating with an apparent specific gravity of 0.8 to 1.4 and a viscosity of 150 to 5000 poise, apply the entire surface by screen printing. A step (F) of forming a thermocompression-bonding layer on the uppermost layer by heating and drying, and a copper substrate having a thermocompression-bonding layer formed on the uppermost layer and having a desired conductive circuit pattern under the layer formed in the step (A + B + C + D + E + F) Bonding (A + B + C + D + E + F +) with the step (G) of cutting the film into desired length and width dimensions.
G).

又、本発明では、（ａ）導電性微粉末が、ニッケルメ
ッキした上にさらに金メッキを施した銅粉末、金メッキ
ニッケル粉末、パラジウム粉末、ハンダ粉末、ニッケル
メッキした上にさらに金メッキを施した樹脂ビーズ粉末
のうちの１種又は２種以上から成り、フォトレジストイ
ンクが、（ｂ）感光性のアクリル系又はエポキシ系ポリ
マー樹脂25〜15重量％、（ｃ）アクリルエステル10〜１
重量％、（ｄ）エチルセロソルブアセテート45〜40重量
％、（ｅ）トルエン25〜20重量％、（ｆ）キシレン５〜
１重量％、及び（ｇ）メチルエチルケトン５〜１重量％
から成り、絶縁性熱圧着懸濁液塗料が、（ｉ）酸化チタ
ン、タルク、水和アルミナ及びコロイダルシリカの１種
又は２種以上から成る粉末５〜30重量％と、（ii）クロ
ロプレン合成ゴム、ポリエステル樹脂、エチレン−酢酸
ビニル共重合体樹脂及びポリエチルメタクリレート樹脂
の１種又は２種以上から成る熱可塑性樹脂結合剤20〜60
重量％、（iii）イソホロン、ジアセトンアルコール、
メチルイソブチルケトン、キシレン、トルエン及びジエ
チルカルビトールの１種又は２種以上から成る有機溶剤
10〜70重量％と、（iv）テルペン系樹脂及び脂肪族炭化
水素系樹脂の１種又は２種から成る粘着付与剤0.1〜20
重量％とを混合（ｉ＋ii＋iii＋iv）溶解し、均一に分
散せしめたものである。In the present invention, (a) the conductive fine powder is nickel-plated and then gold-plated copper powder, gold-plated nickel powder, palladium powder, solder powder, nickel-plated and then gold-plated resin beads. The photoresist ink is composed of one or more of powders, and the photoresist ink is (b) 25 to 15% by weight of a photosensitive acrylic or epoxy polymer resin, (c) acrylic ester 10 to 1
Wt%, (d) ethyl cellosolve acetate 45-40 wt%, (e) toluene 25-20 wt%, (f) xylene 5-
1% by weight, and (g) methyl ethyl ketone 5-1% by weight
The insulating thermocompression suspension coating composition comprises (i) 5 to 30% by weight of a powder comprising one or more of titanium oxide, talc, hydrated alumina and colloidal silica, and (ii) chloroprene synthetic rubber. , 60 to 60, a thermoplastic resin binder comprising one or more of a polyester resin, an ethylene-vinyl acetate copolymer resin and a polyethylmethacrylate resin
% By weight, (iii) isophorone, diacetone alcohol,
Organic solvent consisting of one or more of methyl isobutyl ketone, xylene, toluene and diethyl carbitol
Tackifier 0.1 to 20 consisting of 10 to 70% by weight and (iv) one or two of terpene resin and aliphatic hydrocarbon resin
% (Wt%) is mixed (i + ii + iii + iv), dissolved and uniformly dispersed.

なお、前記のニッケルメッキした上にさらに金メッキ
を施した樹脂ビーズ粉末を得るには、次のごとき製造工
程を経る。In addition, in order to obtain the above-mentioned nickel-plated resin bead powder further plated with gold, the following manufacturing process is performed.

粒度１〜50μｍの樹脂ビーズ粉末（フェノールホルム
アルデヒド系樹脂、スチレン樹脂、スチレンの共重合体
樹脂、例えば、ユニチカ社製のフェノール樹脂粉末、花
王のスチレン系樹脂粉末）の表面を塩化パラジウム処理
（ニッケルメッキを施す為の感受性付与）を行い、その
後良く水洗し、そして樹脂ビーズ粉末の表面を活性化す
る。Palladium chloride treatment (nickel plating) on the surface of resin bead powder having a particle size of 1 to 50 μm (phenol formaldehyde resin, styrene resin, styrene copolymer resin, for example, phenol resin powder manufactured by Unitika Ltd., Kao styrene resin powder) (Providing sensitivity for treatment), followed by thorough washing with water and activation of the resin bead powder surface.

次に、この表面活性化した樹脂ビーズ粉末を、液温50
〜65℃に保った無電解ニッケルメッキ液（硫酸ニッケル
20g/、次亜リン酸ナトリウム10g/、乳酸3g/、ク
エン酸ナトリウム5g/、酢酸ナトリウム5g/）中に入
れ、メッキ膜厚を均一にする為にプロペラかくはん、流
動かくはん、エアーかくはんなどを行い、５分〜60分間
無電解ニッケルメッキを行いメッキ膜厚を、0.5〜５μ
ｍにする。Next, the surface-activated resin bead powder was heated at a liquid temperature of 50
Electroless nickel plating solution (nickel sulfate
20g /, sodium hypophosphite 10g /, lactic acid 3g /, sodium citrate 5g /, sodium acetate 5g /) and propeller agitation, fluid agitation, air agitation, etc. for uniform plating film thickness. Electroless nickel plating for 5 to 60 minutes, plating thickness 0.5 to 5μ
to m.

そして、無電解ニッケルメッキを行った後、良く水洗
し、ニッケルメッキ液を充分に洗い落す。Then, after performing electroless nickel plating, it is thoroughly washed with water to thoroughly wash off the nickel plating solution.

このように樹脂ビーズ粉末に無電解ニッケルメッキを
施した後、この粉末を液温90〜95℃に保った無電解金メ
ッキ液（金シアン化カリウム2g/、塩化アンモニウム7
5g/、クエン酸ナトリウム50g/、次亜リン酸ナトリ
ウム10g/）中に入れ、メッキ膜厚を均一にする為にプ
ロペラかくはん、流動かくはん、エアーかくはん等のか
くはんを行い、１分〜60分間無電解金メッキを行いメッ
キ膜厚0.1〜３μｍにする。After applying electroless nickel plating to the resin bead powder in this way, this powder was kept at a liquid temperature of 90 to 95 ° C with an electroless gold plating solution (potassium cyanide 2 g /, ammonium chloride 7 g
5g /, sodium citrate 50g /, sodium hypophosphite 10g /), and perform stirring such as propeller agitation, fluid agitation, air agitation, etc. to make the plating film thickness uniform. Electrolytic gold plating is performed to a plating film thickness of 0.1 to 3 μm.

無電解金メッキ後、良く水洗湯洗を行い、その後水分
を充分切って50℃〜100℃の温度にて60〜３時間ニッケ
ル、金メッキを施した樹脂ビーズ粉末をかくはんしなが
ら乾燥を行う。After electroless gold plating, it is thoroughly rinsed with water and washed with water, then sufficiently dried to dry at 60 ° C to 100 ° C for 60 to 3 hours while stirring the nickel and gold plated resin bead powder.

このようにしてニッケル、金メッキ樹脂ビーズ粉末が
でき上る。In this way, nickel and gold plated resin bead powder is completed.

樹脂ビーズ粉末にニッケル金メッキを施すことにより
導電性微粉末が製造できる。Conductive fine powder can be produced by plating the resin bead powder with nickel gold.

本発明によって比較的簡単に得られるヒートシールコ
ネクタ部材は、広く電気電子機器、時計、カメラ、ワー
ドプロセッサー等に用いることができる。The heat-seal connector member obtained relatively easily according to the present invention can be widely used in electric and electronic devices, watches, cameras, word processors and the like.

前記（ｃ）アクリルエステルは光重合開始剤として、
又溶剤、稀釈剤として働くが、通常、メチル、エチル又
はプロピルエステルが好適に用いられる。The (c) acrylic ester is a photopolymerization initiator,
Further, it works as a solvent and a diluent, but normally, methyl, ethyl or propyl ester is preferably used.

なお、前記のフォトレジストインクとしては、市販
の、例えば、東京応化工業株式会社製 商品名:PNER−
Ｎ−HC 40（銘柄）を利用し、使用することも可能であ
る。The photoresist ink is commercially available, for example, Tokyo Ohka Kogyo Co., Ltd. product name: PNER-
It is also possible to use and use N-HC 40 (brand).

また、工程（Ａ）では、湿式のボールミルによる回転
混合を利用することができる。Further, in the step (A), rotary mixing with a wet ball mill can be used.

又、可撓性絶縁フィルムとしては、ポリエステル、ポ
リイミド、ポリイミドアミド、ナイロン、アラミド樹脂
フィルム等が用いられる。特にこれらに限定されない。As the flexible insulating film, polyester, polyimide, polyimide amide, nylon, aramid resin film or the like is used. It is not particularly limited to these.

以下本発明における数値限定の理由を簡単に述べる。 The reasons for limiting the numerical values in the present invention will be briefly described below.

前記の（ａ）粒度が1.0μｍ未満のものは普通一般に
市場で入手が困難であり、50μｍを越えるものは、均質
な塗膜を得ることが困難となり、導電性のバラツキも大
きく不可である。（ａ）導電性微粉末が１重量％未満で
は導電性が不足し、逆に40重量％を越えると、露光して
光硬化を起させるのに悪影響を及ぼすおそれが生じるの
で不可である。Generally, if the particle size of (a) is less than 1.0 μm, it is generally difficult to obtain in the market, and if it exceeds 50 μm, it becomes difficult to obtain a uniform coating film, and the variation of conductivity is large and impossible. If the conductive fine powder (a) is less than 1% by weight, the conductivity is insufficient, and if it exceeds 40% by weight, it may adversely affect the photocuring by exposure.

（ｂ）感光性のポリマー樹脂が15重量％未満では、感光
性の機能が微弱になりすぎ不可であり、逆に25重量％を
越えてもそれ以上実際効果が少なく経済的見地からもそ
の必要性を欠く。(B) When the content of the photosensitive polymer resin is less than 15% by weight, the photosensitive function cannot be too weak. On the contrary, when it exceeds 25% by weight, it is practically less effective and necessary from the economical point of view. Lack sex.

（ｃ）アクリルエステル（光重合開始剤）が１重量％未
満では、光重合開始の効力が微弱になるほか、前記感光
性ポリマー樹脂の溶解分散性を悪くし、10重量％を越え
ると、その効力が飽和し、特にその必要性が少なくな
る。If (c) the acrylic ester (photopolymerization initiator) is less than 1% by weight, the effect of initiating the photopolymerization becomes weak, and the dissolution and dispersibility of the photosensitive polymer resin is deteriorated. The efficacy is saturated, especially the need for it is reduced.

（ｄ）エチルセロソルブアセテートが45重量％を越える
と、溶解性、稀釈性が増し、相対的に樹脂濃度が下が
り、逆に40重量％未満では、相対的に樹脂濃度が上が
り、見掛比重や粘度が上がってかえって印刷性からもよ
くない。(D) When the content of ethyl cellosolve acetate exceeds 45% by weight, the solubility and dilutability increase, and the resin concentration relatively decreases. On the contrary, when it is less than 40% by weight, the resin concentration relatively increases, and the apparent specific gravity and The increase in viscosity is not good for printability.

（ｅ）トルエンが25重量％を越えると、稀釈度が昇って
樹脂濃度が下がり、20重量％未満では、稀釈度が下が
り、樹脂濃度が相対的に上がり、塗料の印刷性からみて
も、前記の範囲がよい。(E) When the amount of toluene exceeds 25% by weight, the degree of dilution increases and the resin concentration decreases, and when it is less than 20% by weight, the degree of dilution decreases and the resin concentration relatively increases. The range is good.

（ｆ）キシレンが、５重量％を越えると稀釈度が昇って
樹脂濃度が下がり、１重量％未満では稀釈度が下がって
樹脂濃度が相対的に上がる方向に行き、塗料の印刷性か
らみても、前記の範囲が好適である。(F) When xylene exceeds 5% by weight, the degree of dilution increases and the resin concentration decreases, and when it is less than 1% by weight, the degree of dilution decreases and the resin concentration relatively increases. The above range is preferable.

（ｇ）メチルエチルケトンが、５重量％を越えると稀釈
度が昇って樹脂濃度が下がり、１重量％未満では稀釈度
が下がり樹脂濃度が相対的に上がる方向に行き、塗料の
印刷性からみても、前記の範囲が好適である。(G) When methyl ethyl ketone exceeds 5% by weight, the degree of dilution increases and the resin concentration decreases, and when it is less than 1% by weight, the dilution degree decreases and the resin concentration relatively increases. The above range is preferred.

フォトレジストインク（ｂ＋ｃ＋ｄ＋ｅ＋ｆ＋ｇ）と
して、99重量％を越えると、相対的に（ａ）導電性微粉
末が１重量％を割り、導電性が不足し不可である。逆
に、60重量％未満では、相対的に（ａ）導電性微粉末が
40重量％を越え、露光して光硬化を越させるのに悪影響
を及ぼすおそれが生じるので不可である。If the content of the photoresist ink (b + c + d + e + f + g) exceeds 99% by weight, the conductive fine powder (a) is relatively less than 1% by weight, and the conductivity is insufficient, which is not possible. On the other hand, if it is less than 60% by weight, (a) the conductive fine powder is relatively
It is not possible because it may exceed 40% by weight and adversely affect exposure to light curing.

（実施例） 以下本発明をさらに実施例について説明する。(Example) Hereinafter, the present invention will be described with reference to examples.

実施例１ （ｂ）フォトレジスト用の感光性アクリルポリマー20
重量％、（ｃ）アクリルエチルエステル５重量％、
（ｄ）エチルセロソルブアセテート45重量％、（ｅ）ト
ルエン20重量％、（ｆ）キシレン５重量％、（ｇ）メチ
ルエチルケトン５重量％を配合調製したインク原液、す
なわちフォトレジストインク80重量％に対し、（ａ）粒
度20〜40μｍの金メッキニッケル粉末20重量％を添加混
合し均一に分散せしめた見掛比重1.0、粘度30センチポ
イズのフォトレジスト導電性塗料を調製する（工程
Ａ）。Example 1 (b) Photosensitive acrylic polymer 20 for photoresist
% By weight, (c) 5% by weight of acrylic ethyl ester,
(D) Ethyl cellosolve acetate 45% by weight, (e) Toluene 20% by weight, (f) Xylene 5% by weight, (g) Methylethylketone 5% by weight. (A) 20% by weight of gold-plated nickel powder having a particle size of 20 to 40 μm is added and mixed to uniformly disperse a photoresist conductive paint having an apparent specific gravity of 1.0 and a viscosity of 30 centipoise (step A).

次に、厚さ25μｍのポリエステルフィルムに厚さ15μ
ｍの圧延銅箔を貼り合せた銅箔フィルムの銅面上に、前
記のフォトレジスト導電性塗料を厚さ20μｍにコーティ
ングし、70℃の温度にて２時間乾燥を行う（工程Ｂ）。Next, apply a thickness of 15μ to a 25μm thick polyester film.
The above-mentioned photoresist conductive paint is coated to a thickness of 20 μm on the copper surface of the copper foil film to which the rolled copper foil of m is attached, and dried at a temperature of 70 ° C. for 2 hours (step B).

乾燥を終えた銅箔フィルムの塗布面に細条の巾が0.25
mmで細条間の巾が0.25mmのパターンのネガを描いてある
ネガフィルムを載置し、真空密着させ紫外線露光（45mJ
/cm2）し、パターン部分を光硬化させる（工程Ｃ）。The width of the strip is 0.25 on the coated surface of the dried copper foil film.
Place a negative film on which a negative having a width of 0.25 mm and a width between strips of 0.25 mm is drawn, place it in vacuum, and expose it to ultraviolet light (45 mJ
/ cm 2 ) and the pattern portion is photo-cured (step C).

紫外線露光工程（Ｃ）を終えた銅箔フィルム上のフォ
トレジスト導電性塗料の光硬化されていない部分（パタ
ーン以外の部分）を弱アルカリ水溶液にて現像除去し、
現像液を良く水洗し、その後エアーガンにて銅上の水を
吹き落とし、60℃の温度にて60分間乾燥する（工程
Ｄ）。A portion of the photoresist conductive coating on the copper foil film that has undergone the ultraviolet exposure step (C) that has not been photocured (a portion other than the pattern) is developed and removed with a weak alkaline aqueous solution,
The developing solution is washed well with water, then the water on the copper is blown off with an air gun, and dried at a temperature of 60 ° C. for 60 minutes (step D).

この銅箔フィルムの銅箔が直接露出した部分をすべて
エッチング除去し、その後水洗にてエッチング液を良く
洗い去り、100℃の温風中で２分間乾燥させる（工程
Ｅ）。All the exposed portions of the copper foil of the copper foil film are removed by etching, then the etching solution is thoroughly washed off with water and dried in warm air at 100 ° C. for 2 minutes (step E).

前記の光硬化させたフォトレジスト層を表面に被着し
たまま残した所望のパターンと、その周囲の残余の露出
したフィルム部分との全体にわたって絶縁性熱圧着懸濁
液塗料を塗布する。この塗料の組成は、酸化チタン10重
量％、クロロプレン合成ゴム45重量％、キシレン25重量
％、メチルイソブチルケトン10重量％、イソホロン7.5
重量％、テルペン系樹脂2.5重量％から成り、見掛け比
重1.0、粘度500ポイズである。加熱乾燥して熱圧着層を
形成する（工程Ｆ）。次に、こうして形成された基板フ
ィルムを所望の長さ、及び幅寸法に切断する（工程
Ｇ）。こうして縦縞細条形のヒートシールコネクタ部材
ができ上る。使用に当っては、得られた基板フィルムの
片面の一端の熱圧着層を、例えば、液晶表示管の電極に
接触させ、他端の熱圧着層をプリント回路基板端子部分
に接触させ、前記基板フィルムの片面の両端部を加熱温
度180℃、圧力30kg/cm2で熱圧着して、それぞれ一体に
する。An insulative thermocompression suspension paint is applied over the desired pattern, leaving the photo-cured photoresist layer deposited on the surface, and the remaining exposed film portion around it. The composition of this paint is titanium oxide 10% by weight, chloroprene synthetic rubber 45% by weight, xylene 25% by weight, methyl isobutyl ketone 10% by weight, isophorone 7.5%.
It is composed of 2.5% by weight of terpene resin and has an apparent specific gravity of 1.0 and a viscosity of 500 poise. It is dried by heating to form a thermocompression bonding layer (step F). Next, the substrate film thus formed is cut into desired length and width dimensions (step G). Thus, the striped heat seal connector member is completed. In use, the thermocompression-bonded layer on one end of the obtained substrate film is brought into contact with, for example, an electrode of a liquid crystal display tube, and the thermocompression-bonded layer at the other end is brought into contact with a printed circuit board terminal portion. Both ends of one side of the film are thermocompression bonded at a heating temperature of 180 ° C. and a pressure of 30 kg / cm 2 , and are integrated together.

実用に際しても、電気的並びに機械的に満足すべき結
果が得られ、本発明の顕著な効果が認められた。In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

なお、この場合に、前記の感光性アクリル系ポリマー
樹脂の代わりに、感光性エポキシ系ポリマー樹脂を用い
てみても、略々同様の結果が得られた。In this case, substantially the same result was obtained by using a photosensitive epoxy-based polymer resin instead of the above-mentioned photosensitive acrylic-based polymer resin.

実施例２ 市販のネガタイプフォトレジストインク（東京応化工
業株式会社製 商品名:PMER−Ｎ−HC 40（銘柄）（アク
リル系ポリマー主体）を用い、このもの90重量％に対し
て、（ａ）粒度40〜50μｍのニッケルメッキした上にさ
らに金メッキを施こした銅粉末を10重量％添加混合し、
均一に分散せしめた見掛比重1.0、粘度20センチポイズ
のフォトレジスト導電性塗料を調製した。Example 2 A commercially available negative type photoresist ink (manufactured by Tokyo Ohka Kogyo Co., Ltd., trade name: PMER-N-HC 40 (brand) (mainly acrylic polymer) was used, and 90% by weight of this product, (a) particle size Add 10% by weight of copper powder with 40-50 μm nickel plating and then gold plating, mix,
A photoresist conductive paint having an apparent specific gravity of 1.0 and a viscosity of 20 centipoise uniformly dispersed was prepared.

それ以下の工程は、実施例１と略々同様な方法にて、
縦縞細条形のヒートシールコネクタ部材を得る。ネガフ
ィルムのパターンは細条の巾が0.10mmで細条間の巾が0.
10mmであった。Subsequent steps are substantially the same as in Example 1,
A striped heat seal connector member is obtained. The negative film pattern has a strip width of 0.10 mm and a strip width of 0.
It was 10 mm.

このものは実用に際しても、電気的並びに機械的接続
において、実施例１と略々同様な満足すべき結果が得ら
れ、本発明の顕著な効果が認められた。In the case of practical use, the same satisfactory results as in Example 1 were obtained in electrical and mechanical connection, and the remarkable effect of the present invention was confirmed.

実施例３ （ｂ）フォトレジスト用の光硬化型のアクリル系ポリ
マー樹脂25重量％、（ｃ）アクリルエステル光重合開始
剤10重量％、（ｄ）エチルセロソルブアセテート40重量
％、（ｅ）トルエン20重量％、（ｆ）キシレン３重量
％、（ｇ）メチルエチルケトン２重量％を配合して調製
したインク原液、すなわちフォトレジストインク（アク
リル系ポリマー主体）96重量％に対して、（ａ）粒度40
〜50μｍのニッケルメッキした上にさらに金メッキを施
こした樹脂ビーズ粉末４重量％を添加混合し、均一に分
散せしめた見掛け比重0.9、粘度15センチポイズのフォ
トレジスト導電性塗料を調製した（工程Ａ）。Example 3 (b) 25% by weight of photocurable acrylic polymer resin for photoresist, (c) 10% by weight of acrylic ester photopolymerization initiator, (d) 40% by weight of ethyl cellosolve acetate, (e) 20 of toluene Wt%, (f) xylene 3 wt%, and (g) methyl ethyl ketone 2 wt% were prepared as an ink stock solution, that is, 96 wt% of a photoresist ink (mainly acrylic polymer), (a) particle size 40
4% by weight of resin bead powder, which was nickel-plated to 50 μm and further gold-plated, was added and mixed to prepare a photoresist conductive paint having an apparent specific gravity of 0.9 and a viscosity of 15 centipoise that was uniformly dispersed (step A). .

次に、厚さ25μｍのポリエステルフィルムに厚さ15μ
ｍの圧延銅箔を貼り合せた銅箔フィルムの銅面上に、前
記のフォトレジスト導電性塗料を厚さ15μｍにコーティ
ングし、60℃の温度にて10時間乾燥を行う（工程Ｂ）。Next, apply a thickness of 15μ to a 25μm thick polyester film.
The above-mentioned photoresist conductive paint is coated on the copper surface of the copper foil film to which the m rolled copper foil is pasted to a thickness of 15 μm, and dried at a temperature of 60 ° C. for 10 hours (step B).

この塗布面に細条の巾が0.05mmで細条間距離が0.05mm
のパターンのネガを描いてあるネガフィルムを載置し、
真空密着させ紫外線露光（100mJ/cm2）し、パターン部
分を光硬化させる（工程Ｃ）。The width of the strips is 0.05mm and the distance between the strips is 0.05mm.
Place the negative film on which the negative of the pattern is drawn,
A vacuum contact is performed and ultraviolet exposure (100 mJ / cm 2 ) is performed, and the pattern portion is photocured (step C).

この銅箔フィルム上の導電性塗膜の光硬化されていな
い部分（パターン以外の部分）を弱アルカリ水溶液にて
現像除去し、現像液をよく水洗し、その後エアーガンに
て銅上の水を吹き落し、70℃の温度にて30分間乾燥する
（工程Ｄ）。The non-photo-cured part of the conductive coating on this copper foil film (the part other than the pattern) is developed and removed with a weak alkaline aqueous solution, the developer is washed well with water, and then the water on the copper is blown with an air gun. Drop and dry for 30 minutes at a temperature of 70 ° C (step D).

この銅箔フィルムの銅が直接表面に露光した部分をす
べてエッチング除去し、その後水洗にてエッチング液を
充分に洗い去り、40℃の温風中で15分間乾燥させる（工
程Ｅ）。All the portions of the copper foil film where the copper is directly exposed on the surface are removed by etching, and then the etchant is sufficiently washed off with water and dried in warm air at 40 ° C for 15 minutes (step E).

前記の光硬化させたフォトレジスト層を表面に被着し
たまま残した所望のパターンと、その周囲の残余の露出
したフィルム部分との全体にわたって、絶縁性熱圧着懸
濁液塗料を塗布し、熱圧着層を形成する。ただし、この
塗料の組成は、水和アルミナ20重量％、エチレン−酢酸
ビニル共重合体樹脂40重量％、トルエン10重量％、メチ
ルインブチルケトン５重量％、イソホロン10重量％、テ
ルペン系樹脂15重量％であり、見掛比重1.3、粘度1000
ボイズである（工程Ｆ）。An insulating thermocompression-bonding suspension paint is applied over the entire desired pattern left on the surface where the photo-cured photoresist layer is applied and the remaining exposed film portion, A pressure-bonding layer is formed. However, the composition of this paint is 20% by weight of hydrated alumina, 40% by weight of ethylene-vinyl acetate copolymer resin, 10% by weight of toluene, 5% by weight of methyl inbutyl ketone, 10% by weight of isophorone, 15% by weight of terpene resin. %, Apparent specific gravity 1.3, viscosity 1000
It is a voise (process F).

次に、こうして熱圧着層を形成された基板フィルムを
所望の長さ、及び幅寸法に切断する（工程Ｇ）（図面参
照）。こうして縦縞細条形のヒートシールコネクタ部材
ができ上る。Next, the substrate film thus formed with the thermocompression bonding layer is cut into a desired length and width (step G) (see the drawing). Thus, the striped heat seal connector member is completed.

かくて得られたヒートシールコネクタ部材の使用に当
っては、基板フィルムの片面の一端の熱圧着層を、例え
ば、液晶表示管の電極に接触させ、他端の熱圧着層をプ
リント回路基板端子部分に接触させ、前記基板フィルム
の片面の両端部を加熱温度150℃、圧力20kg/cm2で、熱
圧着して、それぞれ一体にする。こうして縦縞細条形の
ヒートシールコネクタ部材を使用すると、電気的並びに
機械的接続に関して、コネクタとして実用においても充
分に満足すべき結果が得られ、本発明の顕著な効果が認
められた。In using the heat-sealed connector member thus obtained, the thermocompression bonding layer at one end of the substrate film is brought into contact with, for example, the electrode of the liquid crystal display tube, and the thermocompression bonding layer at the other end is printed circuit board terminal. The substrate film is brought into contact with each other, and both ends of one surface of the substrate film are thermocompression bonded at a heating temperature of 150 ° C. and a pressure of 20 kg / cm 2 to integrate them. Thus, when the striped heat seal connector member was used, satisfactory results were obtained in practical use as a connector in terms of electrical and mechanical connection, and the remarkable effect of the present invention was recognized.

なお、この場合にも、前記の感光性アクリル系ポリマ
ー樹脂の代わりに、感光性エポキシ系ポリマー樹脂を用
いても、略々同様の結果が得られた。Also in this case, substantially the same result was obtained even when a photosensitive epoxy polymer resin was used instead of the above photosensitive acrylic polymer resin.

実施例４ （ｂ）フォトレジスト用の光硬化型の感光性のアクリ
ル系ポリマー樹脂15重量％、（ｃ）アクリルエステル光
重合開始剤２重量％、（ｄ）エチルセロソルブアセテー
ト45重量％、（ｅ）トルエン25重量％、（ｆ）キシレン
７重量％、（ｇ）メチルエチルケトン６重量％を配合し
て調製したフォトレジストインク（アクリル系ポリマー
主体）55重量％に対して、（ａ）粒度40〜50μｍの金メ
ッキニッケル粉末45重量％を添加混合し、均一に分散せ
しめた見掛比重1.8、粘度600センチポイズのフォトエッ
チングレジスト導電性塗料を調製した（工程Ａ）。Example 4 (b) 15% by weight of a photocurable photosensitive acrylic polymer resin for photoresist, (c) 2% by weight of an acrylic ester photopolymerization initiator, (d) 45% by weight of ethyl cellosolve acetate, (e) ) To 55% by weight of a photoresist ink (mainly acrylic polymer) prepared by mixing 25% by weight of toluene, 7% by weight of xylene, and 6% by weight of (g) methyl ethyl ketone, (a) particle size of 40 to 50 μm 45% by weight of the gold-plated nickel powder was added and mixed to prepare a photoetching resist conductive paint having an apparent specific gravity of 1.8 and a viscosity of 600 centipoise that was uniformly dispersed (step A).

次に、厚さ25μｍのポリエステルフィルムに15μｍの
銅箔層を被着させた銅箔フィルムの銅面上に、前記のフ
ォトレジスト導電性塗料を厚さ30μｍにコーティング
し、70℃の温度にて２時間乾燥を行う（工程Ｂ）。Next, on the copper surface of the copper foil film in which a copper foil layer of 15 μm is adhered to a polyester film of 25 μm in thickness, the photoresist conductive paint described above is coated to a thickness of 30 μm, and at a temperature of 70 ° C. Dry for 2 hours (step B).

この塗布面に細条の巾が0.15mmで細条間の巾が0.15mm
のパターンのネガを描いてあるネガフィルムを載置し、
真空密着させ紫外線露光（200mJ/cm2）し、パターン部
分を光硬化させる（工程Ｃ）。The width of the strips is 0.15 mm and the width between the strips is 0.15 mm.
Place the negative film on which the negative of the pattern is drawn,
A vacuum contact is performed and ultraviolet exposure (200 mJ / cm 2 ) is performed, and the pattern portion is photocured (step C).

この銅箔フィルム上の導電性塗膜の光硬化されていな
い部分（パターン以外の部分）を弱アルカリ水溶液にて
現像除去し、現像液をよく水洗し、その後エアーガンに
て銅上の水を吹き落し、40℃の温度にて３時間乾燥する
（工程Ｄ）。The non-photo-cured part of the conductive coating on this copper foil film (the part other than the pattern) is developed and removed with a weak alkaline aqueous solution, the developer is washed well with water, and then the water on the copper is blown with an air gun. Drop and dry at a temperature of 40 ° C. for 3 hours (step D).

この銅箔を被着したフィルムの銅が直接表面に露光し
た部分をすべてエッチング除去し、その後水洗にてエッ
チング液を充分に洗い去り、50℃の温風中で10分間乾燥
させる（工程Ｅ）。This copper foil-deposited film is entirely etched away at the area where the copper is directly exposed on the surface, then the water is washed away to sufficiently remove the etching solution, and the film is dried in warm air at 50 ° C for 10 minutes (step E). .

前記の光硬化させたフォトレジスト層を表面に被着し
たまま残した所望のパターンと、その周囲の残余の露出
したフィルム部分との全体にわたって、絶縁性熱圧着懸
濁液塗料を塗布し、熱圧着層を形成する。ただし、この
塗料の組成は、タルク50重量％、ポリエチルメタクリレ
ート樹脂60重量％、ジアセトンアルコール10重量％、ト
ルエン10重量％、メチルイソブチルケトン15重量％であ
り、見掛比重1.4、粘度500ボイズである（工程Ｆ）。An insulating thermocompression-bonding suspension paint is applied over the entire desired pattern left on the surface where the photo-cured photoresist layer is applied and the remaining exposed film portion, A pressure-bonding layer is formed. However, the composition of this paint is talc 50% by weight, polyethylmethacrylate resin 60% by weight, diacetone alcohol 10% by weight, toluene 10% by weight, methyl isobutyl ketone 15% by weight, apparent specific gravity 1.4, viscosity 500 voise (Step F).

次に、こうして形成された基板フィルムを所望の長
さ、及び幅寸法に切断する（工程Ｇ）。Next, the substrate film thus formed is cut into desired length and width dimensions (step G).

こうして縦縞細条形のヒートシールコネクタ部材がで
き上る。使用に当っては、得られた基板フィルムの片面
の一端の熱圧着層を、例えば、液晶表示管の電極に接触
させ、他端の熱圧着層をプリント回路基板端子部分に接
触させ、前記基板フィルムの片面の両端部を加熱温度15
0℃、圧力40kg/cm2で熱圧着して、それぞれ一体にす
る。Thus, the striped heat seal connector member is completed. In use, the thermocompression-bonded layer on one end of the obtained substrate film is brought into contact with, for example, an electrode of a liquid crystal display tube, and the thermocompression-bonded layer at the other end is brought into contact with a printed circuit board terminal portion. Heat both ends of one side of the film 15
Thermocompression bonding at 0 ° C and pressure of 40kg / cm 2 to integrate them.

実用に際しても、電気的並びに機械的に満足すべき結
果が得られ、本発明の顕著な効果が認められた。In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

なお、この場合に、感光性アクリル系ポリマー樹脂の
代わりに、感光性エポキシ系ポリマー樹脂を用いてみて
も、略々同様の結果が得られた。In this case, substantially the same result was obtained even when a photosensitive epoxy-based polymer resin was used instead of the photosensitive acrylic-based polymer resin.

実施例５ （ｂ）フォトレジスト用の感光性アクリルポリマー20
重量％、（ｃ）アクリルエチルエステル５重量％、
（ｄ）エチルセロソルブアセテート45重量％、（ｅ）ト
ルエン20重量％、（ｆ）キシレン５重量％、（ｇ）メチ
ルエチルケトン５重量％を配合調製したインク原液、す
なわちフォトレジストインク80重量％に対し、（ａ）粒
度20〜40μｍの金メッキニッケル粉末20重量％を添加混
合し均一に分散せしめた見掛比重1.0、粘度30センチポ
イズのフォトレジスト導電性塗料を調製する（工程
Ａ）。Example 5 (b) Photosensitive acrylic polymer 20 for photoresist
% By weight, (c) 5% by weight of acrylic ethyl ester,
(D) Ethyl cellosolve acetate 45% by weight, (e) Toluene 20% by weight, (f) Xylene 5% by weight, (g) Methylethylketone 5% by weight. (A) 20% by weight of gold-plated nickel powder having a particle size of 20 to 40 μm is added and mixed to uniformly disperse a photoresist conductive paint having an apparent specific gravity of 1.0 and a viscosity of 30 centipoise (step A).

次に、厚さ25μｍのポリエステルフィルムに、厚さ15
μｍの圧延銅箔を貼り合せた銅箔フィルムの銅面上に、
前記のフォトレジスト導電性塗料を厚さ20μｍにコーテ
ィングし、70℃の温度にて２時間乾燥を行う（工程
Ｂ）。Next, apply a thickness of 15 μm to a 25 μm thick polyester film.
On the copper surface of the copper foil film with the rolled copper foil of μm attached,
The photoresist conductive paint is coated to a thickness of 20 μm and dried at 70 ° C. for 2 hours (step B).

乾燥を終えた銅箔フィルムの塗布面に所望のパターン
のネガを描いてあるネガフィルムを置き、真空密着させ
紫外線露光（45mJ/cm2）し、パターン部分を光硬化させ
る（工程Ｃ）。A negative film on which a negative of a desired pattern is drawn is placed on the coated surface of the dried copper foil film, vacuum-contacted, and exposed to ultraviolet rays (45 mJ / cm 2 ) to photo-cure the pattern portion (step C).

紫外線露光工程（Ｃ）を終えた銅箔フィルム上のフォ
トレジスト導電性塗料の光硬化されていない部分（パタ
ーン以外の部分）を弱アルカリ水溶液にて現像除去し、
現像液を良く水洗し、その後エアーガンにて銅上の水を
吹き落とし、60℃の温度にて60分間乾燥する（工程
Ｄ）。A portion of the photoresist conductive coating on the copper foil film that has undergone the ultraviolet exposure step (C) that has not been photocured (a portion other than the pattern) is developed and removed with a weak alkaline aqueous solution,
The developing solution is washed well with water, then the water on the copper is blown off with an air gun, and dried at a temperature of 60 ° C. for 60 minutes (step D).

この銅箔フィルムの銅が直接露出した部分をすべてエ
ッチング除去し、その後水洗にてエッチング液を良く洗
い去り、100℃の温度で２分間乾燥させる（工程Ｅ）。All the portions of the copper foil film where the copper is directly exposed are removed by etching, then the etching solution is thoroughly washed off with water and dried at a temperature of 100 ° C. for 2 minutes (step E).

前記の光硬化させたフォトレジスト層を表面に被着し
たまま残した所望のパターンと、その周囲の残余の露出
したフィルム部分との全体にわたって、絶縁性熱圧着懸
濁液塗料を塗布する。この塗料の組成は、酸化チタン10
重量％、クロロプレン合成ゴム45重量％、キシレン25重
量％、メチルイソブチルケトン10重量％、イソホロン7.
5重量％、テルペン系樹脂2.5重量％から成る。加熱乾燥
して熱圧着層を形成する。（工程Ｆ）。Insulating thermocompression suspension coating is applied over the desired pattern, leaving the photocured photoresist layer deposited on the surface, and the remaining exposed film portion around it. The composition of this paint is titanium oxide 10
% By weight, 45% by weight chloroprene synthetic rubber, 25% by weight xylene, 10% by weight methyl isobutyl ketone, isophorone 7.
Consists of 5% by weight and 2.5% by weight of terpene resin. It is heated and dried to form a thermocompression bonding layer. (Step F).

次に、こうして形成された基板フィルムを所望の長
さ、及び幅寸法に切断する（工程Ｇ）。Next, the substrate film thus formed is cut into desired length and width dimensions (step G).

こうして縦縞細条形のヒートシールコネクター部材が
でき上る。かくて製造したヒートシールコネクター部材
の使用に当っては、得られた基板フィルムの片面の一端
の熱圧着層を、例えば、液晶表示管の電極に接触させ、
他端の熱圧着層をプリント回路基板端子部分に接触さ
せ、前記基板フィルムの片面の両端部を加熱温度180
℃、圧力30kg/cm2で熱圧着して、それぞれ一体にする。Thus, a striped heat seal connector member is completed. In using the heat-sealed connector member thus produced, the thermocompression bonding layer at one end of the obtained substrate film is contacted with, for example, an electrode of a liquid crystal display tube,
The thermocompression bonding layer at the other end is brought into contact with the printed circuit board terminal portion, and the both ends of one side of the substrate film are heated to 180 ° C.
Thermocompress at ℃ and pressure of 30kg / cm 2 , and integrate them.

実用に際しても、電気的並びに機械的に満足すべき結
果が得られ、本発明の顕著な効果が認められた。In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

実施例６ 市販のネガタイプフォトレジストインク（東京応化工
業株式会社製 商品名:PMER−Ｎ−HC40（銘柄）（アク
リル系ポリマー主体）を用い、このもの90重量％に対し
て、（ａ）粒度40〜50μのニッケルメッキした上にさら
に金メッキを施した銅粉末を10重量％添加混合し、均一
に分散せしめた見掛比重1.0、粘度20センチポイズのフ
ォトレジスト導電性塗料を調製した。Example 6 Using a commercially available negative type photoresist ink (trade name: PMER-N-HC40 (brand name) (manufactured by Tokyo Ohka Kogyo Co., Ltd.) (mainly acrylic polymer), 90% by weight of this product, (a) particle size 40 10 wt% of copper powder plated with ˜50 μm of nickel and further plated with gold was added and mixed to prepare a photoresist conductive paint having an apparent specific gravity of 1.0 and a viscosity of 20 centipoise that was uniformly dispersed.

以下の工程は、実施例１と略々同様な方法にて縦縞細
条形のヒートシールコネクター部材を得る。In the following steps, a striped heat-seal connector member having vertical stripes is obtained by substantially the same method as in Example 1.

このものは、実用に際しても電気的並びに機械的接続
において、実施例１と略々同様な満足すべき結果が得ら
れ、本発明の顕著な効果が認められた。In practical use, the same satisfactory results as in Example 1 were obtained in electrical and mechanical connection, and the remarkable effect of the present invention was confirmed.

実施例７ （ｂ）フォトレジスト用の感光性アクリルポリマー20
重量％、（ｃ）アクリルエチルエステル５重量％、
（ｄ）エチルセロソルブアセテート45重量％、（ｅ）ト
ルエン25重量％、（ｆ）キシレン５重量％、（ｇ）メチ
ルエチルケトン５重量％を配合調製したインク原液、す
なわちフォトレジストインク85重量％に対し、（ａ）粒
度10〜40μｍのニッケルメッキした上に、さらに金メッ
キを施した樹脂ビーズ粉末を15重量％添加混合し均一に
分散せしめた見掛比重1.0、粘度15センチポイズのフォ
トレジスト導電性塗料を調製する（工程Ａ）。Example 7 (b) Photosensitive acrylic polymer for photoresist 20
% By weight, (c) 5% by weight of acrylic ethyl ester,
(D) 45% by weight of ethyl cellosolve acetate, (e) 25% by weight of toluene, (f) 5% by weight of xylene, (g) 5% by weight of methyl ethyl ketone were mixed and prepared, that is, with respect to 85% by weight of a photoresist ink, (A) Prepare a photoresist conductive paint with an apparent specific gravity of 1.0 and a viscosity of 15 centipoise, which is obtained by adding 15% by weight of resin bead powder plated with nickel having a particle size of 10 to 40 μm and further gold-plated and uniformly dispersed. (Step A).

次に、厚さ38μｍのポリエステルフィルムに厚さ35μ
の電解銅箔を貼り合せた銅箔フィルムの銅面上に、前記
のフォトレジスト導電性塗料を厚さ25μｍにコーティン
グし、70℃の温度にて２時間乾燥を行う（工程Ｂ）。Next, a polyester film with a thickness of 38 μm has a thickness of 35 μm.
On the copper surface of the copper foil film to which the electrolytic copper foil of (1) is attached, the photoresist conductive paint is coated to a thickness of 25 μm, and dried at a temperature of 70 ° C. for 2 hours (step B).

乾燥を終えた銅箔フィルムの塗布面に所望のパターン
ネガを描いてあるネガフィルムを置き、真空密着させ、
紫外線露光（50mJ/cm2）し、パターン部分を光硬化させ
る（工程Ｃ）。Place the negative film on which the desired pattern negative is drawn on the coated surface of the copper foil film that has been dried, and vacuum bond it,
UV exposure (50 mJ / cm 2 ) is performed to photo-cure the pattern portion (step C).

紫外線露光工程（Ｃ）を終えた銅箔フィルム上のフォ
トレジスト導電性塗料の光硬化されていない部分（パタ
ーン以外の部分）を弱アルカリ水溶液にて現像除去し、
現像液を良く水洗し、その後エアーガンにて銅上の水を
吹き落とし、60℃の温度にて60分間乾燥する（工程
Ｄ）。A portion of the photoresist conductive coating on the copper foil film that has undergone the ultraviolet exposure step (C) that has not been photocured (a portion other than the pattern) is developed and removed with a weak alkaline aqueous solution,
The developing solution is washed well with water, then the water on the copper is blown off with an air gun, and dried at a temperature of 60 ° C. for 60 minutes (step D).

この銅箔フィルムの銅箔が直接露出した部分をすべて
エッチング除去し、その後水洗にてエッチング液を良く
洗い去り、100℃の温風中で２分間乾燥させる（工程
Ｅ）。All the exposed portions of the copper foil of the copper foil film are removed by etching, then the etching solution is thoroughly washed off with water and dried in warm air at 100 ° C. for 2 minutes (step E).

前記の光硬化させたフォトレジスト層を表面に被着し
たまま残した所望のパターンの熱圧着する部分に、絶縁
性熱圧着懸濁液塗料を塗布する。この組成は、酸化チタ
ン10重量％、クロロプレン合成ゴム45重量％、キシレン
25重量％、メチルイソブチルケトン10重量％、イソホロ
ン7.5重量％、テルペン系樹脂2.5重量％から成る。加熱
乾燥して熱圧着層形成する（工程Ｆ）。An insulating thermocompression-bonding suspension coating material is applied to a portion to be thermocompression-bonded in a desired pattern which is left on the surface where the photo-cured photoresist layer is applied. This composition is 10% by weight titanium oxide, 45% by weight chloroprene synthetic rubber, xylene
25% by weight, 10% by weight methyl isobutyl ketone, 7.5% by weight isophorone, and 2.5% by weight terpene resin. It is dried by heating to form a thermocompression bonding layer (step F).

前記パターンに熱圧着層を形成されていない、熱圧着
層以外のパターンと、その周囲に、絶縁性を保つ為に、
厚さ25μの片面粘着ポリエステルフィルムを貼る（工程
Ｇ）。In order to maintain insulation, the pattern other than the thermocompression bonding layer, in which the thermocompression bonding layer is not formed in the pattern, and the periphery thereof,
A 25 μm-thick single-sided adhesive polyester film is attached (step G).

次に、こうして形成された基板フィルムを所望の長
さ、及び幅寸法に切断する（工程Ｈ）。Next, the substrate film thus formed is cut into a desired length and width (step H).

こうして縦縞細条形のヒートシールコネクター部材が
でき上る。かくて製造したヒートシールコネクター部材
の使用に当っては、得られた基板フィルムの片面の一端
の熱圧着層を、例えば、液晶表示管の電極に接触させ、
他端の熱圧着層をプリント回路基板端子部分に接触さ
せ、前記基板フィルムの片面の両端部を加熱温度180
℃、圧力30kg/cm2で熱圧着して、それぞれ一体にする。Thus, a striped heat seal connector member is completed. In using the heat-sealed connector member thus produced, the thermocompression bonding layer at one end of the obtained substrate film is contacted with, for example, an electrode of a liquid crystal display tube,
The thermocompression bonding layer at the other end is brought into contact with the printed circuit board terminal portion, and the both ends of one side of the substrate film are heated to 180 ° C.
Thermocompress at ℃ and pressure of 30kg / cm 2 , and integrate them.

実用に際しても、電気的並びに機械的に満足すべき結
果が得られ、本発明の顕著な効果が認められた。In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

実施例８ （ｂ）フォトレジスト用の感光性アクリルポリマー20
重量％、（ｃ）アクリルエチルエステル５重量％、
（ｄ）エチルセロソルブアセテート45重量％、（ｅ）ト
ルエン25重量％、（ｆ）キシレン５重量％、（ｇ）メチ
ルエチルケトン５重量％を配合調製したインク原液、す
なわちフォトレジストインク85重量％に対し、（ａ）粒
度20〜30μｍの金メッキを施したニッケル粉末を15重量
％添加混合し、均一に分散せしめた見掛比重1.0、粘度1
5センチポイズのフォトレジスト導電性塗料を調製する
（工程Ａ）。Example 8 (b) Photosensitive acrylic polymer 20 for photoresist
% By weight, (c) 5% by weight of acrylic ethyl ester,
(D) 45% by weight of ethyl cellosolve acetate, (e) 25% by weight of toluene, (f) 5% by weight of xylene, (g) 5% by weight of methyl ethyl ketone were mixed and prepared, that is, with respect to 85% by weight of a photoresist ink, (A) 15% by weight of nickel-plated gold powder having a particle size of 20 to 30 μm was added and mixed, and the mixture was uniformly dispersed to have an apparent specific gravity of 1.0 and a viscosity of 1
A 5 cm poise photoresist conductive paint is prepared (step A).

次に、厚さ50μｍのポリエステルフィルムに厚さ18μ
の圧延銅箔を貼り合せた銅箔フィルムの銅面上に、前記
のフォトレジスト導電性塗料を厚さ20μｍにコーティン
グし、70℃の温度にて１時間乾燥を行う（工程Ｂ）。Next, a 18 μm thick polyester film with a thickness of 50 μm
On the copper surface of the copper foil film to which the rolled copper foil of (1) is attached, the photoresist conductive paint is coated to a thickness of 20 μm, and dried at a temperature of 70 ° C. for 1 hour (step B).

乾燥を終えた銅箔フィルムの塗布面に、所望のパター
ンネガを描いてあるネガフィルムを置き、真空密着さ
せ、紫外線露光（40mJ/cm2）し、パターン部分を光硬化
させる（工程Ｃ）。The negative film on which the desired pattern negative is drawn is placed on the coated surface of the dried copper foil film, vacuum-contacted, and exposed to ultraviolet light (40 mJ / cm 2 ) to photo-cure the pattern portion (step C).

紫外線露光工程（Ｃ）を終えた銅箔フィルム上のフォ
トレジスト導電性塗料の光硬化されていない部分（パタ
ーン以外の部分）を弱アルカリ溶液にて現像除去し、現
像液を良く水洗し、その後、エアーガンにて銅上の水を
吹き落とし、40℃の温度にて60分間乾燥する（工程
Ｄ）。On the copper foil film that has undergone the ultraviolet exposure step (C), the non-photocured portion of the photoresist conductive coating (the portion other than the pattern) is developed and removed with a weak alkaline solution, and the developer is washed well with water, and then Blow off the water on the copper with an air gun and dry for 60 minutes at a temperature of 40 ° C (step D).

この銅箔フィルムの銅が直接露出した部分をすべてエ
ッチング除去し、その後、水洗にてエッチング液を良く
洗い去り、100℃の温で２分間乾燥させる（工程Ｅ）。All the portions of the copper foil film where the copper is directly exposed are removed by etching, then the etching solution is thoroughly washed off with water and dried at a temperature of 100 ° C. for 2 minutes (step E).

前記の光硬化させたフォトレジスト層表面に被着した
まま残した所望のパターンの熱圧着する一端に絶縁性熱
圧着懸濁液塗料を塗布する。この塗料の組成は、酸化チ
タン10重量％、クロロプレン合成ゴム45重量％、キシレ
ン25重量％、メチルイソブチルケトン10重量％、イソホ
ロン7.5重量％、テルペン系樹脂2.5重量％から成る。加
熱乾燥して熱圧着層形成する（工程Ｆ）。An insulating thermocompression-bonding suspension coating material is applied to one end of the desired pattern that is to be thermocompression-bonded and left on the photo-cured photoresist layer surface. The composition of this paint is 10% by weight of titanium oxide, 45% by weight of chloroprene synthetic rubber, 25% by weight of xylene, 10% by weight of methyl isobutyl ketone, 7.5% by weight of isophorone and 2.5% by weight of terpene resin. It is dried by heating to form a thermocompression bonding layer (step F).

熱圧着層形成する工程を終えたあと、もう一つの他端
を挿抜コネクターにする為に、フォトレジスト導電性塗
料をエチルアルコールにて除去し剥離する（工程Ｇ）。After the step of forming the thermocompression-bonded layer is completed, the photoresist conductive paint is removed with ethyl alcohol and peeled off to make the other end into an insertion / removal connector (step G).

次に、こうして形成された基板フィルムを所望の長
さ、及び幅寸法に切断する（工程Ｈ）。こうして縦縞細
条形のヒートシールコネクター部材ができ上る。かくて
製造したヒートシールコネクター部材の使用に当って
は、得られた基板フィルムの片面の一端の熱圧着層を、
例えば、ECDの電極に接触させ、他端の挿抜コネクター
部分を、プリント回路基板の挿抜コネクター部分に差し
込み、前記基板フィルムの片面の一端の熱圧着層に加熱
温度150℃、圧力35kg/cm2で熱圧着して、それぞれ一体
にする。こうして縦縞細条形のヒートシールコネクター
部材を使用する。Next, the substrate film thus formed is cut into a desired length and width (step H). Thus, a striped heat seal connector member is completed. In using the heat-sealed connector member thus produced, the thermocompression bonding layer at one end of the obtained substrate film is
For example, contact the electrode of the ECD, insert the insertion / extraction connector portion of the other end into the insertion / extraction connector portion of the printed circuit board, and heat the thermocompression bonding layer at one end of the substrate film at a heating temperature of 150 ° C. at a pressure of 35 kg / cm 2 . They are thermocompressed and integrated into one. Thus, a striped heat seal connector member is used.

実用に際しても、電気的並びに機械的に満足すべき結
果が得られ、本発明の顕著な効果が認められた。In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

実施例９ 市販のネガタイプフォトレジストインク（東京応化工
業株式会社製、商品名:PMER−Ｎ−HC40（銘柄））（ア
クリル系ポリマー主体）を用い、このもの85重量％に対
して、（ａ）粒度30〜50μｍのハンダ粉末を15重量％添
加混合し、均一に分散せしめた見掛比重0.9粘度40セン
チポイズのフォトレジスト導電製塗料を調製する（工程
Ａ）。Example 9 A commercially available negative type photoresist ink (manufactured by Tokyo Ohka Kogyo Co., Ltd., trade name: PMER-N-HC40 (brand name)) (mainly acrylic polymer) was used, and (a) against 85% by weight of this. 15% by weight of a solder powder having a particle size of 30 to 50 μm is added and mixed to prepare a photoresist conductive paint having an apparent specific gravity of 0.9 and a viscosity of 40 centipoise which is uniformly dispersed (step A).

次に、厚さ16μｍのアラミドフィルムに厚さ18μｍの
電解銅箔を貼り合せた銅箔フィルムの銅面上に、前記の
フォトレジスト導電性塗料を厚さ30μｍにコーティング
し、50℃の温度にて２時間乾燥を行う（工程Ｂ）。Next, coat the above-mentioned photoresist conductive paint to a thickness of 30 μm on the copper surface of a copper foil film obtained by bonding an electrolytic copper foil having a thickness of 18 μm to an aramid film having a thickness of 16 μm, and heat at a temperature of 50 ° C. And dry for 2 hours (step B).

乾燥を終えた銅箔フィルムの塗布面に所望のパターン
ネガを描いてあるネガフィルムを置き、真空密着させ、
紫外線露光（55mJ/cm2）し、パターン部分を光硬化させ
る（工程Ｃ）。Place the negative film on which the desired pattern negative is drawn on the coated surface of the copper foil film that has been dried, and vacuum bond it,
UV exposure (55 mJ / cm 2 ) is performed to photo-cure the pattern portion (step C).

紫外線露光工程（Ｃ）を終えた銅箔フィルム上のフォ
トレジスト導電性塗料の光硬化されていない部分（パタ
ーン以外の部分）を弱アルカリ水溶液にて現像除去し、
現像液を良く水洗いし、その後、エアーガンにて銅上の
水を吹き落し、60℃の温度にて50分間乾燥する（工程
Ｄ）。A portion of the photoresist conductive coating on the copper foil film that has undergone the ultraviolet exposure step (C) that has not been photocured (a portion other than the pattern) is developed and removed with a weak alkaline aqueous solution,
The developing solution is washed well with water, then water on copper is blown off by an air gun, and dried at a temperature of 60 ° C. for 50 minutes (step D).

この銅箔フィルムの銅が直接露出した部分をすべてエ
ッチング除去し、その後、水にてエッチング液を良く洗
い去り、100℃の温度で２分間乾燥させる（工程Ｅ）。All the portions of the copper foil film where the copper is directly exposed are removed by etching, after which the etching solution is thoroughly washed off with water and dried at a temperature of 100 ° C. for 2 minutes (step E).

前記の光硬化させたフォトレジスト層表面に被着した
まま残した所望のパターンの熱圧着する一端に、絶縁性
熱圧着懸濁液塗料を塗布する。この塗料の組成は、酸化
チタン10重量％、クロロプレン合成ゴム45重量％、キシ
レン25重量％、メチルイソブチルケトン10重量％、イソ
ホロン7.5重量％、テルペン系樹脂2.5重量％から成る。
加熱乾燥して熱圧着層を形成する（工程Ｆ）。An insulating thermocompression-bonding suspension coating material is applied to one end of the desired pattern that is to be thermocompression-bonded and left on the photo-cured photoresist layer surface. The composition of this paint is 10% by weight of titanium oxide, 45% by weight of chloroprene synthetic rubber, 25% by weight of xylene, 10% by weight of methyl isobutyl ketone, 7.5% by weight of isophorone and 2.5% by weight of terpene resin.
It is dried by heating to form a thermocompression bonding layer (step F).

熱圧着層形成する工程を終えたあと、もう一つの他端
をハンダ付する為に、フォトレジスト導電性塗料をエチ
ルアルコールにて除去し剥離する（工程Ｇ）。After the step of forming the thermocompression-bonding layer is completed, the other end of the photoresist is removed with ethyl alcohol to peel off the other end for soldering (step G).

次に、こうして形成された基板フィルムを所望の長
さ、及び幅寸法に切断する（工程Ｈ）。Next, the substrate film thus formed is cut into a desired length and width (step H).

こうして縦縞細条形のヒートシールコネクター部材が
でき上る。得られた基板フイルムの片面の一端の熱圧着
層を、例えば、液晶表示管の電極に接触させ、加熱温度
170℃、圧力30kg/cm2で熱圧着して、もう一つの一端を
プリント回路基板の端子部に接触させハンダ付を行い、
それぞれ一体にする。このようにして縦縞細条形のヒー
トシールコネクタ部材を使用する。Thus, a striped heat seal connector member is completed. The thermocompression-bonding layer at one end of the obtained substrate film is brought into contact with, for example, the electrode of the liquid crystal display tube, and the heating temperature
Thermocompression bonding at 170 ℃, pressure 30kg / cm 2 and contacting the other end to the terminal part of the printed circuit board for soldering,
Make them one. In this way, the striped heat seal connector member is used.

実用に際しても、電気的並びに機械的に満足すべき結
果が得られ、本発明の顕著な硬化が認められた。In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable curing of the present invention was recognized.

（発明の効果） 以上述べたように、本発明は、導電性を持たせた特別
のフォトレジスト塗料を利用することによって、フォト
エッチング工程の一部を短縮省略すると共に、アルカリ
等公害薬品を不要とし、銅箔による導電パターン上に、
光硬化させた導電性レジスト層を被着させたまま残し
て、その上に薄い熱圧着層を設けることにより、熱圧着
を行なった場合に上下に導通をはかるようにした信頼性
の高い縦縞細条形ヒートシールコネクタ部材の製造法を
提供することができる。(Effects of the Invention) As described above, the present invention uses a special photoresist coating having conductivity to shorten and omit a part of the photoetching process and eliminate the need for a chemical agent such as alkali. And, on the conductive pattern made of copper foil,
By leaving the photo-cured conductive resist layer deposited and providing a thin thermocompression-bonding layer on top of it, vertical striped strips with high reliability can be made to conduct vertically when thermocompression bonding is performed. A method for manufacturing a strip heat seal connector member can be provided.

【図面の簡単な説明】[Brief description of drawings]

第１図は本発明の一実施例に係るヒートシールコネクタ
部材を拡大して示す模式正面図であり、 第２図は、第１図のII−II′線で切断して示す拡大模式
断面図であり、 第３図は本発明によるヒートシールコネクタ部材の熱圧
着後の要部を拡大して示す模式断面略図であり、 第４図は本発明によるヒートシールコネクタ部材の一使
用例を示す斜視略図である。 １……可撓性絶縁フィルム ２……接着剤層 ３……銅回路 ４……導電性フォトレジスト層 ５……絶縁性熱圧着層 ６……各種のディスプレイ ７……プリント回路基板 ８……本発明の一実施例に係るヒートシールコネクタ部
材 ９……液晶表示管の電極部分 10……プリント回路基板端子部分FIG. 1 is an enlarged schematic front view showing a heat seal connector member according to an embodiment of the present invention, and FIG. 2 is an enlarged schematic sectional view cut along the line II-II ′ in FIG. FIG. 3 is a schematic cross-sectional schematic view showing an enlarged main part of the heat seal connector member according to the present invention after thermocompression bonding, and FIG. 4 is a perspective view showing an example of use of the heat seal connector member according to the present invention. It is a schematic diagram. 1 ... Flexible insulating film 2 ... Adhesive layer 3 ... Copper circuit 4 ... Conductive photoresist layer 5 ... Insulating thermocompression bonding layer 6 ... Various displays 7 ... Printed circuit board 8 ... Heat seal connector member according to an embodiment of the present invention 9 ... Electrode portion of liquid crystal display tube 10 ... Printed circuit board terminal portion

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】可撓性絶縁フィルムに銅箔を貼り合せた銅
箔フィルム又は可撓性絶縁フィルムに銅を蒸着させた銅
蒸着フィルムと、 前記銅箔フィルム又は銅蒸着フィルムの銅表面に設けた
所望のパターンの導電性フォトレジスト塗膜と、 前記所望のパターンの導電性フォトレジスト塗膜を有し
ない前記銅箔フィルム又は銅蒸着フィルムの露出銅表面
と前記所望のパターンの導電性フォトレジスト塗膜との
双方の表面上に設けた絶縁性熱圧着層と、 有することを特徴とする縦縞細条形ヒートシールコネク
タ部材。1. A copper foil film obtained by laminating a copper foil on a flexible insulating film, or a copper vapor deposition film obtained by vapor depositing copper on a flexible insulating film, and a copper surface of the copper foil film or copper vapor deposition film. And a desired pattern conductive photoresist coating, the exposed copper surface of the copper foil film or copper vapor deposition film without the desired pattern conductive photoresist coating and the desired pattern conductive photoresist coating An insulating thermocompression bonding layer provided on both surfaces of a film, and a striped heat seal connector member having vertical stripes. 【請求項２】縦縞細条形ヒートシールコネクタ部材の製
造法において、 （ａ）粒度1.0〜50μｍの導電性微粉末１〜40重量％
を、（ｂ）フォトレジスタとして用いられる感光性のア
クリル系ポリマー樹脂又は感光性のエポキシ系ポリマー
樹脂及び（ｃ）アクリルエステルを主成分とするフォト
レジストインク99〜60重量％と混合し、均一に分散せし
めた見掛比重0.9〜2.0、粘度0.1〜1000ポイズの導電性
フォトレジスト塗料を調製する工程（Ａ）と、 可撓性絶縁フィルムに銅箔を貼り合せた銅箔フィルム又
は可撓性絶縁フィルムに銅を蒸着させた銅蒸着フィルム
の銅表面に、前記導電性フォトレジスト塗料を、厚さ５
〜30μｍにコーティングし、20〜70℃の温度にて10分〜
12時間乾燥を行なう塗布・乾燥工程（Ｂ）と、 該塗布・乾燥工程（Ｂ）を終えた塗布面に、所望寸法の
縦縞細条形パターンを描いてあるネガフィルムを載置
し、紫外線露光を行ない、パターンの部分を硬化させる
紫外線露光工程（Ｃ）と、該紫外線露光工程（Ｃ）を終
えた導電性フォトレジスト塗膜の硬化されていない部分
を弱アルカリ水溶液にて洗い流して除去し、30〜120℃
の温度にて乾燥し、硬化させた所望のパターンのフォト
レジスト塗膜を形成すると共に前記フィルムの銅を直に
露出する工程（Ｄ）と、 該工程（Ｄ）にてフィルムの銅が直に露出した部分をす
べてエッチング除去し、その後水洗にてエッチング液を
良く洗い落とし、フィルムを40〜100℃の温度で乾燥さ
せる工程（Ｅ）と、 前記工程（Ａ＋Ｂ＋Ｃ＋Ｄ＋Ｅ）にて形成され、前記の
光硬化させたフォトレジスト層を銅表面に被着したまま
残した所望のパターンとその周囲の残余の露出したフィ
ルム部分との全体にわたって、見掛比重0.8〜1.4、粘度
150〜5000ポイズの絶縁性熱圧着懸濁液塗料を、スクリ
ーン印刷にて表面に塗布し、加熱乾燥して熱圧着層を最
上層に形成する工程（Ｆ）と、 前記工程（Ａ＋Ｂ＋Ｃ＋Ｄ＋Ｅ＋Ｆ）にて形成され最上
層に熱圧着層を有しその下層に所望の導電回路パターン
を有する銅基板フィルムを、所望の長さ及び幅寸法に切
断する工程（Ｇ）との結合（Ａ＋Ｂ＋Ｃ＋Ｄ＋Ｅ＋Ｆ＋
Ｇ）から成ることを特徴とする縦縞細条形ヒートシール
コネクタ部材の製造法。2. A method for producing a striped heat seal connector member having vertical stripes, wherein: (a) 1 to 40% by weight of conductive fine powder having a particle size of 1.0 to 50 μm.
Is mixed with (b) a photosensitive acrylic polymer resin used as a photoresist or a photosensitive epoxy polymer resin and (c) a photoresist ink containing acrylic ester as a main component in an amount of 99 to 60% by weight, and uniformly mixed. Step (A) of preparing a conductive photoresist coating having an apparent specific gravity of 0.9 to 2.0 and a viscosity of 0.1 to 1000 poise dispersed in it, and a copper foil film or a flexible insulation film in which a copper foil is bonded to a flexible insulation film. A copper-deposited film obtained by vapor-depositing copper on a film is coated with the above-mentioned conductive photoresist coating in a thickness of 5
~ 30μm coating, 20 ~ 70 ℃ temperature 10 minutes ~
A coating / drying step (B) for drying for 12 hours and a negative film on which a striped strip pattern of a desired size is drawn are placed on the coating surface after the coating / drying step (B), and exposed to ultraviolet light. And an ultraviolet exposure step (C) for curing the pattern portion, and an uncured portion of the conductive photoresist coating film that has finished the ultraviolet exposure step (C) is washed away with a weak alkaline aqueous solution to remove it. 30 ~ 120 ℃
And a step of directly exposing the copper of the film while forming a photoresist coating film having a desired pattern which is dried and cured at the temperature of, and in the step (D), the copper of the film is directly exposed. All the exposed parts are removed by etching, and then the etchant is thoroughly washed off with water, and the film is dried at a temperature of 40 to 100 ° C (E) and the above-mentioned process (A + B + C + D + E), and the photo-curing is performed. The desired specific gravity of the photoresist layer left on the copper surface and the remaining exposed film portion around the copper surface, the apparent specific gravity of 0.8 to 1.4, the viscosity
In the step (F) of applying an insulating thermocompression-bonding suspension paint of 150 to 5000 poise to the surface by screen printing and heating and drying to form the thermocompression-bonding layer on the uppermost layer, and the step (A + B + C + D + E + F). Bonding (A + B + C + D + E + F +) with the step (G) of cutting the formed copper substrate film having a thermocompression bonding layer on the uppermost layer and having a desired conductive circuit pattern on the lower layer thereof to a desired length and width dimension.
A method for producing a striped heat seal connector member having vertical stripes, which comprises G). 【請求項３】（ａ）導電性微粉末が、ニッケルメッキし
た上にさらに金メッキを施した銅粉末、金メッキニッケ
ル粉末、パラジウム粉末、ハンダ粉末及びニッケルメッ
キした上にさらに金メッキを施した樹脂ビーズ粉末のう
ちの１種又は２種以上から成り、 フォトレジストインクが、（ｂ）感光性のアクリル系又
はエポキシ系ポリマー樹脂25〜15重量％、（ｃ）アクリ
ルエステル10〜１重量％、（ｄ）エチルセロソルブアセ
テート45〜40重量％、（ｅ）トルエン25〜20重量％、
（ｆ）キシレン５〜１重量％、及び（ｇ）メチルエチル
ケトン５〜１重量％から成り、 絶縁性熱圧着懸濁液塗料が、（ｉ）酸化チタン、タル
ク、水和アルミナ及びコロイダルシリカの１種又は２種
以上から成る粉末５〜30重量％と、（ii）クロロプレン
合成ゴム、ポリエステル樹脂、エチレン−酢酸ビニル共
重合体樹脂及びポリエチルメタクリレート樹脂の１種又
は２種以上から成る熱可塑性樹脂結合材20〜60重量％、
（iii）イソホロン、ジアセトンアルコール、メチルイ
ソブチルケトン、キシレン、トルエン及びジエチルカル
ビトールの１種又は２種以上から成る有機溶剤10〜70重
量％と、（iv）テルペン系樹脂及び脂肪族炭化水素系樹
脂の１種又は２種から成る粘着付与剤0.1〜20重量％と
を混合（ｉ＋ii＋iii＋iv）溶解し、均一に分散せしめ
たものであることを特徴とする特許請求の範囲第２項に
記載の縦縞細条形ヒートシールコネクタ部材の製造法。3. A conductive fine powder comprising: (a) a nickel-plated copper-plated copper powder, a gold-plated nickel powder, a palladium powder, a solder powder, and a nickel-plated gold-plated resin bead powder. The photoresist ink comprises (b) 25 to 15% by weight of a photosensitive acrylic or epoxy polymer resin, (c) 10 to 1% by weight of an acrylic ester, and (d). Ethyl cellosolve acetate 45-40% by weight, (e) Toluene 25-20% by weight,
(F) 5 to 1% by weight of xylene, and (g) 5 to 1% by weight of methyl ethyl ketone, and the insulating thermocompression-bonding suspension paint is (i) one of titanium oxide, talc, hydrated alumina and colloidal silica. Or 5 to 30% by weight of powder composed of two or more kinds, and (ii) thermoplastic resin bond composed of one or more kinds of chloroprene synthetic rubber, polyester resin, ethylene-vinyl acetate copolymer resin and polyethylmethacrylate resin Material 20-60% by weight,
(Iii) 10-70% by weight of an organic solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene and diethyl carbitol, and (iv) a terpene resin and an aliphatic hydrocarbon system. The vertical stripes according to claim 2, wherein 0.1 to 20% by weight of a tackifier composed of one or two kinds of resins is mixed (i + ii + iii + iv), dissolved and uniformly dispersed. Method for manufacturing strip-shaped heat seal connector member.
JP1309173A 1989-11-30 1989-11-30 Vertical striped heat seal connector member and its manufacturing method Expired - Lifetime JPH0817105B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1309173A JPH0817105B2 (en) 1989-11-30 1989-11-30 Vertical striped heat seal connector member and its manufacturing method
GB9025959A GB2239720B (en) 1989-11-30 1990-11-29 Method of producing longitudinally fine striped type heat seal connector member
US08/020,902 US5306602A (en) 1989-11-30 1993-02-22 Method of producing longitudinally fine striped type heat seal connector member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1309173A JPH0817105B2 (en) 1989-11-30 1989-11-30 Vertical striped heat seal connector member and its manufacturing method

Publications (2)

Publication Number Publication Date
JPH03173086A JPH03173086A (en) 1991-07-26
JPH0817105B2 true JPH0817105B2 (en) 1996-02-21

Family

ID=17989813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1309173A Expired - Lifetime JPH0817105B2 (en) 1989-11-30 1989-11-30 Vertical striped heat seal connector member and its manufacturing method

Country Status (2)

Country Link
JP (1) JPH0817105B2 (en)
GB (1) GB2239720B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4336961C2 (en) * 1993-10-29 2000-07-06 Kerafol Keramische Folien Gmbh Flexible heat transfer device
CN105228359B (en) * 2015-10-29 2018-06-22 广州兴森快捷电路科技有限公司 Printed wiring board and preparation method thereof
CN205213232U (en) * 2015-11-18 2016-05-04 乐视致新电子科技（天津）有限公司 A heat radiation structure for liquid crystal display equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140685A (en) * 1983-12-28 1985-07-25 日本写真印刷株式会社 Filmlike electrode connector and method of producing same

Also Published As

Publication number Publication date
JPH03173086A (en) 1991-07-26
GB2239720A (en) 1991-07-10
GB2239720B (en) 1993-09-29
GB9025959D0 (en) 1991-01-16

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